JP2013008842A - Multilayer capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a feed-through capacitor capable of suppressing infiltration of a plating liquid and suppressing generation of insulation resistance defects.SOLUTION: In a feed-through capacitor 1, a width of a first connection part 13A of an internal electrode 6 for signals is narrower than a width of a first main electrode part 11A and a first lead-out part 12A. Thus, when forming a plating layer on an end face of an element assembly 2, the plating liquid is prevented from reaching the first main electrode part 11A of the internal electrode 6 for signals by the narrow first connection part 13A. Also, in the feed-through capacitor 1, a width of a second connection part 13B is almost the same as the width of the first connection part 13A. Thus, the plating liquid is prevented from reaching a second main electrode part 11B of an internal electrode for grounding by the narrow second connection part 13B. Further, even when the plating liquid infiltrates, the reaching time of the plating liquid at the first main electrode part 11A and the reaching time of the plating liquid at the second main electrode part 11B can be matched.

Description

  The present invention relates to a feedthrough capacitor.

  As a conventional feedthrough capacitor, for example, there is a feedthrough capacitor described in Patent Document 1. The feedthrough capacitor includes signal internal electrodes and ground internal electrodes alternately arranged in the element body. The signal internal electrode and the ground internal electrode exist so as to penetrate through the element body, and are configured to connect the terminal electrode and the ground electrode arranged opposite to each other on the end face of the element body.

Japanese Utility Model Publication No. 58-89926

  By the way, in the feedthrough capacitor as described above, a green sheet on which a predetermined internal electrode pattern is formed is stacked and fired to obtain an element body, and then a plating layer is formed on the end surface of the element body using a predetermined plating solution. These are used as a terminal electrode and a ground electrode. When this plating layer is formed, if the plating solution enters the signal internal electrode side and the grounding internal electrode side from the end face of the element body, an insulation resistance defect may occur.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a feedthrough capacitor that can suppress the penetration of a plating solution and suppress the occurrence of defective insulation resistance.

  In order to solve the above problems, a feedthrough capacitor according to the present invention includes an element body formed by stacking dielectric layers, signal internal electrodes and ground internal electrodes alternately arranged in the element body, A terminal electrode disposed on the opposing first end face and electrically connected by the signal internal electrode, and a second end face opposing each other in the direction intersecting the first end face in the element body, respectively, A feedthrough capacitor having a ground electrode electrically connected by an electrode, wherein the terminal electrode and the ground electrode are composed of a single layer or a plurality of plating layers, and the signal internal electrode is adjacent to ground A first main electrode portion facing the internal electrode, a first lead portion exposed at the first end surface, and a first connecting portion connecting the first main electrode portion and the first lead portion, and for grounding The internal electrode is an adjacent signal internal electrode A width of the first connecting portion, the second connecting portion connecting the second main electrode portion and the second leading portion, and a second leading portion exposed to the second end surface; Is narrower than the width of the first lead portion and the first main electrode portion, and the width of the second connecting portion is substantially equal to the width of the first connecting portion.

  In this feedthrough capacitor, the width of the first connecting portion of the signal internal electrode is narrower than the width of the first main electrode portion and the first lead portion. As a result, when the plating layer is formed on the end face of the element body, it is possible to suppress the plating solution from reaching the first main electrode portion of the signal internal electrode by the narrow first connecting portion, and the occurrence of defective insulation resistance. Can be suppressed. Further, in this feedthrough capacitor, the width of the second connecting portion is substantially equal to the width of the first connecting portion. Thereby, it can suppress that a plating solution reaches | attains the 2nd main electrode part of the internal electrode for earthing | grounding by a narrow 2nd connection part, and generation | occurrence | production of an insulation resistance defect can be suppressed. Furthermore, even if the plating solution has entered, it is possible to align the arrival time of the plating solution to the first main electrode portion and the arrival time of the plating solution to the second main electrode portion.

  Moreover, it is preferable that the 1st connection part is provided with two or more mutually spaced apart. In this case, since the width of each first connection portion becomes smaller, the infiltration of the plating solution into the first main electrode portion can be more reliably suppressed.

