JP2013000809A5 - - Google Patents
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- Publication number
- JP2013000809A5 JP2013000809A5 JP2011131587A JP2011131587A JP2013000809A5 JP 2013000809 A5 JP2013000809 A5 JP 2013000809A5 JP 2011131587 A JP2011131587 A JP 2011131587A JP 2011131587 A JP2011131587 A JP 2011131587A JP 2013000809 A5 JP2013000809 A5 JP 2013000809A5
- Authority
- JP
- Japan
- Prior art keywords
- monomer
- transition temperature
- glass transition
- homopolymer
- gives
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000178 monomer Substances 0.000 claims 8
- 230000009477 glass transition Effects 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 229920001519 homopolymer Polymers 0.000 claims 3
- 238000005498 polishing Methods 0.000 claims 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000006061 abrasive grain Substances 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011131587A JP5851124B2 (ja) | 2011-06-13 | 2011-06-13 | 研磨用構造体 |
| KR1020147000358A KR20140051212A (ko) | 2011-06-13 | 2012-06-08 | 폴리싱용 구조 부재 |
| CN201280028637.0A CN103596729B (zh) | 2011-06-13 | 2012-06-08 | 用于抛光的结构构件 |
| PCT/US2012/041535 WO2012173885A2 (en) | 2011-06-13 | 2012-06-08 | Structural member for polishing |
| TW101121028A TW201307504A (zh) | 2011-06-13 | 2012-06-13 | 用於拋光之結構元件 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011131587A JP5851124B2 (ja) | 2011-06-13 | 2011-06-13 | 研磨用構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013000809A JP2013000809A (ja) | 2013-01-07 |
| JP2013000809A5 true JP2013000809A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2014-07-31 |
| JP5851124B2 JP5851124B2 (ja) | 2016-02-03 |
Family
ID=47357676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011131587A Expired - Fee Related JP5851124B2 (ja) | 2011-06-13 | 2011-06-13 | 研磨用構造体 |
Country Status (5)
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106376234B (zh) | 2014-05-02 | 2019-11-05 | 3M创新有限公司 | 间断的结构化磨料制品以及抛光工件的方法 |
| US10543582B2 (en) * | 2014-07-07 | 2020-01-28 | Bando Chemical Industries, Ltd. | Abrasive film |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| KR20240015167A (ko) | 2014-10-17 | 2024-02-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성 |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| WO2017074773A1 (en) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | An apparatus and method of forming a polishing article that has a desired zeta potential |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| JP6976048B2 (ja) * | 2015-11-30 | 2021-12-01 | 日東電工株式会社 | 研磨パッド固定用粘着シート |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| KR102345784B1 (ko) * | 2019-07-10 | 2022-01-03 | 에프엔에스테크 주식회사 | 웨이퍼 후면 연마용 고경도 연마패드 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| CN112171532A (zh) * | 2020-08-26 | 2021-01-05 | 南京航空航天大学 | 一种自由曲面加工用弹性铣抛工具及其制造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02220838A (ja) * | 1989-02-22 | 1990-09-04 | Rodeele Nitta Kk | 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布 |
| US5441549A (en) * | 1993-04-19 | 1995-08-15 | Minnesota Mining And Manufacturing Company | Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder |
| JP3354744B2 (ja) * | 1995-04-25 | 2002-12-09 | ニッタ株式会社 | 研磨布及びその研磨布の研磨機定盤への脱着方法 |
| CA2281921A1 (en) * | 1997-03-07 | 1998-09-11 | Minnesota Mining And Manufacturing Company | Abrasive article for providing a clear surface finish on glass |
| US6077601A (en) * | 1998-05-01 | 2000-06-20 | 3M Innovative Properties Company | Coated abrasive article |
| JP2000071170A (ja) * | 1998-08-28 | 2000-03-07 | Nitta Ind Corp | 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法 |
| JP2000077366A (ja) * | 1998-08-28 | 2000-03-14 | Nitta Ind Corp | 研磨布及びその研磨布の研磨機定盤への脱着方法 |
| EP1212171A1 (en) * | 1999-12-23 | 2002-06-12 | Rodel Holdings, Inc. | Self-leveling pads and methods relating thereto |
| US6706383B1 (en) * | 2001-11-27 | 2004-03-16 | Psiloquest, Inc. | Polishing pad support that improves polishing performance and longevity |
| US7169199B2 (en) * | 2002-11-25 | 2007-01-30 | 3M Innovative Properties Company | Curable emulsions and abrasive articles therefrom |
| JP4351007B2 (ja) * | 2003-09-08 | 2009-10-28 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4898172B2 (ja) * | 2005-09-08 | 2012-03-14 | 日本ミクロコーティング株式会社 | 研磨パッド及びその製造方法並びに研磨方法 |
| JP2007138015A (ja) * | 2005-11-18 | 2007-06-07 | Toyo Ink Mfg Co Ltd | 粘着剤及びそれを用いた粘着シート |
| JP5702912B2 (ja) * | 2008-11-21 | 2015-04-15 | 積水化学工業株式会社 | 粘着剤及び研磨布固定用両面粘着テープ |
| JP5656379B2 (ja) * | 2009-03-03 | 2015-01-21 | 日立マクセル株式会社 | ダイシング用粘着フィルム、及び半導体素子の製造方法 |
| JP2011044461A (ja) * | 2009-08-19 | 2011-03-03 | Nitta Corp | レーザーダイシング用粘着テープ |
| JP2011074308A (ja) * | 2009-10-01 | 2011-04-14 | Three M Innovative Properties Co | 透明粘着シート及びそれを含む画像表示装置 |
-
2011
- 2011-06-13 JP JP2011131587A patent/JP5851124B2/ja not_active Expired - Fee Related
-
2012
- 2012-06-08 CN CN201280028637.0A patent/CN103596729B/zh not_active Expired - Fee Related
- 2012-06-08 KR KR1020147000358A patent/KR20140051212A/ko not_active Withdrawn
- 2012-06-08 WO PCT/US2012/041535 patent/WO2012173885A2/en active Application Filing
- 2012-06-13 TW TW101121028A patent/TW201307504A/zh unknown