JP2013005083A - Connection structure between microstrip lines and microwave unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of transferring an unnecessary harmonic wave as it is with no attenuation of a harmonic wave component when a high frequency signal is transferred on a microstrip line.SOLUTION: The connection structure between microstrip lines includes a base plate 10, an input side substrate 11 containing a ground conductor 16, a dielectric body 17, and a central conductor 18, an output side substrate 12 containing a ground conductor 19, a dielectric body 20, and a central conductor 21, a fixing bracket 14 in which a gap 13 is provided between side wall surfaces 28 and 29, facing each other, of the input/output substrates 11 and 12, for fixing on the base plate 10, and a conductor member 15 which connects between the central conductor 18 of the input side substrate 11 and the central conductor 21 of the output side substrate 12. An impedance which is applied to a basic wave component and a harmonic wave component by the conductor member 15 is changed depending on the line length of the conductor member 15. The attenuation amount of the electric power of the harmonic wave component is set to be 2 dB or larger against the attenuation amount of the electric power of the basic wave component.

Description

  One embodiment relates to a connection structure between microwave strip lines and a microwave unit.

  The microwave circuit has a plurality of modules such as a distributor, an amplifier, and a combiner, and each of these modules is connected in a plurality of stages to constitute a power amplification device or the like. In the microwave circuit, a microstrip line is used for cost reduction (see, for example, Patent Documents 1 and 2).

  The microstrip line substrate has a central conductor patterned on its main surface. The microstrip line substrate refers to a substrate on which a microstrip line composed of a ground conductor, a dielectric substrate, and a central conductor is disposed. The front and rear two-stage microstrip line substrates need to connect the central conductor between these substrates. Further, when units having components such as an amplifier and a mixer are connected by a microstrip line, it is necessary to connect these components with a central conductor.

  Impedance discontinuity occurs at the connection between the microstrip line substrates. The connection portion refers to a space between the end portions of the center conductor of each microstrip line. Impedance refers to characteristic impedance. The microwave circuit is configured so that deterioration of VSWR (voltage standing wave ratio) and increase in transmission loss do not occur without being affected by impedance discontinuity. In the microwave circuit, the microstrip line substrates are brought as close as possible, and these substrates are wired at the shortest distance by a connecting conductor. By wiring between the substrates as short as possible with a connecting conductor, the microwave circuit reduces the discontinuity of the impedance and reduces the transmission loss from a low frequency to a high frequency.

Japanese Patent No. 2636550 JP 2007-208671 A Japanese Patent Laid-Open No. 10-209712

  However, the insertion loss due to the insertion of the microstrip line on the line is small in terms of frequency characteristics. When unnecessary harmonics exist on the line, there is a problem that harmonics are transmitted as they are without attenuation of the harmonic components.

  For example, when an element such as an amplifier having nonlinear input / output characteristics amplifies a microwave signal, a fundamental wave of the amplified microwave signal and unnecessary harmonics are generated on the line. It is necessary to provide a filter for removing unnecessary harmonics at any location on the line.

  In order to solve such a problem, according to one embodiment, a conductive base plate, a ground conductor on the main surface of the base plate, a dielectric on the ground conductor, and a central conductor on the dielectric are provided. And at least two substrates for transmitting a high frequency signal having a fundamental wave component and a frequency signal having a harmonic component having a frequency multiplied by the fundamental wave frequency, and a space between the opposing side wall surfaces of these substrates, and A fixing member that fixes a substrate on the base plate; and a conductor member that connects between the central conductors of each substrate fixed by the fixing member. The conductor member includes the fundamental wave component and the harmonic component. The impedance applied to the conductor member is changed by any one or more of the line length of the conductor member, the distance between the side wall surfaces, and the groove depth of the groove formed in the main surface, The attenuation of the components of the power, the connection structure between a microstrip line, characterized in that it has more than 2dB with respect to the power attenuation of the fundamental wave component is provided.

