JP2012241233A - Vapor deposition boat and vapor deposition apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To create an electrode foil with large capacity, which has a little variation in capacitance.SOLUTION: In a vapor deposition boat 13, a recessed groove 17 is composed of: a recessed groove for supply 19A to which at least a vapor deposition material is supplied; a recessed groove for evaporation 20 in communication with the recessed groove for supply 19A; and a recessed groove for diffusion 19B in communication with the recessed groove for evaporation 20. A ratio of a resistance value of a region of a substrate 18 on which surface the recessed groove for evaporation 20 is formed to the respective resistance values of the regions of the substrate 18 on which surface the recessed groove for supply 19A and the recessed groove for diffusion 19B are formed is not less than the value obtained by dividing the boiling point of the vapor deposition material by the melting point of the vapor deposition material. Thus, the temperature near the recessed groove for supply 19A is decreased, melt and oxidization of the vapor deposition material near the recessed groove for supply 19A is suppressed, and the amount of evaporation is stabilized. Also, the vapor deposition material can uniformly reach the end of the recessed groove 17, so that an uniform layer of a coarse film 7 can be formed.

Description

  The present invention relates to a vapor deposition boat and a vapor deposition apparatus using the same.

  FIG. 10 is a cross-sectional view schematically showing the electrode foil 1 of the electrolytic capacitor.

  The electrode foil 1 includes a base material 2 made of an aluminum foil and a rough film layer 3 formed on the base material 2. The rough film layer 3 has a sparse structure in which fine particles 4 made of aluminum are irregularly stacked and branched, and have a large number of pores inside. The coarse film layer 3 is a thick film having a thickness of about 20 to 40 μm. Thus, by making the rough film layer 3 into a sparse and thick film, the surface area of the electrode foil 1 can be increased and a large-capacity capacitor can be realized.

  The vapor deposition apparatus for forming such a sparse and thick coarse film layer 3 includes a vacuum chamber connected to a vacuum pump. In this vacuum chamber, a vapor deposition boat (diagram 113 in FIG. 11) which is disposed at a position facing the surface of the substrate 2 and whose both ends are respectively connected to positive or negative electrodes, and for this vapor deposition A supply unit for supplying the vapor deposition material to the boat 113 and a gas pipe for introducing gas into the vacuum chamber are provided. The vapor deposition boat 113 is composed of a base 118 having a concave groove 117 formed, and the material thereof is composed of a resistance heating element such as BN (boron nitride), W (tungsten), PBN (pyrolytic boron nitride).

  Further, from the gas pipe, an argon gas as an inert gas and an oxygen gas as an active gas are supplied in a balanced manner to form a sparse rough film layer 3.

  For example, Patent Document 1 is known as prior art document information that approximates the invention of this application. Moreover, patent document 2-4 is mentioned as prior art document information relevant to the boat for vapor deposition.

JP 2008-258355 A JP 2007-39809 A JP-A-60-75574 JP-A-5-26633

  In the conventional electrode foil, as can be seen from the SEM photograph of FIG. 12, the film thickness and density of the rough film layer 3 are not uniform, and the capacitance may vary.

  The reason is considered that the vapor deposition material is not uniformly evaporated from the vapor deposition boat 113 when the rough film layer 3 is formed.

  That is, the vapor deposition material supplied from the supply unit may receive radiant heat from the vapor deposition boat 113 or latent heat from the evaporated fine particles 4 and may melt excessively before reaching the vapor deposition boat 113. Thus, when it melt | dissolves excessively, a vapor deposition material will not be stably filled with the constant speed in the ditch | groove 117, and an evaporation material will not evaporate from the ditch | groove 117 uniformly. Further, the vapor deposition material does not spread uniformly at the end of the concave groove 117, and the evaporation material may not uniformly evaporate from the concave groove 117.

  As a result, the rough film layer 3 becomes non-uniform and the capacitance varies.

  Therefore, an object of the present invention is to form an electrode foil having a uniform rough film layer and less variation in capacitance.

