JP2013011417A - Adsorption heat pump, and information processing system using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the performance of an adsorption heat pump from being deteriorated, in the adsorption heat pump and an information processing system using the pump.SOLUTION: The adsorption heat pump includes: an evaporator which evaporates a refrigerant; an adsorber which is connected with the evaporator and alternately switches the adsorption of the refrigerant evaporated in the evaporator and the desorption of the adsorbing refrigerant; and a condenser which is connected with the adsorber and condenses the refrigerant desorbed from the adsorber. The adsorption heat pump includes a valve 21 for preventing the backflow of the refrigerant. The valve 21 includes: a seat 41 on which a through-hole 41a is formed; and a sheet-like valve element 42 installed on the seat 41. The valve includes irregularities 41b on a surface of the seat 41 around the through-hole 41a.

Description

  The present invention relates to an adsorption heat pump and an information processing system using the same.

  In recent years, in addition to the advancement of electronic devices, the development of advanced information communication networks has led to a significant increase in the number of data centers equipped with a large number of blade servers and storage servers that handle large amounts of data. Waste heat energy is also increasing.

  In particular, in data centers and the like, blade servers are generally equipped with multiple boards per rack to improve data processing capacity. In this blade server, the power consumption per rack is several kW or more and high power. It has become.

  Along with such an increase in waste heat energy, various cooling technologies such as a CPU (Central Processing Unit) that is a heat generation source have been studied. For example, in air-cooled cooling technology, in a server room installed in a large data center or building, a dedicated air conditioner is used to circulate cool air inside the room, and this cold air is introduced into the server rack using a fan. By doing so, CPU etc. are cooled.

  However, such an air-cooled cooling technique consumes a large amount of electric power in order to generate sufficient cold air, so there are problems in terms of cost reduction and environmental problems.

  Therefore, an adsorption-type cold heat pump has attracted attention as a technique for recovering waste heat from an electronic device such as a server and reusing it.

  In the adsorption heat pump, after the adsorption process for adsorbing the refrigerant to the adsorbent, the refrigerant is desorbed from the adsorbent by the heat of a heating fluid such as water that has carried waste heat in a process called a desorption process. And in this desorption process, a heating fluid is cooled using heat absorption of an adsorbent, and an electronic device etc. are cooled with the heating fluid after the cooling.

  On the other hand, in the above adsorption process, the refrigerant put in the evaporator is evaporated and adsorbed on the adsorbent. At this time, cold heat can be obtained by the heat of vaporization when the refrigerant evaporates, and waste heat can be effectively utilized by supplying cold air into the server room or the rack with this cold heat.

  And by repeating such an adsorption process and a desorption process, it becomes possible to perform recovery of waste heat and generation of cold heat continuously.

Japanese Patent Laid-Open No. 9-152221 JP 2009-198163 A International Publication No. 2006/135026

High performance chemical heat pump application examples, Science Forum

  In an adsorption heat pump and an information processing system using the same, an object is to prevent a decrease in performance of the adsorption heat pump.

  According to one aspect of the disclosure below, an evaporator that evaporates a refrigerant, and an adsorber that is connected to the evaporator and alternately switches between adsorption of the refrigerant evaporated by the evaporator and desorption of the adsorbed refrigerant. A condenser connected to the adsorber and condensing the refrigerant desorbed from the adsorber, and having a valve between at least one of the evaporator and the adsorber and between the adsorber and the condenser The valve includes a pedestal portion in which a through-hole is formed and a sheet-like valve body installed on the pedestal portion, and the surface of the pedestal portion around the through-hole is uneven. An adsorption heat pump in which is formed is provided.

