JP2013014803A - Magnet unit, magnetic field generator, and magnetron sputtering apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To propose a magnet unit, magnetic field generator, and magnetron sputtering apparatus allowing a magnetic track to be easily changed without taking time and effort and also allowing for cost reduction.SOLUTION: By configuring the magnet unit to have different magnetic poles, to be provided with a second magnet 22 rotatably supported by a magnetic plate 20, to change the magnetic poles by rotating the second magnet 22, and to change a shape of the magnetic track JT formed on a surface of a target 13, the shape of the magnetic track JT can be changed to an optimal shape without removing the magnetic poles arranged on the magnetic plate 20, whereby the magnetic track JT can be easily changed without taking time and effort to remove the magnetic poles and the cost reduction can be achieved accordingly.

Description

  The present invention relates to a magnet unit, a magnetic field generator, and a magnetron sputtering apparatus, and is suitably applied to, for example, a magnetron sputtering apparatus that confines plasma by a magnetic field and efficiently causes atoms to collide with a target surface.

  Conventionally, a magnetron sputtering apparatus is known as a thin film forming apparatus for forming a thin film on a substrate. In this magnetron sputtering apparatus, a thin film is formed on the deposition substrate by applying a voltage between the target and the deposition substrate to discharge the sputtering gas and generating plasma in the space near the cathode. Has been made. Such a magnetron sputtering apparatus is provided with a magnet unit, and a magnetic field is generated in the sputtering region by the magnet unit and the plasma is confined in the magnetic field, so that the atoms collide with the target surface efficiently. (See, for example, Patent Document 1).

Japanese Patent Laid-Open No. 10-102248

  By the way, in such a magnetron sputtering apparatus, it is always required to increase the target utilization efficiency and to improve the film thickness distribution on the deposition target substrate. The target utilization efficiency and the film thickness distribution can vary depending on the material and size of the target, but the influence of the magnet arrangement shape of the magnet unit arranged behind the target cannot be ignored.

  Here, the magnet unit is configured by appropriately arranging a plurality of magnets on a magnetic plate. For example, as shown in FIG. 19A, the magnet unit 100 includes a first magnet 102 arranged in an annular shape on a disk-shaped magnetic plate 101, and a first magnet 102 in a region surrounded by the first magnet 102. A configuration in which the second magnet 103 is fixed on the magnetic plate 101 without being in contact with 102 is generally used.

  As shown in FIG. 19B, in such a magnet unit 100, a disk-shaped target 13 is provided on the opening surface side where the first magnet 102 and the second magnet 103 are exposed so as to face the magnetic plate 101. Can be installed. As a result, lines of magnetic force generated from the magnet unit 100 (shown by solid lines on the surface of the target 13 in FIG. 19B) can be generated on the surface of the target 13 so as to draw an arc. Here, in the magnetic force lines generated on the surface of the target 13, a set of points where the magnetic flux density of the normal component on the surface of the target 13 becomes zero (hereinafter referred to as a magnetic track) is similar to the shape of the magnet unit 100. The shape can be different.

  A high-density plasma is generated on the magnetic track by the action of the electric field generated on the target 13, and sputtering is promoted in the vicinity of the magnetic track. That is, if the shape of the magnetic track, in other words, the shape of the magnet unit 100 is changed, the sputtered particle generation region is also changed, which affects the film thickness distribution and film quality on the film formation substrate. Such a phenomenon appears remarkably in the stationary facing film formation in which the distance between the target 13 and the film formation substrate is short.

  In addition, for example, when the target 13 installed in the magnet unit 100 is changed to a target made of a material, size, etc. different from the target 13 currently used, the use efficiency of the target is increased accordingly. In order to improve the film thickness distribution on the deposition target substrate, it is necessary to change the arrangement shape of the first magnet 102 and the second magnet 103 in the magnet unit 100.

  However, in the magnet unit 100, since the first magnet 102 and the second magnet 103 are fixed on the magnetic plate 101 with an adhesive, the arrangement of the first magnet 102 and the second magnet 103 is changed to change the magnetic track. When trying to change, there is a problem that the magnet unit 100 itself has to be manufactured again, which takes time and effort, and a new cost is generated accordingly.

  Accordingly, the present invention has been made in consideration of the above points, and proposes a magnet unit, a magnetic field generator, and a magnetron sputtering apparatus that can easily change a magnetic track without taking time and effort and can also reduce costs. The purpose is to do.

  In order to solve this problem, claim 1 of the present invention is a magnet unit used in a magnetron sputtering apparatus, and a holding plate arranged so that a target faces each other, and a first magnet provided on the holding plate, A second magnet having a different magnetic pole provided on the holding plate, the second magnet being rotatably supported by the holding plate, and changing the magnetic pole by rotating to thereby change the target. The shape of the magnetic track formed on the surface of the substrate is changed.

  According to a second aspect of the present invention, the second magnet includes a first magnetic pole half and a second magnetic pole half made of a magnetic pole different from the magnetic pole of the first magnetic pole half. The first magnetic pole half and / or the second magnetic pole half are arranged on the target side by providing a rotation axis in a direction orthogonal to the normal and rotating on the holding plate around the rotation axis. It is characterized by.

  According to a third aspect of the present invention, the first magnet is disposed in a first magnetic pole element disposed on the holding plate and a region surrounded by the first magnetic pole element, and a part of the outer periphery is cut away. A second magnetic pole element, and the second magnet is disposed in a cutout portion of the second magnet element.

  According to a fourth aspect of the present invention, an opening is formed in the holding plate, and a part of the second magnet is disposed in the opening.

  According to a fifth aspect of the present invention, the magnet unit according to any one of the first to fourth aspects, a rotation driving unit that rotates the magnet unit, and a second angle adjusted to a predetermined angle of the magnet unit. And a fixing means for fixing the magnet in a non-rotating state.

  According to a sixth aspect of the present invention, the magnet unit according to any one of the first to fourth aspects, a rotation driving unit that rotates the magnet unit, and the rotation of the rotation driving unit is the second of the magnet unit. There is provided an interlocking means for transmitting to two magnets and rotating the second magnet in conjunction with rotation of the magnet unit.

