JP2013004951A - Electronic component mounting device - Google Patents

Electronic component mounting device Download PDF

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JP2013004951A
JP2013004951A JP2011138193A JP2011138193A JP2013004951A JP 2013004951 A JP2013004951 A JP 2013004951A JP 2011138193 A JP2011138193 A JP 2011138193A JP 2011138193 A JP2011138193 A JP 2011138193A JP 2013004951 A JP2013004951 A JP 2013004951A
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abnormality
detection device
abnormality detection
component
image
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JP5684057B2 (en
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Masafumi Amano
雅史 天野
Kazumi Hoshikawa
和美 星川
Hiroshi Oike
博史 大池
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting device in which, when abnormality is detected in any portion of the electronic component mounting device, the quality of a detection state can be confirmed by displaying an image of an abnormality detection device which detects the abnormality or the abnormality notification device which notifies the detected abnormality.SOLUTION: An electronic component mounting device includes: a camera for mark recognition which recognizes a positioned position of the transported substrate; an abnormality detection device which detects abnormality of an arbitrary portion of a device in which the abnormality occurs; and an image display device which displays an image of the abnormality detected by the abnormality detection device. The camera for the mark recognition is capable of photographing the abnormality detection device which detects the abnormality. In the electronic component mounting device, a control device is provided which, when the abnormality detection device detects the abnormality, makes the abnormality detection device photographed by the camera for the mark recognition and also makes the photographed image displayed in the image display device.

Description

本発明は、基板に電子部品を装着する装置に異常が生じたときに、その異常状態を検知するとともに、検知した検知器具の確認を行なう自己診断機能を有する電子部品装着装置に関する。   The present invention relates to an electronic component mounting apparatus having a self-diagnosis function for detecting an abnormal state and confirming a detected detection instrument when an abnormality occurs in an apparatus for mounting an electronic component on a substrate.

従来、電子部品を装着する電子部品装着装置は常に高い精度でその動きが制御され、基板の所定位置に電子部品を正確かつ迅速に配置することが求められる。そのため、電子部品を装着する工程に使用されるいずれかの装置に異常が生じた場合には、的確に対応して迅速に正常に戻すことが重要である。   2. Description of the Related Art Conventionally, the movement of an electronic component mounting apparatus for mounting an electronic component is always controlled with high accuracy, and it is required to place the electronic component accurately and quickly at a predetermined position on a board. For this reason, when an abnormality occurs in any of the devices used in the process of mounting the electronic component, it is important to respond appropriately and quickly return to normal.

このような異常が生じたときに対応する装置が記載された特許文献1によると、部品供給装置において異常が発生した場合には、部品供給装置に異常があったことを記憶し、基板上に電子部品を装着した後に部品供給装置の部品取出部をカメラで撮像し、撮像された異常にかかる画像を表示することが記載されている。表示された画像により作業者は修正・修理の具体的方法を判断できるようになっている。   According to Patent Document 1 in which an apparatus corresponding to such an abnormality is described, when an abnormality occurs in the component supply device, the fact that the component supply device is abnormal is stored on the substrate. The document describes that after mounting an electronic component, the component extraction unit of the component supply device is imaged with a camera and an image of the imaged abnormality is displayed. The displayed image allows the operator to determine a specific method of correction / repair.

特開2010−199445号公報JP 2010-199445 A

しかし、上記特許文献1では、装置が異常を検知した場合に、異常対象の状態をモニタ画面に表示することは記載されているが、異常を検知した異常検知装置や異常を報知した異常報知装置の状態をも同時にモニタ画面に表示することについては記載がない。そのため、異常検知装置や異常報知装置自体に異常があったり異常の検出方法に誤りがあったりした場合には、作業者は正しく修正・修理を行なうことができないという問題がある。   However, in the above-mentioned Patent Document 1, it is described that when the apparatus detects an abnormality, the state of the abnormality target is displayed on the monitor screen. However, the abnormality detection apparatus that detects the abnormality or the abnormality notification apparatus that notifies the abnormality is described. There is no description about simultaneously displaying the above-mentioned state on the monitor screen. Therefore, there is a problem that the operator cannot correct / repair correctly when there is an abnormality in the abnormality detection device or the abnormality notification device itself or there is an error in the abnormality detection method.

本発明は係る従来の問題点に鑑みてなされたものであり、その目的は、電子部品装着装置がいずれかの作動部位で異常を検知したとき、異常対象部のみならず異常を検知した異常検知装置や異常を報知した異常報知装置の状態を確認して、より的確かつ迅速に異常状態に対応することができる電子部品装着装置を提供することである。   The present invention has been made in view of the conventional problems, and the purpose thereof is to detect not only an abnormality target part but also an abnormality when the electronic component mounting apparatus detects an abnormality in any of the operation parts. It is an object of the present invention to provide an electronic component mounting apparatus capable of confirming the state of an apparatus or an abnormality notification apparatus that has notified an abnormality and responding to the abnormal state more accurately and quickly.

上述した課題を解決するために、請求項1に係る発明の構成上の特徴は、電子部品を装着する基板を搬送して位置決めする基板搬送装置と、前記搬送された基板の位置決めされた位置を認識するマーク認識用カメラと、供給する電子部品が取り出される部品取出部を備えた部品供給装置と、前記部品供給装置の前記部品取出部で採取した電子部品を基板に装着する部品移載装置と、異常を生じた装置の任意の部位の異常を検知する異常検知装置と、前記異常検知装置により検知された異常を画像表示する画像表示装置と、を備えた電子部品装着装置において、前記マーク認識用カメラは、異常を検知した前記異常検知装置を撮像可能とするものであり、前記異常検知装置が異常を検知したとき、当該異常検知装置を前記マーク認識用カメラに撮像させ、撮像された画像を前記画像表示装置に表示させる制御装置を、備えることである。   In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that a substrate transfer device that transfers and positions a substrate on which an electronic component is mounted, and a position where the transferred substrate is positioned. A mark recognition camera for recognizing, a component supply device including a component take-out unit for taking out an electronic component to be supplied, and a component transfer device for mounting an electronic component collected by the component take-out unit of the component supply device onto a substrate In the electronic component mounting apparatus comprising: an abnormality detection device that detects an abnormality in an arbitrary part of the device in which an abnormality has occurred; and an image display device that displays an image of the abnormality detected by the abnormality detection device. The camera for camera enables imaging of the abnormality detection device that has detected an abnormality. When the abnormality detection device detects an abnormality, the abnormality detection device is used as the mark recognition camera. Is an image, a control unit for displaying the captured image to the image display device is to comprise.

