JPS53136749A - Heat pipe connector - Google Patents

Heat pipe connector

Info

Publication number
JPS53136749A
JPS53136749A JP5067577A JP5067577A JPS53136749A JP S53136749 A JPS53136749 A JP S53136749A JP 5067577 A JP5067577 A JP 5067577A JP 5067577 A JP5067577 A JP 5067577A JP S53136749 A JPS53136749 A JP S53136749A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
heat
pipe
ends
inside
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5067577A
Other versions
JPS5644354B2 (en )
Inventor
Ken Ogiso
Etsuro Sasaki
Original Assignee
Nippon Telegr & Teleph Corp <Ntt>
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Abstract

PURPOSE:To make inside of connecter heat pipe structure and to connect number of heat pipe cooling ends and heating ends with low temperature resistances in series.
JP5067577A 1977-05-04 1977-05-04 Expired JPS5644354B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5067577A JPS5644354B2 (en) 1977-05-04 1977-05-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5067577A JPS5644354B2 (en) 1977-05-04 1977-05-04

Publications (2)

Publication Number Publication Date
JPS53136749A true true JPS53136749A (en) 1978-11-29
JPS5644354B2 JPS5644354B2 (en) 1981-10-19

Family

ID=12865506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5067577A Expired JPS5644354B2 (en) 1977-05-04 1977-05-04

Country Status (1)

Country Link
JP (1) JPS5644354B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134377U (en) * 1984-07-31 1986-03-03
WO2003046463A2 (en) * 2001-11-27 2003-06-05 Parish Overton L Stacked low profile cooling system and method for making same
US6988315B2 (en) 1998-06-08 2006-01-24 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
JP2013012068A (en) * 2011-06-29 2013-01-17 Nec Computertechno Ltd Heat sink cooler
JPWO2013111815A1 (en) * 2012-01-27 2015-05-11 古河電気工業株式会社 Heat transport device
US20160021791A1 (en) * 2014-07-18 2016-01-21 Intel Corporation Server thermal management with heat pipes
US9877409B2 (en) 2001-11-27 2018-01-23 Thermotek, Inc. Method for automotive battery cooling

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50154854A (en) * 1974-06-04 1975-12-13
JPS53113356A (en) * 1977-03-16 1978-10-03 Oki Electric Cable Hollowed heat pipe and heat pipe junction structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50154854A (en) * 1974-06-04 1975-12-13
JPS53113356A (en) * 1977-03-16 1978-10-03 Oki Electric Cable Hollowed heat pipe and heat pipe junction structure

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134377U (en) * 1984-07-31 1986-03-03
US6988315B2 (en) 1998-06-08 2006-01-24 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US7322400B2 (en) 1998-06-08 2008-01-29 Thermotek, Inc. Cooling apparatus having low profile extrusion
WO2003046463A2 (en) * 2001-11-27 2003-06-05 Parish Overton L Stacked low profile cooling system and method for making same
WO2003046463A3 (en) * 2001-11-27 2003-09-12 Overton L Parish Stacked low profile cooling system and method for making same
US6834712B2 (en) 2001-11-27 2004-12-28 Thermotek, Inc. Stacked low profile cooling system and method for making same
US9877409B2 (en) 2001-11-27 2018-01-23 Thermotek, Inc. Method for automotive battery cooling
JP2013012068A (en) * 2011-06-29 2013-01-17 Nec Computertechno Ltd Heat sink cooler
JPWO2013111815A1 (en) * 2012-01-27 2015-05-11 古河電気工業株式会社 Heat transport device
US20160021791A1 (en) * 2014-07-18 2016-01-21 Intel Corporation Server thermal management with heat pipes

Also Published As

Publication number Publication date Type
JPS5644354B2 (en) 1981-10-19 grant
JP1096054C (en) grant

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