JP2013015169A - Valve, heat pump and information processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a simple valve with high reliability, a heat pump using the valve, and an information processing system using the heat pump.SOLUTION: The valve includes a sheet-like valve body 14 which opens and closes ventilation holes 12 formed on a partition wall 10 and the valve body 14 has projections 22 abutting on edges 20 of the ventilation holes 12. The shape of the projections 22 is a hemispherical shell shape (hemispherical shape), the valve body 14 is expansible and both ends of the valve body 14 are fixed to the partition wall 10 through a base 16.

Description

  The present invention relates to a valve, a heat pump, and an information processing system.

  Recently, attention has been focused on the effective use of waste heat from the viewpoint of global warming prevention and energy saving.

  One technique for effectively utilizing waste heat is an adsorption heat pump.

  The adsorption heat pump uses the movement of latent heat generated when the adsorbate adsorbs and desorbs to and from the adsorbent, so that the heat (waste heat) at a relatively low temperature of 100 ° C. or less can be effectively used. To convert. Depending on the type of adsorbent used, the temperature of the waste heat may be a relatively low temperature of about 60 ° C., so there is a possibility that energy can be effectively used using various waste heat.

  The adsorption heat pump includes an adsorber, a condenser, and an evaporator, and a partition (valve valve) that opens and closes by a differential pressure is provided between the adsorber, the condenser, and the evaporator.

Japanese Patent No. 4411792 Japanese Patent No. 3831959 Japanese Patent Laid-Open No. 9-152221 JP 11-344138 A

  However, conventional valves may not always have sufficient reliability.

  An object of the present invention is to provide a highly reliable valve with a simple structure, a heat pump using the valve, and an information processing system using the heat pump.

  According to one aspect of the embodiment, the valve body includes a sheet-like valve body that opens and closes a vent hole formed in the partition wall, and the valve body includes a convex portion that contacts an edge of the vent hole. A characteristic valve is provided.

  According to another aspect of the embodiment, an adsorber in which an adsorption process and a desorption process are alternately switched, and a condenser that receives the supply of the refrigerant desorbed from the adsorber in the desorption process and condenses the refrigerant. An evaporator for receiving the supply of the refrigerant condensed by the condenser, evaporating the refrigerant, and supplying the refrigerant to the adsorber in the adsorption process, and the adsorber and the condenser Or a sheet-like valve body that opens and closes a vent hole formed in a partition wall between the adsorber and the evaporator, and the valve body has a convex portion that contacts the edge of the vent hole. There is provided a heat pump characterized by having a valve.

  According to still another aspect of the embodiment, an information device, an adsorber in which an adsorption process and a desorption process are alternately switched by heating using heat generated from the information apparatus, and the adsorber in the desorption process Receiving the supply of the refrigerant desorbed from the condenser, condensing the refrigerant, receiving the supply of the refrigerant condensed by the condenser, evaporating the refrigerant, and supplying the adsorber in the adsorption process to the adsorber An evaporator for supplying a refrigerant, and a sheet-like valve body that opens and closes a vent hole formed in a partition wall between the adsorber and the condenser or between the adsorber and the evaporator The valve body includes a heat pump having a valve having a convex portion that comes into contact with an edge of the vent hole, and an air conditioner that performs air conditioning using a heat transfer fluid cooled by the heat pump. Characteristic information processing system There is provided.

  According to the disclosed valve, the valve body that opens and closes the vent hole formed in the partition wall is formed with a convex portion that can contact the edge of the vent hole. For this reason, a valve can be made into the closed state, without making the part except a convex part of a valve body contact a partition. For this reason, it can prevent that a valve body sticks to a partition, and can provide the valve of a simple structure with high reliability by extension.

FIG. 1 is a sectional view and a plan view showing a valve according to the first embodiment. FIG. 2 is a cross-sectional view showing the operation of the valve according to the first embodiment. FIG. 3 is a cross-sectional view and a plan view showing a valve according to the second embodiment. FIG. 4 is a cross-sectional view showing the operation of the valve according to the second embodiment. FIG. 5 is a schematic diagram showing a heat pump and an information processing system according to the third embodiment. FIG. 6 is a schematic diagram (part 1) illustrating operations of the heat pump and the information processing system according to the third embodiment. FIG. 7 is a schematic diagram (part 2) illustrating the operation of the heat pump and the information processing system according to the third embodiment. FIG. 8 is a schematic diagram illustrating a heat pump and an information processing system according to the fourth embodiment. FIG. 9 is a schematic diagram (part 1) illustrating operations of the heat pump and the information processing system according to the fourth embodiment. FIG. 10 is a schematic diagram (part 2) illustrating operations of the heat pump and the information processing system according to the fourth embodiment. FIG. 11 is a schematic diagram illustrating a heat pump and an information processing system according to the fifth embodiment. FIG. 12 is a schematic diagram (part 1) illustrating operations of the heat pump and the information processing system according to the fifth embodiment. FIG. 13 is a schematic diagram (part 2) illustrating operations of the heat pump and the information processing system according to the fifth embodiment. FIG. 14 is a schematic view showing a valve according to a reference example.

  FIG. 14 is a schematic view showing a valve according to a reference example.

  As shown in FIG. 14, a plurality of vent holes 112 are formed in the partition wall 110. A sheet-like valve body 114 is attached to the partition wall 110 in which the vent holes 112 are formed. One end of the sheet-like valve body 114 is fixed to the partition wall 110.

  Thus, the valve 102 according to the reference example is formed.

  When the valve 102 is closed, the sheet-like valve body 114 and the partition wall 110 come into contact with each other. However, condensed moisture may be sandwiched between the sheet-like valve body 114 and the partition wall 110. When water is sandwiched between the sheet-like valve body 114 and the partition wall 110, the sheet-like valve body 114 and the partition wall 110 are stuck due to the surface tension of the water, and the valve 102 is difficult to open.

  Therefore, the valve 102 according to the reference example as shown in FIG. 14 may not always operate normally.

[First Embodiment]
The valve | bulb by 1st Embodiment is demonstrated using FIG.1 and FIG.2. FIG. 1 is a cross-sectional view and a plan view showing the valve according to the present embodiment. 1B is a plan view, and FIG. 1A is a cross-sectional view taken along the line AA ′ of FIG. FIG. 2 is a cross-sectional view showing the operation of the valve according to the present embodiment.

  As shown in FIG. 1, a plurality of ventilation holes 12 are formed in a partition wall (wall, wall surface, partition, partition wall) 10. As the partition wall 10, for example, the partition wall 10 between the adsorbers (adsorption chamber, desorber, desorption chamber) 24, 26 and the condenser (condensation chamber) 28 of the heat pump described later, the adsorbers 24, 26, Examples include the partition 10 between the evaporator (evaporation chamber) 30 and the like. The diameter of the vent hole 12 is, for example, about 10 mm. The number of the vent holes 12 is, for example, about 18. The thickness of the partition wall 10 is, for example, about 5 mm. As a material of the partition wall 10, for example, aluminum is used.