請求項2に係る発明の構成上の特徴は、請求項1において、前記制御装置は、前記マーク認識用カメラに、異常を検知した前記異常検知装置に加え、前記異常検知装置が異常を検知した装置の異常部位を撮像させ、前記画像表示装置に、異常を検知した前記異常検知装置の撮像された画像とともに、前記異常検知装置が異常を検知した装置の前記異常部位の撮像された画像を表示させることである。   The structural feature of the invention according to claim 2 is that, in claim 1, the control device detects an abnormality in the mark recognition camera in addition to the abnormality detection device that detects an abnormality. An abnormal part of the apparatus is imaged, and an image of the abnormal part of the apparatus in which the abnormality detection apparatus has detected an abnormality is displayed on the image display device together with an image of the abnormality detection apparatus that has detected the abnormality It is to let you.

請求項3に係る発明の構成上の特徴は、請求項1又は2において、前記異常検知装置に対応して設けられ当該異常検知装置が異常を検知したことを報知する異常報知装置と、前記部品移載装置で交換して使用される複数種の吸着ノズルを保管する交換ノズル保管装置とを備え、前記異常検知装置は、前記交換ノズル保管装置に対応して設けられ、前記吸着ノズルの保管位置の異常を検知するものであり、前記制御装置は、前記異常検知装置が異常を検知したとき、前記マーク認識用カメラに、前記交換ノズル保管装置における異常とされた前記吸着ノズルと前記保管位置における異常を検知した異常検知装置とを撮像させるとともに、前記異常を報知した前記異常報知装置を撮像させ、これらの撮像された画像を前記画像表示装置に表示させることである。   The structural feature of the invention according to claim 3 is that in claim 1 or 2, the abnormality notification device provided corresponding to the abnormality detection device and notifying that the abnormality detection device has detected an abnormality, and the component A replacement nozzle storage device that stores a plurality of types of suction nozzles that are exchanged and used in the transfer device, and the abnormality detection device is provided corresponding to the replacement nozzle storage device, and the storage position of the suction nozzles When the abnormality detection device detects an abnormality, the control device detects the abnormality in the replacement nozzle storage device in the mark recognition camera and the suction nozzle in the storage position. The abnormality detection device that has detected the abnormality is imaged, the abnormality notification device that has notified the abnormality is imaged, and the captured images are displayed on the image display device. It is.

請求項4に係る発明の構成上の特徴は、請求項1又は2において、前記異常検知装置に対応して設けられ当該異常検知装置が異常を検知したことを報知する異常報知装置を備え、前記異常検知装置は、前記部品供給装置に対応して設けられ、部品供給される電子部品の前記部品取出部の異常を検知するものであり、前記制御装置は、前記異常検知装置が異常を検知したとき、前記マーク認識用カメラに、前記部品供給装置における異常とされた前記部品取出部と前記部品取出部の異常を検知した異常検知装置とを撮像させるとともに、前記異常を報知した前記異常報知装置を撮像させ、これらの撮像された画像を前記画像表示装置に表示させることである。   The structural feature of the invention according to claim 4 comprises the abnormality notification device according to claim 1 or 2 provided corresponding to the abnormality detection device and notifying that the abnormality detection device has detected an abnormality, The abnormality detection device is provided corresponding to the component supply device, and detects an abnormality in the component take-out portion of the electronic component supplied, and the control device detects the abnormality in the abnormality detection device. The mark recognizing camera is configured to cause the mark recognizing camera to capture an image of the component take-out unit that is abnormal in the component supply device and an abnormality detection device that detects an abnormality in the component take-out unit, and to notify the abnormality Is captured and these captured images are displayed on the image display device.

請求項1に係る発明によると、既存のマーク認識カメラを利用して、異常を検知した異常検知装置を撮像し、画像表示装置に撮像された画像を表示する。このように、異常検知装置の検知状態を画像によって把握することで、異常検知装置自体の異常や検知状態の異常を判断することができるので、異常が検知された装置が本当に異常状態であるか否かの判断を的確に行なうことが可能であり、異常状態への適切な対応を行うことができる。   According to the first aspect of the invention, the existing mark recognition camera is used to capture an image of the abnormality detection device that has detected an abnormality, and the captured image is displayed on the image display device. In this way, by grasping the detection state of the abnormality detection device from the image, it is possible to determine the abnormality of the abnormality detection device itself or the abnormality of the detection state, so whether the device in which the abnormality is detected is really in an abnormal state It is possible to accurately determine whether or not to respond appropriately to an abnormal state.

また、既存のマーク認識用カメラを使用して撮像するので、新たな設備コストを生ずることなく異常検知装置の検知状態を確認することができる。   In addition, since the image is picked up using the existing mark recognition camera, the detection state of the abnormality detection device can be confirmed without causing new equipment costs.

請求項2に係る発明によると、異常を検知した異常検知装置に加えて、異常を生じた装置の部位を撮像し、撮像された異常を検知した異常検知装置の画像と異常を生じた装置の部位の画像とを画像表示装置に同時に表示するので、異常状態のよりいっそうの的確な把握と迅速な対応を行うことができる。   According to the invention according to claim 2, in addition to the abnormality detection device that has detected the abnormality, the part of the device in which the abnormality has occurred is imaged, and the image of the abnormality detection device that has detected the abnormality and the device in which the abnormality has occurred Since the image of the part is displayed on the image display device at the same time, it is possible to more accurately grasp and quickly respond to the abnormal state.

請求項3に係る発明によると、制御装置は、異常検知装置が異常を検知したとき、マーク認識用カメラに、交換ノズル保管装置における異常とされた吸着ノズルと保管位置における異常を検知した異常検知装置とを撮像させるとともに、異常を報知した異常報知装置を撮像させ、これらの異常とされた吸着ノズル、異常を検知した異常検知装置及び異常を報知した異常報知装置の撮像された画像を画像表示装置に表示させるので、交換ノズル保管位置における異常を的確に把握して迅速に対応することができる。   According to the invention of claim 3, when the abnormality detection device detects an abnormality, the control device detects an abnormality in the mark recognition camera that is detected as an abnormality in the replacement nozzle storage device and an abnormality in the storage position. An image of the abnormality notification device that has notified the abnormality is imaged, and the captured image of the suction nozzle that has been determined to be abnormal, the abnormality detection device that has detected the abnormality, and the abnormality notification device that has notified the abnormality are displayed as an image. Since the information is displayed on the apparatus, it is possible to accurately grasp the abnormality at the replacement nozzle storage position and quickly cope with it.