  In order to achieve this object, according to the present invention, a groove is disposed at at least one end, and a supply groove to which a vapor deposition material is supplied communicates with the supply groove to evaporate the vapor deposition material. The groove is composed of an evaporation groove and a diffusion groove that communicates with the evaporation groove and is disposed at the other end of the groove. The supply groove and the diffusion groove are formed on the surface. The ratio of the resistance value of the substrate in the region where the groove for evaporation is formed on the surface to the resistance value of each substrate in the region is not less than the value obtained by dividing the boiling point of the vapor deposition material by the melting point of the vapor deposition material. .

  Accordingly, the present invention can form an electrode foil having a uniform rough film layer and less variation in capacitance.

  The reason is that the structure of the vapor deposition boat can suppress the heat generation of the substrate in the region where the supply groove and the diffusion groove are formed.

  This can suppress radiant heat from the vicinity of the supply groove, suppress the evaporation amount of the vapor deposition material from the supply groove, and reduce the influence of the latent heat of the fine particles. Further, since both ends of the groove are lowered in temperature, the melted vapor deposition material is pulled to both ends, and the wettability in the groove is homogenized.

  As a result, it is possible to uniformly evaporate the vapor deposition material from the evaporation concave groove, and to manufacture an electrode foil having a uniform rough film layer and less variation in capacitance.

Sectional drawing of the electrode foil in Example 1 of this invention The schematic diagram of the vapor deposition apparatus in Example 1 of this invention (A) Top view of vapor deposition boat in Example 1 of the present invention, (b) Vertical sectional view in the major axis direction of the vapor deposition boat, (c) Circuit diagram in which the vapor deposition boat is connected to a resistance heating power source SEM photograph of electrode foil in Example 1 of the present invention The figure which shows the dispersion | variation in the electrostatic capacitance of Example 1 of this invention and the conventional electrode foil SEM photograph of electrode foil of comparative example (A) Top view of vapor deposition boat of comparative example, (b) Vertical sectional view in the major axis direction of the vapor deposition boat. (A) Top view of vapor deposition boat in Example 2 of the present invention, (b) Vertical sectional view in the major axis direction of the vapor deposition boat (A) Top view of vapor deposition boat in Example 3 of the present invention, (b) Vertical sectional view in the major axis direction of the vapor deposition boat Cross section of conventional electrode foil (A) Top view of a conventional vapor deposition boat, (b) Vertical sectional view in the major axis direction of the vapor deposition boat SEM photo of conventional electrode foil

Example 1
Hereinafter, a vapor deposition apparatus which manufactures electrode foil used for a solid electrolytic capacitor, an electrolytic capacitor using electrolytic solution, etc., and a boat for vapor deposition used for this apparatus are explained in this example.

  As shown in FIG. 1, the electrode foil 5 of this example is composed of a base material 6 made of aluminum and a rough film layer 7 formed on the base material 6. The coarse film layer 7 is a sparse structure in which fine particles 8 made of aluminum are laminated non-uniformly from the surface of the substrate 6 and are branched into a plurality of branches. The rough film layer 7 has a large number of holes formed therein, and these holes are connected to the outside. Therefore, the surface area of the rough film layer 7 is very large. Such a rough film layer 7 can be formed by vapor deposition.

  The base material 6 has a thickness of about 30 μm, and the rough film layer 7 has a thickness of about 20 μm to 80 μm on one side. The rough film layer 7 may be formed on one side or both sides of the base material 6. The rough film layer 7 is a thick film having a thickness of 20 μm or more, thereby increasing the surface area and realizing a large capacity. The reason why the thickness is 80 μm or less is that this thickness is a limit thickness that can be accurately formed by the vapor deposition process in this embodiment.

  The fine particles 8 have a diameter of about 0.01 μm to 0.3 μm, and the mode of pore diameter is about 0.01 μm to 0.2 μm. The surface area of the rough film layer 7 can be increased by accumulating the fine particles 8 and forming a large number of fine holes.

  The material of the substrate 6 is not limited to aluminum, and various other conductive materials such as valve metals such as titanium and tantalum, alloy materials thereof, copper, and silver can be used. In this example, a film having a thickness of about 30 μm and a width of about 10 cm was used.

  The material of the coarse film layer 7 is not limited to aluminum, and other conductive materials including other valve metal materials and alloy materials thereof can be used.

  In addition, since the portion where the plurality of fine particles 8 are bonded is functioning as an electrode if they are electrically connected, a part of each of the fine particles 8 excluding these bonded portions is made of an insulating material such as oxide or nitride. You may be comprised with the metal compound of.