  A sheet-like valve element 14 for opening and closing the vent hole 12 is attached to the partition wall 10. More specifically, one end (one end) of the sheet-like valve body 14 is fixed to the partition wall 10 via a base (fixing member) 16. The pedestal 16 is fixed to the partition wall 10 with, for example, an adhesive. Screw holes are formed in the pedestal 16 and the partition wall 10, and the sheet-like valve body 14 is fixed to the partition wall 10 via the pedestal 16 by, for example, screws 18. The height of the base 16 is, for example, about 1 to 3 mm. For example, aluminum is used as the material of the base 16.

  The valve body 14 is formed with convex portions (protrusions) 22 that can come into contact with the edges (edge portions) 20 of the plurality of vent holes 12 formed in the partition wall 10. The convex portion 22 is formed to correspond to the plurality of vent holes 20. The shape of the convex portion 22 is, for example, a hemispherical shell (hemispherical). The dimension of the convex portion 22 in the direction parallel to the main surface of the valve body 14 is set larger than the diameter of the vent hole 12.

  The outer diameter of the valve body 14 is, for example, about 10 cm × 10 cm. The thickness of the valve body 14 is about 0.5 mm, for example. As a material of the valve body 14, for example, a resin or the like is used. As such a resin, for example, PET (PolyEthylene Terephthalate) is used.

  Thus, the valve (steam valve, gas valve) 2 according to the present embodiment is formed.

  Next, the operation of the valve according to the present embodiment will be described with reference to FIG.

  The pressure on the side where the valve element 14 is not arranged (the lower side in the drawing in FIG. 2A) is lower than the pressure on the side where the valve element 14 is arranged (the upper side in the drawing in FIG. 2A). If they are equal or equal, the valve 2 is closed as shown in FIG. That is, the convex portion 22 of the valve body 14 is in contact with the edge 20 of the vent hole 12, and the vent hole 12 is blocked by the convex portion 22 of the valve body 14 (closed state, closed state). As shown in FIG. 2A, the portion of the valve body 14 excluding the convex portion 22 does not contact the partition wall 10, and only a part of the convex portion 22 of the valve body 14 is the edge 20 of the vent hole 12. To touch. In the portion excluding the edge 20 of the vent hole 12, the valve body 14 and the partition wall 10 do not contact each other, and in the portion excluding the edge 20 of the vent hole 12, a gap exists between the valve body 14 and the partition wall 10. Therefore, it is possible to prevent the valve body 14 from sticking to the partition wall 10.

  The pressure on the side where the valve element 14 is arranged (the upper side in FIG. 2B) is lower than the pressure on the side where the valve element 14 is not arranged (the lower side in FIG. 2B). In this case, that is, when the pressure is negative, the state is as shown in FIG. That is, since the gas (steam) flows from the side where the valve body 14 is not disposed toward the side where the valve body 14 is disposed, the valve body 14 has one end as a fulcrum. The other end side bends to the upper side in FIG. Thereby, the convex part 22 of the valve body 14 will be in the state which is not in contact with the edge 20 of the vent hole 12, and will be in the state (open state, open state) where the valve 2 was opened.

  Thus, according to this embodiment, the convex part 22 which can contact | abut the edge 20 of the ventilation hole 12 is formed in the valve body 14 which opens and closes the ventilation hole 12 formed in the partition 10. FIG. For this reason, according to the present embodiment, the valve 2 can be in a closed state without bringing the portion of the valve body 14 excluding the convex portion 22 into contact with the partition wall 10. For this reason, according to this embodiment, it can prevent that the valve body 14 adheres to the partition 10, and can provide the valve 2 of a simple structure with high reliability by extension.

[Second Embodiment]
The valve | bulb by 2nd Embodiment is demonstrated using FIG. 3 thru | or FIG. FIG. 3 is a cross-sectional view and a plan view showing the valve according to the present embodiment. 3B is a plan view, and FIG. 3A is a cross-sectional view taken along the line AA ′ of FIG. 3B. FIG. 4 is a cross-sectional view showing the operation of the valve according to the present embodiment. The same components as those of the valve according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted or simplified.

  In the valve (steam valve, gas valve) 2a according to the present embodiment, both end portions of the valve body 14a are fixed to the partition wall 10 via the pedestal 16.

  As shown in FIG. 3, both end portions of the valve body 14 a are fixed to the partition wall 10 via the pedestal 16. For this reason, in this embodiment, the both ends of the valve body 14a are supported by the partition 10 via the base 16, respectively.

  When both ends of the valve body 14a are fixed to the partition wall 10 as in the present embodiment, the valve body 14a is preferably extendable (extendable). This is because if the valve body 14a is not extendable, the valve 2a may not be opened. Therefore, in the present embodiment, for example, an extensible resin is used as the material of the valve body 14a. Examples of the stretchable resin include silicone.

  The pressure on the side where the valve element 14 is not disposed (the lower side of the sheet in FIG. 4A) is lower than the pressure on the side where the valve element 14 is disposed (the upper side of the sheet in FIG. 4A). If they are equal or equal, the valve 2a is closed as shown in FIG. That is, the convex portion 22 of the valve body 14a comes into contact with the edge 20 of the vent hole 12, and the vent hole 12 is blocked by the convex portion 22 of the valve body 14a. As shown in FIG. 4 (a), also in the present embodiment, the portion of the valve body 14a excluding the convex portion 22 does not come into contact with the partition wall 10, and only a part of the convex portion 22 of the valve body 14a. It contacts the edge 20 of the vent hole 12. Since the valve body 14a and the partition wall 10 are not in contact with each other except the edge 20 of the vent hole 12, the valve body 14a can be prevented from sticking to the partition wall 10 in this embodiment.

  The pressure on the side where the valve element 14a is arranged (the upper side in FIG. 4B) is lower than the pressure on the side where the valve element 14a is not arranged (the lower side in FIG. 4B). In such a case, a state as shown in FIG. That is, gas (steam) flows from the side where the valve body 14a is not disposed toward the side where the valve body 14a is disposed, and the valve body 14a expands accordingly. Thereby, the convex part 22 of the valve body 14a will be in the state which is not in contact with the edge 20 of the ventilation hole 12, and will be in the state (open state, open state) of the valve 2a.

  In this way, both ends of the valve body 14a may be fixed to the partition wall 10. If both ends of the valve body 14a are fixed to the partition wall 10, even if the valve body 14a is arranged on the lower surface side of the partition wall 10, the valve body 14a will not be opened by gravity. Therefore, according to the present embodiment, the valve body 14 a can be disposed on the lower surface side of the partition wall 10.

[Third Embodiment]
A heat pump and an information processing system according to the third embodiment will be described with reference to FIGS. FIG. 5 is a schematic diagram illustrating the heat pump and the information processing system according to the present embodiment. FIG. 6 is a schematic diagram (part 1) illustrating operations of the heat pump and the information processing system according to the present embodiment. FIG. 7 is a schematic diagram (part 2) illustrating the operation of the heat pump and the information processing system according to the present embodiment. The same components as those of the valve according to the first or second embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and description thereof is omitted or simplified.

