JP2013008841A - Feed-through capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a feed-through capacitor capable of suppressing infiltration of a plating liquid and suppressing generation of insulation resistance defects.SOLUTION: In the feed-through capacitor, a width of a first connection part 13A of an internal electrode 6 for signals is narrower than a width of a first main electrode part 11A and a first lead-out part 12A. Thus, when forming a plating layer on an end face of an element assembly, the plating liquid is prevented from reaching the first main electrode part 11A of the internal electrode 6 for signals by the narrow first connection part 13A. Also, in the feed-through capacitor, at the first main electrode part 11A of the internal electrode 6 for signals, a constricted part 14A is formed corresponding to a position of a second connection part 13B. Thus, even when the plating liquid infiltrates from the second lead-out part 12B of an internal electrode 7 for grounding, the plating liquid is prevented from reaching the first main electrode part 11A, and the generation of insulation resistance defects is suppressed.

Description

  The present invention relates to a feedthrough capacitor.

  As a conventional feedthrough capacitor, for example, there is a feedthrough capacitor described in Patent Document 1. The feedthrough capacitor includes signal internal electrodes and ground internal electrodes alternately arranged in the element body. The signal internal electrode and the ground internal electrode exist so as to penetrate through the element body, and are configured to connect the terminal electrode and the ground electrode arranged opposite to each other on the end face of the element body.

Japanese Utility Model Publication No. 58-89926

  By the way, in the feedthrough capacitor as described above, a green sheet on which a predetermined internal electrode pattern is formed is stacked and fired to obtain an element body, and then a plating layer is formed on the end surface of the element body using a predetermined plating solution. These are used as a terminal electrode and a ground electrode. When this plating layer is formed, if the plating solution enters the signal internal electrode side and the grounding internal electrode side from the end face of the element body, an insulation resistance defect may occur.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a feedthrough capacitor that can suppress the penetration of a plating solution and suppress the occurrence of defective insulation resistance.

  In order to solve the above problems, a feedthrough capacitor according to the present invention includes an element body formed by stacking dielectric layers, signal internal electrodes and ground internal electrodes alternately arranged in the element body, A terminal electrode disposed on the opposing first end face and electrically connected by the signal internal electrode, and a second end face opposing each other in the direction intersecting the first end face in the element body, respectively, A feedthrough capacitor having a ground electrode electrically connected by an electrode, wherein the terminal electrode and the ground electrode are composed of a single layer or a plurality of plating layers, and the signal internal electrode is for adjacent grounding A first main electrode portion facing the internal electrode; a first lead portion exposed at the first end face; and a first connecting portion connecting the first main electrode portion and the first lead portion; The electrode is paired with the adjacent signal internal electrode. The second main electrode portion, the second lead portion exposed at the second end surface, and the second connecting portion connecting the second main electrode portion and the second lead portion, and the width of the first connecting portion is The first main electrode portion and the first lead portion are narrower than the first main electrode portion, and a narrow portion corresponding to the position of the second connecting portion is formed in the first main electrode portion. .

  In this feedthrough capacitor, the width of the first connecting portion of the signal internal electrode is narrower than the width of the first main electrode portion and the first lead portion. Thereby, when forming a plating layer in the end surface of an element | base_body, it can suppress that a plating solution reaches | attains the 1st main electrode part of a signal internal electrode by a narrow 1st connection part. In this feedthrough capacitor, a constricted portion corresponding to the position of the second connecting portion is formed in the first main electrode portion of the signal internal electrode. Thereby, even if the plating solution enters from the second lead portion of the grounding internal electrode, the plating solution can be prevented from reaching the first main electrode portion. As described above, this feedthrough capacitor can suppress the occurrence of defective insulation resistance.

  Moreover, it is preferable that the width | variety of a 2nd connection part is narrower than the width | variety of a 2nd main electrode part and a 2nd extraction part. In this case, the plating solution can be prevented from reaching the second main electrode portion of the grounding internal electrode by the narrow second connecting portion.