  Different materials may be used for the base material 6 and the fine particles 8, but when the main components are the same, the affinity between the two is higher, and the base material 6 is also softened by the heat during deposition of the fine particles 8. Adhesion can be improved.

  In addition, as a vapor deposition material, productivity can be increased by using a metal material having a relatively low melting point such as aluminum.

  Next, the vapor deposition apparatus 9 which manufactures the electrode foil 5 of a present Example is demonstrated. As shown in FIG. 2, the vapor deposition apparatus 9 of the present embodiment vaporizes the vapor deposited material on the surface of the base material 6 while continuously transporting the base material 6 in a predetermined direction (arrow X). A coarse film layer 7 is formed on 6.

  The vapor deposition apparatus 9 includes a vacuum chamber 10 connected to a vacuum pump (not shown), and an unwinding roller 11 around which a strip-shaped substrate 6 is wound, and the unwinding roller. 11 is provided at a position facing the surface of the substrate 6 between the take-up roller 12 and the take-up roller 11 and the take-up roller 12, and both ends of the take-up roller 12 are wound up. A vapor deposition boat 13 to which positive and negative electrodes (not shown) of a heating power source are connected, a supply unit 14 for supplying a vapor deposition material to the vapor deposition boat 13, and an inert gas and an active gas in the vacuum chamber 10. A gas pipe (not shown) to be introduced is provided at least.

  In this embodiment, the vapor deposition material is made of an aluminum wire processed into a thin line shape. The supply unit 14 includes a bobbin 15 around which an aluminum wire is wound, and a supply pipe 16 that guides the aluminum wire to the vapor deposition boat 13.

  As shown in FIGS. 3 (a) and 3 (b), the vapor deposition boat 13 is composed of a base body 18 having a concave groove 17 formed on the surface, and the concave groove 17 is disposed on the supply unit 14 side. The supply groove 19A to which the vapor deposition material is supplied from, the evaporation groove 20 for communicating with the supply groove 19A and evaporating the vapor deposition material, and the diffusion groove 19B for communicating with the evaporation groove 20 And at least. The supply groove 19 </ b> A and the diffusion groove 19 </ b> B are respectively disposed at opposite ends of the groove 17. Here, the end portion is an end portion in a direction perpendicular to the feeding direction of the base material 6.

  The vapor deposition boat 13 is arranged so that the longitudinal direction is perpendicular to the feed direction X of the substrate.

The supply groove 19A is narrower than the evaporation groove 20 in the vertical direction with respect to the longitudinal direction of the vapor deposition boat 13 (the connecting direction between the supply groove 19A and the evaporation groove 20) (d). ₁ <d ₂ ), the resistance value of the substrate 18 in the region where the supply groove 19A is formed on the surface (hereinafter referred to as R1) is the resistance value of the substrate 18 in the region where the evaporation groove 20 is formed on the surface. (Hereinafter referred to as R2).

Similarly, the diffusion groove 19B is narrower in the vertical direction than the evaporation groove 20 in the longitudinal direction of the vapor deposition boat 13 (the connecting direction between the diffusion groove 19B and the evaporation groove 20) ( d ₃ <d ₂ ), the resistance value of the substrate 18 in the region where the diffusion groove 19B is formed on the surface (hereinafter referred to as R3) is the resistance of the substrate 18 in the region where the evaporation groove 20 is formed on the surface. It is smaller than the value R2.

In this embodiment, the width d ₁ and the width d ₃ are about 10 mm, the width d ₂ is about 20 mm, and the total length of the supply groove 19A, the diffusion groove 19B, and the evaporation groove 20 is that of the substrate 6. It was designed to be almost the same as the width (10 cm).

  Here, the resistance value is a resistance value of the base 18 when both ends in the longitudinal direction of the vapor deposition boat 13 are connected to the resistance heating power supply Z as shown in FIG. The resistance values R1, R2, and R3 are connected in series. These resistance values R1, R2, and R3 can be obtained from R = ρ · l / S (ρ: resistance coefficient, l: length of substrate, S: vertical cross-sectional area of substrate). The values of ρ, l, and S are the values of the substrate 18 in the region where the respective concave grooves (the supply concave groove 19A, the evaporation concave groove 20, or the diffusion concave groove 19B) are formed. When the vertical cross-sectional area of the substrate 18 changes, for example, when the bottom surface of the supply groove 19A, the diffusion groove 19B, or the evaporation groove 20 is inclined, the average value is S.

