CN110854091A - Anti-condensation device based on liquid cooling plate soaking - Google Patents
Anti-condensation device based on liquid cooling plate soaking Download PDFInfo
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- CN110854091A CN110854091A CN201911261437.XA CN201911261437A CN110854091A CN 110854091 A CN110854091 A CN 110854091A CN 201911261437 A CN201911261437 A CN 201911261437A CN 110854091 A CN110854091 A CN 110854091A
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- H01—ELECTRIC ELEMENTS
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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Abstract
The utility model provides a prevent condensation device based on soaking of liquid cooling plate, prevent that condensation device has the inside volume that supplies the coolant circulation to and the heat-transfer face that needs the heat source contact of heat transfer with the outside, the cooling surface that contacts with the external environment, outside heat-transfer face with be provided with isolating device between the outside cooling surface, isolating device will inside volume keeps apart into cold water passageway layer and hot water passageway layer, cold water passageway layer at least partially with the heat-transfer face contacts, hot water passageway layer at least partially with the cooling surface contacts, the coolant passes through the coolant import and gets into cold water passageway layer with behind the heat-transfer face heat transfer, the process hot water passageway layer is exported again through the coolant. The partition plate for the anti-condensation device based on soaking of the liquid cooling plate divides the liquid cooling plate into the hot water channel and the cold water channel, and enables the heated cooling liquid in the cold water channel to flow back to the hot water channel, so that the temperature of the wall surface of the liquid cooling plate, which is in contact with the environment, is increased, and the wall surface is prevented from condensation.
Description
Technical Field
The invention relates to the field of heat management systems, in particular to an anti-condensation device for uniform heat management by adopting a liquid cooling plate.
Background
With the refinement and intellectualization of electronic devices, the ultrahigh heat flux density seriously affects the safety and reliability of operation, and how to effectively radiate the electronic devices becomes an important problem to be solved urgently. The traditional cooling method of the electronic chip is air cooling, and the air cooling mainly enhances the heat dissipation capacity by increasing the rotating speed of a fan and increasing the size of fins. But neither of these approaches can meet the increasing heat dissipation requirements of chips. Liquid cooling has therefore begun to be used. The liquid cooling plate drives the cooling liquid to flow through a channel at the back of the chip by using a pump, and the cooling liquid exchanges heat with the chip to take away the heat of the chip. Since the coolant temperature is low, dew condensation may occur at the inlet due to an excessively low temperature when the coolant is carried in the passage in the liquid-cooled panel. Condensation is the phenomenon that when the moisture in the air reaches a saturated state, if the ambient temperature continues to drop or the surface temperature of equipment is lower than the dew point temperature of the nearby air, the supersaturated moisture in the air begins to be condensed into water to be separated out. When water droplets formed by condensation adhere to the surface of the equipment, on the one hand, corrosion of the equipment is accelerated, and on the other hand, the water droplets affect the flow in the gas phase pipeline or block the pressure guide pipeline.
The current solutions to the problem of condensation on the wall surface of the equipment mainly include the following:
patent CN201811027614 proposes an anti-condensation method and an anti-condensation device, which collects temperature and humidity data through a temperature sensor, calculates dew point temperature according to the obtained data, and then determines whether a difference between the obtained temperature and the dew point temperature is less than a preset value. If yes, the heater is started.
Patent CN201711133307 proposes a water tank condensation-proof coating, which is directly sprayed on the surface of equipment, and the coating is sprayed twice, so that the condensation-proof effect can be achieved when the paint film reaches 1 mm.
Patent CN201510946346 proposes an anti-condensation converter for a wind generating set and an anti-condensation control method, which detect the temperature and relative humidity inside and outside a converter body through a temperature sensor and a relative humidity sensor, compare and analyze the temperature and relative humidity, and finally start a control fan and/or a heat dissipation device to prevent the device from dewing.
The above methods can be categorized into three main groups: (1) ventilating and dehumidifying: moisture is discharged from the space where the equipment is located, or slight condensation on the surface of the equipment is directly dried, so that the water vapor is prevented from being accumulated; (2) chemical moisture absorption: absorbing moisture with various moisture absorbing materials, such as placing moisture absorbing agents in electrical equipment, or adding anti-condensation coatings on the surface of the equipment; (3) heating and drying: removing moisture by heating.
None of the three methods is suitable for preventing condensation of electronic devices, and the ventilation, dehumidification and heat drying in the above-mentioned condensation prevention measure are not suitable for use in a high-temperature and high-humidity environment. The chemisorbed coating in the above anti-condensation measure has a strong smell, and the adsorbing material has a short service life, needs to be replaced periodically, and has poor durability, thereby increasing the maintenance cost.