請求項4に係る発明によると、制御装置は、異常検知装置が異常を検知したとき、マーク認識用カメラに、部品供給装置における異常とされた部品取出部と部品取出部の異常を検知した異常検知装置とともに、異常を報知する異常報知装置を撮像させ、これらの異常とされた部品取出部、部品取出部の異常を検知した異常検知装置及び異常を報知した異常報知装置の撮像された画像を画像表示装置に表示させるので、部品供給装置における部品取出部における異常を的確に把握して迅速に対応することができる。   According to the invention of claim 4, when the abnormality detection device detects an abnormality, the control device detects an abnormality in the component extraction unit and the component extraction unit detected as abnormal in the component supply device by the mark recognition camera. Along with the detection device, an abnormality notification device that notifies the abnormality is imaged, and the captured image of the component extraction unit that is abnormal, the abnormality detection device that detects the abnormality of the component extraction unit, and the abnormality notification device that notifies the abnormality is displayed. Since the image is displayed on the image display device, it is possible to accurately grasp the abnormality in the component take-out unit in the component supply device and quickly cope with it.

本実施形態に係る電子部品装着装置の概略を示す平面図。The top view which shows the outline of the electronic component mounting apparatus which concerns on this embodiment. 交換ノズル保管装置の概要を示す平面図。The top view which shows the outline | summary of an exchange nozzle storage apparatus. 交換ノズル保管装置の概要を示す側面図。The side view which shows the outline | summary of an exchange nozzle storage apparatus. 同時表示装置の表示例を示す図。The figure which shows the example of a display of a simultaneous display apparatus. 部品供給装置の概要を示す平面図。The top view which shows the outline | summary of a components supply apparatus. カセット式テープフィーダの概要を示す側面図。The side view which shows the outline | summary of a cassette type tape feeder. 同時表示装置の表示例を示す図。The figure which shows the example of a display of a simultaneous display apparatus. 異常を生じた装置の部位の側方からの画像を撮像する別例を示す図。The figure which shows another example which images the image from the side of the site | part of the apparatus which produced abnormality.

本発明に係る電子部品装着方法を実施する電子部品装着装置の実施形態を図面に基づいて以下に説明する。
電子部品装着装置2は、図1に示すように、基板3を搬入位置に搬入して所定の位置に位置決めする基板搬送装置4と、部品供給装置5と、基台6に対して水平方向であるX方向及びY方向に移動可能に支持された移動台8に設けられた装着ヘッド10を有する部品移載装置12及びマーク認識用カメラ14と、基台6に固定された部品認識用カメラ16と、交換ノズル保管装置17と、前記基板搬送装置4による基板3の搬送、前記部品移載装置12による装着及び前記マーク認識用カメラ14の移動・撮像を制御する制御装置18と、を備えている。
An embodiment of an electronic component mounting apparatus that implements an electronic component mounting method according to the present invention will be described below with reference to the drawings.
As shown in FIG. 1, the electronic component mounting apparatus 2 includes a substrate transfer device 4 that loads a substrate 3 into a loading position and positions the substrate 3 at a predetermined position, a component supply device 5, and a base 6 in a horizontal direction. A component transfer device 12 and a mark recognition camera 14 having a mounting head 10 provided on a movable table 8 supported so as to be movable in a certain X direction and Y direction, and a component recognition camera 16 fixed to the base 6. And a replacement nozzle storage device 17 and a control device 18 for controlling the transport of the substrate 3 by the substrate transport device 4, the mounting by the component transfer device 12, and the movement / imaging of the mark recognition camera 14. Yes.

基板搬送装置4は、いわゆるダブルコンベヤタイプで、各コンベヤは、X方向に延在するガイドレール20に沿って並設されて基板3を位置決めされた位置まで搬入する平行に設けられたコンベアベルト(図略)と、搬入された基板3を夫々支持する支持フレーム(図略)と、支持された基板3を実装される位置(所定の位置)まで上昇させる昇降装置(図略)と、実装される位置(装着位置)において基板3をクランプするクランプ装置(図略)とを夫々備えている。   The substrate transfer device 4 is a so-called double conveyor type, and each conveyor is provided in parallel along a guide rail 20 extending in the X direction and is provided in parallel with a conveyor belt (in parallel) for carrying the substrate 3 to a positioned position. (Not shown), a support frame (not shown) for supporting each of the loaded substrates 3, and a lifting device (not shown) for raising the supported substrates 3 to a mounting position (predetermined position). And a clamping device (not shown) for clamping the substrate 3 at each position (mounting position).

部品供給装置5は、前記基板搬送装置4の側部(図1において手前側)に設けられたスロットに後述する複数のカセット式フィーダ21を並設して構成したものである。カセット式フィーダ21は、図6に示すように、前記スロットに離脱可能に取り付けたケース部23と、ケース部23の後部に設けた供給リール25と、ケース部23の先端に設けた部品取出部27を備えている。部品取出部27の前方にはテープ押え蓋30が嵌着されている。供給リール25には電子部品が所定ピッチで封入された細長いテープ29が巻回保持され、このテープ29がスプロケット(図略)により所定ピッチで引き出され、電子部品が封入状態を解除されて部品取出部27に順次送り込まれる。カセット式フィーダ21にはコード(識別符号)が貼着され、このコードと電子部品のID・部品番号・封入数・部品重量等との対応データが、制御装置18にライン全体を管理するホストコンピュータ(図略)から伝送された装着プログラムデータに予め記録されている。   The component supply device 5 is configured by arranging a plurality of cassette-type feeders 21 to be described later in parallel in a slot provided in a side portion (front side in FIG. 1) of the substrate transfer device 4. As shown in FIG. 6, the cassette type feeder 21 includes a case part 23 detachably attached to the slot, a supply reel 25 provided at the rear part of the case part 23, and a component take-out part provided at the tip of the case part 23. 27. A tape presser cover 30 is fitted in front of the component takeout part 27. An elongated tape 29 in which electronic components are enclosed at a predetermined pitch is wound and held on the supply reel 25. The tape 29 is pulled out at a predetermined pitch by a sprocket (not shown), and the electronic component is released from the enclosed state and is taken out. Sequentially sent to the unit 27. A code (identification code) is affixed to the cassette-type feeder 21, and data corresponding to this code and the ID, part number, number of enclosures, part weight, etc. of the electronic parts is managed by the control device 18 to the host computer It is recorded in advance in the mounting program data transmitted from (not shown).