The deposition boat 13 of the present embodiment, since a wider deposition region, towards the long l ₂ of the evaporation concave grooves 20, the length of the length l ₁ and diffusion groove 19B of the supply concave grooves 19A It is formed to be longer than l ₃ . Therefore, in order to lower the resistance values R1 and R3 below R2, the average value of the vertical cross-sectional areas of the bases 18 in the region where the supply groove 19A is formed and the region where the diffusion groove 19B is formed is This is larger than the average value of the vertical sectional areas of the substrate 18 in the region where the evaporation grooves 20 are formed.

  In this embodiment, when the resistance values R1 and R3 are 1, the resistance value R2 is 3 to 4 times.

  The ratio of the resistance value is not limited to this value, but at least the value obtained by dividing (dividing) the boiling point of the vapor deposition material by the melting point of the vapor deposition material is excessively increased in the vicinity of the supply groove 19A. It is possible to reduce melting of the (aluminum wire).

  In this example, under the condition of 10 Pa, the melting point of aluminum as a vapor deposition material is about 660 ° C., the boiling point is around 1300 ° C., and the value obtained by dividing the boiling point of the vapor deposition material by the melting point of the vapor deposition material is about 2. .

  The ratio of the resistance values is desirably 5 times or less. That is, the substrate 18 in the region where the supply groove 19A is provided needs to be heated to the melting point or higher of the vapor deposition material in the vapor deposition process described later. Therefore, when the ratio of the resistance values is larger than 5 times, the temperature of the base 18 in the region where the evaporation groove 20 is provided becomes very high, and the evaporation material becomes the evaporation groove 20. It evaporates before reaching the entire surface of the film, making it difficult to form a uniform rough film layer 7. Moreover, the radiant heat to the base material 6 increases, and the fine particles 8 grow, making it difficult to form the rough film layer 7 having small pores.

  In this embodiment, the supply groove 19A and the diffusion groove 19B are formed symmetrically at both ends of the groove 17. That is, the resistance values R1 and R3 are designed to be approximately the same value. As a result, both ends of the groove 17 are lowered in temperature with a similar temperature distribution, and the aluminum melted in the evaporation groove 20 is pulled to both ends of the groove 17.

  Note that the evaporation boat 13 can use a resistance heating material made of BN (boron nitride), W (tungsten), PBN (pyrolytic boron nitride), graphite, or a composite thereof.

  Hereinafter, the manufacturing method of the electrode foil 5 of a present Example is demonstrated.

In this example, the rough film layer 7 was formed by the resistance heating vapor deposition method using the vapor deposition apparatus 9 described above. In this embodiment, oxygen gas is used as the active gas, and argon gas is used as the inert gas.
(1) The inside of the vacuum chamber 10 shown in FIG. 2 is kept at a vacuum of 0.01 to 0.001 Pa.
(2) Oxygen gas and argon gas whose flow rate is 2 to 6 times that of the oxygen gas are introduced to the periphery of the substrate 6 through a gas pipe, and the pressure around the substrate 6 is set to 10 to 30 Pa. Put it in a state.
(3) The temperature of the substrate 6 is kept in the range of 150 to 300 ° C.
(4) An aluminum wire is supplied from the supply unit 14 shown in FIG. 2 to the supply groove 19A of the vapor deposition boat 13 shown in FIG.
(5) The vapor deposition boat 13 is heated by resistance heating, and the aluminum wire is melted by the supply groove 19A and poured into the evaporation groove 20. The aluminum wire that has flowed in spreads so as to be pulled also at the end of the diffusion groove 19B.
(6) The aluminum filled in the evaporating groove 20 is boiled and evaporated to deposit aluminum fine particles 8 on the surface of the substrate 6. The substrate 6 is transferred from the unwinding roller 11 to the take-up roller 12 in the direction of the arrow X, and the fine particles 8 are successively deposited on the surface of the substrate 6 sequentially.

