JP2012505770A - チタンアルミニウム合金ヒータを備えるインクジェットプリントヘッド - Google Patents
チタンアルミニウム合金ヒータを備えるインクジェットプリントヘッド Download PDFInfo
- Publication number
- JP2012505770A JP2012505770A JP2011531298A JP2011531298A JP2012505770A JP 2012505770 A JP2012505770 A JP 2012505770A JP 2011531298 A JP2011531298 A JP 2011531298A JP 2011531298 A JP2011531298 A JP 2011531298A JP 2012505770 A JP2012505770 A JP 2012505770A
- Authority
- JP
- Japan
- Prior art keywords
- heater
- layer
- inkjet printhead
- alloy
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 title description 6
- 229910000838 Al alloy Inorganic materials 0.000 title description 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 77
- 239000000956 alloy Substances 0.000 claims abstract description 77
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 15
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 12
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 11
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 60
- 239000007788 liquid Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 24
- 239000011253 protective coating Substances 0.000 claims description 14
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 11
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 229910010038 TiAl Inorganic materials 0.000 claims 1
- 238000001704 evaporation Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 163
- 239000000976 ink Substances 0.000 description 69
- 238000004519 manufacturing process Methods 0.000 description 60
- 229920002120 photoresistant polymer Polymers 0.000 description 36
- 238000005530 etching Methods 0.000 description 35
- 229910000601 superalloy Inorganic materials 0.000 description 32
- 238000002161 passivation Methods 0.000 description 25
- 238000000151 deposition Methods 0.000 description 19
- 239000011651 chromium Substances 0.000 description 18
- 230000004888 barrier function Effects 0.000 description 17
- 230000008021 deposition Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 16
- 230000003647 oxidation Effects 0.000 description 16
- 238000007254 oxidation reaction Methods 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 230000002829 reductive effect Effects 0.000 description 13
- 230000008901 benefit Effects 0.000 description 12
- 238000005229 chemical vapour deposition Methods 0.000 description 11
- 239000010955 niobium Substances 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 10
- 239000000654 additive Substances 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 239000011241 protective layer Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 229910004298 SiO 2 Inorganic materials 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- 229910010413 TiO 2 Inorganic materials 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 238000000059 patterning Methods 0.000 description 7
- 229910052727 yttrium Inorganic materials 0.000 description 7
- 238000009835 boiling Methods 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910010037 TiAlN Inorganic materials 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000007792 addition Methods 0.000 description 5