  In addition, it is preferable that a plurality of second connecting portions are provided apart from each other. In this case, since the width of each of the second connecting portions becomes smaller, it is possible to more reliably suppress the infiltration of the plating solution into the second main electrode portion.

  Moreover, it is preferable that the 1st drawer | drawing-out part has a 1st part connected with a 1st connection part, and a 2nd part spaced apart from the 1st part. In this case, since the area of the first lead portion exposed on the surface of the element body can be secured by the second portion, the fixing strength of the plating layer covering the first lead portion can be improved. Further, by making the first portion thinner, it is possible to more reliably suppress the penetration of the plating solution.

  Moreover, it is preferable that the 2nd drawer part has a 1st part connected with a 2nd connection part, and a 2nd part spaced apart from the 1st part. In this case, since the area of the second lead portion exposed on the surface of the element body can be secured by the second portion, the fixing strength of the plating layer covering the second lead portion can be improved. Further, by making the first portion thinner, it is possible to more reliably suppress the penetration of the plating solution.

  According to the present invention, it is possible to suppress the penetration of the plating solution and suppress the occurrence of defective insulation resistance.

1 is a perspective view showing a feedthrough capacitor according to a first embodiment of the present invention. It is sectional drawing which shows the layer structure of the feedthrough capacitor shown in FIG. It is a figure which shows the pattern of the internal electrode of the feedthrough capacitor shown in FIG. It is a perspective view which shows the feedthrough capacitor which concerns on 2nd Embodiment of this invention. It is a figure which shows the pattern of the internal electrode of the feedthrough capacitor shown in FIG. It is a perspective view which shows the feedthrough capacitor which concerns on 3rd Embodiment of this invention. It is a perspective view which shows the pattern of the internal electrode of the feedthrough capacitor shown in FIG.

Hereinafter, a preferred embodiment of a feedthrough capacitor according to the present invention will be described in detail with reference to the drawings. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios.
[First Embodiment]

  FIG. 1 is a perspective view showing a feedthrough capacitor according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing the layer structure of the feedthrough capacitor shown in FIG. As shown in FIGS. 1 and 2, the feedthrough capacitor 1 includes an element body 2, a pair of terminal electrodes 3, a pair of ground electrodes 4, a signal internal electrode 6, and a ground internal electrode 7. It is configured.

As shown in FIG. 2, the element body 2 is formed by laminating a plurality of dielectric layers 5 and has a substantially rectangular parallelepiped shape. The dielectric layer 5 is formed of a dielectric material having electrostrictive characteristics such as a BaTiO ₃ system, a Ba (Ti, Zr) O ₃ system, and a (Ba, Ca) TiO ₃ system.

  The terminal electrode 3 is formed across the end face (first end face) 2a in the longitudinal direction of the element body 2 and the end of the end face (second end face) 2b orthogonal to the end face 2a, and is in a state of facing each other. The terminal electrode 3 is multi-layered by a plurality of plating layers. For example, Cu or Ni is used for the inner plating layer in contact with the element body 2, and Ag, Sn, or the like is used for the outer plating layer, for example. Used.

  In the element body 2, the ground electrodes 4 are respectively formed at substantially central portions of the end surface 2b orthogonal to the end surface 2a, and are in a state of facing each other. Similarly to the terminal electrode 3, the ground electrode 4 is multilayered by a plurality of plating layers. The ground electrode 4 is electrically insulated from the terminal electrode 3 on the surface of the element body 2.

  The signal internal electrodes 6 and the ground internal electrodes 7 are alternately stacked in the element body 2 so as to sandwich at least one dielectric layer 5 therebetween. The thickness of the dielectric layer 5 interposed between the signal internal electrode 6 and the ground internal electrode 7 is thinned to about 1 to 5 μm, for example.