  According to a seventh aspect of the present invention, the magnet unit according to any one of the first to fourth aspects, a rotation driving unit that rotates the magnet unit, and a rotation unit that is separate from the rotation driving unit. And a second magnet rotation drive unit that rotates the two magnets.

  Further, according to claim 8 of the present invention, a magnetic field is generated in a sputtering region by a magnetic field generator, and the plasma is confined in the magnetic field so that atoms collide with the surface of the target and the film is formed facing the target. A magnetron sputtering apparatus for forming a thin film on a holding plate, wherein the magnetic field generator is the magnetic field generator according to any one of claims 5 to 7.

  According to the present invention, the second magnet having different magnetic poles and rotatably supported on the holding plate is provided, and the magnetic poles are changed by rotating the second magnet, so that the magnetic track formed on the surface of the target By changing the shape, it is possible to change the shape of the magnetic track to the optimal shape without removing the magnetic poles arranged on the holding plate, thus eliminating the time and effort to remove the magnetic poles. Can be easily changed, and the cost can be reduced accordingly.

It is the schematic which shows the whole structure of the magnetron sputtering device by this invention. It is the schematic which shows the whole structure of a magnet unit. It is the schematic which shows the whole structure of a 2nd magnet. It is the schematic where it uses for description of the rotation angle of a 2nd magnet. It is the schematic which shows the mode of a change of a magnetic track. It is the schematic which shows the relationship (1) of a magnetic track, erosion, and a film thickness. It is the schematic which shows the relationship (2) of a magnetic track, erosion, and a film thickness. It is the schematic which shows the relationship (3) of a magnetic track, erosion, and a film thickness. It is the top view, side sectional view, and bottom view which show the whole structure of the magnet unit by 1st Embodiment. It is the schematic which shows the whole structure of the magnet unit used by the verification test. It is side sectional drawing which shows the side cross-section structure of the magnetic field generator used in the verification test. It is a sectional side view which shows the side cross-section structure of the magnetic field generator by 2nd Embodiment. It is a sectional side view which shows the side cross-section structure of the magnetic field generator by 3rd Embodiment. It is the schematic which shows the structure of the magnet unit by 4th Embodiment. It is the schematic where it uses for description of the magnetic track and erosion formed with the magnet unit by 4th Embodiment. It is the schematic which shows the structure of the magnet unit by 5th Embodiment. It is a sectional side view which shows the side cross-section structure of the magnet unit by 4th Embodiment. It is the schematic which shows the whole structure of the magnetron sputtering device by other embodiment. It is the schematic where it uses for description of the conventional magnet unit.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(1) First Embodiment (1-1) Configuration of Magnetron Sputtering Apparatus According to First Embodiment In FIG. 1, reference numeral 1 denotes a magnetron sputtering apparatus to which the present invention can be applied. A vacuum container 2 extending in a predetermined direction (in this case, the back side with respect to the paper surface) is provided, and a deposition target substrate 3 is arranged in the vicinity of the center position in the vacuum container 2. The magnetron sputtering apparatus 1 includes a substrate transfer mechanism 4 in a vacuum container 2, and the substrate transfer mechanism 4 allows the film formation surface of the film formation substrate 3 to be covered in the vacuum container 2 so as to be perpendicular to the z axis. The film formation substrate 3 is supported. The substrate transport mechanism 4 can transport the film formation substrate 3 along the vacuum container 2 extending in the x-axis direction (in this case, the back side in the drawing) perpendicular to the y-axis and the z-axis. .

The vacuum vessel 2 is provided with a gas introduction mechanism 5 so that, for example, a sputtering gas such as argon, nitrogen, and helium can be introduced into the vacuum vessel 2 by the gas introduction mechanism 5. In addition, the vacuum vessel 2 is provided with an exhaust mechanism 6, which allows the inside of the vacuum vessel 2 to be in a state of 10 ⁻⁶ Pa or less and exhausts sputtering gas and impurity gas from the vacuum vessel 2. It is made to be able to do. In the case of this embodiment, the inside of the vacuum vessel 2 is adjusted to 0.01 to 10 Pascals, which is a sputtering gas pressure necessary for discharge.

  In addition, in this vacuum vessel 2, magnetic field generators 10 and 11 are arranged on the wall so as to face both film formation surfaces of the film formation substrate 3. Here, since the magnetic field generators 10 and 11 have the same configuration, the following description will be given focusing on one of the magnetic field generators 10. The magnetic field generator 10 has a target 13 attached to the inside of the vacuum vessel 2 and can generate magnetic lines of force from the magnet unit 14 on the surface of the target 13 in the vacuum vessel 2.

  In practice, the magnetic field generator 10 has a power source 15 connected to the cathode container 16, and either DC power, AC power, or power obtained by superimposing AC power and DC power is supplied from the power source to be a cathode. . As a result, the magnetron sputtering apparatus 1 can generate a plasma in a space near the cathode by applying a voltage between the target 13 provided in the magnetic field generation apparatus 10 and the deposition target substrate 3 to discharge the sputtering gas. . In the case of this embodiment, the distance between the target 13 and the deposition target substrate 3 is selected to be about 30 to 40 [mm].

  In practice, the magnetic field generator 10 includes a magnet unit 14, a cathode container 16 that holds the magnet unit 14, and a rotation drive unit 18 that is provided in the cathode container 16 and rotates the magnet unit 14. The target 13 is configured to be installed in the cathode container 16 so as to face the membrane substrate 3. Such a magnetic field generator 10 forms a magnetic track of a predetermined shape by the magnet unit 14, generates high-density plasma by the action of the electric field generated on the target 13, and promotes sputtering near the magnetic track. A thin film can be formed on the film formation substrate 3. Furthermore, by rotating the magnet unit 14 by the rotation drive unit 18 and rotating the magnetic track, concentration of erosion (erosion) generated on the target 13 can be prevented and target utilization efficiency can be increased. Thus, the magnetron sputtering apparatus 1 can form thin films on both film formation surfaces of the film formation substrate 3 by the magnetic field generators 10 and 11 provided so as to face the wall portion of the vacuum vessel 2. ing.

