JP2013098581A - Ultrasonic unit, ultrasonic endoscope, and method for manufacturing ultrasonic unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ultrasonic unit 30 to be easily manufactured.SOLUTION: An ultrasonic unit 30 includes: multiple ultrasonic elements 60; a hollow member 70 where the multiple ultrasonic elements 60 are connected to the outer peripheral surface thereof; a relay wiring board 59; and a cable 80. The relay wiring board 59 includes: a center wiring board 50; and multiple rectangular flexible wiring boards 40 radially extended from the outer peripheral part of the center wiring board 50. Element connection electrodes 41S arranged at the ends of the bent flexible wiring boards 40 are connected to external connection electrodes 62S of the ultrasonic elements 60.

Description

  The present invention relates to an ultrasonic unit having a plurality of ultrasonic elements, an ultrasonic endoscope including the ultrasonic unit, and a method for manufacturing the ultrasonic unit.

  An ultrasonic diagnostic method in which an ultrasonic wave is irradiated into the body and an internal state is imaged from an echo signal is diagnosed. One of ultrasonic diagnostic apparatuses used for ultrasonic diagnostic methods is an ultrasonic endoscope. In the ultrasonic endoscope, an ultrasonic transducer unit is disposed at the distal end rigid portion of the insertion portion introduced into the body. The ultrasonic transducer unit has a function of converting an electric signal into an ultrasonic wave and transmitting it into the body, and receiving an ultrasonic wave reflected in the body and converting it into an electric signal.

  The plurality of ultrasonic vibrators constituting the ultrasonic unit include an ultrasonic cell using a piezoelectric ceramic material (for example, PZT: lead zirconate titanate), or a capacitive ultrasonic wave manufactured using MEMS technology. An ultrasonic cell including a vibrator (capacitive micro-machined Ultrasonic Transducer, hereinafter referred to as “c-MUT”) is used.

  The c-MUT generates ultrasonic waves by applying a voltage between the lower electrode layer and the upper electrode layer to vibrate the membrane (vibrating part) including the upper electrode layer by electrostatic force. In addition, when an ultrasonic wave is incident from the outside, the distance between both electrodes changes, so that the ultrasonic wave is converted into an electric signal from the change in capacitance.

  Since c-MUT does not use lead or the like, the environmental load is smaller than an ultrasonic vibrator using piezoelectric ceramics.

  Here, it is not easy to connect a large number of ultrasonic cells to driving cables. For this reason, for example, Japanese Unexamined Patent Application Publication No. 2006-87708 discloses an ultrasonic transducer that uses an FPC board as a relay wiring board.

  Japanese Unexamined Patent Application Publication No. 2011-23134 discloses a collective cable for connecting a large number of drive cables at once.

  However, the ultrasonic transducer unit has been reduced in size and diameter, and its manufacture has become more difficult.

JP 2006-87708 A JP 2011-23134 A

A. Karonti et al., “Capacitive ultrasonic transducer array for medical image processing”, August 2006, “Microelectronics Journal”, Vol. 37, No. 8, pages 770-777.

  An embodiment of the present invention aims to provide an ultrasonic unit that is easy to manufacture, an ultrasonic endoscope that is easy to manufacture, and a method of manufacturing an ultrasonic unit that is easy to manufacture.

  An ultrasonic unit according to an embodiment of the present invention includes a plurality of ultrasonic elements each including a transmission / reception unit that transmits and receives an ultrasonic wave disposed on a rectangular first main surface, and an external connection electrode unit; A cylindrical or semi-cylindrical hollow member in which the second main surface of the ultrasonic element is joined to the outer peripheral surface, a circular or semi-circular central portion, and a radial extension from the outer peripheral portion of the central portion. A plurality of rectangular flexible portions, and an element connection electrode portion disposed at each end of the bent flexible portion is connected to the external connection electrode portion of each ultrasonic element. Each of the element connection electrode portions has a plurality of cable connection electrode portions connected via a respective internal wiring to a back surface where the central portion is joined to an end surface of the hollow member. A relay circuit board, inserting the interior of said hollow member, and a cable having a plurality of conductors which are connected to each of the cable connecting the electrode portions comprises.

  An ultrasonic endoscope according to another embodiment of the present invention includes the above-described ultrasonic unit.

  According to another embodiment of the present invention, there is provided a method of manufacturing an ultrasonic unit comprising: a plurality of ultrasonic elements each having a transmission / reception unit that transmits and receives an ultrasonic wave and an external connection electrode unit disposed on a rectangular first main surface. A step of manufacturing, a circular or semicircular central portion and a plurality of rectangular flexible portions extending radially from the outer peripheral portion of the central portion, and an element connection electrode portion at each end of the flexible portion Each having a plurality of cable connection electrode portions connected to the element connection electrode portions via wires on the back surface of the central portion, and a step of producing a relay wiring board, Joining the external connection electrode portion and the element connection electrode portion of the flexible portion of the relay wiring board; and the case on the back surface of the relay wiring board. Connecting each of a plurality of conductors of a cable to each of the cable connection electrode portions, joining the end face of a cylindrical or semi-cylindrical hollow member to the back surface of the central portion of the relay wiring board, Bending the flexible portion to join the second main surface of the ultrasonic element to the outer peripheral surface of the hollow member.