  According to another aspect, an evaporator that evaporates a refrigerant, an adsorber that is connected to the evaporator and alternately switches between adsorption of the refrigerant evaporated by the evaporator and desorption of the adsorbed refrigerant; A condenser connected to the adsorber and condensing the refrigerant desorbed from the adsorber, wherein a valve is provided between at least one of the evaporator and the adsorber and between the adsorber and the condenser. The valve includes a pedestal portion in which a through hole is formed and a sheet-like valve body installed on the pedestal portion, and the surface of the pedestal portion around the through hole has irregularities. An information processing system having the formed adsorption heat pump and an electronic device cooled by the adsorption heat pump is provided.

  In the disclosed adsorption heat pump and an information processing system using the same, irregularities are formed on the surface of the pedestal around the through hole. As a result, the contact area between the valve body and the pedestal portion is reduced, and refrigerant condensed between the valve body and the pedestal portion can be excluded from these contact portions, and the valve body is stretched on the pedestal by the surface tension of the condensed refrigerant. In addition, it is possible to prevent the problem that the adsorption heat pump stops operating.

  Further, since the adsorbent debris can be accommodated in the unevenness, it is possible to prevent a problem that the performance of the adsorption heat pump is deteriorated because the valve is not completely closed.

FIG. 1 is a cross-sectional view of an adsorption heat pump. FIG. 2 is a cross-sectional view of the valve of the adsorption heat pump of FIG. FIG. 3 is a cross-sectional view of the adsorption heat pump according to the first embodiment. FIG. 4 is a view of a valve of the adsorption heat pump according to the first embodiment. FIG. 5 is a cross-sectional view for explaining the operation of the valve of FIG. FIG. 6 is a cross-sectional view showing an example of hydrophilic processing and water repellent processing on the valve of FIG. FIG. 7 is a view showing a pedestal portion of the valve according to the second embodiment. FIG. 8 is a cross-sectional view for explaining the operation of the valve according to the second embodiment. FIG. 9 is a block diagram of an information processing system according to the third embodiment.

(1) Preliminary items Prior to the description of the embodiments, basic preliminary items will be described.

  FIG. 1 is a cross-sectional view of an adsorption heat pump.

  The adsorption heat pump 30 includes a first adsorber 1, a second adsorber 2, an evaporator 3, and a condenser 4 each having a reduced pressure inside, and a valve 11 provided therebetween. .

  Among these, silica gel is accommodated as the adsorbent 17 in the first and second adsorbers 1 and 2, and water as the refrigerant 18 is accommodated in the evaporator 3. Note that zeolite may be used as the adsorbent 17 instead of silica gel.

  On the other hand, the valve 11 is provided on a partition wall that partitions the first and second adsorbers 1 and 2, the evaporator 3, and the condenser 4 as illustrated.

FIG. 2 is a cross-sectional view of the valve of the adsorption heat pump of FIG. As shown in FIG. 2A, each valve 11 includes a pedestal portion 31 provided with a plurality of through holes 31 a and a film-like valve body 32 provided on the pedestal portion 31. . One end of the valve body 32 is joined on the pedestal portion 31, and the other end (free end) side is deformed according to the pressure difference between the lower region and the upper region of the pedestal portion 31. 11 is opened and closed. For example, when the pressure P _{1 in} the lower region of the pedestal 31 is higher than the pressure P _{2 in the} upper region (P ₁ > P ₂ ), the free end side of the valve body 32 floats as shown in FIG. As a result, the valve 11 is opened. When the pressure P _{1 in} the lower region of the partition wall 31 becomes lower than the pressure P _{2 in the} upper region (P ₁ <P ₂ ), the valve body 32 covers the through hole 31a as shown in FIG. In this way, the valve 11 is closed.

  The valve 11 is opened and closed spontaneously according to changes in pressure (vapor pressure) in the first and second adsorbers 1 and 2, so that the adsorption process of the first and second adsorbers 1 and 2 is performed. And the desorption process is switched.

  For example, in the open / closed state of the valve 11 as shown in FIG. 1, the adsorption process is performed in the first adsorber 1, and the desorption process is performed in the second adsorber 2.

