JP2012256669A - Coil component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize the downsizing of a LAN module on which both first and second coil components are mounted.SOLUTION: A coil component 1 includes a pulse transformer 3 and a common mode filter 4. The pulse transformer 3 includes a drum type core 10 having a core part 10a and a pair of flange parts 10b, 10c provided at both ends of the core part 10a, wires W1 to W4 wound around the core part 10a, and a plate like core 20 forming a magnetic path of a magnetic field generated between the flange parts 10b, 10c by currents flowing through the wires W1 to W4. The common mode filter 4 is formed by the plate like core 20.

Description

  The present invention relates to a coil component, and more particularly to a coil component using a drum core.

  When connecting a device such as a personal computer to a network such as a LAN or a telephone network, it is necessary to protect the device from ESD (ElectroStatic Discharge) and high voltage entering through a cable. Therefore, in a general LAN module, a pulse transformer is used as a connector constituting a connection point between a cable and a device.

  A conventional pulse transformer is made by winding a primary coil and a secondary coil around a donut-shaped magnetic core (toroidal core), and only the AC component (pulse) of the voltage applied to the primary coil is secondary. It has the property of transmitting to the coil. Since the direct current component is not transmitted to the secondary coil, the pulse transformer can block ESD and high voltage.

  In recent years, pulse transformers are also required to be miniaturized and surface-mounted. For this reason, an example in which a drum core is used instead of the toroidal core has appeared. Such a pulse transformer is referred to as a surface mount type pulse transformer, and an example thereof is disclosed in Patent Document 1.

JP 2010-109267 A

  Incidentally, a common mode filter for removing common mode noise is usually mounted on the LAN module. In other words, both a common mode filter and a pulse transformer are mounted on a single LAN module. However, the necessity of mounting a plurality of types of coil components in this way hinders the miniaturization of the LAN module. Yes.

  Accordingly, one of the objects of the present invention is to provide a coil component that can realize miniaturization of a LAN module on which a plurality of types of coil components are mounted.

  In order to achieve the above object, a coil component according to the present invention includes first and second coil components, and the first coil component includes a pair of flanges provided at both ends of a core portion and the core portion. A drum-type core having a portion, at least one wire wound around the core portion, and a magnetic path of a magnetic field generated between the pair of flange portions by a current flowing through the at least one wire. It has a plate-shaped core, The said 2nd coil component is comprised by the said plate-shaped core, It is characterized by the above-mentioned.

  According to the present invention, since a part of the first coil component (plate core) is used as the second coil component, the LAN module on which both the first and second coil components are mounted can be downsized. it can.

  In the coil component, the second coil component may include at least one planar spiral conductor formed inside the plate core. According to this, a 2nd coil component can be comprised using a plane spiral conductor.

  In the coil component, the plate-like core may have a structure in which a first magnetic substrate, the at least one planar spiral conductor, and a second magnetic substrate are sequentially stacked. According to this, a 2nd coil component can be comprised with a laminated coil component.

  In the coil component, the stacking direction of the plate-like cores may be a direction perpendicular to the extending direction of the core portion. According to this, magnetic interference between the first coil component and the second coil component can be suppressed.

  Each said coil component WHEREIN: The said plate-shaped core is good also as arrange | positioning between a pair of said collar parts. According to this, since it is possible to mount such that the surface of the plate-shaped core and the surfaces of the pair of flanges are in contact with the substrate, flip-chip mounting can be realized.

  In each of the coil components, the plate-shaped core is disposed between the pair of flanges so that a bottom surface of the plate-shaped core and a bottom surface of each of the pair of flanges are flush with each other. Each of the coil components has a plurality of first terminal electrodes connected to any one of the respective ends of the at least one wire, and each of the second coil components has each of the at least one planar spiral conductor. A plurality of second terminal electrodes connected to any one of the end portions, each of the plurality of first terminal electrodes being formed on the bottom surface of one of the pair of flange portions, Any of the second terminal electrodes may be formed on the bottom surface of the plate-like core. According to this, since the first and second terminal electrodes are all located in the same plane, mounting on the substrate (flip chip mounting) is facilitated.