Disclosure of Invention
In order to guarantee the performance and the service life of the electronic chip, the invention provides a condensation preventing device based on liquid cooling plate soaking. The temperature of the outer surface of the low-temperature area of the equipment is raised to be higher than the dew point temperature, and meanwhile, the temperature of each wall surface is ensured to be uniformly distributed, and the wall surface is prevented from dewing.
More specifically, the invention provides a condensation preventing device based on soaking of a liquid cooling plate, wherein the condensation preventing device is provided with an inner volume for circulation of a coolant, a heat exchange surface in contact with a heat source needing heat exchange from the outside, and a cooling surface in contact with the outside, an isolating device is arranged between the outer heat exchange surface and the outer cooling surface, the isolating device isolates the inner volume into a cold water channel layer and a hot water channel layer, the cold water channel layer is at least partially in contact with the heat exchange surface, the hot water channel layer is at least partially in contact with the cooling surface, and the coolant enters the cold water channel layer through a coolant inlet, exchanges heat with the heat exchange surface, passes through the hot water channel layer and flows out through a coolant outlet.
Further, the cooling liquid inlet and the cooling liquid outlet are located on the same end face of the anti-condensation device, and the isolating device is arranged between the cooling liquid inlet and the cooling liquid outlet to isolate the cooling liquid inlet and the cooling liquid outlet.
Further, the isolation device is a partition board which encloses the inner volume into the cold water channel layer.
Furthermore, the partition board is made of a material with a small heat conductivity coefficient.
Furthermore, fins are arranged on the surface of the heat exchange surface, which is in contact with cooling water, so that the heat exchange area is increased to strengthen the heat exchange between the cooling liquid and the heat exchange surface.
Furthermore, the heat exchange surface and the cooling surface are formed by non-uniform reinforced heat exchange surfaces.
The invention also provides a heat exchange method, wherein the internal volume of the heat exchanger is divided into a cold water channel and a hot water channel by the partition plate, at least part of the cold water channel is in contact with the heat exchange surface of the heat exchanger, at least part of the hot water channel is in contact with the cooling surface of the heat exchanger, the heat exchange surface is in contact with a heat source needing heat exchange, and the cooling surface is in contact with the external environment and is used for heat dissipation, so that the cold water channel is communicated with the hot water channel.
Further, a coolant inlet is provided in communication with the cold water passage, a coolant outlet is provided in communication with the hot water passage, and the coolant inlet is separated from the coolant outlet using the partition plate.
Further, the coolant circulation length between the coolant inlet and the coolant outlet is made the longest.
Further, the cooling liquid inlet and the cooling liquid outlet are located on the same end face of the heat exchanger, so that the partition plate is located therebetween.
The partition plate for the anti-condensation device based on soaking of the liquid cooling plate divides the liquid cooling plate into the hot water channel and the cold water channel, and enables the heated cooling liquid in the cold water channel to flow back to the hot water channel, so that the temperature of the wall surface of the liquid cooling plate, which is in contact with the environment, is increased, and the wall surface is prevented from condensation.
The inner surface adopts the non-uniform reinforced heat exchange surface, thereby ensuring the uniform temperature distribution of the wall surface of the liquid cooling plate and effectively prolonging the service life of the equipment. More specifically, the present invention has the following advantages:
1. by adopting the method, the cooling effect of the liquid cooling plate is ensured, and meanwhile, the wall surface can be effectively prevented from dewing.
2. Green and environment-friendly, and can not cause pollution to the environment.
3. The packaging is carried out once, materials do not need to be replaced regularly, and the maintenance cost is saved.
4. The surface temperature is uniform, and the service life of the equipment is prolonged.
Description of the drawings:
FIG. 1 is a schematic perspective view of a liquid cold plate soaking based anti-condensation device according to the present invention;
fig. 2 is a sectional view of the condensation preventing device based on the liquid cold plate soaking of the present invention.
Detailed Description
The technical solution of the present invention will be described in more detail with reference to the accompanying drawings.