  In the first adsorber 1 in which the adsorption step is performed, the vapor of the refrigerant 18 is reduced by being adsorbed by the adsorbent 17, so that the vapor pressure in the first adsorber 1 is lower than that of the evaporator 3 and the condenser 4. Also lower. Therefore, the lower valve 11 of the first adsorber 1 is opened and the upper valve 11 is closed. Then, the vapor of the refrigerant 18 evaporated in the evaporator 3 is supplied to the first adsorber 1 through the lower valve 11, and the vapor is adsorbed by the adsorbent 17. The heat generated in the adsorbent 17 at the time of adsorption is cooled by a cooling fluid 9 such as cooling water flowing through the internal pipe 7.

  The cooling fluid 9 is, for example, cooling water, and its temperature is about 25 ° C. immediately before entering the first adsorber 1. The cooling fluid 9 immediately after exiting the first adsorber 1 is warmed to about 30 ° C. by the adsorbent 17 that has generated heat by adsorbing the refrigerant 18.

  On the other hand, in the second adsorber 2 in which the desorption process is performed, the heating fluid 6 carrying the waste heat from the electronic device such as the server is flowed to the internal pipe 7, and the refrigerant 18 is transferred from the adsorbent 17 by the heat. Desorbed. As a result, the vapor pressure in the second adsorber 2 is increased, so that the upper valve 11 of the second adsorber 2 is opened and the lower valve 11 is closed. At this time, since the adsorbent 17 absorbs heat, the heating fluid 6 is cooled. For example, when the temperature of the heating fluid immediately before entering the second adsorber 2 is 75 ° C., the temperature of the heating fluid 6 decreases to about 70 ° C. immediately after leaving the second adsorber 2.

  The heated fluid 6 thus cooled is used to cool the electronic device, and then returns to the second adsorber 2 to be cooled again.

  The evaporator 3 stores a refrigerant 18 and a circulation pipe 10 through which a circulating fluid 5 such as water flows. When the adsorption process is performed in the first adsorber 1, the circulating fluid 5 is cooled by the heat of vaporization of the refrigerant 18, and the circulating fluid 5 is cooled to a temperature about 5 ° C. lower than that before entering the evaporator 3. be able to.

  On the other hand, the vapor | steam of the refrigerant | coolant 18 is supplied to the condenser 4 from the 2nd adsorption device 2 in which the desorption process is performed. The vapor is cooled and liquefied by the cooling water 15 flowing through the cooling pipe 8 and then returned to the evaporator 18 through the refrigerant recovery pipe 16. The temperature of the cooling water 15 is about 25 ° C. immediately before entering the condenser 4, but the temperature rises to about 30 ° C. immediately after leaving the condenser 4.

  In such a series of processes, the refrigerant 18 is desorbed from the adsorbent 17 by the heat of the heating fluid 6, and the circulating fluid 5 is cooled by the heat of vaporization of the refrigerant 18 in the evaporator 3. Is reused to generate cold heat of the circulating fluid 5. The cold heat is used, for example, to supply cold air into a server room or a rack.

  Here, when the desorption process is performed in the second adsorber 2 as described above, the drying of the adsorbent 17 in the second adsorber 2 proceeds, and the heating fluid 6 is cooled using the heat absorption of the adsorbent 17. Efficiency decreases gradually.

  Therefore, when a predetermined amount of the refrigerant 18 is desorbed from the adsorbent 17 in the second adsorber 2, the adsorption process and the desorption process in each of the adsorbers 1 and 2 are switched. The switching is performed by flowing the heating fluid 6 through the internal pipe 7 of the first adsorber 1 and flowing the cooling fluid 9 through the internal pipe 7 of the second adsorber 2.

  By the way, if the adsorption heat pump 30 is operated for a long period of time, there may be a problem that the operation is stopped or the cooling efficiency is lowered.

  As a result of various investigations by the inventors of the present application, the operation stop of the adsorption heat pump 30 is caused by the valve body 32 (see FIG. 2B) and the pedestal portion 31 due to the surface tension of the refrigerant condensed around the valve 11. It became clear that the cause was that the valve 11 could not be opened due to the close contact.