  As shown in FIG. 3A, the signal internal electrode 6 is exposed to the first main electrode portion 11 </ b> A facing the second main electrode portion 11 </ b> B of the ground internal electrode 7 and the end surface 2 a of the element body 2. 12 A of 1 extraction parts, and the 1st connection part 13A which connects 11 A of 1st main electrode parts, and 12 A of 1st extraction parts, penetrate the element | base_body 2 to a longitudinal direction, and electrically connect terminal electrodes 3 and 3 with each other Connected.

The first main electrode portion 11 </ b> A extends in a rectangular shape in the longitudinal direction of the element body 2. First extraction portion 12A extends in the end face 2a side central portion of the element body 2, the first and part 12A ₁ connected to the first connecting portion 13A, spaced from the first portion 12A ₁ and a second portion 12A ₂ respectively disposed on both sides Te. First connecting portion 13A is a first portion 12A ₁ and substantially equal width of the first lead-out portion 12A, connecting the central portion of the first main electrode portion 11A in the first lead-out portion 12A. Note that the width of the first lead portions 12A, refers to the first portion 12A ₁ and second portions 12A ₂ and the combined width, the first portion 12A ₁ and between the second portion 12A ₂ Width is not included.

  A dummy electrode 14 </ b> B is formed in the same layer as the signal internal electrode 6. The dummy electrode 14 </ b> B extends to the central portion on the end face 2 b side of the element body 2 and is connected only to the ground electrode 4.

  As shown in FIG. 3B, the grounding internal electrode 7 is exposed to the second main electrode portion 11 </ b> B facing the first main electrode portion 11 </ b> A of the signal internal electrode 6 and the end surface 2 b of the element body 2. 2 lead part 12B, and 2nd connection part 13B which connects 2nd main electrode part 11B and 2nd lead part 12B, and penetrates element body 2 in the width direction, and grounding electrodes 4 and 4 are electrically connected Connected.

The second main electrode portion 11B extends in a rectangular shape in the longitudinal direction of the element body 2 with an area substantially equal to that of the first main electrode portion 11A. The second lead portion 12B extends to the central portion on the end surface 2b side of the element body 2 with a width smaller than the width of the second main electrode portion 11B. Second extraction portion 12B, a first portion 12B ₁ connected to the second coupling portion 13B, a second portion 12B ₂ respectively disposed on both sides at a distance from the first portion 12B ₁ Have. Second coupling portion 13B, the first portion 12A _1, a first portion 12B _1, and the first connecting portion 13A and substantially equal width of the second lead portion 12B, the second main electrode of the first lead-out portion 12A The center part of 11B is connected to the 2nd drawer | drawing-out part 12B. Note that the width of the first lead portions 12B, refers to the first portion 12B ₁ and the second portion 12B ₂ and the combined width, a first portion 12B ₁ and between the second portion 12B ₂ Width is not included.

  A dummy electrode 14 </ b> D is formed in the same layer as the grounding internal electrode 7. The dummy electrode 14 </ b> D extends with the same width as the element body 2 on the end face 2 a side of the element body 2, and is connected only to the terminal electrode 3.

  A protective layer 8 and a protective layer 9 are further laminated on the outer layers of the signal internal electrode 6 and the ground internal electrode 7. As shown in FIG. 3C, dummy electrodes 14 </ b> E and 14 </ b> F are formed on the protective layer 8. Like the dummy electrode 14D, the dummy electrode 14E extends to the end face 2a side of the element body 2 with the same width as the element body 2, and is connected only to the terminal electrode 3. Similar to the dummy electrode 14B, the dummy electrode 14F extends to the central portion on the end face 2b side of the element body 2 and is connected only to the ground electrode 4. On the other hand, as shown in FIG. 3 (d), the dummy electrode is not formed on the protective layer 9, and only the dielectric layer 5 is formed.

  As described above, in the feedthrough capacitor 1, the width of the first connecting portion 13A of the signal internal electrode 6 is narrower than the width of the first main electrode portion 11A and the first lead portion 12A. Thereby, when forming a plating layer on the end surface of the element body 2, it is possible to suppress the plating solution from reaching the first main electrode portion 11 </ b> A of the signal internal electrode 6 by the narrow first connecting portion 13 </ b> A, and to have an insulation resistance. The occurrence of defects can be suppressed.