  As shown in FIG. 5, the heat pump (adsorption heat pump) 4 according to the present embodiment includes a pair of adsorbers (adsorption chamber, desorption chamber, desorption chamber) 24 and 26, a condenser (condensing chamber) 28, And an evaporator (evaporation chamber) 30. The adsorbers 24 and 26, the condenser 28, and the evaporator 30 are provided in a casing (vacuum container) 32 partitioned by a partition wall (partition wall) 10. The first adsorber 24, which is one of the pair of adsorbers 24 and 26, is provided in the left chamber of the casing 32, for example. The second adsorber 26 which is the other of the pair of adsorbers 24 and 26 is provided in the right chamber of the casing 32, for example. The condenser 28 is provided, for example, in an upper chamber among the middle chambers partitioned above and below the casing 32. The evaporator 30 is provided in the lower chamber of the middle chamber of the casing 32. The inside of the casing 32 is set to a predetermined vacuum degree as a whole. A refrigerant 34 is accommodated in the casing 32. For example, water is used as the refrigerant 34.

  An adsorbent 36 is disposed in each of the adsorbers 24 and 26. The adsorbent 36 is accommodated in a case (not shown) in which air permeability is ensured. For example, silica gel or activated carbon is used as the adsorbent 36. The adsorbers 24 and 26 are respectively provided with heat exchange channels (heat exchange pipes) 38 and 40 through which a heat transfer fluid (fluid) for cooling or heating the adsorbent 36 flows. The heat exchange flow paths 38 and 40 penetrate the outer wall of the casing 32 while maintaining the airtightness of the casing 32. For example, water is used as the heat transfer fluid that circulates in the heat exchange channels 38 and 40. When the adsorbent 36 disposed in the adsorption chambers 24 and 26 is cooled (cooled state), the adsorbent 36 adsorbs gaseous refrigerant (gas refrigerant, vapor refrigerant) (adsorption process, adsorption process). . On the other hand, when the adsorbent 36 is heated (heated state), the adsorbed refrigerant is desorbed (desorption process, desorption process) to regenerate the adsorption capacity.

  A plurality of ventilation holes 12 similar to the plurality of ventilation holes 12 described above with reference to FIG. 1 are formed in the partition wall 10 between the adsorbers 24 and 26 and the condenser 28. 5 to 7 conceptually show the vent hole 12, and the actual vent hole 12 is as shown in FIG.

  Further, a valve body 14 similar to the valve body 14 described above with reference to FIG. 1 is attached to the partition wall 10 between the adsorbers 24 and 26 and the condenser 28. 5 to 7 conceptually show the valve body 14, and the actual valve body 14 is as shown in FIG. The valve body 14 is attached to the surface on the condenser 28 side in the partition 10 between the adsorbers 24 and 26 and the condenser 28.

  The direction of the surface of the partition 10 between the adsorbers 24 and 26 and the condenser 28 is, for example, a vertical direction. In order that the valve element 14 is closed by gravity when no differential pressure is generated between the adsorbers 24 and 26 and the condenser 28, the valve element 14 is provided above the portion where the vent hole 12 is formed. Is fixed to the partition wall 10 via a pedestal 16.

  In this way, the partition 10 between the adsorbers 24 and 26 and the condenser 28 is provided with a valve 2 similar to the valve 2 described above with reference to FIG.

  The valve 2 is opened and closed by a differential pressure (pressure difference). When the pressure on the side where the valve body 14 is disposed is lower than the pressure on the side where the valve body 14 is not disposed, the valve 2 is in an open state (open state, open state). On the other hand, when the pressure on the side where the valve body 14 is disposed is higher than the pressure on the side where the valve body 14 is not disposed, the valve 2 is closed (closed state, closed state).

  The condenser 28 condenses the gas-phase refrigerant (gas refrigerant, refrigerant vapor) supplied from the adsorbers 24 and 26 in the desorption process into the condenser 28 to form a liquid-layer refrigerant (liquid refrigerant). Is. The condenser 28 is provided with a heat exchange passage (heat exchange pipe) 42 through which a heat transfer fluid (cooling fluid) for cooling the inside of the condenser 28 flows. The heat exchange flow path 42 penetrates the outer wall of the casing 32 while maintaining the airtightness of the casing 32. For example, water is used as the heat transfer fluid flowing through the heat exchange flow path 42. The refrigerant 34 condensed by the condenser 28 is stored in the condenser 28 as shown in FIG.

  The condenser 28 and the evaporator 30 are connected by a thin tube 44, for example. A part of the liquid refrigerant 34 stored in the condenser 28 is supplied to the evaporator 30 through the narrow tube 44.

  The evaporator 30 uses the heat of vaporization when the liquid refrigerant 34 evaporates to become a gas refrigerant, cools the liquid refrigerant 34 stored in the evaporator 30, and adsorbers 24 and 26 in the adsorption process. The gas refrigerant is supplied to the tank. The evaporator 30 is provided with a heat exchange channel (heat exchange pipe) 46 through which a heat transfer fluid (fluid) flows. The heat exchange channel 46 penetrates the outer wall of the casing 32 while maintaining the airtightness of the casing 32. For example, water is used as the heat transfer fluid flowing through the heat exchange channel 46. At least a part of the heat exchange flow path 46 is in contact with the liquid refrigerant 34 stored in the evaporator 30, whereby the heat transfer fluid flowing through the heat exchange flow path 46 is cooled by the liquid refrigerant 34. It is cooled by.

  A plurality of air holes 12 similar to the air holes 12 described above with reference to FIG. 1 are formed in the partition wall 10 between the adsorbers 24 and 26 and the evaporator 30. A valve body 14 similar to the valve body 14 described above with reference to FIG. 1 is attached to the partition wall 10 between the adsorbers 24 and 26 and the evaporator 30. The valve body 14 is attached to the surface on the side of the adsorbers 24 and 26 in the partition wall 10 between the adsorbers 24 and 26 and the evaporator 30.

  The direction of the surface of the partition 10 between the adsorbers 24 and 26 and the evaporator 30 is, for example, a vertical direction. In order that the valve element 14 is closed by gravity when no differential pressure is generated between the adsorbers 24 and 26 and the evaporator 30, the valve element 14 is provided above the portion where the vent hole 12 is formed. Is fixed to the partition wall 10 via a pedestal 16.

  Thus, the partition 10 between the adsorbers 24 and 26 and the evaporator 30 is provided with a valve 2 similar to the valve 2 described above with reference to FIG.

  The flow path of the heat transfer fluid for heating or cooling the inside of the adsorbers 24 and 26 can be switched by the four-way valves 48 and 50.

  A pipe 54 for sending the heat transfer fluid heated by the heating element (heat source) 78 is connected to the first inlet port IP 1 of the first four-way valve 48. The pipe 54 is provided with a pump 56 for sending the heat transfer fluid. The heating element 78 is a CPU (Central Processing Unit) disposed in the information device 52 used in the information processing system according to the present embodiment. Examples of the information device 52 include a server device. For example, a cold plate (heat exchanger) 80 is attached to the heating element 78 mounted on the substrate 77, and the heat transfer fluid flows through the flow path in the cold plate 80.

  The temperature of the heat transfer fluid before being heated by the heating element 78 is, for example, about 45 to 55 ° C., and the temperature of the heat transfer fluid after being heated by the heating element 78 is, for example, about 50 to 60 ° C. is there.