  According to an embodiment of the present invention, an object is to provide an ultrasonic unit that is easy to manufacture, an ultrasonic endoscope that is easy to manufacture, and a method of manufacturing an ultrasonic unit that is easy to manufacture.

It is an external view for demonstrating the ultrasonic endoscope of 1st Embodiment. It is a perspective view for demonstrating the front-end | tip part of the ultrasonic endoscope of 1st Embodiment. It is a perspective view for demonstrating the ultrasonic unit of the front-end | tip part of the ultrasonic endoscope of 1st Embodiment. It is an exploded view for demonstrating the structure of the ultrasonic unit of 1st Embodiment. It is sectional drawing for demonstrating the structure of the ultrasonic unit of 1st Embodiment. It is a flowchart for demonstrating the manufacturing method of the ultrasonic unit of 1st Embodiment. It is a top view of the ultrasonic element of the ultrasonic unit of the first embodiment. It is sectional drawing of the ultrasonic cell of the ultrasonic element in the ultrasonic unit of 1st Embodiment. It is a figure for demonstrating the relay wiring board of the ultrasonic unit of 1st Embodiment, FIG. 9 (A) has shown the front surface and FIG. 9 (B) has shown the back surface. It is a perspective view of the flexible substrate of the relay wiring board of the ultrasonic unit of 1st Embodiment. It is a figure for demonstrating the manufacturing method of the relay wiring board of the ultrasonic unit of 1st Embodiment, FIG. 11 (A) has shown the front surface and FIG. 11 (B) has shown the back surface. It is a top view for demonstrating the joining method of the relay wiring board and ultrasonic element of the ultrasonic unit of 1st Embodiment. It is sectional drawing for demonstrating the connection of the relay wiring board of the ultrasonic unit of 1st Embodiment, a cable, and a hollow member. It is sectional drawing for demonstrating the bending of the relay wiring board of the ultrasonic unit of 1st Embodiment, and joining with the hollow member of an ultrasonic element. It is a top view for demonstrating the relay wiring board of the ultrasonic unit of 2nd Embodiment. It is sectional drawing for demonstrating the connection of the relay wiring board and cable of the ultrasonic unit of 3rd Embodiment. It is a figure for demonstrating the manufacturing method of the relay wiring board of the ultrasonic unit of 3rd Embodiment, FIG. 17 (A) has shown the front surface and FIG. 17 (B) has shown the back surface. It is a top view of the ultrasonic element of the ultrasonic unit of the fourth embodiment. It is sectional drawing for demonstrating the structure of the ultrasonic unit of 4th Embodiment. It is a perspective view for demonstrating the ultrasonic unit of 4th Embodiment. It is a perspective view for demonstrating the ultrasonic unit of 5th Embodiment. It is a perspective view for demonstrating the manufacturing process of the ultrasonic unit of 5th Embodiment. It is a figure for demonstrating the hollow member of the ultrasonic unit of embodiment.

  Hereinafter, the ultrasound units 30 to 30D and the ultrasound endoscopes 2 to 2D including the ultrasound units 30 to 30D will be described with reference to the drawings.

<Configuration of ultrasonic endoscope>
As shown in FIG. 1, the ultrasonic endoscopes 2 to 2 </ b> D constitute the ultrasonic endoscope systems 1 to 1 </ b> D together with the ultrasonic observation device 3 and the monitor 4. Hereinafter, since the ultrasonic endoscopes 2 to 2D are similar, the ultrasonic endoscope 2 will be described as an example. The ultrasonic endoscope 2 includes an elongated insertion portion 21 to be inserted into the body, an operation portion 22 disposed at a proximal end of the insertion portion 21, a universal cord 23 extending from a side portion of the operation portion 22, It comprises.

  A connector 24 </ b> A connected to a light source device (not shown) is disposed at the base end of the universal cord 23. From the connector 24A, there are a cable 25 that is detachably connected to a camera control unit (not shown) via a connector 25A, and a cable 26 that is detachably connected to the ultrasonic observation apparatus 3 via a connector 26A. It is extended. A monitor 4 is connected to the ultrasonic observation apparatus 3.

  The insertion portion 21 is operated in order from the distal end side, the distal end rigid portion (hereinafter referred to as “the distal end portion”) 37, the bending portion 38 positioned at the rear end of the distal end portion 37, and the rear end of the bending portion 38. A flexible tube portion 39 having a small diameter, a long length, and flexibility that reaches the portion 22 is provided continuously. An ultrasonic unit 30 is disposed on the distal end side of the distal end portion 37.

  The operation unit 22 includes an angle knob 22A that controls the bending of the bending portion 38 in a desired direction, an air / water supply button 22B that performs air supply and water supply operations, a suction button 22C that performs suction operations, and a body that will be described later. A treatment instrument insertion port 22D or the like serving as an entrance of a treatment instrument having a puncture needle or the like is disposed.

  As shown in FIG. 2, an illumination lens cover 31 constituting an illumination optical system, an observation lens cover 32 of the observation optical system, and a later-described portion are provided at a distal end portion 37 where the ultrasonic unit 30 is disposed. Thus, a forceps port 33 from which a treatment instrument such as a puncture needle 5 (see FIG. 21) projects and an air / water supply nozzle (not shown) are arranged.

  Next, the configuration of the ultrasonic unit 30 will be described with reference to FIGS. The ultrasonic array 60S of the ultrasonic unit 30 is a radial transducer group in which the long sides of a plurality of substantially rectangular ultrasonic elements 60 in a plan view are connected and curved in a cylindrical shape. Each figure is a schematic diagram for explanation, and the number, size, size ratio, etc. of the components are different from actual ones.

  For example, in the actual ultrasonic array 60S, 200 or more ultrasonic elements 60 having a short side of 0.1 mm or less are arranged in a 360 degree direction on the outer peripheral surface 70SA of the hollow member 70 having an outer diameter of 2 mm. This is a radial type transducer group.

  A set of external connection electrodes 62A and 62B constituting the external connection electrode portions 62S of the plurality of ultrasonic elements 60 are arranged at the end of the cylindrical ultrasonic array 60S. 62A and 62B are connected to a plurality of conductors 81A and 81B of the cable 80 via the relay wiring board 59. The external connection electrode 62A is a drive potential electrode, and the external connection electrode 62B is a ground potential electrode. In the reference numerals of electrodes, wirings, or conductive wires, “A” indicates a driving potential and “B” indicates a ground potential.

  The ultrasonic unit 30 includes an ultrasonic array 60 </ b> S composed of a plurality of ultrasonic elements 60, a cylindrical hollow member 70, a relay wiring board 59, and a cable 80.

  The ultrasonic element 60 has a substantially rectangular first main surface 60SA and a second main surface 60SB facing the first main surface 60SA. A transmitting / receiving unit 61 for transmitting and receiving ultrasonic waves is disposed on the first main surface 60SA of the ultrasonic element 60, and a set of external connection electrode units 62S is formed at the end of the first main surface 60SA. External connection electrodes 62A and 62B are provided. The second main surface 60SB of the plurality of ultrasonic elements 60 is joined to the outer peripheral surface of the hollow member 70.

  The relay wiring board 59 includes a circular central wiring board 50 and a plurality of rectangular flexible wiring boards 40 extending radially from the outer periphery of the central wiring board 50.

  Each flexible wiring board 40 bent by approximately 90 degrees connects the ultrasonic element 60 and the central wiring board 50.

  The cable 80 is inserted into the distal end portion 37, the bending portion 38, the flexible tube portion 39, the operation portion 22, the universal cord 23, and the ultrasonic cable 26, and is connected via the ultrasonic connector 26A. The sound wave observation device 3 is connected.

Next, the configuration and manufacturing method of the ultrasonic unit 30 will be described with reference to the flowchart of FIG.
<Step S11>
As shown in FIG. 7, a transmitting / receiving unit 61 that transmits and receives ultrasonic waves disposed on the first main surface 60SA having a substantially rectangular shape, and an external connection electrode unit 62S disposed on an end portion of the first main surface 60SA. Are produced using the MEMS technology.

  In the ultrasonic element 60, a plurality of capacitive ultrasonic cells 10 are arranged in a matrix. For explanation, FIG. 7 schematically shows only a part of the ultrasonic cells 10. The arrangement of the ultrasonic cells 10 may be a regular lattice arrangement, a staggered arrangement, a triangular mesh arrangement, or the like, or a random arrangement.

  As shown in FIG. 8, the ultrasonic cell 10 includes a lower electrode layer 12 connected to an external connection electrode 62A, a lower insulating layer 13, a cylindrical shape, which are sequentially stacked on a silicon substrate 11 as a base. The upper insulating layer 15 in which the cavity 14 is formed, the upper electrode layer 16 connected to the external connection electrode 62B, and the protective layer 17 are included.

  Each ultrasonic cell 10 has a lower electrode portion 12 </ b> A and an upper electrode portion 16 </ b> A that are opposed to each other with a cavity 14 interposed therebetween. The cavity 14 is a space for the membrane 18 to vibrate.

  The lower electrode layer 12 includes a plurality of lower electrode portions 12A that are circular in plan view, and a lower wiring portion 12B that extends from the edge of the lower electrode portion 12A. The lower wiring part 12 </ b> B connects the lower electrode part 12 </ b> A of another ultrasonic cell of the same ultrasonic element 60. The lower wiring portion 12B is connected to the external connection electrode 62A.

  The upper electrode layer 16 has a plurality of upper electrode portions 16A that are circular in plan view, and an upper wiring portion 16B that extends from the edge of the upper electrode portion 16A. The upper wiring portion 16B connects the upper electrode portion 16A of another ultrasonic cell of the same ultrasonic element 60. The upper wiring portion 16B is connected to the external connection electrode 62B.

