JP2013028069A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card on which an image can be formed with reduced roughness, high concentration and excellent light resistance.SOLUTION: The IC card includes a base material containing an IC module where electronic information can be read/written in a noncontact state and a cushion layer and a receiving layer formed at least on one surface on the base material. The cushion layer contains hollow particles and a first binder resin. The receiving layer contains a second binder resin.

Description

  The present invention relates to an IC card, and more particularly to an IC card that can form a printed matter with less roughness, high density, and excellent light resistance.

  In an ID card such as an ID card or bank card, etc., image information such as a person's face photo and character information such as the person's address and name are recorded on one side so that they can be individually recognized. Are used. Such an ID card is manufactured by recording image information and character information on one surface of a card such as plastic. Such an information recording body is manufactured using a thermal transfer sheet in consideration of the sharpness of image information and the convenience in printing character information. For example, using a thermal transfer sheet provided with a color material layer such as yellow, magenta and cyan on a substrate, a color human image is recorded on a card, and then a thermal transfer sheet provided with a black color material layer is used. Thus, it is manufactured by recording characters or the like on a portion other than the person image formed on the substrate. The image obtained using the thermal transfer sheet has excellent reproducibility and gradation of intermediate colors and can form a high-quality image comparable to a full-color photographic image. In general, the recording medium is manufactured using a thermal transfer sheet.

  An IC card provided with an IC module is used as a plastic card for manufacturing an ID card. An IC module is an electronic component capable of writing and / or reading electronic information without contact.

  For example, Patent Document 1 proposes an IC card in which a cushion layer and a receiving layer are formed. In addition, it has been proposed that the cushion layer can reduce noise and transfer and record an image corresponding to image information with good reproducibility, and that an olefin resin is preferable as this material.

JP 2003-58847 A

  However, there is a demand for further speeding up of the printer, and the cushion layer that has been used conventionally has little noise, and it may become difficult to transfer and record an image corresponding to image information with good reproducibility. It was. Further, as the speed of the printer increases, it may be difficult to obtain a high density image. Furthermore, it is known that the light resistance is increased by sufficiently diffusing the dye in the receiving layer, but the amount of heat applied to the receiving layer is reduced by increasing the speed of the printer, and the dye is sufficiently absorbed in the receiving layer. In some cases, it is difficult to diffuse and it is difficult to obtain the light resistance of the image as before.

  Therefore, the present inventors have been made in view of the above-described background art, and an object of the present invention is to provide an IC card that can form an image with little roughness, high density, and excellent light resistance. is there.

  As a result of intensive studies to solve the above problems, the present inventors have found that a substrate (hereinafter simply referred to as a substrate) provided with an IC module and hollow particles on one surface of the substrate. The present invention has been completed by discovering that the above-mentioned problems can be solved by an IC card having a cushion layer and a receiving layer.

  That is, according to one aspect of the present invention, a base material provided therein with an IC module capable of writing and / or reading electronic information without contact, and a cushion layer on at least one surface of the base material In the IC card having the receiving layer, the cushion layer includes hollow particles and a first binder resin, and the receiving layer includes a second binder resin.

  The first binder resin may be gelatin and / or styrene acrylic acid copolymer resin. As a result, the adhesion between the substrate having the IC module therein and the receiving layer can be enhanced. In addition, the water resistance of the printed product can be increased.

  The second binder resin may be a vinyl chloride resin. Thereby, the water resistance of the printed product can be further increased.

  The cushion layer may further contain gelatin and a hardener. Thereby, the adhesiveness between the base material provided with the IC module and the receiving layer can be further enhanced. Further, the water resistance of the printed product can be further increased.

  The hollow particles may be crosslinked hollow particles having a volume average particle size of 5 μm or less. Thereby, the roughness of the printed matter can be further reduced. In addition, the occurrence of damage (dents) due to heat received from the thermal head during printing can be reduced.

  According to the present invention, it is possible to provide an IC card that can form an image with little roughness, high density, and excellent light resistance. .

It is a schematic cross section which shows an example of the IC card by this invention.

