CN101533036A

CN101533036A - Probe supporting device

Info

Publication number: CN101533036A
Application number: CN200810083570A
Authority: CN
Inventors: 范宏光; 林燊一; 杨惠彬
Original assignee: MJC Probe Inc
Current assignee: MJC Probe Inc
Priority date: 2008-03-12
Filing date: 2008-03-12
Publication date: 2009-09-16

Abstract

The invention discloses a probe supporting device which is used for leading a plurality of probes to be arranged on the device and form a probe card assembly. The probe supporting device comprises a rigid bearing element and a probe substrate. The rigid bearing element has a plurality of supporting pillars, and the ends of the supporting pillars are positioned on a same setup plane. The ends of the supporting pillars are connected with the probe substrate so as to eliminate the buckling deformation of the probe substrate, thus leading the probe substrate to be flat, and the probes are arranged on the flat probe substrate, thus leading a plane which is defined by the front ends of all the probes to be parallel to a prearranged plane.

Description

Probe supporting device

Technical field

The present invention relates to the detection of circuit arrangement, particularly about the circuit of a probe contact chip, with the detection chip function whether normal operation probe card assembly and be applied to the probe supporting device of this probe.

Background technology

Whether there are exposed plain conductor or contact mat in the surface of chip, can and receive feedback signal for the feed-in test signal, can normal operation to judge chip.The mode of feed-in and received signal is to utilize the probe that possesses probe, suppress on chip with suitable pressure, make the front end of probe and chip signal feed-in point, feed out point (for example Luo Lu plain conductor or contact mat) and contact, and the circuit and the chip to be measured that electrically conduct and be arranged at probe.Probe when probe is pressed down with the probe front contact chip, along with probe continues to press down, elastic deformation can appear in probe, make probe front flexibly be contacted with contact mat and produce elastic force, each probe is all suppressed on contact mat with suitable pressure, sees through electrical connecting wire linking probe and test circuit (being arranged on usually on the circuit board of probe) again.Under the ideal situation, the front end of each probe is to be positioned on the same imaginary plane V not having when stressed, and when probe was pressed down, each probe can possess identical deflection, produce identical elastic force, guarantee that contact mat is suppressed and be contacted with to the front end of each probe all with identical pressure.

Yet, use the substrate that the basis is set for the probe conduct often because of procedure for processing produces warping phenomenon, and make substrate surface can't keep desirable flat state.Be arranged at the probe on the substrate, its front end also can't be positioned on the same imaginary plane V.In this case, probe just must increase towards the amount of feeding of chip compacting, can both contact measured examination chip to guarantee each probe.Because the deflection difference of each probe, therefore the probe that is positioned at substrate recess (away from the part of chip) can be with less pressure contact chip, and cause loose contact, the probe that is positioned at substrate evagination place (near the part of chip) can excessively be compressed distortion on the contrary, with excessive pressure contact chip, cause probe or chip to be damaged.

In order to address the above problem, the mode that proposes in the prior art mainly contains three kinds of modes.

First kind of mode is that the kenel at probe improves, reduce the Hooke coefficient of probe along the probe pressing direction, so that different each probe deformations amount are when possessing difference, still produce approximate elastic pressure, for example No. 293938 patents of invention of TaiWan, China patent announcement and TaiWan, China patent announcement I269874 patent of invention.

No. 293938 patent of invention is with the tortuous kenel of making of probe, make it comprise two resilient contact structure, wherein at least one resilient contact structure possesses low Hooke coefficient along the probe pressing direction, therefore within specific compression deformation scope, the elasticity press power that probe produces can be very approximate, and having solved probe front does not have coplanar problem.The probe of I269874 patent of invention has comprised probe tip and elastic construction, on, elastic construction possesses low Hooke coefficient along the probe pressing direction, and therefore within specific compression deformation scope, the elasticity press power that probe produces can be very approximate.So, No. 293938 patents of invention and I269874 patent of invention have all adopted the probe structure of relative complex, have increased the cost of manufacture and the manufacture difficulty of probe.

The second way is to grinding in order to the face that is provided with that probe is set, make probe substrate have at least a side to keep desirable flat state, for the probe setting thereon, and for example: TaiWan, China patent I284379 patent of invention.The I284379 patent of invention is the probe substrate surface in buckling deformation, a plurality of fixed parts are set, the end face of each fixed part is through a polish process, make the end face of fixed part possess coplanar feature, but this kind design can't solve the problem that probe substrate is subjected to load deformation, therefore must additionally increase the structure of opposing external force load.

The third mode is with adjusting gear a plurality of points on the probe substrate to be carried out the application of force, buckling deformation to probe substrate compensates, and desirable flat state is kept at least one side that makes probe substrate, for example: No. 588404 patents of invention of TaiWan, China patent announcement and No. 588400 patents of invention of TaiWan, China patent announcement, all be to adopt a plurality of adjustment assemblies that probe substrate is exerted pressure or pulling force, acting in conjunction is with the buckling deformation of compensation probe substrate.This probe card designs must be after assembling be finished, and assembly carries out repeatedly and accurate fine setting to adjusting, fine setting program complexity.The buckling deformation state of each probe substrate is also different simultaneously, and is therefore also different at the fine setting compensation that individual other probe substrate carried out, and makes its manufacture difficulty height.

