JP2013008646A - Connector for board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector for board which can ensure a high holding force for a printed circuit board.SOLUTION: The connector 10 for board comprises a connector housing 20; and a metallic fixing member 60. The fixing member 60 comprises: a housing attachment part 61 which is attached to the side surface of the connector housing 20; a board attachment part 62 which is attached to the surface of a board 90 by soldering; and a coupling part 63 located between the board attachment part 62 and the housing attachment part 61 and being coupled thereto in curved shape. At least on the outer side surface at the bend of the coupling part 63, a solder entry 71 through which a solder enters is formed, and the tip of the board attachment part 62 is a closed end 72 where the solder entry 71 does not open.

Description

  The present invention relates to a board connector.

  Patent Document 1 discloses a conventional board connector. This includes a connector housing and a metal plate fixing member attached to a side surface of the connector housing. The fixing member is curvedly connected to both the housing mounting portion along the side surface of the connector housing, the board mounting portion along the surface of the printed circuit board (hereinafter simply referred to as a board), and both the board mounting portion and the housing mounting portion. It consists of a connecting part, and has an L shape as a whole through the connecting part.

  In addition, a plurality of solder entry holes are formed through the board mounting portion. A substrate connector is placed on the surface of the substrate, and reflow soldering is performed in this state, whereby the substrate attachment portion is fixed to the substrate, and the substrate connector is attached to the substrate. At this time, when the solder enters the solder entry portion, the holding force with respect to the substrate is enhanced.

JP 2007-280968 A

  By the way, in the case of the above conventional board connector, if there is a situation such as a small solder bonding area, the solder back fillet attached to the outer side of the bending of the connecting portion is not formed at a sufficient height, There is a possibility that a high holding force on the substrate cannot be secured.

  The present invention has been completed based on the above-described circumstances, and an object of the present invention is to provide a board connector that can ensure a high holding force with respect to a printed circuit board.

  As means for achieving the above object, the invention of claim 1 is a board connector attached to a printed circuit board, comprising a connector housing and a fixing member made of a metal plate, wherein the fixing member is A housing attachment portion attached to a side surface of the connector housing, a substrate attachment portion attached to the surface of the printed circuit board by soldering, and a connecting portion which is between the substrate attachment portion and the housing attachment portion and is connected in a curved shape. The solder intrusion part into which the solder enters is formed to be open at least on the outer side surface of the bending of the connecting part, and the tip of the board mounting part is a closed end where the solder intrusion part does not open. However, it has characteristics.

  According to a second aspect of the present invention, in the first aspect of the present invention, a side solder intrusion portion into which the solder enters is formed to be opened at at least one side end of both side ends of the board mounting portion. However, it has characteristics.

  A third aspect of the present invention is characterized in that, in the first or second aspect of the present invention, the rising end of the solder entry portion is equal to or higher than the rising end of the solder fillet.

<Invention of Claim 1>
Since the solder intrusion part into which the solder enters at least the outer side surface of the bending portion of the connecting portion is opened and formed, the solder fillet is increased on the outer side surface of the bending portion of the connecting portion by sucking the solder into the solder intruding portion. Secured. Further, since the tip of the board mounting portion is a closed end where the solder entry portion does not open, the solder does not escape to the tip side of the board mounting portion. As a result, the holding force of the board connector with respect to the printed circuit board is enhanced.

<Invention of Claim 2>
Since the side solder intrusion portion where the solder enters at least one side end of the both sides of the board mounting portion is formed to be opened, the solder also enters the side solder intrusion portion, so that the printed circuit The holding force with respect to the substrate is further increased.

<Invention of Claim 3>
Since the rising edge of the solder entry portion is equal to or higher than the rising edge of the solder fillet, the solder fillet is secured as high as possible on the outer side surface of the connecting portion. As a result, the holding force with respect to the printed circuit board is further increased.

It is a front view of the connector for substrates concerning Embodiment 1 of the present invention. It is a top view of the connector for boards. It is the sectional view on the AA line of FIG. It is a side view of a fixing member. It is the BB sectional view taken on the line of FIG. It is a top view of a fixing member. It is an expanded sectional view showing the state where solder entered into the solder entry portion. It is a top view of the fixing member of the connector for substrates concerning Embodiment 2 of the present invention. It is a side view of a fixing member.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. The board connector 10 according to the first embodiment is attached to a printed circuit board (hereinafter simply referred to as a board 90), and includes a connector housing 20 and fixing members 60 attached to both side surfaces of the connector housing 20. ing.

  The connector housing 20 is made of a synthetic resin, and has a rectangular tubular hood portion 21 that is elongated in the width direction, as shown in FIG. A lock portion 22 is formed so as to protrude from a substantially central portion in the width direction of the upper wall inner surface of the hood portion 21. A mating connector housing (not shown) can be fitted in the hood portion 21, and the mating connector housing is fitted in the hood portion 21 at a normal depth, so that the lock portion 22 puts the mating connector housing into a state of being restricted. It is designed to be locked.

  A plurality of terminal fittings 80 are attached to the back wall of the hood portion 21. Each terminal fitting 80 has a tab-like shape, and is connected to a mating terminal 81 that protrudes into the hood portion 21 and, as shown in FIG. And a substrate connecting portion 82 whose lower end portion is disposed along the substrate 90. The connection portion 81 is electrically connected to a mating terminal fitting (not shown) with the mating connector housing. Further, the lower end portion of the board connecting portion 82 is connected to the conductive path of the board 90 by soldering.

  As shown in FIG. 2, a pair of mounting grooves 23 are formed on both side surfaces of the connector housing 20. The mounting groove 23 is configured to extend in the height direction of the connector housing 20, and a pair of front and rear slit grooves 24 are formed on both front and rear ends thereof. Further, as shown in FIG. 3, a plurality of steps 25 in the height direction are formed at both front and rear ends of the mounting groove 23. The mounting groove 23 has a configuration in which the front-rear width is gradually narrowed to the lower side through each step 25.

  The fixing member 60 is a metal plate, and is mounted on the mounting groove 23 from above, and is provided in pairs corresponding to both mounting grooves 23 as shown in FIG. Specifically, as shown in FIG. 1, the fixing member 60 includes a housing mounting portion 61 disposed along the groove surface of the mounting groove 23 of the connector housing 20 and a substrate mounting disposed along the surface of the substrate 90. It consists of the part 62 and the connection part 63 which is arrange | positioned between the board | substrate attachment part 62 and the housing attachment part 61, and is connected to both integrally, and is made into the form bent as a L shape as a whole. The plate surface of the housing mounting portion 61 is disposed substantially vertically along the height direction, the plate surface of the substrate mounting portion 62 is disposed substantially horizontally along the width direction, and the plate surface of the connecting portion 63 is bent into a curved surface. Are arranged.

  As shown in FIG. 4, a plurality of retaining pieces 64, 65, 66 are formed on both front and rear edges of the housing attachment portion 61. Each retaining piece 64, 65, 66 is at the uppermost stage of the housing mounting portion 61, and is located at the substantially central portion in the height direction of the housing mounting portion 61, with the upper stage retaining piece 64 protruding in the plate width direction (front and rear both sides). It consists of a lower step retaining piece 65 projecting in the plate width direction, and a middle step retaining piece 66 that projects between the lower step retaining piece 65 and the upper step retaining piece 64 and bends and projects in the plate thickness direction. When the housing mounting portion 61 is properly mounted in the mounting groove 23, as shown in FIG. 3, the upper-stage retaining pieces 64 and the lower-stage retaining pieces 65 are held against the step 25, and the respective retaining pieces 64, 65, 66 are It is press-fitted into the slit groove 24 in a biting state. Further, a reinforcing rib 67 extending in the width direction is formed on the upper side of the housing mounting portion 61 by hammering.

  The lower half of the housing mounting portion 61 (the portion below the lower-stage retaining piece 65) has a narrower front-rear width than the upper half. A bent portion 68 is formed in the middle of the lower half of the housing mounting portion 61 in the height direction, as shown in FIG. Of the lower half of the housing mounting portion 61, the lower region sandwiching the bent portion 68 is shifted outward from the upper region and is disposed away from the groove surface of the mounting groove 23.

  As shown in FIG. 7, the board mounting portion 62 has a flat plate shape that protrudes outward in the width direction from the connecting portion 63. Solder applied to the surface of the substrate 90 is attached to the lower surface of the substrate mounting portion 62. As shown in FIGS. 4 and 6, a slit 69 is formed so as to penetrate substantially at the center in the front-rear direction of the board mounting portion 62. The slit 69 is configured to extend from the substrate mounting portion 62 to the lower half of the housing mounting portion 61 through the connecting portion 63, and opens at the front end (front end in the protruding direction) of the substrate mounting portion 62. It is configured to stand up to almost the same height. The board attaching portion 62 is divided into a pair of front and rear regions by way of the slit 69.

  As shown in FIG. 5, the connecting portion 63 has a rounded cross section, and is formed between the substrate mounting portion 62 and the housing mounting portion 61 so as to be curved. In the connecting portion 63, a plurality of solder intrusion portions 71 into which the solder applied to the substrate 90 can enter are opened.

  As shown in FIG. 6, each solder entry portion 71 is formed in a pair in each of the front and rear regions across the slit 69, and is disposed symmetrically across the slit 69. Then, as shown in FIG. 5, the solder intrusion portion 71 is configured to penetrate from the outer side surface to the inner side surface of the connecting portion 63 and extends from the connecting portion 63 to the board attaching portion 62 and the housing attaching portion 61. It is set as the form extended in the width direction and a height direction. Further, the solder intrusion portion 71 has a narrow groove shape, and has a groove width narrower than the groove width of the slit 69.

  As shown in FIG. 6, the outer end in the width direction of the solder intrusion portion 71 remains in the projecting direction of the board mounting portion 62 and is closed without opening at the tip of the board mounting portion 62. Here, the front end of the board mounting portion 62 is a closed end 72 that extends substantially straight in the front-rear direction, leaving the slit 69. Further, as shown in FIG. 4, the rising end (the outer end in the height direction) of the solder intrusion portion 71 is in the middle of the lower half of the housing mounting portion 61 in the height direction, specifically in a position substantially directly below the bent portion 68. It stays lower than the rising edge of the slit 69. Note that the rising end and the outer end in the width direction of the solder entry portion 71 have an arcuate shape.

Next, a process of attaching the board connector 10 according to the first embodiment to the board 90 will be described.
A terminal fitting 80 is mounted on the hood portion 21 of the connector housing 20, and a fixing member 60 is inserted into the both mounting grooves 23 of the connector housing 20 from above. The fixing member 60 is retained in the mounting groove 23 of the connector housing 20 by the locking action of the retaining pieces 64, 65, 66.

  Subsequently, the board connector 10 is placed on the surface of the board 90. Note that solder is applied to the surface of the substrate 90 in advance at a portion corresponding to the substrate attachment portion 62 and a portion corresponding to the substrate connection portion 82 of each terminal fitting 80.

  Next, the board 90 is passed through the reflow furnace together with the board connector 10, and the solder on the board 90 is melted. Then, the melted solder adheres to the board connection portion 82 of each terminal fitting 80 and also enters the solder entry portion 71 and adheres to its peripheral surface as shown in FIG. At this time, as shown in FIG. 7, the solder enters substantially the whole of the solder entry portion 71 and naturally rises so as to be sucked up in the rising direction of the solder entry portion 71, and reaches the rising end of the solder entry portion 71. To reach. Therefore, the upper end position (rising end) of the solder back fillet 100 reaches the vicinity of the bent portion 68 of the housing mounting portion 61.

  When the solder is cooled and solidified, the board connection portion 82 of the terminal fitting 80 is fixedly connected to the corresponding conductive path. Further, when the solder adheres to the peripheral edge portion of the board attaching portion 62 and the solder intrusion portion 71, the connector housing 20 is attached and fixed to the board 90. Thereafter, a mating connector housing (not shown) is fitted into the hood portion 21 of the connector housing 20 from the front.

  As described above, according to the present embodiment, since the solder entry portion 71 into which the solder enters the opening is formed on the outer side surface of the connecting portion 63, the solder is sucked into the solder entry portion 71. As a result, a high solder back fillet 100 is secured on the outer side surface of the connecting portion 63 that is bent. Further, since the front end of the board mounting portion 62 is a closed end 72 where the solder intrusion portion 71 does not open, the solder does not escape to the front end side of the board mounting portion 62. As a result, the holding force of the board connector 10 with respect to the board 90 is increased. In addition, the connection reliability with the board | substrate 90 is improved because the closed end 72 of the board | substrate attachment part 62 continues in the front-back direction.

  Further, since the rising edge of the solder entry portion 71 is the same as the rising edge of the solder back fillet 100, the solder back fillet 100 is ensured as high as possible on the outer side of the bending of the connecting portion 63. As a result, the holding force with respect to the substrate 90 is further increased.

<Embodiment 2>
8 and 9 show the second embodiment of the present invention. In the second embodiment, the structure of the board attachment portion 62A of the fixing member 60A is partially different from that of the first embodiment. Others are the same as those in the first embodiment, and the same parts as those in the first embodiment are denoted by the same reference numerals, and redundant description is omitted.

  A pair of front and rear side solder intrusion portions 75 are formed to be open at both front and rear ends (edges extending in the width direction) of the board mounting portion 62A. The side solder intrusion portion 75 is a notch having a rectangular cross section that opens to the front and rear ends of the substrate attachment portion 62A while penetrating the substrate attachment portion 62A in the thickness direction. In this case, the side solder intrusion portion 75 is disposed at a substantially intermediate portion in the protruding direction of the board attachment portion 62A.

  Here, when solder is applied to the substrate 90 and reflow soldering is performed in this state, the solder enters the side solder entry portion 75. Then, the solder is wetted by the surface tension of the side solder entry portion 75 and is firmly bonded between the substrate 90 and the substrate attachment portion 62A. As a result, the holding force of the board connector 10 with respect to the board 90 is increased.

  If the connector housing 20 is fitted into a mating connector housing (not shown) and an electric wire (not shown) drawn from the mating connector housing swings in the height direction, excessive stress acts on both front and rear ends of the board mounting portion 62A. However, the fixing member 60 </ b> A may be peeled off from the substrate 90 starting from this portion. However, according to the second embodiment, since the side solder intrusion portions 75 are opened at both front and rear ends of the board mounting portion 62A, the solder enters the side solder intrusion portions 75 and is cooled and solidified. As a result, the bonding strength between the front and rear ends of the board mounting portion 62A is increased, and the situation where the fixing member 60A is peeled from the board 90 is avoided.

Therefore, the technical idea extracted from Embodiment 2 is as follows.
A board connector 10 attached to a board 90, comprising:
A connector housing 20 that can be fitted to the mating connector housing, and a metal fixing member 60A;
The fixing member 60A includes a housing attachment portion 61 attached to the side surface of the connector housing 20, and a substrate attachment portion 62A that is integrally connected to the housing attachment portion 61 and attached to the surface of the substrate 90 by soldering. ,
In the board mounting portion 62A, a side solder intrusion portion 75 into which the solder enters is cut out and formed in at least one side end of both side ends extending in a direction intersecting with the mating connector housing fitting direction. A board connector 10 characterized by:
Further, it is desirable that the side solder intrusion portion 75 is formed so as to penetrate through the entire thickness of the board attachment portion 62A.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) A form in which the solder intrusion portion opens only on the outer surface without opening on the inner surface of the bending portion of the connecting portion may be employed.
(2) The rising edge of the solder entry portion may be higher than the rising edge of the solder fillet.
(3) The solder entry portion may be formed only in the connecting portion and not formed in the board attachment portion and the housing attachment portion.
(4) The side solder entry portion may be formed only at one side end of the front and rear side ends of the board mounting portion.

DESCRIPTION OF SYMBOLS 10 ... Board connector 20 ... Connector housing 60, 60A ... Fixing member 61 ... Housing attachment part 62, 62A ... Board attachment part 71 ... Solder entry part 72 ... Close end 75 ... Side solder entry part 90 ... Board (printed circuit board) )
100 ... Back fillet (solder fillet)

Claims (3)

A board connector attached to a printed circuit board,
A connector housing and a metal plate fixing member;
The fixing member is between a housing attachment portion attached to a side surface of the connector housing, a substrate attachment portion attached to the surface of the printed circuit board by soldering, and is curved between the substrate attachment portion and the housing attachment portion. It consists of connecting parts that are connected in a shape,
A solder intrusion portion into which the solder enters is formed to be opened at least on an outer surface of the bending portion of the connecting portion, and a tip of the board mounting portion is a closed end where the solder intrusion portion does not open. Board connector.   2. The board connector according to claim 1, wherein a side solder intrusion portion into which the solder enters is formed to open at least one side end of both side ends of the substrate mounting portion.   The board connector according to claim 1 or 2, wherein a rising edge of the solder entry portion is equal to or higher than a rising edge of the solder fillet.

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