CN106338621A - PCB thin board vertical flying probe test bracing frame - Google Patents
PCB thin board vertical flying probe test bracing frame Download PDFInfo
- Publication number
- CN106338621A CN106338621A CN201610790360.5A CN201610790360A CN106338621A CN 106338621 A CN106338621 A CN 106338621A CN 201610790360 A CN201610790360 A CN 201610790360A CN 106338621 A CN106338621 A CN 106338621A
- Authority
- CN
- China
- Prior art keywords
- pcb
- bracing frame
- hole
- flying probe
- flying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Abstract
The invention relates to a PCB thin board vertical flying probe test bracing frame. The PCB thin board vertical flying probe test bracing frame comprises a bracing frame body, wherein the bracing frame body is arranged on a PCB surface, and the bracing frame is provided with through holes enabling probes penetrating through the bracing frame body to contact with a welding pad on a PCB or passage openings. Through the additionally-equipped PCB thin board vertical flying probe test bracing frame, the thin board is supported and is prevented from shaking, test points at a back surface can be further exposed, dual-surface simultaneous detection is realized, test accuracy is improved, a test yield is improved, and an electric measurement operation board loss rate can be reduced; the bracing effect of the bracing frame is excellent, dual-surface measurement and full-measurement-point measurement of 0.05-0.10mm thin boards are realized, measurement reliability is improved, and PCB flying probe test efficiency is greatly improved.
Description
Technical field
The present invention relates to industrial automation, the vertical flying probe bracing frame of especially a kind of pcb thin plate.
Background technology
Existing vertical flying probe tester can only test the pcb plate with certain thickness and rigidity it is impossible to accurate test and comparison
, apart from the nearer pcb plate of edges of boards, direct measurement is rocked because pcb plate produces or fixture folder for thin and flexible, thin and easy to break or measuring point
Plate is bad to lead to test leakage to produce the false point of test, be only capable of using one side measurement can make layer hole wall between conduction cannot measure
And inefficiency, accurate judgement cannot be made to the quality of product.
Content of the invention
Present invention mainly solves technical problem be to provide a kind of pcb thin plate vertical flying probe bracing frame.
The present invention is that the technical scheme solving above-mentioned technical problem employing is:
A kind of vertical flying probe bracing frame of pcb thin plate, includes bracing frame body, support frame as described above body is located at pcb
In plate face, support frame as described above is provided with the through hole contacting with the pad on pcb or via hole for probe through bracing frame body.
Further, the quantity of described through hole is identical with the total quantity of the pad on pcb and path.
Further, the length of described through hole is more than the length of through hole, and the width of described through hole is more than the width of through hole.
Further, the material of support frame as described above body is fr-4 insulant.
Further, the manufacture method of support frame as described above body is:
A. measure pcb size, obtain the length and width data of pcb；Then take fr-4 insulation tabula rasa imposite, according to obtaining pcb length
Wide Data subset adapts to the fr-4 insulation tabula rasa substrate of specification, and the length of described fr-4 insulation tabula rasa substrate is more than or equal to pcb
Length, the insulate width of tabula rasa substrate of described fr-4 is more than or equal to the width of pcb；
B. the position of the pad according to pcb or via hole determines the flying needle shift position of flying probe tester and enters data into
The control module of flying probe tester, obtain flying needle with pcb contact position；
C. the flying needle mobile location information of the flying probe tester by obtaining in step b, the control module of input cnc, control
Molding block controls cnc that fr-4 insulation tabula rasa substrate is holed and fenestration procedure, and it is some fixed that fr-4 insulation tabula rasa opens up
Position hole and with pcb on pad and path total quantity identical through hole, each pad on the position of each through hole and pcb
Or path hole site corresponds to, obtain final product bracing frame body；Described location hole is used for installing pin on bracing frame body for the fixing pcb
Nail.
Further, pcb plate is fixed by a pin on bracing frame, by the fixture fixing support rack of flying probe tester
Start to carry out flying probe to pcb.
The invention has the benefit that
1. after installing bracing frame additional, thin plate is supported the present invention in itself, and situation of rocking eliminates, and can expose anti-
Face measuring point, realizes the two-sided increase accurate testing degree raising test yield of detection simultaneously and can reduce electrical measurement operation plate loss rate simultaneously.