(1-2) Outline of Magnet Unit Here, as shown in FIG. 2, a magnet unit 14 to which the present invention can be applied includes, for example, a disk-shaped magnetic plate 20 provided with a first magnet 21 and a second magnet 22. The second magnet 22 is provided so as to be rotatable, and the magnetic pole is changed by changing the second magnet 22 so that the shape of the magnetic track can be changed. .

  Incidentally, the magnet unit 14 can be rotated by the rotation drive unit 18 with the normal line (z-axis direction) penetrating the center of the circle of the magnetic plate 20 as the rotation axis z1, and a thin film is formed on the deposition target substrate 3. Is formed, it can continue to rotate clockwise or counterclockwise about the rotation axis z1 to generate a uniform magnetic track on the surface of the target 13.

  The first magnet 21 has a first magnet element 21a arranged in a circular shape along the periphery of the magnetic plate 20, and a first magnet 21a fixed on the magnetic plate 20 and arranged in a region surrounded by the first magnet element 21a. It consists of two magnet elements 21b. Here, the second magnet element 21b has a configuration in which a part of a circular shape is notched and formed in a C shape, and a notch portion 23 is provided on the outer peripheral portion. Specifically, the second magnet element 21b has a C-shaped diameter selected to be smaller than the diameter of the first magnet element 21a, and is fixed on the magnetic plate 20 with a predetermined distance from the first magnet element 21a. Has been.

  In this embodiment, the first magnet 21 includes a circular first magnet element 21a, a C-shaped second magnet element 21b, and a disk-shaped magnetic plate 20 arranged concentrically. The first magnet element 21a and the second magnet element 21b are fixed to the magnetic plate 20 by an epoxy adhesive. In addition, the first magnet 21 includes, for example, a first magnet element having an N pole, a second magnet element having an S pole that is a magnetic pole different from the magnetic pole of the first magnet element, and the first magnet element 21a and the second magnet element. 21b is formed of different magnetic poles.

  In addition to this, the magnet unit 14 includes a second magnet 22 in the notch 23 of the second magnet element 21b. By changing the magnetic pole of the second magnet 22 as necessary, the magnet unit 14 The shape of the magnetic track formed by 14 can be appropriately changed. In the case of this embodiment, the second magnet 22 is arranged in the axial direction at the notch 23 of the second magnet element 21b, one end is located near the center point of the magnetic plate 20, and the other end Is located in the vicinity of the first magnet element 21a.

  In practice, as shown in FIG. 3, the second magnet 22 has a cylindrical shape, a semi-cylindrical first magnetic pole half body 25a, and also a semi-cylindrical magnetic pole of the first magnetic pole half body 25a (for example, N pole) and a second magnetic pole half body 25b having a different magnetic pole (for example, S pole). The second magnet 22 is arranged such that the axial direction is orthogonal to the normal line (z axis) of the magnetic pole plate 20, and the first magnetic pole with respect to the magnetic plate 20 is rotated by rotating this axial direction as the rotation axis y1. The arrangement state of the half body 25a and the second magnetic pole half body 25b changes, and the magnetic track formed by the magnet unit 14 can change.

  In the case of the first embodiment, when the thin film is formed on the film formation substrate 3, the magnetic plate 20 itself rotates about the central axis z1 that is the normal line, but the second magnet 22 is It is positioned at a predetermined rotational position and can be used while being fixed to a predetermined magnetic pole state.

  Here, how the magnetic track formed by the magnet unit 14 changes when the state of the magnetic pole is changed by rotating the second magnet 22 will be described. Here, as shown in FIG. 4, with respect to the rotational position of the second magnet 22, a rotation reference line a1 is provided in the second magnet 22, and this rotation reference line a1 is relative to the fixed reference line a2 defined in the magnetic plate 20. It is specified by how much the rotation angle θ is positioned.

  In practice, in FIG. 4, a line that is disposed perpendicular to the rotation axis y1 of the second magnet 22 and passes through the center of each outer peripheral surface of the first magnetic pole half body 25a and the second magnetic pole half body 25b is defined as a rotation reference line a1. A normal line (z axis) from the surface of the magnetic plate 20 is a fixed reference line a2, and the degree of rotation of the second magnet 22 is represented by the rotation angle θ of the rotation reference line a1 from the fixed reference line a2.

  Specifically, when the rotation angle θ is 0 degree, the fixed reference line a2 of the magnetic plate 20 and the rotation reference line a1 of the second magnet 22 coincide with each other and N on the target 13 (not shown in FIG. 4) side. The outer peripheral surface of the first magnetic pole half body 25a, which is the pole, is almost entirely exposed, and only the first magnetic pole half body 25a faces the target 13.

  On the other hand, when the rotation angle θ is 90 degrees, the rotation reference line a1 of the second magnet 22 is 90 degrees with respect to the fixed reference line a2 of the magnetic plate 20 (the first magnetic pole half 25a and the second magnetic pole). The boundary of the half body 25b coincides with the fixed reference line a1, and the outer peripheral surfaces of the first magnetic pole half body 25a, which is the N pole, and the second magnetic pole half body 25b, which is the S pole, are exposed to the target 13 The outer peripheral surface of the first magnetic pole half body 25a and the outer peripheral surface of the second magnetic pole half body 25b are in a state of facing the target 13 at the same ratio.

  When the rotation angle θ is 180 degrees, the fixed reference line a2 of the magnetic plate 20 and the rotation reference line a1 of the second magnet 22 coincide with each other, and the outer periphery of the second magnetic pole half body 25b serving as the S pole on the target 13 side. The surface is almost entirely exposed, and only the second magnetic pole half body 25b faces the target 13. Incidentally, in the case of this embodiment, the second magnet 22 is arranged so as to be partially embedded in the opening 20a formed in the magnetic plate 20, and the degree of protrusion from the magnetic plate 20 is suppressed. Thus, the entire magnet unit 14 is reduced in thickness.

  Then, the magnetic track in a state where the magnetic plate 20 was stationary without rotating while adjusting the rotation angle θ of the second magnet 22 to a predetermined angle and fixing the magnetic pole state was examined. It was confirmed that the magnetic track JT as shown in 5F was obtained. The verification test for obtaining the results of FIGS. 5A to 5F will be described in “(1-5) Verification test” described later.