  That is. All the lower electrode portions 12A of the plurality of ultrasonic cells 10 arranged in the same ultrasonic element 60 are connected to each other, and all the upper electrode portions 16A are also connected to each other.

  In the ultrasonic cell 10 having the structure shown in FIG. 8, the upper insulating layer 15, the upper electrode layer 16, and the protective layer 17 in the region immediately above the cavity 14 constitute a membrane 18 that is a vibrating portion.

Here, the manufacturing method of the ultrasonic cell 10 will be described in detail.
The silicon substrate 11 is a substrate in which silicon thermal oxide films 11B and 11C are formed on the surface of the silicon 11A.

  In forming the lower electrode portion 12A and the upper electrode portion 16A, a conductive material made of conductive silicon or metal, for example, copper, gold, or aluminum, is formed on the entire surface of the silicon substrate 11 by sputtering or the like. Then, by forming a mask pattern by photolithography and then partially removing it by etching, for example, the lower electrode layer 12 having a lower electrode portion 12A and a lower wiring portion 12B is formed.

  In forming the lower insulating layer 13, the lower insulating layer 13 made of an insulating material such as SiN is formed by, for example, a CVD method so as to cover the lower electrode layer 12.

  The cavity 14 is formed using a material that can be removed by etching. The height of the cavity 14 is, for example, 0.05 to 0.3 μm, preferably 0.05 to 0.15 μm.

  On the upper surface of the sacrificial layer pattern, the upper insulating layer 15 is formed by the same method and the same material as the lower insulating layer 13, for example. The sacrificial layer pattern is etched away by an etching agent introduced through an opening (not shown) formed in the upper insulating layer 15, whereby the cavity 14 is formed.

  The cavity 14 is not limited to a cylindrical shape, and may be a polygonal column shape or the like. In the case where the cavity 14 has a polygonal column shape, it is preferable that the upper electrode portion 16A and the lower electrode portion 12A have a polygonal shape in plan view.

  The upper electrode layer 16 having the upper electrode portion 16A and the upper wiring portion 16B is formed by the same method and the same material as the lower electrode layer 12.

  The surface of the ultrasonic element 60 is covered with the protective layer 17. The protective layer 17 has not only a protective function but also an acoustic matching layer function and a function of connecting the ultrasonic elements 60.

  Although not described, the external connection electrode 62A is also formed in the lower electrode formation step, and the external connection electrode 62B is also formed in the upper electrode formation step. The protective layer 17 is formed so as not to cover the external connection electrode 62A and the external connection electrode 62B.

  The protective layer 17 is made of a flexible resin such as polyimide, epoxy, acrylic, or polyparaxylene, has high chemical resistance, has flexibility, and is easy to process. Particularly preferred is polyimide. . The protective layer 17 may have a two-layer structure in which a second insulating layer having biocompatibility is further formed on the first insulating layer.

<Step S12>
The relay wiring board 59 includes a circular central portion and a plurality of rectangular flexible portions extending radially from the outer peripheral portion of the central portion. Each flexible part has an element connection electrode part 41S at the end. The central portion has a plurality of cable connection electrode portions 52S each connected to the back surface via the element connection electrode portion 41S and the internal wiring 53.

  In the ultrasonic unit 30, the step of producing the relay wiring board 59 includes the step of producing the circular central wiring board 50 constituting the central part (step S <b> 13) and the rectangular flexible wiring board 40 constituting the flexible part. And a step of connecting the central wiring board 50 and the plurality of flexible wiring boards 40 (step S15).

<Step S13>
As shown in FIGS. 9 (A) and 9 (B), the central wiring board 50 is arranged in an arc shape on the outer peripheral portion of the front surface 50SA, and each is a set of flexible wiring board connection electrodes 51A, 51B. A plurality of flexible wiring board connection electrode portions 51S are formed, and each is connected to the flexible wiring board connection electrodes 51A and 51B via the respective internal wirings 53S (53A and 53B) in the central region of the back surface 50SB. In addition, a cable connection electrode portion 52S including a plurality of sets of cable connection electrodes 52A and 52B is provided. That is, although not shown, the internal wiring 53S has a through wiring portion that connects the front surface 50SA and the back surface 50SB of the central wiring board 50.

  The central wiring board 50 is made of a known rigid wiring board.

<Step S14>
As shown in FIG. 10, each of the substantially rectangular flexible wiring boards 40 has an element connection electrode part 41S at one end and a central wiring board connection electrode part 42S at the opposite end. The element connection electrode 41A and the central wiring board connection electrode 42A are connected by an internal wiring 43A, and the element connection electrode 41B and the central wiring board connection electrode 42B are connected by an internal wiring 43B. In the flexible wiring board 40 shown in FIG. 10, a region other than the internal wiring 43B is used as the internal wiring 43A in order to reduce electric resistance.

  The flexible wiring board 40 is made of a known flexible wiring board having, for example, polyimide as a base.

<Step S15>
As shown in FIGS. 11A and 11B, the central wiring board connecting electrode portions 42S of the plurality of flexible wiring boards 40 are arranged in an arc shape on the outer peripheral portion of the front surface 50SA of the central wiring board 50. The relay wiring board 59 is produced by connecting to the plurality of flexible wiring board connecting electrode portions 51S provided.
For example, solder bonding is used to connect the central wiring board 50 and the flexible wiring board 40.

<Step S16>
As shown in FIG. 12, the external connection electrode portions 62 </ b> S of the ultrasonic elements 60 are respectively connected to the element connection electrode portions 41 </ b> S of the plurality of flexible wiring boards 40 on the outer peripheral portion of the relay wiring board 59. For example, solder bonding is used to connect the flexible wiring board 40 and the ultrasonic element 60.

<Step S17>
As shown in FIG. 13, the conductive wire 81 of the cable 80 is connected to the cable connection electrode portion 52 </ b> S on the back surface 50 </ b> SB of the relay wiring board 59. For example, solder bonding is used for connection between the cable connection electrode portion 52S and the conductive wire 81. As the cable 80, a known collective cable described above may be used.

<Step S18>
As shown in FIG. 13, the end surface of the cylindrical hollow member 70 is joined to the back surface 50SB of the relay wiring board 59 using an adhesive or the like.

  In addition, after joining to the relay wiring board 59, the inner peripheral part of the hollow member 70 may be filled with a filler. Further, the cable 80 may be connected after the hollow member 70 is joined. Further, the hollow member 70 and the cable 80 may be integrated with a filler and joined to the relay wiring board 59 at the same time.

<Step S19>
As shown in FIGS. 13 and 14, the flexible wiring board 40 of the relay wiring board 59 is bent at a substantially right angle so that the second main surface 60SB of the ultrasonic element 60 has an adhesive or the like applied to the outer peripheral surface 70SA of the hollow member 70. The basic structure of the ultrasonic unit 30 is completed by using and joining.

  The main surface (front surface, back surface) of the relay wiring board 59 and the main surface of the ultrasonic element 60 are opposed to each other at a right angle, and the manufacturing process for electrically connecting between them is not easy. However, in the ultrasonic unit 30, the process of connecting the ultrasonic element 60 to the relay wiring board 59 is performed by joining the plane and the plane, which is easy. Further, the flexible wiring board 40 is easily bent because it is performed along the shape of the hollow member 70. For this reason, the ultrasonic unit 30 and the ultrasonic endoscope 2 have a high manufacturing yield.

<Operation of ultrasonic unit>
Next, the operation of the ultrasonic unit 30 will be briefly described. The lower electrode portion 12A of each ultrasonic cell 10 is connected to the drive potential side via the external connection electrode 62A and the like. On the other hand, the upper electrode portion 16A of each ultrasonic cell 10 is connected to the ground potential side via the external connection electrode 62B and the like.

  When ultrasonic waves are generated, a voltage signal generation unit (not shown) of the ultrasonic observation apparatus 3 applies a drive voltage signal to the lower electrode unit 12A. When a voltage is applied to the lower electrode portion 12A, the upper electrode portion 16A having the ground potential is attracted to the lower electrode portion 12A by electrostatic force, so that the membrane 18 including the upper electrode portion 16A is deformed. When the voltage applied to the lower electrode portion 12A disappears, the membrane 18 is restored to its original shape by the elastic force. An ultrasonic wave is generated by the deformation / recovery of the membrane 18.

  On the other hand, at the time of ultrasonic reception, the membrane 18 including the upper electrode portion 16A is deformed by the received ultrasonic energy. Then, since the distance between the upper electrode portion 16A and the lower electrode portion 12A changes, the capacitance between them changes. Then, a current accompanying a capacitance change flows through a capacitance signal detection unit (not shown) of the ultrasonic observation apparatus 3. That is, the received ultrasonic energy is converted into a capacitive signal.

  As described above, in the ultrasonic unit 30, the plurality of flexible wiring boards 40 of the relay wiring board 59 in which the plurality of ultrasonic elements 60 are radially arranged on the outer peripheral portion are arranged on the outer peripheral surface 70 SA of the hollow member 70. It can be manufactured by bending along. For this reason, the ultrasonic unit 30 and the ultrasonic endoscope 2A are easy to manufacture. Moreover, the manufacturing method of the ultrasonic unit 30 is easy to manufacture.

Second Embodiment
Next, a method for manufacturing the ultrasonic unit 30A, the ultrasonic endoscope 2A, and the ultrasonic unit 30A according to the second embodiment will be described. Since the ultrasonic unit 30A and the like are similar to the ultrasonic unit 30 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 15, the relay wiring board 59A of the ultrasonic unit 30A includes a circular central portion 50A made of a rigid substrate, and a plurality of rectangular flexible portions 40A extending radially from the outer peripheral portion of the central portion 50A. A so-called rigid-flex wiring board. The entire relay wiring board 59 may be a flexible wiring board, and may be joined to a donut-shaped holding plate having an outer diameter substantially equal to the outer diameter of the central portion 50A.

  The ultrasonic unit 30A and the ultrasonic endoscope 2A have the effects of the ultrasonic unit 30 and the like, and the relay wiring board 59A is easier to manufacture than the relay wiring board 59. Similarly, the manufacturing method of the ultrasonic unit 30 </ b> A has the effects that the manufacturing method of the ultrasonic unit 30 has, and is easier to manufacture.

<Third Embodiment>
Next, a method for manufacturing the ultrasonic unit 30B, the ultrasonic endoscope 2B, and the ultrasonic unit 30B according to the third embodiment will be described. Since the ultrasonic unit 30B and the like are similar to the ultrasonic unit 30 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 16, in the ultrasonic unit 30B, a connector 83 connected to the cable connection electrode portion 52SB is joined to the back surface of the relay wiring board 59B, and the cable 80B is connected to the relay wiring board via the connector 83. 59.

  The cable connection electrode portion 52SB is connected to the connector 83 by soldering or the like. The ultrasonic unit 30B that connects the cable 80B and the relay wiring board 59B via the connector 83 is easier to connect than the ultrasonic unit 30 or the like. When the connector 83 is used, the cable 80 </ b> B can be connected to the connector 83 after the hollow member 70 is joined to the relay wiring board 59. That is, the handling of the relay wiring board 59 to which a long cable is connected may not be easy, but the ultrasonic unit 30B is easy because the connector 83 is used.

  That is, the ultrasonic unit 30B and the ultrasonic endoscope 2B have the same effects as the ultrasonic unit 30 and the like, and are easier to manufacture. Similarly, the method for manufacturing the ultrasonic unit 30B has the effects that the method for manufacturing the ultrasonic unit 30 has, and is easier to manufacture.

  In the ultrasonic unit 30 </ b> B, the hollow member 70 is provided with a buffer member 71. The ultrasonic element 60 is disposed in the hollow member 70 via the buffer member 71. The buffer member 71 is made of a backing material that absorbs unnecessary ultrasonic waves in order to improve transmission / reception efficiency. That is, the buffer member 71 restricts free vibration of the membrane when radiating ultrasonic waves, and improves the resolution in the traveling direction of the ultrasonic waves. Various materials that can absorb vibration can be used for the buffer member 71, and any of inorganic materials and organic materials can be applied. In particular, an epoxy resin and a rubber material are preferable because they have a low acoustic impedance and can absorb vibration without reducing sensitivity.

  For this reason, the ultrasonic unit 30B and the like have the effects that the ultrasonic unit 30 has and the sensitivity is higher. In addition, the transmission / reception efficiency can be improved similarly to the ultrasonic unit 30B by disposing the buffer member 71 in the ultrasonic units 30 and 30A.

  Also, as shown in FIGS. 17A and 17B, in the relay wiring board 59B, the plurality of element connection electrodes 41B, which are ground potential electrodes, are connected to one cable connection electrode at the center of the back surface by the internal wiring 53BB. (Second electrode) It is connected to 52BB. The element connection electrode 41A, which is a drive potential electrode, is connected to each cable connection electrode (first electrode) 52AB by an internal wiring 53AB. That is, the number of cable connection electrode portions (second electrodes) 52BB having a ground potential is one, which is smaller than the number of cable connection electrodes (first electrodes) 52AB having a drive potential. In other words, the cable connection electrode portion 52SB includes one cable connection electrode (second electrode) 52BB and a plurality of cable connection electrodes (first electrodes) 52AB.

  For this reason, the conductor 80B of the ground potential connected to the cable connection electrode (second electrode) 52BB of the cable 80B is only one arranged at the center. The ground potential conductor may be a common shield line of the cable 80B, or the number of second electrodes and the ground potential conductor may be two or more.

  The ultrasonic unit 30B and the ultrasonic endoscope 2B have the same effects as those of the ultrasonic unit 30, and are easier to manufacture because there are few connection points between the cable 80B and the relay wiring board 59B. Similarly, the method for manufacturing the ultrasonic unit 30B has the effects that the method for manufacturing the ultrasonic unit 30 has, and is easier to manufacture.

  The relay wiring board 59B of the ultrasonic unit 30B is made of a flexible substrate as in the case of the relay wiring board 59A of the ultrasonic unit 30A, and is joined to the donut-shaped holding plate 53 with an adhesive or the like.

  In addition, the same effect can be obtained in the ultrasonic units 30 and 30A and the ultrasonic endoscopes 2 and 2A by adopting the same structure as the ultrasonic unit 30B and the like.

<Fourth embodiment>
Next, a method for manufacturing the ultrasonic unit 30C, the ultrasonic endoscope 2C, and the ultrasonic unit 30C according to the fourth embodiment will be described. Since the ultrasonic unit 30C and the like are similar to the ultrasonic unit 30 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 18, the ultrasonic element 60C of the ultrasonic unit 30C has an external connection electrode 62A that is a drive potential electrode at one end of the first main surface 60SA, and a ground potential at the other end. It has the external connection electrode 62B which is an electrode. The relay wiring board 59C includes a flexible wiring board 40C (40CS) and a central wiring board 50C.

  As shown in FIGS. 19 and 20, each external connection electrode 62B is connected to one common ground line 84 arranged in an arc shape along the outer periphery of ultrasonic array 60SC. The common ground line 84 is connected to the conductor 81E having the ground potential of the cable 80C.

  As described above, the ultrasonic unit 30C and the ultrasonic endoscope 2C have the same effects as the ultrasonic unit 30, and the number of connection points between the cable 80C and the relay wiring board 59 is small. Easy. Similarly, the manufacturing method of the ultrasonic unit 30 </ b> C has the effects that the manufacturing method of the ultrasonic unit 30 has, and is easier to manufacture.

  In addition, arrangement | positioning of the external connection electrode 62A and the external connection electrode 62B in the ultrasonic element 60 etc. is not restricted to the form already demonstrated. For example, the ultrasonic element 60 or the like may have the external connection electrode 62A on the first main surface and the external connection electrode 62B on the second main surface.

  Depending on the arrangement state of the external connection electrode portion 62S of the ultrasonic element 60, the two electrodes 41A and 41B of the element connection electrode portion 41S of the flexible wiring board 40 or the flexible portion of the relay wiring board are arranged on different main surfaces. Also good.

<Fifth Embodiment>
Next, a method for manufacturing the ultrasonic unit 30D, the ultrasonic endoscope 2D, and the ultrasonic unit 30D according to the fifth embodiment will be described. Since the ultrasonic unit 30D and the like are similar to the ultrasonic unit 30 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 21, the ultrasound unit 30D disposed at the distal end portion 37 of the ultrasound endoscope 2D has an ultrasound array 60SD that is a convex transducer group. The ultrasonic unit 30 </ b> D scans a plane including the puncture needle 5 protruding from the forceps opening 33.

  As shown in FIGS. 21 and 22, the ultrasonic array 60SD of the ultrasonic unit 30D includes a plurality of ultrasonic elements 60 joined to the outer peripheral surface of a substantially semi-cylindrical hollow member 70D. The end face of the hollow member 70D is joined to a substantially semi-cylindrical central wiring board 50D. The manufacturing method of the ultrasonic unit 30D is the same as that of the ultrasonic unit 30 already described. That is, by bending the flexible wiring board 40 to which the ultrasonic element 60 is connected by approximately 90 degrees, the ultrasonic element 60 is joined to the outer peripheral surface of the hollow member 70D.

  That is, the hollow member 70D of the ultrasonic unit 30D constituting the convex vibrator is substantially semi-cylindrical, and the central wiring board 50D is also substantially semi-circular as the end face shape of the hollow member 70D.

  The ultrasonic unit 30D and the ultrasonic endoscope 2D have the same effects as the ultrasonic unit 30 and the like. Similarly, the method for manufacturing the ultrasonic unit 30 </ b> D has the effect of the method for manufacturing the ultrasonic unit 30.

  Note that the end faces of the relay wiring board and the hollow member of the embodiment may be circular as shown in FIG. 23A, semicircular as shown in FIG. 23B, It may be substantially semicircular as shown in FIG. That is, in the present invention, the circular or semicircular shape may be any shape that includes a substantially circular shape or a substantially semicircular shape and further has an arc in a part thereof. Similarly, the cylindrical shape and the semicylindrical shape may be any shape as long as the end surface has a circular arc in part. That is, the shapes of the relay wiring board and the hollow member can be changed according to the scanning range of the ultrasonic unit.

  In addition, as the ultrasonic unit of the embodiment, the ultrasonic array 60S of the radial transducer group described in the first embodiment and the like, the ultrasonic array 60SD of the convex transducer group described in the fifth embodiment, You may have.

  Note that the above embodiment has been described by taking an example of an ultrasonic unit and an ultrasonic endoscope manufactured by the capacitive MEMS technology. This is because the capacitive ultrasonic unit is particularly suitable for miniaturization, and the effect of the present invention is remarkable. However, it is clear that the present invention has the same effect also in a piezoelectric ultrasonic unit and an ultrasonic endoscope using PZT and other piezoelectric ceramics.

  The present invention is not limited to the above-described embodiments, and various changes and modifications, for example, combinations of the components of the embodiments, and the like are possible without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Ultrasound endoscope system 2 ... Ultrasound endoscope 3 ... Ultrasound observation apparatus 10 ... Ultrasonic cell 30 ... Ultrasound unit 40 ... Flexible wiring board 41S ... Element connection electrode part 42S ... Central wiring board connection electrode part 43A, 43B ... Internal wiring 50 ... Central wiring board 51S ... Flexible wiring board connection electrode part 52S ... Cable connection electrode parts 53A, 53B ... Internal wiring 59 ... Relay wiring board 60 ... Ultrasonic element 60S ... Ultrasonic array 61 ... Transmission / reception part 62S ... External connection electrode 70 ... Hollow member 71 ... Buffer member 80 ... Cable

Claims (12)

A plurality of ultrasonic elements having a transmission / reception unit for transmitting and receiving ultrasonic waves disposed on the first principal surface of the rectangle, and an external connection electrode unit;
A cylindrical or semi-cylindrical hollow member in which the second principal surfaces of the plurality of ultrasonic elements are joined to the outer peripheral surface;
A circular or semi-circular central portion and a plurality of rectangular flexible portions extending radially from the outer peripheral portion of the central portion, and arranged at each end of the bent flexible portion The element connection electrode portions are connected to the external connection electrode portions of the respective ultrasonic elements, and each of the element connection electrode portions is connected to the back surface where the central portion is joined to the end surface of the hollow member. A relay wiring board having a plurality of cable connection electrode portions connected via internal wiring;
An ultrasonic unit comprising: a cable having a plurality of conducting wires connected to the respective cable connection electrode portions, which are inserted through the inside of the hollow member.   The relay wiring board includes a circular or semi-circular central wiring board and a plurality of rectangular flexible wiring boards, and the central wiring board is disposed in an arc shape on the cable connection electrode portion and the outer peripheral portion. A plurality of flexible wiring board connection electrode portions, and a wiring connecting each of the cable connection electrode portions and the flexible wiring board connection electrode portion, and each of the flexible wiring boards is connected to the element connection electrode portion. A central wiring board connection electrode part disposed at an end opposite to the element connection electrode part, and a wiring connecting the element connection electrode part and the central wiring board connection electrode part, The ultrasonic unit according to claim 1, wherein the flexible wiring board connection electrode portion and each of the central wiring board connection electrode portions are connected to each other.   The external connection electrode part, the element connection electrode part, the cable connection electrode part, the flexible wiring board connection electrode part, and the central wiring board connection electrode part each include a first electrode and a second electrode, The ultrasonic unit according to claim 2, wherein one electrode is a drive potential electrode and the second electrode is a ground potential electrode. The wiring of the central wiring board connects the second electrodes of the plurality of element connection electrode portions to the second electrode of one of the cable connection electrode portions,
The ultrasonic unit according to claim 3, wherein the number of the second electrodes of the cable connection electrode portion is smaller than the number of the first electrodes of the cable connection electrode portion. The external connection electrode part, the element connection electrode part, the cable connection electrode part, the flexible wiring board connection electrode part, and the central wiring board connection electrode part are drive potential electrodes,
Each of the ultrasonic elements has a ground potential electrode at the end opposite to the external connection electrode part,
The ultrasonic unit according to claim 2, wherein a short-circuit line connecting the plurality of ground potential electrodes is connected to a shield line of the cable.   The ultrasonic unit according to claim 4, wherein the ultrasonic element is joined to the hollow member via a buffer member.   An ultrasonic endoscope comprising the ultrasonic unit according to claim 1. A step of producing a plurality of ultrasonic elements having a transmission / reception unit that transmits and receives ultrasonic waves disposed on the first principal surface of the rectangle, and an external connection electrode unit;
A circular or semi-circular central portion, and a plurality of rectangular flexible portions extending radially from the outer peripheral portion of the central portion, each having an element connection electrode portion at each end thereof A step of producing a relay wiring board having a plurality of cable connection electrode portions each connected to the back surface of the central portion via the element connection electrode portion and wiring;
Bonding the external connection electrode portions of each of the plurality of ultrasonic elements and the element connection electrode portions of the flexible portions of the relay wiring board;
Connecting each of the plurality of conductors of the cable to each of the cable connection electrode portions on the back surface of the relay wiring board;
Joining the end face of a cylindrical or semi-cylindrical hollow member to the back surface of the relay wiring board;
And bending the flexible portion to join the second main surface of the ultrasonic element to the outer peripheral surface of the hollow member. The step of producing the relay wiring board includes
A circular or semi-circular central wiring board having a plurality of flexible wiring board connection electrode portions arranged in an arc shape on the outer peripheral portion, and wiring connecting the flexible wiring board connection electrode portion and the cable connection electrode portion A step of producing
The element connection electrode part, a central wiring board connection electrode part disposed at an end opposite to the element connection electrode part, and a wiring connecting the element connection electrode part and the central wiring board connection electrode part; Producing a plurality of rectangular flexible wiring boards having:
9. The step of connecting each of the flexible wiring board connection electrode portions of the central wiring board and the central wiring board connection electrode portion of each of the flexible wiring boards. Manufacturing method of ultrasonic unit.   The external connection electrode part, the element connection electrode part, the cable connection electrode part, the flexible wiring board connection electrode part, and the central wiring board connection electrode part each have a first electrode and a second electrode, 10. The method of manufacturing an ultrasonic unit according to claim 9, wherein the first electrode is a drive potential electrode, and the second electrode is a ground potential electrode. The relay wiring board has the wiring for connecting the second electrodes of the plurality of element connection electrode portions to the second electrode of one cable connection electrode portion,
The number of the 2nd electrodes of the said cable connection electrode part is fewer than the number of the said 1st electrodes of the said cable connection electrode part, The ultrasonic unit manufacturing method of Claim 10 characterized by the above-mentioned.   The method of manufacturing an ultrasonic unit according to claim 11, wherein the ultrasonic element is joined to the hollow member via a buffer member.

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