Probe supporting device of the prior art or probe card assembly in order to make the probe front copline, have related to the complicated probe structure or the structure of probe supporting device, promote the manufacture difficulty and the cost of manufacture that cause probe card assembly.

Summary of the invention

The probe card assembly that the object of the invention is to propose a kind of probe supporting device and uses this probe supporting device, the structure of see through oversimplifying is reached and is made the coplanar effect of probe front.

In order to reach above-mentioned purpose, the present invention proposes a kind of probe supporting device, uses for a plurality of probes to be set up thereon, and forms a probe card assembly.Probe supporting device comprises a rigidity bearing part and a probe substrate.The rigidity bearing part has a plurality of support columns, and the end of support column is to be positioned at the same plane that is provided with.Probe substrate is used for probe and is set up thereon, and wherein the end of support column is connected in probe substrate, makes probe substrate keep dull and stereotyped state with the buckling deformation of eliminating probe substrate, makes probe front be positioned at an imaginary plane jointly.

In one or more embodiment of the present invention, support column is to extend the rigidity bearing part, for the support column end all is positioned at the plane is set, be on a processing plane, the support column end to be carried out processing grinding, make the support column end plane is set, the plane is set so that the end of a plurality of support columns all is positioned at this for being located on.

In the present invention another or a plurality of embodiment, support column is isometric also parallel to each other, for the support column end all is positioned at the plane is set, be to form a reference plane with a processing grinding program in rigidity bearing part surface in advance, make support column etc. extend reference plane again, the plane is set so that the end of a plurality of support columns all is positioned at this.

Effect of the present invention is that the present invention sees through simple structure just can reach the coplanar effect of probe front, does not need complicated probe kenel or additionally additional micromatic setting.Simultaneously, can see through the load of rigidity bearing part opposing external force effectively, need not carry out extra indemnifying measure in the distortion that the load at external force causes.

Description of drawings

Figure 1A and Figure 1B are in the first embodiment of the invention, a kind of diagrammatic cross-section of probe card assembly;

Fig. 2 A and Fig. 2 B are among first embodiment, the diagrammatic cross-section that support column is processed;

Fig. 3 A and Fig. 3 B are in the first embodiment of the invention, and support column is connected in the diagrammatic cross-section of probe substrate;

Fig. 4 A and Fig. 4 B are in the first embodiment of the invention, the diagrammatic cross-section of probe card assembly test chip;

In Fig. 5 A and Fig. 5 B second embodiment of the invention, a kind of diagrammatic cross-section of probe;

In Fig. 6 A and Fig. 6 B third embodiment of the invention, a kind of diagrammatic cross-section of probe;

In Fig. 7 A and Fig. 7 B fourth embodiment of the invention, a kind of diagrammatic cross-section of probe;

Fig. 8 A, Fig. 8 B and the 8th figure C are among the 4th embodiment, the reference plane of strengthening substrate processed, and in conjunction with the diagrammatic cross-section of support column in the reference plane of strengthening substrate;

In Fig. 9 A and Fig. 9 B fifth embodiment of the invention, a kind of diagrammatic cross-section of probe;

Figure 10 A, Figure 10 B and the tenth figure C are among the 5th embodiment, the reference block of strengthening on the substrate processed, and in conjunction with the diagrammatic cross-section of support column in reference plane;

Figure 11 A, Figure 11 B, Figure 11 C, Figure 11 D, Figure 11 E, and Figure 11 F be in the sixth embodiment of the invention, a kind of diagrammatic cross-section of probe;

Figure 12 A, Figure 12 B, Figure 12 C, Figure 12 D, and Figure 12 E be in the seventh embodiment of the invention, a kind of diagrammatic cross-section of probe.

[primary clustering symbol description]