  According to another embodiment, the conductive base plate provided in the input / output direction of the high-frequency signal having the fundamental wave component, and provided on the signal input side on the main surface of the base plate, on the main surface An input-side board having a ground conductor grounded on the ground, a dielectric on the ground conductor, and a central conductor on the dielectric that forms a microstrip line together with the ground conductor and the dielectric, and facing the input-side board The ground conductor provided on the main surface on the signal output side and grounded on the main surface, the dielectric on the ground conductor, and the dielectric constituting the microstrip line together with the ground conductor and the dielectric An output side substrate having a central conductor on the body, and a gap between the output side substrate and the opposite side wall surfaces of the input side substrate, and the output side substrate and the input side substrate being the base plate A microwave component that generates a frequency signal of a harmonic component having a frequency multiplied by a fundamental frequency of the high-frequency signal transmitted through the input-side substrate fixed by the fixture, and the microwave A conductor member connecting between the central conductor of the input-side board and the central conductor of the output-side board through which the frequency signal and the high-frequency signal transmitted from a component are transmitted, the conductor member being the fundamental wave component And the impedance given to the harmonic component is changed by any one or more of the line length of the conductor member, the distance between the side wall surfaces, and the groove depth of the groove formed in the main surface, There is provided a microwave unit characterized in that the power attenuation of the component is 2 dB or more with respect to the power attenuation of the fundamental wave component.

(A) is a top view of the connection structure between the microstrip lines according to the first embodiment, and (b) is a longitudinal sectional view of (a) of the connection structure. It is a figure which shows the frequency characteristic of the attenuation amount of the high frequency wave signal by the connection structure between the microstrip lines which concerns on 1st Embodiment. It is a figure which shows the structural example of the amplifier module containing the microwave unit which concerns on 1st Embodiment. (A)-(c) is a figure which shows the connection part of the microstrip line of the microwave unit which concerns on a comparative example. (A) is a top view of the connection structure between the microstrip lines according to the second embodiment, (b) is a longitudinal sectional view of the connection structure, and (c) is a micro structure according to the second embodiment. It is a figure which shows the frequency characteristic of the attenuation amount of the high frequency signal by the connection structure between striplines. (A) is a top view of the connection structure between the microstrip lines according to the third embodiment, (b) is a longitudinal sectional view of the connection structure, and (c) is a micro structure according to the third embodiment. It is a figure which shows the frequency characteristic of the attenuation amount of the high frequency signal by the connection structure between striplines. (A) is a top view of the connection structure between the microstrip lines according to the fourth embodiment, (b) is a longitudinal sectional view of the connection structure, and (c) is a micro structure according to the fourth embodiment. It is a figure which shows the frequency characteristic of the attenuation amount of the high frequency signal by the connection structure between striplines. It is a longitudinal cross-sectional view of the connection structure between the microstrip lines which concerns on the modification of 4th Embodiment.

  Hereinafter, the connection structure between the microstrip lines and the microwave unit according to the embodiment will be described with reference to FIGS. In the drawings, the same portions are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
FIG. 1A is a top view of a connection structure between microstrip lines according to the first embodiment. FIG. 1B is a longitudinal sectional view taken along the line AA ′ in FIG. In these drawings, the same reference numerals denote the same elements. In the example of the figure, the left is the input terminal side, and the right is the output terminal side.

  The connection structure between the microstrip lines according to the present embodiment is a structure for connecting the input / output substrates each having the microstrip line. The microwave unit according to the present embodiment is an amplifier module having a connection structure between the microstrip lines.

  The connection structure between the microstrip lines according to the present embodiment includes a conductive case 10 (base plate), an input side substrate 11 provided on the input terminal side on the main surface of the case 10, and the input side substrate 11. The gap 13 is formed between the output-side substrate 12 provided on the output terminal side on the main surface and the input / output substrates 11 and 12 (the input-side substrate 11 and the output-side substrate 12). A plurality of screws 14 (fixing fixtures) that are fixed on the case 10 while leaving a gap, and a connecting conductor foil 15 (conductor member) that connects the central conductors of the fixed input / output boards 11 and 12; It has.

  Case 10 is the bottom wall of the shield case and functions as a base plate. The case 10 is made of a metal such as aluminum or copper. The case 10 has a common ground plane for the microstrip lines of the input / output boards 11 and 12.

  The input side substrate 11 includes a ground conductor 16 on the main surface of the case 10, a dielectric layer 17 (dielectric) on the ground conductor 16, and a center conductor 18 provided on the dielectric layer 17. Both the ground conductor 16 and the center conductor 18 are metal layers such as gold and copper. The lower surface of the ground conductor 16 and the main surface of the case 10 are fixed by soldering or the like. The center conductor 18 is a strip conductor. The center conductor 18 is produced by etching using a photoresist. For example, PTFE (polytetrafluoroethylene is used for the dielectric layer 17. These ground conductor 16, dielectric layer 17 and center conductor 18 constitute a microstrip line, which is not shown on the left side. A microwave signal (high frequency signal) input from the input terminal is transmitted.