  In addition, the cooling efficiency of the adsorption heat pump 30 decreases because, for some reason, debris or powder of the adsorbent 17 adheres between the valve body 32 and the pedestal 31 and the valve 11 is not completely closed by this powder. It became clear that it occurred at.

  The inventor of the present application has come up with an embodiment described below based on such knowledge.

(2) First Embodiment FIG. 3 is a cross-sectional view of the adsorption heat pump according to the present embodiment, and FIG. 4 is a view of the valve of the adsorption heat pump of FIG.

  As shown in FIG. 3, the adsorption heat pump 40 includes first and second adsorbers 1 and 2, an evaporator 3, an evaporator 4, and a valve 21 provided between the partition walls 23. Is provided. The adsorption heat pump 40 of the present embodiment is the same as the adsorption heat pump 30 described with reference to FIG. 1 except for the valve 21, and the same components are denoted by the same reference numerals and the description thereof is omitted.

  As illustrated in FIG. 4A, the valve 21 includes a pedestal portion 41 attached to the opening 23 a of the partition wall 23, and a valve body 42 disposed so as to cover the pedestal portion 41.

  The valve body 42 is made of a flexible resin film such as PET (Poly-Ethylene Terephthalate) resin, and one end (fixed end) thereof is fixed to the partition wall 23 by a method such as screwing as shown in FIG. ing.

  On the other hand, as shown in the plan view of FIG. 4 (b), the pedestal portion 41 is a rectangular plate-like member provided with a plurality of through holes 41 a penetrating in the thickness direction. An annular recess (groove) 41b is provided on the upper surface of the substrate so as to surround the periphery of the through hole 41a. The recess 41b is formed to have a width and depth sufficient to accommodate the refrigerant condensed by the valve 11 and the adsorbent 17 powder. However, in order to prevent the refrigerant from leaking from the recess 41b when the valve 11 is closed, the recess 41b has a depth that does not penetrate in the thickness direction of the pedestal 41.

  5A and 5B are cross-sectional views for explaining the operation of the valve 21. FIG.

When the pressure P _{1 in} the lower area of the valve 21 is higher than the pressure P _{2 in the} upper area (P ₁ > P ₂ ) as shown in FIG. The free end side of the body 42 is lifted and the valve 21 is opened. In this state, the refrigerant vapor passes through the valve 21 through the through hole 41a.

On the other hand, when the pressure P _{1 in} the lower region of the partition wall 35 is lower than the pressure P _{2 in the} upper region (P ₁ <P ₂ ) as shown in FIG. 42 is pressed against the upper surface of the pedestal 41. The valve body 42 is in close contact with the upper surface of the pedestal 41 between the through hole 41a and the recess 41b, so that the through hole 41a is closed and the valve 21 is closed.

  At this time, since the concave portion 41b is provided on the surface of the pedestal portion 41, the refrigerant condensed between the pedestal portion 41 and the valve body 42 is excluded in the concave portion 41b. Moreover, the contact area of the valve body 42 and the base part 41 becomes small by the recessed part 41b. Therefore, even if the condensed refrigerant remains between the valve body 42 and the pedestal portion 41, the adhesion force between the valve body 42 and the pedestal portion 41 due to the surface tension of the condensed refrigerant can be weakened. Thereby, the malfunction which the valve body 42 sticks to the base part 41 and cannot move with the surface tension of the condensed refrigerant | coolant can be prevented.

  Moreover, since the recessed part 41b can accommodate the powder of the adsorbent 17 dropped to the pedestal part 41 to some extent, it is possible to prevent the operation efficiency of the adsorption heat pump 40 from being lowered.

  In the valve 21 described above, hydrophilic processing is selectively performed on the inside of the recess 41a of the pedestal portion 41 as described below, and the surface of the pedestal portion 41 that contacts the valve body 42 is subjected to water repellency processing. May be.