  The above conditions such as pressure, gas pressure, and temperature are examples, but the rough film layer 7 can be formed by the above process.

  The effect of the present embodiment will be described below with reference to FIGS.

  FIG. 4 is an SEM photograph showing the electrode foil 5 taken from above when the vapor deposition boat 13 of this embodiment is used, and FIG. 12 uses a conventional vapor deposition boat (number 113 in FIG. 11A). It is the upper surface SEM photograph of the electrode foil 1 at the time of vapor-depositing. As shown in FIGS. 11A and 11B, in the conventional vapor deposition boat 113, a groove 118 having a constant width and depth is formed in a base 118. FIG.

  Comparing FIG. 4 and FIG. 12, it can be seen that the unevenness of the rough film layer 7 can be reduced visually. Further, FIG. 5 shows the capacity variation per unit area with respect to the electrode foil in the conventional example and the present embodiment, with the position in the length direction of the base material, that is, the feed direction of the base material (arrow X direction in FIG. It is measured. In FIG. 5, the conventional electrode foil 1 (electrode foil of FIG. 12) has a maximum capacity variation of about ± 40% per unit area, whereas the electrode foil 5 of the present embodiment has about ± 5%. You can see that it was suppressed.

  Thus, in this embodiment, it is possible to manufacture the electrode foil 5 having the uniform rough film layer 7 and less variation in capacitance.

  The reason is that heat generation around the supply ditch 19A can be suppressed by configuring the ditch 17 of the vapor deposition boat 13 as described above.

  Further, in the region where the supply groove 19A is formed, since the resistance of the base 18 is low, heat generation can be suppressed and radiant heat in the vicinity can also be suppressed. Therefore, the vapor deposition material supplied from the supply unit 14 can be prevented from being excessively melted before reaching the vapor deposition boat, and a constant amount can be stably supplied to the evaporation concave groove 20 at a constant speed. Moreover, since it becomes difficult for aluminum to melt | dissolve before a vapor deposition material reaches the vapor deposition boat 13, generation | occurrence | production of the aluminum oxide film by the thermal oxidation of the surface can be reduced. When this aluminum oxide film is formed, the boiling point rises, so that the evaporation rate with the exposed aluminum part changes. Therefore, suppressing the formation of the aluminum oxide film is useful for uniform evaporation.

  Furthermore, since the resistance of the base 18 is low in the region where the supply groove 19A is formed, heat generation can be suppressed, and the evaporation amount of the vapor deposition material in the supply groove 19A can be suppressed. In the present embodiment, the opening of the supply groove 19A is narrow, so that the evaporation amount can be more effectively suppressed. Therefore, it can suppress that the vapor deposition material supplied from the supply part 14 is heated by the latent heat from the evaporated fine particle 8. FIG. Therefore, the evaporation material can be prevented from being excessively melted before reaching the evaporation boat 13, and the evaporation material can be supplied uniformly into the concave groove 17. Moreover, thermal oxidation can also be suppressed and it can suppress that an oxide film is formed on the surface of vapor deposition material.

  As described above, in the present embodiment, the radiant heat from the vapor deposition boat 13 and the latent heat from the vapor deposition fine particles 8 can be reduced. A uniform electrode foil 5 with little variation in capacitance can be produced.

  When oxygen gas is introduced, an oxide film is easily formed. Therefore, suppressing the melting of the vapor deposition material in the vicinity of the supply groove 19A as in this embodiment is effective for forming a uniform film.

  Further, as in this embodiment, when active gas or inert gas is introduced and vapor deposition is performed under a relatively high pressure condition, the fine particles 8 are likely to combine and have a large latent heat. Reducing the evaporation amount is effective for forming a uniform film.

  Furthermore, in this embodiment, as can be seen from the top view of FIG. 4, the unevenness in the direction Y perpendicular to the feeding direction of the substrate 6 can also be reduced. The reason will be described below using a comparative example.

  FIG. 6 is a top view of an electrode foil for comparison, which is formed using a vapor deposition boat 213 shown in FIGS. 7 (a) and 7 (b). The vapor deposition boat 213 includes the supply groove 219A and the evaporation groove 220 as in the first embodiment, but the diffusion groove 19B is not formed. When the vapor deposition boat 213 of such a comparative example is used, unevenness may occur in the longitudinal direction of the vapor deposition boat 213, that is, in the direction Y perpendicular to the feed direction X of the base material 6, as shown in FIG.