  The microwave signal has a fundamental wave component. When a microwave signal passes through a microwave component such as an amplification element, the microwave component outputs a harmonic component having a frequency obtained by multiplying the fundamental frequency. The fundamental wave component and the harmonic component propagate to the input / output boards 11 and 12.

  The output side substrate 12 includes a ground conductor 19 on the main surface of the case 10, a dielectric layer 20 (dielectric) on the ground conductor 19, and a center conductor 21 provided on the dielectric layer 20. Both the ground conductor 19 and the center conductor 21 are gold or copper metal layers. The lower surface of the ground conductor 19 and the main surface of the case 10 are fixed by soldering. The central conductor 21 is a strip conductor, and is generated by an etching process using a photoresist. PTFE is used for the dielectric layer 20. These ground conductor 19, dielectric layer 20 and center conductor 21 constitute a microstrip line. A microwave signal from the conductor foil 15 is transmitted through the microstrip line, and is output from an output terminal (not shown) on the right side.

  A wiring pattern different from the central conductors 18 and 21 is formed on the dielectric layer 17 of the input side substrate 11 and the dielectric layer 20 of the output side substrate 12. Amplifying elements, passive elements, etc. (not shown) are connected to this wiring pattern. The input side substrate 11 and the output side substrate 12 are respectively formed with screw holes that penetrate the substrate material in the vertical direction.

  The plurality of screws 14 closely contact the back surface of the ground conductor 16 and the main surface of the case 10, and closely contact the back surface of the ground conductor 19 and the main surface of the case 10. In the input side substrate 11, a symmetrical position with the central conductor 18 sandwiched in the substrate width direction is screwed. In the output side substrate 12, a symmetrical position with the central conductor 21 in the substrate width direction is screwed. The substrate width direction refers to a direction orthogonal to the substrate length direction (signal power propagation direction) on the main surface.

  The connecting conductor foil 15 is a foil formed of gold or copper. Alternatively, an electric wire or the like is used for the conductor foil 15. In the connection structure according to the present embodiment, the conductor foil 15 is bent by bending upward so that the conductor foil 15 does not hang downward. The physical distance between the conductor foil 15 as the main line and the main surface of the case 10 as the ground plane is increased. By bending the conductor foil 15, the conductor foil 15 is not subjected to stress (stress) generated on the input / output substrates 11 and 12 when the temperature is changed or screwed. Both ends of the conductor foil 15 are fixed on the center conductors 18 and 21 by soldering or the like, respectively.

  In the connection structure between the microstrip lines according to the present embodiment, the impedance to the microwave signal is changed depending on the line length of the conductor foil 15. The line length of the conductor foil 15 is substantially equal to the path length of the conductor foil 15 that is curved in an arc shape in a side view. The path refers to a point from a fixed point at one end of the conductor foil 15 to a fixed point at the other end of the conductor foil 15 through a loop-shaped signal transmission path. The path length of the conductor foil 15 is determined by a guideline such as about 2 to about 3 times the substrate thickness of the input side substrate 11. The amount of bending is determined to such a value that the conductor foil 15 is not cut.

  FIG. 2 is a diagram showing the frequency characteristics of the attenuation amount of the microwave signal by the connection structure between the microstrip lines according to the present embodiment. The horizontal axis of the figure represents the frequency. The vertical axis represents the amount of power attenuation of the frequency component. The attenuation is based on the signal power of the microwave signal before the microwave signal is transmitted through the conductor foil 15, and the reference value is, for example, 0 dB. The frequency of the fundamental wave is 1 GHz. The frequency of the third harmonic is 3 GHz. In the connection structure according to the present embodiment, the attenuation amount of the target third harmonic component power is 2 dB or more with respect to the attenuation amount of the fundamental wave component of the microwave signal. Further, by appropriately selecting the frequency of the fundamental wave and the like, the attenuation amount of the power of the frequency component of the third harmonic can be made 3 dB or more with respect to that of the fundamental wave component.

