JP2013027146A - Wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which firmly fixes a terminal part to an insulation layer.SOLUTION: A wiring board comprises: a conductive core material 21; an insulation layer provided on an outer peripheral surface of the core material 21; a wiring pattern 14 formed on a surface of the insulation layer; and a terminal part 16a having a long shape. The terminal part 16a comprises: an interior part buried in the insulation layer; and an exposed part protruding from the interior part to the exterior side of the insulation layer, and two through holes 15e, 15a, arranged along the longitudinal direction of the long shape, are formed at the interior part of the terminal part 16a. Each through hole is composed of an open hole and a connection member, and thus the terminal part 16a and the insulation layer are firmly fixed to each other. Further, since the terminal part 16a and the insulation layer are fixed by the two through holes, the misalignment is prevented from occurring in the horizontal direction.

Description

  The present invention relates to a wiring board including a terminal portion protruding outward from an insulating layer covering a core material, and more particularly to a technique for firmly fixing the terminal portion to the insulating layer.

  Conventionally, as a wiring board for mounting electronic components, a flat and conductive core material is covered with an insulating layer, and a conductive circuit layer is formed on the surface of the insulating layer to form a wiring pattern. In the same layer, a plurality of terminal portions that are long and protrude outward are formed (for example, see Patent Document 1). By using such a wiring board, it is possible to connect the protruding portion of the terminal portion to the female connector.

  When such a wiring board is displaced in a plurality of terminal portions, it often occurs that it cannot be smoothly connected to a female connector.

JP 2010-273433 A

  As described above, the conventional wiring board is smoothly connected when connecting to another connector when the terminal portion protruding outward from the same layer as the core material is displaced. The problem of not being able to occur.

  The present invention has been made to solve such conventional problems, and an object of the present invention is to provide a wiring board capable of firmly fixing a terminal portion to an insulating layer. It is in.

  In order to achieve the above object, the invention according to claim 1 of the present application includes a conductive core material (21), an insulating layer (41, 43) disposed so as to cover the outer peripheral surface of the core material, Conductor circuit layers (14, 44) laminated on at least one surface of the insulating layer, and elongated terminal portions (16a to 16d) electrically connected to the conductor circuit layer, The terminal portion includes an interior portion embedded in the insulating layer, and an exposed portion protruding from the interior portion to the outside of the insulating layer. Further, the terminal portion extends in the longitudinal direction of the elongated shape from the interior portion. At least two holes (51) are formed, and fixed to the insulating layer by connecting means (52) provided in the holes.

  According to a second aspect of the present invention, the connecting means is composed of a conductive paste, copper plating, resin, or solder fixed to the hole, or a conductive pin inserted into the hole. Features.

  The invention according to claim 3 is characterized in that the terminal portion is integrated with the core material.

  The invention according to claim 4 is characterized in that at least one connecting means provided in the terminal portion is not electrically connected to the conductor circuit layer.

  In the invention of claim 1, since at least two holes are formed along the longitudinal direction of the terminal portion and are fixed by the connecting means, even if a lateral stress is applied to the terminal portion, , It is possible to prevent the displacement.

  In the second aspect of the present invention, a conductive paste, copper plating, resin, or solder, or a conductive pin inserted into the hole is used as the connecting means, so that the insulating layer and the core material are firmly fixed. It can be fixed.

  In the invention of claim 3, since the terminal portion is integrated with the core material, it is possible to prevent the lateral displacement generated in the terminal portion.

  In the invention of claim 4, since the connecting means is not electrically connected to the conductor circuit layer, only the terminal portion and the insulating layer are fixed by providing the hole and the connecting means at a position where the conductor circuit layer does not exist. A hole portion and a connecting means can be used for the terminal portion, and lateral displacement can be prevented from occurring in the terminal portion regardless of the presence or absence of the conductor pattern.