- 239000006117 anti-reflective coating Substances 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052735 hafnium Inorganic materials 0.000 description 5
- 229910001026 inconel Inorganic materials 0.000 description 5
- 229910000816 inconels 718 Inorganic materials 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 229910052702 rhenium Inorganic materials 0.000 description 5
- 229910052720 vanadium Inorganic materials 0.000 description 5
- 229910052726 zirconium Inorganic materials 0.000 description 5
- 230000032798 delamination Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 229910052746 lanthanum Inorganic materials 0.000 description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000002159 nanocrystal Substances 0.000 description 3
- 229910001235 nimonic Inorganic materials 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 3
- 229910000521 B alloy Inorganic materials 0.000 description 2
- 229910001339 C alloy Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001188 F alloy Inorganic materials 0.000 description 2
- 229910000796 S alloy Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000008186 active pharmaceutical agent Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910001293 incoloy Inorganic materials 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 244000132059 Carica parviflora Species 0.000 description 1
- 235000014653 Carica parviflora Nutrition 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- LNGCCWNRTBPYAG-UHFFFAOYSA-N aluminum tantalum Chemical compound [Al].[Ta] LNGCCWNRTBPYAG-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910001041 brightray Inorganic materials 0.000 description 1
- -1 but not limited to Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000796 flavoring agent Substances 0.000 description 1
- 235000019634 flavors Nutrition 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- MELCCCHYSRGEEL-UHFFFAOYSA-N hafnium diboride Chemical compound [Hf]1B=B1 MELCCCHYSRGEEL-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/05—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers produced by the application of heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/1412—Shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/1437—Back shooter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14403—Structure thereof only for on-demand ink jet heads including a filter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
【解決手段】インクを蒸発させて各々のノズルを通して滴を吐出するための抵抗ヒータを備えるインクジェットプリントヘッドにおいて、上記の抵抗ヒータは、Tiが40重量%超を占め、Alが40重量%超を占め、Xが5重量%未満を占め、かつゼロ以上のAg、Cr、Mo、Nb、Si、Ta及びWを含む、TiAlX合金から形成されている。
【選択図】図1
Description
液体を保持するチャンバと、
チャンバと流体連通されたノズルと、
チャンバ内に液体と熱接触するように配置されたヒータであって、当該ヒータの抵抗加熱が蒸気バブルを発生させ、この蒸気バブルがノズルを通して液体の滴を吐出する構成とされた当該ヒータと、を備え、
このヒータが、Tiが40重量%超を占め、Alが40重量%超を占め、Xが5重量%未満を占め、かつ、ゼロ以上のAg、Cr、Mo、Nb、Si、Ta及びWを含む、TiAlX合金から形成されている、インクジェットプリントヘッドを提供する。
液体を保持するチャンバと、
チャンバ内に液体と熱接触して配置されたヒータとを備え、ヒータが、粒径100ナノメートル未満の微細構造を有し、作動時に、液体中に圧力パルスをもたらす蒸気バブルを発生させるために、ヒータが液体の一部を液体の沸点より高い温度まで加熱するよう、関連駆動回路から作動信号を受信するように構成されている、MEMSデバイスを提供する。