  FIG. 6 is a schematic diagram illustrating an example of hydrophilic processing and water repellent processing of the pedestal portion 41.

  First, as shown in FIG. 6A, a pedestal portion 41 is prepared. The pedestal portion 41 is produced by, for example, forming a through hole 41a and a recess 41b in a metal plate such as an aluminum plate by machining.

  Next, as shown in FIG. 6B, a mask 46 is formed on the upper surface of the pedestal portion 41 excluding the concave portion 41 b. The mask 46 can be formed by, for example, a method of attaching a masking tape shaped into a predetermined shape, or a method of applying an oil-based paint to the convex portion with a brush or the like.

  Next, as shown in FIG. 6C, from the upper side of the pedestal 41, a hydrophilic agent such as a commercially available silica-based coating solution is applied to make the mask 46, the recess 41b of the pedestal 41, and the inner walls of the through holes 41a hydrophilic. Covering with a material 47.

  Thereafter, as shown in FIG. 6D, the hydrophilic material 47 on the mask 46 is removed together with the mask 46 to leave the hydrophilic material only in the through holes 41a and the recesses 41b.

  Next, as shown in FIG. 6E, a water repellent agent is selectively applied to a portion other than the concave portion 41 b on the upper surface of the pedestal portion 41 and covered with a water repellent material 48. Here, as the water repellent material 48, for example, a commercially available Teflon coating liquid can be used. If this is adjusted to an appropriate viscosity and applied with a brush or the like, it is selectively repelled on the upper surface other than the recess 41 b. A water material 48 can be applied.

  As described above, a water repellent process is performed on the upper surface of the pedestal part 41 excluding the recessed part 41b, and the pedestal part 41 in which the recessed part 41b is subjected to a hydrophilic process is obtained. According to the pedestal portion 41 subjected to such hydrophilic processing and water repellent processing, the condensed refrigerant easily flows from the contact portion between the pedestal portion 41 and the valve body 42 to the concave portion 41b side. Therefore, it becomes easier for the valve body 42 to remove the refrigerant droplets at the contact portion with the pedestal portion 41, and the sticking of the valve body 42 to the pedestal portion 41 is less likely to occur.

  In addition, you may give a hydrophilic process not only to the recessed part 41b but to the surface by the side of the base part 41 of the valve body 42. FIG.

(3) Experimental example of 1st Embodiment Hereinafter, the experimental example which this inventor performed is demonstrated.

  200 g of silica gel (RD2060 manufactured by Fuji Silysia Chemical Ltd.) was filled as the adsorbent 17 in the first and second adsorbers 1 and 2 (see FIG. 3). The evaporator 3 was filled with water as a refrigerant.

  A valve 21 shown in FIG. 4 was installed at the connection portion of the first adsorber 1, the second adsorber 2, the evaporator 3, and the condenser 4. Here, a total of 15 through holes 41a having a diameter φ of 5 mm are provided in a pedestal portion 41 of the bulb 21 in a region of 60 mm × 50 mm at a pitch of 15 mm. Further, around each through hole 41a, a recess 41b made of an annular groove having a diameter φ of 10 mm, a width of 2 mm and a depth of 2 mm was provided, and hydrophilic processing was performed in the recess 41b.

  In addition, the valve body 42 was formed of a PET resin film having an area of about 60 mm × 50 mm, and the surface in contact with the pedestal 41 was subjected to hydrophilic processing.

  One adsorber of such an adsorption heat pump was supplied with 65 ° C. warm water (heating fluid) at 2 L / min, and the other adsorber was supplied with 25 ° C. water (cooling fluid) at 2 L / min. The operation was performed by switching the supply of hot water and cold water to each adsorber every 10 minutes.

  Note that the circulating fluid was circulated through the evaporator 3 at a flow rate of 1 L / min so that the cold water take-out temperature was 15 ° C. and the return temperature was 18 ° C.

  In the experimental examples as described above, it was confirmed that water (refrigerant) condensed by the valve 21 can be removed to the concave portion 41b of the pedestal portion 41, and the opening / closing failure of the valve 21 can be prevented. Further, it was confirmed that the water collected in the recess 41b was vaporized during the opening / closing operation of the valve 21 and operated continuously without water being accumulated in the recess 41b.

(4) 2nd Embodiment In this embodiment, the shape of the base part of a valve differs from the shape of the base part 41 of the valve | bulb 21 shown in FIG.

  FIG. 7 is a view showing a pedestal portion of the valve according to the present embodiment.

  As shown in the perspective view of FIG. 7A, the pedestal 51 is formed with a plurality of through holes 51a penetrating in the thickness direction, an annular recess (groove) 51b, and a linear groove 51c. Has been. The upper end side of the through hole 51a is chamfered to form a mortar-shaped inclined surface 51e. The inclined surface 51e reduces the contact area between the valve body 42 and the pedestal 51, and makes it easier for the condensed refrigerant to flow to the through hole 41a side. Furthermore, a plurality of grooves 51d extending in the thickness direction of the pedestal 51 are provided on the inner wall of the through hole 51a. The groove 51d allows the coolant droplets flowing into the through hole 51a to flow downward without accumulating in the through hole 51a.

  The linear groove 51c on the upper surface of the pedestal 51 extends to the peripheral edge of the pedestal 51, and is connected to the recess 51b as shown in the partially enlarged view of FIG. As a result, the coolant droplets collected in the recess 51b can be discharged to the outside of the pedestal 51 through the groove 51c.

  8A and 8B are cross-sectional views showing the operation of the valve according to this embodiment.

As shown in FIG. 8A, when the pressure P _{1 in} the lower region of the valve 50 is higher than the pressure P _{2 in the} upper region (P ₁ > P ₂ ), it is arranged on the upper surface side of the pedestal 51. The free end side of the valve body 42 is lifted by the pressure difference. And the vapor | steam of a refrigerant | coolant passes through the valve | bulb 50 through the through-hole 51a of the base part 51. FIG.

On the other hand, when the pressure P _{1 in} the lower region of the valve 50 is lower than the pressure P _{2 in the} upper region (P ₁ <P ₂ ) as shown in FIG. Is pressed against the upper surface side of the pedestal 51, the through hole 51a is closed, and the valve 50 is closed.

  At this time, the refrigerant condensed in the valve 50 is removed from the contact portion between the valve body 42 and the pedestal 51 to the recess 51b or the inclined surface 51e, and is discharged outside the pedestal 51 through the groove 51c or the groove 51d of the through hole. . Thereby, accumulation | storage of the refrigerant | coolant in the recessed part 51b can be prevented. Further, since the inclined surface 51e and the groove 51c are formed in addition to the recess 51b, the contact area between the valve body 42 and the pedestal portion 51 is further reduced, and the valve body 42 and the pedestal portion 51 due to the surface tension of the condensed refrigerant. The adhesion strength with can be suppressed.

  Moreover, since the powder of the adsorbent 17 that has fallen on the surface of the pedestal 51 can flow out together with the refrigerant to the outside of the pedestal 51 through the groove 51c, it is difficult for the valve 50 to be closed.

  As described above, according to the valve 50 according to the present embodiment, it is possible to more effectively prevent the valve from opening and closing, and the adsorption heat pump 40 can be stably operated for a long period of time.

  In this embodiment as well, hydrophilic processing may be applied to the surfaces of the recess 51b, the groove 51c, and the inclined surface 51e of the pedestal 51, and water repellent processing may be applied to the portion where the pedestal 51 and the valve body 42 are in contact.

(5) Third Embodiment FIG. 9 is a block diagram of an information processing system according to a third embodiment.