  A pipe 60 for sending the heat transfer fluid cooled by the cooling unit (heat radiator, radiator) 58 is connected to the second inlet port IP2 of the first four-way valve 48. The cooling unit 58 is, for example, a cooling tower (cooling tower). The pipe 60 is provided with a pump 62 for sending the heat transfer fluid.

  The temperature of the heat transfer fluid before being cooled by the cooling tower 58 is, for example, about 25 to 35 ° C., and the temperature of the heat transfer fluid after being cooled by the cooling tower 58 is, for example, about 20 to 30 ° C. is there.

  The second outlet port OP <b> 2 of the first four-way valve 48 is connected to one end of a heat exchange flow path 38 provided in the first adsorber 24 via a pipe 64. The first outlet port OP <b> 1 of the first four-way valve 48 is connected to one end of the heat exchange channel 40 provided in the second adsorber 26 via a pipe 66.

  The other end of the heat exchange flow path 38 provided in the first adsorber 24 is connected to the first inlet port IP1 of the second four-way valve 50 via a pipe 68. The other end of the heat exchange flow path 40 provided in the second adsorber 26 is connected to a second inlet port IP2 of the second four-way valve 50 via a pipe 70.

  The first outlet port OP <b> 1 of the second four-way valve 50 is connected to a pipe 72 for returning the heat transfer fluid to the cooling tower 58. The second outlet port OP <b> 2 of the second four-way valve 50 is connected to a pipe 74 for returning the heat transfer fluid to the heating element 78.

  One end of the heat exchange flow path 42 provided in the condenser 28 is connected to a pipe 60 for sending the heat transfer fluid cooled by the cooling tower 58. The other end of the heat exchange flow path 42 provided in the condenser 28 is connected to a pipe 72 for returning the heat transfer fluid to the cooling tower 58.

  The four-way valves 48 and 50 are switched every predetermined time by a control unit (not shown).

  The heat exchange flow path 46 provided in the evaporator 30 is connected to the air conditioner 76. The air conditioner 76 performs air conditioning in the room where the information processing system according to the present embodiment is arranged. The air conditioner 76 is provided with a dry coil, for example. The air conditioner 76 cools the room in which the information processing system according to the present embodiment is arranged by using the cold heat of the heat transfer fluid cooled in the heat exchange flow path 46 provided in the evaporator 30. Specifically, for example, air heated by an information device 52 such as a server is circulated in the data center by a fan (not shown) or the like, and the air circulated in the data center is, for example, Cooled by dry coil.

  The temperature of the heat transfer fluid after being cooled in the heat exchange flow path 46 provided in the evaporator 30, in other words, the temperature of the cold obtained by the heat pump 4 according to the present embodiment is about 15 ° C., for example. The temperature of the heat transfer fluid before being cooled in the heat exchange flow path 46 provided in the evaporator 30 is, for example, about 18 ° C.

  Next, the operation of the heat pump according to the present embodiment will be described with reference to FIGS.

  FIG. 6 shows a case where the first inlet port IP1 and the first outlet port OP1 are connected to each of the four-way valves 48 and 50, and the second inlet port IP2 and the second outlet port OP2 are connected. Show.

  When each of the four-way valves 48 and 50 is set in this way, the heat transfer fluid cooled by the cooling tower 58, that is, the cooling fluid, is supplied to the second inlet port IP2 and the second inlet port IP2 of the first four-way valve 48. The heat exchange flow path 38 provided in the first adsorber 24 is reached via the outlet port OP2. The cooling fluid cools the adsorbent 36 in the first adsorber 24 and is returned to the cooling tower 58 via the first inlet port IP1 and the first outlet port OP1 of the second four-way valve 50. . The heat transfer fluid returned to the cooling tower 58 is cooled again by the cooling tower 58 and then sent out again by the pump 62. The adsorbent 36 provided in the first adsorber 24 is cooled by the cooling fluid circulating in this way. For this reason, the first adsorber 24 becomes an adsorption process.

  On the other hand, the heat transfer fluid heated by the heating element 78, that is, the heating fluid, passes through the first inlet port IP1 and the first outlet port OP1 of the first four-way valve 48, and then the second adsorber 26. It reaches the heat exchange flow path 40 provided in. The heated fluid heats the adsorbent 36 in the second adsorber 26, and is returned to the heating element 78 via the second inlet port IP2 and the second outlet port OP2 of the second four-way valve 50. . The adsorbent 36 provided in the second adsorber 26 is heated by the heating fluid circulating in this way. For this reason, the second adsorber 26 becomes a desorption process.

  In the first adsorber 24 that is in the adsorption process, the gas refrigerant around the adsorbent 36 is adsorbed by the adsorbent 36, so the pressure decreases. The pressure in the first adsorber 24 is lower than the pressure in the evaporator 30 and lower than the pressure in the condenser 28. In the partition wall 10 between the first adsorber 24 and the evaporator 30, the valve body 14 of the valve 2 is arranged on the surface on the first adsorber 24 side, so that the valve 2 is in an open state. . On the other hand, in the partition wall between the first adsorber 24 and the condenser 28, the valve body 14 of the valve 2 is disposed on the surface on the condenser 28 side, so that the valve 2 is closed.

  Since the valve 2 provided in the partition wall 10 between the first adsorber 24 and the evaporator 30 is in an open state, the gas refrigerant evaporated in the evaporator 30 passes through the valve 2 through the first adsorber. It flows into the interior 24 and is adsorbed by the adsorbent 36 of the first adsorber 24. At this time, in the evaporator 30, the liquid refrigerant stored in the evaporator 30 is cooled by the heat of vaporization when the liquid refrigerant is vaporized, and accordingly, the heat transfer fluid in the heat exchange channel 46 is cooled. Is cooled.

  In addition, since the valve 2 provided in the partition 10 between the first adsorber 24 and the condenser 28 is in a closed state, the gas refrigerant in the condenser 28 is moved to the first adsorber 24 side. There is no inflow.

  On the other hand, in the second adsorber 26 in the desorption process, the adsorbent 36 is heated, so that the refrigerant adsorbed on the adsorbent 36 is desorbed and the pressure rises. The pressure in the second adsorber 26 is higher than the pressure in the condenser 28 and higher than the pressure in the evaporator 30. In the partition wall 10 between the second adsorber 26 and the condenser 28, the valve body 14 of the valve 2 is disposed on the surface on the condenser 28 side, so that the valve 2 is in an open state. On the other hand, in the partition wall 10 between the second adsorber 26 and the evaporator 30, the valve 2 is placed on the surface on the second adsorber 26 side, so that the valve 2 is closed.

  Since the valve 2 provided in the partition wall 10 between the second adsorber 26 and the condenser 28 is in an open state, the gas refrigerant desorbed from the second adsorber 26 is condensed via the valve 2. Flows into the vessel 28. Along with this, the adsorption capacity of the adsorbent 36 in the second adsorber 26 is regenerated. In the condenser 28, the gas refrigerant supplied from the second adsorber 26 through the valve 2 is condensed to become a liquid refrigerant. The liquid refrigerant 34 is stored in the condenser 28. A part of the liquid refrigerant 34 stored in the condenser 28 is supplied into the evaporator 30 through the narrow tube 44.

