JP2012516056A5 - - Google Patents
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- Publication number
- JP2012516056A5 JP2012516056A5 JP2011548081A JP2011548081A JP2012516056A5 JP 2012516056 A5 JP2012516056 A5 JP 2012516056A5 JP 2011548081 A JP2011548081 A JP 2011548081A JP 2011548081 A JP2011548081 A JP 2011548081A JP 2012516056 A5 JP2012516056 A5 JP 2012516056A5
- Authority
- JP
- Japan
- Prior art keywords
- openings
- slurry
- sidewall
- flowing
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002002 slurry Substances 0.000 claims 1
Claims (1)
- ガスが貫通して流れるように適合された1以上の開口を有するガス配気装置を提供するステップと、
前記1以上の開口を通してスラリーを流し、これによって前記1以上の開口の側壁から損傷面を除去するステップとを含む半導体プロセスチャンバ用ガス配気装置を製造する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/356,687 | 2009-01-21 | ||
US12/356,687 US20100180426A1 (en) | 2009-01-21 | 2009-01-21 | Particle reduction treatment for gas delivery system |
PCT/US2010/021557 WO2010090846A2 (en) | 2009-01-21 | 2010-01-21 | Particle reduction treatment for gas delivery system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012516056A JP2012516056A (ja) | 2012-07-12 |
JP2012516056A5 true JP2012516056A5 (ja) | 2013-03-07 |
Family
ID=42335784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011548081A Pending JP2012516056A (ja) | 2009-01-21 | 2010-01-21 | ガス配送システム用粒子削減処理 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100180426A1 (ja) |
JP (1) | JP2012516056A (ja) |
KR (1) | KR20110115137A (ja) |
CN (1) | CN102293062A (ja) |
TW (1) | TW201034049A (ja) |
WO (1) | WO2010090846A2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10559451B2 (en) * | 2017-02-15 | 2020-02-11 | Applied Materials, Inc. | Apparatus with concentric pumping for multiple pressure regimes |
US11380557B2 (en) | 2017-06-05 | 2022-07-05 | Applied Materials, Inc. | Apparatus and method for gas delivery in semiconductor process chambers |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3506885A (en) * | 1965-07-12 | 1970-04-14 | Brunswick Corp | Electric device having passage structure electrode |
US4680897A (en) * | 1985-12-03 | 1987-07-21 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method for machining holes in composite materials |
US5074456A (en) * | 1990-09-18 | 1991-12-24 | Lam Research Corporation | Composite electrode for plasma processes |
JPH11104950A (ja) * | 1997-10-03 | 1999-04-20 | Shin Etsu Chem Co Ltd | 電極板及びその製造方法 |
US6399499B1 (en) * | 1999-09-14 | 2002-06-04 | Jeong Gey Lee | Method for fabricating an electrode of a plasma chamber |
JP3654142B2 (ja) * | 2000-01-20 | 2005-06-02 | 住友電気工業株式会社 | 半導体製造装置用ガスシャワー体 |
US20020127853A1 (en) * | 2000-12-29 | 2002-09-12 | Hubacek Jerome S. | Electrode for plasma processes and method for manufacture and use thereof |
US7479304B2 (en) * | 2002-02-14 | 2009-01-20 | Applied Materials, Inc. | Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate |
JP2004149881A (ja) * | 2002-10-31 | 2004-05-27 | Applied Materials Inc | プラズマ処理装置及び方法 |
JP4823639B2 (ja) * | 2005-01-19 | 2011-11-24 | グランデックス株式会社 | デバリング装置 |
TWI284075B (en) * | 2005-08-31 | 2007-07-21 | Univ Nat Central | Grinding material spiral grinding device and method thereof |
ES2534215T3 (es) * | 2006-08-30 | 2015-04-20 | Oerlikon Metco Ag, Wohlen | Dispositivo de pulverización de plasma y un método para la introducción de un precursor líquido en un sistema de gas de plasma |
EP1895818B1 (en) * | 2006-08-30 | 2015-03-11 | Sulzer Metco AG | Plasma spraying device and a method for introducing a liquid precursor into a plasma gas system |
US20080131622A1 (en) * | 2006-12-01 | 2008-06-05 | White John M | Plasma reactor substrate mounting surface texturing |
CN100577866C (zh) * | 2007-02-27 | 2010-01-06 | 中微半导体设备(上海)有限公司 | 应用于等离子体反应室中的气体喷头组件、其制造方法及其翻新再利用的方法 |
-
2009
- 2009-01-21 US US12/356,687 patent/US20100180426A1/en not_active Abandoned
-
2010
- 2010-01-21 KR KR1020117019299A patent/KR20110115137A/ko not_active Application Discontinuation
- 2010-01-21 CN CN2010800052006A patent/CN102293062A/zh active Pending
- 2010-01-21 WO PCT/US2010/021557 patent/WO2010090846A2/en active Application Filing
- 2010-01-21 JP JP2011548081A patent/JP2012516056A/ja active Pending
- 2010-01-21 TW TW099101681A patent/TW201034049A/zh unknown
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