  In the coil component, each of the plurality of first terminal electrodes extends from a bottom surface of the flange portion on which each of the first terminal electrodes is formed, to an upper surface of the flange portion, through a side surface of the flange portion, and the at least one terminal electrode is provided. Each end portion of the wire may be connected to any one of the plurality of first terminal electrodes on the upper surface of each of the pair of flange portions. According to this, since it is not necessary to provide a gap for passing the wire between the plate-shaped core and the pair of flanges, the magnetic characteristics of the first coil component are improved.

  In each of the coil components, the at least one planar spiral conductor includes stacked first and second planar spiral conductors, and the first and second planar spiral conductors constitute a common mode filter. Also good. The at least one wire includes a first and a fourth wire that are bifilar wound on the core portion, and a second that is bifilar-wound on the core portion from above the first and fourth wires. And the third wire, the first and second wires constitute one of the primary winding and the secondary winding of the pulse transformer, and the third and fourth wires are the primary winding of the pulse transformer. It is good also as comprising the other of a line | wire and a secondary winding.

  According to the present invention, since a part of the first coil component (plate core) is used as the second coil component, the LAN module on which both the first and second coil components are mounted can be downsized. it can.

It is a perspective view of the coil component by embodiment of this invention. It is a disassembled perspective view of the coil components by embodiment of this invention. (A) (b) is a top view of the drum type core by embodiment of this invention. It is a disassembled perspective view of the plate-shaped core by embodiment of this invention. It is a top view of the board | substrate with which the coil components by embodiment of this invention are mounted. It is a circuit diagram of a LAN module on which two coil components according to an embodiment of the present invention are mounted. (A) and (b) are the figures which show the magnetic force line which generate | occur | produces in the coil components by embodiment of this invention. It is a perspective view of the coil components by the modification of embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a coil component 1 according to the present embodiment. FIG. 2 is an exploded perspective view of the coil component 1. In FIG. 2, a substrate 2 on which the coil component 1 is mounted is also drawn. Moreover, in FIG. 1 and FIG. 2, the coil component 1 is upside down. As shown in these drawings, the coil component 1 includes a drum core 10 and a plate core 20, and four wires W1 to W4 wound around the drum core 10, and is mounted on the surface of the substrate 2. Is done.

  The plate-like core 20 is a plate-like member, and is disposed on the surface of the substrate 2 with the bottom surface 20b (FIG. 1) facing the substrate 2 side. The plate-like core 20 is formed with bump-type terminal electrodes Q1 to Q4 (a plurality of second terminal electrodes) penetrating from the upper surface 20u to the bottom surface 20b, and these are wiring formed on the surface of the substrate 2 A pattern (described later, not shown in FIG. 2) and a pattern are bonded to each other by solder and are electrically connected (flip chip mounting). The plate-shaped core 20 constitutes a four-terminal common mode filter 4 (second coil component). Although details regarding this point will be described later, the terminal electrodes Q <b> 1 to Q <b> 4 correspond to the terminals of the common mode filter 4.

  As shown in FIGS. 1 and 2, the drum core 10 includes a rod-shaped core portion 10a and a pair of flange portions 10b and 10c provided at both ends of the core portion 10a, which are integrated. It has a structure. The drum core 10 is a sintered body of a magnetic material having a relatively high magnetic permeability, such as Ni—Zn ferrite or Mn—Zn ferrite. Four wires W1 to W4 are wound around the core portion 10a, and these end portions are connected to terminal electrodes P1 to P6 (a plurality of first terminal electrodes) formed on the flange portions 10b and 10c. Is done. This connection structure will be described in more detail later.

  The wires W1 to W4, the drum core 10 and the plate core 20 constitute a 6-terminal pulse transformer 3 (first coil component). Although details regarding this point will be described later, the terminal electrodes P <b> 1 to P <b> 6 correspond to the respective terminals of the pulse transformer 3. The drum core 10 and the plate core 20 function as a closed magnetic circuit of the pulse transformer 3.