  Since the valve 2 provided in the partition wall 10 between the second adsorber 26 and the evaporator 30 is in a closed state, the gas refrigerant desorbed from the second adsorber 26 is removed from the evaporator 30. It does not flow in.

  In the first adsorber 24, since the adsorption proceeds, the adsorption capacity of the adsorbent 36 of the first adsorber 24 gradually decreases. On the other hand, since desorption proceeds in the second adsorber 26, the adsorption capacity of the adsorbent 36 of the second adsorber 26 is regenerated. Therefore, before the adsorption capacity of the adsorbent 36 of the first adsorber 24 becomes excessively low, the first adsorber 24 is switched from the adsorption process to the desorption process, and the second adsorber 26 is removed from the desorption process. Switch to adsorption process. Such switching can be performed by switching the four-way valves 48 and 50. Specifically, the four-way valves 48 and 50 are connected so that the first inlet port IP1 and the second outlet port OP2 are connected, and the second inlet port IP2 and the first outlet port OP1 are connected. Switch. Switching of the four-way valves 48 and 50 is controlled by a control unit (CPU) (not shown).

  FIG. 7 shows a case where the first inlet port IP1 and the second outlet port OP2 are connected to each of the four-way valves 48 and 50, and the second inlet port IP2 and the first outlet port OP1 are connected. Show.

  When each of the four-way valves 48 and 50 is set in this way, the heat transfer fluid cooled by the cooling tower 58, that is, the cooling fluid is supplied to the second inlet port IP2 and the first first port 48 of the first four-way valve 48. The heat exchange flow path 40 provided in the second adsorber 26 is reached via the outlet port OP1. The cooling fluid cools the adsorbent 36 in the second adsorber 26 and returns to the cooling tower 58 via the second inlet port IP2 and the first outlet port OP1 of the second four-way valve 50. . The heat transfer fluid returned to the cooling tower 58 is cooled again by the cooling tower 58 and then sent out again by the pump 62. The adsorbent 36 provided in the second adsorber 26 is cooled by the cooling fluid circulating in this way. For this reason, the second adsorber 26 becomes an adsorption process.

  On the other hand, the heat transfer fluid heated by the heating element 78, that is, the heating fluid, passes through the first inlet port IP1 and the second outlet port OP2 of the first four-way valve 48, and thus the first adsorber 24. The heat exchange flow path 38 provided in the is reached. The heating fluid heats the adsorbent 36 in the first adsorber 24, and is returned to the heating element 78 via the first inlet port IP1 and the second outlet port OP2 of the second four-way valve 50. . The adsorbent 36 provided in the first adsorber 24 is heated by the heating fluid circulating in this way. For this reason, the first adsorber 24 becomes a desorption process.

  In the second adsorber 26, which is in the adsorption process, the gas refrigerant around the adsorbent 36 is adsorbed by the adsorbent 36, so the pressure decreases. The pressure in the second adsorber 26 is lower than the pressure in the evaporator 30 and lower than the pressure in the condenser 28. In the partition wall 10 between the second adsorber 26 and the evaporator 30, the valve body 14 of the valve 2 is arranged on the surface on the second adsorber 26 side, so that the valve 2 is in an open state. . On the other hand, in the partition wall between the second adsorber 26 and the condenser 28, the valve body 14 of the valve 2 is disposed on the surface on the condenser 28 side, so that the valve 2 is closed.

  Since the valve 2 provided in the partition wall 10 between the second adsorber 26 and the evaporator 30 is in an open state, the gas refrigerant evaporated in the evaporator 30 passes through the valve 2 through the second adsorber. 26 and is adsorbed by the adsorbent 36 of the second adsorber 26. At this time, in the evaporator 30, the liquid refrigerant stored in the evaporator 30 is cooled by the heat of vaporization when the liquid refrigerant is vaporized, and accordingly, the heat transfer fluid in the heat exchange channel 46 is cooled. Is cooled.

  Since the valve 2 provided in the partition wall 10 between the second adsorber 26 and the condenser 28 is in a closed state, the gas refrigerant in the condenser 28 is moved to the second adsorber 26 side. There is no inflow.

  On the other hand, in the first adsorber 24 in the desorption process, the adsorbent 36 is heated, so that the refrigerant adsorbed on the adsorbent 36 is desorbed and the pressure rises. The pressure in the first adsorber 24 is higher than the pressure in the condenser 28 and higher than the pressure in the evaporator 30. In the partition wall 10 between the first adsorber 24 and the condenser 28, the valve body 14 of the valve 2 is disposed on the surface on the condenser 28 side, so that the valve 2 is opened. On the other hand, in the partition 10 between the first adsorber 24 and the evaporator 30, the valve 2 is placed on the surface on the first adsorber 24 side, so that the valve 2 is closed.

  Since the valve 2 provided in the partition wall 10 between the first adsorber 24 and the condenser 28 is in an open state, the gas refrigerant desorbed from the first adsorber 24 is condensed via the valve 2. Flows into the vessel 28. Accordingly, the adsorption capacity of the adsorbent 36 in the first adsorber 24 is regenerated. In the condenser 28, the gas refrigerant supplied from the first adsorber 24 via the valve 2 is condensed to become a liquid refrigerant. The liquid refrigerant 34 is stored in the condenser 28. A part of the liquid refrigerant 34 stored in the condenser 28 is supplied into the evaporator 30 through the narrow tube 44.

  Since the valve 2 provided in the partition wall 10 between the first adsorber 24 and the evaporator 30 is in a closed state, the gas refrigerant desorbed from the first adsorber 24 is removed from the evaporator 30. It does not flow in.

  In the second adsorber 26, since the adsorption proceeds, the adsorption capacity of the adsorbent 36 of the second adsorber 26 gradually decreases. On the other hand, since desorption proceeds in the first adsorber 24, the adsorption capacity of the adsorbent 36 of the first adsorber 24 is regenerated. Accordingly, before the adsorption capacity of the adsorbent 36 of the second adsorber 26 becomes excessively low, the second adsorber 26 is switched from the adsorption process to the desorption process, and the first adsorber 24 is removed from the desorption process. Switch to adsorption process. Specifically, the four-way valves 48 and 50 are connected so that the first inlet port IP1 and the first outlet port OP1 are connected, and the second inlet port IP2 and the second outlet port OP2 are connected. Switch.

  In this manner, the setting of the four-way valves 48 and 50 is switched every time a predetermined time elapses, and the pair of adsorbers 24 and 26 are alternately switched between the adsorption process and the desorption process. Since the adsorption process and the desorption process can be alternately switched in the pair of adsorbers 24 and 26, the heat transfer fluid flowing through the heat exchange flow path 46 provided in the evaporator 30 can be continuously cooled, and thus air conditioning. The cooling capacity of the device 76 can be continuously maintained.