2. the supporting role of bracing frame is good, realizes the two-sided measurement of 0.05～0.10mm thin plate and the measurement lifting of full measuring point is surveyed
Amount reliability greatly improves the flying probe efficiency of pcb simultaneously.
3. the bracing frame being made by method of the present invention step, it is possible to achieve on bracing frame, each through hole is right with pcb
Answer the pad of position or the position consistency of via hole, that is, realize on each through hole and pcb on bracing frame the pad of correspondence position or
The accurate correspondence of via hole.
Brief description
Fig. 1 is a kind of structural representation of specific embodiment of the present invention.
In figure: 1 is bracing frame body, 2 is through hole, and 3 is location hole.
Specific embodiment
The present invention is further elaborated below in conjunction with the accompanying drawings, refers to Fig. 1.
A kind of vertical flying probe bracing frame of pcb thin plate it is characterised in that: include bracing frame body 1, support frame as described above
In pcb plate face, support frame as described above is provided with pad or the via hole passing through on bracing frame body and pcb for probe to body
The through hole 2 of contact；The quantity of described through hole is identical with the total quantity of the pad on pcb and path；The length of described through hole is big
In the length of through hole, the width of described through hole is more than the width of through hole；The material of support frame as described above body is fr-4 insulant.
The manufacture method of the bracing frame body of the present invention is:
A. measure pcb size, obtain the length and width data of pcb；Then take fr-4 insulation tabula rasa imposite, according to obtaining pcb length
Wide Data subset adapts to the fr-4 insulation tabula rasa substrate of specification, and the length of described fr-4 insulation tabula rasa substrate is more than or equal to pcb
Length, the insulate width of tabula rasa substrate of described fr-4 is more than or equal to the width of pcb；
B. the position of the pad according to pcb or via hole determines the flying needle shift position of flying probe tester and enters data into
The control module of flying probe tester, obtain flying needle with pcb contact position；
C. the flying needle mobile location information of the flying probe tester by obtaining in step b, the control module of input cnc, control
Molding block controls cnc that fr-4 insulation tabula rasa substrate is holed and fenestration procedure, and it is some fixed that fr-4 insulation tabula rasa opens up
Position hole 3 and with pcb on pad and path total quantity identical through hole, upper each of the position of each through hole and pcb weld
Disk or path hole site correspond to, and obtain final product bracing frame body；Described location hole is used for installing pin on bracing frame body for the fixing pcb
Nail.
Pcb plate is fixed by a pin on bracing frame, is started to pcb by the fixture fixing support rack of flying probe tester
Carry out flying probe.
After installing bracing frame additional, thin plate is supported the present invention in itself, and situation of rocking eliminates, and can expose reverse side
Measuring point, realizes the two-sided increase accurate testing degree raising test yield of detection simultaneously and can reduce electrical measurement operation plate loss rate simultaneously.
The supporting role of bracing frame is good, realizes the two-sided measurement of 0.05～0.10mm thin plate and the measurement lifting measurement of full measuring point
Reliability greatly improves the flying probe efficiency of pcb simultaneously.
The bracing frame being made by method of the present invention step, it is possible to achieve on bracing frame, each through hole is corresponding with pcb
The pad of position or the position consistency of via hole, that is, realize the pad of the upper correspondence position of each through hole and pcb on bracing frame or lead to
The accurate correspondence in road hole.
Claims (6)
1. a kind of vertical flying probe bracing frame of pcb thin plate it is characterised in that: include bracing frame body, support frame as described above this
In pcb plate face, support frame as described above is provided with and passes through pad on bracing frame body and pcb or via hole to connect for probe body
Tactile through hole.
2. the vertical flying probe bracing frame of pcb thin plate according to claim 1 it is characterised in that: the quantity of described through hole
Identical with the total quantity of the pad on pcb and path.
3. the vertical flying probe bracing frame of pcb thin plate according to claim 1 it is characterised in that: the length of described through hole
More than the length of through hole, the width of described through hole is more than the width of through hole.
4. the vertical flying probe bracing frame of pcb thin plate according to claim 1 it is characterised in that: support frame as described above body
Material be fr-4 insulant.
