JP2013000809A5 - - Google Patents
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- JP2013000809A5 JP2013000809A5 JP2011131587A JP2011131587A JP2013000809A5 JP 2013000809 A5 JP2013000809 A5 JP 2013000809A5 JP 2011131587 A JP2011131587 A JP 2011131587A JP 2011131587 A JP2011131587 A JP 2011131587A JP 2013000809 A5 JP2013000809 A5 JP 2013000809A5
- Authority
- JP
- Japan
- Prior art keywords
- monomer
- transition temperature
- glass transition
- homopolymer
- gives
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (3)
前記粘着剤層は、第一のモノマー58〜85質量%、第二のモノマー2〜7質量%及び第三のモノマー10〜40質量%を含むモノマーの重合体を含有し、
前記第一のモノマーは、ガラス転移温度が0℃以下のホモポリマーを与える、炭素数8〜18のアルキル基を有する(メタ)アクリル酸エステルであり、
前記第二のモノマーは、ガラス転移温度が50℃以上のホモポリマーを与える、極性モノマーであり、
前記第三のモノマーは、ガラス転移温度が10℃以上のホモポリマーを与える、炭素数4〜18のアルキル基又は炭素数7〜18のアラルキル基を有する(メタ)アクリル酸エステルである、研磨用構造体。 A polishing structure comprising a support, an abrasive, and a pressure-sensitive adhesive layer for joining them,
The pressure-sensitive adhesive layer contains a polymer of monomers including a first monomer 58 to 85% by mass, a second monomer 2 to 7% by mass, and a third monomer 10 to 40% by mass,
The first monomer is a (meth) acrylic acid ester having an alkyl group having 8 to 18 carbon atoms that gives a homopolymer having a glass transition temperature of 0 ° C. or lower.
The second monomer is a polar monomer that gives a homopolymer having a glass transition temperature of 50 ° C. or higher,
The third monomer is a (meth) acrylic acid ester having an alkyl group having 4 to 18 carbon atoms or an aralkyl group having 7 to 18 carbon atoms, which gives a homopolymer having a glass transition temperature of 10 ° C. or higher. Structure.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011131587A JP5851124B2 (en) | 2011-06-13 | 2011-06-13 | Polishing structure |
CN201280028637.0A CN103596729B (en) | 2011-06-13 | 2012-06-08 | Structural member for polishing |
PCT/US2012/041535 WO2012173885A2 (en) | 2011-06-13 | 2012-06-08 | Structural member for polishing |
KR1020147000358A KR20140051212A (en) | 2011-06-13 | 2012-06-08 | Structural member for polishing |
TW101121028A TW201307504A (en) | 2011-06-13 | 2012-06-13 | Structural member for polishing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011131587A JP5851124B2 (en) | 2011-06-13 | 2011-06-13 | Polishing structure |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013000809A JP2013000809A (en) | 2013-01-07 |
JP2013000809A5 true JP2013000809A5 (en) | 2014-07-31 |
JP5851124B2 JP5851124B2 (en) | 2016-02-03 |
Family
ID=47357676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011131587A Expired - Fee Related JP5851124B2 (en) | 2011-06-13 | 2011-06-13 | Polishing structure |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5851124B2 (en) |
KR (1) | KR20140051212A (en) |
CN (1) | CN103596729B (en) |
TW (1) | TW201307504A (en) |
WO (1) | WO2012173885A2 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106376234B (en) | 2014-05-02 | 2019-11-05 | 3M创新有限公司 | Intermittent structured abrasive article and the method for polishing workpiece |
WO2016006476A1 (en) * | 2014-07-07 | 2016-01-14 | バンドー化学株式会社 | Polishing film |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
KR102436416B1 (en) | 2014-10-17 | 2022-08-26 | 어플라이드 머티어리얼스, 인코포레이티드 | Cmp pad construction with composite material properties using additive manufacturing processes |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
JP6976048B2 (en) * | 2015-11-30 | 2021-12-01 | 日東電工株式会社 | Adhesive sheet for fixing polishing pads |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
CN112654655A (en) | 2018-09-04 | 2021-04-13 | 应用材料公司 | Advanced polishing pad formulations |
KR102345784B1 (en) * | 2019-07-10 | 2022-01-03 | 에프엔에스테크 주식회사 | High-hardness polishing pad for polishing the backside of wafer |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
CN112171532A (en) * | 2020-08-26 | 2021-01-05 | 南京航空航天大学 | Elastic milling and polishing tool for free-form surface machining and manufacturing method thereof |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02220838A (en) * | 1989-02-22 | 1990-09-04 | Rodeele Nitta Kk | Laminate and support material of member to be polished and polishing cloth used therewith |
US5441549A (en) * | 1993-04-19 | 1995-08-15 | Minnesota Mining And Manufacturing Company | Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder |
JP3354744B2 (en) * | 1995-04-25 | 2002-12-09 | ニッタ株式会社 | Polishing cloth and method for attaching and detaching the polishing cloth to and from a polishing machine surface plate |
WO1998039142A1 (en) * | 1997-03-07 | 1998-09-11 | Minnesota Mining And Manufacturing Company | Abrasive article for providing a clear surface finish on glass |
US6077601A (en) * | 1998-05-01 | 2000-06-20 | 3M Innovative Properties Company | Coated abrasive article |
JP2000077366A (en) * | 1998-08-28 | 2000-03-14 | Nitta Ind Corp | Polishing cloth and method for attaching/detaching polishing cloth to/from turn table of polishing machine |
JP2000071170A (en) * | 1998-08-28 | 2000-03-07 | Nitta Ind Corp | Polished-wafer holding member, and method of attaching and detaching same to and from surface plate of polishing machine |
EP1212171A1 (en) * | 1999-12-23 | 2002-06-12 | Rodel Holdings, Inc. | Self-leveling pads and methods relating thereto |
US6706383B1 (en) * | 2001-11-27 | 2004-03-16 | Psiloquest, Inc. | Polishing pad support that improves polishing performance and longevity |
US7169199B2 (en) * | 2002-11-25 | 2007-01-30 | 3M Innovative Properties Company | Curable emulsions and abrasive articles therefrom |
JP4351007B2 (en) * | 2003-09-08 | 2009-10-28 | 東洋ゴム工業株式会社 | Polishing pad |
JP4898172B2 (en) * | 2005-09-08 | 2012-03-14 | 日本ミクロコーティング株式会社 | Polishing pad, method for producing the same, and polishing method |
JP2007138015A (en) * | 2005-11-18 | 2007-06-07 | Toyo Ink Mfg Co Ltd | Adhesive and adhesive sheet using the same |
JP5702912B2 (en) * | 2008-11-21 | 2015-04-15 | 積水化学工業株式会社 | Double-sided adhesive tape for fixing adhesive and abrasive cloth |
JP5656379B2 (en) * | 2009-03-03 | 2015-01-21 | 日立マクセル株式会社 | Dicing adhesive film and method for manufacturing semiconductor element |
JP2011044461A (en) * | 2009-08-19 | 2011-03-03 | Nitta Corp | Adhesive tape for laser dicing |
JP2011074308A (en) * | 2009-10-01 | 2011-04-14 | Three M Innovative Properties Co | Transparent adhesive sheet and image display device including the same |
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2011
- 2011-06-13 JP JP2011131587A patent/JP5851124B2/en not_active Expired - Fee Related
-
2012
- 2012-06-08 KR KR1020147000358A patent/KR20140051212A/en not_active Application Discontinuation
- 2012-06-08 WO PCT/US2012/041535 patent/WO2012173885A2/en active Application Filing
- 2012-06-08 CN CN201280028637.0A patent/CN103596729B/en not_active Expired - Fee Related
- 2012-06-13 TW TW101121028A patent/TW201307504A/en unknown