  The microwave unit according to the present embodiment has a connection structure between the microstrip lines. FIG. 3 shows a configuration example in the case where a microwave unit is used for the second amplifier module among the three amplifier modules connected in series in three stages. FIG. 3 is a diagram illustrating a configuration example of an amplifier module including a microwave unit. The above described symbols represent the same elements. The microwave amplifier 22 is a microwave circuit provided in a microwave signal transmission system. The microwave amplifier 22 includes a first amplifier module (first amplifier) 23 provided before the microwave unit 1 and input / output substrates 11 and 12 and has a connection structure between the microstrip lines. And a second amplifier module (second amplifier) 24 provided at a later stage than the microwave unit 1. The microwave unit 1 includes one or both of an amplifying element 25 on the input side substrate 11 and an amplifying element 26 on the output side substrate 12.

  A microwave signal amplified and output by the first amplifier module 23 is input to the microwave unit 1 having such a configuration. The amplification characteristics of the first amplifier module 23 and the amplification element 25 have nonlinearity. After the microwave signal passes through the microstrip line of the input side substrate 11, unnecessary harmonics are generated. The conductor foil 15 is a space between a side wall surface 28 including a fixing point on one end side of the conductor foil 15 on the central conductor 18 and a side wall surface 29 including a fixing point on the other end side of the conductor foil 15 in the central conductor 21. The impedance at is changed. When the harmonic component looks at the conductor foil 15, the impedance can be increased at the connection between the microstrip lines.

  By connecting the microstrip lines with the long conductor foil 15 within a range that does not affect the fundamental wave, the impedance of the connection part between the microstrip lines can be increased. The microwave unit 1 suppresses the third harmonic wave by passing the microwave signal through the conductor foil 15. The target harmonic component is further attenuated with respect to the attenuation amount of the fundamental wave component.

  Since the influence of the microwave signal varies depending on the frequency of the fundamental wave to be used, the distance between the microstrip lines and the length of the conductive foil 15 can originally vary depending on the factors that affect the microwave signal. Since the harmonics are used after being attenuated, the microwave unit 1 determines the distance between the microstrip line substrates and the length of the conductor foil 15 according to the transmission characteristics of the fundamental wave.

  As an example of how to determine the distance between the side wall surfaces 28 and 29 and the length of the conductor foil 15, the distance between the side walls 28 and 29 and the length of the conductor foil 15 are gradually increased based on the fundamental wave frequency. When measuring the transmission characteristics, it is desirable to use the distance and length used in the trial just before the fundamental characteristics start to deteriorate.

  When the microwave unit 1 is used under a usage situation where the loss of the fundamental wave component is allowed to some extent, the attenuation amount of the desired harmonic component may be adjusted by the conductor foil 15. Alternatively, if the fundamental wave transmission characteristics are allowed to deteriorate to some extent, it is effective to further increase the impedance of the connecting portion in order to suppress harmonics.

  With this microwave unit 1, unnecessary harmonics can be suppressed at the connection between the microstrip lines at the same cost as the conventional example. A filter for removing harmonics is not necessary. The filter refers to a low pass filter or a band pass filter. Alternatively, the number of filters can be reduced. Alternatively, it is possible to use a filter with a relatively gentle attenuation characteristic instead of using a filter with a steep attenuation characteristic.

  FIG. 4 shows a connection portion of the microstrip line of the microwave unit according to the comparative example. FIG. 4A is a top view of a connection structure between microstrip lines according to a comparative example. FIG. 4B is a longitudinal sectional view of the connection structure. FIG. 4C is a diagram illustrating the frequency characteristics of the attenuation amount of the microwave signal by the connection structure between the microstrip lines according to the comparative example. In these drawings, the above-described reference numerals represent equivalent elements.

  At the substrate end in the signal transmission direction of the input side substrate 11, the dielectric layer 17 is interrupted and disappears. Since the continuity of the ground plane is lost, an abrupt impedance discontinuity occurs at the connection between the substrates of the microstrip line. The input / output boards 11 and 12 are arranged as close as possible to each other so as not to deteriorate the VSWR and increase the transmission loss amount.