In the feedthrough capacitor 1, the width of the second connecting portion 13B is substantially equal to the width of the first connecting portion 13A. Thereby, it can suppress that a plating solution reaches | attains the 2nd main electrode part 11B of the internal electrode for grounding by the narrow 2nd connection part 13B, and can suppress generation | occurrence | production of an insulation resistance defect. Furthermore, even if the plating solution has entered, it is possible to align the arrival time of the plating solution to the first main electrode portion 11A and the arrival time of the plating solution to the second main electrode portion 11B. Thereby, the dispersion | variation in the fall of insulation resistance can be reduced.
[Second Embodiment]

  FIG. 4 is a perspective view showing a feedthrough capacitor according to the second embodiment of the present invention. FIG. 5 is a diagram showing electrode patterns of the signal internal electrode and the ground internal electrode of the feedthrough capacitor shown in FIG. As shown in the figure, in the feedthrough capacitor 21 of the second embodiment, the electrode pattern of each internal electrode is different from that of the feedthrough capacitor 1 of the first embodiment. Accordingly, the terminal electrode 23 is formed in a rectangular shape at the center portion of the end surface 2 a in the longitudinal direction of the element body 2.

  As shown in FIG. 5A, the signal internal electrode 26 is exposed to the first main electrode portion 31 </ b> A facing the second main electrode portion 31 </ b> B of the grounding internal electrode 27 and the end surface 2 a of the element body 2. The first lead portion 32A and the first main electrode portion 31A and the first lead portion 33A for connecting the first lead portion 32A are provided, and the terminal electrodes 3 and 3 are electrically connected to each other through the element body 2 in the longitudinal direction. Connected.

  The first main electrode portion 31 </ b> A extends in a rectangular shape in the longitudinal direction of the element body 2. The first lead portion 32A has a width substantially equal to that of the first main electrode portion 31A and extends to the central portion of the element body 2 on the end face 2a side. 33 A of 1st connection parts are provided in two places by the width | variety narrower than the 1st main electrode part 31A and the 1st extraction part 32A, and the both ends of the width direction of the 1st main electrode part 31A and the 1st extraction part 32A is connected to both end portions in the width direction.

  A dummy electrode 34 A is formed in the same layer as the signal internal electrode 26. The dummy electrode 34 </ b> A extends to the central portion on the end face 2 b side of the element body 2 and is connected only to the ground electrode 4.

  As shown in FIG. 5B, the grounding internal electrode 27 is exposed to the second main electrode portion 31 </ b> B facing the first main electrode portion 31 </ b> A of the signal internal electrode 26 and the end surface 2 b of the element body 2. 2 lead part 32B, and 2nd connection part 33B which connects 2nd main electrode part 31B and 2nd lead part 32B, and penetrates element body 2 in the width direction, and grounding electrodes 4 and 4 are electrically connected. Connected.

  The second main electrode portion 31B extends in a rectangular shape in the longitudinal direction of the element body 2 with an area substantially equal to that of the first main electrode portion 31A. The second lead portion 32B extends to the central portion on the end face 2b side of the element body 2 with a width narrower than the width of the second main electrode portion 31B. The second connecting portion 33B is provided at two parts with substantially the same width as the first connecting portion 33A, and connects the central portion of the second main electrode portion 31B to both end portions of the second lead portion 32B.

  A dummy electrode 34 </ b> B is formed in the same layer as the grounding internal electrode 27. The dummy electrode 34 </ b> B has the same width as the second main electrode portion 31 </ b> B on the end surface 2 a side of the element body 2, and is connected only to the terminal electrode 3.

