JP2013024869A - Probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flatness adjusting member and a probe card with the same.SOLUTION: A probe card includes: a first substrate 110 which is equipped with a plurality of probe pins projecting from the undersurface and contactable with a pattern of an inspection object; a second substrate 140 which is provided above the first substrate 110 and electrically connected to the first substrate 110 through electrical connection means; and a flatness adjusting member which is provided between the first and second substrates 110, 140 to adjust a flatness. The flatness adjusting member includes a fixing bolt 120 which is bonded to the top surface of the first substrate 110, and an adjusting bolt 170 which penetrates the second substrate 140 from above to be coupled with the fixing bolt 120. A fixing strength increasing part 110a which increases bonding strength between the first substrate 110 and the fixing bolt 120 is formed in a part of the top surface of the first substrate 110, to which the fixing bolt 120 is bonded.

Description

  The present invention relates to a flatness adjusting member and a probe card including the same, and more particularly to a probe card that can prevent damage and breakage of a ceramic substrate when adjusting the flatness of a space transformer such as a ceramic substrate.

  In general, a semiconductor device is manufactured through a fabrication process for forming a pattern on a wafer and an assembly process for assembling the wafer on which the pattern is formed with respective chips. During the process, an EDS (Electrical die sorting) process for inspecting the electrical characteristics of each chip constituting the wafer is performed.

  Such an EDS process is a process for discriminating particularly defective chips among the chips constituting the wafer, that is, an electric signal is inputted to each chip constituting the wafer, The presence or absence of a defect is determined based on the output signal obtained as a result. To that end, it is essential to have a probe card that applies an electrical signal while directly contacting the chip pattern on the wafer.

  As shown in FIGS. 1 to 2, the conventional probe card 10 is a ceramic in which a number of probe pins (not shown) that directly contact a pattern of a wafer chip (not shown) that is an object of electrical inspection are formed on the lower surface. A printed circuit board 14 electrically connected to the ceramic substrate 11 via a connector 16 provided on the ceramic substrate 11 and serving as interface means; and the ceramic substrate 11 and the printed circuit board. 14 and a probe jig 15 covering 14.

  Further, the probe card 10 is connected between the ceramic substrate 11 and the printed circuit board 14 in order to adjust the horizontal state of the probe card, that is, the flatness of the probe card. Further comprising a flatness adjusting member.

  Here, the flatness adjusting member passes through the printed circuit board 14 from above and the fixing bolt 12 in the form of a male screw fixed to the center of the upper surface of the ceramic substrate 11 with an adhesive 13 such as epoxy. And an adjusting bolt 17 screwed to the bolt 12.

  At this time, a coupling groove 17a for rotating the adjustment bolt 17 with a tool such as a wrench 18 (see FIG. 3) is formed in the head portion of the adjustment bolt 17. As described above, when the fixing bolt 12 and the adjustment bolt 17 are screwed together, the wrench 18 is inserted into the coupling groove 17a of the adjustment bolt 17 and rotated forward and backward, thereby the ceramic substrate 11 and the print The distance between the circuit board 14 and the horizontal state of the probe card 10, that is, the flatness can be adjusted.

  However, in the probe card 10 having the above-described structure, torque applied to the adjustment bolt 17 in the process of adjusting the flatness by rotating the adjustment bolt 17 acts on the fixing bolt 12 as stress. For this reason, there is a problem that a bonded portion between the fixing bolt 12 and the ceramic substrate 11 is broken or the ceramic substrate 11 is damaged or broken.

JP 2008-216060 A

  The present invention has been derived in order to solve the above-mentioned problems. The present invention relates to the assembly of the ceramic board and the printed circuit board and the adjustment of the flatness of the probe card in the process of adjusting the flatness of the probe card and the ceramic board. An object of the present invention is to provide a flatness adjusting member capable of improving durability and life by preventing breakage of a joint portion and damage or breakage of a ceramic substrate, and a probe card including the same.

  In order to achieve the above object, the present invention includes a first substrate having a plurality of probe pins that can come into contact with a pattern of an object to be inspected and protruded on a lower surface, and an upper portion of the first substrate. A second substrate electrically connected to the substrate through an electrical connection means; and a flatness adjusting member provided between the first substrate and the second substrate for adjusting the flatness. The flatness adjusting member includes a fixing bolt bonded to the upper surface of the first substrate, and an adjusting bolt that penetrates the second substrate from above and is coupled to the fixing bolt. The probe card is provided with a fixing strength reinforcing portion for increasing a bonding force between the first substrate and the fixing bolt at a portion to which the fixing bolt is bonded.

  Here, the fixing strength reinforcing part may include a groove formed on the upper surface of the first substrate and filled with an adhesive.

  In this case, the groove may have at least one step portion along the depth direction.

  Meanwhile, the fixing force strengthening part may include a plurality of ring-shaped grooves formed on the upper surface of the first substrate and filled with an adhesive.

  At this time, the plurality of grooves may be spaced apart radially.

  The adhesive is preferably provided to have a predetermined thickness from the upper surface of the first substrate.