  As shown in FIG. 4A and FIG. 4B, the microwave unit has a connecting conductor 100 wired between the central conductors 18 and 21 at the shortest distance. By implementing the shortest distance wiring, impedance discontinuities are reduced, and transmission loss is reduced from a low frequency to a high frequency as shown in FIG. However, in the examples of FIGS. 4A and 4B, the microstrip line has a small insertion loss. Due to the frequency characteristics, the amount of variation in the amount of insertion loss is small even if the frequency changes. In the comparative example, when an unnecessary harmonic exists on the line, the harmonic component is transmitted as it is as the fundamental component. When the characteristics of the microwave unit are characteristics that reduce transmission loss in accordance with the frequency of the desired fundamental wave, harmonic components are transmitted without loss.

  On the other hand, the microwave unit 1 gives the conductor foil 15 frequency characteristics so that unnecessary harmonics are not transmitted. In other words, the microwave unit 1 is different from the conventional example in which the impedance of the connection portion is not changed in that the impedance of the connection portion is intentionally changed. In this way, the microwave unit 1 increases the impedance given to the third harmonic wave so as not to affect the signal having the fundamental frequency, thereby suppressing the third harmonic wave. The microwave unit 1 can attenuate the harmonic power while maintaining the fundamental power without using a filter, simply by passing the conductor foil 15 through the microwave signal.

(Second Embodiment)
In the first embodiment, the line length of the conductor foil 15 is increased. However, by increasing the distance between the side wall surfaces 28 and 29 of the input / output substrates 11 and 12, the connection portion between the microstrip line substrates is increased. High impedance can be achieved.

  FIG. 5A is a top view of a connection structure between microstrip lines according to the second embodiment. FIG. 5B is a longitudinal sectional view taken along the line BB ′ in FIG. 5A of the connection structure. The above described symbols represent the same elements.

  The connection structure between the microstrip lines according to the present embodiment includes an input side substrate 11, an output side substrate 12, and a connecting conductor 27 (conductor member). The conducting wire 27 connects the central conductor 18 of the input side substrate 11 and the central conductor 21 of the output side substrate 12. The conducting wire 27 is formed by braiding a number of metal strands. Both ends of the conducting wire 27 are fixed on the central conductors 18 and 21 by soldering or the like, respectively. By increasing the distance between the side wall surfaces 28 and 29, the impedance of the conductor 27 with respect to the third harmonic component of the microwave signal is increased without attenuating the fundamental component.

  After the microwave signal passes through the input side substrate 11 of the microwave unit 2 having such a configuration, unnecessary harmonics are generated. FIG.5 (c) is a figure which shows the frequency characteristic of the attenuation amount of the microwave signal by the connection structure between the microstrip lines which concerns on this embodiment. The target power attenuation ATT of the third harmonic component is 2 dB or more with respect to the power attenuation of the fundamental wave component of the microwave signal. By appropriately selecting the frequency of the fundamental wave and the like, the attenuation amount of the power of the frequency component of the third harmonic can be made 3 dB or more with respect to that of the fundamental wave component.

  By connecting the microstrip lines with the long conductive wires 27 within a range that does not affect the fundamental wave, the impedance of the connection part between the microstrip lines can be increased. The microwave unit 1 can attenuate the harmonic power while maintaining the power of the fundamental wave without using a filter, simply by passing the conducting wire 27 through the microwave signal.

  Moreover, the effect similar to the effect obtained in FIG. 1 is acquired by making a connection part into high impedance.

(Third embodiment)
In addition, the distance between the side wall surfaces 28 and 29 of the input / output substrates 11 and 12 can be narrowed and the line length of the conductor member can be further increased as compared with the example of the first embodiment.

  FIG. 6A is a top view of a connection structure between microstrip lines according to the third embodiment. FIG. 6B is a longitudinal sectional view taken along CC ′ of FIG. 6A of the connection structure. The above described symbols represent the same elements.

  The connection structure between the microstrip lines according to the present embodiment includes a copper foil 30 (conductor member) for connection. The copper foil 30 connects the center conductor 18 of the input side substrate 11 and the center conductor 21 of the output side substrate 12. Both ends of the copper foil 30 are fixed on the central conductors 18 and 21 by soldering or the like, respectively. The copper foil 30 is erected in a state in which a middle portion of the copper foil 30 is stretched upward and the curved posture is maintained. For example, the height of the copper foil 30 erected from the center conductors 18 and 21 is about three times the substrate thickness of the input / output substrates 11 and 12. By increasing the impedance due to the line length of the copper foil 30 by decreasing the gap value of the gap 13 between the side walls 28 and 29 and reducing the impedance, the copper foil 30 as the main line and the ground plane A distance from the main surface of the case 10 is secured. Impedance for the third harmonic component of the microwave signal is increased.

