JP2013012068A - Heat sink cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively cool a heat generator different from a heat generator cooled by a heat sink cooler.SOLUTION: A heat sink cooler 1 comprises: a cooling fan 2; a heat sink body 3 that is provided on a downstream side of the cooling fan 2, is thermally connected to a first heat transfer pipe 4, and exchanges heat between a heat carrier, flowing in the first heat transfer pipe, and blowing air; a first heat conductor 6 that is provided outside a flow channel reaching the heat sink body 3 from the cooling fan 2, is thermally connected to a second heat transfer pipe 5 communicated with the first heat transfer pipe 4, and allows heat from a first heat generator 21 to transfer to a heat carrier in the second heat transfer pipe 5; and a current plate 9 for guiding blowing air from the cooling fan 2 to a direction of at least one of the first heat conductor 6 and the second heat transfer pipe 5.

Description

  The present invention relates to a heat sink cooler for cooling electronic devices and electrical products.

2. Description of the Related Art Conventionally, a heat sink cooler is provided in a heating element of an electronic device such as a PC or a server or an electric product in order to suppress a high temperature due to the heat generation.
A heat sink cooler dissipates the heat generated in a heating element such as a CPU, thereby reducing the temperature of the heating element, and forcibly increasing the amount of air movement. A cooling fan that increases the cooling capacity is generally used.

  The heat sink cooler is generally a heat sink that is directly attached to the surface of the heating element, and a top flow type that is placed above the heat sink and blows air from directly above the heat sink. On the other hand, a side flow type heat sink cooler in which wind is blown from the side to a heat sink provided above a heat generating body for further performance improvement is also known (see, for example, Patent Document 1).

JP 2010-225630 A

  By the way, the server board which comprises a server is mounted with high density for high performance. In particular, the progress of miniaturization of the voltage regulator circuit that supplies power to the CPU is remarkable. Therefore, the establishment of a method for cooling these circuit components, which has a high heat density, is a current problem.

  In order to cool the voltage regulator, a method of providing a heat sink cooler with respect to the voltage regulator may be considered, but it is not preferable in terms of space efficiency, noise, and cost.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a heat sink cooler that can efficiently cool a heating element different from the heating element cooled by the heat sink cooler. There is to do.

  The present invention has been made to solve the above-described problems. A heat sink cooler according to the present invention is provided on the downstream side of a cooling fan and the cooling fan and is thermally connected to the first heat transfer tube. A heat sink main body for exchanging heat between the heat medium flowing in the first heat transfer tube and the blown air, and provided outside the flow path from the cooling fan to the heat sink main body and the first heat transfer A first heat conductor thermally connected to a second heat transfer pipe communicating with the heat pipe and conducting heat from the first heating element to a heat medium in the second heat transfer pipe; And a rectifying plate for guiding the blown air from the cooling fan in at least one direction of the second heat transfer tube.

  The heat sink cooler of this invention is good also as a structure which further provides the 2nd heat conductor which conducts the heat | fever from the 2nd heat generating body downstream from said 1st heat conductor.

  The heat sink cooler of the present invention is configured such that the first heating element and the first heat conductor are provided at a predetermined interval below the heat sink main body, and the rectifying plate guides air toward the interval. It is good.

  The heat sink cooler of the present invention may have a configuration in which the cooling fan is provided on one side of the heat sink body and the second heating element and the second heat conductor are provided on the other side.

  According to the present invention, the air blown from the cooling fan is around the heat sink cooler by the baffle plate, and the air blown from the cooling fan is guided to the outside of the flow path from the cooling fan to the heat sink main body, A heating element different from the heating element cooled by the heat sink cooler can be efficiently cooled.

It is a side view of the heat sink cooler concerning the embodiment of the present invention. It is A arrow directional view of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 and 2, the heat sink cooler 1 of this embodiment is attached to a CPU 21 mounted on a motherboard 20.

