JP2013010843A - Organic/inorganic hybrid material - Google Patents
Organic/inorganic hybrid material Download PDFInfo
- Publication number
- JP2013010843A JP2013010843A JP2011143735A JP2011143735A JP2013010843A JP 2013010843 A JP2013010843 A JP 2013010843A JP 2011143735 A JP2011143735 A JP 2011143735A JP 2011143735 A JP2011143735 A JP 2011143735A JP 2013010843 A JP2013010843 A JP 2013010843A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- inorganic hybrid
- resin
- inorganic
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
Description
本発明は耐熱性の高い有機−無機ハイブリッド樹脂硬化物、およびそれを用いた半導体装置に関する。 The present invention relates to a cured organic-inorganic hybrid resin having high heat resistance and a semiconductor device using the same.
近年、電気・電子機器の高性能化，高速化により半導体素子からの発熱量が増加の一途をたどっており、半導体を封止する樹脂材料の耐熱性向上が望まれる。有機材料は低温では高弾性率，低熱膨張性を示すが、ある温度以上で弾性率の急激な低下や、熱膨張係数の急激な上昇が起こる。この温度をガラス転移温度と呼び、耐熱性の指標の一つとなる。更に高温になると激しい分子運動により結合の解裂が起こり、熱分解する。有機樹脂材料の場合、一定の昇温速度で昇温した場合の初期重量の９５％の時点の温度を５％重量減少温度とし、耐熱性の指標の一つとなる。ガラス転移温度や５％重量減少温度を向上させる方法として、温度に対する可動性が低い無機物を樹脂中に添加する方法が提案されている。例えば、特許文献１に加水分解性アルコキシシランと重縮合反応させたエポキシシリカハイブリッド、特許文献２にポリアミック酸に有機ケイ素化合物を付加反応させたポリイミド−シリカハイブリッドなどが例示されている。 In recent years, the amount of heat generated from semiconductor elements has been steadily increasing due to higher performance and higher speed of electric and electronic devices, and it is desired to improve the heat resistance of resin materials for sealing semiconductors. Organic materials exhibit high elastic modulus and low thermal expansion at low temperatures, but suddenly lower the elastic modulus and increase the thermal expansion coefficient above a certain temperature. This temperature is called the glass transition temperature and is one of the indices of heat resistance. When the temperature rises further, the bonds are broken by vigorous molecular motion, causing thermal decomposition. In the case of an organic resin material, the temperature at the time of 95% of the initial weight when the temperature is raised at a constant rate of temperature is defined as a 5% weight reduction temperature, which is one of heat resistance indexes. As a method for improving the glass transition temperature and the 5% weight loss temperature, a method has been proposed in which an inorganic substance having low mobility with respect to temperature is added to the resin. For example, Patent Document 1 exemplifies an epoxy silica hybrid obtained by polycondensation reaction with a hydrolyzable alkoxysilane, and Patent Document 2 discloses a polyimide-silica hybrid obtained by addition reaction of an organosilicon compound with polyamic acid.
従来技術で提案されているエポキシ−シリカハイブリッドは、ガラス転移温度（Ｔｇ）は高いが、熱分解温度が３６０℃程度と低い点で課題を有する。また、ポリイミド−シリカハイブリッドは、耐熱性は十分に高いが硬化温度が３５０℃と高く、はんだ材を含む半導体封止には適さない。 The epoxy-silica hybrid proposed in the prior art has a high glass transition temperature (Tg), but has a problem in that the thermal decomposition temperature is as low as about 360 ° C. In addition, the polyimide-silica hybrid is sufficiently high in heat resistance but has a high curing temperature of 350 ° C., and is not suitable for semiconductor encapsulation including a solder material.
本発明は、低い硬化温度で硬化でき、ガラス転移温度や熱分解温度が高い有機−無機ハイブリッド樹脂硬化物を提供することを目的とする。 An object of the present invention is to provide a cured organic-inorganic hybrid resin that can be cured at a low curing temperature and has a high glass transition temperature and high thermal decomposition temperature.
本発明の有機−無機ハイブリッド樹脂硬化物は、トリアジン環を含む熱硬化性樹脂に無機ナノ粒子が分散した構造であり、可視光に対して透明であることを特徴とする。 The cured organic-inorganic hybrid resin of the present invention has a structure in which inorganic nanoparticles are dispersed in a thermosetting resin containing a triazine ring, and is characterized by being transparent to visible light.
本発明により、ガラス転移温度や熱分解温度が高く、硬化温度が低い有機−無機ハイブリッド樹脂硬化物を提供できる。 According to the present invention, a cured organic-inorganic hybrid resin having a high glass transition temperature and thermal decomposition temperature and a low curing temperature can be provided.
本発明者らは、上記目的を達成するために鋭意研究を重ねた結果、トリアジン環を含む熱硬化性樹脂に無機ナノ粒子が分散した構造の有機−無機ハイブリッド樹脂硬化物が高いガラス転移温度と熱分解温度を示すことを見出した。熱硬化性樹脂は、耐熱性が高い２，２−ビス（４−シアナトフェニル）プロパンに代表されるシアネート樹脂、あるいはビスマレイミドジフェニルエタンと２，２−ビス（４−シアナトフェニル）プロパンの共重合体であることが望ましい。また、樹脂中に分散する無機ナノ粒子はシリカ，チタニア，アルミナ，ジルコニアの少なくとも１種類以上の金属酸化物粒子から成り、無機ナノ粒子の粒径は、無機ナノ粒子の高い比表面積効果が得られる１ｎｍ〜１００ｎｍであることが望ましい。粒径が１ｎｍ以下では無機物による樹脂骨格の分子運動抑制効果が十分ではなく、粒径が１００ｎｍ以上では粒子の比表面積が減少するため十分な耐熱効果を示さない。
また、有機−無機ハイブリッド樹脂硬化物中の無機ナノ粒子濃度は任意の量が選べるが、特に０．０１ｗｔ％〜１０ｗｔ％の範囲が望ましい。０.０１ｗｔ％以下ではたとえ無機ナノ粒子の粒径が１ｎｍでも比表面積の十分な効果が発現せず、１０ｗｔ％以上では耐熱性向上の効果が飽和する。
As a result of intensive studies to achieve the above object, the present inventors have found that a cured organic-inorganic hybrid resin having a structure in which inorganic nanoparticles are dispersed in a thermosetting resin containing a triazine ring has a high glass transition temperature. It has been found to exhibit a thermal decomposition temperature. The thermosetting resin is a cyanate resin represented by 2,2-bis (4-cyanatophenyl) propane having high heat resistance, or bismaleimide diphenylethane and 2,2-bis (4-cyanatophenyl) propane. A copolymer is desirable. Further, the inorganic nanoparticles dispersed in the resin are composed of at least one kind of metal oxide particles of silica, titania, alumina, and zirconia, and the particle size of the inorganic nanoparticles can obtain the high specific surface area effect of the inorganic nanoparticles. It is desirable that the thickness is 1 nm to 100 nm. When the particle size is 1 nm or less, the effect of suppressing the molecular motion of the resin skeleton by the inorganic substance is not sufficient, and when the particle size is 100 nm or more, the specific surface area of the particles is reduced, and thus a sufficient heat resistance effect is not exhibited.
In addition, the inorganic nanoparticle concentration in the cured organic-inorganic hybrid resin can be selected in any amount, but is preferably in the range of 0.01 wt% to 10 wt%. If it is 0.01 wt% or less, even if the particle size of the inorganic nanoparticles is 1 nm, a sufficient effect of the specific surface area is not exhibited, and if it is 10 wt% or more, the effect of improving heat resistance is saturated.
本実施形態に係る有機−無機ハイブリッド樹脂硬化物は、金属アルコキシド化合物を加水分解・重合反応させて無機ナノ粒子を形成する第一のステップと、第一のステップで生成した生成物と重合性官能基とアルコキシル基を有する金属アルコキシド化合物を加水分解・重合反応させ、無機ナノ粒子の表面に重合性官能基を導入する第二のステップと、第二のステップで生成した生成物を含む反応溶液から遠心分離により溶媒を除去し、有機溶剤を加えて溶媒置換する第三のステップと、第三のステップで生成した分散液にシアネート化合物を含む樹脂原料を加えて混合する第四のステップと、第四のステップで生成した混合液から有機溶剤を除去する第五のステップと、第五のステップで得られた生成物を熱処理により硬化させる第六のステップにより製造することができる。 The cured organic-inorganic hybrid resin according to the present embodiment includes a first step in which a metal alkoxide compound is hydrolyzed and polymerized to form inorganic nanoparticles, and a product generated in the first step and a polymerizable functional group. From the reaction solution containing the product produced in the second step of introducing a polymerizable functional group onto the surface of the inorganic nanoparticles by hydrolyzing and polymerizing a metal alkoxide compound having a group and an alkoxyl group A third step of removing the solvent by centrifugation and adding an organic solvent to replace the solvent; a fourth step of adding and mixing the resin raw material containing the cyanate compound to the dispersion produced in the third step; A fifth step for removing the organic solvent from the mixed solution produced in the fourth step, and a sixth step for curing the product obtained in the fifth step by heat treatment. It can be prepared by-up.
本実施形態の有機−無機ハイブリッド樹脂硬化物の作製方法の詳細について、図１を用いて説明する。 The detail of the preparation method of the organic-inorganic hybrid resin cured material of this embodiment is demonstrated using FIG.
まず、アルコール（Ａ）中に金属アルコキシド化合物（Ｂ），反応開始剤（Ｃ）を加え、アルコールの沸点以下の温度で１時間以上攪拌して加水分解・重縮合反応させ、無機ナノ粒子（Ｇ）を得る。次いで重合性官能基を有する金属アルコキシド化合物（Ｄ）を加え、更に１時間以上攪拌する。この時、金属アルコキシド化合物（Ｄ）のアルコキシル基が酸化物無機粒子表面の官能基（水酸基やアルコキシル基）と加水分解・縮重合し、酸化物無機粒子表面に重合性官能基が化学結合する。次いで、溶液に含まれる無機粒子の乾燥を極力抑えつつ遠心分離，エバポレータ等でアルコール（Ａ）や反応開始剤（Ｃ）を除去し、有機溶剤（Ｅ）で溶媒置換する。この操作は数回繰り返してもよい。この溶液に樹脂原料（Ｆ）を加え、ハイブリッドミキサやボールミル等で１０分以上攪拌し、十分に混合する。ここで、有機溶剤（Ｅ）を用いて溶媒置換する工程を省くと、樹脂原料（Ｆ）を加えて混合したときに樹脂原料とアルコール（Ａ）や上記加水分解・重縮合反応で生成するアルコール類が反応し、耐熱性の低い構造となるため、好ましくない。混合後、有機溶剤（Ｅ）の沸点以上で保持しながらアスピレータや真空ポンプ等で有機溶剤（Ｅ）を完全に除去する。残った残留物を１５０℃以上で１時間以上、加熱し、有機−無機ハイブリッド樹脂硬化物を得る。 First, the metal alkoxide compound (B) and the reaction initiator (C) are added to the alcohol (A), and the mixture is stirred for 1 hour or more at a temperature not higher than the boiling point of the alcohol to cause hydrolysis / polycondensation reaction. ) Next, the metal alkoxide compound (D) having a polymerizable functional group is added and further stirred for 1 hour or more. At this time, the alkoxyl group of the metal alkoxide compound (D) is hydrolyzed / condensed with the functional group (hydroxyl group or alkoxyl group) on the surface of the oxide inorganic particle, and the polymerizable functional group is chemically bonded to the surface of the oxide inorganic particle. Next, the alcohol (A) and the reaction initiator (C) are removed by centrifugation, an evaporator or the like while suppressing the drying of the inorganic particles contained in the solution as much as possible, and the solvent is replaced with the organic solvent (E). This operation may be repeated several times. The resin raw material (F) is added to this solution and stirred for 10 minutes or more with a hybrid mixer, a ball mill or the like, and mixed sufficiently. Here, when the step of solvent replacement using the organic solvent (E) is omitted, the resin raw material and the alcohol (A) and the alcohol produced by the hydrolysis / polycondensation reaction when the resin raw material (F) is added and mixed. Is not preferable because the structure reacts to form a structure with low heat resistance. After mixing, the organic solvent (E) is completely removed with an aspirator or a vacuum pump while maintaining the boiling point of the organic solvent (E) or higher. The remaining residue is heated at 150 ° C. or higher for 1 hour or longer to obtain a cured organic-inorganic hybrid resin.