  As described above, according to the present embodiment, the valve 2 in which the convex portion 22 capable of contacting the edge 20 of the vent hole 12 is formed on the sheet-like valve body 14 includes the adsorbers 24 and 26, the condenser 28, and the like. Are attached to the partition 10 between the adsorbers 24 and 26 and the evaporator 30. For this reason, according to the present embodiment, the valve 2 can be in a closed state without bringing the portion of the valve body 14 excluding the convex portion 22 into contact with the partition wall 10. For this reason, according to this embodiment, it can prevent that the valve body 14 of the valve | bulb 2 adheres to the partition 10, and can provide the heat pump 4 with high reliability by extension. And according to this embodiment, since the cold / heat obtained using the waste heat (warm heat) emitted from heat generating bodies 78, such as CPU of the information equipment 52, can be used for air conditioning, it contributes to energy saving. it can.

[Fourth Embodiment]
A heat pump and an information processing system according to the fourth embodiment will be described with reference to FIGS. FIG. 8 is a schematic diagram illustrating the heat pump and the information processing system according to the present embodiment. FIG. 9 is a schematic diagram (part 1) illustrating operations of the heat pump and the information processing system according to the present embodiment. FIG. 10 is a schematic diagram (part 2) illustrating operations of the heat pump and the information processing system according to the present embodiment. The same components as those of the valves, heat pumps, and information processing systems according to the first to third embodiments shown in FIGS. 1 to 7 are denoted by the same reference numerals, and description thereof will be omitted or simplified.

  In the heat pump 4a according to the present embodiment, the surface of the partition wall 10 provided with a valve is inclined.

  As shown in FIG. 8, a plurality of vent holes 12 similar to the plurality of vent holes 12 described above with reference to FIG. 1 are formed in the oblique partition wall 10 between the adsorbers 24 and 26 and the condenser 28. ing. The upper surface side of the oblique partition 10 between the adsorbers 24 and 26 and the condenser 28 is the condenser 28 side. The lower surface side of the oblique partition wall 10 between the adsorbers 24 and 26 and the condenser 28 is the adsorber 24 and 26 side. 8 to 10 conceptually show the vent hole 12, and the actual vent hole 12 is as shown in FIG.

  In addition, a valve body 14 similar to the valve body 14 described above with reference to FIG. 1 is attached to the oblique partition wall 10 between the adsorbers 24 and 26 and the condenser 28. 8 to 10 conceptually show the valve body 14, and the actual valve body 14 is as shown in FIG. The valve body 14 is attached to the surface on the condenser 28 side of the oblique partition 10 between the adsorbers 24 and 26 and the condenser 28. In order that the valve element 14 is closed by gravity when no differential pressure is generated between the adsorbers 24 and 26 and the condenser 28, the valve element 14 is provided above the portion where the vent hole 12 is formed. Is fixed to the slanted partition wall 10 through a pedestal 16.

  In this way, the partition 10 between the adsorbers 24 and 26 and the condenser 28 is provided with a valve 2 similar to the valve 2 described above with reference to FIG.

  In addition, a plurality of ventilation holes 12 similar to the plurality of ventilation holes 12 described above with reference to FIG. 1 are formed in the oblique partition wall 10 between the adsorbers 24 and 26 and the evaporator 30. The upper surface side of the oblique partition 10 between the adsorbers 24 and 26 and the evaporator 30 is the adsorber 24 and 26 side. The lower surface side of the oblique partition 10 between the adsorbers 24 and 26 and the evaporator 30 is the evaporator 30 side.

  In addition, a valve body 14 similar to the valve body 14 described above with reference to FIG. 1 is attached to the oblique partition wall 10 between the adsorbers 24 and 26 and the evaporator 30. The valve body 14 is attached to the surface on the side of the adsorbers 24 and 26 in the partition wall 10 between the adsorbers 24 and 26 and the evaporator 30. In order that the valve element 14 is closed by gravity when no differential pressure is generated between the adsorbers 24 and 26 and the evaporator 30, the valve element 14 is provided above the portion where the vent hole 12 is formed. Is fixed to the slanted partition wall 10 through a pedestal 16. Thus, the inclined partition 10 between the adsorbers 24 and 26 and the evaporator 30 is provided with a valve 2 similar to the valve 2 described above with reference to FIG.

  Next, the operation of the heat pump 4a according to the present embodiment will be described with reference to FIGS.

  FIG. 9 shows a case where the first inlet port IP1 and the first outlet port OP1 are connected to each of the four-way valves 48 and 50, and the second inlet port IP2 and the second outlet port OP2 are connected. Show.

  When each of the four-way valves 48 and 50 is set in this way, the first adsorber 24 is cooled by the cooling fluid to enter the adsorbing process similarly to the heat pump 4 according to the third embodiment, and the second adsorber 26 is heated by the heating fluid to enter the desorption process.

  In the partition wall 10 between the first adsorber 24 and the evaporator 30, the pressure in the first adsorber 24 is lower than the pressure in the evaporator 30 as in the heat pump 4 according to the third embodiment. Therefore, the valve 2 is in an open state. On the other hand, in the partition wall 10 between the first adsorber 24 and the condenser 28, the pressure in the first adsorber 24 is higher than the pressure in the condenser 28, as in the heat pump 4 according to the third embodiment. Since it becomes low, the valve 2 is closed.

  In the partition wall 10 between the second adsorber 26 and the condenser 28, the pressure in the second adsorber 26 is higher than the pressure in the condenser 28, as in the heat pump 4 according to the third embodiment. Therefore, the valve 2 is in an open state. On the other hand, in the partition wall 10 between the second adsorber 26 and the evaporator 30, the pressure in the second adsorber 26 is higher than the pressure in the evaporator 30 as in the heat pump 4 according to the third embodiment. Since it becomes higher, the valve 2 is closed.

  Therefore, the heat pump 4a according to the present embodiment also operates in the same manner as the heat pump 4 according to the third embodiment.

  FIG. 10 shows a case where the first inlet port IP1 and the second outlet port OP2 are connected to each of the four-way valves 48 and 50, and the second inlet port IP2 and the first outlet port OP1 are connected. Show.

  When each of the four-way valves 48 and 50 is set in this way, the first adsorber 24 is heated by the heating fluid to be desorbed as in the heat pump 4 according to the third embodiment, and the second adsorber 26 is cooled by the cooling fluid and becomes an adsorption process.

  In the partition 10 between the first adsorber 24 and the evaporator 30, the pressure in the first adsorber 24 is higher than the pressure in the evaporator 30 as in the heat pump 4 according to the third embodiment. Therefore, the valve 2 is in a closed state. On the other hand, in the partition wall 10 between the first adsorber 24 and the condenser 28, the pressure in the first adsorber 24 is higher than the pressure in the condenser 28, as in the heat pump 4 according to the third embodiment. Since it becomes higher, the valve 2 is in an open state.

  In the partition wall 10 between the second adsorber 26 and the condenser 28, the pressure in the second adsorber 26 is lower than the pressure in the condenser 28, as in the heat pump 4 according to the third embodiment. Therefore, the valve 2 is in a closed state. On the other hand, in the partition wall 10 between the second adsorber 26 and the evaporator 30, the pressure in the second adsorber 26 is higher than the pressure in the evaporator 30 as in the heat pump 4 according to the third embodiment. Since it becomes low, the valve 2 is in an open state.