  The terminal electrodes P1 to P3 are formed on the surface of the flange portion 10b. Specifically, each of the terminal electrodes P1 to P3 is connected to the side surface (core portion 10a) of the flange portion 10b from the bottom surface 10bb (FIG. 1) of the flange portion 10b to the upper surface 10bu (FIG. 2) of the flange portion 10b. Side surface and the opposite side surface). On the other hand, the terminal electrodes P4 to P6 are formed on the surface of the flange portion 10c. Specifically, each of the terminal electrodes P4 to P6 is connected to the side surface (core portion 10a) of the flange portion 10c from the bottom surface 10cb (FIG. 1) of the flange portion 10c to the upper surface 10cu (FIG. 2) of the flange portion 10c. Side surface and the opposite side surface). As shown in FIG. 2, the wires W1 to W4 in the present embodiment are connected to the portions formed on the upper surfaces (upper surfaces 10bu and 10cu) of the flange portions 10b and 10c of the terminal electrodes P1 to P6. .

  Here, in the following description, as shown in FIGS. 1 and 2, the extending direction of the core portion 10 a (the direction connecting the pair of flange portions 10 b and 10 c) is the X direction, and the X direction is within the surface of the substrate 2. The normal direction of the substrate 2 is referred to as the Z direction. The terminal electrodes P1 to P3 are arranged at equal intervals in order from one end to the other end in the Y direction of the flange portion 10b. Similarly, the terminal electrodes P4 to P6 are arranged at equal intervals in order from one end to the other end in the Y direction of the flange portion 10c.

  As shown in FIG. 2, the drum core 10 is disposed on the surface of the substrate 2 with the bottom surfaces of the flange portions 10 b and 10 c (the bottom surfaces 10 bb and 10 cb shown in FIG. 1) facing the substrate 2 side. Of the terminal electrodes P1 to P6, the portions formed on the bottom surfaces 10bb and 10cb are bonded to a wiring pattern (described later, not shown in FIG. 2) formed on the surface of the substrate 2 by soldering to be conductive (flip). Chip mounting).

  The arrangement of the drum core 10 within the surface of the substrate 2 is determined so that the plate core 20 is positioned between the pair of flange portions 10b and 10c as shown in FIG. The bottom surface 20b of the plate core 20 and the bottom surfaces (bottom surfaces 10bb, 10cb) of the flanges 10b, 10c are flush with each other as shown in FIG.

  In the present embodiment, the width of the plate-shaped core 20 in the X direction is adjusted to the distance between the flange portions 10b and 10c. Therefore, the plate-shaped core 20 and the flanges 10b and 10c are in close contact as shown in FIG. Further, the width in the Y direction of each of the plate core 20 and the flange portions 10b and 10c is set to the same value as shown in FIG. Furthermore, the distance between the core part 10a and the substrate 2 is set so that the wires W1 to W4 wound around the core part 10a do not come into contact with the plate core 20 (in the Z direction). The value is sufficiently larger than (width).

  Next, the connection structure of the wires W1 to W4 will be described. 3 (a) and 3 (b) are plan views of the drum core 10 as viewed from the upper surface 10bu, 10cu side. The wires W1 to W4 are wound in two layers around the core portion 10a. FIG. 3 (a) shows only the lower layer, and FIG. 3 (b) also shows the upper layer.

  First, as shown in FIG. 3A, in the lower layer, the wires W1 and W4 are bifilar wound (two wires are alternately arranged and wound in a single layer). Since it is bifilar winding, the number of turns of the wires W1 and W4 is the same. Ends W1a and W4a at the start of winding of the wires W1 and W4 are connected to the terminal electrodes P1 and P5, respectively. On the other hand, end portions W1b and W4b at the end of winding of the wires W1 and W4 are respectively connected to the terminal electrodes P2 and P6.

