JP2012243958A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012243958A5 JP2012243958A5 JP2011112764A JP2011112764A JP2012243958A5 JP 2012243958 A5 JP2012243958 A5 JP 2012243958A5 JP 2011112764 A JP2011112764 A JP 2011112764A JP 2011112764 A JP2011112764 A JP 2011112764A JP 2012243958 A5 JP2012243958 A5 JP 2012243958A5
- Authority
- JP
- Japan
- Prior art keywords
- processing method
- plasma processing
- plasma
- gas
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims 9
- 238000004140 cleaning Methods 0.000 claims 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 3
- 229910052719 titanium Inorganic materials 0.000 claims 3
- 239000010936 titanium Substances 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011112764A JP2012243958A (ja) | 2011-05-19 | 2011-05-19 | プラズマ処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011112764A JP2012243958A (ja) | 2011-05-19 | 2011-05-19 | プラズマ処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012243958A JP2012243958A (ja) | 2012-12-10 |
| JP2012243958A5 true JP2012243958A5 (cg-RX-API-DMAC7.html) | 2014-05-08 |
Family
ID=47465331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011112764A Pending JP2012243958A (ja) | 2011-05-19 | 2011-05-19 | プラズマ処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012243958A (cg-RX-API-DMAC7.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6049527B2 (ja) * | 2013-04-05 | 2016-12-21 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| JP6177601B2 (ja) * | 2013-06-25 | 2017-08-09 | 東京エレクトロン株式会社 | クリーニング方法及び基板処理装置 |
| JP6284786B2 (ja) * | 2014-02-27 | 2018-02-28 | 東京エレクトロン株式会社 | プラズマ処理装置のクリーニング方法 |
| CN114097064B (zh) | 2020-06-25 | 2025-08-15 | 株式会社日立高新技术 | 真空处理方法 |
| US11769671B2 (en) * | 2020-09-11 | 2023-09-26 | Applied Materials, Inc. | Systems and methods for selective metal compound removal |
| JP7397206B2 (ja) * | 2021-07-19 | 2023-12-12 | 株式会社日立ハイテク | 半導体製造装置のクリーニング方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5756400A (en) * | 1995-12-08 | 1998-05-26 | Applied Materials, Inc. | Method and apparatus for cleaning by-products from plasma chamber surfaces |
| JP4224374B2 (ja) * | 2002-12-18 | 2009-02-12 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置の処理方法およびプラズマ処理方法 |
| JP4764028B2 (ja) * | 2005-02-28 | 2011-08-31 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法 |
-
2011
- 2011-05-19 JP JP2011112764A patent/JP2012243958A/ja active Pending