  FIG. 1 shows a cross-sectional view of an IC card 1 provided with a substrate 2, an image receiving layer 3, and a cushion layer 4. The base material 2 includes an IC module having a predetermined thickness between the first sheet member 5 and the second sheet member 5 ′. The IC module includes an antenna body 8, an IC chip 9, and the like, and these are provided in the inlet 7. The base material 2 has a laminated structure in which the inlet 7 is disposed between the first sheet member 5 and the second sheet member 5 ′, and the respective members are laminated with the adhesives 6 and 6 ′ interposed therebetween. .

The cushion layer IC card 1 is provided with a cushion layer 4 on the first sheet member 5 side of the substrate 2. The cushion layer is for obtaining a printed matter with little roughness, high density and excellent light resistance, and is an essential constituent element of the present invention. The cushion layer 4 includes hollow particles and a first binder resin, and may further include a hydrophilic binder, a hardener, an emulsifier, and the like. The cushion layer 4 may be composed of two or more layers.

  The thickness of the cushion layer 4 is not particularly limited as long as the heat insulating property, the cushioning property and the like can be adjusted to a desired level, but it is preferably within a range of 10 μm to 100 μm, and preferably 10 μm to 50 μm. More preferably within the range. Further, the density of the cushion layer 4 is preferably in the range of, for example, 0.1 g / cm3 to 0.8 g / cm3, and more preferably in the range of 0.2 g / cm3 to 0.7 g / cm3.

(First binder resin)
In the present invention, the first binder resin has a function of holding hollow particles. Since the hollow particles used in the present invention have low organic solvent resistance, the first binder resin is preferably one that can be dispersed or dissolved in water. Since the IC card is required to have water resistance, the first binder resin preferably has water resistance after drying. For example, styrene acrylic acid copolymer resin and / or gelatin can be preferably used.

(Styrene acrylic acid copolymer resin)
The styrene acrylic acid copolymer resin has a glass transition temperature (Tg) of 50 ° C or higher, preferably 60 ° C or higher and 120 ° C or lower, more preferably 70 ° C or higher and 120 ° C or lower, and 150 or higher, preferably 180 or higher and 300 or lower. More preferably, it has an acid value of 190 or more and 300 or less. In the present invention, the glass transition temperature (Tg) is a DSC-60 (manufactured by Shimadzu Corporation) as a DSC apparatus (differential scanning calorimeter), a heating rate of 10 ° C./min, a sample weight of 10 mg, and a condition under a nitrogen atmosphere. Is a value measured by The solid content oxidation is a theoretical acid value (AV) before neutralization, and AV (mg KOH / g) = KOH amount (mg) necessary for neutralization of carboxyl groups contained in 1 g of resin.

  In the present invention, a commercially available styrene / acrylic acid copolymer resin can also be used. For example, Jonkrill 62J, Jonkrill HPD-96J, Jonkrill 52J, Jonkrill PDX-6102B (above, manufactured by BASF Corporation) and the like are preferable.

(gelatin)
In the present invention, the use of gelatin can improve the interlayer adhesion between the receiving layer and the cushion layer. In particular, when each layer is formed by an aqueous coating method and a simultaneous multilayer coating method, the coating suitability can be improved. Moreover, the viscosity of each coating liquid can be adjusted to a desired range, and a desired film thickness can be obtained. In the present invention, commercially available gelatin can also be used. For example, RR, R, and CLV (manufactured by Nitta Gelatin Co., Ltd.) are preferred (hollow particles).
The hollow particles used in the present invention preferably have a volume average particle size of 0.1 to 10 μm, more preferably 0.3 to 5 μm. If the volume average particle diameter of the hollow particles is in the above range, heat insulating properties and cushioning properties can be imparted to the heat insulating layer. The average hollowness of the hollow particles is preferably 20% or more, more preferably 30 to 80%. If the average hollowness of the hollow particles is in the above range, heat insulating properties and cushioning properties can be imparted to the heat insulating layer. Furthermore, the organic hollow particle comprised from resin etc. may be sufficient, and the inorganic hollow particle comprised from glass etc. may be sufficient. From the viewpoint of increasing the resistance to embossing, the hollow particles are preferably crosslinked hollow particles. In the present invention, commercially available hollow particles can also be used. For example, HP-1055, HP-91, and Ropeke SE (manufactured by Rohm and Haas Co., Ltd.), MH-5055 (Nippon Zeon), SX8782 (A ) (JSR Corporation) and the like are preferable.