  Meanwhile, the first substrate may include a ceramic substrate, and the second substrate may include a printed circuit board.

  As described above, according to the probe card of the present invention, the assembly of the first substrate, that is, the ceramic substrate, and the second substrate, that is, the printed circuit board, and the process of adjusting the flatness of the probe card including the assembly. Thus, the stress applied to the ceramic substrate can be dispersed to prevent the breakage of the bonded portion of the ceramic substrate and the damage or breakage of the ceramic substrate, and further improve the durability, productivity and life of the probe card. There is an advantage.

  Further, according to the probe card of the present invention, there is an advantage that the fixing force of the fixing bolt that is bonded and fixed to the ceramic substrate by the adhesive can be enhanced. That is, by increasing the area where the adhesive contacts the ceramic substrate, the force by which the adhesive fixes the fixing bolt to the ceramic substrate, that is, the fixing force can be increased.

  In addition, according to the probe card of the present invention, there is an advantage that it is possible to clearly grasp the position where the fixing bolt is fixed to the ceramic substrate by forming the fixing force reinforcing portion on the ceramic substrate, and to prevent an assembly error.

FIG. 6 is a cross-sectional view illustrating a state in which a fixing bolt is bonded to a ceramic substrate in a probe card according to a conventional technique. It is sectional drawing which showed schematically the probe card by a prior art. FIG. 6 is a cross-sectional view schematically illustrating adjusting the flatness of a probe card according to the prior art. In the probe card according to the present invention, it is a cross-sectional view showing a state in which a fixing bolt is bonded to a first substrate. FIG. 5 is a plan view and a cross-sectional view of a recess schematically showing a fixing strength reinforcing portion of the first substrate of FIG. 4. It is sectional drawing which showed schematically the probe card by this invention. FIG. 5 is a cross-sectional view schematically illustrating adjusting the flatness of a probe card according to the present invention. It is the recessed part top view and sectional drawing which showed the adhering force reinforcement | strengthening part of the 1st board | substrate applied to other embodiment of the probe card by this invention. FIG. 9 is a cross-sectional view schematically illustrating another embodiment of the probe card according to the present invention including the first substrate of FIG. 8.

  Hereinafter, preferred embodiments of the present invention capable of specifically realizing the object of the present invention will be described with reference to the accompanying drawings. In the description of the present embodiment, the same name and the same reference numeral are used for the same configuration, and additional description thereof will be omitted.

  First, an embodiment of a probe card according to the present invention will be described in more detail with reference to FIGS.

  FIG. 4 is a cross-sectional view illustrating a state in which a fixing bolt is bonded to a first board in a probe card according to the present invention, and FIG. 5 schematically illustrates a fixing strength reinforcing portion of the first board of FIG. FIG. 6 is a cross-sectional view schematically illustrating a probe card according to the present invention, and FIG. 7 is a schematic view illustrating adjusting the flatness of the probe card according to the present invention. It is sectional drawing shown.

  4 to 7, an embodiment of the probe card 100 according to the present invention is large and may include a first substrate 110, a second substrate 140, and a flatness adjusting member.

  Here, the first substrate 110 may include a plurality of probe pins (not shown) that can come into contact with a pattern of an inspection object (not shown) such as a wafer, and may be configured as a ceramic substrate. Can be done.

  In addition, the second substrate 140 is provided on the first substrate 110 and can be electrically connected to the first substrate 110 through an electrical connection unit 160 such as a connection pin. Can be configured on a substrate.

  At this time, the probe card 100 according to the present embodiment may include a probe jig 150 that covers the first substrate 110 and the second substrate 140.

  Meanwhile, the flatness adjusting member is provided between the first substrate 110 and the second substrate 140 to adjust the flatness, and in the present embodiment, the flatness adjusting member is The fixing bolt 120 may be attached to the upper surface of the first substrate 110, and the adjusting bolt 170 may be connected to the fixing bolt 120 through the second substrate 140 from above.

  At this time, a coupling groove 170 a to which a wrench 180 for adjusting the flatness is coupled may be formed in the head portion of the adjustment bolt 170.

  In addition, in the present embodiment, the flatness adjusting member may be configured such that the bonding force between the first substrate 110 and the fixing bolt 120, i.e., the fixing force, is increased in the upper surface of the first substrate 110. The fixing strength reinforcing portion 110a can be formed at a portion to which the fixing bolt 120 is bonded.

  In this embodiment, it is disclosed that the fixing strength reinforcing part 110a is formed of a plurality of ring-shaped grooves formed on the upper surface of the first substrate 110 and filled with an adhesive 130 such as epoxy. It is not limited.

  In more detail, the fixing strength reinforcing part 110a may be formed in a radial pattern in which ring-shaped grooves are formed at predetermined intervals in the center of the upper surface of the first substrate 110.

  Here, when the first substrate 110 is formed with a thickness of about 3 to 8 mm, each groove of the fixing force reinforcing portion 110a is formed with a diameter of about 10 to 30 mm and a thickness of about 1 to 3 mm. It is preferable.