  The heat sink cooler 1 is in communication with the cooling fan 2, the heat sink body 3 provided on the downstream side of the cooling fan 2, four first heat pipes 4 penetrating the heat sink body 3, and the first heat pipe 4. The heat sink cooler 1 as a whole is fixed to the mother board 20 by fixing the four second heat pipes 5, the heat receiving base 6 provided on the upper surface of the CPU 21, and connected to the second heat pipe 5 to the mother board 20. And a clip 7 to be fixed to 20.

  The heat sink body 3 is arranged above the CPU 21 and the heat receiving base 6 with a predetermined interval. That is, the heat receiving base 6 is provided outside the flow path from the cooling fan 2 to the heat sink main body 3.

A bracket 8 is fixed to the heat sink body 3 with screws, and the cooling fan 2 is fixed to the bracket 8.
A rectifying plate 9 is provided below the bracket 8 and guides the air blown from the cooling fan 2 to the lower side of the heat sink body 3. Details of the current plate 9 will be described later.

  The cooling fan 2 has a rectangular casing 11. In the casing 11, a motor 13, a rotating shaft 13 </ b> A rotated by the motor 13, and a blower blade 12 attached to the rotating shaft 13 </ b> A are provided. The cooling fan 2 is configured to generate an air flow on the right side of FIG. 1 when the blower blades 12 rotate. Hereinafter, the direction along the rotation shaft 13A and in which air flows is referred to as a flow path direction F1.

  The heat sink main body 3 is composed of a metal plate 3A having a high thermal conductivity arranged in a large number at regular intervals. The metal plate 3A is arranged so that the air flow of the cooling fan 2 flows along the surface of the metal plate 3A. Further, a first heat pipe 4 to be described later passes through the heat sink main body 3 in a direction orthogonal to the metal plate 3 </ b> A, whereby a volatile liquid (heat medium) flowing in the first heat pipe 4 and Heat exchange with the air blown by the cooling fan 2 is performed.

The first heat pipe 4 is a heat pipe made of a tubular member made of a material having high thermal conductivity, and a volatile liquid (heat medium) is enclosed in the first heat pipe 4. The first heat pipe 4 is provided through the plurality of metal plates 3A, and the plurality of metal plates 3A and the first heat pipe 4 are thermally connected.
The second heat pipe 5 is a heat pipe having the same configuration as the first heat pipe 4 and communicates with the first heat pipe 4. That is, the heat medium is enclosed between the first heat pipe 4 and the second heat pipe 5.

  The heat receiving base 6 is a plate-like member formed of a metal having high thermal conductivity, for example, copper, and is provided so as to be in surface contact with the most heat generating portion (core) of the CPU 21. The heat receiving base 6 is provided with the second heat pipe 5 in contact therewith, and the heat receiving base 6 and the second heat pipe 5 are thermally connected. That is, the heat receiving base 6 is configured to conduct heat from the CPU 21 to the heat medium in the second heat pipe 5.

  The clip 7 is a sheet metal member for fixing the heat receiving base 6 to the mother board 20 and is configured to press the periphery of the heat receiving base 6 against the mother board 20 side. The clip 7 is fixed to the mother board 20 by a fastening pin 14.

The current plate 9 is a plate-like member provided integrally with the bracket 8 below the bracket 8. Further, a ventilation hole 8A is formed in the lower part of the bracket 8, and the rectifying plate 9 is provided continuously to the ventilation hole 8A.
The rectifying plate 9 extends obliquely downward toward the flow path direction F <b> 1 so as to guide the blown air generated by the cooling fan 2 in at least one direction of the heat receiving base 6 and the second heat pipe 5. Is formed. Specifically, the heat sink main body 3 and the heat receiving base 6 are installed so as to be inclined so that the distance between the plate surface 9a of the rectifying plate 9 and the mother board 20 is gradually reduced.
Thereby, most of the blown air from the cooling fan 2 flows into the heat sink main body 3 along the flow path direction F <b> 1, but a part of the blown air passes through the ventilation holes 8 </ b> A of the bracket 8. Into the bottom.