部品供給装置5のX方向の前後両側には異常検知装置としての一対の遮光センサ31が設けられ、遮光センサ31はカセット式フィーダ21の部品取出部27のすぐ上方を検査光線が横切るよう配置されている。遮光センサ31には異常を検出した時に点滅する異常報知装置としての表示灯32が設けられている。
基板搬送装置4の側部(図1における上部側)には部品トレイ33が配置され、部品トレイ33には大型の電子部品が収納されている。
A pair of light shielding sensors 31 as an abnormality detection device are provided on both front and rear sides in the X direction of the component supply device 5, and the light shielding sensors 31 are arranged so that the inspection beam crosses just above the component extraction portion 27 of the cassette type feeder 21. ing. The light shielding sensor 31 is provided with an indicator lamp 32 as an abnormality notification device that blinks when an abnormality is detected.
A component tray 33 is disposed on a side portion (upper side in FIG. 1) of the substrate transfer device 4, and a large electronic component is accommodated in the component tray 33.

基板搬送装置4の上方にはX方向移動ビーム22が設けられ、該X方向移動ビーム22はY方向に延在するとともに、前記基板搬送装置4に沿ってX方向に延在するX方向レール(図略)に沿って移動可能に設けられる。X方向移動ビーム22には、図1に示すように、移動台8がX方向移動ビーム22の側面に設けられたY方向レール(図略)にスライダ(図略)を介して移動可能に設けられている。該移動台8には装着ヘッド10を備えた部品移載装置12とマーク認識用カメラ14とが保持され、移動台8とともに移動可能になっている。X方向移動ビーム22はいずれも図略のボールねじ機構を介してサーボモータにより駆動され、移動台8は、図略のY方向移動用ボールねじ機構を介して図略のサーボモータにより駆動される。これらのサーボモータはその駆動を制御装置18によって制御されている。   An X-direction moving beam 22 is provided above the substrate transport device 4, and the X-direction moving beam 22 extends in the Y direction and extends in the X direction along the substrate transport device 4 ( It is provided so as to be movable along (not shown). As shown in FIG. 1, the moving table 8 is provided on the X direction moving beam 22 so as to be movable on a Y direction rail (not shown) provided on the side surface of the X direction moving beam 22 via a slider (not shown). It has been. The moving table 8 holds a component transfer device 12 having a mounting head 10 and a mark recognition camera 14, and can move together with the moving table 8. The X-direction moving beam 22 is driven by a servo motor via a ball screw mechanism (not shown), and the moving table 8 is driven by a servo motor (not shown) via a Y-direction moving ball screw mechanism (not shown). . The drive of these servo motors is controlled by the control device 18.

マーク認識用カメラ14の光軸はX方向及びY方向に直角なZ方向に平行になっている。マーク認識用カメラ14は、図2に示すように、矩形状の視野SAを有している。   The optical axis of the mark recognition camera 14 is parallel to the Z direction perpendicular to the X direction and the Y direction. As shown in FIG. 2, the mark recognition camera 14 has a rectangular field of view SA.

マーク認識用カメラ14により撮像された撮像画像は、図略のA/D変換機を備えた図略の画像認識装置に入力される。画像認識装置は、撮像された画像を取込んで、図略の参照マークからの情報を読み取る。そして、制御装置18に備えられた演算装置(図略)により参照マークの位置ずれを演算する。次にマーク認識用カメラ14が移動されるときには、この位置ずれを補正して移動する。   A captured image captured by the mark recognition camera 14 is input to an unillustrated image recognition apparatus including an unillustrated A / D converter. The image recognition apparatus captures a captured image and reads information from a reference mark (not shown). Then, the position deviation of the reference mark is calculated by a calculation device (not shown) provided in the control device 18. Next, when the mark recognition camera 14 is moved, the position deviation is corrected and moved.

また、マーク認識用カメラ14は、制御装置18により、交換ノズル保管装置17の上方及び供給リール25の部品取出部27の上方に位置決め可能となっている。   The mark recognition camera 14 can be positioned by the control device 18 above the replacement nozzle storage device 17 and above the component take-out portion 27 of the supply reel 25.

部品移載装置12は、前記前記移動台8と、移動台8によりX方向及びY方向と直角なZ方向に昇降可能に支持される装着ヘッド昇降装置(図略)と、装着ヘッド昇降装置に支持された装着ヘッド10とを備えている。装着ヘッド10には、一対の図略のノズルホルダが設けられ、各ノズルホルダは図略の軸受により夫々軸方向に回転可能に支承されている。また、ノズルホルダは図略のガイド部材により上下動可能に支承されている。各ノズルホルダは、図略のサーボモータで駆動されるノズルホルダ昇降装置(図略)によって夫々上下動駆動される。またノズルホルダは、図略の回転駆動機構及び回転駆動機構を駆動される図略のサーボモータにより、その中心軸回りに回転駆動される。   The component transfer device 12 includes the moving table 8, a mounting head lifting device (not shown) supported by the moving table 8 so as to be movable up and down in the Z direction perpendicular to the X direction and the Y direction, and the mounting head lifting device. The mounting head 10 is supported. The mounting head 10 is provided with a pair of nozzle holders (not shown), and each nozzle holder is supported by a bearing (not shown) so as to be rotatable in the axial direction. The nozzle holder is supported by a guide member (not shown) so as to be movable up and down. Each nozzle holder is vertically driven by a nozzle holder lifting device (not shown) driven by a servo motor (not shown). The nozzle holder is driven to rotate about its central axis by a rotation drive mechanism (not shown) and a servo motor (not shown) that drives the rotation drive mechanism.

ノズルホルダには夫々軸状の吸着ノズル28が嵌脱可能に嵌挿されている。吸着ノズル28の下端には、いずれも図略の負圧供給ポンプに連通する負圧流路の開口28aが設けられている。負圧流路と負圧供給ポンプの間には図略の電磁弁が設けられ、電磁弁により負圧流路に対する負圧供給ポンプからの負圧空気の連通及び遮断が可能になっている。電磁弁の作動は前記制御装置18によって制御される。吸着ノズル28の先端の開口28aは負圧空気が供給されることで電子部品等が吸着保持されるようになっている。   A shaft-like suction nozzle 28 is removably fitted in each nozzle holder. At the lower end of the suction nozzle 28, an opening 28a of a negative pressure channel that communicates with a negative pressure supply pump (not shown) is provided. An electromagnetic valve (not shown) is provided between the negative pressure channel and the negative pressure supply pump, and the electromagnetic valve can communicate and block negative pressure air from the negative pressure supply pump to the negative pressure channel. The operation of the solenoid valve is controlled by the control device 18. The opening 28a at the tip of the suction nozzle 28 is adapted to suck and hold electronic components and the like by supplying negative pressure air.

基板搬送装置4と部品供給装置5との間には、部品認識用カメラ16が設けられ、この部品認識用カメラ16によって前記吸着ノズル28に吸着された電子部品が撮像されて、生産される基板の種類に適合する種類の電子部品であるか、吸着状態が良いか、部品自体の不良箇所がないか等が判定される。   A component recognition camera 16 is provided between the substrate transfer device 4 and the component supply device 5, and the electronic component sucked by the suction nozzle 28 is imaged by the component recognition camera 16 to be produced. It is determined whether the electronic component is of a type suitable for the type, whether the suction state is good, and whether there is a defective portion of the component itself.

部品認識カメラ16の下流側には交換ノズル保管装置17が配設され、交換ノズル保管装置17は、例えば図2に示すように、長方形のプレート43よりなりプレート43の長手方向の一端面よりプレート43の長手方向に延在する中心線に向かって互いに平行に三条の掛止溝45が切欠き形成されている。これらの掛止溝45に吸着ノズル28の細管部が嵌入される。掛止溝45の奥部であってプレート43の中央部上面には円形の凹部47が形成され、凹部47に吸着ノズル28のフランジ部28bが嵌合するとともに掛止溝45の縁部でフランジ部28bが掛止されるようになっている。図2及び図3に示すように、プレート43の長手方向の両端上面には異常検知装置としての一対の遮光センサ49が設けられ、交換ノズル保管装置17の所定位置より吸着ノズル28が上方にずれて配置されると、検査光線を遮って異常が検知される。異常が検知されると遮光センサ49の上面に設けられた異常報知装置としての表示灯51が点滅するようになっている。   An exchange nozzle storage device 17 is disposed on the downstream side of the component recognition camera 16, and the exchange nozzle storage device 17 is formed of a rectangular plate 43, for example, as shown in FIG. Three retaining grooves 45 are cut out in parallel to each other toward a center line extending in the longitudinal direction of 43. The narrow tube portion of the suction nozzle 28 is fitted into these hooking grooves 45. A circular recess 47 is formed on the upper surface of the central portion of the plate 43 at the back of the latch groove 45, and the flange portion 28 b of the suction nozzle 28 is fitted into the recess 47 and the flange at the edge of the latch groove 45. The portion 28b is hooked. As shown in FIGS. 2 and 3, a pair of light shielding sensors 49 as an abnormality detection device are provided on both upper surfaces in the longitudinal direction of the plate 43, and the suction nozzle 28 is displaced upward from a predetermined position of the replacement nozzle storage device 17. If the sensor is placed, the anomaly is detected by blocking the inspection beam. When an abnormality is detected, an indicator lamp 51 serving as an abnormality notification device provided on the upper surface of the light shielding sensor 49 blinks.

電子部品装着装置2には、基板データ、部品データ等を入力するためのキーボード等の入力装置42が設けられている。入力装置42には画像表示装置44が併設され、画像表示装置44の画面には基板データ、部品データ、演算データやマーク認識用カメラ14等で撮像した画像が表示できるようになっている。なお、この画像表示装置44は、制御装置18に操作指示を入力する既存のディスプレイが流用されている。   The electronic component mounting apparatus 2 is provided with an input device 42 such as a keyboard for inputting board data, component data, and the like. The input device 42 is provided with an image display device 44. On the screen of the image display device 44, substrate data, component data, calculation data, an image captured by the mark recognition camera 14 and the like can be displayed. As the image display device 44, an existing display for inputting an operation instruction to the control device 18 is used.

画像表示装置44は、例えば交換ノズル保管装置17における異常が検知された場合、図4に示すように、左右2区分で異なった画像を同時に表示可能になっており、マーク認識用カメラ14で撮像された異常とされた吸着ノズル28の掛止位置の画像と、異常を検知した遮光センサ49と、遮光センサ49の表示灯51とが同時に表示される。   For example, when an abnormality is detected in the replacement nozzle storage device 17, the image display device 44 can simultaneously display different images in the left and right sections as shown in FIG. 4 and is captured by the mark recognition camera 14. The image of the position of the suction nozzle 28 that has been made abnormal, the light shielding sensor 49 that has detected the abnormality, and the indicator lamp 51 of the light shielding sensor 49 are displayed simultaneously.

また、部品供給装置5におけるカセット式フィーダ21における異常が検知された場合、図7に示すように、マーク認識用カメラ14で撮像された異常とされたカセット式フィーダ21における部品取出部27の画像と、異常を検知した遮光センサ31の表示灯32の画像とが、画像表示装置44に同時に表示される。   Further, when an abnormality is detected in the cassette type feeder 21 in the component supply device 5, as shown in FIG. 7, an image of the component take-out unit 27 in the cassette type feeder 21 determined to be abnormal and captured by the mark recognition camera 14. The image of the indicator lamp 32 of the light shielding sensor 31 that has detected the abnormality is displayed on the image display device 44 at the same time.

上記のように構成された電子部品装着装置2を使用して基板3に電子部品(図略)を装着することについて、図に基づいて以下に説明する。
まず、制御装置18は、前工程であるスクリーン印刷工程で半田が表面に印刷された基板3を電子部品装着装置2に搬送し、基板搬送装置4により所定搬送位置まで搬送する。所定搬送位置まで搬送された基板3は、図略の昇降装置により所定搬送位置より装着位置に上昇され、位置決めされて図略のクランプ装置によりクランプされる。
The mounting of an electronic component (not shown) on the substrate 3 using the electronic component mounting apparatus 2 configured as described above will be described below with reference to the drawings.
First, the control device 18 transports the board 3 on which the solder is printed in the screen printing process, which is a previous process, to the electronic component mounting apparatus 2 and transports the board 3 to a predetermined transport position. The substrate 3 transported to the predetermined transport position is raised from the predetermined transport position to the mounting position by a lifting device (not shown), positioned, and clamped by a clamping device (not shown).

位置決めされた基板3の対角線上のコーナーに設けられた一対の参照マーク(図略)にマーク認識用カメラ14を位置決めし、参照マークの位置座標を読み取る。これによって、予め制御装置18の記憶装置に記憶されている基板3の位置座標のデータとの対比において、基板3が基板搬送装置4によって位置決めされた位置の水平方向の位置ずれ(X方向、Y方向及び回転方向)を認識する。   The mark recognition camera 14 is positioned on a pair of reference marks (not shown) provided at the corners on the diagonal line of the substrate 3 that has been positioned, and the position coordinates of the reference marks are read. Thereby, in comparison with the position coordinate data of the substrate 3 stored in the storage device of the control device 18 in advance, the horizontal displacement (X direction, Y direction) of the position where the substrate 3 is positioned by the substrate transfer device 4. Direction and direction of rotation).