  Moreover, it is preferable that the constriction part corresponding to the position of the 1st connection part is formed in the 2nd main electrode part. In this case, even if the plating solution enters from the first lead portion of the signal internal electrode, the plating solution can be prevented from reaching the second main electrode portion.

  Further, it is preferable that a first dummy electrode exposed on the second end face is formed on the same layer as the signal internal electrode in correspondence with the position of the second lead portion. In this case, the formation of the ground electrode by the plating layer is facilitated.

  Further, it is preferable that a second dummy electrode exposed on the first end face is formed on the same layer as the grounding internal electrode corresponding to the position of the first lead portion. In this case, the terminal electrode can be easily formed by the plating layer.

  According to the present invention, it is possible to suppress the penetration of the plating solution and suppress the occurrence of defective insulation resistance.

1 is a perspective view showing a feedthrough capacitor according to a first embodiment of the present invention. It is sectional drawing which shows the layer structure of the feedthrough capacitor shown in FIG. It is a figure which shows the electrode pattern of the signal internal electrode and grounding internal electrode of the feedthrough capacitor shown in FIG. It is a figure which shows the electrode pattern of the signal internal electrode and grounding internal electrode of the feedthrough capacitor which concerns on 2nd Embodiment of this invention. It is a figure which shows the electrode pattern of the signal internal electrode and grounding internal electrode of the feedthrough capacitor which concerns on 3rd Embodiment of this invention. It is a perspective view which shows the feedthrough capacitor which concerns on 4th Embodiment of this invention. FIG. 7 is a diagram showing electrode patterns of a signal internal electrode and a ground internal electrode of the feedthrough capacitor shown in FIG. 6. It is a figure which shows the electrode pattern of the signal internal electrode and grounding internal electrode of the feedthrough capacitor which concerns on 5th Embodiment of this invention.

Hereinafter, a preferred embodiment of a feedthrough capacitor according to the present invention will be described in detail with reference to the drawings. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios.
[First Embodiment]

  FIG. 1 is a perspective view showing a feedthrough capacitor according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing the layer structure of the feedthrough capacitor shown in FIG. As shown in FIGS. 1 and 2, the feedthrough capacitor 1 includes an element body 2, a pair of terminal electrodes 3, a pair of ground electrodes 4, a signal internal electrode 6, and a ground internal electrode 7. It is configured.

As shown in FIG. 2, the element body 2 is formed by laminating a plurality of dielectric layers 5 and has a substantially rectangular parallelepiped shape. The dielectric layer 5 is formed of a dielectric material having electrostrictive characteristics such as a BaTiO ₃ system, a Ba (Ti, Zr) O ₃ system, and a (Ba, Ca) TiO ₃ system.

  The terminal electrodes 3 are respectively formed so as to cover the end face (first end face) 2a in the longitudinal direction of the element body 2, and are in a state of facing each other. The terminal electrode 3 is multi-layered by a plurality of plating layers. For example, Cu or Ni is used for the inner plating layer in contact with the element body 2, and Ag, Sn, or the like is used for the outer plating layer, for example. Used.

  The ground electrodes 4 are respectively formed in substantially central portions of the end face (second end face) 2b orthogonal to the end face 2a in the element body 2, and are in a state of facing each other. Similarly to the terminal electrode 3, the ground electrode 4 is multilayered by a plurality of plating layers. The ground electrode 4 is electrically insulated from the terminal electrode 3 on the surface of the element body 2.

  The signal internal electrodes 6 and the ground internal electrodes 7 are alternately stacked in the element body 2 so as to sandwich at least one dielectric layer 5 therebetween. The thickness of the dielectric layer 5 interposed between the signal internal electrode 6 and the ground internal electrode 7 is thinned to about 1 to 5 μm, for example.

  As shown in FIG. 3A, the signal internal electrode 6 is exposed to the first main electrode portion 11 </ b> A facing the second main electrode portion 11 </ b> B of the ground internal electrode 7 and the end surface 2 a of the element body 2. 12 A of 1 extraction parts, and the 1st connection part 13A which connects 11 A of 1st main electrode parts, and 12 A of 1st extraction parts, penetrate the element | base_body 2 to a longitudinal direction, and electrically connect terminal electrodes 3 and 3 with each other Connected.