  Next, as shown in FIG. 3B, the wires W2 and W3 are bifilar wound in the upper layer. Since it is bifilar winding, the number of turns of the wires W2 and W3 is the same. The winding direction of the wires W2, W3 is the same as the winding direction of the wires W1, W4. Ends W2a and W3a at the beginning of winding of the wires W2 and W3 are connected to the terminal electrodes P2 and P4, respectively. On the other hand, end portions W2b and W3b at the end of winding of the wires W2 and W3 are connected to the terminal electrodes P3 and P5, respectively.

  Next, the internal structure of the plate core 20 will be described. FIG. 4 is an exploded perspective view of the plate core 20. As shown in the figure, the plate-like core 20 has a structure (a magnetic substrate 21 and a layer) in which a layer structure 23 is sandwiched between two magnetic substrates 21 and 22 (first and second magnetic substrates). The structure 23 and the magnetic substrate 22 are sequentially stacked. The surface of the plate core 20 on the magnetic substrate 22 side is the upper surface 20u, and the surface of the plate core 20 on the magnetic substrate 21 side is the bottom surface 20b.

  The magnetic substrates 21 and 22 are made of sintered ferrite or composite ferrite (resin containing powdered ferrite). In particular, it is preferable to use a material having a relatively high magnetic permeability such as Ni—Cu—Zn ferrite and Mn—Zn ferrite. This is because by using a magnetic material having a high magnetic permeability, magnetic characteristics originally required for a common mode filter can be enhanced.

  The terminal electrodes Q1 to Q4 are all bump electrodes that penetrate the plate-like core 20 from the upper surface 20u to the bottom surface 20b. The terminal electrodes Q1, Q2 are provided to be exposed on the side surface (the side surface closer to the terminal electrodes P1, P4) on one end side in the Y direction of the plate core 20. The terminal electrode Q1 is provided at a position near the collar part 10c, and the terminal electrode Q2 is provided at a position near the collar part 10b. On the other hand, the terminal electrodes Q3 and Q4 are provided to be exposed on the side surface on the other end side in the Y direction of the plate-like core 20 (the side surface closer to the terminal electrodes P3 and P6). The terminal electrode Q3 is provided at a position near the collar part 10c, and the terminal electrode Q4 is provided at a position near the collar part 10b. These arrangements of the terminal electrodes Q1 to Q4 are determined so that a wiring pattern in the substrate 2 described later does not become excessively complicated.

  When the conductivity of the magnetic substrates 21 and 22 is high, an insulating film (not shown) is provided between the terminal electrodes Q1 to Q4 and the magnetic substrates 21 and 22, so that the magnetic properties of the terminal electrodes Q1 to Q4 and the magnetic substrates 21 and 22 are increased. Conduction between the body substrates 21 and 22 is prevented. This insulating film may be formed by selectively oxidizing only the magnetic substrates 21 and 22.

  The layer structure 23 is a laminate of resin layers S1 to S4, magnetic layers S5a and S5b, and an adhesive layer S6. Among these, the resin layers S2 to S4 have a through-hole H having a substantially rectangular cross section near the center. A pair of planar spiral conductors 30 and 40 are formed on the surfaces of the resin layers S3 and S2, and the planar spiral conductors 30 and 40 are electrically connected to the external electrodes Q1 to Q4 on the surfaces of the resin layers S1 to S3. Conductor patterns 31 to 33 and 41 to 43 are formed. The resin layer S4 is provided to separate the conductor pattern and the magnetic layer S5b, and no conductor pattern is formed on the surface thereof. The adhesive layer S6 is provided for the purpose of bonding the magnetic layer S5b and the magnetic substrate 22 together. In the layer structure 23, a through-hole conductor 34 that penetrates the resin layers S2 and S3 and a through-hole conductor 44 that penetrates the resin layer S2 are also formed.

  Each of the resin layers S1 to S4 is formed by spin-coating an insulating nonmagnetic resin (for example, a photosensitive polyimide resin) having photosensitivity, and exposing, developing, and thermosetting it. You may form using a dip method or a spray method. Through holes for forming the through hole H and the through hole conductors 34 and 44 are formed by etching. Each conductor pattern is formed by forming a base conductive layer on a resin layer by vapor deposition or sputtering, and performing plating using this as a power feeding body. The through-hole conductors 34 and 44 are constituted by a base conductive layer that has entered the through-hole.