First embodiment

100 probe card assemblies

100a rigidity bearing part 110 rigid substrates

121 perforation of 120 circuit boards

130 support columns, 131 stiff ends

132 free ends, 140 probe substrates

141 probes, 150 electrical connection modules

901 test platforms, 902 chips

P is provided with the planar S supporting plane

The V imaginary plane

Second embodiment

200 probe card assemblies

210 rigid substrates, 212 support columns

212a free end 220 circuit boards

240 probe substrate P are provided with the plane

The 3rd embodiment

300 probe supporting devices

310 rigid substrates, 320 circuit boards

330 support columns, 340 probe substrates

The 4th embodiment

400 probe supporting devices

410 rigid substrates, 41 1 reference planes

412 faying faces, 413 fixed orifices

421 perforation of 420 circuit boards

430 support columns, 431 stiff ends

432 free ends, 440 probe substrates

441 probes, 450 electrical connection modules

470 fixed cap P are provided with the plane

S supporting plane V imaginary plane

The 5th embodiment

500 probe supporting devices

510 rigid substrates, 511 lateral surfaces

512 faying faces, 513 fixed orifices

521 perforation of 520 circuit boards

530 support columns, 531 stiff ends

532 free ends, 533 joint portions

540 probe substrates, 541 probes

542 conjunctions, 560 reference blocks

561 perforation, 570 fixed caps

R reference plane P is provided with the plane

The V imaginary plane

The 6th embodiment

600 probe supporting devices

610 rigid substrates, 611 lateral surfaces

612 faying faces, 613 combined holes

621 perforation of 620 circuit boards

630 support columns, 631 first support members

632 second support members, 640 probe substrates

650 fixed frames, 651 disposal areas

652 second combined holes 660 are in conjunction with sleeve

670 intermediate woods, 680 fixed caps

R reference plane P is provided with the plane

V presets the plane

The 7th embodiment

700 probe supporting devices, 710 rigid substrates

711 lateral surfaces, 712 faying faces

713 combined holes, 720 circuit boards

721 perforation, 730 support columns

740 probe substrates, 741 probes

750 fixed frames, 751 hollow region

752 screws 760 are in conjunction with sleeve

761 flanges, 770 intermediate woods

780 fixed cap R reference planes

P is provided with the default plane of plane V

Embodiment

Shown in Figure 1A and Figure 1B, the diagrammatic cross-section of a kind of probe card assembly 100 that discloses for first embodiment of the invention, this probe card assembly 100 comprises a rigid substrates 110, a circuit board 120, a plurality of support column 130, an and probe substrate 140.

Consult shown in Figure 1A and Figure 1B, rigid substrates 110 is to make with the material of heavily stressed intensity and low rate of strain, in order to support structure power to be provided again.Circuit board 120 is incorporated into the downside of rigid substrates 110, and circuit board 120 usefulness are set up thereon for test circuit, produces test signal and receives feedback signal.Have more a plurality of perforation 121 on the circuit board 120, pass for each support column 130.Each support column 130 has a stiff end 131 and a free end 132 respectively, and stiff end 131 is fixed in the downside of rigid substrates 130, so that each support column 130 is fixed in rigid substrates 110 downsides, makes each support column 130 extend rigid substrates 110 respectively.

Consult shown in Fig. 2 A and Fig. 2 B, the free end 132 of support column 130 is through a machining program, grinds or cuts on same processing plane jointly again.Can possess different length through the support column 130 after the machining program, present that length increases progressively or length is successively decreased or the ordered state of unequal length.Because free end 132 is processed on same processing plane jointly, be to be positioned at the same plane P that is provided with therefore through the free end 132 after the processing.Though having addressed each support column 130 in the above stated specification is to arrange parallel to each other, but in present embodiment, each support column 130 must not need parallel to each other, only need be after being fixed in rigid substrates 110, simultaneously each free end 132 is processed, free end 132 after the processing all is positioned at plane P is set to get final product.In addition, though the support column 130 that is illustrated among Figure 1A and Figure 1B presents line spread, in fact support column 130 is not to adopt single file configuration, but the area size of looking rigid substrates 110 and circuit board 120 is allocated in fifty-fifty and is provided with on the plane P.

Consult shown in Figure 1A, Figure 1B, Fig. 3 A and Fig. 3 B, probe substrate 140 is set on the probe substrate 140 for probe 141 in order to the basis that is provided with as a plurality of probes 141 again.The free end 132 of support column 130 is connected in probe substrate 140, see through the fixed support effect of support column 130, eliminate the buckling deformation of probe substrate 140, make probe substrate 140 be kept dull and stereotyped state in being provided with on the plane P by panelized, forming provides a smooth and supporting plane S not warpage.Probe 141 is arranged at parallel to each other by the supporting plane S of the probe substrate 140 of panelized, so the plane that defines jointly of the front end of probe 141, can be parallel to a default plane.The plane that this default plane is the predetermined contact of probe, for example exposed surface of workplace on the board or chip.Because rigid substrates 110 adopts the structure fabrication that possesses high relatively rigidity, therefore connection that can be by support column 130 also can reduce the distortion after probe substrate 140 is subjected to load to provide probe substrate 140 enough anchorage forces.In other words, present embodiment provides a kind of probe card assembly 100 that comprises probe supporting device and probe 141, and wherein probe supporting device has comprised rigidity bearing part 100a and probe substrate 140.Rigidity bearing part 100a can be any kenel, and in order to support structure power to be provided, and rigidity bearing part 100a has a plurality of support columns 130, and wherein support column 130 is the rigid substrates 110 that extend rigidity bearing part 100a.The free end 132 of support column 130 processed jointly (grind or cut) and be positioned at the same plane P that is provided with, and each free end 132 is sides that are connected in probe substrate 140, with fixed support probe substrate 140.Be positioned at conplane free end 132, provide fixed support power, and eliminate the buckling deformation of probe substrate 140 probe substrate 140.Eliminate buckling deformation after probe substrate 140 by panelized, and provided a smooth supporting plane S by 140 pairs of probes 141 of the probe substrate of panelized, the defined plane parallel of front end that makes the probe 141 that is arranged at supporting plane S is in a default plane V.

Shown in Figure 1B, in addition, probe card assembly 100 more comprises a plurality of electrical connection modules 150, in order to electrically connect circuit board 130 and probe 141, electrical connection module 150 can be selected: the not plain conductor of coated insulation layer, general electric wire (plain conductor of coating plastic or rubber insulation), enameled wire or soft arranging wire (coat simultaneously and isolate a plurality of plain conductors) with insulation course, and in order between probe 141 and circuit board 130, to transmit electric signal.