  The first main electrode portion 11 </ b> A extends in a rectangular shape in the longitudinal direction of the element body 2 and has a constricted portion 14 </ b> A corresponding to the position of the second connecting portion 13 </ b> B of the grounding internal electrode 7. The constricted portion 14A is formed in a rectangular shape with a width larger than the width of the second connecting portion 13B. The first lead portion 12A extends along the end surface 2a of the element body 2 so as to be substantially equal in width to the first main electrode portion 11A. 13 A of 1st connection parts are the width | variety narrower than the width | variety of 1st main electrode part 11A and 12 A of 1st extraction parts, and connect the center part of 11 A of 1st main electrode parts, and the center part of 1st extraction part 12A. Yes.

  A first dummy electrode 15 </ b> A is formed in the same layer as the signal internal electrode 6. The first dummy electrode 15 </ b> A extends along the end surface 2 b of the element body 2 approximately at the same width as the second lead portion 12 </ b> B corresponding to the position of the second lead portion 12 </ b> B, and is connected only to the ground electrode 4. .

  As shown in FIG. 3B, the grounding internal electrode 7 is exposed to the second main electrode portion 11 </ b> B facing the first main electrode portion 11 </ b> A of the signal internal electrode 6 and the end surface 2 b of the element body 2. 2 lead part 12B, and 2nd connection part 13B which connects 2nd main electrode part 11B and 2nd lead part 12B, and penetrates element body 2 in the width direction, and grounding electrodes 4 and 4 are electrically connected Connected.

  The second main electrode portion 11B extends in a rectangular shape in the longitudinal direction of the element body 2 with an area substantially equal to that of the first main electrode portion 11A. The second lead portion 12 </ b> B extends with a predetermined width at a substantially central portion of the end surface 2 b of the element body 2. The second connecting portion 13B has substantially the same width as the second lead portion 12B and connects the second main electrode portion 11B and the second lead portion 12B.

  A second dummy electrode 15 </ b> B is formed in the same layer as the grounding internal electrode 7. The second dummy electrode 15 </ b> B extends along the end surface 2 a of the element body 2 approximately at the same width as the first lead portion 12 </ b> A corresponding to the position of the first lead portion 12 </ b> A, and is connected only to the terminal electrode 3. .

  A protective layer 8 and a protective layer 9 are further laminated on the outer layers of the signal internal electrode 6 and the ground internal electrode 7. As shown in FIG. 3C, dummy electrodes 15 </ b> C and 15 </ b> D are formed on the protective layer 8. The dummy electrode 15C has a width similar to that of the dummy electrode 15B, extends to the central portion on the end face 2a side of the element body 2, and is connected only to the terminal electrode 3. The dummy electrode 15D has a width similar to that of the dummy electrode 15A, extends to the center portion on the end face 2b side of the element body 2, and is connected only to the ground electrode 4. On the other hand, as shown in FIG. 3 (d), the dummy electrode is not formed on the protective layer 9, and only the dielectric layer 5 is formed.

  In this feedthrough capacitor 1, the width of the first connecting portion 13A of the signal internal electrode 6 is narrower than the width of the first main electrode portion 11A and the first lead portion 12A. Thereby, when forming a plating layer on the end surface of the element body 2, it is possible to suppress the plating solution from reaching the first main electrode portion 11 </ b> A of the signal internal electrode 6 by the narrow first connecting portion 13 </ b> A.

  Further, in the feedthrough capacitor 1, a constricted portion 14A corresponding to the position of the second connecting portion 13B is formed in the first main electrode portion 11A of the signal internal electrode 6. Thereby, even if the plating solution enters from the second lead portion 12B of the grounding internal electrode 7, the plating solution can be prevented from reaching the first main electrode portion 11A. As described above, the feedthrough capacitor 1 can suppress the occurrence of defective insulation resistance.