次に、制御装置18は、吸着ノズル28によりカセット式フィーダ21から電子部品を採取し、位置補正された位置座標に位置決め載置する。この際、いずれかのカセット式フィーダ21の部品取出部27において、例えばテープ押え蓋30がきちんと嵌められておらず、浮き上がっている等の異常を生じていた場合、遮光センサ31の検査光線が遮られることで、異常が検知される。検知された異常信号は制御装置18に伝送され、制御装置18は、X方向移動ビーム22と移動台8とを駆動させてマーク認識用カメラ14を移動させて、異常を生じたカセット式フィーダ21の部品取出部27の上方に位置決めし、該部品取出部27を撮像する。続いて、X方向移動ビーム22と移動台8とを駆動させてマーク認識用カメラ14を遮光センサ31の上方に位置決めし、マーク認識用カメラ14に遮光センサ31と表示灯32とを撮像させる。そして、異常部位であるテープ押え蓋30が浮き上がっている箇所の画像と、遮光センサ31の画像と、表示灯32の画像とを画像表示装置44において同時に表示する。この画像表示装置44の画像により、作業者は、異常状態と異常表示の正誤とを適切に把握し、例えば直ちに装置を停止して、テープ押え蓋30の組付けを正しく修正することができる。   Next, the control device 18 collects an electronic component from the cassette type feeder 21 by the suction nozzle 28 and positions and places the electronic component on the position coordinate whose position has been corrected. At this time, if an abnormality such as, for example, the tape presser cover 30 is not properly fitted and is raised in the component extraction portion 27 of any of the cassette type feeders 21, the inspection light beam from the light shielding sensor 31 is blocked. The abnormality is detected. The detected abnormal signal is transmitted to the control device 18, and the control device 18 drives the X-direction moving beam 22 and the moving table 8 to move the mark recognition camera 14, thereby causing the cassette type feeder 21 in which an abnormality has occurred. The component take-out part 27 is positioned above and the part take-out part 27 is imaged. Subsequently, the X-direction moving beam 22 and the moving table 8 are driven to position the mark recognition camera 14 above the light shielding sensor 31, and the mark recognition camera 14 images the light shielding sensor 31 and the indicator lamp 32. Then, the image display device 44 simultaneously displays an image of a portion where the tape presser lid 30, which is an abnormal portion, is lifted, an image of the light shielding sensor 31, and an image of the indicator lamp 32. From the image of the image display device 44, the operator can appropriately grasp the abnormal state and the correctness of the abnormal display, and can immediately stop the device, for example, and correct the assembly of the tape presser cover 30 correctly.

次に、吸着ノズル28の交換が必要な場合、制御装置18は部品移載装置12を交換ノズル保管装置17に移動させて吸着ノズル28を交換する。この際、制御装置18は、ノズルホルダに組み付けられていた吸着ノズル28を、離脱させて交換ノズル保管装置17の掛止溝45に吸着ノズル28のフランジ部28bを掛止させる。続いて、新たな吸着ノズル28をノズルホルダに組付け、装着ヘッド10を装着位置に移動する。   Next, when the suction nozzle 28 needs to be replaced, the control device 18 moves the component transfer device 12 to the replacement nozzle storage device 17 and replaces the suction nozzle 28. At this time, the control device 18 disengages the suction nozzle 28 assembled in the nozzle holder and hooks the flange portion 28b of the suction nozzle 28 in the hook groove 45 of the replacement nozzle storage device 17. Subsequently, a new suction nozzle 28 is assembled to the nozzle holder, and the mounting head 10 is moved to the mounting position.

前記掛止溝45に掛止された吸着ノズル28の掛止状態に異常があって、例えば吸着ノズル28が所定の位置より浮き上がっている場合には、遮光センサ49の検査光線を吸着ノズル28が遮断する。これによって、異常検知信号が制御装置18に発信され、制御装置18はX方向移動ビーム22と移動台8とを駆動させてマーク認識用カメラ14を移動させて、異常を生じた交換ノズル保管装置17の吸着ノズル28の上方に位置決めし、該吸着ノズル28を撮像する。続いて、制御装置18は、X方向移動ビーム22と移動台8とを駆動させてマーク認識用カメラ14を遮光センサ49の上方に位置決めし、マーク認識用カメラ14に遮光センサ49と表示灯51とを撮像させる。異常とされた装置の部位である吸着ノズル28が浮き上がっている画像と、遮光センサ49の画像と表示灯51の画像とを画像表示装置44において同時に表示する。この画像表示装置44の画像により、作業者は、異常状態と異常表示の正誤とを適切に把握し、例えば直ちに装置を停止して、吸着ノズル28の掛止を正しく修正する。   If there is an abnormality in the hooking state of the suction nozzle 28 hooked in the hooking groove 45 and the suction nozzle 28 is lifted from a predetermined position, for example, the suction nozzle 28 receives the inspection light from the light shielding sensor 49. Cut off. As a result, an abnormality detection signal is transmitted to the control device 18, and the control device 18 drives the X-direction moving beam 22 and the moving table 8 to move the mark recognition camera 14, thereby causing an abnormality in the replacement nozzle storage device. It positions above 17 suction nozzles 28 and images the suction nozzles 28. Subsequently, the control device 18 drives the X-direction moving beam 22 and the moving table 8 to position the mark recognition camera 14 above the light shielding sensor 49, and the mark recognition camera 14 has the light shielding sensor 49 and the indicator lamp 51. And image. The image display device 44 simultaneously displays an image in which the suction nozzle 28, which is a part of the device that has been abnormal, is floating, an image of the light shielding sensor 49, and an image of the indicator lamp 51. From the image of the image display device 44, the operator appropriately grasps the abnormal state and the correctness of the abnormal display, and immediately stops the device, for example, and corrects the hooking of the suction nozzle 28 correctly.

そして、制御装置18は、交換された吸着ノズル28が装着された部品移載装置12を駆動させることで電子部品を装着位置に位置決めされた基板3に装着する。
次に、制御装置18は、電子部品が装着された基板3をアンクランプして昇降装置で装着位置から搬送位置に降下させることで基板搬送装置4に受渡す。
次に、制御装置18は、基板搬送装置4を駆動させて電子部品が装着された基板3を次工程に払い出す。
And the control apparatus 18 mounts an electronic component on the board | substrate 3 positioned by the mounting position by driving the component transfer apparatus 12 with which the replaced suction nozzle 28 was mounted | worn.
Next, the control device 18 unclamps the substrate 3 on which the electronic component is mounted, and lowers the substrate 3 from the mounting position to the transfer position by the lifting device, and transfers the substrate 3 to the substrate transfer device 4.
Next, the control apparatus 18 drives the board | substrate conveyance apparatus 4, and pays out the board | substrate 3 with which the electronic component was mounted to the following process.