本発明で用いられるアルコール（Ａ）としては、常温で液体のアルコール類であれば特に限定されるものではない。例として、メタノール，エタノール，１−プロパノール，イソプロパノール，１−ブタノール，２−ブタノール，１−オクタノールなどが挙げられるが、これらを２種類以上組み合わせて用いてもよい。 The alcohol (A) used in the present invention is not particularly limited as long as it is a liquid alcohol at room temperature. Examples include methanol, ethanol, 1-propanol, isopropanol, 1-butanol, 2-butanol, 1-octanol and the like, but two or more of these may be used in combination.
本発明で用いられる金属アルコキシド化合物（Ｂ）としては、シラン化合物，チタン化合物，アルミニウム化合物，ジルコニウム化合物が挙げられる。シラン化合物にはテトラエトキシシランやトリエトキシシラン，ジエトキシシランなどが挙げられる。テトラエトキシシランには、テトラメトキシシラン，テトラエトキシシラン，テトライソプロポキシシラン，テトラブトキシシラン，ジメトキシジエトキシシランなどが挙げられる。トリエトキシシランには、メチルトリメトキシシラン，エチルトリメトキシシラン，プロピルトリメトキシシラン，フェニルトリメトキシシラン，フェニルトリエトキシシランなど、アルキル基，フェニル基を含むシラン化合物が挙げられるが、ビニルトリメトキシシラン、ビニルトリエトキシシラン、３−グリシドキシプロピルトリエトキシシラン、３−メルカプトプロピルトリメトキシシラン、３−（２−アミノエチル）アミノプロピルトリメトキシシラン、３−シアノプロピルトリメトキシシランγ−（メタクリロキシプロピル）トリメトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシランなど、重合性官能基を有するシラン化合物でもよい。ジエトキシシランには、ジメチルジメトキシシラン，ジメチルジエトキシシラン，ジフェニルジメトキシシラン，メチルフェニルジメトキシシラ、３−グリシドキシプロピルメチルジエトキシシラン等が挙げられる。
これらは単独でも複数を組み合わせて用いてもよい。チタン化合物には、チタニウムテトラエトキシド，チタニウムテトライソプロポキシド，チタニウムブトキシド，チタンブトキシドダイマー，チタンテトラ−２−エチルヘキソキド，チタンジイソプロポキシビス（アセチルアセトネート），チタンテトラアセチルアセトネート，チタンジオクチロキシビス（オクチレングリコレート），チタンジイソプロポキシビス（エチルアセトアセテート）等が挙げられるが、これらを必要に応じて２種類上組み合わせて用いてもよい。アルミニウム化合物には、アルミニウムメトキシド，アルミニウムエポキシド，アルミニウムｎ−プロポキシアルミニウム，アルミニウムイソプロポキシド，アルミニウムｉ−ブトキシド，アルミニウムsec−ブトキシド，アルミニウムｔ−ブトキシド，アルミニウムブトキシド等が挙げられるが、これらを必要に応じて２種類上組み合わせて用いてもよい。ジルコニウム化合物には、ジルコニウムテトラノルマルプロポキシド，ジルコニウムテトラノルマルブトキシド，ジルコウニウムテトラアセチルアセトネート，ジルコニウムトリブトキシモノアセチルアセトネート，ジルコニウムモノブトキシアセチルアセトネートビス（エチルアセトアセテート），ジルコニウムジブトキシビス（エチルアセトアセテート），ジルコニウムテトラアセチルアセトネート，ジルコニウムトリブトキシモノステアレートが挙げられるが、これらを必要に応じて２種類上組み合わせて用いてもよい。
Examples of the metal alkoxide compound (B) used in the present invention include silane compounds, titanium compounds, aluminum compounds, and zirconium compounds. Examples of the silane compound include tetraethoxysilane, triethoxysilane, and diethoxysilane. Examples of tetraethoxysilane include tetramethoxysilane, tetraethoxysilane, tetraisopropoxysilane, tetrabutoxysilane, dimethoxydiethoxysilane, and the like. Examples of triethoxysilane include silane compounds containing an alkyl group and a phenyl group, such as methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane. , Vinyltriethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3-cyanopropyltrimethoxysilane γ- (methacryloxy) Silane compounds having a polymerizable functional group such as propyl) trimethoxysilane and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane may also be used. Examples of the diethoxysilane include dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane, methylphenyldimethoxysila, 3-glycidoxypropylmethyldiethoxysilane, and the like.
These may be used alone or in combination. Titanium compounds include titanium tetraethoxide, titanium tetraisopropoxide, titanium butoxide, titanium butoxide dimer, titanium tetra-2-ethylhexoxide, titanium diisopropoxybis (acetylacetonate), titanium tetraacetylacetonate, titanium dioctiate. Roxybis (octylene glycolate), titanium diisopropoxybis (ethyl acetoacetate) and the like may be mentioned, but these may be used in combination of two kinds as necessary. Aluminum compounds include aluminum methoxide, aluminum epoxide, aluminum n-propoxyaluminum, aluminum isopropoxide, aluminum i-butoxide, aluminum sec-butoxide, aluminum t-butoxide, aluminum butoxide, etc. Accordingly, two types may be used in combination. Zirconium compounds include zirconium tetranormal propoxide, zirconium tetranormal butoxide, zirconium tetraacetylacetonate, zirconium tributoxymonoacetylacetonate, zirconium monobutoxyacetylacetonate bis (ethylacetoacetate), zirconium dibutoxybis ( Ethyl acetoacetate), zirconium tetraacetylacetonate, and zirconium tributoxy monostearate. These may be used in combination of two kinds as necessary.
本発明で用いられる反応開始剤（Ｃ）は、金属アルコキシド化合物（Ｂ）と加水分解・重縮合反応を起こすものであり、触媒としてアンモニア，メチルアミン，ジメチルアミン等のアンモニア類、或いは、酢酸やリン酸，塩酸などの酸を含む水溶液であるが、特にアンモニアを含む水溶液であることが望ましい。 The reaction initiator (C) used in the present invention causes hydrolysis / polycondensation reaction with the metal alkoxide compound (B), and as a catalyst, ammonia such as ammonia, methylamine, dimethylamine, acetic acid, An aqueous solution containing an acid such as phosphoric acid or hydrochloric acid is preferable, but an aqueous solution containing ammonia is particularly desirable.
金属アルコキシド化合物（Ｂ）の加水分解・重縮合反応で生成する無機ナノ粒子（Ｇ）の種類は、合成で用いる金属アルコキシド化合物（Ｂ）の種類で決まる。例えば、シリカ，チタニア，アルミナ，ジルコニア等が挙げられ、これらを２種類以上組み合わせてもよい。これらの粒子の粒径は、反応開始剤（Ｃ）により制御することが可能で、金属アルコキシド化合物（Ｂ）の濃度，水の濃度，触媒であるアミン、或いは酸の濃度で決まる。例えば、金属アルコキシド化合物（Ｂ）の濃度が０.２mol／Ｌ、水の濃度が１０mol／Ｌの場合、アンモニア濃度が０.１mol／ｌではおよそ１００ｎｍの粒子が生成し、アンモニア濃度が０.０１mol／ｌでは５０ｎｍの粒子を得ることができる。また、メチルアミンやジメチルアミンなどの２級，３級アミンを用いると、更に小さな粒径の粒子を得ることができる。このような無機粒子は、乾燥粒子を外部から直接添加しても差し支えないが、有機−無機ハイブリッド樹脂硬化物により高い耐熱性を付与するには、上記合成方法で得ることが望ましい。 The kind of inorganic nanoparticles (G) produced by the hydrolysis / polycondensation reaction of the metal alkoxide compound (B) is determined by the kind of metal alkoxide compound (B) used in the synthesis. Examples thereof include silica, titania, alumina, zirconia and the like, and two or more of these may be combined. The particle size of these particles can be controlled by the reaction initiator (C), and is determined by the concentration of the metal alkoxide compound (B), the concentration of water, the amine as the catalyst, or the concentration of the acid. For example, when the concentration of the metal alkoxide compound (B) is 0.2 mol / L and the concentration of water is 10 mol / L, particles having a size of about 100 nm are formed at an ammonia concentration of 0.1 mol / l, and the ammonia concentration is 0.01 mol. At / l, particles of 50 nm can be obtained. Further, when a secondary or tertiary amine such as methylamine or dimethylamine is used, particles having a smaller particle size can be obtained. Such inorganic particles may be directly added from the outside, but it is desirable to obtain the inorganic particles by the above synthesis method in order to impart high heat resistance to the cured organic-inorganic hybrid resin.
無機ナノ粒子（Ｇ）は、金属アルコキシド化合物（Ｄ）を用いて表面修飾すると望ましい。この操作を行うことにより、樹脂中に無機ナノ粒子を均一に分散した透明な有機無機ハイブリッド樹脂硬化物を得ることができる。金属アルコキシド化合物（Ｄ）は金属アルコキシド化合物（Ｂ）と同様の化合物を用いることもできるが、特に、重合性官能基を持つ金属アルコキシド化合物が望ましい。フェニル基やアルキル基で置換した金属アルコキシド化合物を用いると、有機−無機ハイブリッド樹脂硬化物が可塑化し、ガラス転移温度が低下する恐れがある。具体的には、ビニルトリメトキシシラン，ビニルトリエトキシシラン、３−グリシドキシプロピルトリエトキシシラン、３−メルカプトプロピルトリメトキシシラン、３−（２−アミノエチル）アミノプロピルトリメトキシシラン、３−シアノプロピルトリメトキシシランγ−（メタクリロキシプロピル）トリメトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、３−グリシドキシプロピルメチルジエトキシシランなどが好ましい。本発明で用いられるシラン化合物（Ｂ）は、上記単独でも複数を組み合わせてもよい。 The inorganic nanoparticles (G) are desirably modified with a metal alkoxide compound (D). By performing this operation, a transparent organic-inorganic hybrid resin cured product in which inorganic nanoparticles are uniformly dispersed in the resin can be obtained. As the metal alkoxide compound (D), the same compound as the metal alkoxide compound (B) can be used, but a metal alkoxide compound having a polymerizable functional group is particularly desirable. When a metal alkoxide compound substituted with a phenyl group or an alkyl group is used, the cured organic-inorganic hybrid resin may be plasticized and the glass transition temperature may be lowered. Specifically, vinyltrimethoxysilane, vinyltriethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3-cyano Propyltrimethoxysilane γ- (methacryloxypropyl) trimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane and the like are preferable. The silane compound (B) used in the present invention may be used alone or in combination.