  The conductor pattern formed on the resin layers S1 to S3 will be specifically described. First, the planar spiral conductors 30 and 40 are formed on the resin layers S3 and S2, respectively. Both have a substantially elliptical shape that is long in the Y direction, and the shape when viewed from the Z direction is the same except for a portion near the inner peripheral end of the planar spiral conductor 30. Therefore, of course, the winding direction is also the same. The planar spiral conductors 30 and 40 overlap in the Z direction across the resin layer S3 and are magnetically coupled to each other.

  The conductor pattern 31 is formed in each of the resin layers S1 to S3 in the same shape at the same position as viewed from the Z direction. The conductor patterns 31 of each layer are connected to each other by through-hole conductors 34. Similarly, the conductor pattern 41 is formed in the same shape in the same position seeing from a Z direction in each of resin layer S1, S2. The conductor patterns 41 in each layer are connected to each other by through-hole conductors 44.

  The conductor pattern 31 formed on the resin layer S3 is connected to the inner peripheral end of the planar spiral conductor 30, and the conductor pattern 31 formed on the resin layer S1 is connected to the terminal electrode Q1 via the conductor pattern 33. Therefore, the inner peripheral end of the planar spiral conductor 30 is connected to the terminal electrode Q1 through these. Similarly, the conductor pattern 41 formed on the resin layer S2 is connected to the inner peripheral end of the planar spiral conductor 40, and the conductor pattern 41 formed on the resin layer S1 is connected to the terminal electrode Q3 via the conductor pattern 43. ing. Therefore, the inner peripheral end of the planar spiral conductor 40 is connected to the terminal electrode Q3 through these.

  The conductor pattern 32 is formed on the resin layer S3 and is connected to both the outer peripheral end of the planar spiral conductor 30 and the terminal electrode Q2. Therefore, the outer peripheral end of the planar spiral conductor 30 is connected to the terminal electrode Q2. The conductor pattern 42 is formed on the resin layer S2 and connected to both the outer peripheral end of the planar spiral conductor 40 and the terminal electrode Q4. Thereby, the outer peripheral end of the planar spiral conductor 40 is connected to the terminal electrode Q4.

  The magnetic layer S <b> 5 a is a layer that serves as a magnetic path of the common mode filter 4 configured by the pair of planar spiral conductors 30 and 40, and is embedded in the through hole H. The magnetic layer S5a is formed by flowing a magnetic material mixed with resin and having fluidity on the resin layer S4. The magnetic layer S5b is made of a magnetic material remaining on the surface of the resin layer S4 after flowing the magnetic material on the resin layer S4.

  Next, after describing a wiring pattern formed on the surface of the substrate 2, a circuit realized by the wiring pattern and the coil component 1 will be described.

  FIG. 5 is a diagram showing a wiring pattern formed on the surface of the substrate 2. The substrate 2 constitutes a LAN module, and two coil parts 1 are mounted on the surface thereof. The substrate 2 has 16 external terminals PIN1 to PIN16. One coil component 1 is connected to the external terminals PIN1 to PIN3 and PIN14 to PIN16, and the other coil component 1 is connected to the external terminals PIN6 to PIN8 and PIN9 to PIN11. , Each connected. Since one coil component 1 and the other coil component 1 use exactly the same wiring pattern except for connected external terminals, only the wiring patterns related to the external terminals PIN1 to PIN3 and PIN14 to PIN16 will be described below. Focus on the explanation.

As shown in FIG. 5, land patterns L _{P1 to} L _P6 and L _{Q1 to} L _Q4 are provided on the surface of the substrate 2. The subscript corresponds to the code of the terminal electrode of the coil component 1, and the corresponding terminal electrode is soldered to each land pattern.