INCONEL(登録商標)600合金、601合金、617合金、625合金、625LCF合金、690合金、693合金、718合金、783合金、X−750合金、725合金、751合金、MA754合金、MA758合金、925合金、又はHX合金、
INCOLOY(登録商標)330合金、800合金、800H合金、800HT合金、MA956合金、A−286合金、又はDS合金、
NIMONIC(登録商標)75合金、80A合金、又は90合金、
BRIGHTRAY(登録商標)B合金、C合金、F合金、S合金、又は35合金、或いは、
FERRY(登録商標)合金又はThermo−Span(登録商標)合金。
図1〜図4を参照すると、本発明の一実施形態によるプリントヘッドのユニットセル1は、ノズル3を内部に有するノズルプレート2を備え、ノズルは、ノズルリム4と、ノズルプレートを通って延びる孔5とを有する。ノズルプレート2は、化学気相成長法(CVD)を用いて、後でエッチングされる犠牲材料の上に堆積された窒化ケイ素構造からプラズマエッチングされる。
次に、本発明の実施形態によるプリントヘッドの製造プロセスの関連部分を図10〜図33を参照して説明する。
他の実施形態において、ヒータ素子はチャンバの内部壁に接合される。ヒータをチャンバ内の固体表面に接合することにより、エッチング及び堆積製作プロセスの簡略化が可能となる。しかしながら、ヒータ素子がもはや「自己冷却」を行わなくなるので、シリコン基板への熱伝導がノズルの効率を低下させる可能性がある。したがって、ヒータがチャンバ内の固体表面に接合される実施形態では、基板からヒータを熱的に分離するよう措置を講ずる必要がある。
1.SiO2上に直接堆積されたヒータ
2.Black Diamond(登録商標)上に直接堆積されたヒータ
オープンプール沸騰構成で、試験流体として水を使用し、ストロボスコープによるバブル形成の観察により、後者はバブル凝集の開始に必要なエネルギーが20%少ないことが決定された。10億回以上の動作にわたってオープンプール沸騰を行ったが、凝集エネルギーの移動又はバブルの崩壊もなく、これは基層が水の過熱限界、すなわち約300℃に達するまで熱的に安定であることを示している。実際、このような膜のCu拡散バリアとしての使用に関する研究(Chiu−Chih Chiangら、「Physical and Barrier Properties of Amorphous Silicon−Oxycarbide Deposited by PECVD from Octamethylcycltetrasiloxane」、Journal of The Electrochemical Society、151ページ(2004)を参照のこと)に記載されているように、このような層は550℃まで熱的に安定となり得る。
1.吐出のエネルギーを削減するために、ヒータが基板から熱的に隔離される。
2.チップ背面への熱伝導により、プリントヘッドチップが冷却される。
チップが除去を必要とする熱は、吐出された液滴によって除去される熱だけであるという意味で、自己冷却性となるように設計されている本出願人のノズルには、そのような構成は必要ない。正式には、「自己冷却される」又は「自己冷却性」ノズルとは、吐出可能な液体の滴を吐出するのに必要なエネルギーが、滴によって除去できる熱エネルギーの最大量未満であるノズルと定義できる。このエネルギーは、滴の量に等しい量の吐出可能な流体を、流体がプリントヘッドに入る温度から吐出可能な流体の不均質沸点(heterogeneous boiling point)まで加熱するのに必要なエネルギーである。この場合、プリントヘッドチップの定常温度は、ノズル密度、噴射率又は導電性ヒートシンクの有無に関わらず、吐出可能な流体の不均質沸点未満となる。ノズルが自己冷却性である場合、熱はプリントヘッドの表面から吐出された液滴によって除去され、チップの背面に輸送する必要はない。したがって、ヒータの下の領域に封入するように熱バリア層をパターニングする必要がない。これにより、デバイスの加工が簡略化する。事実、CVDされたSiOCHを単にCMOS上部不動態化層とヒータ層との間に挿入するだけでよい。これについては図6〜図9を参照して以下で説明する。
図6〜図9は、2つの埋め込み式ヒータの実施形態を概略的に示す。図6及び図7では、ヒータ10がチャンバ7のフロアに埋め込まれ、図8及び図9では、チャンバのルーフにヒータが埋め込まれる。これらの図は、バブル12の凝集及び成長の初期段階を示すという点において全体的に図1及び図2に一致する。簡略化のため、図3〜図5に対応する、継続的な成長及び滴吐出を示す図は省略される。
図6〜図9に示すユニットセルは、かなり概略的であり、埋め込み式ヒータ素子と吊下ヒータ素子の間の相違を強調するため可能な限り、意図的に図1〜図4に示すユニットセルに対応させてある。図37〜図70は、より詳細で複雑な埋め込み式ヒータの実施形態の製作ステップを示す。この実施形態において、ユニットセル21は、4つのノズル、4つのヒータ素子及び1つのインク入口を有する。この設計により、楕円ノズル開口と、より薄いヒータ素子と、千鳥形のノズルの列とを使用して、単一のインク入口から複数のノズルチャンバに供給することにより、ノズルのパッキング密度が増す。ノズル密度が上がると、印刷の解像度が上がる。
超合金は、高温下での使用のために開発された材料クラスである。超合金は通常、元素周期表のVIIA族の元素をベースとし、ジェットエンジン、発電所のタービンなど、材料の高温安定性を必要とする用途で主に使用される。超合金が熱インクジェットの分野で適していることはこれまで認識されていなかった。超合金は、公知の熱インクジェットプリントヘッドに使用される従来の薄膜ヒータ(アルミニウムタンタル、窒化タンタル又は二ホウ化ハフニウムなど)の高温強度、耐食性及び耐酸化性を大幅に超える高温強度、耐食性及び耐酸化性を提供することができる。超合金の主な利点は、親出願である米国特許出願第11/097,308号明細書で詳述されるように、ヒータが保護コーティングなしで動作できるのに十分な強度、耐酸化性及び耐食性を有し、したがってコーティングの加熱時に無駄になっていたエネルギーが設計から排除される。
Cr含有量が2重量%〜35重量%、
Al含有量が0.1重量%〜8重量%、
Mo含有量が1重量%〜17重量%、
Nb+Ta含有量が0.25重量%〜8.0重量%、
Ti含有量が0.1重量%〜5.0重量%、
Fe含有量が60重量%以下、
Ni含有量が26重量%〜70重量%、及び/又は、
Co含有量が35重量%〜65重量%
である超合金が、MEMSバブル発生器内の薄膜ヒータ素子としての使用に適している可能性が高く、特定のデバイス設計(例えば、吊下ヒータ素子、埋め込み式ヒータ素子等)において有効性に関してさらなる試験が妥当であることを示す。
MがNi、Co、Feのうち1つ又は複数からなり、Mは少なくとも50重量%を占め、
Crが8重量%〜35重量%を占め、
Alがゼロ以上8重量%未満を占め、