  The information processing system 80 includes an adsorption heat pump 40, an electronic device 70, a fluid switch 61, a cooling tower 62, and an air conditioner 63. The adsorption heat pump 40 of the present embodiment is the same as the adsorption heat pump 40 (first embodiment) shown in FIG. 3, and the same elements are denoted by the same reference numerals and description thereof is omitted.

  The electronic device 70 is, for example, a server or the like, and electronic components such as a CPU 71, an HDD (Hard Disc Drive) 72, and a power supply device 73 that have a relatively large amount of heat generation are incorporated therein. A cooling pipe 74 for cooling these electronic components is provided inside the electronic device 70. Electronic components in the electronic device 70 are cooled by the heating fluid 6 flowing in the cooling pipe 74. The heated fluid 6 whose temperature has been increased by cooling the electronic device 70 is sent to the adsorption heat pump 40 via the fluid switch 61.

  On the other hand, the cooling tower 62 cools the cooling fluid 9 and the cooling water 15 from the adsorption heat pump 40 by heat exchange with the outside air.

  The fluid switch 61 switches the heating fluid 6 and the cooling fluid 9 supplied to the first adsorber 1 and the second adsorber 2 at regular intervals (for example, 10 minutes) under the control of the built-in control device. . In the first adsorber 1 and the second adsorber 2, the adsorption process and the desorption process are alternately performed.

  Cooling water 15 is supplied to the condenser 4 from the cooling tower 62, and the refrigerant vapor evaporated in the desorption process is condensed. The refrigerant condensed in the condenser 4 is returned to the evaporation chamber 3 through the refrigerant recovery pipe 16.

  In the evaporator 3, the refrigerant continuously evaporates to generate cold heat, and this cold heat is supplied to the air conditioner 63 through the circulating fluid 5 passing through the pipe 64. The air conditioner 63 cools the inside of the server room in which the electronic device 70 is installed using this cold energy.

  In the information processing system 80 as described above, since the adsorption heat pump 40 is used, cooling of the electronic device 70 and cooling using the waste heat can be stably performed for a long time.

  The following additional notes are disclosed with respect to the above embodiments.

(Appendix 1) an evaporator for evaporating the refrigerant;
An adsorber that is connected to the evaporator and alternately switches between adsorption of the refrigerant evaporated by the evaporator and desorption of the adsorbed refrigerant;
A condenser connected to the adsorber and condensing the refrigerant desorbed from the adsorber, and
A valve is disposed between at least one of the evaporator and the adsorber and between the adsorber and the condenser;
The valve includes a pedestal portion in which a through hole is formed and a sheet-like valve body installed on the pedestal portion, and an unevenness is formed on a surface of the pedestal portion around the through hole. This is an adsorption heat pump.

  (Additional remark 2) The adsorption | suction heat pump of Additional remark 1 characterized by the groove | channel extended in the thickness direction of the said base part being formed in the side wall of the said through-hole.

  (Appendix 3) The adsorption heat pump according to appendix 1 or appendix 2, wherein the end of the through hole on the valve body side is chamfered.

  (Additional remark 4) The said unevenness | corrugation is equipped with the cyclic | annular recessed part formed in the circumference | surroundings of the said through-hole, and the groove | channel extended to the peripheral part of the said base part connected with this recessed part, The additional note 1 characterized by the above-mentioned. The adsorption heat pump of any one of thru | or appendix 3.

  (Additional remark 5) The said refrigerant | coolant is water, The recessed part of the said unevenness | corrugation is covered with the hydrophilic material, The adsorption heat pump of any one of Additional remark 1 thru | or Additional remark 4 characterized by the above-mentioned.

  (Additional remark 6) The part which contacts the said valve body of the said base part is covered with the water-repellent material, The adsorption heat pump of Additional remark 5 characterized by the above-mentioned.

  (Appendix 7) In any one of appendices 1 to 6, wherein the through hole of the pedestal portion is formed in a columnar shape, and the concave and convex portions are concave portions formed concentrically around the through hole. The adsorption heat pump described.