As shown in FIG. 5, the land patterns L _{P1 to} L _P6 and L _{Q1 to} L _Q4 are arranged so that the land patterns L _{P1 to} L _P3 are adjacent to the external terminals PIN1 to PIN3, respectively. Thus, the land patterns L _{P4 to} L _P6 are arranged adjacent to the external terminals PIN16 to PIN14, respectively. The land patterns L _{Q1 to} L _Q4 are defined by the land patterns L _{P1 to} L _P3 and the land patterns L _{P4 to} L _P6 . It will be arranged in the sandwiched area.

In addition to the land patterns L _{P1 to} L _P6 and L _{Q1 to} L _Q4 as described above, a wiring pattern for connecting each land pattern to a corresponding external terminal, and the land patterns are connected to the surface of the substrate 2. A wiring pattern is formed. Specifically, three wiring patterns for connecting the land patterns L _{P1 to} L _P3 to the external terminals PIN1 to PIN3, respectively, and two wiring patterns for connecting the land patterns L _Q1 and L _Q3 to the external terminals PIN16 and PIN14, respectively. , the wiring pattern, the wiring pattern for connecting the land patterns _{L Q2} and the land pattern _{L P4,} and a wiring pattern for connecting the land patterns _{L Q4} and the land pattern _{L P6} is provided to connect the land pattern _{L P5} to an external terminal PIN15 .

  FIG. 6 is a circuit diagram of a circuit realized by the above land pattern and wiring pattern and the two coil components 1 mounted on the surface of the substrate 2. Also here, one coil component 1 and the other coil component 1 are exactly the same circuit except for the external terminals, and therefore only one coil component 1 will be described.

  As shown in FIG. 6, one end (the end W1a shown in FIG. 3A) of the wire W1 is connected to the external terminal PIN1, and the other end (end W1b) is connected to the external terminal PIN2. One end (end W2a) of the wire W2 is connected to the external terminal PIN2, and the other end (end W2b) is connected to the external terminal PIN3. One end (end W3a) of the wire W3 is connected to one end (outer peripheral end, see FIG. 4) of the planar spiral conductor 30, and the other end (end W3b) is connected to the external terminal PIN15. One end (end W4a) of the wire W4 is connected to the external terminal PIN15, and the other end (end W4b) is connected to one end (outer peripheral end) of the planar spiral conductor 40. Further, the other end (inner peripheral end) of the planar spiral conductor 30 is connected to the external terminal PIN16, and the other end (inner peripheral end) of the planar spiral conductor 40 is connected to the external terminal PIN14.

  Since the wires W1 to W4 and the planar spiral conductors 30 and 40 are connected as described above, as shown in FIG. 6, the external terminals PIN1 and PIN2 are respectively used as a positive input terminal IN + and a negative input terminal IN− for balanced input. When the external terminals PIN16 and PIN14 are the balanced output plus side terminal OUT + and minus side terminal OUT-, respectively, and the external terminals PIN2 and PIN15 are the input side and output side intermediate taps CT, the wires W1 to W4 are pulse transformers. 3, and the planar spiral conductors 30 and 40 constitute the common mode filter 4. Wires W1 and W2 are primary windings of the pulse transformer 3, and wires W3 and W4 are secondary windings of the pulse transformer. The input and output may be reversed. In this case, the wires W3 and W4 are the primary windings of the pulse transformer 3, and the wires W1 and W2 are the secondary windings of the pulse transformer.

  FIGS. 7A and 7B show magnetic lines of force generated in the coil component 1. The magnetic field lines shown in FIG. 6A are magnetic field lines (magnetic field lines generated between the pair of flanges 10b and 10c) that are generated when current flows through the wires W1 to W4 serving as the pulse transformer 3. FIG. Lines of magnetic force shown in b) are lines of magnetic force generated when a current flows through the planar spiral conductors 30 and 40 as the common mode filter 4.

  As shown in FIG. 7A, the magnetic field lines of the pulse transformer 3 are generated at the core portion 10a and pass through the flange portion 10b, the magnetic substrates 21 and 22 of the plate-like core 20, and the flange portion 10c. Take the route back to 10a. That is, the drum core 10 and the plate core 20 constitute a closed magnetic circuit.

  On the other hand, the lines of magnetic force of the common mode filter 4 are generated in the magnetic layer S5a, and pass through the magnetic layer S5b, the magnetic substrate 22, each flange, and the magnetic substrate 21, as shown in FIG. Take the route back to the body layer S5a. Since the magnetic material is interrupted between the magnetic material layer S5b and the magnetic material substrate 22, and between the magnetic material layer S5a and the magnetic material substrate 21, this route is not a closed magnetic circuit.

  As is clear from the magnetic field lines shown above, at least in the vicinity of the magnetic layer S5a, the magnetic field lines of the pulse transformer 3 and the magnetic field lines of the common mode filter 4 are almost orthogonal. This means that magnetic interference between the pulse transformer 3 and the common mode filter 4 is suppressed. That is, in the coil component 1, the pulse transformer 3 and the common mode filter 4 share a magnetic path, but mutual magnetic interference is minimized.

  As described above, according to the coil component 1, a part of the pulse transformer 3 (plate core 20) is used as the common mode filter 4. Therefore, the LAN module on which both the pulse transformer and the common mode filter are mounted can be miniaturized. Can be realized.

  Further, since the plate-like core 20 has a laminated structure in which a planar spiral conductor is sandwiched between two magnetic substrates, and the lamination direction is a direction perpendicular to the extending direction of the core portion 10a, the pulse transformer 3 and the common mode filter Magnetic interference between the four is suppressed.

  Further, since the plate-shaped core 20 is disposed between the pair of flange portions 10b and 10c, the bottom surface 20b of the plate-shaped core 20 and the bottom surfaces (bottom surfaces 10bb and 10cb) of the pair of flange portions 10b and 10c, respectively. In any case, the mounting can be performed so as to be in contact with the substrate 2, and the flip chip mounting as described above is realized. In addition, since the terminal electrodes P1 to P6 and Q1 to Q4 are all located in the same plane in the coil component 1, mounting on the substrate 2 (flip chip mounting) is facilitated.

  Further, in the coil component 1, since the terminal electrodes P1 to P6 are extended from the upper surface to the bottom surface of each flange portion, the wires W1 to W4 are connected by the upper surface (surface opposite to the substrate contact surface) of each flange portion. It is possible. Therefore, it is not necessary to provide gaps for passing the wires W1 to W4 between the plate-shaped core 20 and the pair of flange portions 10b and 10c, and the magnetic characteristics of the coil component 1 are improved.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to such embodiment at all, and this invention can be implemented in various aspects in the range which does not deviate from the summary. Of course.

  For example, in the above-described embodiment, the magnetic characteristics of the coil component 1 are improved by connecting the wires W1 to W4 with the upper surface (surface opposite to the substrate contact surface) of each collar portion. Depending on the specific characteristics, as shown in FIG. 8, a gap is provided between the plate-shaped core 20 and the pair of flanges 10b, 10c, and the wires W1 to W4 are passed through, and at the bottom surface (substrate contact surface) of each flange. The wires W1 to W4 may be connected to the terminal electrodes P1 to P6. This eliminates the need to form the terminal electrodes P1 to P6 on the side surfaces and the upper surface of each flange as shown in FIG. 8, so that the terminal electrodes P1 to P6 are erroneously in contact with other components in the LAN module. The possibility of conducting is reduced.

  The specific structures of the pulse transformer 3 and the common mode filter 4 described in the above embodiment can be changed as appropriate. For example, in the above-described embodiment, the terminal electrodes Q1 to Q4, which are bump electrodes, have been described as being exposed on the bottom surface 20b, the top surface 20u, and the side surfaces of the plate-like core 20. You may employ | adopt the structure which Q1-Q4 exposes. Moreover, you may use the conductor formed in the side surface of the plate-shaped core 20 by sputtering as the terminal electrodes Q1-Q4. In addition, various modifications can be applied to the specific structure of the coil component 1.