Referring to fig. 1-2, in order to prevent the wall surface of the liquid cooling plate in the electronic device from dewing, the embodiment of the present invention provides a novel method for preventing the wall surface of the liquid cooling plate from dewing, and the specific scheme is as follows:
the chip, namely the heat source, is placed on the top of the liquid cooling plate, and the cooling liquid enters from one side, exchanges heat with the heat source on the top and then flows out from the same side. The temperature of the wall surface of the liquid cooling plate far away from the heat source is lower and is lower than the dew point temperature of the surrounding environment. Therefore, the heated cooling liquid in the cold water channel flows back to the hot water channel under the action of the partition plate to raise the temperature of the wall surface of the liquid cooling plate, which is in contact with the environment, so as to prevent the liquid cooling plate from dewing. The hot water channel and the cold water channel are separated by the partition board, and the partition board can be made of materials with small heat conductivity coefficient such as PVC, PE and the like, so that heat exchange of cooling liquid in the two channels is reduced, and condensation prevention and cooling effects are effectively guaranteed. When the cooling liquid enters the channel, the temperature difference between the cooling liquid and the upper surface of the liquid cooling plate is large, and the heat exchange effect is good. As the cooling fluid continues to flow forward, heat exchange with the chip continues and the temperature gradually increases. The temperature difference between the cooling liquid and the upper surface is obviously smaller than that of the inlet/outlet at the position of the cold water channel far away from the inlet/outlet of the cooling liquid, so that the surface of the inner channel adopts a non-uniform reinforced heat exchange surface. The heat exchange between the cooling liquid and the upper surface of the liquid cooling plate can be enhanced by adding fins on the surface to increase the heat exchange area. The cold water channel carries out the intensive heat transfer at keeping away from coolant liquid business turn over exit, guarantees the radiating effect of coolant liquid to maintain the upper surface temperature even. Similarly, the hot water channel is reinforced near the inlet/outlet of the cooling liquid to improve the average temperature of the outer surface (bottom surface and side surface), and the service life of the liquid cooling plate can be prolonged to a certain extent by the uniform distribution of the wall surface temperature. Meanwhile, the flow of the cooling liquid in the hot water channel can be adjusted by changing the structure of the pipeline or the internal flow channel, so that the condensation of the surface of the liquid cooling plate contacted with the environment is avoided. The chip is placed on the upper surface of the liquid cooling plate, and the cooling medium enters from one end of the liquid cooling plate. The interior of the liquid cooling plate is divided into a hot water channel and a cold water channel by a partition plate, and the heated cooling liquid in the cold water channel flows back to the hot water channel under the action of the partition plate so as to increase the temperature of a wall surface in the liquid cooling plate, which is in contact with the environment, and prevent the liquid cooling plate from dewing. The surface of the internal channel adopts a non-uniform reinforced heat exchange surface, and the cold water channel is reinforced at the position far away from the inlet/outlet of the cooling liquid so as to maintain the temperature of the upper surface to be uniform. The hot water channel is reinforced near the cooling liquid inlet/outlet to raise the average temperature of the outer surface, and prolong the service life of the equipment. Meanwhile, the flow of the cooling liquid in the hot water channel can be adjusted by changing the structure of the pipeline or the internal flow channel, so that the condensation of the surface of the liquid cooling plate contacted with the environment is avoided.
In a specific embodiment, the cooling device further comprises a cooling liquid inlet section adjusting device and/or a cooling liquid outlet section adjusting device, a temperature sensor is arranged on the outer surface of the condensation preventing device, and a controller of the condensation preventing device controls the opening degree of the cooling liquid inlet section adjusting device and/or the cooling liquid outlet section adjusting device according to a temperature signal of the temperature sensor, so as to control the flow rate of the cooling liquid, and thus the temperature of the outer surface of the condensation preventing device is maintained above a preset level.
In another embodiment, the speed of the coolant pump can be controlled to control the flow rate of the coolant, and when the temperature of the element requiring heat exchange, such as a chip, is low, the flow rate of the coolant is controlled to maintain a low level to prevent the temperature of the cooling surface contacted by the hot water channel from being lower than the ambient temperature.
In another embodiment, the shape of the cooling water channel surrounded by the partition plate is determined according to the temperature distribution of the heat exchange surface. The ratio of the volume of the cooling water channel to the volume of the hot water channel is also determined according to the heat quantity to be exchanged and the area of the cooling surface.
The invention is a brand new technical scheme independent of the existing technical scheme, and has the key points that the hot water channel and the cold water channel are separated by the partition plate, and the heated cooling liquid in the cold water channel flows back to the hot water channel to increase the temperature of the wall surface in the liquid cooling plate, which is in contact with the environment, so that the condensation of the wall surface is effectively prevented. The key point of the invention is that the surface of the internal channel adopts a non-uniform reinforced heat exchange surface, so that the uniform temperature distribution of the wall surface of the liquid cooling plate is ensured, and the service life of the liquid cooling plate is effectively prolonged. The key point of the invention is that the flow of the cooling liquid in the hot water channel can be adjusted by changing the structure of the pipeline or the internal flow channel, so as to ensure that no dew condensation occurs on the surface of the liquid cooling plate contacting with the environment.