  A protective layer 28 and a protective layer 29 are further laminated on the outer layers of the signal internal electrode 26 and the ground internal electrode 27. Dummy electrodes 34C and 34D are formed on the protective layer 28. As shown in FIG. 5C, the dummy electrode 34 </ b> C extends to the central portion on the end face 2 a side of the element body 2 and is connected only to the terminal electrode 3, similarly to the dummy electrode 34 </ b> B. Similar to the dummy electrode 34A, the dummy electrode 34D extends to the central portion on the end face 2b side of the element body 2 and is connected only to the ground electrode 4. As shown in FIG. 5D, the protective layer 29 is not formed with a dummy electrode, and is formed only of the dielectric layer 5.

Even in such a configuration, the same effects as those of the first embodiment can be achieved. Further, by providing the narrow first connecting portion 33A and the second connecting portion 33B in two locations, the infiltration of the plating solution into the first main electrode portion 31A and the second main electrode portion 31B is further suppressed. It becomes possible. Therefore, it is possible to more reliably suppress the occurrence of defective insulation resistance.
[Third Embodiment]

  FIG. 6 is a perspective view showing a feedthrough capacitor according to a third embodiment of the present invention. FIG. 7 is a diagram showing electrode patterns of the signal internal electrode and the ground internal electrode of the feedthrough capacitor shown in FIG. In the feedthrough capacitor 41 of the third embodiment, the electrode pattern of each internal electrode is further different from that of the first embodiment. Accordingly, like the terminal electrode 23, the terminal electrode 43 is formed in a rectangular shape at the central portion of the end face 2 a in the longitudinal direction of the element body 2.

  As shown in FIG. 7A, the signal internal electrode 46 is exposed to the first main electrode portion 51 </ b> A facing the second main electrode portion 51 </ b> B of the ground internal electrode 47 and the end surface 2 a of the element body 2. The first lead portion 52A, the first main electrode portion 51A and the first lead portion 52A for connecting the first lead portion 52A, and the terminal electrode 3, 3 are electrically connected to each other through the element body 2 in the longitudinal direction. Connected.

The first main electrode portion 51 </ b> A extends in a rectangular shape in the longitudinal direction of the element body 2. The first lead-out portion 52A is located at the central portion on the end surface 2a side of the element body 2, and is provided in five locations with a narrower width than the first main electrode portion 51A, and is connected to the first connecting portion 53A. It is the first and part 52A ₁ of the three was, and has two second portions 52A ₂ respectively disposed between ₁ first portion 52A. First connecting portion 53A is provided separately on three in the first part 52A ₁ and substantially equal width of the first lead portions 52A, a central portion and both end portions in the width direction of the first main electrode portion 51A It is connected to the first lead portion 52A. Note that the width of the first lead portions 52A, refers to the first portion 52A ₁ and second portions 52A ₂ and the combined width, the first portion 52A ₁ and between the second portion 52A ₂ Width is not included.

  A dummy electrode 54 </ b> B is formed in the same layer as the signal internal electrode 46. The dummy electrode 54 </ b> B extends to the central portion on the end face 2 b side of the element body 2 and is connected only to the ground electrode 4.

  As shown in FIG. 7B, the grounding internal electrode 47 is exposed to the second main electrode portion 51 </ b> B facing the first main electrode portion 51 </ b> A of the signal internal electrode 46 and the end surface 2 b of the element body 2. And a second connecting portion 53B that connects the second main electrode portion 51B and the second leading portion 52B, and passes through the element body 2 in the width direction to electrically connect the ground electrodes 4 and 4 to each other. Connected.

The second main electrode portion 51B extends in a rectangular shape in the longitudinal direction of the element body 2 with an area substantially equal to that of the first main electrode portion 51A. The second lead portion 52B is located at the central portion of the element body 2 on the end face 2b side, and is provided in five portions with a width narrower than the width of the second main electrode portion 51B, and the second connecting portion 53B. concatenated with the two first portions 52B _1, the first portion _52B 1, 52B ₁ between the three second portions which are provided separately in three locations in and outside of the first portion 52B ₁ to and a 52B _2. Second coupling portion 53B is provided separately at two positions in the first portion 52B ₁ and the first connecting portion 53A and substantially equal width of the second lead portion 52B, the central portion of the second main electrode portion 51B first It connects with 2 drawer part 52B, respectively. Note that the width of the second lead portions 52B, refers to the first portion 52B ₁ and the second portion 52B ₂ and the combined width, a first portion 52B ₁ and between the second portion 52B ₂ Width is not included.