上記のように構成された電子部品装着装置2によると、既存のマーク認識カメラ14を利用して、異常を検知した遮光センサ31,49を撮像し、画像表示装置44に撮像された画像を表示する。このように、遮光センサ31,49の検知状態を画像によって把握することで、遮光センサ31,49自体の異常や検知状態の異常を判断することができるので、異常が検知された装置が本当に異常状態であるか否かの判断を的確に行なうことが可能であり、異常状態への適切な対応を行うことができる。   According to the electronic component mounting apparatus 2 configured as described above, the existing mark recognition camera 14 is used to capture the light shielding sensors 31 and 49 that have detected an abnormality, and the captured image is displayed on the image display device 44. To do. As described above, by grasping the detection state of the light shielding sensors 31 and 49 by the image, it is possible to determine the abnormality of the light shielding sensors 31 and 49 itself or the abnormality of the detection state. It is possible to accurately determine whether or not it is a state, and it is possible to appropriately cope with an abnormal state.

また、既存のマーク認識用カメラ14を使用して撮像するので、新たな設備コストを生ずることなく異常検知装置の検知状態を確認することができる。   In addition, since imaging is performed using the existing mark recognition camera 14, the detection state of the abnormality detection device can be confirmed without causing new equipment costs.

また、異常を検知した遮光センサ31,49に加えて、異常を生じた装置の部位(部品取出部)27,(吸着ノズル)28を撮像し、撮像されたそれらの画像を画像表示装置44に同時に表示するので、異常状態のよりいっそうの的確な把握と迅速な対応を行うことができる。   Further, in addition to the light-shielding sensors 31 and 49 that have detected the abnormality, the parts (component extraction unit) 27 and (suction nozzle) 28 of the apparatus in which the abnormality has occurred are imaged, and these captured images are displayed on the image display device 44. Since they are displayed at the same time, it is possible to more accurately grasp an abnormal state and to respond quickly.

また、制御装置18は、遮光センサ49が異常を検知したとき、マーク認識用カメラ14に、交換ノズル保管装置17における異常とされた吸着ノズル28と保管位置における異常を検知した遮光センサ49とを撮像させるとともに、異常を報知した表示灯51を撮像させ、これらの異常とされた吸着ノズル28、異常を検知した遮光センサ49及び異常を報知した表示灯51の撮像された画像を画像表示装置44に表示させるので、交換ノズル保管位置における異常を的確に把握して迅速に対応することができる。   In addition, when the light shielding sensor 49 detects an abnormality, the control device 18 provides the mark recognition camera 14 with the suction nozzle 28 that is abnormal in the replacement nozzle storage device 17 and the light shielding sensor 49 that detects an abnormality in the storage position. The display lamp 51 that has been informed of an abnormality is imaged, and the picked-up nozzle 28 that has been made abnormal, the light-shielding sensor 49 that has detected the abnormality, and the captured image of the display lamp 51 that has been notified of the abnormality are image display devices 44. Therefore, the abnormality at the replacement nozzle storage position can be accurately grasped and promptly dealt with.

また、制御装置18は、遮光センサ31が異常を検知したとき、マーク認識用カメラ14に、部品供給装置5における異常とされた部品取出部27と部品取出部27の異常を検知した遮光センサ31とともに、異常を報知する表示灯32を撮像させ、これらの異常とされた部品取出部27、部品取出部27の異常を検知した遮光センサ31及び異常を報知した表示灯32の撮像された画像を画像表示装置44に表示させるので、部品供給装置5における部品取出部27における異常を的確に把握して迅速に対応することができる。   Further, when the light shielding sensor 31 detects an abnormality, the control device 18 causes the mark recognition camera 14 to detect the abnormality of the component extraction unit 27 and the component extraction unit 27 that are abnormal in the component supply device 5. At the same time, the display lamp 32 that notifies the abnormality is imaged, and the captured image of the component extraction unit 27 that is abnormal, the light shielding sensor 31 that detects the abnormality of the component extraction unit 27, and the display lamp 32 that notifies the abnormality is displayed. Since the image is displayed on the image display device 44, it is possible to accurately grasp the abnormality in the component take-out unit 27 in the component supply device 5 and quickly cope with it.

なお、上記実施形態において、マーク認識用カメラによって異常とされた装置の部位を上方から撮像するものとしたが、これに限定されず、例えば、図8に示すように、例えばプリズム52や鏡を利用して、異常とされた部位の側面や装置の側方に配置された異常検知装置や表示灯を撮像する構成にしてもよい。側面等から撮像することで、異常状態を生じている部位の状態や異常検知装置の検知状態をより正確に把握することができる。   In the above-described embodiment, the part of the apparatus that is abnormal by the mark recognition camera is imaged from above. However, the present invention is not limited to this. For example, as shown in FIG. It may be configured to take an image of an abnormality detection device or an indicator lamp that is arranged on the side surface of an abnormal portion or the side of the device. By capturing an image from the side or the like, it is possible to more accurately grasp the state of the part causing the abnormal state and the detection state of the abnormality detection device.

また、異常検知装置として、遮光センサ31,49を使用したが、これに限定されず、例えば、画像を電気信号に変換する画像センサや所定位置から外れた場合に接触感知する接触センサなどの既知の技術を使用してもよい。   Further, although the light shielding sensors 31 and 49 are used as the abnormality detection device, the present invention is not limited to this. For example, an image sensor that converts an image into an electrical signal or a contact sensor that senses contact when the image is out of a predetermined position is known. The technique may be used.

また、異常報知装置として、異常時に点滅する表示灯32,51としたが、これに限定されず、例えば、異常時にサイレンなどの音を生じるもの、異常時に動きを生じて作業者の視認性を高めるものでもよい。   In addition, as the abnormality notification device, the indicator lamps 32 and 51 blinking at the time of abnormality are not limited to this. You may raise it.

また、画像表示装置に異常を生じている部位とともに、異常検知装置と異常報知装置とを画像表示するものとしたが、これに限定されず、例えば、異常を生じている部位と異常検知装置とを画像表示するものでもよい。   In addition, the abnormality detection device and the abnormality notification device are displayed together with the portion where the abnormality has occurred in the image display device. However, the present invention is not limited to this. For example, the portion where the abnormality has occurred and the abnormality detection device May be displayed as an image.