In such a magnet unit 14, FIGS. 5A to 5F show the magnetic flux density on the target 13 and the shape of the magnetic track JT when the second magnet 22 is rotated every 36 degrees. 5A to 5F, the surface of the magnetic plate 20 is the xy plane of the x axis and the y axis, the direction perpendicular to the xy plane and perpendicular to the surface of the target 13 is the z axis, and the surface of the target 13 is a magnetic field measuring means. The whole surface is measured by scanning (for example, a teslameter), and the magnetic track JT (where erosion occurs on the surface of the target 13) is formed by connecting portions where the component B _{Z in the} z-axis direction becomes B _Z = 0.

  For example, as shown in FIG. 5A, when the rotation angle θ of the second magnet 22 is 0 degree, the shape of the magnetic track JT can be a concave shape cut out from a partial region of the outer periphery to the central region. 5B, when the rotation angle θ of the second magnet 22 is 36 degrees, or when the rotation angle θ of the second magnet 22 is 72 degrees as shown in FIG. 5C, the magnetic track JT Although the shape is concave, as the rotation angle θ increases, the degree of dents cut out from a part of the outer periphery to the central region gradually decreases.

  Further, as shown in FIG. 5D, when the rotation angle θ of the second magnet 22 is 108 degrees, the shape of the magnetic track JT can be in a state where a part of the outer periphery is slightly depressed. As shown in FIG. 5E, when the rotation angle θ of the second magnet 22 is 144 degrees, or when the rotation angle θ of the second magnet 22 is 180 degrees as shown in FIG. 5F, the rotation angle θ is As the size increases, the outer periphery of the magnetic track JT becomes smaller, and the magnetic track JT can be substantially circular. Thus, it was confirmed that the magnetic track JT changed to a concave shape or a circular shape by changing the rotation state of the second magnet 22 and could be adjusted to a desired shape.

  Here, FIG. 6A shows a magnetic track JT that is circular on the surface of the target 13 when the magnetic pole position of the second magnet 22 is adjusted and the magnet unit 14 is not rotating. FIG. 6B shows that the magnetic track JT is formed on the surface of the target 13 when the magnetic track JT has a circular shape as shown in FIG. It shows erosion. In this case, as shown in FIG. 6B, an erosion in which the region on the edge facing the magnetic track JT is greatly eroded can be formed on the surface of the target 13. As a result, as shown in FIG. 6C, the film thickness of the region facing the erosion formed on the target 13 is thicker than that of the region facing the center of the target 13 having no erosion. A thin film 3a is formed.

  On the other hand, FIG. 7A shows a magnetic track JT that has a concave shape on the surface of the target 13 when the magnetic pole position of the second magnet 22 is adjusted and the magnet unit 14 does not rotate. FIG. 7B shows the erosion formed on the surface of the target 13 when the magnetic track JT has a concave shape as shown in FIG. 7A and the magnet unit 14 is rotated as it is to form a film on the deposition target substrate 3. It is a thing. In this case, as shown in FIG. 7B, the target 13 may be eroded such that the edge portion facing the magnetic track JT is greatly eroded and the central region is slightly eroded. As a result, as shown in FIG. 7C, a thin film 3a having a substantially uniform thickness is formed on the deposition target substrate 3.

  Further, FIG. 8A shows a magnetic track JT having a bean shape in which the central region side is greatly recessed on the surface of the target 13 when the magnetic pole position of the second magnet 22 is adjusted and the magnetic plate 20 does not rotate. FIG. 8B shows the erosion formed on the surface of the target 13 when the magnetic track JT has a broad bean shape as shown in FIG. 8A and the magnet unit 14 is rotated to form a film on the film formation substrate 3. It is a thing. In this case, as shown in FIG. 8B, the target 13 may be formed with erosion eroded almost uniformly from the edge portion facing the magnetic track JT to the central region. As a result, as shown in FIG. 8C, a thin film 3a is formed on the deposition target substrate 3 in which the thickness of the central portion is larger than the thickness of the edge portion.

  As described above, the magnet unit 14 can appropriately change the shape of the magnetic track JT formed on the surface of the target 13 by fixing the second magnet 22 at a predetermined rotational position and adjusting the state of the magnetic pole. The erosion formed on the surface of the target 13 is changed. As a result, the utilization efficiency of the target 13 can be improved, and the film thickness distribution on the deposition target substrate 3 can be changed.

(1-3) Configuration of Magnet Unit In practice, the magnet unit 14 of the magnetic field generator 10 is as shown in FIG. 9A which is a top view, FIG. 9B which is a side sectional view, and FIG. 9C which is a bottom view. A magnetic pole rotating mechanism 27 is provided on the magnetic plate 20 as a mechanism for rotating the second magnet 22. In the first embodiment, the second magnet 22 is used in a fixed state at a predetermined rotational position.

  In this case, the magnetic pole rotating mechanism 27 includes a first bearing 28a and a second bearing 28b fixed on the magnetic plate 20, and a columnar shaft member rotatably provided between the first bearing 28a and the second bearing 28b. 29, a gear 30a provided on the shaft member 29, and a fixed gear 30b meshing with the gear 30a. The second magnet 22 is provided concentrically with the shaft member 29, is disposed between the first bearing 28 a and the second pairing 28 b, and is rotatably supported by the magnetic plate 20.

  In the case of this embodiment, in the magnetic pole rotating mechanism 27, the first bearing 28a is slightly deviated from the center of the magnetic plate 20, and is disposed in the vicinity of the second magnet element 21b, and is opposed to the first bearing 28a. A second bearing 28b is disposed in the vicinity of the first magnet element 21a.

  The gear 30a has a bevel gear shape with a predetermined diameter, and a shaft member 29 is fitted into a through hole (not shown) drilled in the central portion thereof, so that the shaft member 29 is interposed between the second magnet 22 and the first bearing 28a. Can be fixed to. The fixed gear 30b has a bevel gear shape with a predetermined diameter, and a shaft portion (not shown) provided at the central portion thereof is rotatably provided with respect to the magnetic plate 20, and the magnetic plate is fixed by a fixing screw 31 provided at the head. Fixed to 20 and can be non-rotating.