  A dummy electrode 54D is formed in the same layer as the grounding internal electrode 47. The dummy electrode 54 </ b> D extends with the same width as the second main electrode portion 51 </ b> B on the end face 2 a side of the element body 2, and is connected only to the terminal electrode 3.

  A protective layer 48 and a protective layer 49 are further laminated on the outer layers of the signal internal electrode 46 and the ground internal electrode 47. As shown in FIG. 7C, dummy electrodes 54 </ b> E and 54 </ b> F are formed on the protective layer 48. Like the dummy electrode 54B, the dummy electrode 54E extends to the central portion on the end face 2a side of the element body 2 and is connected only to the terminal electrode 3. The dummy electrode 54 </ b> F extends to the center portion on the end face 2 b side of the element body 2 and is connected only to the ground electrode 4. As shown in FIG. 7D, the protective layer 49 is not formed with a dummy electrode, and is formed only of the dielectric layer 5.

  Even in such a configuration, the same effects as those of the first embodiment can be achieved. Further, by providing the narrow first connecting portion 53A and second connecting portion 53B at a plurality of locations, the infiltration of the plating solution into the first main electrode portion 51A and the second main electrode portion 51B is further suppressed. It becomes possible. Therefore, it is possible to more reliably suppress the occurrence of defective insulation resistance.

1, 2, 41 ... Feed-through capacitor, 2 ... Element, 3, 23, 43 ... Terminal electrode, 4, 24, 44 ... Ground electrode, 5 ... Dielectric layer, 6, 26, 46 ... Signal internal electrode, 7 , 27, 47 ... internal electrode grounded, 11A, 31A, 51A ... first main electrode, 11B, 31B, 51B ... second main electrode portions, 12A, 32A, 52A ... first lead _portions, 12A 1, 52A ₁ ... first portion, _12A 2, 52A 2 _... second portion, 12B, 32B, 52B ... second lead portions, _12B 1, 52B 1 _... first portion, _12B 2, 52B 2 _... second portion, 13A, 33A, 53A ... 1st connection part, 13B, 33B, 53B ... 2nd connection part.

Claims (5)

An element body formed by laminating dielectric layers;
Signal internal electrodes and ground internal electrodes alternately arranged in the element body;
Terminal electrodes respectively disposed on first end faces facing each other in the element body and electrically connected by the signal internal electrodes;
A feedthrough capacitor comprising a ground electrode disposed on a second end face facing each other in a direction intersecting the first end face in the element body and electrically connected by the ground internal electrode,
The terminal electrode and the ground electrode are composed of a single layer or a plurality of plating layers,
The signal internal electrode includes a first main electrode portion facing an adjacent grounding internal electrode, a first lead portion exposed on the first end face, the first main electrode portion, and the first lead portion. A first connecting portion to be connected,
The grounding internal electrode includes a second main electrode portion facing the adjacent signal internal electrode, a second lead portion exposed on the second end surface, the second main electrode portion, and the second lead portion. A second connecting part to be connected,
The width of the first connecting portion is narrower than the width of the first lead portion and the first main electrode portion,
The feedthrough capacitor, wherein the width of the second connecting portion is substantially equal to the width of the first connecting portion.   The feedthrough capacitor according to claim 1, wherein a plurality of the first connecting portions are provided apart from each other.   The feedthrough capacitor according to claim 1, wherein a plurality of the second connection portions are provided apart from each other.   The said 1st drawer | drawing-out part has the 1st part connected with the said 1st connection part, and the 2nd part spaced apart from the said 1st part, The 1-3 characterized by the above-mentioned. The feedthrough capacitor according to any one of the above. The said 2nd drawer | drawing-out part has the 1st part connected with the said 2nd connection part, and the 2nd part spaced apart from the said 1st part, The 1-4 characterized by the above-mentioned. The feedthrough capacitor according to any one of the above.

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