  The reason for this is considered that molten aluminum is not spread over the entire groove 217. That is, in the configuration of the comparative example shown in FIGS. 7A and 7B, aluminum is not uniformly filled up to the end opposite to the side where the supply groove 219A is formed, and unevenness in the Y direction is caused. May be.

  On the other hand, in this embodiment, since the diffusion groove 19B is formed in the vapor deposition boat 13, the diffusion groove 19B side becomes a low temperature, and the molten aluminum is pulled. As a result, aluminum is uniformly melted in the groove 17 and can be uniformly deposited in the Y direction of the substrate 6.

  Further, in this embodiment, the supply groove 19A and the diffusion groove 19B are formed symmetrically, so that both end portions show the same temperature distribution. Then, the molten aluminum spreads over both ends of the supply groove 19A and the diffusion groove 19B, and the uniformity of the deposition can be improved more reliably.

(Example 2)
In this embodiment, as shown in FIG. 8A, the widths of the supply groove 22A, the evaporation groove 23, and the diffusion groove 22B of the vapor deposition boat 21 are all the same, and the substrate 24 itself The width is changed.

That is, in this embodiment, the width t ₁ and the width t ₃ of the base 24 in the region where the supply groove 22A and the diffusion groove 22B are formed on the surface are the evaporation grooves 23 formed on the surface. wider than the width t ₂ of the substrate 24 in the region, the supply concave groove 22A on the surface, the resistance value of each of the substrate 24 in the region where the diffusion concave groove 22B is formed, evaporating grooves 23 on the surface It formed so that it might become smaller than the resistance value of the base | substrate 24 of the formed area | region.

  Also in this embodiment, as in the first embodiment, evaporation grooves 23 are formed on the surface for the respective resistance values of the substrate 24 in the region where the supply grooves 22A and the diffusion grooves 22B are formed on the surface. The ratio of the resistance values of the substrate 24 in the region is preferably (boiling point of vapor deposition material) / (melting point of vapor deposition material) or more and 5 or less, and this ratio is also about 3 to 4 in this embodiment. .

  Thus, in this embodiment, it is possible to suppress the heat generation around the supply ditch 22A and to suppress the evaporation amount from the supply ditch 22A. Therefore, it can suppress that the vapor deposition material supplied from the supply part (14 of FIG. 2) melt | dissolves excessively before reaching the vapor deposition boat 21, and can prevent the thermal oxidation of the surface of vapor deposition material. As a result, the rough film layer 7 can be formed uniformly in the feed direction of the base material, and the electrode foil 5 with little capacity variation can be formed.

  Further, by lowering the temperature of the diffusion groove 22B, the molten aluminum can be spread to both ends of the groove 25. As a result, the rough film layer 7 can be formed uniformly in the direction perpendicular to the feed direction of the substrate (X direction in FIG. 2), and the electrode foil 5 with less capacity variation can be formed.

  In this embodiment, as shown in FIG. 8B, the supply groove 22A, the evaporation groove 23, and the diffusion groove 22B have the same depth. For example, the supply groove 22A It may be a structure that gradually increases from one end side toward the other end communicating with the evaporation groove 23, and in this case, the vapor deposition material is supplied from the supply groove 22 A to the evaporation groove 23. It can be moved more quickly.

  Description of other configurations and effects similar to those of the first embodiment will be omitted.

(Example 3)
In this embodiment, as shown in FIG. 9A, the widths of the supply groove 27A, the evaporation groove 28, and the diffusion groove 27B of the vapor deposition boat 26 are the same. Further, the width of the base 29 on which the supply groove 27A, the evaporation groove 28, and the diffusion groove 27B are respectively formed is also the same. As shown in FIG. 9B, the supply groove 27 </ b> A and the diffusion groove 27 </ b> B have a structure that gradually deepens from the respective end portions toward the evaporation groove 28.

  By deepening the groove from the end of the supply groove 27A toward the evaporation groove 28, the vapor deposition material can be quickly poured into the evaporation groove 28. Further, the upward slope of the vapor deposition material can be suppressed by providing an upward slope on the bottom surface from the evaporation groove 28 toward the end of the diffusion groove 27B.