  In the magnetic pole rotation mechanism 27, the fixed gear 30b and the gear 30 are engaged with each other, and the fixed screw 31 as a fixing means is loosened to rotate the fixed gear 30b, whereby the gear 30a rotates in a direction orthogonal to the rotation direction of the fixed gear 30b. When the shaft member 29 rotates in response to the rotation, the second magnet 22 can also rotate. The magnetic pole rotating mechanism 27 rotates the second magnet 22 to a desired angular position, and then the fixed gear 30b is fixed by the fixing screw 31, whereby the second magnet 22 is brought into a non-rotating state with respect to the magnetic plate 20. It can be fixed in a magnetic pole state.

  Incidentally, in the case of this embodiment, the magnetic pole rotating mechanism 27 has a part of the second magnet 22 in the opening 20a penetrating the magnetic plate 20, although the second magnet 22 has a thickness larger than that of the first magnet element 21a. Therefore, the thickness of the second magnet 22 in the diametrical direction and the combined thickness of the first magnet element 21a and the magnetic plate 20 are substantially equal, so that the overall thickness is reduced and the gear 30a is It is designed to reliably mesh with the fixed gear 30b.

  In the case of this embodiment, the magnetic pole rotating mechanism 27 has the diameter of the gear 30a arranged in the thickness direction (z axis) of the magnetic plate 20, but the magnetic plate 20 corresponds to the arrangement position of the gear 30a. The gear opening 20b is formed in the gear opening 20b, and the gear 30a is housed in the gear opening 20b, so that the gear 30a can be thinned without protruding from the thickness of the first magnet element 21a and the magnetic plate 20. It has been.

  Further, in the case of this embodiment, the magnetic pole rotating mechanism 27 is formed with a recessed step portion 20c that matches the outer shape of the fixed gear 30b at the position where the fixed gear 30b is disposed, and the fixed gear 30b is accommodated in the step portion 20c. The protrusion of the fixed gear 30b from the surface of the magnetic plate 20 is suppressed, and the overall thickness is reduced.

(1-4) Operation and Effect In the above configuration, in the magnet unit 14, the second magnet 22 having different magnetic poles of the S pole and the N pole is rotatably supported on the magnetic plate 20, The shape of the magnetic track JT formed by the entire magnet unit 14 can be changed to an optimum shape by simply rotating the second magnet 22 without removing the magnetic poles arranged on the magnetic plate 20.

  According to the above configuration, the second magnet 22 having different magnetic poles and rotatably supported on the magnetic plate 20 is provided, and the magnetic poles are changed by rotating the second magnet 22 to be formed on the surface of the target 13. By changing the shape of the magnetic track JT, the shape of the magnetic track JT can be changed to an optimum shape without removing the magnetic pole arranged on the magnetic plate 20, and the magnetic pole is thus removed. The magnetic track JT can be easily changed without taking time and effort, and the cost can be reduced accordingly.

(1-5) Verification Test Incidentally, the results shown in FIGS. 5A to 5F described above are results obtained by using a magnet unit 35 as shown in FIG. In the magnet unit 35 used for the verification test, a magnetic plate made of SS400 and having a thickness of 12 [mm] and a diameter of 160 [mm] was used as the magnetic plate 20. A first magnet 36 was fixed on such a magnetic plate 20. Here, the first magnet 36 includes a plurality of magnet bodies 37 each having a rectangular parallelepiped shape and a C-shaped second magnet element 36b, and the magnet body is formed in a circular shape along the edge of the magnetic plate 20. The first magnet element 36a was formed by arranging 37 and fixing them on the magnetic plate 20, and the second magnet element 36b was fixed to the central region surrounded by the first magnet element 36a.

  At that time, the first magnet element 36a was fixed so that the N pole appeared on the target 13 side, and the second magnet element 36b was fixed so that the S pole appeared on the target 13 side. The first magnet element 36a and the second magnet element 36b were fixed to the magnetic plate 20 by using an adhesive (product name, Araldite). On the other hand, the second magnet 22 was installed in a U-shaped notch 38 of the second magnet element 36b so as to be rotatable by a bearing (not shown). A second magnet 22 having a diameter of 32 [mm] and a length of 55 [mm] was used. In addition, one end of the second magnet 22 is disposed about 7 [mm] away from the center of the magnetic plate 20.

  The first magnet 36 and the second magnet 22 were made of Shin-Etsu Chemical N48M (energy product 48MGOe). As shown in FIG. 11, the first magnet 36 has a height H1 of 30 [mm] from the surface of the magnetic plate 20. The cathode vessel 16 is provided with a back plate 40 made of a nonmagnetic material at the edge, and a target 13 having a diameter of 160 [mm] made of an iron-cobalt alloy with a saturation magnetic flux density of 2.4 T is provided on the back plate 40. The gap between the first magnet 36 and the second magnet 22 and the back plate 40 is 1 [mm], the thickness of the back plate 40 is 8 [mm], and the thickness of the target 13 is 3 [mm]. The height H2 from the upper surface of the first magnet and the second magnet to the surface of the target 13 was 12 [mm]. When the magnetic field was measured using the surface of the target 13 as a magnetic field distribution confirmation surface, the results shown in FIGS. 5A to 5F were obtained. In FIG. 11, reference numeral 41 denotes magnetic field lines.

  Incidentally, the magnetic field strength in the direction of the target surface in the vicinity of the magnetic track JT is also 50 [mT] or more, and it can be said that the magnetic field strength can be discharged, and the magnet unit 35 according to the present invention can sufficiently withstand use. It could be confirmed. The bearings provided at both ends of the second magnet 22 are made of martensitic stainless steel having an outer diameter of 21 [mm], an inner diameter of 12 [mm], and a width of 5 [mm]. The change in the shape of track JT was slight. Further, the force applied to the second magnet 22 was also obtained by simulation. Even if a material with a saturation magnetic flux density of 2.4 [T] is fixed as a target 13 at a location about 12 [mm] away from the opening surface of the magnet unit 35, the maximum axial direction of the second magnet 22 is 100 [N], The bearings could withstand the use of the above-mentioned bearings with a repulsive force of up to 500 [N] applied in the radial direction.