  Therefore, the heat pump 4a according to the present embodiment also operates in the same manner as the heat pump 4 according to the third embodiment.

  As described above, the valve 2 may be provided in the oblique partition wall 10. Even when the valve 2 is provided in the oblique partition wall 10 as in the present embodiment, the valve 2 can operate normally.

[Fifth Embodiment]
A heat pump and an information processing system according to the fifth embodiment will be described with reference to FIGS. 11 to 13. FIG. 11 is a schematic diagram illustrating the heat pump and the information processing system according to the present embodiment. FIG. 12 is a schematic diagram (part 1) illustrating operations of the heat pump and the information processing system according to the present embodiment. FIG. 13 is a schematic diagram (part 2) illustrating operations of the heat pump and the information processing system according to the present embodiment. The same components as those in the valves, heat pumps, and information processing systems according to the first to fourth embodiments shown in FIGS. 1 to 10 are denoted by the same reference numerals, and description thereof will be omitted or simplified.

  In the heat pump 4b according to the present embodiment, the surface of the partition wall 10 provided with the valve 2a is horizontal.

  As shown in FIG. 11, in the present embodiment, the adsorbers 24 and 26 are located above the condenser 28.

  A plurality of ventilation holes 12 similar to the plurality of ventilation holes 12 described above with reference to FIG. 1 are formed in the partition wall 10 between the adsorbers 24 and 26 and the condenser 28. The upper surface side of the partition 10 between the adsorbers 24 and 26 and the condenser 28 is the adsorber 24 and 26 side. The lower surface side of the partition wall 10 between the adsorbers 24 and 26 and the condenser 28 is the condenser 28 side. In addition, in FIG. 11 thru | or FIG. 13, the ventilation hole 12 is shown notionally, and the actual ventilation hole 12 is as showing in FIG.

  A valve body 14 a similar to the valve body 14 a of the valve 2 a according to the second embodiment described above with reference to FIG. 3 is attached to the partition wall 10 between the adsorbers 24 and 26 and the condenser 28. In addition, in FIG. 11 thru | or FIG. 13, the valve body 14a is shown notionally, and the actual valve body 14a is as showing in FIG. The valve body 14 a is attached to the surface on the condenser 28 side in the partition wall 10 between the adsorbers 24 and 26 and the condenser 28. As shown in FIG. 3, both ends of the valve body 14 a are fixed to the partition wall 10 via the pedestal 16. Since both ends of the valve body 14a are fixed to the partition wall 10 via the pedestal 16, when there is no differential pressure between the adsorbers 24, 26 and the condenser 28, the vent hole 12 is formed by the valve body 14a. Closed state.

  Thus, the partition 10 between the adsorbers 24 and 26 and the condenser 28 is provided with a valve 2a similar to the valve 2a according to the second embodiment described above with reference to FIG.

  A plurality of ventilation holes 12 similar to the plurality of ventilation holes 12 described above with reference to FIG. 1 are formed in the partition wall 10 between the adsorbers 24 and 26 and the evaporator 30. The upper surface side of the partition wall 10 between the adsorbers 24 and 26 and the evaporator 30 is the adsorber 24 and 26 side. The lower surface side of the oblique partition 10 between the adsorbers 24 and 26 and the evaporator 30 is the evaporator 30 side.

  A valve body 14 a similar to the valve body 14 a of the valve 2 a according to the second embodiment described above with reference to FIG. 3 is attached to the partition wall 10 between the adsorbers 24 and 26 and the evaporator 30. The valve body 14 a is attached to the surface on the side of the adsorbers 24, 26 in the partition 10 between the adsorbers 24, 26 and the evaporator 30. As shown in FIG. 3, both ends of the valve body 14 a are fixed to the partition wall 10 via the pedestal 16. Thus, the partition 10 between the adsorbers 24 and 26 and the evaporator 30 is provided with a valve 2a similar to the valve 2a described above with reference to FIG.

  Next, the operation of the heat pump 4b according to the present embodiment will be described with reference to FIGS.

  FIG. 12 shows a case where the first inlet port IP1 and the first outlet port OP1 are connected to each of the four-way valves 48 and 50, and the second inlet port IP2 and the second outlet port OP2 are connected. Show.

  When each of the four-way valves 48 and 50 is set in this way, the first adsorber 24 is cooled by the cooling fluid to enter the adsorbing process similarly to the heat pump 4 according to the third embodiment, and the second adsorber 26 is heated by the heating fluid to enter the desorption process.

  In the partition wall 10 between the first adsorber 24 and the evaporator 30, the pressure in the first adsorber 24 is lower than the pressure in the evaporator 30 as in the heat pump 4 according to the third embodiment. Therefore, the valve 2a is opened. On the other hand, in the partition wall 10 between the first adsorber 24 and the condenser 28, the pressure in the first adsorber 24 is higher than the pressure in the condenser 28, as in the heat pump 4 according to the third embodiment. Since it becomes low, the valve 2a is closed.

  In the partition wall 10 between the second adsorber 26 and the condenser 28, the pressure in the second adsorber 26 is higher than the pressure in the condenser 28, as in the heat pump 4 according to the third embodiment. Therefore, the valve 2a is opened. On the other hand, in the partition wall 10 between the second adsorber 26 and the evaporator 30, the pressure in the second adsorber 26 is higher than the pressure in the evaporator 30 as in the heat pump 4 according to the third embodiment. Since it becomes high, the valve 2a is in a closed state.

  Therefore, the heat pump 4b according to the present embodiment also operates in the same manner as the heat pump 4 according to the third embodiment.

  FIG. 13 shows a case where the first inlet port IP1 and the second outlet port OP2 are connected to each of the four-way valves 48 and 50, and the second inlet port IP2 and the first outlet port OP1 are connected. Show.

  When each of the four-way valves 48 and 50 is set in this way, the first adsorber 24 is heated by the heating fluid to be desorbed as in the heat pump 4 according to the third embodiment, and the second adsorber 26 is cooled by the cooling fluid and becomes an adsorption process.

  In the partition 10 between the first adsorber 24 and the evaporator 30, the pressure in the first adsorber 24 is higher than the pressure in the evaporator 30 as in the heat pump 4 according to the third embodiment. Therefore, the valve 2a is closed. On the other hand, in the partition wall 10 between the first adsorber 24 and the condenser 28, the pressure in the first adsorber 24 is higher than the pressure in the condenser 28, as in the heat pump 4 according to the third embodiment. Since it becomes high, the valve 2a is in an open state.

  In the partition wall 10 between the second adsorber 26 and the condenser 28, the pressure in the second adsorber 26 is lower than the pressure in the condenser 28, as in the heat pump 4 according to the third embodiment. Therefore, the valve 2a is closed. On the other hand, in the partition wall 10 between the second adsorber 26 and the evaporator 30, the pressure in the second adsorber 26 is higher than the pressure in the evaporator 30 as in the heat pump 4 according to the third embodiment. Since it becomes low, the valve 2a is in an open state.

  Therefore, the heat pump 4b according to the present embodiment also operates in the same manner as the heat pump 4 according to the third embodiment.