また、樹脂中に分散する無機ナノ粒子の最終的な濃度は任意に決定することができるが、０.０５ｗｔ％〜１０ｗｔ％の範囲がより好ましい。０.０５ｗｔ％以下では効果が不十分であり、１０ｗｔ％以上添加しても効果が変わらないためである。 Moreover, the final concentration of the inorganic nanoparticles dispersed in the resin can be arbitrarily determined, but a range of 0.05 wt% to 10 wt% is more preferable. This is because the effect is insufficient at 0.05 wt% or less, and the effect does not change even when 10 wt% or more is added.
本発明で用いられる有機溶剤（Ｅ）は、アセトン，メチルエチルケトン，メチルイソブチルケトン，ジイソブチルケトン，アセチルアセトン，イソホロン，アセトフェノン，シクロヘキサノン等のケトン類が挙げられ、特にメチルエチルケトン，メチルイソブチルケトンが望ましいが、これに限定されるものではない。 Examples of the organic solvent (E) used in the present invention include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, acetyl acetone, isophorone, acetophenone, and cyclohexanone, and methyl ethyl ketone and methyl isobutyl ketone are particularly preferable. It is not limited.
本発明における樹脂原料（Ｆ）には、シアネート化合物を用いる。また、シアネート化合物にマレイミド化合物，エポキシ樹脂プレポリマ等を任意の割合で混合してもよい。シアネート化合物の硬化反応で耐熱性に優れるトリアジン環を含む硬化物が生成される。また、シアネート化合物とマレイミド化合物，エポキシ樹脂プレポリマ等を混合した場合には、シアネート化合物とマレイミド化合物またはエポキシ樹脂との反応でもトリアジン環を含む硬化物が生成される。 A cyanate compound is used for the resin raw material (F) in the present invention. Moreover, you may mix a maleimide compound, an epoxy resin prepolymer, etc. with a cyanate compound in arbitrary ratios. A cured product containing a triazine ring excellent in heat resistance is generated by the curing reaction of the cyanate compound. Further, when a cyanate compound, a maleimide compound, an epoxy resin prepolymer, and the like are mixed, a cured product containing a triazine ring is also generated by a reaction between the cyanate compound and the maleimide compound or the epoxy resin.
シアネート化合物としては、４，４′−ジシアナートビフェニル、３，３′，５，５′−テトラメチル−４，４′−ジシアナートビフェニル、ビス（４−シアナトフェニル）メタン、ビス（４−シアナート−３−メチルフェニル）メタン、ビス（４−シアナート−３−ｔ−ブチルフェニル）メタン、ビス（４−シアナート−３−ｉ−プロピルフェニル）メタン、ビス（４−シアナート−３，５−ジメチルフェニル）メタン、ビス（２−シアナート−３−ｔ−ブチル−５−メチルフェニル）メタン、１，１−ビス（４−シアナトフェニル）エタン、１，１−ビス（４−シアナート−３−メチルフェニル）エタン、１，１−ビス（４−シアナート−３−ｔ−ブチルフェニル）エタン、１，１−ビス（４−シアナート−３−ｉ−プロピルフェニル）エタン、１，１−ビス（４−シアナート−３，５−ジメチルフェニル）エタン、１，１−ビス（２−シアナート−３−ｔ−ブチル−５−メチルフェニル）エタン、２，２−ビス（４−シアナトフェニル）プロパン、２，２−ビス（４−シアナート−３−メチルフェニル）プロパン、２，２−ビス（４−シアナート−３−ｔ−ブチルフェニル）プロパン、２，２−ビス（４−シアナート−３−ｉ−プロピルフェニル）プロパン、２，２−ビス（４−シアナート−３，５−ジメチルフェニル）プロパン、２，２−ビス（２−シアナート−３−ｔ−ブチル−５−メチルフェニル）プロパン、２，２−ビス（４−シアナート−３−ｔ−ブチル−６−メチルフェニル）プロパン、２，２−ビス（３−アリル−４−シアナトフェニル）プロパン、２，２−ビス（４−シアナトフェニル）プロパン、１，１−ビス（４−シアナトフェニル）ブタン、１，１−ビス（４−シアナート−３−メチルフェニル）ブタン、１，１−ビス（４−シアナート−３−ｔ−ブチルフェニル）ブタン、１，１−ビス（４−シアナート−３−ｉ−プロピルフェニル）ブタン、１，１−ビス（４−シアナート−３，５−ジメチルフェニル）ブタン、１，１−ビス（２−シアナート−３−ｔ−ブチル−５−メチルフェニル）ブタン、１，１−ビス（４−シアナート−３−ｔ−ブチル−６−メチルフェニル）ブタン、１，１−ビス（３−アリル−４−シアナトフェニル）ブタン、１，１−ビス（４−シアナトフェニル）シクロヘキサン、１，１−ビス（４−シアナート−３−メチルフェニル）シクロヘキサン、ビス（４−シアナトフェニル）スルフィド、ビス（４−シアナート−３−メチルフェニル）スルフィド、ビス（４−シアナート−３−ｔ−ブチルフェニル）スルフィド、ビス（４−シアナート−３−ｉ−プロピルフェニル）スルフィド、ビス（４−シアナート−３，５−ジメチルフェニル）スルフィド、ビス（２−シアナート−３−ｔ−ブチル−５−メチルフェニル）スルフィド、ビス（４−シアナトフェニル）スルホン、ビス（４−シアナート−３−メチルフェニル）スルホン、ビス（４−シアナート−３−ｔ−ブチルフェニル）スルホン、ビス（４−シアナート−３−ｉ−プロピルフェニル）スルホン、ビス（４−シアナート−３，５−ジメチルフェニル）スルホン、ビス（２−シアナート−３−ｔ−ブチル−５−メチルフェニル）スルホン、ビス（４−シアナトフェニル）エーテル、ビス（４−シアナート−３−メチルフェニル）エーテル、ビス（４−シアナート−３−ｔ−ブチルフェニル）エーテル、ビス（４−シアナート−３−ｉ−プロピルフェニル）エーテル、ビス（４−シアナート−３，５−ジメチルフェニル）エーテル、ビス（２−シアナート−３−ｔ−ブチル−５−メチルフェニル）エーテル、ビス（４−シアナトフェニル）カルボニル、ビス（４−シアナート−３−メチルフェニル）カルボニル、ビス（４−シアナート−３−ｔ−ブチルフェニル）カルボニル、ビス（４−シアナート−３−ｉ−プロピルフェニル）カルボニル、ビス（４−シアナート−３，５−ジメチルフェニル）カルボニル、ビス（２−シアナート−３−ｔ−ブチル−５−メチルフェニル）カルボニル、等が挙げられ、必要に応じてその２種以上を用いることもできる。 Examples of cyanate compounds include 4,4′-dicyanate biphenyl, 3,3 ′, 5,5′-tetramethyl-4,4′-dicyanate biphenyl, bis (4-cyanatophenyl) methane, bis ( 4-cyanato-3-methylphenyl) methane, bis (4-cyanato-3-t-butylphenyl) methane, bis (4-cyanato-3-i-propylphenyl) methane, bis (4-cyanate-3,5 -Dimethylphenyl) methane, bis (2-cyanato-3-t-butyl-5-methylphenyl) methane, 1,1-bis (4-cyanatophenyl) ethane, 1,1-bis (4-cyanate-3) -Methylphenyl) ethane, 1,1-bis (4-cyanato-3-t-butylphenyl) ethane, 1,1-bis (4-cyanato-3-i-propylphenyl) 1,1-bis (4-cyanato-3,5-dimethylphenyl) ethane, 1,1-bis (2-cyanato-3-t-butyl-5-methylphenyl) ethane, 2,2-bis ( 4-cyanatophenyl) propane, 2,2-bis (4-cyanato-3-methylphenyl) propane, 2,2-bis (4-cyanato-3-t-butylphenyl) propane, 2,2-bis ( 4-cyanato-3-i-propylphenyl) propane, 2,2-bis (4-cyanato-3,5-dimethylphenyl) propane, 2,2-bis (2-cyanato-3-t-butyl-5- Methylphenyl) propane, 2,2-bis (4-cyanato-3-t-butyl-6-methylphenyl) propane, 2,2-bis (3-allyl-4-cyanatophenyl) propane, 2,2- (4-cyanatophenyl) propane, 1,1-bis (4-cyanatophenyl) butane, 1,1-bis (4-cyanato-3-methylphenyl) butane, 1,1-bis (4-cyanate) -3-tert-butylphenyl) butane, 1,1-bis (4-cyanato-3-i-propylphenyl) butane, 1,1-bis (4-cyanato-3,5-dimethylphenyl) butane, 1-bis (2-cyanato-3-t-butyl-5-methylphenyl) butane, 1,1-bis (4-cyanato-3-t-butyl-6-methylphenyl) butane, 1,1-bis ( 3-allyl-4-cyanatophenyl) butane, 1,1-bis (4-cyanatophenyl) cyclohexane, 1,1-bis (4-cyanato-3-methylphenyl) cyclohexane, bis (4-ciana) Tophenyl) sulfide, bis (4-cyanato-3-methylphenyl) sulfide, bis (4-cyanato-3-t-butylphenyl) sulfide, bis (4-cyanato-3-i-propylphenyl) sulfide, bis (4 -Cyanate-3,5-dimethylphenyl) sulfide, bis (2-cyanato-3-t-butyl-5-methylphenyl) sulfide, bis (4-cyanatophenyl) sulfone, bis (4-cyanato-3-methyl) Phenyl) sulfone, bis (4-cyanato-3-t-butylphenyl) sulfone, bis (4-cyanato-3-i-propylphenyl) sulfone, bis (4-cyanato-3,5-dimethylphenyl) sulfone, bis (2-cyanato-3-tert-butyl-5-methylphenyl) sulfone, bis (4- Anatophenyl) ether, bis (4-cyanato-3-methylphenyl) ether, bis (4-cyanato-3-t-butylphenyl) ether, bis (4-cyanato-3-i-propylphenyl) ether, bis ( 4-cyanate-3,5-dimethylphenyl) ether, bis (2-cyanato-3-t-butyl-5-methylphenyl) ether, bis (4-cyanatophenyl) carbonyl, bis (4-cyanato-3- Methylphenyl) carbonyl, bis (4-cyanato-3-t-butylphenyl) carbonyl, bis (4-cyanato-3-i-propylphenyl) carbonyl, bis (4-cyanato-3,5-dimethylphenyl) carbonyl, Bis (2-cyanato-3-t-butyl-5-methylphenyl) carbonyl, etc. Gerare, it is also possible to use two or more thereof as needed.
マレイミド化合物としては、４，４′−ジフェニルメタンビスマレイミド、ｍ−フェニレンビスマレイミド、ビスフェノール Ａ ジフェニルエーテルビスマレイミド、３，３′−ジメチル−５，５′−ジエチル−４，４′−ジフェニルメタンビスマレイミド、４−メチル−１，３−フェニレンビスマレイミド、１，６′−ビスマレイミド−（２，２，４−トリメチル）ヘキサン、４，４′−ジフェニルエーテルビスマレイミド、４，４′−ジフェニルスルフォンビスマレイミド、１，３−ビス（３−マレイミドフェノキシ）ベンゼン、１，３−ビス（４−マレイミドフェノキシ）ベンゼンなどのビスマレイミド類やマレイミド，フェニルマレイミドなどのモノマレイミド類が挙げられ、必要に応じてその２種類以上を用いることもできる。 Examples of maleimide compounds include 4,4′-diphenylmethane bismaleimide, m-phenylene bismaleimide, bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide, 4 -Methyl-1,3-phenylenebismaleimide, 1,6'-bismaleimide- (2,2,4-trimethyl) hexane, 4,4'-diphenyl ether bismaleimide, 4,4'-diphenylsulfone bismaleimide, 1 , 3-bis (3-maleimidophenoxy) benzene, bismaleimides such as 1,3-bis (4-maleimidophenoxy) benzene, and monomaleimides such as maleimide and phenylmaleimide, and two types as required The above can also be used.
エポキシ樹脂プレポリマは、１分子内に２個以上のエポキシ基を有する公知のエポキシ樹脂全般を指すものである。例えば、フェノール類やアルコール類とエピクロルヒドリンから得られるグリシジルエーテル型エポキシ樹脂，カルボン酸類とエピクロルヒドリンから得られるグリシジルエステル型エポキシ樹脂，アミン類とエピクロルヒドリンから得られるグリシジルアミン型エポキシ樹脂，不飽和炭化水素の２重結合の酸化より得られる酸化型エポキシ樹脂が挙げられるが、特にこれらに限定されるものではない。具体的には、ビスフェノールＡ，Ｆ，Ｓなどを原料とするビスフェノール型エポキシ樹脂、ハロゲン化されたフェノール類から得られるハロゲン化エポキシ樹脂、ナフタレン骨格やビフェニル骨格を有するエポキシ樹脂、などの２官能エポキシ樹脂、クレゾールノボラック型エポキシ樹脂，トリフェノールメタン型エポキシ樹脂，ジシクロペンタジエン型エポキシ樹脂，ナフタレン型エポキシ樹脂，フェノールビフェニレン型エポキシ樹脂、などの多官能エポキシ樹脂、ポリヒドロキシルエーテル型エポキシ樹脂、などのグリシジルエーテル型エポキシ樹脂が挙げられる。また、グリシジルエステル型エポキシ樹脂には、脂肪族系カルボン酸，芳香族系カルボン酸，環状系カルボン酸，重合脂肪酸系カルボン酸を原料として得られる各種グリシジルエステル型エポキシ樹脂が挙げられる。また、グリシジルアミン型エポキシ樹脂としては、芳香族アミン類，アミノフェノール類、及び環状脂肪族アミン類を原料として得られるグリシジルアミン型エポキシ樹脂が挙げられる。また、酸化型エポキシ樹脂としては環式脂肪族エポキシ樹脂が例示される。その他にも、ナフタレン環，アントラセン環，ピレン環などを導入したエポキシ樹脂，含窒素エポキシ樹脂，含リンエポキシ樹脂，含ケイ素エポキシ樹脂，液晶性エポキシ樹脂なども例示されるが、特にこれらに限定されるものではない。また、これらは複数を併用して用いることも可能である。 The epoxy resin prepolymer refers to all known epoxy resins having two or more epoxy groups in one molecule. For example, glycidyl ether type epoxy resin obtained from phenols and alcohols and epichlorohydrin, glycidyl ester type epoxy resin obtained from carboxylic acids and epichlorohydrin, glycidyl amine type epoxy resin obtained from amines and epichlorohydrin, unsaturated hydrocarbon 2 Although the oxidation type epoxy resin obtained by oxidation of a heavy bond is mentioned, it is not specifically limited to these. Specifically, bifunctional epoxy such as bisphenol type epoxy resin made from bisphenol A, F, S or the like, halogenated epoxy resin obtained from halogenated phenols, epoxy resin having naphthalene skeleton or biphenyl skeleton, etc. Resin, cresol novolac type epoxy resin, triphenolmethane type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, phenol biphenylene type epoxy resin, glycidyl such as polyhydroxyl ether type epoxy resin Examples include ether type epoxy resins. Examples of the glycidyl ester type epoxy resin include various glycidyl ester type epoxy resins obtained using aliphatic carboxylic acid, aromatic carboxylic acid, cyclic carboxylic acid, and polymerized fatty acid carboxylic acid as raw materials. Examples of the glycidylamine type epoxy resin include glycidylamine type epoxy resins obtained using aromatic amines, aminophenols, and cyclic aliphatic amines as raw materials. Examples of the oxidized epoxy resin include cycloaliphatic epoxy resins. Other examples include epoxy resins incorporating a naphthalene ring, anthracene ring, pyrene ring, etc., nitrogen-containing epoxy resins, phosphorus-containing epoxy resins, silicon-containing epoxy resins, liquid crystalline epoxy resins, and the like. It is not something. These can also be used in combination.
図４にパワー半導体装置の断面模式図を示す。図４に示したパワー半導体装置では、パワー半導体素子１０１の裏面側電極が絶縁基板１０６上の回路配線部材１０２に接合材１０４によって電気的に接続され、パワー半導体素子１０１の主電極がリード部材１０３にワイヤ１０５によって電気的に接続されている。絶縁基板１０６の裏面側にはパワー半導体素子１０１で発生した熱を外部に逃がすための放熱板が設けられている。そして、回路配線部材１０２，リード部材１０３，放熱板１０７の一部が露出した状態でパワー半導体素子１０１の周囲が封止樹脂１０８で封止される。この封止樹脂１０８に本発明の有機−無機ハイブリッド樹脂硬化物を適用することができる。本発明の有機−無機ハイブリッド樹脂硬化物は、ガラス転移温度が高く温度振幅に対する弾性率や熱膨張率の変化が小さいため、パワー半導体装置の封止材に用いた時にパワー素子の発熱に伴う温度変化によりかかる熱応力を抑制し、パワー半導体装置の高信頼化に寄与するだけでなく、高い耐熱性を有するためパワー半導体装置の高寿命化に寄与することが期待できる。なお、図４に示したパワー半導体装置の構造は一例であり、他の構造の半導体装置においても半導体素子の周囲を覆う封止樹脂として本発明の有機−無機ハイブリッド樹脂硬化物を適用可能なことはいうまでもない。 FIG. 4 is a schematic cross-sectional view of the power semiconductor device. In the power semiconductor device shown in FIG. 4, the back side electrode of the power semiconductor element 101 is electrically connected to the circuit wiring member 102 on the insulating substrate 106 by the bonding material 104, and the main electrode of the power semiconductor element 101 is the lead member 103. Are electrically connected to each other by a wire 105. On the back surface side of the insulating substrate 106, a heat radiating plate for releasing heat generated in the power semiconductor element 101 to the outside is provided. Then, the periphery of the power semiconductor element 101 is sealed with a sealing resin 108 with a part of the circuit wiring member 102, the lead member 103, and the heat sink 107 exposed. The organic-inorganic hybrid resin cured product of the present invention can be applied to the sealing resin 108. Since the cured organic-inorganic hybrid resin of the present invention has a high glass transition temperature and a small change in elastic modulus and thermal expansion coefficient with respect to temperature amplitude, the temperature accompanying heat generation of the power element when used as a sealing material for a power semiconductor device. It can be expected that not only the thermal stress due to the change is suppressed and contributes to the enhancement of the reliability of the power semiconductor device, but also the contribution to the extension of the life of the power semiconductor device because of its high heat resistance. Note that the structure of the power semiconductor device shown in FIG. 4 is merely an example, and the organic-inorganic hybrid resin cured product of the present invention can be applied as a sealing resin covering the periphery of the semiconductor element even in semiconductor devices of other structures. Needless to say.
次に、本発明を実施例および比較例によって説明するが、本発明は下記に限定されるものではない。 Next, although an example and a comparative example explain the present invention, the present invention is not limited to the following.
〔実施例１〜５，比較例１〕
エタノール中にテトラエトキシシラン（ＴＥＯＳ）とアンモニアおよび水を加え、室温で１２時間攪拌した。これより、粒径１０ｎｍのシリカが生成した。次いでビニルトリメトキシシラン（ＶＴＭＳ）を加え、更に１２時間攪拌した。次いで、遠心分離器を用いてアルコールやアンモニア，水を除去し、メチルエチルケトン（ＭＥＫ）で溶媒置換した。
この操作を２回繰り返した。この溶液に２，２−ビス（４−シアナトフェニル）プロパン（ＢＣＰＰ）を加え、遊星ボールミルで３０分間処理し、十分に混合した。このとき、混合するＢＣＰＰの量を変えて樹脂中のシリカ濃度を変化させた。混合後、１６０℃に保持しながら真空ポンプでＭＥＫを完全に除去した。最後に残った残留物を１６０℃／２ｈ，２５０℃／４ｈで加熱し、有機−無機ハイブリッド樹脂硬化物を得た。
[Examples 1-5, Comparative Example 1]
Tetraethoxysilane (TEOS), ammonia and water were added to ethanol and stirred at room temperature for 12 hours. As a result, silica having a particle size of 10 nm was produced. Subsequently, vinyltrimethoxysilane (VTMS) was added and further stirred for 12 hours. Subsequently, alcohol, ammonia, and water were removed using a centrifugal separator, and the solvent was replaced with methyl ethyl ketone (MEK).
This operation was repeated twice. 2,2-bis (4-cyanatophenyl) propane (BCPP) was added to this solution, treated for 30 minutes with a planetary ball mill, and mixed well. At this time, the silica concentration in the resin was changed by changing the amount of BCPP to be mixed. After mixing, MEK was completely removed with a vacuum pump while maintaining at 160 ° C. Finally, the remaining residue was heated at 160 ° C./2 h and 250 ° C./4 h to obtain a cured organic-inorganic hybrid resin.
また、比較例１として、シリカ粒子無添加のＢＣＰＰの樹脂硬化物を作製した。 Further, as Comparative Example 1, a cured resin of BCPP without addition of silica particles was prepared.
有機−無機ハイブリッド樹脂硬化物の弾性率は動的粘弾性測定（Dynamic Mechanical Analysis，ＤＭＡ）はＴＡ Instruments製のＴＡ２０００を用いて測定した。昇温速度は２℃／min、チャック間距離１０〜２０mm，試料厚さ約０.５mm，測定周波数１０Ｈｚとした。ガラス転移温度は、ＤＭＡ測定よりtanδのピーク温度から求めた。５％重量減少温度は熱重量分析装置（ＴＧＡ，ＴＡ Instruments，Ｑ５００）を用いて評価した。測定条件は、大気中、昇温速度１０℃／minとし、測定前の全重量の９５％の温度を５％重量減少温度と定義した。また、樹脂分が完全に分解される８００℃の重量分率から無機ナノ粒子含有量を求めた。この値は、合成における仕込み値と一致することを確認した。 The elastic modulus of the cured organic-inorganic hybrid resin was measured using TA2000 manufactured by TA Instruments for dynamic viscoelasticity measurement (Dynamic Mechanical Analysis, DMA). The heating rate was 2 ° C./min, the distance between chucks was 10 to 20 mm, the sample thickness was about 0.5 mm, and the measurement frequency was 10 Hz. The glass transition temperature was determined from the peak temperature of tan δ by DMA measurement. The 5% weight loss temperature was evaluated using a thermogravimetric analyzer (TGA, TA Instruments, Q500). The measurement conditions were defined as a 5% weight loss temperature in the atmosphere with a temperature rising rate of 10 ° C./min and a temperature of 95% of the total weight before the measurement. Further, the inorganic nanoparticle content was determined from the weight fraction at 800 ° C. at which the resin component was completely decomposed. This value was confirmed to match the charge value in the synthesis.
有機−無機ハイブリッド樹脂硬化物の透明性を目視により評価した。 The transparency of the cured organic-inorganic hybrid resin was visually evaluated.
有機−無機ハイブリッド樹脂硬化物の赤外吸収スペクトルは赤外分光装置（PerkinElmer，Spectrum１００，ＡＴＲ法）で測定した。測定条件は、測定範囲３８０−４０００cm-1，測定間隔１cm-1，積算回数１２回とした。評価結果を表１に示す。 The infrared absorption spectrum of the cured organic-inorganic hybrid resin was measured with an infrared spectrometer (PerkinElmer, Spectrum 100, ATR method). Measurement conditions were measured range 380-4000Cm -1, measurement interval 1 cm -1, cumulated number 12 times. The evaluation results are shown in Table 1.
実施例１〜５のシアネート−シリカハイブリッド樹脂硬化物は、比較例１のシリカ無添加の樹脂硬化物よりもガラス転移温度と５％重量減少温度が増加する結果となった。また、実施例１〜６より、シアネート−シリカハイブリッド樹脂硬化物は、シリカ濃度が増えるに従いガラス転移温度と５％重量減少温度が増加し、シリカ濃度が５％以上でほぼ一定の値となった。得られる有機無機ハイブリッド樹脂硬化物を目視したところ、全て透明であった。これは、可視光（３６０ｎｍ以上）以下の粒子が均一に分散しているためと考えられる。 The cyanate-silica hybrid resin cured products of Examples 1 to 5 resulted in an increase in the glass transition temperature and the 5% weight loss temperature compared to the resin cured product of Comparative Example 1 without addition of silica. Further, from Examples 1 to 6, the cured product of cyanate-silica hybrid resin increased the glass transition temperature and the 5% weight loss temperature as the silica concentration increased, and became a substantially constant value when the silica concentration was 5% or more. . The obtained cured organic-inorganic hybrid resin was visually transparent. This is considered to be because particles of visible light (360 nm or more) or less are uniformly dispersed.
〔実施例６〜１０，比較例２〕
エタノール中にテトラエトキシシラン（ＴＥＯＳ）とアンモニアおよび水を加え、室温で１２時間攪拌した。これより、粒径１０ｎｍのシリカ粒子が生成した。次いでビニルトリメトキシシラン（ＶＴＭＳ）を加え、更に１２時間攪拌した。次いで、遠心分離器を用いてアルコールやアンモニア，水を除去し、メチルエチルケトン（ＭＥＫ）で溶媒置換した。この操作を２回繰り返した。この溶液に２，２−ビス（４−シアナトフェニル）プロパン（ＢＣＰＰ）とビスマレイミドジフェニルエタン（ＢＭＩ）を加え、遊星ボールミルで３０分間処理し、十分に混合した。このとき、混合するＢＣＰＰとＢＭＩの量を変えて樹脂中のシリカ濃度を変化させた。混合後、１６０℃に保持しながら真空ポンプでＭＥＫを完全に除去した。最後に残った残留物を１６０℃／２ｈ，２５０℃／４ｈで加熱し、有機−無機ハイブリッド樹脂硬化物を得た。
[Examples 6 to 10, Comparative Example 2]
Tetraethoxysilane (TEOS), ammonia and water were added to ethanol and stirred at room temperature for 12 hours. As a result, silica particles having a particle diameter of 10 nm were produced. Subsequently, vinyltrimethoxysilane (VTMS) was added and further stirred for 12 hours. Subsequently, alcohol, ammonia, and water were removed using a centrifugal separator, and the solvent was replaced with methyl ethyl ketone (MEK). This operation was repeated twice. To this solution, 2,2-bis (4-cyanatophenyl) propane (BCPP) and bismaleimide diphenylethane (BMI) were added, treated with a planetary ball mill for 30 minutes, and mixed well. At this time, the silica concentration in the resin was changed by changing the amounts of BCPP and BMI to be mixed. After mixing, MEK was completely removed with a vacuum pump while maintaining at 160 ° C. Finally, the remaining residue was heated at 160 ° C./2 h and 250 ° C./4 h to obtain a cured organic-inorganic hybrid resin.
また、比較例２として、ＢＣＰＰとＢＭＩの共重合体でシリカ粒子無添加の樹脂硬化物を作製した。 In addition, as Comparative Example 2, a cured resin having no silica particles added with a copolymer of BCPP and BMI was prepared.
有機−無機ハイブリッド樹脂硬化物の弾性率は動的粘弾性測定（Dynamic Mechanical Analysis，ＤＭＡ）はＴＡ Instruments製のＴＡ２０００を用いて測定した。昇温速度は２℃／min、チャック間距離１０〜２０mm，試料厚さ約０.５mm，測定周波数１０Ｈｚとした。ガラス転移温度は、ＤＭＡ測定よりtanδのピーク温度から求めた。５％重量減少温度は熱重量分析装置（ＴＧＡ，ＴＡ Instruments，Ｑ５００）を用いて評価した。測定条件は、大気中、昇温速度１０℃／minとし、測定前の全重量の９５％の温度を５％重量減少温度と定義した。また、樹脂分が完全に分解される８００℃の重量分率から無機ナノ粒子含有量を求めた。この値は、合成における仕込み値と一致することを確認した。 The elastic modulus of the cured organic-inorganic hybrid resin was measured using TA2000 manufactured by TA Instruments for dynamic viscoelasticity measurement (Dynamic Mechanical Analysis, DMA). The heating rate was 2 ° C./min, the distance between chucks was 10 to 20 mm, the sample thickness was about 0.5 mm, and the measurement frequency was 10 Hz. The glass transition temperature was determined from the peak temperature of tan δ by DMA measurement. The 5% weight loss temperature was evaluated using a thermogravimetric analyzer (TGA, TA Instruments, Q500). The measurement conditions were defined as a 5% weight loss temperature in the atmosphere with a temperature rising rate of 10 ° C./min and a temperature of 95% of the total weight before the measurement. Further, the inorganic nanoparticle content was determined from the weight fraction at 800 ° C. at which the resin component was completely decomposed. This value was confirmed to match the charge value in the synthesis.
有機−無機ハイブリッド樹脂硬化物の透明性を目視により評価した。 The transparency of the cured organic-inorganic hybrid resin was visually evaluated.
有機−無機ハイブリッド樹脂硬化物の赤外吸収スペクトルは赤外分光装置（PerkinElmer，Spectrum１００，ＡＴＲ法）で測定した。測定条件は、測定範囲３８０−４０００cm-1，測定間隔１cm-1，積算回数１２回とした。評価結果を表２に示す。 The infrared absorption spectrum of the cured organic-inorganic hybrid resin was measured with an infrared spectrometer (PerkinElmer, Spectrum 100, ATR method). Measurement conditions were measured range 380-4000Cm -1, measurement interval 1 cm -1, cumulated number 12 times. The evaluation results are shown in Table 2.
実施例６〜１０の有機−無機ハイブリッド樹脂硬化物は、比較例２のシリカ無添加の樹脂硬化物よりもガラス転移温度と５％重量減少温度が増加する結果となった。また、実施例６〜１０より、原料樹脂をＢＣＰＰ／ＢＭＩ＝５０／５０共重合体の場合、シリカ濃度が増えるに従いガラス転移温度と５％重量減少温度が増加し、シリカ濃度が２％以上でほぼ一定の値となった。 The organic-inorganic hybrid resin cured products of Examples 6 to 10 resulted in an increase in glass transition temperature and 5% weight loss temperature as compared with the cured resin product without addition of silica of Comparative Example 2. From Examples 6 to 10, when the raw material resin is a BCPP / BMI = 50/50 copolymer, the glass transition temperature and the 5% weight loss temperature increase as the silica concentration increases, and the silica concentration is 2% or more. The value was almost constant.
図２に実施例１０における有機−無機ハイブリッド樹脂硬化物のＦＴ−ＩＲスペクトルを示す。図２において、点線がナノシリカ無添加の有機−無機ハイブリッド樹脂硬化物のＦＴ−ＩＲスペクトルで、実線が実施例１０で得られる有機−無機ハイブリッド樹脂硬化物のＦＴ−ＩＲスペクトルである。実施例１０で得られる有機−無機ハイブリッド樹脂硬化物は、１３６０cm-1と１５６０cm-1にトリアジン環由来の吸収が、１０００〜１１００cm-1にシリカの吸収が見られ、トリアジン環を含む樹脂硬化物中に無機粒子であるシリカが分散した構造であることが分かる。 FIG. 2 shows an FT-IR spectrum of the cured organic-inorganic hybrid resin in Example 10. In FIG. 2, the dotted line is the FT-IR spectrum of the cured organic-inorganic hybrid resin without addition of nanosilica, and the solid line is the FT-IR spectrum of the cured organic-inorganic hybrid resin obtained in Example 10. The organic obtained in Example 10 - inorganic hybrid cured resin, the absorption derived from the triazine ring to 1360 cm -1 and 1560 cm -1 is absorption of silica found in 1000～1100Cm -1, cured resin containing a triazine ring It can be seen that this is a structure in which silica as inorganic particles is dispersed.
〔実施例１１，１２，比較例３〕
エタノール中にテトラエトキシシラン（ＴＥＯＳ）と反応開始剤（Ｃ）であるアンモニアおよび水を加え、室温で１２時間攪拌した。この時、添加するアンモニアの量で生成するシリカの粒径を変化させた。次いでビニルトリメトキシシラン（ＶＴＭＳ）を加え、更に１２時間攪拌した。次いで、遠心分離器を用いてアルコールやアンモニア，水を除去し、有機溶剤（Ｅ）であるメチルエチルケトン（ＭＥＫ）で溶媒置換した。この操作を２回繰り返した。この溶液に樹脂原料（Ｆ）として２，２−ビス（４−シアナトフェニル）プロパン（ＢＣＰＰ）とビスマレイミドジフェニルエタン（ＢＭＩ）を加え、遊星ボールミルで３０分間処理し、十分に混合した。混合後、１６０℃に保持しながら真空ポンプでＭＥＫを完全に除去した。最後に残った残留物を１６０℃／２ｈ，２５０℃／４ｈで加熱し、有機−無機ハイブリッド樹脂硬化物を得た。
[Examples 11 and 12, Comparative Example 3]
Tetraethoxysilane (TEOS) and reaction initiator (C) ammonia and water were added to ethanol and stirred at room temperature for 12 hours. At this time, the particle size of the silica produced was changed by the amount of ammonia added. Subsequently, vinyltrimethoxysilane (VTMS) was added and further stirred for 12 hours. Subsequently, alcohol, ammonia and water were removed using a centrifugal separator, and the solvent was replaced with methyl ethyl ketone (MEK) which is an organic solvent (E). This operation was repeated twice. To this solution, 2,2-bis (4-cyanatophenyl) propane (BCPP) and bismaleimide diphenylethane (BMI) were added as a resin raw material (F), treated with a planetary ball mill for 30 minutes, and thoroughly mixed. After mixing, MEK was completely removed with a vacuum pump while maintaining at 160 ° C. Finally, the remaining residue was heated at 160 ° C./2 h and 250 ° C./4 h to obtain a cured organic-inorganic hybrid resin.
有機−無機ハイブリッド樹脂硬化物の弾性率は動的粘弾性測定（Dynamic Mechanical Analysis，ＤＭＡ）はＴＡ Instruments製のＴＡ２０００を用いて測定した。昇温速度は２℃／min、チャック間距離１０〜２０mm，試料厚さ約０.５mm，測定周波数１０Ｈｚとした。ガラス転移温度は、ＤＭＡ測定よりtanδのピーク温度から求めた。５％重量減少温度は熱重量分析装置（ＴＧＡ，ＴＡ Instruments，Ｑ５００）を用いて評価した。測定条件は、大気中、昇温速度１０℃／minとし、測定前の全重量の９５％の温度を５％重量減少温度と定義した。また、樹脂分が完全に分解される８００℃の重量分率から無機ナノ粒子含有量を求めた。この値は、合成における仕込み値と一致することを確認した。 The elastic modulus of the cured organic-inorganic hybrid resin was measured using TA2000 manufactured by TA Instruments for dynamic viscoelasticity measurement (Dynamic Mechanical Analysis, DMA). The heating rate was 2 ° C./min, the distance between chucks was 10 to 20 mm, the sample thickness was about 0.5 mm, and the measurement frequency was 10 Hz. The glass transition temperature was determined from the peak temperature of tan δ by DMA measurement. The 5% weight loss temperature was evaluated using a thermogravimetric analyzer (TGA, TA Instruments, Q500). The measurement conditions were defined as a 5% weight loss temperature in the atmosphere with a temperature rising rate of 10 ° C./min and a temperature of 95% of the total weight before the measurement. Further, the inorganic nanoparticle content was determined from the weight fraction at 800 ° C. at which the resin component was completely decomposed. This value was confirmed to match the charge value in the synthesis.
有機−無機ハイブリッド樹脂硬化物の透明性を目視により評価した。 The transparency of the cured organic-inorganic hybrid resin was visually evaluated.
有機−無機ハイブリッド樹脂硬化物の赤外吸収スペクトルは赤外分光装置（PerkinElmer，Spectrum１００，ＡＴＲ法）で測定した。測定条件は、測定範囲３８０−４０００cm-1，測定間隔１cm-1，積算回数１２回とした。評価結果を表３に示す。 The infrared absorption spectrum of the cured organic-inorganic hybrid resin was measured with an infrared spectrometer (PerkinElmer, Spectrum 100, ATR method). Measurement conditions were measured range 380-4000Cm -1, measured interval 1 cm -1, cumulated number 12 times. The evaluation results are shown in Table 3.
実施例１３，１４より、粒径が１００ｎｍ以下では比較例２のシリカ無添加の樹脂硬化物に対してガラス転移温度と熱分解温度の向上が見られた。これに対し、比較例３より粒径が２００ｎｍ以上では、比較例２のシリカ無添加の樹脂硬化物と同レベルの耐熱性となることが分かった。この結果より、添加する無機粒子の粒径は２００ｎｍよりも小さくすることが好ましく、１００ｎｍ以下とすることがより望ましい。 From Examples 13 and 14, when the particle size was 100 nm or less, the glass transition temperature and the thermal decomposition temperature were improved as compared with the resin-free resin-added product of Comparative Example 2. On the other hand, it was found from Comparative Example 3 that when the particle size was 200 nm or more, the same level of heat resistance as that of the resin-free resin-free product of Comparative Example 2 was added. From this result, the particle size of the inorganic particles to be added is preferably smaller than 200 nm, and more desirably 100 nm or less.
〔実施例１３〜１７〕
エタノール中にテトラエトキシシラン（ＴＥＯＳ）とアンモニアおよび水を加え、室温で１２時間攪拌した。次いで、ビニルトリメトキシシラン（ＶＴＭＳ），アリルトリメトキシシラン（ＡＴＭＳ），メタクリロキシプロピルトリメトキシシラン（ＭＰＴＭＳ），エチルトリメトキシシラン（ＥＴＭＳ），ヘキシルトリメトキシシラン（ＨＴＭＳ）をそれぞれ加え、更に１時間以上攪拌した。次いで、遠心分離器を用いてアルコールやアンモニア，水を除去し、メチルエチルケトン（ＭＥＫ）で溶媒置換した。この操作を２回繰り返した。この溶液に２，２−ビス（４−シアナトフェニル）プロパン（ＢＣＰＰ）とビスマレイミドジフェニルエタン（ＢＭＩ）を加え、遊星ボールミルで３０分間処理し、十分に混合した。混合後、１６０℃に保持しながら真空ポンプでＭＥＫを完全に除去した。最後に残った残留物を１６０℃／２ｈ，２５０℃／４ｈで加熱し、有機−無機ハイブリッド樹脂硬化物を得た。
[Examples 13 to 17]
Tetraethoxysilane (TEOS), ammonia and water were added to ethanol and stirred at room temperature for 12 hours. Subsequently, vinyltrimethoxysilane (VTMS), allyltrimethoxysilane (ATMS), methacryloxypropyltrimethoxysilane (MPTMS), ethyltrimethoxysilane (ETMS), and hexyltrimethoxysilane (HTMS) were added, respectively, and further 1 hour. Stir above. Subsequently, alcohol, ammonia, and water were removed using a centrifugal separator, and the solvent was replaced with methyl ethyl ketone (MEK). This operation was repeated twice. To this solution, 2,2-bis (4-cyanatophenyl) propane (BCPP) and bismaleimide diphenylethane (BMI) were added, treated with a planetary ball mill for 30 minutes, and mixed well. After mixing, MEK was completely removed with a vacuum pump while maintaining at 160 ° C. Finally, the remaining residue was heated at 160 ° C./2 h and 250 ° C./4 h to obtain a cured organic-inorganic hybrid resin.
有機−無機ハイブリッド樹脂硬化物の弾性率は動的粘弾性測定（Dynamic Mechanical Analysis，ＤＭＡ）はＴＡ Instruments製のＴＡ２０００を用いて測定した。昇温速度は２℃／min、チャック間距離１０〜２０mm，試料厚さ約０.５mm，測定周波数１０Ｈｚとした。ガラス転移温度は、ＤＭＡ測定よりtanδのピーク温度から求めた。５％重量減少温度は熱重量分析装置（ＴＧＡ，ＴＡ Instruments，Ｑ５００）を用いて評価した。測定条件は、大気中、昇温速度１０℃／minとし、測定前の全重量の９５％の温度を５％重量減少温度と定義した。また、樹脂分が完全に分解される８００℃の重量分率から無機ナノ粒子含有量を求めた。この値は、合成における仕込み値と一致することを確認した。 The elastic modulus of the cured organic-inorganic hybrid resin was measured using TA2000 manufactured by TA Instruments for dynamic viscoelasticity measurement (Dynamic Mechanical Analysis, DMA). The heating rate was 2 ° C./min, the distance between chucks was 10 to 20 mm, the sample thickness was about 0.5 mm, and the measurement frequency was 10 Hz. The glass transition temperature was determined from the peak temperature of tan δ by DMA measurement. The 5% weight loss temperature was evaluated using a thermogravimetric analyzer (TGA, TA Instruments, Q500). The measurement conditions were defined as a 5% weight loss temperature in the atmosphere with a temperature rising rate of 10 ° C./min and a temperature of 95% of the total weight before the measurement. Further, the inorganic nanoparticle content was determined from the weight fraction at 800 ° C. at which the resin component was completely decomposed. This value was confirmed to match the charge value in the synthesis.
有機−無機ハイブリッド樹脂硬化物の透明性を目視により評価した。 The transparency of the cured organic-inorganic hybrid resin was visually evaluated.
有機−無機ハイブリッド樹脂硬化物の赤外吸収スペクトルは赤外分光装置（PerkinElmer，Spectrum１００，ＡＴＲ法）で測定した。測定条件は、測定範囲３８０−４０００cm-1，測定間隔１cm-1，積算回数１２回とした。評価結果を表４に示す。 The infrared absorption spectrum of the cured organic-inorganic hybrid resin was measured with an infrared spectrometer (PerkinElmer, Spectrum 100, ATR method). Measurement conditions were measured range 380-4000Cm -1, measurement interval 1 cm -1, cumulated number 12 times. The evaluation results are shown in Table 4.
実施例１３〜１７のいずれも比較例２のシリカ無添加の樹脂硬化物に対してガラス転移温度と５％重量減少温度が向上した。一方で、実施例１３〜１５のビニル基，アリル基，メタクリル基等の重合性官能基を有する金属アルコキシド化合物を用いた場合のガラス転移温度と５％重量減少温度向上の効果に対して、実施例１６，１７のエチル基，ヘキシル基で置換した金属アルコキシド化合物を用いた場合には耐熱性向上の効果が小さくなった。これは、重合性官能基を有する金属アルコキシド化合物を用いた方がシリカと樹脂の親和性が高いためと考えられる。 In any of Examples 13 to 17, the glass transition temperature and the 5% weight reduction temperature were improved with respect to the resin-free resin-added product of Comparative Example 2. On the other hand, with respect to the effect of improving the glass transition temperature and the 5% weight reduction temperature when using the metal alkoxide compound having a polymerizable functional group such as vinyl group, allyl group, methacryl group or the like of Examples 13 to 15 When the metal alkoxide compound substituted with the ethyl group or hexyl group in Examples 16 and 17 was used, the effect of improving the heat resistance was reduced. This is probably because the affinity between silica and the resin is higher when the metal alkoxide compound having a polymerizable functional group is used.
〔実施例１８〜２１〕
エタノール中にテトラエトキシシラン（ＴＥＯＳ），チタニウムｉ−プロポキシド（ＴＩＰ），ジルコニウムブトキシド（ＺＢ），アルミニウムｉ−プロポキシド（ＡＰ）をそれぞれ添加し、それぞれに反応開始剤（Ｃ）であるアンモニアおよび水を加え、室温で１２時間攪拌した。次いでビニルトリメトキシシラン（ＶＴＭＳ），アリルトリメトキシシラン（ＡＴＭＳ），メタクリロキシプロピルトリメトキシシラン（ＭＰＴＭＳ），エチルトリメトキシシラン（ＥＴＭＳ）をそれぞれ加え、更に１２時間攪拌した。次いで、遠心分離器を用いてアルコールやアンモニア，水を除去し、メチルエチルケトン（ＭＥＫ）で溶媒置換した。この操作を２回繰り返した。この溶液に２，２−ビス（４−シアナトフェニル）プロパン（ＢＣＰＰ）とビスマレイミドジフェニルエタン（ＢＭＩ）を加え、遊星ボールミルで３０分間処理し、十分に混合した。混合後、１６０℃に保持しながら真空ポンプでＭＥＫを完全に除去した。最後に残った残留物を１６０℃／２ｈ，２５０℃／４ｈで加熱し、有機−無機ハイブリッド樹脂硬化物を得た。
[Examples 18 to 21]
Tetraethoxysilane (TEOS), titanium i-propoxide (TIP), zirconium butoxide (ZB), and aluminum i-propoxide (AP) were added to ethanol, respectively, and ammonia as a reaction initiator (C) and Water was added and stirred at room temperature for 12 hours. Subsequently, vinyltrimethoxysilane (VTMS), allyltrimethoxysilane (ATMS), methacryloxypropyltrimethoxysilane (MPTMS), and ethyltrimethoxysilane (ETMS) were added, and the mixture was further stirred for 12 hours. Subsequently, alcohol, ammonia, and water were removed using a centrifugal separator, and the solvent was replaced with methyl ethyl ketone (MEK). This operation was repeated twice. To this solution, 2,2-bis (4-cyanatophenyl) propane (BCPP) and bismaleimide diphenylethane (BMI) were added, treated with a planetary ball mill for 30 minutes, and mixed well. After mixing, MEK was completely removed with a vacuum pump while maintaining at 160 ° C. Finally, the remaining residue was heated at 160 ° C./2 h and 250 ° C./4 h to obtain a cured organic-inorganic hybrid resin.
有機−無機ハイブリッド樹脂硬化物の弾性率は動的粘弾性測定（Dynamic Mechanical Analysis，ＤＭＡ）はＴＡ Instruments製のＴＡ２０００を用いて測定した。昇温速度は２℃／min、チャック間距離１０〜２０mm，試料厚さ約０.５mm，測定周波数１０Ｈｚとした。ガラス転移温度は、ＤＭＡ測定よりtanδのピーク温度から求めた。５％重量減少温度は熱重量分析装置（ＴＧＡ，ＴＡ Instruments，Ｑ５００）を用いて評価した。測定条件は、大気中、昇温速度１０℃／minとし、測定前の全重量の９５％の温度を５％重量減少温度と定義した。また、樹脂分が完全に分解される８００℃の重量分率から無機ナノ粒子含有量を求めた。この値は、合成における仕込み値と一致することを確認した。 The elastic modulus of the cured organic-inorganic hybrid resin was measured using TA2000 manufactured by TA Instruments for dynamic viscoelasticity measurement (Dynamic Mechanical Analysis, DMA). The heating rate was 2 ° C./min, the distance between chucks was 10 to 20 mm, the sample thickness was about 0.5 mm, and the measurement frequency was 10 Hz. The glass transition temperature was determined from the peak temperature of tan δ by DMA measurement. The 5% weight loss temperature was evaluated using a thermogravimetric analyzer (TGA, TA Instruments, Q500). The measurement conditions were defined as a 5% weight loss temperature in the atmosphere with a temperature rising rate of 10 ° C./min and a temperature of 95% of the total weight before the measurement. Further, the inorganic nanoparticle content was determined from the weight fraction at 800 ° C. at which the resin component was completely decomposed. This value was confirmed to match the charge value in the synthesis.
有機−無機ハイブリッド樹脂硬化物の透明性を目視により評価した。 The transparency of the cured organic-inorganic hybrid resin was visually evaluated.
有機−無機ハイブリッド樹脂硬化物の赤外吸収スペクトルは赤外分光装置（PerkinElmer，Spectrum１００，ＡＴＲ法）で測定した。測定条件は、測定範囲３８０−４０００cm-1，測定間隔１cm-1，積算回数１２回とした。評価結果を表５に示す。 The infrared absorption spectrum of the cured organic-inorganic hybrid resin was measured with an infrared spectrometer (PerkinElmer, Spectrum 100, ATR method). Measurement conditions were measured range 380-4000Cm -1, measurement interval 1 cm -1, cumulated number 12 times. The evaluation results are shown in Table 5.
実施例１８〜２１では、シリカ粒子，チタニア粒子，ジルコニア粒子，アルミナ粒子の異なる種類の無機ナノ粒子を分散させた有機−無機ハイブリッド樹脂硬化物を作製した。
何れの条件でも、比較例２のシリカ無添加の樹脂硬化物に対してガラス転移温度、５％重量減少温度が向上し、無機ナノ粒子の種類による違いはほとんど見られなかった。これは、無機ナノ粒子のサイズが十分に小さいため材料バルクの特性が出現しないためと考えられる。
In Examples 18 to 21, cured organic-inorganic hybrid resins in which different types of inorganic nanoparticles of silica particles, titania particles, zirconia particles, and alumina particles were dispersed were prepared.
Under any condition, the glass transition temperature and the 5% weight loss temperature were improved with respect to the resin-cured resin-free product of Comparative Example 2, and almost no difference was observed depending on the type of inorganic nanoparticles. This is thought to be because the bulk properties of the material do not appear because the size of the inorganic nanoparticles is sufficiently small.
〔比較例４〕
エタノール中に金属アルコキシド化合物（Ｂ）の代わりに粒径が１μｍのシリカ粒子を添加し、アンモニアと水を加えてビニルトリメトキシシラン（ＶＴＭＳ）を加え、１２時間攪拌した。次いで、遠心分離器を用いてアルコールやアンモニア，水を除去し、メチルエチルケトン（ＭＥＫ）で溶媒置換した。この操作を２回繰り返した。この溶液に２，２−ビス（４−シアナトフェニル）プロパン（ＢＣＰＰ）とビスマレイミドジフェニルエタン（ＢＭＩ）を加え、遊星ボールミルで３０分間処理し、十分に混合した。混合後、１６０℃に保持しながら真空ポンプでＭＥＫを完全に除去した。最後に残った残留物を１６０℃／２ｈ，２５０℃／４ｈで加熱し、有機−無機ハイブリッド樹脂硬化物を得た。
[Comparative Example 4]
Silica particles having a particle size of 1 μm were added to ethanol instead of the metal alkoxide compound (B), ammonia and water were added, vinyltrimethoxysilane (VTMS) was added, and the mixture was stirred for 12 hours. Subsequently, alcohol, ammonia, and water were removed using a centrifugal separator, and the solvent was replaced with methyl ethyl ketone (MEK). This operation was repeated twice. To this solution, 2,2-bis (4-cyanatophenyl) propane (BCPP) and bismaleimide diphenylethane (BMI) were added, treated with a planetary ball mill for 30 minutes, and mixed well. After mixing, MEK was completely removed with a vacuum pump while maintaining at 160 ° C. Finally, the remaining residue was heated at 160 ° C./2 h and 250 ° C./4 h to obtain a cured organic-inorganic hybrid resin.
有機−無機ハイブリッド樹脂硬化物の弾性率は動的粘弾性測定（Dynamic Mechanical Analysis，ＤＭＡ）はＴＡ Instruments製のＴＡ２０００を用いて測定した。昇温速度は２℃／min、チャック間距離１０〜２０mm，試料厚さ約０.５mm，測定周波数１０Ｈｚとした。ガラス転移温度は、ＤＭＡ測定よりtanδのピーク温度から求めた。５％重量減少温度は熱重量分析装置（ＴＧＡ，ＴＡ Instruments，Ｑ５００）を用いて評価した。測定条件は、大気中、昇温速度１０℃／minとし、測定前の全重量の９５％の温度を５％重量減少温度と定義した。また、樹脂分が完全に分解される８００℃の重量分率から無機ナノ粒子含有量を求めた。この値は、合成における仕込み値と一致することを確認した。 The elastic modulus of the cured organic-inorganic hybrid resin was measured using TA2000 manufactured by TA Instruments for dynamic viscoelasticity measurement (Dynamic Mechanical Analysis, DMA). The heating rate was 2 ° C./min, the distance between chucks was 10 to 20 mm, the sample thickness was about 0.5 mm, and the measurement frequency was 10 Hz. The glass transition temperature was determined from the peak temperature of tan δ by DMA measurement. The 5% weight loss temperature was evaluated using a thermogravimetric analyzer (TGA, TA Instruments, Q500). The measurement conditions were defined as a 5% weight loss temperature in the atmosphere with a temperature rising rate of 10 ° C./min and a temperature of 95% of the total weight before the measurement. Further, the inorganic nanoparticle content was determined from the weight fraction at 800 ° C. at which the resin component was completely decomposed. This value was confirmed to match the charge value in the synthesis.
有機−無機ハイブリッド樹脂硬化物の透明性を目視により評価した。 The transparency of the cured organic-inorganic hybrid resin was visually evaluated.
有機−無機ハイブリッド樹脂硬化物の赤外吸収スペクトルは赤外分光装置（PerkinElmer，Spectrum１００，ＡＴＲ法）で測定した。測定条件は、測定範囲３８０−４０００cm-1，測定間隔１cm-1，積算回数１２回とした。 The infrared absorption spectrum of the cured organic-inorganic hybrid resin was measured with an infrared spectrometer (PerkinElmer, Spectrum 100, ATR method). Measurement conditions were measured range 380-4000Cm -1, measurement interval 1 cm -1, cumulated number 12 times.
測定の結果、外観は不透明であった。また、ガラス転移温度は２７０℃、５％重量減少温度は４１０℃と、樹脂単独の値とほぼ同程度であった。 As a result of the measurement, the appearance was opaque. The glass transition temperature was 270 ° C., and the 5% weight loss temperature was 410 ° C., which was almost the same as the value of the resin alone.
〔比較例５〕
エタノール中にＴＥＯＳアンモニアおよび水を加え、室温で１２時間攪拌した。次いでビニルトリメトキシシラン（ＶＴＭＳ）を加え、更に１２時間攪拌した。次いで、ＭＥＫで溶媒置換せずに、樹脂原料である２，２−ビス（４−シアナトフェニル）プロパン（ＢＣＰＰ）とビスマレイミドジフェニルエタン（ＢＭＩ）を加え、遊星ボールミルで３０分間処理し、十分に混合した。混合後、１６０℃に保持しながら真空ポンプで溶媒を完全に除去した。最後に残った残留物を１６０℃／２ｈ，２５０℃／４ｈで加熱し、有機−無機ハイブリッド樹脂硬化物を得た。
[Comparative Example 5]
TEOS ammonia and water were added to ethanol and stirred at room temperature for 12 hours. Subsequently, vinyltrimethoxysilane (VTMS) was added and further stirred for 12 hours. Next, without replacing the solvent with MEK, the resin raw materials 2,2-bis (4-cyanatophenyl) propane (BCPP) and bismaleimide diphenylethane (BMI) were added and treated with a planetary ball mill for 30 minutes. Mixed. After mixing, the solvent was completely removed with a vacuum pump while maintaining at 160 ° C. Finally, the remaining residue was heated at 160 ° C./2 h and 250 ° C./4 h to obtain a cured organic-inorganic hybrid resin.
有機−無機ハイブリッド樹脂硬化物の弾性率は動的粘弾性測定（Dynamic Mechanical Analysis，ＤＭＡ）はＴＡ Instruments製のＴＡ２０００を用いて測定した。昇温速度は２℃／min、チャック間距離１０〜２０mm，試料厚さ約０.５mm，測定周波数１０Ｈｚとした。ガラス転移温度は、ＤＭＡ測定よりtanδのピーク温度から求めた。５％重量減少温度は熱重量分析装置（ＴＧＡ，ＴＡ Instruments，Ｑ５００）を用いて評価した。測定条件は、大気中、昇温速度１０℃／minとし、測定前の全重量の９５％の温度を５％重量減少温度と定義した。また、樹脂分が完全に分解される８００℃の重量分率から無機ナノ粒子含有量を求めた。この値は、合成における仕込み値と一致することを確認した。 The elastic modulus of the cured organic-inorganic hybrid resin was measured using TA2000 manufactured by TA Instruments for dynamic viscoelasticity measurement (Dynamic Mechanical Analysis, DMA). The heating rate was 2 ° C./min, the distance between chucks was 10 to 20 mm, the sample thickness was about 0.5 mm, and the measurement frequency was 10 Hz. The glass transition temperature was determined from the peak temperature of tan δ by DMA measurement. The 5% weight loss temperature was evaluated using a thermogravimetric analyzer (TGA, TA Instruments, Q500). The measurement conditions were defined as a 5% weight loss temperature in the atmosphere with a temperature rising rate of 10 ° C./min and a temperature of 95% of the total weight before the measurement. Further, the inorganic nanoparticle content was determined from the weight fraction at 800 ° C. at which the resin component was completely decomposed. This value was confirmed to match the charge value in the synthesis.