  Also in the present embodiment, as in the first embodiment, the evaporation grooves 28 are formed on the surface with respect to the resistance values of the respective substrates 29 in the regions where the supply grooves 27A and the diffusion grooves 27B are formed. The ratio of the resistance values of the substrate 29 in the region is not less than a value obtained by dividing the boiling point of the vapor deposition material by the melting point of the vapor deposition material, and is preferably 5 or less, and this ratio is also about 3 to 4 in this embodiment.

  In this embodiment, since the resistance value and the cross-sectional area of the substrate 29 in the region where the supply groove 27A and the diffusion groove 27B are formed gradually change, the average value is used.

  Description of other configurations and effects similar to those of the first embodiment will be omitted.

  The present invention can increase the mass productivity of uniform and large-capacity electrode foils, and can be used as an anode foil or a cathode foil of an electrolytic capacitor.

DESCRIPTION OF SYMBOLS 5 Electrode foil 6 Base material 7 Coarse film layer 8 Fine particle 9 Deposition apparatus 10 Vacuum tank 11 Unwinding roller 12 Winding roller 13 Deposition boat 14 Supply part 15 Bobbin 16 Supply pipe 17 Concave groove 18 Base 19A Concave groove 19B Diffusion Groove 20 for evaporation 21 Groove 21 for evaporation 22B Groove for supply 22B Groove for diffusion 23 Groove for evaporation 24 Substrate 25 Groove 26 Deposition groove 27A Groove for supply 27B Groove for diffusion 28 Groove for evaporation 28 Groove 29 Base

Claims (6)

A boat for vapor deposition consisting of a substrate having a concave groove formed on the surface,
The groove is
A supply ditch that is disposed at at least one end and to which a vapor deposition material is supplied;
An evaporation groove that communicates with the supply groove and evaporates the vapor deposition material;
A communicating groove with the evaporation groove, and a diffusion groove disposed at the other end of the groove,
The ratio of the resistance value of the substrate in the region where the groove for evaporation is formed on the surface to the resistance value of the substrate in the region where the supply groove and the diffusion groove are formed on the surface is: A vapor deposition boat that is equal to or greater than a value obtained by dividing the boiling point of the vapor deposition material by the melting point of the vapor deposition material. 2. The vapor deposition boat according to claim 1, wherein both of the supply ditch and the diffusion ditch are narrower than the evaporation ditch. 2. The substrate according to claim 1, wherein each of the regions in which the supply grooves and the diffusion grooves are formed on the surface has a width wider than that of the region in which the evaporation grooves are formed on the surface. Deposition boat. The average value of the vertical cross-sectional area of each of the substrates in the region where the supply ditch and the diffusion ditch are formed on the surface,
The evaporation boat according to claim 1, wherein the evaporation boat according to claim 1 is larger than an average value of a vertical cross-sectional area of the substrate in a region where the groove for evaporation is formed on the surface. 2. The vapor deposition boat according to claim 1, wherein each of the supply groove and the diffusion groove has a structure that gradually increases from an outer end of the groove toward the evaporation groove side. A vapor deposition apparatus for depositing a molten vapor deposition material on the surface of a substrate in a vacuum chamber,
In the vacuum chamber,
The deposition boat is disposed at a position facing the surface of the substrate, and both ends are connected to a resistance heating power source, and
A supply unit for supplying a deposition material to the deposition boat;
A gas pipe for introducing gas into the vacuum chamber is provided at least,
The evaporation boat is
It consists of a substrate with a concave groove formed on the surface,
The groove is
A supply ditch that is disposed at at least one end and to which a vapor deposition material is supplied;
An evaporation groove that communicates with the supply groove and evaporates the vapor deposition material;
A communicating groove with the evaporation groove, and a diffusion groove disposed at the other end of the groove,
The ratio of the resistance value of the substrate in the region where the groove for evaporation is formed on the surface to the resistance value of the substrate in the region where the supply groove and the diffusion groove are formed on the surface is: The vapor deposition apparatus which is more than the value which remove | divided the boiling point of the said vapor deposition material by melting | fusing point of the said vapor deposition material.