It is explanatory drawing which shows the structure of the wiring board which concerns on 1st Embodiment of this invention, (a) is an external view, (b) is an internal block diagram. It is a schematic sectional drawing of the wiring board which concerns on embodiment of this invention. It is sectional drawing of the through hole of the wiring board which concerns on 1st, 2nd embodiment of this invention. It is explanatory drawing which shows the structure of the wiring board which concerns on 2nd Embodiment of this invention, (a) is an external view, (b) is an internal block diagram. It is explanatory drawing which shows the structure of the wiring board which concerns on 3rd Embodiment of this invention, (a) is an external view, (b) is an internal block diagram. It is sectional drawing of the wiring board which concerns on 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Description of First Embodiment]
1A and 1B are explanatory views showing the configuration of the wiring board 101 according to the first embodiment of the present invention. FIG. 1A is a top view and FIG. 1B is an explanatory view showing a core material 21 inside the board. . FIG. 2 is a schematic sectional view of the wiring board 101.

  As shown in FIG. 1, the wiring board 101 has a board body 11 that is rectangular as a whole, and an IC 12 and various components 13 are mounted on the surface of the board body 11. As shown in FIG. 2, the substrate body 11 has a multi-layer structure, and a conductive core material 21 (for example, a copper plate) is provided at the center, and the upper surface (core material shown in FIG. 2). An insulating layer 41 is laminated on the upper side (21), and an insulating layer 43 is laminated on the lower surface (below the core material 21 shown in FIG. 2). That is, the insulating layers 41 and 43 are laminated so as to cover the periphery of the core material 21. Further, a wiring pattern (conductor circuit layer) 14 is formed on the upper surface of the insulating layer 41, and a wiring pattern (conductor circuit layer) 44 is formed on the lower surface of the insulating layer 43. In addition, since the wiring patterns 14 and 44 are routed as necessary, there is a region where the wiring patterns 14 and 44 do not exist. In this region, the insulating layers 41 and 43 shown in FIG. Will be exposed. Note that the wiring pattern 14 shown in FIG. 2 is exaggerated in thickness to facilitate understanding. Therefore, the thickness of the wiring patterns 14 and 44 is actually thinner than that of the insulating layers 41 and 43.

  As shown in FIG. 1, the IC 12 is connected to the wiring pattern 14a via the connection terminal 17a, and a through hole 15e is formed in the wiring pattern 14a. Further, a wiring pattern 14 b is formed in the substrate body 11, and a through hole 15 a is formed in the wiring pattern 14 b and is connected to the wiring pattern 14 e through the component 13.

  Therefore, the wiring pattern 14a formed on the surface of the substrate body 11 is electrically connected to the core material 21 and the wiring pattern 44 on the back surface side through the through hole 15e (see FIG. 3A). ). Similarly, the wiring pattern 14b is electrically connected to the core material 21 and the wiring pattern 44 on the back surface side through the through hole 15a.

  Further, the IC 12 is connected to the wiring pattern 14c via the connection terminal 18a, and a through hole 15b is formed in the wiring pattern 14c. Further, it is connected to the wiring pattern 14d through the connection terminal 18b, and a through hole 15d is formed in the wiring pattern 14d.

  Further, as shown in FIG. 1B, a part of the core material 21 is formed in an elongated shape, and this tip protrudes outside the substrate body 11 as a terminal portion 16a. At this time, the through holes 15a and 15e are both formed along the longitudinal direction of the terminal portion 16a. That is, the long terminal portion 16 a is an interior portion in which a part thereof is covered with the insulating layer 41, and the other portion is an exposed portion that protrudes outside the substrate body 11.

  Furthermore, three terminal portions 16b, 16c, and 16d that are made of the same material as the core material 21 and are electrically separated from the core material 21 are provided, and a part of these is covered with an insulating layer 41. The interior portion is used, and the other portion is an exposed portion that protrudes outside the substrate body 11. Through holes 15b, 15c, and 15d are formed in the interior portions of the terminal portions 16b, 16c, and 16d, respectively.

  FIG. 3A is a cross-sectional view of the through-hole 15e. As shown in the figure, the through-hole 15e has a through-hole (hole) 51 penetrating from the front surface to the back surface of the substrate body 11, and further, the through-hole 15e. A connecting member (connecting means) 52 is provided on the inner peripheral surface of 51. The connecting member 52 can be composed of a conductive paste, copper plating, resin, or solder fixed on the inner peripheral surface of the through hole 51, or a conductive pin inserted through the through hole 51. The through hole 15a has the same configuration as the through hole 15e. Therefore, by forming the through holes 15e and 15a in the wiring substrate 101, the core material 21 and the insulating layers 41 and 43 are firmly fixed. Since the through holes 15b to 15d shown in FIG. 1 have the same configuration, the terminal portions 16b to 16d are firmly fixed to the insulating layers 41 and 43.