有機−無機ハイブリッド樹脂硬化物の透明性を目視により評価した。 The transparency of the cured organic-inorganic hybrid resin was visually evaluated.
有機−無機ハイブリッド樹脂硬化物の赤外吸収スペクトルは赤外分光装置（PerkinElmer，Spectrum１００，ＡＴＲ法）で測定した。測定条件は、測定範囲３８０−４０００cm-1，測定間隔１cm-1，積算回数１２回とした。 The infrared absorption spectrum of the cured organic-inorganic hybrid resin was measured with an infrared spectrometer (PerkinElmer, Spectrum 100, ATR method). Measurement conditions were measured range 380-4000Cm -1, measurement interval 1 cm -1, cumulated number 12 times.
測定の結果、ガラス転移温度は２００℃、５％重量減少温度は３５０℃であり、無機ナノシリカ無添加と比較してガラス転移温度は７０℃、５％重量減少温度は６０℃低下した。 As a result of the measurement, the glass transition temperature was 200 ° C., the 5% weight reduction temperature was 350 ° C., and the glass transition temperature was 70 ° C. and the 5% weight reduction temperature was reduced by 60 ° C., compared to the case where no inorganic nanosilica was added.
図３に比較例５で合成した有機−無機ハイブリッド樹脂硬化物のＦＴ−ＩＲスペクトルを示す。図３において、点線がナノシリカ無添加の有機−無機ハイブリッド樹脂硬化物のＦＴ−ＩＲスペクトルで、実線が比較例５で得られるナノシリカを１０ｗｔ％添加した有機−無機ハイブリッド樹脂硬化物のＦＴ−ＩＲスペクトルである。比較例５で得られる有機−無機ハイブリッド樹脂硬化物は、シリカ無添加の有機−無機ハイブリッド樹脂硬化物で見られる１３６０cm-1と１５６０cm-1のトリアジン環由来の吸収が消失していることが分かる。これは、ＭＥＫで溶媒置換せずに合成したため、シアネート化合物とアルコールとの反応等により樹脂が変質し、耐熱性が低下したと考えられる。 FIG. 3 shows an FT-IR spectrum of the cured organic-inorganic hybrid resin synthesized in Comparative Example 5. In FIG. 3, the dotted line is the FT-IR spectrum of the organic-inorganic hybrid resin cured product without addition of nanosilica, and the solid line is the FT-IR spectrum of the cured organic-inorganic hybrid resin with 10 wt% of nanosilica obtained in Comparative Example 5. It is. The organic obtained in Comparative Example 5 - inorganic hybrid cured resin, an organic silica additive-free - it can be seen that the absorption derived from the triazine ring inorganic hybrid resin curing seen with compound 1360 cm -1 and 1560 cm -1 had disappeared . Since this was synthesized without solvent substitution with MEK, it is considered that the resin was altered by the reaction of a cyanate compound and an alcohol and the heat resistance was lowered.
１０１ パワー半導体素子
１０２ 回路配線部材
１０３ リード部材
１０４ 接合材
１０５ ワイヤ
１０６ 絶縁基板
１０７ 放熱板
１０８ 封止樹脂
DESCRIPTION OF SYMBOLS 101 Power semiconductor element 102 Circuit wiring member 103 Lead member 104 Bonding material 105 Wire 106 Insulating substrate 107 Heat sink 108 Sealing resin
Claims (8)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011143735A JP5358623B2 (en) | 2011-06-29 | 2011-06-29 | Organic-inorganic hybrid material |
| TW101121328A TWI457383B (en) | 2011-06-29 | 2012-06-14 | The organic - inorganic hybrid material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011143735A JP5358623B2 (en) | 2011-06-29 | 2011-06-29 | Organic-inorganic hybrid material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013010843A true JP2013010843A (en) | 2013-01-17 |
| JP5358623B2 JP5358623B2 (en) | 2013-12-04 |
Family
ID=47684996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011143735A Expired - Fee Related JP5358623B2 (en) | 2011-06-29 | 2011-06-29 | Organic-inorganic hybrid material |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5358623B2 (en) |
| TW (1) | TWI457383B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9725561B2 (en) | 2014-06-20 | 2017-08-08 | 3M Innovative Properties Company | Curable polymers comprising silsesquioxane polymer core and silsesquioxane polymer outer layer and methods |
| US9957358B2 (en) | 2014-09-22 | 2018-05-01 | 3M Innovative Properties Company | Curable polymers comprising silsesquioxane polymer core silsesquioxane polymer outer layer, and reactive groups |
| US9957416B2 (en) | 2014-09-22 | 2018-05-01 | 3M Innovative Properties Company | Curable end-capped silsesquioxane polymer comprising reactive groups |
| US10066123B2 (en) | 2013-12-09 | 2018-09-04 | 3M Innovative Properties Company | Curable silsesquioxane polymers, compositions, articles, and methods |
| US10370564B2 (en) | 2014-06-20 | 2019-08-06 | 3M Innovative Properties Company | Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods |
| US10392538B2 (en) | 2014-06-20 | 2019-08-27 | 3M Innovative Properties Company | Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods |
| CN114409959A (en) * | 2022-01-12 | 2022-04-29 | 东华大学 | Organic-inorganic hybrid high-performance resin toughening agent and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08217974A (en) * | 1995-02-14 | 1996-08-27 | Sumitomo Chem Co Ltd | Cyanate resin composition |
| JPH11124487A (en) * | 1997-10-22 | 1999-05-11 | Mitsubishi Gas Chem Co Inc | Cyanic acid ester-maleimide liquid resin composition and sealed semiconductor device |
| JP2005068347A (en) * | 2003-08-27 | 2005-03-17 | Mitsui Chemicals Inc | Polyimide composition, method for producing the same and use thereof |
| JP2006028265A (en) * | 2004-07-13 | 2006-02-02 | Hitachi Chem Co Ltd | Liquid encapsulation resin composition, electronic component device and its manufacturing process |
| JP2011513541A (en) * | 2008-03-07 | 2011-04-28 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Curable reactive resin system |
| WO2012026451A1 (en) * | 2010-08-25 | 2012-03-01 | 日産化学工業株式会社 | Film-forming composition |
-
2011
- 2011-06-29 JP JP2011143735A patent/JP5358623B2/en not_active Expired - Fee Related
-
2012
- 2012-06-14 TW TW101121328A patent/TWI457383B/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08217974A (en) * | 1995-02-14 | 1996-08-27 | Sumitomo Chem Co Ltd | Cyanate resin composition |
| JPH11124487A (en) * | 1997-10-22 | 1999-05-11 | Mitsubishi Gas Chem Co Inc | Cyanic acid ester-maleimide liquid resin composition and sealed semiconductor device |
| JP2005068347A (en) * | 2003-08-27 | 2005-03-17 | Mitsui Chemicals Inc | Polyimide composition, method for producing the same and use thereof |
| JP2006028265A (en) * | 2004-07-13 | 2006-02-02 | Hitachi Chem Co Ltd | Liquid encapsulation resin composition, electronic component device and its manufacturing process |
| JP2011513541A (en) * | 2008-03-07 | 2011-04-28 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Curable reactive resin system |
| WO2012026451A1 (en) * | 2010-08-25 | 2012-03-01 | 日産化学工業株式会社 | Film-forming composition |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10066123B2 (en) | 2013-12-09 | 2018-09-04 | 3M Innovative Properties Company | Curable silsesquioxane polymers, compositions, articles, and methods |
| US9725561B2 (en) | 2014-06-20 | 2017-08-08 | 3M Innovative Properties Company | Curable polymers comprising silsesquioxane polymer core and silsesquioxane polymer outer layer and methods |
| US10370564B2 (en) | 2014-06-20 | 2019-08-06 | 3M Innovative Properties Company | Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods |
| US10392538B2 (en) | 2014-06-20 | 2019-08-27 | 3M Innovative Properties Company | Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods |
| US9957358B2 (en) | 2014-09-22 | 2018-05-01 | 3M Innovative Properties Company | Curable polymers comprising silsesquioxane polymer core silsesquioxane polymer outer layer, and reactive groups |
| US9957416B2 (en) | 2014-09-22 | 2018-05-01 | 3M Innovative Properties Company | Curable end-capped silsesquioxane polymer comprising reactive groups |
| CN114409959A (en) * | 2022-01-12 | 2022-04-29 | 东华大学 | Organic-inorganic hybrid high-performance resin toughening agent and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201305262A (en) | 2013-02-01 |
| TWI457383B (en) | 2014-10-21 |
| JP5358623B2 (en) | 2013-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5358623B2 (en) | Organic-inorganic hybrid material | |
| JP5193207B2 (en) | Silane compound, production method thereof, and resin composition containing silane compound | |
| TWI804615B (en) | Thermosetting maleimide resin composition for semiconductor sealing and semiconductor device | |
| JP4935972B2 (en) | Composition for optical semiconductor encapsulation, method for producing the same, and optical semiconductor encapsulant | |
| JP6902193B2 (en) | Manufacture method of composition for heat dissipation member, heat dissipation member, electronic device, heat dissipation member | |
| TW201213398A (en) | Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition | |
| WO2013021717A1 (en) | Silicon-containing curable composition and cured product of same | |
| JP6009120B2 (en) | Curable composition, method for producing curable composition, cured product, method for using curable composition, and optical device | |
| JP5569703B2 (en) | Epoxy group-containing silsesquioxane-modified epoxy resin, curable resin composition, cured product and coating agent | |
| CN112585087B (en) | Method for producing silicon-oxide-coated aluminum nitride particles, and silicon-oxide-coated aluminum nitride particles | |
| WO2017122762A1 (en) | Condensation reaction-type silicone composition and cured product | |
| JP2001059013A (en) | Epoxy resin composition | |
| Liu et al. | Self‐adhesive epoxy modified silicone materials for light emitting diode encapsulation | |
| TW202028325A (en) | Liquid composition, resin composite, liquid sealing material, sealing material, and electronic device | |
| JP2009013398A (en) | Thermosetting binder resin composition for bonded magnet | |
| WO2021153683A1 (en) | Silsesquioxane derivative and use therefor | |
| Anoop et al. | Development of an optically transparent polysilsesquioxane/PDMS addition cured nanocomposite adhesive for electronic applications | |
| KR101284764B1 (en) | Epoxy Compositions Having Enhanced Heat Conductivity | |
| KR101147971B1 (en) | Low-k siloxane passivation layer composition | |
| JP2008274013A (en) | Curable epoxy resin composition and its manufacturing method | |
| JP2017168808A (en) | Thermosetting white ink for CSP-LED | |
| JP2009108109A (en) | Thermosetting resin composition, cured product, and light emitting diode derived from them | |
| Skachkova et al. | Optically transparent heat-resistant nanocomposites based on epoxy resin and silicon dioxide | |
| JP5297598B2 (en) | Curable epoxy resin composition and method for producing the same | |
| JP5943104B2 (en) | Curable composition, cured film, polysiloxane, and optical semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130305 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130513 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130611 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130710 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130806 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130902 |
|
| LAPS | Cancellation because of no payment of annual fees |