(2) Second Embodiment In FIG. 12, in which parts corresponding to those in FIG. 9B are assigned the same reference numerals, reference numeral 45 denotes a magnetic field generator according to the second embodiment. The second embodiment is different from the first embodiment in that the second magnet 22 rotates simultaneously with the rotation of the plate 20. In this case, an overall view of the magnetron sputtering apparatus is omitted, and only the vicinity of the magnetic field generator 45 will be described.

  In practice, the magnetic field generator 45 is provided with a bottomed cylindrical cathode container 16 so as to surround the magnet unit 14, and a rotation drive unit 18 that rotates the magnet unit 14 is provided at the bottom 16 a of the cathode container 16. It has been. Further, a target (FIG. 1) is disposed at the edge of the cathode container 16 so as to face the bottom 16a, and the target can be positioned on the opening surface side of the magnet unit 14.

  The cathode container 16 includes a through hole 48 having a bearing 47 in the bottom portion 16a, and a shaft member 18a extending from the rotation drive unit 18 can pass through the through hole 48, and the shaft member 18a is supported by the bearing 47. Has been made to get. The rotation drive unit 18 has an end of the shaft member 18a fixed to the holding means 50 provided on the magnetic plate 20, and rotates the shaft member 18a to fix the magnet unit 14 to the end of the shaft member 18a. Can be rotated.

  In addition to this configuration, the magnetic field generator 45 according to the second embodiment has a planetary gear mechanism 51 as interlocking means. In this case, the planetary gear mechanism 51 is provided on the shaft member 18a extending from the rotational drive unit 18, and meshes with the sun gear 51a disposed between the bottom plate 16a of the cathode container 16 and the magnetic plate 20, and the sun gear 51a. However, the planetary gear 51b is pivotally supported by the magnetic plate 20 so as to revolve around it. The planetary gear mechanism 51 may be provided with a ring-shaped internal gear on the outer periphery of the planetary gear 51b, and the planetary gear 51b may be inscribed in the internal gear. The gear 51b can be stably revolved.

  Here, the planetary gear 51b is meshed with a gear 30a of the shaft member 29 to which the second magnet 22 is fixed. As a result, when the shaft member 18a is rotated by the rotation drive unit 18, the magnetic field generator 45 rotates the magnetic plate 20 fixed to the shaft member 18a and simultaneously rotates the sun gear 51a fixed to the shaft member 18a. Can do. Thereby, the sun gear 51a can revolve the planetary gear 51b together with the magnetic plate 20 at a predetermined revolution period by transmitting the rotation to the planetary gear 51b. The planetary gear 51b transmits the rotation to the gear 30a, and the second magnet 22 can be rotated by rotating the shaft member 29.

  Thus, in the magnetic field generator 45, the second magnet 22 can be rotated simultaneously with the rotation of the magnetic plate 20, and the shape of the magnetic track JT is, for example, the shape of the magnetic track JT as shown in FIGS. The predetermined thin film can be formed on the film formation substrate 3 while periodically changing the film formation. Incidentally, the rotation speed of the second magnet 22 can be determined depending on the rotation speed of the magnet unit 14 and the gear ratio between the sun gear 51a and the planetary gear 51b.

  In the above configuration, the magnetic field generator 45 can achieve the effects of the first embodiment described above, and the second magnet 22 is also rotated in conjunction with the rotation of the magnetic plate 20. Thus, the magnetic track JT can be rotated while constantly changing the outer shape of the magnetic track JT, and the magnetic track JT can be spread evenly over the surface of the target 13, so that the utilization efficiency of the target 13 can be improved.

(3) Third Embodiment In FIG. 13, in which parts corresponding to those in FIG. 12 are assigned the same reference numerals, reference numeral 55 denotes a magnetic field generator according to the third embodiment. The second embodiment is different from the second embodiment in that the rotation speed of the second magnet 22 can be set independently of the rotation speed of the magnetic plate 20. Even in this case, an overall view of the magnetron sputtering apparatus is omitted, and only the vicinity of the magnetic field generator 55 will be described.

  In this case, the magnetic field generator 55 is provided with a second magnet rotation drive unit 56 for rotating the second magnet 22 in the cathode container 16, and the shaft member 56 a of the second magnet rotation drive unit 56 is provided on the cathode member 16. The adjustment gear 57 is fixed. The magnetic field generator 55 also has a planetary gear mechanism 58. The sun gear 59 of the planetary gear mechanism 58 is provided on the shaft member 18a of the rotation drive unit 18 via a bearing 47. The sun gear 59 is formed so that a first gear portion 59a and a second gear portion 59b having a predetermined diameter face each other, and an adjustment gear 57 is meshed with one first gear portion 59a, and the other first gear portion 59a is engaged. The planetary gear 51b is meshed with the two gear portions 59b.

  As a result, when the second magnet rotation drive unit 56 rotates the shaft member 56a to rotate the adjustment gear 57, the sun gear 59 rotates accordingly and meshes with the second gear unit 59b of the sun gear 59. The planetary gear 51b thus made can rotate. Thereby, the rotation drive part 56 for 2nd magnets can rotate the 2nd magnet 22 by rotating rotation of the planetary gear 51b to the gear 30a, and rotating the gear 30a. At this time, the sun gear 59 can be freely rotated according to the rotation of the adjustment gear 57 without being restricted by the rotation of the shaft member 18a by the bearing 57. Thus, the second magnet rotation drive unit 56 can rotate the second magnet 22 independently of the rotation drive unit 18.

  Further, the magnetic field generator 55 can rotate only the rotation drive unit 18 in a state where the second magnet rotation drive unit 56 is stopped. In this case, the magnetic field generator 55 fixes the sun gear 59 to the shaft member 18a, so that the sun gear 59 is also rotated by the rotation of the shaft member 18a, as in the second embodiment described above. Accordingly, the planetary gear 51b and the gear 30a meshing with the sun gear 59 can also rotate, and thus the second magnet 22 can be rotated at the same time as the magnetic plate 20 is rotated.

  Further, the magnetic field generator 55 adjusts the rotation of the second magnet rotation drive unit 56 so that the rotation angular velocity of the magnetic plate 20 and the rotation angular velocity of the sun gear 59 are not equal, thereby allowing the second magnet 22 to be adjusted. However, the rotation can be relatively stopped on the magnetic plate 20, and the state in which only the magnetic plate 20 is rotated can be realized as in the first embodiment described above.