  After the microwave signal passes through the input side substrate 11 of the microwave unit 3 having such a configuration, unnecessary harmonics are generated.

  FIG. 6C is a diagram illustrating the frequency characteristics of the attenuation amount of the microwave signal due to the connection structure between the microstrip lines according to the present embodiment. The target power attenuation ATT of the third harmonic component is 2 dB or more with respect to the power attenuation of the fundamental wave component of the microwave signal. By appropriately selecting the frequency of the fundamental wave, the attenuation amount of the power of the frequency component of the third harmonic can be 3 dB or more with respect to that of the fundamental wave.

  By connecting the microstrip lines with a long copper foil 30 within a range that does not affect the fundamental wave, the impedance of the connection between the microstrip lines can be increased. The microwave unit 3 can attenuate the harmonic power while maintaining the power of the fundamental wave without using a filter, simply by allowing the microwave signal to pass through the copper foil 30.

(Fourth embodiment)
Further, as a method for increasing the distance between the main line and the ground plane, a groove can be dug in the main surface of the case 10.

  FIG. 7A is a top view of a connection structure between microstrip lines according to the fourth embodiment. FIG. 7B is a longitudinal sectional view taken along DD ′ in FIG. 7A of the connection structure. The above described symbols represent the same elements.

  The connection structure between the microstrip lines according to the present embodiment includes a connection copper foil 31 (conductor member) and a groove 32 that is recessed in the main surface of the case 10. The copper foil 31 connects the center conductor 18 of the input side substrate 11 and the center conductor 21 of the output side substrate 12. Both ends of the copper foil 31 are fixed on the central conductors 18 and 21 by soldering or the like, respectively. The groove 32 has a groove bottom 33 lower than the main surface of the case 10. A distance between the copper foil 31 as the main line and the groove bottom 33 as the ground plane is secured. Impedance for the third harmonic component of the microwave signal is increased. The method of determining the groove depth of the groove bottom 33 is based on, for example, an operation or experiment in which the attenuation is measured while changing the value of the groove depth while the copper foil 31 is attached.

  After the microwave signal passes through the input side substrate 11 of the microwave unit 4 having such a configuration, unnecessary harmonics are generated.

  FIG.7 (c) is a figure which shows the frequency characteristic of the attenuation amount of the microwave signal by the connection structure between the microstrip lines which concerns on this embodiment. The target power attenuation ATT of the third harmonic component is 2 dB or more with respect to the power attenuation of the fundamental wave component of the microwave signal. By appropriately selecting the frequency of the fundamental wave and the like, this connection structure can make the attenuation amount of the power of the frequency component of the third harmonic wave 3 dB or more with respect to that of the fundamental wave.

  By providing the groove 32 within a range that does not affect the fundamental wave, the impedance of the connection portion between the microstrip lines can be increased. The microwave unit 4 can attenuate the harmonic power while maintaining the fundamental power without using a filter, simply by passing the copper signal 31 through the microwave signal.

  The size and shape of the groove can be variously changed.

  FIG. 8 is a longitudinal sectional view of a connection structure between microstrip lines according to a modification of the fourth embodiment. The above described symbols represent the same elements. The connection structure between the microstrip lines according to this modification includes a connection conductor foil 34 (conductor member), the input-side substrate 11, the output-side substrate 12, and a groove 35 recessed in the main surface of the case 10. And have.

The microwave unit 5 is provided with three parts: extending the connection distance between the microstrip lines, lengthening the conductor member for connection between the substrates, and digging the case wall. Unnecessary waves (harmonics) from the device can be suppressed by extending the line length of the gap 13 in calculation and increasing the impedance of the connecting portion.
Moreover, you may combine each of said each embodiment. Any one of increasing the line length of the conductor foil 15, decreasing the distance between the side wall surfaces, and digging a groove in the main surface of the case 10 may be performed. You may change the length of a conductor member, the distance between side wall surfaces, and the groove depth of a groove in the range which does not appear in the transmission characteristic of a fundamental wave.

(Other)
In the above embodiment, the order of the harmonics is the third order. However, the impedance such as the connection part or the conductor foil 15 is set so as to remove the second order harmonic or the higher order harmonic exceeding 3 times the fundamental wave. You may make it give to a member.