5. the vertical flying probe bracing frame of pcb thin plate according to claim 1 it is characterised in that: support frame as described above body
Manufacture method be:
A. measure pcb size, obtain the length and width data of pcb；Then take fr-4 insulation tabula rasa imposite, according to obtaining pcb length and width number
According to cutting the fr-4 insulation tabula rasa substrate adapting to specification, the length of described fr-4 insulation tabula rasa substrate is more than or equal to the length of pcb
Degree, the width of described fr-4 insulation tabula rasa substrate is more than or equal to the width of pcb；
B. the position of the pad according to pcb or via hole determines the flying needle shift position of flying probe tester and enters data into flying needle
The control module of tester, obtain flying needle with pcb contact position；
C. the flying needle mobile location information of the flying probe tester by obtaining in step b, the control module of input cnc, control mould
Block controls cnc that fr-4 insulation tabula rasa substrate is holed and fenestration procedure, and fr-4 insulation tabula rasa opens up some location holes
And with pcb on pad and path total quantity identical through hole, the position of each through hole and pcb each pad upper or lead to
Road hole site corresponds to, and obtains final product bracing frame body；Described location hole is used for installing pin on bracing frame body for the fixing pcb.
6. the vertical flying probe bracing frame of pcb thin plate according to claim 4 it is characterised in that: pcb plate is passed through pin
It is fixed on bracing frame, start to carry out flying probe to pcb by the fixture fixing support rack of flying probe tester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790360.5A CN106338621A (en) | 2016-08-30 | 2016-08-30 | PCB thin board vertical flying probe test bracing frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790360.5A CN106338621A (en) | 2016-08-30 | 2016-08-30 | PCB thin board vertical flying probe test bracing frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106338621A true CN106338621A (en) | 2017-01-18 |
Family
ID=57823590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610790360.5A Pending CN106338621A (en) | 2016-08-30 | 2016-08-30 | PCB thin board vertical flying probe test bracing frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106338621A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107356857A (en) * | 2017-05-23 | 2017-11-17 | 惠州市金百泽电路科技有限公司 | Minimum widith is the quick determination method of 1mil PCB mini-pads functional defects |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003069356A1 (en) * | 2002-02-11 | 2003-08-21 | Intel Corporation | Method and apparatus for testing electronic devices |
| CN201130233Y (en) * | 2007-12-20 | 2008-10-08 | 株洲南车时代电气股份有限公司 | Improved all-purpose test mold for printed circuit board |
| US20090072849A1 (en) * | 2007-09-13 | 2009-03-19 | Jabil Circuit, Inc. | Flexible Test Fixture |
| WO2009104589A1 (en) * | 2008-02-21 | 2009-08-27 | 東京エレクトロン株式会社 | Method for manufacturing probe supporting plate, computer storage medium and probe supporting plate |
| CN101533036A (en) * | 2008-03-12 | 2009-09-16 | 旺矽科技股份有限公司 | Probe supporting device |
| CN203148975U (en) * | 2013-03-15 | 2013-08-21 | 润峰电力有限公司 | Test probe support frame |
| CN104582289A (en) * | 2015-01-15 | 2015-04-29 | 泰州市博泰电子有限公司 | Production method for small circuit board SMT carrier device |
-
2016
- 2016-08-30 CN CN201610790360.5A patent/CN106338621A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003069356A1 (en) * | 2002-02-11 | 2003-08-21 | Intel Corporation | Method and apparatus for testing electronic devices |
| US20090072849A1 (en) * | 2007-09-13 | 2009-03-19 | Jabil Circuit, Inc. | Flexible Test Fixture |
| CN201130233Y (en) * | 2007-12-20 | 2008-10-08 | 株洲南车时代电气股份有限公司 | Improved all-purpose test mold for printed circuit board |
| WO2009104589A1 (en) * | 2008-02-21 | 2009-08-27 | 東京エレクトロン株式会社 | Method for manufacturing probe supporting plate, computer storage medium and probe supporting plate |
| CN101533036A (en) * | 2008-03-12 | 2009-09-16 | 旺矽科技股份有限公司 | Probe supporting device |
| CN203148975U (en) * | 2013-03-15 | 2013-08-21 | 润峰电力有限公司 | Test probe support frame |
| CN104582289A (en) * | 2015-01-15 | 2015-04-29 | 泰州市博泰电子有限公司 | Production method for small circuit board SMT carrier device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107356857A (en) * | 2017-05-23 | 2017-11-17 | 惠州市金百泽电路科技有限公司 | Minimum widith is the quick determination method of 1mil PCB mini-pads functional defects |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170118 |
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| RJ01 | Rejection of invention patent application after publication |