Further, in the feedthrough capacitor 1, the first dummy electrode 15 </ b> A exposed to the second end face 2 b is formed in the same layer as the signal internal electrode 6 corresponding to the position of the second lead portion 12 </ b> B. Similarly, a second dummy electrode 15B exposed to the first end face 2a is formed in the same layer as the grounding internal electrode 7 in correspondence with the position of the first lead portion 12A. As a result, the first dummy electrode 15A and the second dummy electrode 15B serve as growth starting points for the plating layer, so that it is easy to form the terminal electrode 3 and the ground electrode 4 using the plating layer. That is, in the stacking direction, the second dummy electrode 15B is disposed between the first lead portions 12A and 12A, and the first dummy electrode 15A is disposed between the second lead portions 12B and 12B. A plating layer can be reliably formed using plating elongation.
[Second Embodiment]

  FIG. 4 is a diagram showing electrode patterns of the signal internal electrode and the ground internal electrode of the feedthrough capacitor according to the second embodiment of the present invention. As shown in the figure, in the second embodiment, the electrode pattern of the grounding internal electrode 7 is different from that of the first embodiment.

  That is, in the second embodiment, the second main electrode portion 11B of the grounding internal electrode 7 has a constricted portion 14B corresponding to the position of the first connecting portion 13A of the signal internal electrode 6. The constricted portion 14B is formed in a rectangular shape with a width larger than the width of the first connecting portion 13A.

Even in such a configuration, the same effects as those of the first embodiment can be achieved. Also, since the constricted portion 14B is formed in the second main electrode portion 11B corresponding to the position of the first connecting portion 13A, it is assumed that the plating solution has entered from the first lead portion 12A of the signal internal electrode 6 Moreover, it can suppress that a plating solution reaches | attains the 2nd main electrode part 11B. Therefore, it is possible to more reliably suppress the occurrence of defective insulation resistance.
[Third Embodiment]

  FIG. 5 is a diagram showing electrode patterns of the signal internal electrode and the ground internal electrode of the feedthrough capacitor according to the third embodiment of the present invention. As shown in the figure, in the third embodiment, the electrode pattern of the signal internal electrode 6 is different from that of the first embodiment.

  That is, in the third embodiment, the first connecting portion 13A of the signal internal electrode 6 is provided in two places with a narrower width than that of the first embodiment, and the width direction of the first main electrode portion 11A. Are connected to both end portions in the width direction of the first lead portion 12A.

Even in such a configuration, the same effects as those of the first embodiment can be achieved. In addition, by providing the narrow first coupling portion 13A at two locations, it is possible to further suppress the penetration of the plating solution into the first main electrode portion 11A. Therefore, it is possible to more reliably suppress the occurrence of defective insulation resistance. In addition, by providing a plurality of first connecting portions 13A, it is possible to suppress the occurrence of poor energization.
[Fourth Embodiment]

  FIG. 6 is a perspective view showing a feedthrough capacitor according to a fourth embodiment of the present invention. FIG. 7 is a diagram showing electrode patterns of the signal internal electrode and the ground internal electrode of the feedthrough capacitor shown in FIG. As shown in the figure, in the feedthrough capacitor 21 of the fourth embodiment, the electrode patterns of the signal internal electrode 26 and the ground internal electrode 27 are different from those of the first embodiment. Accordingly, the terminal electrode 23 is formed over the end surface 2a of the element body 2 and the end portion of the end surface 2b.

  As shown in FIG. 7A, the signal internal electrode 26 of the fourth embodiment includes a first main electrode portion 31 </ b> A facing the second main electrode portion 31 </ b> B of the grounding internal electrode 27, and an end face of the element body 2. The first lead portion 32A exposed to 2a and the first connecting portion 33A for connecting the first main electrode portion 31A and the first lead portion 32A are provided.

  The first main electrode portion 31 </ b> A extends in a rectangular shape in the longitudinal direction of the element body 2 and has a constricted portion 34 </ b> A corresponding to the position of the second connecting portion 33 </ b> B of the grounding internal electrode 27. The constricted portion 34A is formed in a rectangular shape with a width larger than the width of the second connecting portion 33B. The first lead portion 32 </ b> A extends at the same width as the element body 2 along the end surface 2 a of the element body 2. The first connecting portion 33A is narrower than the first main electrode portion 31A and the first lead portion 32A, and connects the central portion of the first main electrode portion 31A and the central portion of the first lead portion 32A. Yes.

  A first dummy electrode 35 </ b> A is formed in the same layer as the signal internal electrode 26. The first dummy electrode 35 </ b> A extends along the end surface 2 b of the element body 2 approximately at the same width as the second lead portion 32 </ b> B corresponding to the position of the second lead portion 32 </ b> B, and is connected only to the ground electrode 24. .

  As shown in FIG. 7B, the grounding internal electrode 27 is exposed to the second main electrode portion 31 </ b> B facing the first main electrode portion 31 </ b> A of the signal internal electrode 26 and the end surface 2 b of the element body 2. It has the 2 drawer | drawing-out part 32B and the 2nd connection part 33B which connects the 2nd main electrode part 31B and the 2nd drawer | drawing-out part 32B.

  The second main electrode portion 31B extends in a rectangular shape in the longitudinal direction of the element body 2 with an area substantially equal to that of the first main electrode portion 31A and corresponds to the position of the first connecting portion 33A of the signal internal electrode 26. It has a part 34B. The constricted part 34B is formed in a rectangular shape with a width larger than the width of the first connecting part 33A. The second lead portion 32 </ b> B extends with a predetermined width at a substantially central portion of the end surface 2 b of the element body 2. The second connecting portion 33B is narrower than the second main electrode portion 31B and the second lead portion 32B, and connects the central portion of the second main electrode portion 31B and the central portion of the second lead portion 32B. Yes.

  In the same layer as the grounding internal electrode 27, a second dummy electrode 35B is formed. The second dummy electrode 35B extends at the same width as the element body 2 along the end surface 2a of the element body 2 corresponding to the position of the first lead portion 32A, and is connected only to the terminal electrode 23.

  A protective layer 28 and a protective layer 29 are further laminated on the outer layers of the signal internal electrode 26 and the ground internal electrode 27. As shown in FIG. 7C, dummy electrodes 35 </ b> C and 35 </ b> D are formed on the protective layer 28. Similar to the dummy electrode 35B, the dummy electrode 35C extends to the end face 2a side of the element body 2 with the same width as the element body 2 and is connected only to the terminal electrode 23. The dummy electrode 35D has a width similar to that of the dummy electrode 35A, extends to the central portion on the end face 2b side of the element body 2, and is connected only to the ground electrode 24. On the other hand, as shown in FIG. 7 (d), the dummy electrode is not formed on the protective layer 29, and only the dielectric layer 5 is formed.

  Even in such a configuration, the same effects as those of the first embodiment can be achieved. In the present embodiment, the width of the second connecting portion 33B is narrower than the widths of the second main electrode portion 31B and the second lead portion 32B. Thereby, when forming a plating layer on the end surface of the element body 2, it is possible to suppress the plating solution from reaching the second main electrode portion 31 </ b> B of the grounding internal electrode 27 by the narrow second connecting portion 33 </ b> B.

Furthermore, in the present embodiment, a constricted portion 34B is formed in the second main electrode portion 31B corresponding to the position of the first connecting portion 33A. Thereby, even if the plating solution enters from the first lead portion 32A of the signal internal electrode 26, the plating solution can be prevented from reaching the second main electrode portion 31B. Therefore, it is possible to more reliably suppress the occurrence of defective insulation resistance.
[Fifth Embodiment]

  FIG. 8 is a diagram showing electrode patterns of the signal internal electrode and the ground internal electrode of the feedthrough capacitor according to the fifth embodiment of the present invention. As shown in the figure, in the fifth embodiment, the electrode patterns of the signal internal electrode 26 and the ground internal electrode 27 are different from those in the fourth embodiment.

  That is, in the fifth embodiment, the first connecting portion 33A of the signal internal electrode 26 is provided in two places with a narrower width than in the case of the fourth embodiment, and the width direction of the first main electrode portion 31A. Are connected to the first lead portion 32A. Further, the second connecting portion 33B of the grounding internal electrode 27 is provided in two places with a narrower width than in the case of the fourth embodiment, and the second main electrode portion 31B is arranged in the width direction of the second lead portion 32B. It is connected to both end portions.

  Further, constricted portions 34A of the signal internal electrode 26 are provided at two positions on both ends in the width direction of the first main electrode portion 31A corresponding to the position of the second connecting portion 33B, and the first connecting portion 33A Corresponding to the position, the constricted portion 34B of the grounding internal electrode 27 is provided at each corner of the second main electrode portion 31B.

  Even in such a configuration, the same operational effects as in the fourth embodiment can be obtained. Further, by providing the narrow first connecting portion 33A and the second connecting portion 33B in two locations, the infiltration of the plating solution into the first main electrode portion 31A and the second main electrode portion 31B is further suppressed. It becomes possible. Furthermore, by providing the constricted portions 34 and 35 corresponding to the positions of the first connecting portion 33A and the second connecting portion 33B, the infiltration of the plating solution from the first lead portion 32A to the second main electrode portion 31B, and the second Infiltration of the plating solution from the two lead portions 32B to the first main electrode portion 31A can be suppressed. Therefore, it is possible to more reliably suppress the occurrence of defective insulation resistance.

  DESCRIPTION OF SYMBOLS 1,21 ... Feed-through capacitor, 2 ... Element, 2a ... End face (first end face), 2b ... End face (second end face), 3, 23 ... Terminal electrode, 4, 24 ... Ground electrode, 6, 26 ... For signal Internal electrodes 7, 27 ... Grounding internal electrodes, 11A, 31A ... First main electrode portion, 11B, 31B ... Second main electrode portion, 12A, 32A ... First lead portion, 12B, 32B ... Second lead portion, 13A, 33A ... 1st connection part, 13B, 33B ... 2nd connection part, 14A, 14B, 34A, 34B ... Constriction part, 15A, 35A ... 1st dummy electrode, 15B, 35B ... 2nd dummy electrode.

Claims (5)

An element body formed by laminating dielectric layers;
Signal internal electrodes and ground internal electrodes alternately arranged in the element body;
Terminal electrodes respectively disposed on first end faces facing each other in the element body and electrically connected by the signal internal electrodes;
A feedthrough capacitor comprising a ground electrode disposed on a second end face facing each other in a direction intersecting the first end face in the element body and electrically connected by the ground internal electrode,
The terminal electrode and the ground electrode are composed of a single layer or a plurality of plating layers,
The signal internal electrode includes a first main electrode portion facing an adjacent grounding internal electrode, a first lead portion exposed on the first end face, the first main electrode portion, and the first lead portion. A first connecting portion to be connected,
The grounding internal electrode includes a second main electrode portion facing the adjacent signal internal electrode, a second lead portion exposed on the second end surface, the second main electrode portion, and the second lead portion. A second connecting part to be connected,
The width of the first connecting portion is narrower than the width of the first main electrode portion and the first lead portion,
The feedthrough capacitor according to claim 1, wherein the first main electrode portion is formed with a constricted portion corresponding to the position of the second connecting portion.   2. The feedthrough capacitor according to claim 1, wherein a width of the second connection portion is narrower than a width of the second main electrode portion and the second lead portion.   3. The feedthrough capacitor according to claim 1, wherein the second main electrode portion is formed with a constricted portion corresponding to the position of the first connecting portion.   The first dummy electrode exposed to the second end face is formed in the same layer as the signal internal electrode corresponding to the position of the second lead portion. A feedthrough capacitor according to claim 1.   5. The second dummy electrode exposed to the first end face is formed on the same layer as the grounding internal electrode corresponding to the position of the first lead portion. A feedthrough capacitor according to claim 1.

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