  In the above embodiment, the conductor foil 15 is used as the conductor member. However, a bar-like, plate-like, or thin wire-like conductor piece different from the foil body may be used as the conductor member.

  In the said embodiment, it is preferable that the shape of the conductor foil 15 seen from the side, the shape of a groove | channel, etc. have symmetry.

  In the above embodiment, the ground conductors 16 and 19 are fixed to the case 10 by screwing. However, soldering or adhesion with a conductive adhesive may be used for fixing.

  In the above embodiment, the microwave unit is used for the connection between the substrates in the amplifier module. However, the microwave unit may be used for an antenna switch, an isolator, a circulator, an amplifier, a phase shifter, a mixer, and the like.

  Although several embodiments have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

  1, 2, 3, 4, 5 ... microwave unit, 10 ... case (base plate), 11 ... input side substrate (substrate), 12 ... output side substrate (substrate), 13 ... gap, 14 ... screw (fixing tool) 15 ... conductor foil (conductor member), 16 ... ground conductor, 17 ... dielectric layer (dielectric), 18 ... center conductor, 19 ... ground conductor, 20 ... dielectric layer (dielectric), 21 ... center conductor, DESCRIPTION OF SYMBOLS 22 ... Microwave amplifier, 23 ... 1st amplifier module, 24 ... 2nd amplifier module, 25, 26 ... Amplifying element, 27 ... Conductor (conductor member), 28, 29 ... Side wall surface, 30 ... Copper foil (conductor member) 31 ... Copper foil (conductor member), 32 ... groove, 33 ... groove bottom, 34 ... conductor foil (conductor member), 35 ... groove.

Claims (5)

A conductive base plate;
A high-frequency signal having a fundamental wave component and a harmonic component having a frequency multiplied by the fundamental wave frequency, each having a ground conductor on the main surface of the base plate, a dielectric on the ground conductor, and a central conductor on the dielectric. At least two substrates for transmitting a frequency signal of
A fixture for fixing each substrate on the base plate with a gap between the opposing side wall surfaces of these substrates;
A conductor member connecting between the central conductors of each substrate fixed by the fixture;
The impedance given to the fundamental wave component and the harmonic component by the conductor member is any one of the line length of the conductor member, the distance between the side wall surfaces, and the groove depth of the groove formed in the main surface. The connection structure between the microstrip lines is changed as described above, and the attenuation amount of the harmonic component power is set to 2 dB or more with respect to the attenuation amount of the fundamental component power.   2. The connection structure between microstrip lines according to claim 1, wherein the conductor member has an attenuation amount of power of the harmonic component set to 3 dB or more with respect to an attenuation amount of power of the fundamental wave component.   2. The connection structure between microstrip lines according to claim 1, wherein the conductor member gives a high impedance to the harmonic component within a range not affecting the fundamental wave component. A conductive base plate provided in the input / output direction of a high-frequency signal having a fundamental wave component;
The ground conductor provided on the signal input side on the main surface of the base plate and grounded on the main surface, the dielectric on the ground conductor, and the dielectric forming the microstrip line together with the ground conductor and the dielectric An input side substrate having a central conductor on the body;
A ground conductor provided on the signal output side on the main surface facing the input side substrate and grounded on the main surface, a dielectric on the ground conductor, and a microstrip together with the ground conductor and the dielectric An output side substrate having a central conductor on the dielectric constituting the line;
A fixture for fixing the output side substrate and the input side substrate on the base plate by providing a gap between the opposing side wall surfaces of the output side substrate and the input side substrate;
A microwave component for generating a frequency signal of a harmonic component having a frequency multiplied by a fundamental frequency of the high-frequency signal transmitted through the input-side substrate fixed by the fixture;
A conductor member that connects between the center conductor of the input side substrate and the center conductor of the output side substrate that transmit the frequency signal and the high frequency signal from the microwave component;
The impedance given to the fundamental wave component and the harmonic component by the conductor member is any one of the line length of the conductor member, the distance between the side wall surfaces, and the groove depth of the groove formed in the main surface. The microwave unit according to the above, wherein the attenuation amount of the power of the harmonic component is set to 2 dB or more with respect to the attenuation amount of the power of the fundamental wave component.   5. The microwave unit according to claim 4, wherein the conductor member has an attenuation amount of power of the harmonic component set to 3 dB or more with respect to an attenuation amount of power of the fundamental wave component.

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