(Hardener)
According to a preferred embodiment of the present invention, as the hardener contained in the cushion layer or the like, an aldehyde hardener (formaldehyde etc.), an aziridine hardener, an epoxy hardener, a vinylsulfone hardener ( N, N′-ethylene-bis (vinylsulfonylacetamide) ethane), N-methylol hardener (such as dimethylolurea), boric acid, metaboric acid or polymer hardener (Japanese Patent Laid-Open No. 62-234157) Compounds described in the publications, etc.), oxazoline hardeners, carbodiimide hardeners can be used. By using such a hardener, the water resistance of the printed product can be improved. N-methylol hardeners, oxazoline hardeners, and carbodiimide hardeners are particularly preferred because they can further improve the water resistance of the printed matter.

In the receiving layer IC card 1, an image receiving layer 3 is provided on the first sheet member 5 side of the base 2 via a cushion layer 4. The image receiving layer 3 is for receiving character images and image information on the recording medium 1 by receiving a sublimation or heat diffusible dye image by a thermal transfer recording method, and is an essential constituent element of the present invention. In the present invention, the receiving layer contains the second binder resin, and may further contain an emulsifier and a release agent.

(Second binder resin)
The second binder resin of the present invention is a polymer that can accept a sublimation dye transferred from a thermal transfer ink sheet. In the present invention, a solvent-based resin can be used as the binder resin.

  Solvent-based resins are mainly composed of ester solvents such as ethyl acetate, aromatic hydrocarbon solvents such as toluene and benzene, ketone solvents such as acetone and methyl ethyl ketone, hydrocarbon solvents such as hexane, and mixtures thereof. It is a polymer that dissolves in the solvent used. As such, for example, vinyl resins such as vinyl chloride resins, vinylidene chloride resins, vinyl acetate resins, acrylic resins, olefin resins, polyester resins, polyurethane resins, and copolymers thereof can be preferably used. it can. From the viewpoint of high dye receptivity from the thermal transfer sheet, vinyl resins and polyester resins are particularly preferable. From the viewpoint that heat fusion with the thermal transfer sheet hardly occurs, a vinyl resin is more preferable.

(emulsifier)
The receiving layer of the present invention may contain an emulsifier. Thereby, an aqueous dispersion can be produced from a solvent-based solution containing the second binder resin. In the present invention, any of an anionic emulsifier, a cationic emulsifier, and a nonionic emulsifier can be used, but an anionic emulsifier is particularly preferable from the viewpoint of dispersibility, and an anionic emulsifier composed of a salt of an organic strong acid and an inorganic strong base. More preferred are emulsifiers. For example, sodium alkylnaphthalene sulfonate, sodium dioctyl sulfonate succinate, sodium alkylbenzene sulfonate, sodium butyl oleate, sodium oleate sulfate, sodium salt of natural alcohol ether sulfate, sodium lauryl sulfate, and sodium phenol sulfonate Etc.

(Release agent)
According to a preferred embodiment of the present invention, the receiving layer may further contain a release agent. In the preparation of the coating solution for the receiving layer, it may be contained in a solvent-based solution. Examples of the release agent include solvent-based silicones and fluorine-based surfactants, and solvent-based silicones are particularly preferable. As the solvent-based silicone, various modified silicones such as dimethyl silicone can be used. Specifically, amino-modified silicone, epoxy-modified silicone, alcohol-modified silicone, vinyl-modified silicone, urethane-modified silicone, polyester-modified silicone, polyether-modified silicone, polyester-modified silicone oil, acrylic-modified silicone, amide-modified silicone, etc. These may be used as a mixture, or may be polymerized using various reactions. Two or more release agents may be mixed and used. By forming the receiving layer using an aqueous dispersion coating liquid containing such a release agent, problems such as fusion between the thermal transfer ink sheet and the receiving layer of the IC card and a decrease in printing sensitivity may be improved during printing. it can. In the present invention, a commercially available solvent-based mold release agent can also be used, for example, X-22-163, X-22-173D, X-22-343, X-22-2000 manufactured by Shin-Etsu Chemical Co., Ltd. X-22-3000T, KF-101, KF-102, KF-1001, KF-1002, KP-1800U, X-22-4015, X-22-1660B, X-22-160ASD, KF-410, etc. preferable.

An image-receiving layer coating solution is prepared by dispersing or dissolving each of the above-described components in a solvent, and the image-receiving layer coating solution is applied onto one sheet member of the IC card substrate and dried to form the image-receiving layer. Can be formed. The thickness of the image receiving layer is generally about 1 to 50 μm, preferably about 2 to 10 μm.

  The image receiving layer may be preliminarily printed in a format such as ruled lines before printing image information or character information. The format printing can be formed by any method such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, ink jet method, sublimation transfer method, electrophotographic method, and thermal melting method.

The base material 2 is an essential constituent element of the present invention including the IC module. The base material 2 has a laminated structure in which the inlet 7 is disposed between the first sheet member 5 and the second sheet member 5 ′, and the respective members are laminated with the adhesives 6 and 6 ′ interposed therebetween. Examples of the sheet member used for the IC card substrate include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, nylon 6, and nylon. Polyamides such as 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymers, ethylene / vinyl acetate copolymers, ethylene / vinyl alcohol copolymers, vinyl polymers such as polyvinyl alcohol and vinylon, biodegradable fats Biodegradable resins such as Aromatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol, biodegradable cellulose acetate, biodegradable polycaprolactone, cellulose triacetate, cellophane, etc. Acrylic resin such as roulose resin, polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polybutyl acrylate, etc., single layer such as polystyrene, polycarbonate, polyarylate, polyimide, or these two layers The above laminated body is mentioned.

  The thickness of the sheet member is 30 to 300 μm, preferably 50 to 200 μm. When the thickness is 50 μm or less, thermal contraction or the like may occur when the sheet members 5 and 7 and 5 ′ and 7 are bonded to each other. In addition, you may perform the annealing process of the sheet | seat member which reduces a thermal contraction rate.

  Further, easy contact processing may be performed on the sheet member for improving post-processing adhesion, and antistatic processing may be performed for chip protection. Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

The IC module generally includes an IC chip 9 that electrically stores information of an electronic card user and a coiled antenna body 8 connected to the IC chip 9. The IC chip is only a memory or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member. An IC module composed of electronic components has an antenna coil. When the IC module has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding is used. Also good. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). A method using an industrial anisolum or the like) or a method of performing solder bonding is known, but any method may be used.

  In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the shearing force due to the flow of the resin causes the joint to come off or the surface smoothness due to the flow or cooling of the resin. An inlet is used to eliminate the loss and lack of stability. Inlet, a resin layer is formed in advance on the substrate sheet, and the electronic component is sealed in the resin layer with a porous resin film, a porous foamed resin film, a flexible resin sheet, It is preferably used in the form of a porous resin sheet or nonwoven fabric sheet. As the resin sheet, sheets of polyethylene terephthalate (PET), PET-G, polyethylene naphthalate (PEN), vinyl chloride, polycarbonate, triacetyl cellulose, acrylic, etc. can be suitably used, but mechanical strength and dimensions From the viewpoint of stability and solvent resistance, PET, PET-G or PEN is preferred. Among these, PET or PET-G is particularly preferable from the viewpoints of transparency, processability, and cost.

  For example, examples of the non-woven sheet member include a mesh woven fabric such as a non-woven fabric, and a plain woven fabric, a twill woven fabric, and a satin woven fabric. In addition, a fabric having pile called moquette, plush velor, seal, velvet, or suede can be used. Materials include polyamides such as nylon 6, nylon 66 and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohols, polyvinylidene chloride, polyvinyl chloride, polyacrylonitrile, acrylamide, methacryl Acrylics such as amides, synthetic resins such as polycyanide vinylidene, polyfluoroethylene, and polyurethane, natural fibers such as silk, cotton, wool, cellulose, and cellulose ester, recycled fibers (rayon, acetate), aramid fibers The fiber which combined 1 type (s) or 2 or more types chosen from among these is raised. Of these fiber materials, rayon that is preferably polyamide-based such as nylon 6 or nylon 66, acrylic-based such as polyacrylonitrile, acrylamide or methacrylid, polyester-based such as polyethylene terephthalate, cellulose-based as recycled fiber, or cellulose ester-based And acetate and aramid fibers.

  Further, in the inlet 7 or the adhesive 6 including the IC module, the IC chip may have a reinforcing plate 10 in the vicinity of the IC chip because the point pressure strength is weak. The total thickness of the electronic component including the inlet is preferably 100 to 600 μm, more preferably 150 to 500 μm, and particularly preferably 150 to 450 μm.

  Examples of a method for forming a laminated structure in which a predetermined electronic component and a second sheet member are provided between the first sheet member and the second sheet member include a heat bonding method, an adhesive bonding method, an adhesive coating method, and an injection molding method. However, each member may be bonded by any method. When an adhesive is used for bonding, a conventionally known adhesive can be used without any particular limitation. In the present invention, a hot-melt adhesive or the like can be preferably used. For example, ethylene -A vinyl acetate copolymer (EVA) type | system | group, a polyester type, a polyamide type, a thermoplastic elastomer type | system | group, and a polyolefin-type adhesive agent can be mentioned. Among these, a moisture curable adhesive is preferable. In addition to the above, the adhesives disclosed in JP 2000-036026 A, JP 2000-21278 A, JP 2000-218555 and the like are preferably used as the moisture curable adhesive. Can do. In addition, when bonding each member using an adhesive agent, the total thickness of the adhesive layer and the electronic component layer (inlet thickness) is preferably 100 to 600 μm, more preferably 150 to 500 μm, particularly preferably. Is 150 to 450 μm.

  Adhesives include wax, thermoplastic resins, inorganic fine particles, leveling agents, rubber elastic particles, thermoplastic elastomers, thermoplastic resins, adhesives, curing agents, curing catalysts, spreading agents, flat particles, and needles. You may contain other additives, such as particle | grains.

  An adhesive is applied to the back and front of the inlet (electronic component) or one surface of the first and second sheet members so as to have a predetermined thickness, and the respective members are bonded together to produce an IC card substrate. be able to. As a method for applying the adhesive, a conventionally known method such as a roller method, a T-die method, or a die method can be used, but the method is not limited to these application methods, and the adhesive is applied in a stripe shape. Or a coating method proposed in JP 2000-036026 A, JP 2000-21855 A, JP 2000-21278 A, JP 10-316959 A, JP 11-5964 A, etc. May be adopted.

  Further, on the surface of the second sheet member 5 'located on the surface opposite to the surface on which the image receiving layer 3 of the IC base card 1 is provided (that is, the surface opposite to the surface on which image information or the like is printed). A writing layer (not shown) may be provided. The writing layer is a layer that allows writing on the back surface of the ID card. As the writing layer, for example, a thermoplastic resin (polyolefins such as polyethylene, various copolymers, etc.) film containing inorganic fine powder such as calcium carbonate, talc, diatomaceous earth, titanium oxide, barium sulfate, etc. is used as the second layer. It can form by providing in the outermost surface of a sheet | seat member.

  When pasting each member, in order to improve the surface smoothness of the sheet base material and the adhesion of the electronic component provided between the first sheet member and the second sheet member, heating and pressurization are performed. It is preferable to carry out and it is preferable to manufacture by an up-and-down press system, a lamination system, etc. In consideration of breakage of the IC component due to pressurization, it is preferable to use a flat press die rather than a roller press. The heating is preferably 10 to 180 ° C, more preferably 30 to 150 ° C. The pressurization is preferably 1 to 300 kgf / cm 2, more preferably 1 to 200 kgf / cm 2. If the pressure is higher than this, the IC chip may be damaged. The heating and pressurizing time is preferably approximately 0.001 to 90 seconds, and more preferably 0.001 to 60 seconds, although it depends on the heating and pressurizing conditions.

  The base material may be formed as a laminated sheet or continuous coated lami roll formed as a continuous sheet by an adhesive laminating method or a resin injection method, and the sheet or lami roll is formed into a predetermined card size. A substrate having a desired size can be produced. In addition, after producing the IC card substrate, before or after providing the image receiving layer, general bibliographic items other than personal identification information can be printed on the other surface, but in a sheet or lami roll state. It is preferable to print general bibliographic items continuously. As a method for forming a predetermined card size, a punching method, a cutting method, or the like can be mainly employed.

EXAMPLES Next, although an Example and a comparative example are given and this invention is demonstrated further in detail, this invention is limited to the content of the following Examples, and is not interpreted. In addition, the described mass part was described by solid content, diluted with pure water, and adjusted so that the total solid content of each coating solution was 15 to 30%.
Example 1
As a base material sheet for the IC card 1 , a PET film (Teijin DuPont Films Co., Ltd., U2L98W low heat yield grade) was used, and on one surface thereof, a cushioning layer coating solution 1 and a receiving layer coating solution having the following composition were used. 1 (water-based dispersion coating solution) was heated to 40 ° C., applied by slide coating to a thickness of 12 μm and 3 μm, respectively, cooled at 5 ° C. for 30 seconds, and then cooled to 50 ° C. And dried for 2 minutes. Using the obtained sheet, an IC card was produced by the method described in Examples of Japanese Patent Application Laid-Open No. 2006-178666. The IC card 1 has a layer structure as shown in FIG.

Composition of cushion layer coating solution 1 hollow particles (manufactured by Nippon Zeon Co., Ltd., trade name: MH5055, volume average particle size 0.5 μm)
70 parts by mass of styrene acrylic acid copolymer resin (manufactured by BASF Corp., trade name: Joncrill 62J)
25 parts by mass
Composition of coating solution 1 for receiving layer / vinyl acetate resin (manufactured by Nissin Chemical Co., Ltd., trade name: Solvain C)
45 parts by mass-anionic emulsifier (sodium alkylnaphthalene sulfonate, manufactured by Kao Corporation, trade name: Perex NBL) 2.5 parts by mass In addition, the receiving layer coating solution 1 (aqueous dispersion coating solution) is as follows: It was prepared as follows. First, an aqueous solution 1 and a solvent-based solution 1 were prepared so as to have the following composition. The aqueous solution 1 and the solvent-based solution 1 are mixed and stirred, and then dispersed using a homogenizer to emulsify the solvent-based vinyl chloride resin in the aqueous solution. Thereafter, the organic solvent is removed to obtain an aqueous dispersion coating solution. It was prepared and used as a coating solution for the receiving layer. The amount of solid content of the prepared aqueous dispersion coating liquid was 15%. Hereinafter, also in each of the examples and comparative examples, a coating solution for a receiving layer was prepared by the same method.

Composition of aqueous solution 1 Anionic emulsifier (sodium alkylnaphthalenesulfonate, manufactured by Kao Corporation, trade name: Perex NBL) 2.5 parts by weight Pure water 270 parts by weight
Composition of solvent-based solution 1 / vinyl chloride resin (manufactured by Nissin Chemical Co., Ltd., trade name: Solvain C)
45 parts by weight, ethyl acetate (solvent) 450 parts by weight Example 2
An IC card 2 was obtained in the same manner as in Example 1 except that the composition of the cushion layer coating solution 1 was changed to the cushion layer coating solution 2 described below.

Composition of Cushion Layer Coating Solution 2 Crosslinked Hollow Particles (JSR Co., Ltd., trade name: SX8782 (A), volume average particle size 1.1 μm, inner pore diameter 0.9 μm, hollow rate 55%)
70 parts by mass of styrene acrylic acid copolymer resin (manufactured by BASF Corp., trade name: Joncrill 62J)
25 parts by mass Example 3
An IC card 3 was obtained in the same manner as in Example 1 except that the composition of the cushioning layer coating solution 1 was changed to the cushioning layer coating solution 3 described below.

Composition of coating liquid 3 for cushion layer / hollow particles (manufactured by Nippon Zeon Co., Ltd., trade name: MH5055, volume average particle size 0.5 μm)
70 parts by mass Gelatin (made by Nitta Gelatin Co., Ltd., trade name: RR) 23 parts by mass Hexamethylene-1,6-bis (ethylene urea) (hardener, JP 2002-4059
5 and JP-A-2002-62610) 2 parts by weight Example 4
An IC card 4 was obtained in the same manner as in Example 1 except that the composition of the cushioning layer coating solution 1 was changed to the cushioning layer coating solution 4 described below.