  Accordingly, when the adjustment bolt 170 is rotated for flatness adjustment in a state where the adjustment bolt 170 is coupled to the fixing bolt 120, the present embodiment is adapted to correspond to the rotation form of the adjustment bolt 170. By forming the fixing strength reinforcing portion 110a of the ring-shaped grooves formed radially, the stress applied to the first substrate 110, that is, the ceramic substrate can be effectively dispersed. In the process of adjusting the flatness by the flatness adjusting member, the first substrate 110 can be effectively prevented from being damaged or broken.

  Meanwhile, the adhesive 130 is preferably provided to have a predetermined thickness from the upper surface of the first substrate 110. That is, the adhesive 130 is filled in the fixing strength reinforcing portion 110a formed on the first substrate 110 and is provided on the upper surface of the first substrate 110 with a predetermined thickness. The fixing area and amount of the adhesive 130 to be applied can be increased, and the force for fixing the fixing bolt 120 to the first substrate 110, that is, the fixing force can be increased.

  Next, another embodiment of the probe card according to the present invention will be described in detail with reference to FIGS.

  FIG. 8 is a plan view and a cross-sectional view of a concave portion showing a fixing strength reinforcing portion of a first substrate applied to another embodiment of the probe card according to the present invention, and FIG. 9 includes the first substrate of FIG. It is sectional drawing which showed other embodiment of the probe card by this invention roughly.

  As shown in FIGS. 8 and 9, the probe card 200 according to the present embodiment is different from the above-described embodiment in that the fixing force reinforcing portion 210 a is formed on the upper surface of the first substrate 110 and is a groove filled with an adhesive. Disclose the formation.

  That is, the adhering strength reinforcing portion 210a of the present embodiment is configured by a circular groove formed integrally.

  At this time, the groove is preferably formed so as to have at least one step portion along the depth direction.

  Also in the probe card 200 according to the present embodiment, in the process in which the adjustment bolt 270 is rotated to adjust the flatness in a state where the adjustment bolt 270 is coupled to the fixing bolt 220, the fixing force strengthened on the first substrate 210 is enhanced. The stress applied to the first substrate 210, that is, the ceramic substrate can be effectively dispersed by the portion 210a, whereby the first substrate 210 is damaged or broken during the flatness adjustment process by the flatness adjustment member. Can be effectively prevented.

  In addition, the probe card 200 according to the present embodiment increases the fixing area and amount of the adhesive 230 that is fixed to the first substrate 210, and the force that fixes the fixing bolt 220 to the first substrate 210, that is, the fixing force. Can be increased.

  Compared with the conventional probe card, the probe card according to the present embodiment can greatly improve the fixing force between the first substrate, that is, the ceramic substrate and the fixing bolt, that is, the fixing strength. Can be confirmed.

  That is, referring to Table 1 below, a first substrate is formed with a thickness of 5 mm, and an adhesion strength reinforcing portion is formed on the upper surface of the first substrate, that is, a ring shape having a maximum diameter of 20 mm and a depth of 2 mm. Comparison was made with a conventional probe card through the process of adjusting the flatness of the probe card having five grooves.

  As a result of comparison, the fixing strength of the probe card according to the present invention for all 10 samplings was twice or more on average higher than that of the conventional probe card.

  The preferred embodiments of the present invention described above have been disclosed for the purpose of illustration, and those who have ordinary knowledge in the technical field to which the present invention belongs do not depart from the technical idea of the present invention. Various substitutions, modifications, and alterations are possible, and such substitutions, alterations, etc. should fall within the scope of the appended claims.

100 Probe card 110 First board 120 Fixing bolt
130 Adhesive 140 Second substrate 150 Probe jig 160 Electrical connection means 170 Adjustment bolt 180 Wrench

Claims (7)

A first substrate having a plurality of probe pins that can come into contact with a pattern of an object to be inspected and projecting from a lower surface;
A second substrate provided on an upper portion of the first substrate and electrically connected to the first substrate via an electrical connection means;
A flatness adjusting member for adjusting flatness provided between the first substrate and the second substrate,
The flatness adjusting member includes a fixing bolt bonded to the upper surface of the first substrate, and an adjusting bolt that penetrates the second substrate from above and is coupled to the fixing bolt.
A probe card in which a fixing force reinforcing portion for increasing a coupling force between the first substrate and the fixing bolt is formed on a portion of the upper surface of the first substrate to which the fixing bolt is bonded.   The probe card according to claim 1, wherein the fixing force reinforcing portion includes a groove formed on an upper surface of the first substrate and filled with an adhesive.   The probe card according to claim 2, wherein the groove has at least one step portion along a depth direction.   2. The probe card according to claim 1, wherein the fixing force reinforcing portion includes a plurality of ring-shaped grooves formed on an upper surface of the first substrate and filled with an adhesive.   The probe card according to claim 4, wherein the plurality of grooves are spaced apart radially.   The probe card according to claim 2, wherein the adhesive is provided so as to have a predetermined thickness from an upper surface of the first substrate.   The probe card according to claim 1, wherein the first substrate includes a ceramic substrate, and the second substrate includes a printed circuit board.

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