  In the present embodiment, as shown in FIG. 1, there are two through holes 15e and 15a on the straight line that faces the terminal portion 16a in the longitudinal direction (on the straight line that goes up and down in FIG. 1). Therefore, not only the core material 21 and the insulating layers 41 and 43 are firmly fixed, but also when the lateral stress (stress in the left-right direction in FIG. 1) is applied to the terminal portion 16a, the terminal portion It is possible to prevent the displacement of the position 16a.

  In this manner, in the wiring board 101 according to the first embodiment, the two through holes 15e and 15a are formed in the interior portion of the terminal portion 16a (inside the substrate body 11), and the through holes 15e and 15a are Since each terminal portion 16a is provided along the longitudinal direction of the terminal portion 16a, it is possible to prevent the terminal portion 16a from being displaced, and when the terminal portions 16a to 16d are inserted into and connected to a female connector (not shown). In addition, the connecting operation can be performed smoothly.

  In addition, although 1st Embodiment demonstrated the example which laminates | stacks a wiring pattern (conductor circuit layer) on the upper surface of the insulating layer 41, and the lower surface of the insulating layer 43, respectively, At least one surface (each) of each insulating layer 41 and 43 ( For example, a wiring pattern may be provided on the surface of the insulating layer 41 only).

  Moreover, although 1st Embodiment demonstrated the example which provides two through-holes 15e and 15a along the longitudinal direction of the terminal part 16a, this invention is not limited to this, The longitudinal direction of the terminal part 16a It is good also as a structure which provides three or more through-holes along a direction. In this case, it becomes possible to fix more firmly to the stress in the lateral direction.

[Description of Second Embodiment]
Next, a second embodiment will be described. 4A and 4B are explanatory views showing the configuration of the wiring board 102 according to the second embodiment, wherein FIG. 4A is a top view and FIG. 4B is an explanatory view showing the core material 21 inside the board. The second embodiment is different from the first embodiment described above in that a through hole 15f shown in FIG. 4 is formed instead of the through hole 15e shown in FIG. That is, in the wiring board 102 according to the second embodiment, the through hole 15f is provided at a position where the wiring pattern 14a does not exist.

  FIG. 3B is a cross-sectional view of the through hole 15f. As shown in the figure, the through hole 15f has a through hole (hole) 51 that penetrates from the front surface to the back surface of the substrate body 11, and further includes the through hole. A connecting member (connecting means) 52 is provided on the inner peripheral surface of the hole 51. The connection member 52 is a conductive paste, copper plating, resin, or solder fixed on the inner peripheral surface of the through hole 51, or a conductive pin inserted through the through hole 51, as in the first embodiment. Can be configured. Therefore, the core material 21 and the insulating layers 41 and 43 can be firmly fixed by forming the through hole 15f in the wiring board 102 and the through hole 15a.

  That is, in the first embodiment described above, the terminal portion 16a is firmly fixed by the two through holes 15e and 15a penetrating the wiring patterns 14a and 14b. However, in the second embodiment, the wiring pattern and Even if there is no need for electrical connection between the terminals 16a (core material 21) and the insulating layers 41 and 43, the through holes 15f are firmly fixed. Accordingly, as in the first embodiment described above, the two through holes 15f and 15a are provided along the longitudinal direction of the terminal portion 16a. Therefore, even when a lateral stress is applied to the terminal portion 16a, It is possible to prevent the displacement of the terminal portion 16a.

  In this way, in the wiring board 102 according to the second embodiment, two through holes, that is, the wiring pattern (conductor circuit layer) 14b are connected to the interior part (inside the board body 11) of the terminal part 16a. A through hole 15f that is not connected to the through hole 15a is formed. And since each through-hole 15f, 15a is each provided along the longitudinal direction of the terminal part 16a, it can prevent that position shift generate | occur | produces in the terminal part 16a, and the terminal parts 16a-16d can be connected to a female connector ( When inserting and connecting to (not shown), the connecting operation can be performed smoothly.