  (Additional remark 8) The adsorption type heat pump of Additional remark 5 or Additional remark 6 characterized by the surface of the said base part side of the said valve body being covered with the hydrophilic material.

(Supplementary note 9) An evaporator for evaporating a refrigerant, an adsorber connected to the evaporator, and alternately switching between adsorption of the refrigerant evaporated by the evaporator and desorption of the adsorbed refrigerant, and connection to the adsorber A condenser for condensing the refrigerant desorbed from the adsorber, and a valve is disposed between at least one of the evaporator and the adsorber and between the adsorber and the condenser, The valve includes a pedestal portion in which a through hole is formed and a sheet-like valve body installed on the pedestal portion, and a surface of the pedestal portion around the through hole has an unevenness formed on the surface. A heat pump,
Electronic equipment cooled by the adsorption heat pump;
An information processing system comprising:

(Supplementary Note 10) A cooling tower for cooling the cooling fluid supplied to the adsorber;
A fluid switch that supplies the adsorber while switching the heating fluid heated by the electronic device and the cooling fluid cooled by the cooling tower at regular intervals;
An air conditioner for cooling with the cold generated in the evaporator;
The information processing system according to claim 9, further comprising:

  DESCRIPTION OF SYMBOLS 1 ... 1st adsorber, 2 ... 2nd adsorber, 3 ... Evaporator, 4 ... Condenser, 5 ... Circulating fluid, 6 ... Heating fluid, 7 ... Internal piping, 8 ... Cooling piping, 9 ... Cooling fluid DESCRIPTION OF SYMBOLS 10 ... Circulation piping, 11, 21, 50 ... Valve, 15 ... Cooling water, 16 ... Refrigerant recovery piping, 17 ... Adsorbent, 18 ... Refrigerant, 30, 40 ... Adsorption heat pump, 31, 41, 51 ... Pedestal part 31a, 41a, 51a ... through-hole, 32, 42 ... valve body, 33 ... partition wall, 41b, 51b ... recess, 46 ... mask, 47 ... hydrophilic material, 48 ... water repellent material, 51c, 51d ... groove, 51e ... Inclined surface.

Claims (5)

An evaporator for evaporating the refrigerant;
An adsorber that is connected to the evaporator and alternately switches between adsorption of the refrigerant evaporated by the evaporator and desorption of the adsorbed refrigerant;
A condenser connected to the adsorber and condensing the refrigerant desorbed from the adsorber, and
A valve is disposed between at least one of the evaporator and the adsorber and between the adsorber and the condenser;
The valve includes a pedestal portion in which a through hole is formed and a sheet-like valve body installed on the pedestal portion, and an unevenness is formed on a surface of the pedestal portion around the through hole. This is an adsorption heat pump.   The adsorption heat pump according to claim 1, wherein a groove extending in a thickness direction of the pedestal portion is formed in a side wall of the through hole.   The adsorption heat pump according to claim 1 or 2, wherein an end of the through hole on the valve body side is chamfered.   The said unevenness | corrugation is equipped with the cyclic | annular recessed part formed in the circumference | surroundings of the said through-hole, and the groove | channel extended to the peripheral part of the said base part connected with this recessed part, The Claim 1 thru | or Claim characterized by the above-mentioned. 4. The adsorption heat pump according to any one of 3 above. An evaporator that evaporates the refrigerant; an adsorber that is connected to the evaporator and alternately switches between adsorption of the refrigerant evaporated by the evaporator and desorption of the adsorbed refrigerant; and is connected to the adsorber and the adsorption A condenser for condensing the refrigerant desorbed from the condenser, and a valve is disposed between at least one of the evaporator and the adsorber and between the adsorber and the condenser. An adsorption heat pump in which irregularities are formed on the surface of the pedestal portion around the through hole, including a pedestal portion in which a hole is formed and a sheet-like valve body installed on the pedestal portion;
Electronic equipment cooled by the adsorption heat pump;
An information processing system comprising:

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