斯様に、上記した実施の形態で述べた具体的構成は、本発明の一例を示したものにすぎず、本発明はそのような具体的構成に限定されることなく、本発明の主旨を逸脱しない範囲で種々の態様を採り得るものである。   Thus, the specific configuration described in the above-described embodiment is merely an example of the present invention, and the present invention is not limited to such a specific configuration. Various embodiments can be adopted without departing from the scope.

2…電子部品装着装置、3…基板、4…基板搬送装置、5…部品供給装置、12…部品移載装置、14…マーク認識用カメラ、17…交換ノズル保管装置、18…制御装置、27…部品取出部、28…吸着ノズル、31…異常検知装置(遮光センサ)、32…異常報知装置(表示灯)、44…画像表示装置、49…異常検知装置(遮光センサ)、51…異常報知装置(表示灯)。 DESCRIPTION OF SYMBOLS 2 ... Electronic component mounting apparatus, 3 ... Board | substrate, 4 ... Board | substrate conveyance apparatus, 5 ... Component supply apparatus, 12 ... Component transfer apparatus, 14 ... Mark recognition camera, 17 ... Replacement nozzle storage apparatus, 18 ... Control apparatus, 27 DESCRIPTION OF CHARACTERISTICS EQUIPMENT COMPONENT EXPORTING UNIT 28 ... SUCTION NOZZLE 31 ... ABNORMALITY DETECTING DEVICE (light shielding sensor) 32 ... ABNORMAL INFORMATION DEVICE (Indicator) 44 Device (indicator light).

Claims (4)

電子部品を装着する基板を搬送して位置決めする基板搬送装置と、
前記搬送された基板の位置決めされた位置を認識するマーク認識用カメラと、
供給する電子部品が取り出される部品取出部を備えた部品供給装置と、
前記部品供給装置の前記部品取出部で採取した電子部品を基板に装着する部品移載装置と、
異常を生じた装置の任意の部位の異常を検知する異常検知装置と、
前記異常検知装置により検知された異常を画像表示する画像表示装置と、
を備えた電子部品装着装置において、
前記マーク認識用カメラは、異常を検知した前記異常検知装置を撮像可能とするものであり、
前記異常検知装置が異常を検知したとき、当該異常検知装置を前記マーク認識用カメラに撮像させ、撮像された画像を前記画像表示装置に表示させる制御装置を、備えることを特徴とする電子部品装着装置。
A board transfer device for transferring and positioning a board on which an electronic component is mounted;
A mark recognition camera for recognizing a positioned position of the conveyed substrate;
A component supply device having a component take-out unit for taking out electronic components to be supplied;
A component transfer device for mounting an electronic component collected by the component extraction unit of the component supply device on a substrate;
An anomaly detection device for detecting an anomaly in any part of the device that has caused an anomaly
An image display device for displaying an image of the abnormality detected by the abnormality detection device;
In an electronic component mounting apparatus comprising:
The mark recognition camera is capable of imaging the abnormality detection device that has detected an abnormality,
An electronic component mounting comprising: a control device for causing the mark recognition camera to capture an image of the abnormality detection device and displaying the captured image on the image display device when the abnormality detection device detects an abnormality. apparatus.
請求項1において、前記制御装置は、
前記マーク認識用カメラに、異常を検知した前記異常検知装置に加え、前記異常検知装置が異常を検知した装置の異常部位を撮像させ、
前記画像表示装置に、異常を検知した前記異常検知装置の撮像された画像とともに、前記異常検知装置が異常を検知した装置の前記異常部位の撮像された画像を表示させることを特徴とする電子部品装着装置。
The control device according to claim 1, wherein:
In addition to the abnormality detection device that has detected an abnormality, the mark recognition camera causes the abnormality detection device to image an abnormal part of the device that has detected the abnormality,
An electronic component that causes the image display device to display a captured image of the abnormal part of the device in which the abnormality detection device has detected an abnormality together with a captured image of the abnormality detection device in which the abnormality has been detected. Mounting device.
請求項1又は2において、前記異常検知装置に対応して設けられ当該異常検知装置が異常を検知したことを報知する異常報知装置と、
前記部品移載装置で交換して使用される複数種の吸着ノズルを保管する交換ノズル保管装置とを備え、
前記異常検知装置は、前記交換ノズル保管装置に対応して設けられ、前記吸着ノズルの保管位置の異常を検知するものであり、
前記制御装置は、前記異常検知装置が異常を検知したとき、前記マーク認識用カメラに、前記交換ノズル保管装置における異常とされた前記吸着ノズルと前記保管位置における異常を検知した異常検知装置とを撮像させるとともに、前記異常を報知した前記異常報知装置を撮像させ、これらの撮像された画像を前記画像表示装置に表示させることを特徴とする電子部品装着装置。
The abnormality notification device according to claim 1 or 2, wherein the abnormality notification device is provided corresponding to the abnormality detection device and notifies that the abnormality detection device detects an abnormality.
An exchange nozzle storage device for storing a plurality of types of adsorption nozzles used by exchanging in the component transfer device;
The abnormality detection device is provided corresponding to the replacement nozzle storage device, and detects an abnormality in the storage position of the suction nozzle,
When the abnormality detection device detects an abnormality, the control device includes, on the mark recognition camera, the suction nozzle that is abnormal in the replacement nozzle storage device and an abnormality detection device that detects an abnormality in the storage position. An electronic component mounting apparatus characterized in that the abnormality notification device that has notified the abnormality is imaged and the captured images are displayed on the image display device.
請求項1又は2において、前記異常検知装置に対応して設けられ当該異常検知装置が異常を検知したことを報知する異常報知装置を備え、
前記異常検知装置は、前記部品供給装置に対応して設けられ、部品供給される電子部品の前記部品取出部の異常を検知するものであり、
前記制御装置は、前記異常検知装置が異常を検知したとき、前記マーク認識用カメラに、前記部品供給装置における異常とされた前記部品取出部と前記部品取出部の異常を検知した異常検知装置とを撮像させるとともに、前記異常を報知した前記異常報知装置を撮像させ、これらの撮像された画像を前記画像表示装置に表示させることを特徴とする電子部品装着装置。
In Claim 1 or 2, comprising an abnormality notification device provided corresponding to the abnormality detection device for notifying that the abnormality detection device has detected an abnormality,
The abnormality detection device is provided corresponding to the component supply device, and detects an abnormality of the component take-out portion of an electronic component to be supplied with a component,
When the abnormality detection device detects an abnormality, the control device detects an abnormality in the component extraction unit and the component extraction unit detected as abnormal in the component supply device, and detects an abnormality in the mark recognition camera; An electronic component mounting apparatus characterized by causing the abnormality notification device that has notified the abnormality to be imaged and displaying the captured images on the image display device.
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