  In the above configuration, the magnetic field generator 55 is provided with the second magnet rotation drive unit 56 for rotating the second magnet 22 separately from the rotation drive unit 18 for rotating the magnetic plate 20. The second magnet 22 can be controlled separately from the rotation of the magnetic plate 20, and the second magnet 22 can be rotated at various rotational angular speeds, or the rotation of the second magnet 22 can be stopped and the magnetic pole state can be fixed. . That is, the magnetic field generator 55 can execute the operation as the magnetic field generator 10 of the first embodiment described above or the operation of the magnetic field generator 45 according to the second embodiment. The rotation of the magnet 22 can be finely controlled, and the magnetic track JT can be easily formed according to various conditions.

(4) Fourth Embodiment In FIG. 14, in which parts corresponding to those in FIG. 2 are assigned the same reference numerals, 65 denotes a magnet unit according to the fourth embodiment, and this magnet unit 65 is a first magnet. A first magnet 67 composed of an element 21a and a magnet element group 66 is provided on the magnetic plate 20, and a second magnet 22 whose magnetic pole can be changed is provided on the magnetic plate 20. In addition, Similarly, the magnetic plate 20 has a configuration in which a third magnet 68 whose magnetic pole can be changed is provided.

  In this case, the magnet element group 66 is disposed on the magnetic plate 20 in a region surrounded by the circular first magnet element 21a. The magnet element group 66 includes a second magnet element 66a and a third magnet element 66b bent in a curved shape having a predetermined arc length, and a rod-like fourth magnet element 66c disposed at the center.

  The second magnet element 66a and the third magnet element 66b are arranged so that the curved concave regions are opposed to each other at a predetermined interval, and the fourth magnet is arranged on the center line of the second magnet element 66a and the third magnet element 66b. Element 66c is arranged. Here, the second magnet element 66a, the third magnet element 66b, and the fourth magnet element 66c are all composed of the same magnetic poles and different from the magnetic poles of the first magnet element 21a. That is, when the first magnet element 21a has the N pole, the second magnet element 66a, the third magnet element 66b, and the fourth magnet element 66c are all configured from the S pole.

  The magnetic plate 20 is provided with a cylindrical second magnet 22 and a third magnet 68 so as to sandwich the fourth magnet element 66c. The second magnet 22 and the third magnet 68 are respectively connected to the first bearing 28a and the second magnet 68a. It is rotatably supported by a bearing 28b. The third magnet 68 has the same configuration as that of the second magnet 22 described above. As shown in FIG. 3, the third magnet 68 has a semi-cylindrical first magnetic pole half body 25a, the same semi-cylindrical shape, and the first magnet 68. The magnetic pole half body 25a includes a second magnetic pole half body 25b made of a magnetic pole different from the magnetic pole of the magnetic pole half body 25a.

  The second magnet 22 and the third magnet 68 are configured such that the rotation axis y1 extending in the axial direction is arranged at a right angle to the normal line (z axis) of the magnetic pole plate 20, and rotates around the rotation axis y1. The arrangement state of the first magnetic pole half body 25a and the second magnetic pole half body 25b with respect to the magnetic plate 20 may change, and the magnetic track JT formed by the magnet unit 65 may change. In the case of this embodiment, the second magnet 22 and the third magnet 68 are arranged on the magnetic plate 20 in a substantially straight line.

  As described above, in the magnet unit 65, the second magnet 22 and the third magnet 65 rotate independently without being interlocked with each other, and the magnetic poles of the second magnet 22 and the third magnet 65 are freely changed to thereby change the magnetic track JT. Can be adjusted to an optimal shape.

  Here, FIG. 15A shows two concave regions that are depressed toward the central region on the surface of the target 13 when the magnetic pole positions of the second magnet 22 and the third magnet 65 are adjusted so that the magnet unit 65 does not rotate. The formed magnetic track JT is shown. 15B shows that the magnetic track JT is formed on the surface of the target 13 when the magnetic track JT has a shape having two concave regions as shown in FIG. It shows the erosion that is done. In this case, as shown in FIG. 15B, erosion can be formed on the surface of the target 13 by relatively uniformly eroding the entire region facing the magnetic track JT.

  In this way, the magnet unit 65 has two recesses as shown in FIG. 15A, and can form a magnetic track JT with a reduced magnetic track length on the outer periphery of the target 13. Can slow down. Note that such a magnet unit 65 is more effective in the case of offset film formation (that is, offset film formation in which the center of the deposition target substrate 3 is shifted from the center of the target 13) than the stationary facing film formation.

  In the fourth embodiment described above, the mechanism for rotating the second magnet 22 and the third magnet 68 may be the mechanism of the magnetic field generator 10 according to the first embodiment, the second magnet described above, or the like. Various other mechanisms such as the mechanism of the magnetic field generator 45 according to the embodiment and the mechanism of the magnetic field generator 55 according to the third embodiment may be combined.

(5) Fifth Embodiment In FIG. 16 in which parts corresponding to those in FIG. 10 are assigned the same reference numerals, and in FIG. 17 showing the cross-sectional structure in FIG. 16, reference numeral 70 denotes a magnet unit according to the fifth embodiment. This magnet unit 70 is different from the first to third embodiments in the configuration of the first magnet 71. In this case, the first magnet 71 is composed of a rod-shaped magnet body 72 having an N pole disposed at one end 72a and an S pole disposed at the other end 72b. One magnetic pole is disposed in the outer region of the magnetic plate 20, and the other magnetic pole is disposed in the inner region of the magnetic plate 20 so as to extend radially from the center point of the magnetic plate 20.

  A magnetic body 72 of the first magnet 71 is arranged on the magnetic plate 20 so as to avoid the second magnet 22 that is rotatably supported with the direction orthogonal to the normal line as the axial direction. Also in the magnet unit 70, since the 2nd magnet 22 is comprised so that a magnetic pole can be changed, the effect similar to the magnet unit 14 of 1st Embodiment mentioned above can be acquired.

