JP2013005403A - Ultrasonic unit, ultrasonic endoscope, and method for manufacturing ultrasonic unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ultrasonic unit 30 which can be easily manufactured.SOLUTION: An ultrasonic unit 30 comprises an ultrasonic array 40 composed of a plurality of connected ultrasonic elements 20. The ultrasonic element 20 has a silicon substrate 11, a transmitting/receiving part 60 which has a plurality of ultrasonic cells 10 arranged thereon and is disposed on a first principal surface 20SA of the silicon substrate 11, a flexible lower electrode wiring 42, a lower electrode terminal 52, a flexible upper electrode wiring 41, and an upper electrode terminal 51. A flexible third insulating layer 17 covers the surface of the transmitting/receiving part 60, and also covers the lower electrode wiring 42 and the upper electrode wiring 41 which are bent in a direction of a second principal surface 20SB by bending parts 46 and 47.

Description

  The present invention relates to a capacitive ultrasonic unit, an ultrasonic endoscope having the ultrasonic unit, and a method for manufacturing the ultrasonic unit.

  The ultrasonic endoscope clearly depicts the digestive tract wall or deep organs with a good image quality that is not affected by gas or bone in the body. An electronic scanning ultrasonic endoscope is provided with an ultrasonic unit having an ultrasonic array at the tip. The ultrasonic array is configured by connecting a plurality of ultrasonic elements.

  Each ultrasonic element is provided with a plurality of electrostatic capacitance type ultrasonic vibration cells each composed of a lower electrode portion and an upper electrode portion facing each other through a cavity. The capacitive ultrasonic element is formed on a substrate by so-called MEMS technology. For this reason, the electrode terminal for electrical connection and the ultrasonic transmission surface are disposed on the same main surface of the substrate.

  Japanese Patent No. 3924466 discloses an ultrasonic transducer in which electrode terminals are arranged on the second main surface by through wiring extending from the first main surface on which the ultrasonic transmission surface is arranged. ing.

  However, since the through wiring needs to be formed at the beginning of the manufacturing process, it may be difficult to manufacture. Further, the maximum temperature that can be used in the process may be lowered depending on the heat resistance of the conductive material disposed inside the through hole. The factor of the operation speed of the capacitive ultrasonic transducer is the product of the electrical resistance and the electrostatic capacity, but the through wiring using polysilicon as the conductive material does not have a low electrical resistance. For this reason, there existed a possibility that operation speed might fall.

Japanese Patent No. 3924466

  Embodiments of the present invention provide an ultrasonic unit that is easy to manufacture, an ultrasonic endoscope that is easy to manufacture, and a method for manufacturing an ultrasonic unit that is easy to manufacture.

An ultrasonic unit according to an embodiment of the present invention includes an ultrasonic array including a plurality of connected ultrasonic elements,
The ultrasonic element is
A base body having a rectangular first main surface and a second main surface;
A plurality of ultrasonic cells each having a lower electrode portion and an upper electrode portion that are arranged to face each other through a cavity are arranged, and the lower electrode portions are connected to each other, and A rectangular transmission / reception unit for transmitting / receiving ultrasonic waves disposed on the first main surface, the upper electrode units being connected to each other;
A flexible lower electrode wiring connected to a plurality of the lower electrode portions, extending from an end of the transmission / reception unit;
A lower electrode terminal connected to the lower electrode wiring;
A flexible upper electrode wiring extending from the other end of the transmitting / receiving unit and connected to the plurality of upper electrode units;
An upper electrode terminal connected to the upper electrode wiring,
A flexible resin layer covers the surface of the transmission / reception unit, and covers the lower electrode wiring and the upper electrode wiring bent in the direction of the second main surface by the respective bent portions. Yes.

  An ultrasonic endoscope according to another embodiment includes a distal end rigid portion having the ultrasonic unit described above.

The manufacturing method of the ultrasonic unit of another embodiment is:
Producing a plurality of ultrasonic elements each having a plurality of ultrasonic cells each having a lower electrode portion and an upper electrode portion disposed opposite to each other via a cavity on the first main surface of the substrate;
Lower electrode wiring connected to the lower electrode portion, a lower electrode terminal extending from the lower electrode wiring, an upper electrode wiring connected to the upper electrode portion, and an upper electrode terminal extending from the upper electrode wiring On the first main surface,
Covering the surface of the first main surface with a flexible resin layer;
Removing at least a portion of the lower electrode wiring, the lower electrode terminal, the upper electrode wiring, and the substrate below the upper electrode terminal;
Bending the lower electrode wiring and the upper electrode wiring in the direction of the second main surface.

  According to the embodiments of the present invention, an ultrasonic unit that is easy to manufacture, an ultrasonic endoscope that is easy to manufacture, and a method for manufacturing an ultrasonic unit that is easy to manufacture are provided.

It is an external view for demonstrating the endoscope system which comprises the ultrasonic endoscope of 1st Embodiment. It is a perspective view for demonstrating the front-end | tip rigid part of the ultrasonic endoscope of 1st Embodiment. It is a perspective view for demonstrating the structure of the ultrasonic unit of 1st Embodiment. It is a cell structure sectional view of the ultrasonic array of a 1st embodiment. It is a top view of the ultrasonic array of the first embodiment. It is sectional drawing along the VI-VI line of FIG. 5 of the ultrasonic array of 1st Embodiment. It is a flowchart for demonstrating the manufacturing method of the ultrasonic unit of 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the ultrasonic unit of 1st Embodiment. It is sectional drawing for demonstrating the structure of the ultrasonic unit of the modification 1 of 1st Embodiment. It is sectional drawing for demonstrating the structure of the ultrasonic unit of the modification 2 of 1st Embodiment. It is a top view for demonstrating the structure of the ultrasonic array of 2nd Embodiment. It is sectional drawing along the XII-XII line | wire of FIG. 11 for demonstrating the structure of the ultrasonic array of 2nd Embodiment.

  Hereinafter, with reference to the drawings, the ultrasonic unit (hereinafter referred to as “US unit”) 30 of the first embodiment, the ultrasonic endoscope (hereinafter referred to as “US endoscope”) 2 having the US unit 30, and A method for manufacturing the US unit 30 will be described.

<Configuration of ultrasonic endoscope>
As shown in FIG. 1, the US endoscope 2 constitutes an ultrasonic endoscope system 1 together with the ultrasonic observation device 3 and the monitor 4. The US endoscope 2 includes an elongated insertion portion 21 to be inserted into the body, an operation portion 22 disposed at the proximal end of the insertion portion 21, and a universal cord 23 extending from a side portion of the operation portion 22. It has.

  A connector 24 </ b> A connected to a light source device (not shown) is disposed at the base end of the universal cord 23. From the connector 24A, there are a cable 25 that is detachably connected to a camera control unit (not shown) via a connector 25A, and a cable 26 that is detachably connected to the ultrasonic observation apparatus 3 via a connector 26A. It is extended. A monitor 4 is connected to the ultrasonic observation apparatus 3.

  The insertion portion 21 is operated in order from the distal end side, the distal end rigid portion (hereinafter referred to as “the distal end portion”) 37, the bending portion 38 positioned at the rear end of the distal end portion 37, and the rear end of the bending portion 38. A flexible tube portion 39 having a small diameter, a long length, and flexibility that reaches the portion 22 is provided continuously. An ultrasonic unit 30 is disposed on the distal end side of the distal end portion 37.

  The operation unit 22 includes an angle knob 22A for controlling the bending of the bending unit 38 in a desired direction, an air / water supply button 22B for performing air supply and water supply operations, a suction button 22C for performing suction operations, and a treatment introduced into the body. A treatment instrument insertion port 22D and the like serving as an instrument entrance are disposed.

  As shown in FIG. 2, the US unit 30 is provided with an illumination lens cover 31 that constitutes the illumination optical system, an observation lens cover 32 for the observation optical system, and a suction port at the tip 37 provided. A forceps port 33 also serving as an air / water supply nozzle (not shown) is provided.

  As shown in FIG. 3, the US array 40 of the US unit 30 has a radial shape in which a plurality of rectangular ultrasonic elements (hereinafter referred to as “US elements”) 20 having a rectangular shape in plan view are connected and curved in a cylindrical shape. This is a group of type transducers. That is, in the US array 40, for example, 200 US elements 20 having a short side of 0.1 mm or less are arranged in a 360-degree direction on a side surface of a cylinder having a diameter of 2 mm. Each US element 20 is provided with a transmission / reception unit 60 (see FIGS. 4 to 6) which is an active region for transmitting and receiving ultrasonic waves.

  The US array 40 is a radial transducer group, but the US array may be a convex transducer group bent into a convex shape.

  A plurality of lower electrode terminals 52 are arranged at the end of the inner surface of the cylindrical ultrasonic array 40, and each is connected to a respective signal line 62 of the coaxial cable bundle 35. Although not shown in FIG. 3, a plurality of upper electrode terminals 51 (see FIG. 5) are arranged at the other end of the inner surface of the ultrasonic array 40. It is connected to the shield wire 61 (see FIG. 5). That is, the coaxial cable bundle 35 is composed of coaxial cables having the same number of core wires as the plurality of signal wires 62.

  The transmitter / receiver 60 generates ultrasonic waves by a driving signal applied via the lower electrode terminal 52 and the upper electrode terminal 51. Further, when receiving the ultrasonic wave, the transmission / reception unit 60 generates an electrical signal between the lower electrode terminal 52 and the upper electrode terminal 51.

  The coaxial cable bundle 35 is inserted into the distal end portion 37, the bending portion 38, the flexible tube portion 39, the operation portion 22, the universal cord 23, and the ultrasonic cable 26, and via the ultrasonic connector 26a. The ultrasonic observation apparatus 3 is connected.

<Configuration of transceiver unit>
Next, the configuration of the transmission / reception unit 60 of the US element 20 will be described with reference to FIGS. 4 and 5. Each figure is a schematic diagram for explanation, and the ratio of the number, thickness, size, size, and the like of the patterns is different from the actual one.

  As shown in FIG. 5, a plurality of capacitive ultrasonic transducer cells (hereinafter referred to as “US cells”) 10 are arranged in a matrix in the transmission / reception unit 60 of the ultrasonic unit 30. The arrangement of the US cells 10 may be a regular lattice arrangement, a staggered arrangement, a triangular mesh arrangement, or the like, or a random arrangement.

  As shown in FIG. 4, the US cell 10 includes a lower electrode 12 connected to a lower electrode terminal 52, a first insulating layer (lower insulating layer) 13, and a laminated structure on a silicon substrate 11 that is a base. And a second insulating layer (upper insulating layer) 15 in which a cylindrical cavity 14 is formed, an upper electrode 16 connected to the upper electrode terminal 51, and a third insulating layer (resin layer) 17. The silicon substrate 11 is a substrate in which silicon thermal oxide films 11B and 11C are formed on the surface of the silicon 11A.

  Each US cell 10 has a lower electrode portion 12A that is a signal electrode portion and an upper electrode portion 16A that is a ground electrode portion, which are opposed to each other via a cavity 14. The plurality of lower electrode portions 12A constitute the lower electrode 12 that is a signal electrode, and the plurality of upper electrode portions 16A constitute the upper electrode 16 that is a ground electrode.

  The lower electrode 12 includes a circular lower electrode portion 12 </ b> A and a conductive portion 12 </ b> B extending from the edge of the lower electrode 12. The lower electrode portion 12A is connected to the lower electrode portion of another US cell of the same US element 20 by the conductive portion 12B. The lower electrode 12 extends from the end of the transmission / reception unit 60 to the lower electrode wiring 42, and the lower electrode wiring 42 extends to the lower electrode terminal 52.

  The upper electrode 16 includes a circular upper electrode portion 16 </ b> A and a conductive portion 16 </ b> B extending from the edge of the upper electrode 16. The upper electrode portion 16A is connected to the upper electrode portion of another US cell of the same US element 20 by the conductive portion 16B. The upper electrode 16 extends from the end of the transmission / reception unit 60 to the upper electrode wiring 41, and the upper electrode wiring 41 extends to the upper electrode terminal 51.

  That is. All the lower electrode portions 12A of the plurality of US cells 10 arranged in the same US element 20 are connected to each other, and all the upper electrode portions 16A are also connected to each other.

  The upper electrode wiring 41 and the lower electrode wiring 42 (hereinafter referred to as “wiring 41 etc.”) are made of a metal material having a lower electrical resistance than conductive silicon or the like, for example, copper, gold, or aluminum.

  The third insulating layer 17 is a flexible resin layer that covers the surface of the transmission / reception unit 60. Further, the third insulating layer 17 covers the wiring 41 and the like, but does not cover the electrode terminal 51 and the like. The third insulating layer 17 has not only a protective layer function but also an acoustic matching layer function and a function of connecting the US elements 20.

  The third insulating layer 17 is made of a flexible resin such as polyimide, epoxy, acrylic, or polyparaxylene, and is particularly preferably polyimide because of high chemical resistance, flexibility, and easy processing. It is. The third insulating layer 17 may have a two-layer structure in which a biocompatible upper insulating layer is further formed on the lower insulating layer.

  In the US cell 10 having the structure shown in FIG. 4, the second insulating layer 15, the upper electrode 16, and the third insulating layer 17 in the region immediately above the cavity 14 constitute a membrane 18 that is a vibrating portion.

<Configuration of ultrasonic array>
As shown in FIGS. 5 and 6, the flexible lower part extends from the end of the transmitting / receiving unit 60 of the US element 20 to the lower electrode terminal 52 which is an external connection terminal located on the second main surface 20SB side. The electrode wiring 42 is extended. A flexible upper electrode wiring 41 extends from the other end of the transmitting / receiving unit 60 of the US element 20 to the upper electrode terminal 51 which is an external connection terminal located on the second main surface 20SB side. Has been.

  As already described, the lower electrode terminal 52 is connected to the signal line 62, and the upper electrode terminal 51 is connected to the shield line 61.

  And the 3rd insulating layer 17 which is a flexible resin layer has coat | covered the wiring 41 etc. while covering the surface of the transmission / reception part 60. FIG. The third insulating layer 17 preferably covers not only the upper side of the wiring 41 etc. but also the lower side of the wiring 41 etc., and seals the wiring 41 etc.

  Hereinafter, the flexible wiring 41 and the like sealed with the flexible third insulating layer 17 are referred to as “flexible wiring”. The flexible wiring includes bent portions 46 and 47 that are bent from the first main surface 20SB at a bending angle θ of 180 degrees.

  The US unit 30 is easy to manufacture because the external connection terminals are arranged on the second main surface 20SB by the bent flexible wiring. Further, the US endoscope 2 including the US unit 30 is easy to manufacture. Furthermore, since the electrical resistance of the wiring 41 and the like is low, the operation speed of the US unit 30 does not decrease.

<Method for manufacturing ultrasonic array>
Next, a method for manufacturing the ultrasonic array 40 will be described with reference to FIGS.

<Step S11> Formation of Lower Electrode As shown in FIG. 8A, a lower electrode layer made of a conductive material is formed on the silicon thermal oxide film 11B of the silicon substrate 11. The conductive material is formed on the entire surface of the silicon substrate 11 by sputtering or the like. The lower electrode 12 is formed by partially removing the mask pattern by etching after forming the mask pattern by photolithography.

<Step S12> First Insulating Layer Formation The first insulating layer 13 made of an insulating material such as SiN so as to cover the first main surface 20SA including the lower electrode 12 is formed by, for example, a CVD method (chemical vapor deposition method) or the like. Is formed.

<Step S13> Cavity / Second Insulating Layer Forming Step Then, after the sacrificial layer material is formed on the first insulating layer 13, the sacrificial layer having the shape of the cavity 14 (columnar shape) is removed by partial removal. Is formed.

  The thickness of the sacrificial layer is, for example, 0.05 to 0.3 μm and preferably 0.05 to 0.15 μm in order to be the height of the cavity 14. As the sacrificial layer material, for example, phosphorus glass (PSG: phosphorous-containing silicon oxide), silicon dioxide, polysilicon, or metal is used.

  On the upper surface of the first insulating layer 13 on which the sacrificial layer is formed, the second insulating layer 15 is formed by, for example, the same method and the same material as the first insulating layer 13.

  Then, an opening (not shown) through which an etchant flows is formed at a predetermined position of the second insulating layer 15 in order to remove the sacrificial layer.

  Next, the cavity 14 is formed by etching the sacrificial layer. For example, when phosphorous glass is used as the sacrificial layer and SiN is used as the first insulating layer 13 and the second insulating layer 15, a hydrofluoric acid solution (buffered HF solution) is used as the etchant.

  The cavity 14 is not limited to a cylindrical shape, and may be a polygonal column shape or the like. When the cavity 14 has a polygonal column shape, it is preferable that the shapes of the upper electrode portion 16A and the lower electrode portion 12A are also polygonal.

<Step S14> Formation of Upper Electrode Layer As shown in FIG. 8B, the upper electrode 16 is formed by the same method as the lower electrode 12.

<Step S15> Formation of Wiring Layer As shown in FIG. 8C, after forming a hole for bonding to the lower electrode wiring 42 in the first insulating layer 13 and the second insulating layer 15, the wiring layer, The lower electrode wiring 42, the lower electrode terminal 52, the upper electrode wiring 41, and the upper electrode terminal 51 are formed.
The wiring layer is formed by sputtering, vapor deposition, plating, or the like. For example, a 2 μm gold plating film is preferably used.

<Step S16> Formation of Third Insulating Layer As shown in FIG. 8D, the surface of the US element 20 (US array 40) excluding the electrode terminals 51 and the like is covered with the third insulating layer 17.
In order to seal the wiring 41 and the like, it is preferable to form a resin layer similar to the third insulating layer before the wiring layer forming step. That is, the third insulating layer is preferably performed before and after the wiring layer forming step. For example, the wiring layer is sealed by forming the 5 μm third insulating layer 1 before the wiring layer forming step and forming the 5 μm third insulating layer 2 after the wiring layer forming step.

  Further, a part of the first insulating layer 13 and the second insulating layer 15 may be used as a lower layer of the third insulating layer, or a base layer of a wiring layer is formed when the lower electrode 12 and the upper electrode 16 are formed. May be. Further, as already described, the insulating layer formed after the wiring layer forming step may have a two-layer structure.

<Step S17> Substrate Etching As shown in FIG. 8E, a part of the substrate 11, that is, both ends and the space between the US elements 20 are removed from the second main surface 20SB side by, for example, etching. The wiring 41 and the like can be bent by the substrate etching. As an etching method, a DRIE (Deep Reactive Ion Etching) method or the like is used.

<Step S18> Bending As shown in FIG. 8F, the flexible wirings at both ends are each bent 90 degrees along the side surface of the silicon substrate 11, and further 90 degrees along the second main surface 20SB. It can be bent. That is, the bending angle θ of the bent portions 46 and 47 is 180 degrees. For this reason, the electrode terminal 51 etc. which existed in 1st main surface 20SA comes to be located in the 2nd main surface 20SB side.

  Although not shown, the flexible wiring is joined to the silicon substrate 11 in a state of being bent by an epoxy adhesive or the like.

<Step S19> External Wiring Connection The signal wire 62 and the shield wire 61 of the coaxial cable bundle 35, which are the external connection wires, are connected to the electrode terminals 51 on the second main surface 20SB side, for example, by soldering. .
For example, the coaxial cable bundle 35 may be connected via a relay wiring board (cable connection board) made of a printed wiring board having a plurality of wirings.

  Although omitted in the above description, a plurality of rectangular US elements 20 constituting the US array 40 are manufactured simultaneously using a single silicon substrate 11. Then, for example, in the substrate etching process, each US element 20 is divided. That is, as shown in FIG. 5, the US array 40 has a structure in which the long sides of the plurality of ultrasonic elements 20 are connected by the third insulating layer 17. As already described, the third insulating layer 17 may have a multilayer structure, but each layer is made of a flexible resin.

  Further, in the US array 40, a plurality of ultrasonic elements 20 are arranged in a curved shape in a radial shape with a predetermined diameter in the connecting direction. That is, the US array 40 is bonded to the outer periphery of a cylinder having a predetermined diameter, for example.

  As described above, the method for manufacturing the ultrasonic unit 30 is easy.

<Modification of First Embodiment>
Next, the ultrasonic endoscope 2A including the ultrasonic unit 30A and the ultrasonic unit 30A according to the first modification of the first embodiment, and the ultrasonic unit 30B and the ultrasonic unit 30B according to the second modification according to the first embodiment are included. The ultrasonic endoscope 2B to be performed will be described.
Since the modified example is similar to the first embodiment, the same components are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 9, in the ultrasonic unit 30 </ b> A, a backing layer 70 that absorbs unnecessary ultrasonic waves is formed on the second main surface 20 </ b> SB of the silicon substrate 11. The backing layer 70 restricts the free vibration of the membrane when radiating ultrasonic waves, and improves the resolution in the traveling direction of the ultrasonic waves. Various materials that can absorb vibration can be used for the backing layer 70, and any of inorganic materials and organic materials can be applied. In particular, an epoxy resin and a rubber material are preferable because they have a low acoustic impedance and can absorb vibration without reducing sensitivity.

  The silicon substrate 11 of the US element 20 of the US unit 30A is etched so that the silicon substrate 11 remains in a part of the lower portion of the flexible wiring. In particular, by using a (100) plane single crystal silicon substrate and performing anisotropic etching with an alkaline aqueous solution, the end surface has a tapered shape with an inclination of 54.7 degrees with respect to the main surface. Of course, a dry etching method capable of forming a non-vertical cross-sectional shape may be used.

  As shown in FIG. 9, the flexible wiring is bent at bending portions 46 and 47 so as to cover the backing layer 70. The bending angle θ is 180 degrees, and the electrode terminals 51 and the like are located on the second main surface side of the silicon substrate 11.

  The US unit 30A is easy to bend because the silicon substrate 11 having a tapered side surface is provided at a part below the flexible wiring.

  On the other hand, as shown in FIG. 10, in the ultrasonic unit 30B, the bending angle θ of the bent portions 46 and 47 is 90 degrees. The electrode terminal 51 is located on the inner surface side of the side surface of the silicon substrate 11, and the electrode terminal 52 is located on the side surface of the silicon substrate 11.

  That is, the arrangement state of the electrode terminal 51 and the electrode terminal 52 does not have to be the same. For example, one electrode terminal may be located on the second main surface 20SB side of the silicon substrate 11 and the other may be located on the side surface. . One electrode terminal may be located on the first main surface 20SA side of the silicon substrate 11.

  Both the ultrasonic unit 30A and the ultrasonic unit 30B have the same effect as the ultrasonic unit 30 of the first embodiment. That is, the external connection electrode terminal is disposed on a surface different from the ultrasonic transmission / reception surface, but is easy to manufacture.

Second Embodiment
Next, the ultrasonic endoscope 2C including the ultrasonic unit 30C and the ultrasonic unit 30C according to the second embodiment will be described.

  In the ultrasonic unit 30A or the like, the ultrasonic array 40 is joined to the outer periphery of a cylindrical member having a predetermined diameter in order to deform the ultrasonic array 40 into a radial shape. However, the diameter of the ultrasonic array 40 increases due to the arrangement of the cylindrical members.

  On the other hand, as shown in FIGS. 11 and 12, in the US unit 30C, the plurality of ultrasonic elements 20 are curved along the shape of the backing layer 70 disposed on the second main surface 20SB. Yes.

  The silicon substrate 11 of the US element 20 of the US unit 30C is etched so as to leave the silicon substrate 11 in a part of the lower portion of the flexible wiring.

  Further, the side surface of the silicon substrate 11 after etching is not perpendicular to the main surface but inclined. In order to make the side surface tapered, a (100) plane single crystal is used as the silicon substrate 11 and anisotropic etching with an alkaline aqueous solution is performed. Then, the side surface formed by etching has an inclination of 54.7 degrees with respect to the main surface. Of course, a dry etching method capable of forming a non-vertical cross-sectional shape may be used.

  The shape of the backing layer 70 is a shape that fits with the inclined side surface of the silicon substrate 11, that is, an outer peripheral surface having a concave portion with a side surface having a predetermined inclination angle. For this reason, by joining the US elements 20 of the US array 40 so as to fit the irregularities on the outer peripheral surface of the cylindrical backing layer 70, a predetermined radial US unit 30C can be obtained without a gap. .

  The US unit 30C has the effect that the US unit 30B has, and further has a small diameter because a cylinder or the like for deforming the ultrasonic array 40 to a predetermined bending angle is unnecessary. Further, the distal end portion of the US endoscope 2C has a small diameter.

  The present invention is not limited to the above-described embodiment or modification, and various changes and modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Ultrasound endoscope system 2, 2A-2C ... Ultrasound endoscope, 3 ... Ultrasonic observation apparatus, 10 ... Ultrasonic cell, 11 ... Silicon substrate, 12 ... Lower electrode, 12A ... Lower electrode part, DESCRIPTION OF SYMBOLS 13 ... 1st insulating layer, 14 ... Cavity, 15 ... 2nd insulating layer, 16 ... Upper electrode, 16A ... Upper electrode part, 17 ... 3rd insulating layer, 18 ... Membrane, 20 ... Ultrasonic element, 20SA ... 1st , 20SB ... second main surface, 30, 30A-30C ... ultrasonic unit, 40 ... ultrasonic array, 41 ... upper electrode wiring, 42 ... lower electrode wiring, 46,47 ... folded portion, 51 ... upper part Electrode terminal 52 ... Lower electrode terminal 60 ... Transmission / reception unit 61 ... Shield wire 62 ... Signal wire 70 ... Backing layer

Claims (13)

Comprising an ultrasonic array comprising a plurality of connected ultrasonic elements;
The ultrasonic element is
A base body having a rectangular first main surface and a second main surface;
A plurality of ultrasonic cells each having a lower electrode portion and an upper electrode portion that are arranged to face each other through a cavity are arranged, and the lower electrode portions are connected to each other, and A rectangular transmission / reception unit for transmitting / receiving ultrasonic waves disposed on the first main surface, the upper electrode units being connected to each other;
A flexible lower electrode wiring connected to a plurality of the lower electrode portions, extending from an end of the transmission / reception unit;
A lower electrode terminal connected to the lower electrode wiring;
A flexible upper electrode wiring extending from the other end of the transmitting / receiving unit and connected to the plurality of upper electrode units;
An upper electrode terminal connected to the upper electrode wiring,
A flexible resin layer covers the surface of the transmission / reception unit, and covers the lower electrode wiring and the upper electrode wiring bent in the direction of the second main surface by the respective bent portions. Ultrasonic unit characterized by being.   2. The ultrasonic unit according to claim 1, wherein a bending angle of the bent portion is 180 degrees, and at least one of the lower electrode terminal and the upper electrode terminal is located on the second main surface side. .   The bending angle of the bent portion is 90 degrees, and at least one of the lower electrode terminal or the upper electrode terminal is located on a side surface side of the substrate. Ultrasonic unit.   The bending angle of the bent portion is 90 degrees, and at least one of the lower electrode terminal and the upper electrode terminal is located on the inner surface side of the side surface of the substrate. The ultrasonic unit according to any one of the above. The resin layer is made of polyimide,
The ultrasonic unit according to any one of claims 1 to 4, wherein the lower electrode wiring and the upper electrode wiring are made of copper, gold, or aluminum.   The ultrasonic unit according to claim 1, wherein the plurality of ultrasonic elements are connected by the resin layer.   The ultrasonic unit according to claim 6, wherein the plurality of ultrasonic elements are curved in a convex shape or a radial shape in a connecting direction.   8. A backing layer for absorbing ultrasonic waves disposed on the second main surface is provided, and the plurality of ultrasonic elements are curved along the shape of the backing layer. The ultrasonic unit described in.   An ultrasound endoscope comprising a distal end rigid portion having the ultrasound unit according to any one of claims 8 to 8. Producing a plurality of ultrasonic elements each having a plurality of ultrasonic cells each having a lower electrode portion and an upper electrode portion disposed opposite to each other via a cavity on the first main surface of the substrate;
Lower electrode wiring connected to the lower electrode portion, a lower electrode terminal extending from the lower electrode wiring, an upper electrode wiring connected to the upper electrode portion, and an upper electrode terminal extending from the upper electrode wiring On the first main surface,
Covering the surface of the first main surface with a flexible resin layer;
Removing at least a portion of the lower electrode wiring, the lower electrode terminal, the upper electrode wiring, and the substrate below the upper electrode terminal;
And a step of bending the lower electrode wiring and the upper electrode wiring in the direction of the second main surface.   The method of manufacturing an ultrasonic unit according to claim 10, wherein long sides of the plurality of ultrasonic elements are connected by the resin layer.   The method of manufacturing an ultrasonic unit according to claim 11, wherein the plurality of ultrasonic elements are curved in a convex shape or a radial shape in a connecting direction.   13. A backing layer for absorbing ultrasonic waves disposed on the second main surface is provided, and the plurality of ultrasonic elements are curved along the shape of the backing layer. The manufacturing method of the ultrasonic unit as described in 2 ..

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