[Description of Third Embodiment]
Next, a third embodiment will be described. 5A and 5B are explanatory views showing the configuration of the wiring board 103 according to the third embodiment. FIG. 5A shows a top view and FIG. 5B shows the core material 21 inside the board. FIG. 6 is a cross-sectional view of the terminal portion 16b facing in the longitudinal direction. The third embodiment is different from the first and second embodiments described above in that two through holes 31a to 31d and 32a to 32d are provided for the terminal portions 16a to 16d, respectively.

  That is, as shown in FIG. 5B, the wiring board 103 according to the third embodiment is provided in the interior portion of the terminal portion 16a (inside the substrate body 11) along the longitudinal direction of the terminal portion 16a. Through-holes 31a and 32a are formed, and in the interior portion of the terminal portion 16b, two through-holes 31b and 32b are formed along the longitudinal direction of the terminal portion 16b, and the interior portion of the terminal portion 16c is formed. Are provided with two through holes 31c and 32c along the longitudinal direction of the terminal portion 16c. Furthermore, the interior portion of the terminal portion 16d has two through holes along the longitudinal direction of the terminal portion 16d. Through holes 31d and 32d are formed.

  The through holes 31b and 32b are connected to the wiring pattern 14c, and the through holes 31d and 32d are connected to the wiring pattern 14d.

  As shown in FIG. 6, the terminal portion 16b is provided with two through holes 31b and 32b penetrating the terminal portion 16b. The terminal portion 16b and the insulating layers 41 and 43 are firmly fixed by the through holes 31b and 32b. The same applies to the other terminal portions 16a, 16c, and 16d.

  Accordingly, since each of the terminal portions 16a to 16d is fixed by two through holes, the terminal portions 16a to 16d can be firmly fixed between the insulating layers 41 and 43. Since the through-holes are provided along the longitudinal direction of each of the terminal portions 16a to 16d, even if stress is applied to the terminal portions 16a to 16d in the lateral direction, it is possible to prevent displacement. it can. As a result, as in the first and second embodiments described above, when the wiring board 103 is connected to a female connector (not shown), the connecting operation can be performed smoothly.

  In addition, although the example which drills two through holes in one terminal part was demonstrated in FIG. 5, this invention is not limited to this, It can also be set as the structure which provides three or more through holes. is there.

  In the first to third embodiments described above, the example in which the through-hole penetrating from the front surface to the back surface of the substrate body 11 is formed as the hole portion. However, the present invention is not limited to this, and the substrate It is also possible to use a hole formed from the surface of the main body 11 to the core material 21 or from the back surface of the substrate main body to the core material 21. Even in such a configuration, it is possible to achieve the same effect as the above-described embodiment.

  The wiring board of the present invention has been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part may be replaced with an arbitrary configuration having the same function. it can.

  The present invention can be used to prevent a lateral shift of a terminal portion protruding outside the wiring board.

11 Board body 12 IC
13 Parts 14, 14a to 14e, 44 Wiring patterns 15a to 15f Through holes 16a to 16d Terminal portions 17a, 18a and 18b Connection terminals 21 Core materials 31a to 31d Through holes 32a to 32d Through holes 41, 43 Insulating layer 51 Through hole ( Hole)
52 connecting member 101, 102, 103 wiring board

Claims (4)

A conductive core material;
An insulating layer disposed so as to cover the outer peripheral surface of the core material;
A conductor circuit layer laminated on at least one surface of the insulating layer;
A long terminal portion electrically connected to the conductor circuit layer,
The terminal portion includes an interior portion embedded in the insulating layer, and an exposed portion protruding from the interior portion to the outside of the insulating layer,
Further, the terminal portion is formed with at least two holes along the longitudinal direction of the elongated shape in the interior portion, and is fixed to the insulating layer by connecting means provided in the holes. A wiring board characterized by.   The said connection means is comprised with the electroconductive paste fixed to the said hole part, copper plating, resin, or solder, or the electroconductive pin penetrated by the said hole part. Wiring board.   The wiring board according to claim 1, wherein the terminal portion is integrated with the core material.   4. The wiring board according to claim 1, wherein at least one connecting means provided in the terminal portion is not electrically connected to the conductor circuit layer. 5.

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