  In the above embodiment, the pulse transformer is configured by the wire wound around the drum core, and the common mode filter is configured by the planar spiral conductor formed in the plate-shaped core. However, the scope of application of the present invention is as follows. Thus, the present invention is not limited to a combination of a pulse transformer and a common mode filter. For example, a coil part according to the present invention can be formed by arbitrarily combining arbitrary coil parts, such as a balun transformer formed by a wire wound around a drum core and a differential mode filter formed by a planar spiral conductor formed in a plate core. Can be configured. Moreover, you may comprise the coil components by this invention combining the same kind coil components. Depending on the type of coil component, the number of wires and the number of planar spiral conductors may be different from those in the above embodiment, but even in that case, it is appropriate to add or remove terminal electrodes as appropriate. It is possible to constitute the coil component according to the present invention.

  Further, the present invention is applicable to any device that requires two or more coil components in addition to the LAN module.

DESCRIPTION OF SYMBOLS 1 Coil components 2 Board | substrate 3 Pulse transformer 4 Common mode filter 10 Drum type | mold core 10a Core part 10b, 10c Bottom part 10bb Bottom face 10bu of top part 10b Top face 10cb of top part 10b Bottom face 10cu of top part 10c Top face 20 of top part 10c Plate core 20b Bottom surface 20u of plate core 20 Upper surfaces 21, 22 of plate core 20 Magnetic substrate 23 Layer structure 30, 40 Planar spiral conductors 31-33, 41-43 Conductor patterns 34, 44 Through-hole conductor H Through Holes L _{P1 to} L _P6 , L _{Q1 to} L _Q4 Land patterns P1 to _P6 , _{Q1 to} Q4 Terminal electrodes PIN1 to PIN16 External terminals S1 to S4 Resin layers S5a and S5b Magnetic layer S6 Adhesive layers W1 to W4 Wire

Claims (9)

Comprising first and second coil components;
The first coil component is:
A drum core having a winding core and a pair of flanges provided at both ends of the winding core;
At least one wire wound around the core, and
A plate-like core constituting a magnetic path of a magnetic field generated between the pair of flanges by a current flowing through the at least one wire,
The second coil component is constituted by the plate-like core. The coil component according to claim 1, wherein the second coil component has at least one planar spiral conductor formed inside the plate-like core. The coil according to claim 2, wherein the plate-like core has a structure in which a first magnetic substrate, the at least one planar spiral conductor, and a second magnetic substrate are sequentially stacked. parts. The coil component according to claim 3, wherein a laminating direction of the plate-like core is a direction perpendicular to an extending direction of the core portion. The coil component according to any one of claims 1 to 4, wherein the plate-like core is disposed between the pair of flanges. The plate-like core is disposed between the pair of collars so that the bottom surface of the plate-shaped core and the bottom surfaces of the pair of collars are coplanar,
Each of the first coil components has a plurality of first terminal electrodes connected to any one of the ends of the at least one wire,
Each of the second coil components has a plurality of second terminal electrodes connected to any one of the end portions of the at least one planar spiral conductor,
Each of the plurality of first terminal electrodes is formed on the bottom surface of one of the pair of flanges,
5. The coil component according to claim 2, wherein each of the plurality of second terminal electrodes is formed on the bottom surface of the plate-like core. The plurality of first terminal electrodes are extended from the bottom surface of the flange portion on which each of the first terminal electrodes is formed, through the side surface of the flange portion, from the top surface of the flange portion,
The end portions of the at least one wire are connected to any one of the plurality of first terminal electrodes on the upper surfaces of the pair of flange portions, respectively. Coil parts as described in. The at least one planar spiral conductor includes stacked first and second planar spiral conductors;
The coil component according to any one of claims 2, 3, 4, 6, and 7, wherein the first and second planar spiral conductors constitute a common mode filter. The at least one wire includes first and fourth wires that are bifilar wound on the core portion, and second and second wires that are bifilar wound on the core portion from above the first and fourth wires. 3 wires,
The first and second wires constitute one of a primary winding and a secondary winding of a pulse transformer, and the third and fourth wires constitute the other of the primary winding and the secondary winding of the pulse transformer. The coil component according to any one of claims 1 to 8, wherein the coil component is configured.

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