Consult shown in Fig. 4 A and Fig. 4 B, aforementioned probe card assembly 100 is to be set up on the testing apparatus, is fixed in chip 902 on the test platform 901 in order to test.Probe substrate 140 and chip 902 be for being provided with parallel to each other, and be not under the stress, by the plane that probe 141 front ends define jointly, also with default plane V, just parallel with the upper surface of chip 902 at probe 141.Probe substrate 140 and chip 902 are relatively moved, make probe substrate 140 move, or test platform drive chip 902 is moved towards probe substrate 140 towards chip 902.The arrangement mode of probe 141, be corresponding to chip 902 signal feed-in point, feed out point (for example Luo Lu plain conductor or contact mat).Because the plane of the front end of probe 141 definition all is parallel to this default plane V, therefore along with probe substrate 140 continues near chip 902, can see through the spacing distance between probe substrate 140 and the chip 902, the front end that judges whether all probes 141 all fully the signal feed-in point of contact chip 902, feed out a little, and within the scope that the contact pressure control of probe 141 is suitable.Circuit board 130 produces test signal (or by the reception of external testing main frame), the probe 141 that sees through the activation signal load point is sent to chip 902, produce feedback signal by chip 902 again, the probe 141 that is fed out a little by activation signal is sent to circuit board 130, but judges whether normal operation of chip 902 to see through feedback signal.Chip 902 that can't normal operation will be carried out and be labeled as inefficacy, and cancel in follow-up electronic package processing procedure.The chip 902 that application the present invention detects can be the one chip 902 that has cut down from wafer, or the chip unit that still cuts as yet on wafer.Simultaneously, the arrangement of described probe 141, also corresponding a plurality of chips (with a plurality of chips of bogey carrying or all chip units on the single wafer) simultaneously to detect a plurality of chips simultaneously, promote detection rates.

Consult shown in Fig. 5 A and Fig. 5 B, be the disclosed a kind of probe card assembly 200 of second embodiment of the invention, comprise a rigid substrates 210, a circuit board 220, reach a probe substrate 240.

The disclosed probe card assembly 200 of second embodiment is roughly identical with first embodiment, and its difference is among second embodiment that a plurality of support columns 212 are the downsides that are integrally formed in rigid substrates 210, and extend rigid substrates 210.The free end 212a of support column 212 makes free end 212a be positioned at the same plane P that is provided with jointly, with linking probe substrate 220 similarly through a machining program.

Consult shown in Fig. 6 A and Fig. 6 B, be the disclosed a kind of probe supporting device 300 of third embodiment of the invention, comprise a rigid substrates 310, a circuit board 320, a plurality of support column 330 and a probe substrate 340.

In first and second embodiment, circuit board the 120, the 220th is arranged at the downside of rigid substrates 110,210, so circuit board 130,230 need possess the perforation that support column 130,212a pass.In the 3rd embodiment, circuit board 320 is the upper sides that are arranged at rigid substrates 310, and support column 330 is integrally formed or be fixed in the downside of rigid substrates 310.Therefore just not needing to be provided with perforation on the circuit board 130 passes for support column 330.

Consult shown in Fig. 7 A and Fig. 7 B, be the disclosed a kind of probe supporting device 400 of fourth embodiment of the invention, comprise a rigid substrates 410, a circuit board 420, a plurality of support column 430, reach a probe substrate 440.

Consult again shown in Fig. 7 A and Fig. 7 B, test circuit (figure do not show) is set on the circuit board 420,, produce test signal, and the feedback signal of receiving chip, for judging whether normal operation of chip to chip to be measured in order to test function to be provided.

Consult shown in Fig. 7 A and Fig. 7 B, rigid substrates 410 has a reference plane 411 and a faying face 412, and rigid substrates 410 has more a plurality of fixed orifices 413 again.Circuit board 420 is incorporated into faying face 412, and circuit board 420 has a plurality of perforation 421, is overlapped in a plurality of fixed orifices 413 of rigid substrates 410.

Consult again shown in Fig. 8 A, Fig. 8 B and Fig. 8 C, the reference plane 411 of rigid substrates 410 be on a processing plane, process form, make it constitute the supporting construction on a plane.And after rigid substrates 410 was formed probe card assembly with correlated parts, its plane 411 paralleled with default plane V.The length of each support column 430 is isometric, and each support column 430 passes the perforation 421 of the fixed orifice 413 and the circuit board 420 of rigid substrates 410, and is fixed in the fixed orifice 413, and each support column 430 is arrangement parallel to each other simultaneously.Support column 430 can be but is not limited to bolt, sees through the fixed orifice 413 that screw-in version is incorporated into rigid substrates 410.Certainly, also can use modes such as viscose glue, welding to be incorporated into the fixed orifice 413 of rigid substrates 410.Each support column 430 has a stiff end 431 and a free end 432 respectively, and wherein the external diameter of stiff end 431 is greater than the internal diameter of the fixed orifice 413 of rigid substrates 410.When each support column 430 passes the fixed orifice 413 of pairing rigid substrates 410 respectively with its free end 432, and after passing the perforation 421 of circuit board 420, the stiff end 431 of support column 430 is resisted against on the reference plane 411 of rigid substrates 410.See through support column 430 and be incorporated into rigid substrates 410, the stiff end 431 of support column 430 is to be fixed on the reference plane 411 of rigid substrates 410.Because each support column 430 is isometric and parallel to each other, the stiff end 431 of support column 430 is fixed in reference plane 411 jointly simultaneously, and therefore the free end 432 that extends towards circuit board 420 outsides also can be in the same plane, that is plane P is set.

Consult shown in Fig. 7 A and Fig. 7 B, probe substrate 440 is in order to the basis that is provided with as probe 441 again.The free end 432 of support column 430 is connected in probe substrate 440, sees through the fixed support effect of support column 430, eliminates the buckling deformation of probe substrate 440, makes probe substrate 440 in plane P being set by panelized.Provided a supporting plane S by the probe substrate 440 of panelized, use for probe 441 to be set up thereon, thus the front end of probe 441 the plane of common definition, also can be parallel to a default plane.Probe supporting device 400 more comprises a plurality of electrical connection modules 450, in order to electrically connect circuit board 420 and probe 441, makes circuit board 430 see through probe 441 and transmits test signal and receive feedback signal by probe 441.Electrical connection module 450 can be not plain conductor, general electric wire, enameled wire or the soft arranging wire of coated insulation layer, in order to transmit electric signal between probe 441 and circuit board 420.

See also shown in Fig. 9 A and Fig. 9 B, be the disclosed a kind of probe supporting device 500 of fifth embodiment of the invention, comprise a rigid substrates 510, a circuit board 520, a plurality of reference block 560, a plurality of support column 530, reach a probe substrate 540.

Consult again shown in Fig. 9 A and Fig. 9 B, and simultaneously with reference to Figure 10 A, Figure 10 B and Figure 10 C.Rigid substrates 510 has a lateral surface 511 and a faying face 512, and rigid substrates 510 has more a plurality of fixed orifices 513 corresponding to support column 530.Circuit board 520 is incorporated into the faying face 512 of rigid substrates 510, and each reference block 560 is arranged at the lateral surface 511 of rigid substrates 510.Circuit board 520 has a plurality of perforation 521, be overlapped in a plurality of fixed orifices 513 of rigid substrates 510, each reference block 560 also has perforation 561, and each reference block 560 is to be positioned over respectively on each fixed orifice 513 of rigid substrates 510, makes the perforation 561 of each reference block 560 also be overlapped in the fixed orifice 513 of rigid substrates 510.Each reference block 560 is machining programs such as grinding or cut on a processing plane, make the end face of each reference block 560 be processed to a plane, and when described reference block 560 was assembled on the rigid substrates 510, these planes were to be positioned at jointly on the reference plane R.

The length of each support column 530 is isometric, and each support column 530 passes fixed orifice 513, and the perforation 521 of circuit board 520 of perforation 561, the rigid substrates 510 of reference block 560, presents parallel to each other and arranges.Support column 530 can be but is not limited to bolt, sees through screw-in version and is fixed in rigid substrates 510.Certainly, support column 530 does not limit with screw-in version and is incorporated into rigid substrates 510, also can use modes such as viscose glue, welding to be incorporated into rigid substrates 510.Each support column 530 has a stiff end 531 and a free end 532 respectively, and wherein the external diameter of stiff end 531 is greater than footpath within the perforation 561 of reference block 560.When each support column 530 passes the perforation 561 of pairing reference block 560, the fixed orifice 513 of rigid substrates 510 with its free end 532 respectively, and after passing the perforation 561 of circuit board 520, the stiff end 531 of support column 530 can stay on the end face of each reference block 560, that is is positioned at jointly on the reference plane R.See through support column 530 and be incorporated into rigid substrates 510, and the stiff end 531 of support column 530 is to be fixed on each reference block 560 defined reference plane R.Because each support column 530 is isometric and parallel to each other, the stiff end 531 of support column 530 is fixed in reference plane R jointly simultaneously, and therefore the free end 532 that extends towards circuit board 520 outsides also can be in the same plane, that is plane P is set.Probe supporting device 500 more comprises a plurality of fixed caps 570, be arranged at the end face of reference block 560, the part that exposes in order to clinching fixed support post 530, that is each fixed cap 570 is stiff ends 531 that each support column 530 is fixed in clinching respectively, do not caused support column 530 with respect to rigid substrates 510 displacements by the external force collision to guarantee stiff end 531.

Consult shown in Fig. 9 A and Fig. 9 B, the bottom surface of probe substrate 540 is provided with a plurality of probes 541 again, and the end face of probe substrate 540 is provided with a plurality of conjunctions 542.When each support column 530 is a double-screw bolt, its outside has the joint portion 533 that screw thread constitutes near the part of free end 532, each conjunction 542 can be the cylinder that the top possesses screw, use for the free end 532 of support column 530 and lock in each screw, be fixed in conjunction 542 with free end 532, and be connected in probe substrate 540 support column 530.Because the free end 532 of support column 530 is to be positioned at plane P is set, see through the fixed support effect of support column 530, eliminate the buckling deformation of probe substrate 540, make the plane of the common definition of preceding institute of probe 541, be parallel to one and preset plane V.

In other words, the 4th and the 5th embodiment provides a kind of probe supporting device, has comprised rigidity bearing part, support column and probe substrate.The rigidity bearing part can be any kenel, in order to support structure power to be provided.The rigidity bearing part provides a reference plane, uses the end (stiff end) for support column to be fixed thereon, and simultaneously support column is isometric and stretches out parallel to each other, so the other end of support column (free end) can be positioned at one and is provided with on the plane.Be positioned at conplane free end, provide fixed support power to probe substrate after being connected in probe substrate, and eliminate the buckling deformation of probe substrate.Eliminated after the buckling deformation, probe substrate can be by panelized.Provided a smooth supporting plane by the probe substrate of panelized to probe, the defined plane parallel of front end that makes probe is in a default plane.

See also shown in Figure 11 A and Figure 11 B, be the disclosed a kind of probe supporting device 600 of sixth embodiment of the invention, comprise a rigid substrates 610, a circuit board 620, a plurality of first support member 631, a plurality of second support member 632, a probe substrate 640, reach a fixed frame 650.

See also shown in Figure 11 A and Figure 11 B, rigid substrates 610 has a lateral surface 611 and a faying face 612, and rigid substrates 610 has more a plurality of first combined holes 613 corresponding to first support member 631.Circuit board 620 is incorporated into the faying face 612 of rigid substrates 610.Circuit board 620 has a plurality of perforation 621, is overlapped in a plurality of first combined holes 613 of rigid substrates 610.

Consult shown in Figure 11 C, the length of each first support member 631 is isometric, and its etc. front end be to be polished into a plane.The length of each second support member 632 also is isometric, and the front end of its grade also is polished into a plane.First support member 631 and second support member 632 are respectively bolt, be can be incorporated into simultaneously one possess internal thread in conjunction with in the sleeve 660, and the front end of first support member 631 and second support member 632 is to be locked by two ends in conjunction with sleeve 660, and fit mutually with the plane, make first support member 631 and second support member 632 in conjunction with forming a support column 630.

Consult shown in Figure 11 B and Figure 11 D, fixed frame 650 comprises disposal area 651 and a plurality of second combined hole 652 of a hollow, the bottom surface of probe substrate 640 is provided with a plurality of probes 641, fixed frame 650 is the edges that are fixed in probe substrate 640 end faces, both are combined as a whole to make fixed frame 650 and probe substrate 640, make second combined hole 652 of fixed frame 650 be overlapped in the perforation 621 of circuit board 620 again.Second support member 632 is to be incorporated in the combined hole 652 of fixed frame 650, sees through fixed frame 650 and is incorporated into probe substrate 640, and extend the end face of probe substrate 640; And in conjunction with after, all end faces of support member 632 form a plane, parallel with the top surface plane of probe substrate 640.In conjunction with the end face of sleeve 660 by fixed frame 650 and probe substrate 640, be placed in the front end of second support member 632 with the screw thread coupling, the front end of second support member 632 is incorporated in conjunction with in the sleeve 660.

Consult again shown in Figure 11 E, fixed frame 650 is in order to as an integrated structure, with so that second support member 632 is connected in probe substrate 640, therefore the kenel of fixed frame does not limit single and around the annular component at probe substrate 640 edges, also can be the combination of a plurality of individual members, be arranged at each edge that is incorporated into probe substrate 640 respectively.Also can not use fixed frame 650, and on probe substrate 640, directly offer combined hole, so that second support member 632 directly is incorporated into probe substrate 640.

Consult shown in Figure 11 A and Figure 11 F, first support member 631 is to be incorporated into rigid substrates 610, and towards the extension of the bottom surface of rigid substrates 610, and the perforation 621 of passing circuit board 620, and pass an intermediate wood 670, this intermediate wood 670 is to be arranged between probe substrate 640 and the circuit board 620, and its major function is as the electric connection between probe substrate 640 and the circuit board 620, and is identical with electrical connection module 150 functions of first embodiment.Then, the front end of first support member 631 is criticized to join with screw thread and is incorporated in conjunction with in the sleeve 660, and fits in the plane of second support member, 632 front ends with the plane that is positioned at front end.So that first support member 631, second support member 632 see through and be combined into a support column 630 in conjunction with sleeve 660, and the length of each support column 630 is isometric.First support member 631 is incorporated into the mode of rigid substrates 610, can be screw togather, mode such as welding or close-fitting.In present embodiment, be to utilize a fixed cap 680 to be fixed in the end face of rigid substrates 610, and cover first combined hole 613, live the head end of first support member 631 with compacting, and the head end of first support member 631 is fixed in the lateral surface of rigid substrates 610.And the lateral surface 611 of rigid substrates 610, in advance prior to machining programs such as grinding or cut on the processing plane, make lateral surface 611 form a reference plane R, so that an end of support column 630, that is the head end of first support member 631 is positioned at reference plane R jointly.

Consult shown in Figure 11 A, because support column 630 is isometric, and an end of support column 630 is to be fixed in reference plane R, so the other end of support column 630, that is the head end of second support member 632 is to be positioned at one plane P is set again.Because the head end of second support member 632 is positions plane P is set, see through the fixed support effect of second support member 632, eliminate the buckling deformation of probe substrate 640, make probe substrate 610 keep panelized, probe 640 is the probe substrates 610 that are set at by panelized, make the plane of the front end formation of probe 641, be parallel to a default plane V.

See also shown in Figure 12 A and Figure 12 B, be the disclosed a kind of probe supporting device 700 of seventh embodiment of the invention, comprise a rigid substrates 710, a circuit board 720, a plurality of support column 730, reach a probe substrate 740, reach a fixed frame 750.

See also shown in Figure 12 A and Figure 12 B, rigid substrates 710 has a lateral surface 711 and a faying face 712, and rigid substrates 710 has more a plurality of combined holes 713 corresponding to support column 730.Circuit board 720 is incorporated into the faying face 712 of rigid substrates 710.Circuit board 720 has a plurality of perforation 721, is overlapped in a plurality of combined holes 713 of rigid substrates 710.

Consult shown in Figure 12 B and Figure 12 C, fixed frame 750 comprises the disposal area 751 of a hollow, the bottom surface of probe substrate 740 is provided with a plurality of probes 741, and fixed frame 750 is the edges that are fixed in probe substrate 740 end faces, and both are combined as a whole to make fixed frame 750 and probe substrate 740.The end face of fixed frame 750 is provided with in conjunction with sleeve 760, is to be fixed in the edge of the end face of fixed frame 750 with sealed, welding or other fixed form in conjunction with sleeve 760.With the present embodiment is example, base portion in conjunction with sleeve 760 forms flange 761, use screw terminal compacting for a plurality of screws 762, and also form to organize screws 752 on the fixed frame 750 more, correspond respectively to each in conjunction with sleeve 760, each group screw 752 is respectively around its pairing edge in conjunction with sleeve 760, after described screw 762 is locked on corresponding screw 752, screw terminal just can be suppressed flange 761, and secure bond sleeve 760 is in fixed frame 750.In addition, the length of each support column 730 is isometric, and its etc. front end be to be polished into a plane.The front end of support column 730 be can screw thread coupling and being incorporated in the fixed muffle 760, and the front end of support column 730 is connected in fixed frame 750, thus linking probe substrate 740 indirectly.Fixed frame 750 is in order to as an integrated structure, with so that support column 730 is connected in probe substrate 740 indirectly.The kenel of fixed frame 750 does not limit single and around the annular component at probe substrate 740 edges, can be the combination of a plurality of individual members yet, is arranged at each edge that is incorporated into probe substrate 740 respectively.

Consult Figure 12 A, Figure 12 D, reach shown in Figure 12 E, support column 730 is to be incorporated into rigid substrates 710, and extends towards the bottom surface of rigid substrates 710, and the perforation 721 of passing circuit board 720.Support column 730 more passes an intermediate wood 770, this intermediate wood 770 is to be arranged between probe substrate 740 and the circuit board 720, its major function is as the electric connection between probe substrate 740 and the circuit board 720, and is identical with electrical connection module 150 functions of first embodiment.Then, the front end of support column 730 is incorporated in conjunction with in the sleeve 760, and with the end face of the plane applying fixed frame 750 that is positioned at front end.Support column 730 is incorporated into the combination of rigid substrates 710, can be screw togather, mode such as welding or close-fitting.In present embodiment, be to utilize a fixed cap 780 to be fixed in the end face of rigid substrates 710, and cover combined hole 713, live the head end of support column 730 with compacting, and the head end of support column 730 is fixed in the lateral surface of rigid substrates 710.And the lateral surface 711 of rigid substrates 710 in advance prior to machining programs such as grinding or cut on the processing plane, makes lateral surface 711 form a reference plane R, makes the head end of support column 730 be positioned at reference plane R jointly.

Consult shown in Figure 12 A, because support column 730 is isometric, and an end of support column 730 is to be fixed in reference plane R, so the other end of support column 730, is to be positioned at one plane P is set again.See through the fixed support effect of support column 730 and fixed frame 750, be fixed in the buckling deformation of the probe substrate 740 in the fixed frame 750, can eliminate by supported post 730, make probe substrate 710 keep panelized, probe 740 is the probe substrates 710 that are set at by panelized, make the plane of the front end formation of probe 741, be parallel to a default plane V.

That is major technology means of the present invention are to make the support column that extends the rigidity bearing part, have to be positioned at conplane end (free end).Described end (free end) is connected in probe substrate, so that probe substrate is by panelized, and then makes the defined plane parallel of the probe front that is positioned on the probe substrate in a default plane.

Claims

1. a probe supporting device is used for a plurality of probes to be set up thereon, it is characterized in that comprising:

One rigidity bearing part has a plurality of support columns, and the end of described support column is to be positioned at the same plane that is provided with; And

One probe substrate, the end of described support column is to be connected in this probe substrate, to eliminate the buckling deformation of this probe substrate, and make this probe substrate keep panelized, and described probe is set at this by the probe substrate of panelized, and the common plane parallel that constitutes of front end that makes described probe is in a default plane.

2. probe supporting device as claimed in claim 1 is characterized in that, described support column extends this rigidity bearing part.

3. probe supporting device as claimed in claim 1 is characterized in that, this rigidity bearing part has a reference plane, and described support column is isometric and extends this reference plane parallel to each other.

4. a probe card assembly feeds out a little in order at least one signal feed-in point and at least one signal that is electrically connected a chip, it is characterized in that comprising:

One rigid substrates;

A plurality of support columns have a stiff end and a free end respectively, and wherein the stiff end of this support column is fixed in this rigid substrates, and the free end of described support column is to be positioned at the same plane that is provided with;

One probe substrate is positioned at this and is provided with on the plane, and the free end of described support column is to be connected in this probe substrate, eliminates the buckling deformation of this probe substrate and makes this probe substrate by panelized; And

A plurality of probes are arranged at this by the probe substrate of panelized, and the plane that makes the common definition of front end of described probe is to be parallel to a default plane, in order to contact this signal feed-in point and this signal feeds out a little.

5. adapter assembly as claimed in claim 1 is characterized in that, comprises a circuit board, is electrically connected at described probe, passes through this signal feed-in point to this chip in order to produce test signal, and feeds out a feedback signal that receives this chip generation by this signal.

6. probe card assembly as claimed in claim 5 is characterized in that, this circuit board and described support column are sides of being fixed in this rigid substrates, and described support column passes this circuit board.

7. probe card assembly as claimed in claim 6 is characterized in that this circuit board has a plurality of perforation, uses for this support column respectively and passes.

8. probe card assembly as claimed in claim 5 is characterized in that, this circuit board and described support column are individually fixed in the two side faces of this rigid substrates.

9. probe card assembly as claimed in claim 5 is characterized in that, comprises a plurality of electrical connection modules, electrically connects this circuit board and described probe.

10. probe card assembly as claimed in claim 5 is characterized in that, comprises an intermediate wood, electrically connects this circuit board and described probe.

11. probe card assembly as claimed in claim 4 is characterized in that, respectively this support column extends this rigid substrates parallel to each other.

12. probe card assembly as claimed in claim 4 is characterized in that, respectively the free end of this support column is to carry out a machining program jointly on same processing plane, makes to be positioned at this through the described free end after this machining program the plane is set.

13. probe card assembly as claimed in claim 4 is characterized in that, described support column is to be integrally formed in this rigid substrates.

14. a probe supporting device is used for a plurality of probes to be set up thereon, it is characterized in that comprising:

One rigid substrates has a reference plane;

A plurality of support columns isometric and parallel to each other have a stiff end and a free end respectively, and wherein the stiff end of this support column is the reference plane that is fixed in this rigid substrates, and the free end that makes described support column is to be positioned at one jointly the plane is set; And

One probe substrate, the free end of described support column is to be connected in this probe substrate, to eliminate the buckling deformation of this probe substrate, and make this probe substrate by panelized, described probe is set at this by the probe substrate of panelized, makes a plane parallel of the common definition of front end of described probe preset the plane in one.

15. probe supporting device as claimed in claim 14 is characterized in that, comprises a circuit board, is electrically connected at described probe, in order to transmit and received signal by described probe.

16. probe supporting device as claimed in claim 14 is characterized in that, this rigid substrates has a plurality of fixed orifices, and described support column is to pass this fixed orifice, and making respectively, this stiff end is arranged at this reference plane.

17. probe supporting device as claimed in claim 16 is characterized in that, respectively the external diameter of this stiff end is greater than the internal diameter of this fixed orifice respectively.

18. probe supporting device as claimed in claim 16 is characterized in that, comprises a circuit board, is incorporated into this faying face, and is electrically connected at described probe, in order to transmit and received signal by described probe.

19. probe supporting device as claimed in claim 18 is characterized in that, this circuit board has a plurality of perforation, uses for described support column and passes.

20. probe supporting device as claimed in claim 15 is characterized in that, comprises a plurality of electrical connection modules, in order to electrically connect circuit board and described probe.

21. probe card assembly as claimed in claim 15 is characterized in that, comprises an intermediate wood, electrically connects this circuit board and described probe.

22. probe supporting device as claimed in claim 14 is characterized in that, the reference plane of this rigid substrates is to grind on a processing plane and form, and makes it constitute the supporting construction on a plane.

23. a probe supporting device is used for a plurality of probes to be set up thereon, it is characterized in that comprising:

One rigid substrates has a lateral surface and a faying face;

A plurality of reference blocks are arranged at the faying face of this rigid substrates, and the end face of described reference block is to be positioned at a reference plane jointly after being provided with;

A plurality of support columns isometric and parallel to each other, pass described reference block one and this rigid substrates wherein respectively, and each support column has a stiff end and a free end respectively, wherein the stiff end of this support column is to fix this reference plane, and the free end that makes described support column is to be positioned at one jointly the plane is set; An and probe substrate, the free end of described support column is to be connected in this probe substrate, eliminating the buckling deformation of this probe substrate, and makes this probe substrate by panelized, described probe is set at this probe substrate, makes the plane parallel of the common definition of front end of described probe preset the plane in one.

24. probe supporting device as claimed in claim 23 is characterized in that, comprises a circuit board, is electrically connected at described probe, in order to transmit and received signal by described probe.

25. probe supporting device as claimed in claim 24 is characterized in that, this circuit board is incorporated into this faying face, and described support column is to pass this circuit board.

26. probe supporting device as claimed in claim 23 is characterized in that, this rigid substrates has a plurality of fixed orifices corresponding to support column, and this each reference block bores a hole respectively, is overlapped in the fixed orifice of this rigid substrates.

27. probe supporting device as claimed in claim 26 is characterized in that, respectively the external diameter of the stiff end of this support column is greater than footpath within the perforation of corresponding reference block.

28. probe supporting device as claimed in claim 24 is characterized in that, comprises a plurality of fixed caps, in order to the fixing respectively stiff end of this support column of clinching.