  For example, in the fifth embodiment, the case where the magnetic plate 20 having magnetism is used as the holding plate has been described. However, the present invention is not limited to this, and a nonmagnetic nonmagnetic plate is used as the holding plate. It may be used.

(6) Other Embodiments The present invention is not limited to this embodiment, and various modifications can be made within the scope of the gist of the present invention. For example, a portion corresponding to FIG. 18, the film formation substrate 3 is placed on the substrate mounting table 76 and is opposed to the film formation substrate 3, for example, in the first embodiment described above. A magnetron sputtering apparatus 75 provided with the magnetic field generator 10 according to the form may be applied. In this case, in the magnetron sputtering apparatus 75, the magnetic field generators 45 and 55 according to the second and third embodiments described above may be applied, and the magnet unit 65 according to the fourth or fifth embodiment. 70 may be applied.

  Incidentally, in such a magnetron sputtering apparatus 75, a power source 15 is connected to the magnetic field generator 10, and DC power can be supplied from the power source 15 to the magnetic field generator 10. The magnetic field generator 10 is provided with a target 13 in the vacuum vessel 2 and can generate magnetic lines of force from the magnet unit 14 on the surface of the target 13 in the vacuum vessel 2. Even in such a magnetron sputtering apparatus 75, plasma can be confined and high-density plasma can be generated on the surface of the target 13 by the action of the electric field generated by the electric power input to the target 13.

  At this time, in the magnet unit 14, the second magnet 22 having different magnetic poles of the S pole and the N pole is rotatably supported on the magnetic plate 20, so that the magnetic pole arranged on the magnetic plate 20 can be changed. The shape of the magnetic track JT formed by the entire magnet unit 14 can be changed to an optimum shape by simply rotating the second magnet 22 without removing it. Thus, the magnetron sputtering apparatus 75 can easily change the magnetic track JT without taking time and effort to remove the magnetic poles, and can also reduce the cost accordingly.

  Further, in the above-described embodiment, the C-shaped second magnet is used as the second magnetic pole element, which is disposed in the region surrounded by the first magnetic pole element in the first magnet and a part of the outer periphery is notched. Although the case where the magnet elements 21b and 36b are applied has been described, the present invention is not limited to this, and has an outer shape such as a U-shape, a V-shape, a U-shape, etc. A second magnetic pole element provided with a notch may be applied. In addition, although the circular 21a and 36a are applied to the first magnetic pole element, the first magnetic pole element having various other outer peripheral shapes such as a C shape, a U shape, a V shape, a U shape, etc. is applied. May be.

  Furthermore, in the above-described embodiment, the case where the cylindrical second magnets 22, 68 are applied as the second magnet is described. However, the present invention is not limited thereto, that is, the first magnetic pole half and Any second magnet having a configuration in which a magnetic pole of the first magnetic pole half and a second magnetic pole half made of a different magnetic pole are connected, such as an elliptical cross section, a triangular shape, a square shape, a polygonal shape, etc. A columnar second magnet having a cross-sectional shape, or a second magnet having various shapes such as a spherical shape or a cubic shape may be applied.

  Further, in the above-described embodiment, the second magnets 22 and 68 are manufactured by cutting a magnetic pole body in which, for example, the first magnetic pole half of N pole and the second magnetic pole half of S pole are integrally formed. In addition, for example, a semi-cylindrical first magnetic pole half and a semi-cylindrical second magnetic pole half that is separate from the first magnetic half are prepared. The cylindrical second magnets 22 and 68 may be manufactured by connecting two magnetic pole halves.

1 Magnetron sputtering equipment
13 Target
14 Magnet unit
18 Rotation drive
20 Magnetic plate (holding plate)
21 First magnet
21a First pole element
21b Second magnetic pole element
22 Second magnet
25a 1st magnetic pole half
25b Second pole half
31 Fixing screw (fixing means)
51 Planetary gear mechanism (interlocking means)
56 Rotary drive for second magnet

Claims (8)

A magnet unit used in a magnetron sputtering apparatus,
A holding plate arranged so that the targets are opposed to each other;
A first magnet provided on the holding plate;
A second magnet provided on the holding plate and having different magnetic poles,
The second magnet is rotatably supported by the holding plate, and changes the magnetic pole by rotating to change the shape of a magnetic track formed on the surface of the target. . The second magnet includes a first magnetic pole half and a second magnetic pole half made of a magnetic pole different from the magnetic pole of the first magnetic pole half, and has a rotation axis in a direction perpendicular to the normal line of the holding plate. 2. The magnet according to claim 1, wherein the first magnetic pole half and / or the second magnetic pole half are arranged on the target side by rotating on the holding plate about the rotation axis. unit. The first magnet includes a first magnetic pole element disposed on the holding plate, and a second magnetic pole element disposed in a region surrounded by the first magnetic pole element and having a part of the outer periphery cut away.
3. The magnet unit according to claim 1, wherein the second magnet is disposed in a cutout portion in which the second magnet element is cut out. The magnet unit according to claim 1, wherein an opening is formed in the holding plate, and a part of the second magnet is disposed in the opening. The magnet unit according to any one of claims 1 to 4,
A rotation drive unit for rotating the magnet unit;
A magnetic field generator comprising: a fixing unit configured to fix the second magnet adjusted to a predetermined angle of the magnet unit in a non-rotating state. The magnet unit according to any one of claims 1 to 4,
A rotation drive unit for rotating the magnet unit;
A magnetic field generator comprising: interlocking means for transmitting the rotation of the rotation driving unit to the second magnet of the magnet unit and rotating the second magnet in conjunction with the rotation of the magnet unit. The magnet unit according to any one of claims 1 to 4,
A rotation drive unit for rotating the magnet unit;
A magnetic field generator comprising: a second magnet rotation drive unit that rotates the second magnet of the magnet unit separately from the rotation drive unit. A magnetron sputtering apparatus that generates a magnetic field in a sputtering region by a magnetic field generator and confines the plasma in the magnetic field, thereby causing atoms to collide with the target surface and forming a thin film on a deposition target substrate facing the target. There,
The said magnetic field generator is a magnetic field generator of any one of Claims 5-7. The magnetron sputtering apparatus characterized by the above-mentioned.