  Further, a voltage regulator 22 is provided on the mother board 20 of the present embodiment and downstream of the CPU 21 and the heat receiving base 6 in the flow direction F1. In addition, a heat sink 23 that conducts heat from the voltage regulator 22 is attached to the voltage regulator 22. That is, the voltage regulator 22 and the heat sink 23 are provided in a direction opposite to the direction in which the cooling fan 2 is provided with respect to the heat sink main body 3.

Next, the operation of the heat sink cooler 1 of the present embodiment will be described.
First, a heat transfer path of heat generated in the CPU 21 will be described. When heat is generated in the CPU 21, the heat is conducted to the heat receiving base 6 in surface contact with the CPU 21. This heat is conducted to the heat sink body 3 via the second heat pipe 5 and the first heat pipe 4 that are thermally connected to the heat receiving base 6.

Next, cooling of the heat conducted to the heat pipe 4 will be described.
When the motor 13 of the cooling fan 2 is driven, the heat of the CPU 21 conducted to the metal plate 3A of the heat sink body 3 is forcibly released to the outside by the wind sent by the cooling fan 2, and as a result, the CPU 21 Cooling will be promoted.

  Also, the blown air generated by the cooling fan 2 is guided to the outside of the flow path direction F <b> 1 from the cooling fan 2 to the heat sink main body 3 by the rectifying plate 9. That is, a part of the blown air is guided in at least one direction F <b> 2 of the heat receiving base 6 and the second heat pipe 5. As shown in FIG. 1, a part of this blown air hits the heat sink 23 of the voltage regulator 22 arranged further downstream. Thereby, the heat sink 23 is cooled by a part of blowing air, and the temperature of the voltage regulator 22 is lowered.

  According to the above embodiment, the air blown from the cooling fan 2 by the rectifying plate 9 hits the heat sink 23 of the voltage regulator 22 provided around the heat sink cooler 1 and downstream of the CPU 21 in the flow direction F1. The temperature of the voltage regulator 22 can be effectively reduced.

  Since it is not necessary to provide a separate heat sink cooler in the voltage regulator 22, the cost can be reduced and the noise level generated from the server can be reduced.

Table 3 is a table showing results of an example in which the heat sink cooler according to the present invention is applied to the server device and a comparative example in which the conventional heat sink cooler is applied to the server device.
As shown in Table 3, a temperature reduction of about 15 ° C. was confirmed for the voltage regulator circuit component by applying the heat sink cooler employing the rectifying plate of the present invention.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the embodiment described above, the heat sink cooler is configured to contribute to cooling the heat sink of the voltage regulator. It is good also as a structure.

  Moreover, although the baffle plate showed the structure formed integrally with a bracket, not only this but a baffle plate is good also as a structure attached to another component.

1 Heat Sink Cooler 2 Cooling Fan 3 Heat Sink Body 4 First Heat Pipe (First Heat Transfer Tube)
5 Second heat pipe (second heat transfer tube)
6 Heat receiving base (first heat conductor)
9 Current plate 21 CPU (first heating element)
22 Voltage regulator (second heating element)
23 Heat sink (second heat conductor)

Claims (4)

A cooling fan,
A heat sink main body which is provided on the downstream side of the cooling fan and is thermally connected to the first heat transfer pipe and exchanges heat between the heat medium flowing in the first heat transfer pipe and the blown air;
It is provided outside the flow path from the cooling fan to the heat sink main body and is thermally connected to a second heat transfer tube communicating with the first heat transfer tube, and heat from the first heating element is obtained. A first heat conductor that conducts heat to the heat medium in the second heat transfer tube;
A heat sink cooler comprising: a rectifying plate that guides blown air from the cooling fan in at least one direction of the first heat conductor and the second heat transfer tube.   The heat sink cooler according to claim 1, further comprising a second thermal conductor that conducts heat from the second heating element downstream from the first thermal conductor. The first heating element and the first thermal conductor are provided at a predetermined interval below the heat sink body,
The heat sink cooler according to claim 2, wherein the rectifying plate guides air toward the space.   4. The cooling fan is provided on one side of the heat sink main body, and the second heating element and the second heat conductor are provided on the other side. The heat sink cooler described.

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