The above description is only a preferred embodiment of the method of the present invention and is not intended to limit the method of the present invention. In the practical implementation process, the size and structure of the liquid cooling plate, the ambient temperature and humidity, the inlet temperature and type of the cooling liquid, the material and size of the partition plate, and the application object may be changed or replaced. However, the above form of modification does not fundamentally alter the process of the present invention, namely: the hot water channel and the cold water channel are separated by the partition plate, and the heated cooling liquid in the cold water channel flows back to the hot water channel to raise the temperature of the wall surface in the liquid cooling plate, which is in contact with the environment, so that the wall surface is effectively prevented from dewing. Meanwhile, the surface of the internal channel adopts a non-uniform reinforced heat exchange surface, so that the uniform temperature of the wall surface of the liquid cooling plate is ensured, and the service life of the liquid cooling plate is effectively prolonged. They are therefore considered to be within the scope of the invention as defined by the claims.
Claims (10)
1. The utility model provides a prevent condensation device based on soaking of liquid cooling plate, its characterized in that, prevent the condensation device and have the inside volume that supplies the coolant circulation to and the heat-transfer face that needs the heat source contact of heat transfer with the outside, the cooling surface that contacts with the external environment, outside heat-transfer face with be provided with isolating device between the outside cooling surface, isolating device will inside volume keeps apart into cold water passageway layer and hot water passageway layer, cold water passageway layer at least partially with the heat-transfer face contacts, hot water passageway layer at least partially with the cooling surface contacts, the coolant passes through the coolant import and gets into cold water passageway layer with behind the heat-transfer face heat transfer, the process hot water passageway layer is exported again through the coolant.
2. The liquid cold plate soaking based condensation prevention device according to claim 1, wherein the coolant inlet and the coolant outlet are located on the same end surface of the condensation prevention device, and the isolation device is disposed between the coolant inlet and the coolant outlet to isolate the coolant inlet and the coolant outlet.
3. The liquid cold plate soaking based condensation prevention device of claim 1, wherein the isolation device is a partition that encloses the interior volume as the cold water channel layer.
4. The vapor condensation prevention device based on a liquid cooled plate according to any of claims 1 to 3, wherein the partition plate is made of a material having a low thermal conductivity.
5. The vapor condensation preventing device based on the liquid cooling plate as claimed in any one of claims 1 to 3, wherein the surface of the heat exchanging surface contacting the cooling water is provided with fins to increase the heat exchanging area to enhance the heat exchange between the cooling liquid and the heat exchanging surface.
6. The vapor soak prevention device according to any of claims 1 to 3 wherein the heat exchange surface and the cooling surface are formed with non-uniform enhanced heat exchange surfaces.
7. A method of heat exchange, comprising: the internal volume of the heat exchanger is divided into a cold water channel and a hot water channel through an isolating device, so that at least part of the cold water channel is in contact with a heat exchange surface of the heat exchanger, at least part of the hot water channel is in contact with a cooling surface of the heat exchanger, the heat exchange surface is in contact with a heat source needing heat exchange, and the cooling surface is in contact with the outside and used for heat dissipation, so that the cold water channel is communicated with the hot water channel.
8. A method of exchanging heat according to claim 7 wherein a coolant inlet is provided in communication with the cold water passageway, a coolant outlet is provided in communication with the hot water passageway, and the coolant inlet is separated from the coolant outlet by the separating means.
9. A method of exchanging heat according to claim 8 wherein the coolant flow length between the coolant inlet and the coolant outlet is maximized.
10. A method of exchanging heat according to claim 8 wherein the coolant inlet and the coolant outlet are located on the same end face of the heat exchanger such that the spacer means is located therebetween.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911261437.XA CN110854091B (en) | 2019-12-10 | 2019-12-10 | Anti-condensation device based on liquid cooling plate soaking |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911261437.XA CN110854091B (en) | 2019-12-10 | 2019-12-10 | Anti-condensation device based on liquid cooling plate soaking |
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| CN110854091A true CN110854091A (en) | 2020-02-28 |
| CN110854091B CN110854091B (en) | 2022-04-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114135951A (en) * | 2021-11-15 | 2022-03-04 | 中铁第四勘察设计院集团有限公司 | Dehumidification system and control method |
| CN114392510A (en) * | 2022-01-18 | 2022-04-26 | 江苏科技大学 | System and method for controlling environment of ship container |
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| JP2006245479A (en) * | 2005-03-07 | 2006-09-14 | Nichicon Corp | Device for cooling electronic component |
| US20060262502A1 (en) * | 2005-05-23 | 2006-11-23 | Je-Young Chang | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114392510A (en) * | 2022-01-18 | 2022-04-26 | 江苏科技大学 | System and method for controlling environment of ship container |
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