  Thus, the valve 2a may be provided in the horizontal partition 10. Since both ends of the valve body 14a of the valve 2a are fixed to the partition wall 10, even when the valve body 14a is attached to the lower surface side of the horizontal partition wall 10, the valve body 14a is opened by gravity. There is no end. Therefore, even when the valve body 14a is attached to the lower surface side of the horizontal partition wall 10, it can operate normally.

[Modified Embodiment]
The present invention is not limited to the above embodiment, and various modifications are possible.

  For example, in the third and fourth embodiments, the case where the valve 2 according to the first embodiment is provided in the partition wall 10 has been described as an example, but the present invention is not limited to this. For example, you may make it provide the valve | bulb 2a by 2nd Embodiment in the partition 10 of the heat pumps 4 and 4a by 3rd and 4th embodiment.

  In the fifth embodiment, the case where the valve 2a according to the second embodiment is provided in any partition wall 10 has been described as an example. However, the present invention is not limited to this. For example, the partition 2 between the adsorbers 24 and 26 and the evaporator 30 may be provided with the valve 2 of the first embodiment. In the partition 10 between the adsorbers 24 and 26 and the evaporator 30, the valve 2 according to the first embodiment can be used because the valve body is disposed on the upper surface side of the partition 10.

  Moreover, although the case where water was used as the refrigerant | coolant 34 was demonstrated to the example in the said embodiment, the refrigerant | coolant 34 is not limited to water. For example, methanol, ethanol or the like may be used as the refrigerant 34.

  Regarding the above embodiment, the following additional notes are disclosed.

(Appendix 1)
It has a sheet-like valve body that opens and closes the vent hole formed in the partition wall,
The valve body has a convex portion that abuts against an edge of the vent hole.

(Appendix 2)
In the valve according to appendix 1,
The convex portion has a hemispherical shell shape.

(Appendix 3)
In the valve according to appendix 1 or 2,
A plurality of the vent holes are formed in the partition wall,
The valve according to claim 1, wherein the sheet-like valve body has a plurality of convex portions that respectively contact the edges of the plurality of vent holes.

(Appendix 4)
In the valve according to any one of appendices 1 to 3,
One end of the valve body is fixed to the partition wall.

(Appendix 5)
In the valve according to any one of appendices 1 to 3,
The valve body is extendable and contractible.
Both ends of the valve body are fixed to the partition wall.

(Appendix 6)
An adsorber capable of alternately switching between an adsorption process and a desorption process;
A condenser that condenses the refrigerant in response to the supply of the refrigerant desorbed from the adsorber in the desorption process;
An evaporator that receives supply of the refrigerant condensed by the condenser, evaporates the refrigerant, and supplies the refrigerant to the adsorber in the adsorption process;
A sheet-like valve body that opens and closes a vent hole formed in a partition wall between the adsorber and the condenser or between the adsorber and the evaporator; A heat pump comprising: a valve having a convex portion that comes into contact with an edge of a pore.

(Appendix 7)
In the heat pump according to appendix 6,
The convex portion has a hemispherical shell shape.

(Appendix 8)
In the heat pump according to appendix 6 or 7,
A plurality of the vent holes are formed in the partition wall,
The sheet-like valve body has a plurality of the convex portions that respectively contact the edges of the plurality of vent holes.

(Appendix 9)
In the heat pump according to any one of appendices 6 to 8,
One end of the valve body is fixed to the partition wall.

(Appendix 10)
In the heat pump according to any one of appendices 6 to 9,
The valve body is extendable and contractible.
Both ends of the valve body are fixed to the partition wall.

(Appendix 11)
In the heat pump according to appendix 11,
The condenser is located below the adsorber;
The said valve is attached to the lower surface side of the said partition between the said adsorption device and the said condenser. The heat pump characterized by the above-mentioned.

(Appendix 12)
Information equipment,
An adsorber in which an adsorption process and a desorption process are alternately switched by heating using heat generated from the information device, and a supply of refrigerant desorbed from the adsorber in the desorption process are received to condense the refrigerant. A condenser; an evaporator that receives supply of the refrigerant condensed by the condenser, evaporates the refrigerant, and supplies the refrigerant to the adsorber in the adsorption process; the adsorber and the condenser; Or a sheet-like valve body that opens and closes a vent hole formed in a partition wall between the adsorber and the evaporator, and the valve body is a convex abutting against an edge of the vent hole. A heat pump having a valve having a portion;
An air conditioner that performs air conditioning using a heat transfer fluid cooled by the heat pump.

2, 2a ... valves 4, 4a, 4b ... heat pump 10 ... partition 12 ... vent holes 14, 14a ... valve body 16 ... pedestal, fixing member 18 ... screw 20 ... edge 22 ... convex portion 24 ... first adsorber 26 ... Second adsorber 28 ... condenser 30 ... evaporator 32 ... casing 34 ... refrigerant 36 ... adsorbent 38 ... heat exchange channel 40 ... heat exchange channel 42 ... heat exchange channel 44 ... narrow tube 46 ... heat exchange channel 48 ... first four-way valve 50 ... second four-way valve 52 ... information device 54 ... pipe 56 ... pump 58 ... cooling section, cooling tower 60 ... pipe 62 ... pump 64 ... pipe 66 ... pipe 68 ... pipe 70 ... pipe 72 ... Piping 74 ... Piping 76 ... Air conditioner 77 ... Substrate 78 ... Heat, CPU
80 ... Cold plate IP1 ... 1st input port IP2 ... 2nd input port OP1 ... 1st output port OP2 ... 2nd output port

Claims (5)

It has a sheet-like valve body that opens and closes the vent hole formed in the partition wall,
The valve body has a convex portion that abuts against an edge of the vent hole. The valve of claim 1,
The convex portion has a hemispherical shell shape. The valve according to claim 1 or 2,
The valve body is extendable and contractible.
Both ends of the valve body are fixed to the partition wall via a pedestal. An adsorber capable of alternately switching between an adsorption process and a desorption process;
A condenser that condenses the refrigerant in response to the supply of the refrigerant desorbed from the adsorber in the desorption process;
An evaporator that receives supply of the refrigerant condensed by the condenser, evaporates the refrigerant, and supplies the refrigerant to the adsorber in the adsorption process;
A sheet-like valve body that opens and closes a vent hole formed in a partition wall between the adsorber and the condenser or between the adsorber and the evaporator; A heat pump comprising: a valve having a convex portion that comes into contact with an edge of a pore. Information equipment,
An adsorber in which an adsorption process and a desorption process are alternately switched by heating using heat generated from the information device, and a supply of refrigerant desorbed from the adsorber in the desorption process are received to condense the refrigerant. A condenser; an evaporator that receives supply of the refrigerant condensed by the condenser, evaporates the refrigerant, and supplies the refrigerant to the adsorber in the adsorption process; the adsorber and the condenser; Or a sheet-like valve body that opens and closes a vent hole formed in a partition wall between the adsorber and the evaporator, and the valve body is a convex abutting against an edge of the vent hole. A heat pump having a valve having a portion;
An air conditioner that performs air conditioning using a heat transfer fluid cooled by the heat pump.

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