Composition of coating liquid 4 for cushion layer / crosslinked hollow particles (manufactured by JSR Corporation, trade name: SX8782 (A), volume average particle diameter 1.1 μm, inner pore diameter 0.9 μm, hollow ratio 55%)
70 parts by mass of styrene acrylic acid copolymer resin (manufactured by BASF Corp., trade name: Joncrill 62J)
15 parts by mass gelatin (made by Nitta Gelatin Co., Ltd., trade name: RR) 8 parts by mass hexamethylene-1,6-bis (ethylene urea) (hardening agent, JP-A-2002-4059
5 and JP-A-2002-62610) 2 parts by weight comparative example 1
An IC card 5 was obtained in the same manner as in Example 1 except that the cushion layer was not applied.

(Water resistance evaluation)
The IC card produced above is immersed in warm water heated to 36 ° C. for 1 minute, taken out from the warm bath, and excess water is poured off. 30 seconds after the removal, a scratch test was performed with a HEIDON measuring instrument with a load of 20 g and a 0.5 mmφ needle, and the water resistance was evaluated based on the width of the scratch. The evaluation criteria are as follows.
-Evaluation criteria ○: There were scratches with a width of 200 μm or less.

  Δ: There was a scratch having a width of 200 μm or more and less than 500 μm.

  X: There were scratches with a width of 500 μm or more. Alternatively, the coating layer was dissolved in water.

(Light resistance evaluation)
The produced IC card was printed with a black 18-gradation gradation image having an RGB value of 15 * n (n = 0 to 17) using a sublimation thermal transfer printer CX120 (manufactured by Victor Co., Ltd.). The obtained printed matter was evaluated for light resistance using a xenon fade meter under the following conditions.
(I) Conditions for light resistance evaluation / irradiation tester: Ci4000 manufactured by Atlas
・ Light source: Xenon lamp ・ Filter: Inner side = CIRA, Outer side = Soda lime ・ Black panel temperature: 45 (℃)
・ Irradiation intensity: 1.2 (W / m 2) -420 (nm) measured value ・ Irradiation energy: 300 (kJ / m 2) -420 (nm) integrated value (ii) Light resistance evaluation After covering the part with aluminum foil, the light resistance test was conducted under the above conditions. The aluminum foil of the obtained printed material was peeled off and visually evaluated according to the following criteria. The obtained results are shown in Table 1.
-Evaluation criteria ○: Almost no fading.
Δ: Although slight fading can be confirmed, there is no problem in actual use.

  ×: Fading

(Roughness evaluation)
The printed matter produced by the above light resistance evaluation was visually evaluated according to the following criteria.
-Evaluation criteria ○: Unevenness such as graininess is hardly found.

  X: The stamp screen has a grainy feeling.

(Emboss evaluation)
The unevenness of the printed matter produced by the above light resistance evaluation in the high density portion and the low density portion was visually evaluated according to the following criteria.
-Evaluation criteria ○: No irregularities were seen in the appearance.

  Δ: Unevenness was observed in the appearance, but it was at a level of no practical problem.

  X: Unevenness was clearly seen in the appearance.

表１から明らかなように、本願発明で製造された実施例１〜４のＩＣカードは、耐水性、耐光性、ざらつき、エンボス共に良好な評価結果を得ることができた。

As can be seen from Table 1, the IC cards of Examples 1 to 4 manufactured according to the present invention were able to obtain good evaluation results for water resistance, light resistance, roughness, and embossing.

DESCRIPTION OF SYMBOLS 1 IC card 2 Base material 3 Receiving layer 4 Cushion layer 5, 5 'Sheet member 6, 6' Adhesive layer 7 Inlet 8 Antenna body 9 IC chip 10 Reinforcing plate

Claims (5)

In an IC card having an IC module capable of writing and / or reading electronic information without contact and having a cushion layer and a receiving layer on at least one surface of the substrate,
The cushion layer includes hollow particles and a first binder resin,
The receptor layer comprises a second binder resin;
IC card characterized by that.   2. The IC card according to claim 1, wherein the first binder resin is gelatin and / or a styrene acrylic copolymer resin.   The IC card according to claim 1 or 2, wherein the second binder resin is a vinyl chloride resin.   The IC card according to claim 1, wherein the cushion layer further includes a hardener.   The IC card according to any one of claims 1 to 4, wherein the hollow particles are crosslinked hollow particles having a volume average particle diameter of 5 µm.

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