Xが25重量%未満を占め、Xはゼロ以上のMo、Re、Ru、Ti、Ta、V、W、Nb、Zr、B、C、Si、Y、Hfからなる超合金が、オープンプール試験(上述)において良好な結果を提供する。
Inconel(登録商標)600合金、601合金、617合金、625合金、625LCF合金、690合金、693合金、718合金、X−750合金、725合金、751合金、MA754合金、MA758合金、783合金、925合金又はHX合金、
INCOLOY(登録商標)330合金、800合金、800H合金、800HT合金、MA956合金、A−286合金又はDS合金、
NIMONIC(登録商標)75合金、80A合金又は90合金、
BRIGHTRAY(登録商標)B合金、C合金、F合金、S合金又は35合金、或いは
FERRY(登録商標)合金又はThermo−Span(登録商標)合金
Brightray、Ferry及びNimonicは、Holmer Road HEREFORD HR4 9FL UNITED KINGDOMのSpecial Metals Wiggin Ltd社の登録商標である。
チタンアルミニウム(TiAl)合金は、優れた強度、低クリープ及び軽量という、これらの合金が航空産業及び自動車産業で広く使用される由縁である特性を有する。チタンアルミニウム合金は極めて高温下における耐酸化性のため、炉、窯等の耐火コーティングに適している(「Oxidation Resistance of Refractory γ−TiAlW Coatings」、L.Kaczmarckら、Surface & Coatings Technology 201(2007)6167〜6170ページを参照のこと)。
Claims (12)
- 液体の滴を媒体基板上に吐出するためのインクジェットプリントヘッドであって、
液体を保持するチャンバと、
前記チャンバと流体連通されたノズルと、
前記チャンバ内に前記液体と熱接触するように配置されたヒータであって、当該ヒータの抵抗加熱が蒸気バブルを発生させ、前記蒸気バブルが前記ノズルを通して前記液体の滴を吐出する構成とされた当該ヒータと、
を備え、
前記ヒータが、Tiが40重量%超を占め、Alが40重量%超を占め、Xが5重量%未満を占め、かつ、ゼロ以上のAg、Cr、Mo、Nb、Si、Ta及びWを含む、TiAlX合金から形成されている、インクジェットプリントヘッド。 - XがWである、請求項1に記載のインクジェットプリントヘッド。
- Xが1.7重量%〜4.5重量%を占めるWを含む、請求項1に記載のインクジェットプリントヘッド。
- Tiが48重量%超を占め、Alが48重量%超を占め、Xが0重量%である、請求項1に記載のインクジェットプリントヘッド。
- 前記ヒータの前記TiAl成分がガンマ相構造を有する、請求項1に記載のインクジェットプリントヘッド。
- 前記ヒータが粒径100ナノメートル未満の微細構造を有する、請求項1に記載のインクジェットプリントヘッド。
- 使用時に、前記TiAlX合金が前記液体と直接接触するAl2O3表面酸化物を形成する、請求項1に記載のインクジェットプリントヘッド。
- 前記TiAlX合金が厚さ2ミクロン未満の層として堆積される、請求項1に記載のインクジェットプリントヘッド。
- 前記層が厚さ0.5ミクロン未満である、請求項8に記載のインクジェットプリントヘッド。
- 前記ヒータが保護コーティングをさらに備え、前記保護コーティングが総厚0.5ミクロン未満である、請求項1に記載のインクジェットプリントヘッド。
- 前記保護コーティングが単一材料の層である、請求項10に記載のインクジェットプリントヘッド。
- 前記保護コーティングが少なくとも部分的に酸化ケイ素、窒化ケイ素又は炭化ケイ素から形成される、請求項10に記載のインクジェットプリントヘッド。
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JP2002542949A (ja) * | 1999-04-22 | 2002-12-17 | シルバーブルック リサーチ プロプライエタリー リミテッド | 作動装置の構成部材 |
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US20060250453A1 (en) * | 2005-04-04 | 2006-11-09 | Silverbrook Research Pty Ltd | MEMS bubble generator |
WO2007041747A1 (en) * | 2005-10-10 | 2007-04-19 | Silverbrook Research Pty Ltd | Printhead with elongate nozzles |
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JPH07314687A (ja) * | 1994-05-27 | 1995-12-05 | Canon Inc | インクジェット記録ヘッド |
CA2319505C (en) * | 1998-02-02 | 2009-10-06 | Philip Morris Products Inc. | Two phase titanium aluminide alloy |
US7726777B2 (en) * | 2004-11-15 | 2010-06-01 | Samsung Electronics Co., Ltd. | Inkjet print head and method of fabricating the same |
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JPH11293433A (ja) * | 1990-11-14 | 1999-10-26 | General Electric Co <Ge> | クロミウム及びニオビウムで改良したチタニウム−アルミニウムの処理方法 |
JP2002542949A (ja) * | 1999-04-22 | 2002-12-17 | シルバーブルック リサーチ プロプライエタリー リミテッド | 作動装置の構成部材 |
JP2004160829A (ja) * | 2002-11-13 | 2004-06-10 | Sony Corp | 液体吐出装置及びその製造方法 |
US20060250453A1 (en) * | 2005-04-04 | 2006-11-09 | Silverbrook Research Pty Ltd | MEMS bubble generator |
WO2007041747A1 (en) * | 2005-10-10 | 2007-04-19 | Silverbrook Research Pty Ltd | Printhead with elongate nozzles |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |