JP2012235065A5 - - Google Patents

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JP2012235065A5
JP2012235065A5 JP2011104488A JP2011104488A JP2012235065A5 JP 2012235065 A5 JP2012235065 A5 JP 2012235065A5 JP 2011104488 A JP2011104488 A JP 2011104488A JP 2011104488 A JP2011104488 A JP 2011104488A JP 2012235065 A5 JP2012235065 A5 JP 2012235065A5
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mark
length
optical system
projection optical
substrate
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JP2012235065A (en
JP5773735B2 (en
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上記課題を解決するために、本発明は、影光学系を介して原版のパターンを基板に投影露光する露光装置であって、原版を保持し、投影光学系の光軸に直交る第1方向および、光軸および第1方向に直交する第2方向可動で、第1方向における位置合わせに用いられる第1マークおよび第2方向における位置合わせに用いられる第2マークを有する原版保持部と、基板を保持し、第1方向および第2方向可動で、第1方向における位置合わせに用いられる第3マークおよび第2方向における位置合わせに用いられる第4マークを有する基板保持部と、第1マーク、投影光学系よび第3マークを通過した光量、および、第2マーク、投影光学系よび第4マークを通過した光量をそれぞれ検出する検出部と、原版保持部を第2方向に移動させながら基板保持部を第1方向に移動させるとともに原版保持部を第1方向に移動させながら基板保持部を第2方向に移動させたときの検出部の出力に基づいて、原版保持部と基板保持部との第1方向における位置合わせを行わせるとともに第2方向における位置合わせを行わせる制御部と、を備え、投影光学系の像面における第1マークの第2方向の長さは、第3マークの第2方向の長さよりも大きく、かつ、投影光学系の像面における第2マークの第1方向の長さは、第4マークの第1方向の長さよりも大きい、または、投影光学系の像面における第1マークの第2方向の長さは、第3マークの第2方向の長さよりも小さく、かつ、投影光学系の像面における第2マークの第1方向の長さは、第4マークの第1方向の長さよりも小さいことを特徴とする。 In order to solve the above problems, the present invention is an exposure apparatus for projection exposure onto the substrate a pattern of an original through a light projecting projection optical system, holds the original, first you orthogonal to the optical axis of the projection optical system 1 direction and movable in a second direction perpendicular to the optical axis and the first direction, the original holding having a second mark for use in alignment in the first mark and the second direction are used for alignment in the first direction A substrate holding unit that holds the substrate, is movable in the first direction and the second direction , and has a third mark used for alignment in the first direction and a fourth mark used for alignment in the second direction ; , the first mark, the amount of light passing through the third mark and contact projection optical system, and a second mark, a detector for detecting the amount of light passing through the fourth mark and your projection optical system, respectively, the original holding portion second direction While it moved based on an output of the detecting unit when moving the substrate holding portion while moving the original holding section in the first direction moves the substrate holding portion in a first direction to a second direction, and the original holder A control unit that performs alignment in the first direction with the substrate holding unit and alignment in the second direction, and the length of the first mark in the image plane of the projection optical system in the second direction is: The length of the third mark is larger than the length of the second mark in the second direction, and the length of the second mark on the image plane of the projection optical system in the first direction is larger than the length of the fourth mark in the first direction. The length of the first mark in the second direction on the image plane of the optical system is smaller than the length of the third mark in the second direction, and the length of the second mark in the first direction on the image plane of the projection optical system. Is longer than the length of the fourth mark in the first direction. Characterized in that again.

Claims (5)

投影光学系を介して原版のパターンを基板に投影露光する露光装置であって、
前記原版を保持し、前記投影光学系の光軸に直交する第1方向、および、前記光軸および前記第1方向に直交する第2方向に可動で、前記第1方向における位置合わせに用いられる第1マークおよび前記第2方向における位置合わせに用いられる第2マークを有する原版保持部と、
前記基板を保持し、前記第1方向および前記第2方向に可動で、前記第1方向における置合わせに用いられる第3マークおよび前記第2方向における置合わせに用いられる第4マークを有する基板保持部と、
前記第1マーク、前記投影光学系および前記第3マークを通過した光量、および、前記第2マーク、前記投影光学系および前記第4マークを通過した光量をそれぞれ検出する検出部と、
前記原版保持部を前記第2方向に移動させながら前記基板保持部を前記第1方向に移動させるとともに前記原版保持部を前記第1方向に移動させながら前記基板保持部を前記第2方向に移動させたときの前記検出部の出力に基づいて、前記原版保持部と前記基板保持部との前記第1方向における置合わせを行わせるとともに前記第2方向における置合わせを行わせる制御部と、を備え、
前記投影光学系の像面における前記第1マークの前記第2方向の長さは、前記第3マークの前記第2方向の長さよりも大きく、かつ、前記投影光学系の像面における前記第2マークの前記第1方向の長さは、前記第4マークの前記第1方向の長さよりも大きい、
または、前記投影光学系の像面における前記第1マークの前記第2方向の長さは、前記第3マークの前記第2方向の長さよりも小さく、かつ、前記投影光学系の像面における前記第2マークの前記第1方向の長さは、前記第4マークの前記第1方向の長さよりも小さいことを特徴とする露光装置。
An exposure apparatus that projects and exposes an original pattern onto a substrate via a projection optical system,
The original is held and is movable in a first direction orthogonal to the optical axis of the projection optical system and a second direction orthogonal to the optical axis and the first direction, and is used for alignment in the first direction. An original holding unit having a first mark and a second mark used for alignment in the second direction;
Holding said substrate at said first and second directions on the movable, has a fourth mark used in the position alignment in the third mark and the second direction is used to position adjustment in the first direction A substrate holder,
A detector that detects the amount of light that has passed through the first mark, the projection optical system, and the third mark, and the amount of light that has passed through the second mark, the projection optical system, and the fourth mark;
The substrate holding part is moved in the first direction while moving the original holding part in the second direction, and the substrate holding part is moved in the second direction while moving the original holding part in the first direction. based on the output of the detector obtained while, and the original holder and the control unit to perform the position alignment in the second direction together with to perform position alignment in the first direction and the substrate holding portion With
The length of the first mark in the image plane of the projection optical system in the second direction is larger than the length of the third mark in the second direction, and the second mark in the image plane of the projection optical system. A length of the mark in the first direction is greater than a length of the fourth mark in the first direction;
Alternatively, the length in the second direction of the first mark on the image plane of the projection optical system is smaller than the length in the second direction of the third mark, and the length on the image plane of the projection optical system. The length of the second mark in the first direction is smaller than the length of the fourth mark in the first direction.
前記第1マークの前記第2方向の長さをL1Yとし、
前記第2マークの前記第1方向の長さをL1Xとし、
前記第3マークの前記第2方向の長さをL2Yとし、
前記第4マークの前記第1方向の長さをL2Xとし、
前記第1方向における置合わせに要求される前記原版保持部の移動量をDXとし、
前記第2方向における置合わせに要求される前記原版保持部の移動量をDYとすると、
L1Y≧L2Y+2×DY、および、L1X≧L2X+2×DXが成立するように構成されている、
または、L2Y≧L1Y+2×DY、および、L2X≧L1X+2×DXが成立するように構成されていることを特徴とする請求項1に記載の露光装置。
The length of the first mark in the second direction is L1Y,
The length of the second mark in the first direction is L1X,
The length of the third mark in the second direction is L2Y,
The length of the fourth mark in the first direction is L2X,
The movement amount of the original holder is required to position adjustment in the first direction and DX,
When the amount of movement of the original holder is required to position adjustment in the second direction and DY,
L1Y ≧ L2Y + 2 × DY and L1X ≧ L2X + 2 × DX are established.
The exposure apparatus according to claim 1, wherein L2Y ≧ L1Y + 2 × DY and L2X ≧ L1X + 2 × DX are established.
前記制御部は、前記第1方向における置合わせを行わせるとともに前記第2方向における置合わせを行わせた後に、前記原版保持部または前記基板保持部を前記投影光学系の前記光軸に平行な方向に移動させたときの前記検出部の出力に基づいて、合焦位置を求めることを特徴とする請求項1または請求項2に記載の露光装置。 Wherein, after together to perform position alignment in the first direction to perform the position adjustment in the second direction, the master holder or the substrate holder in the optical axis of the projection optical system The exposure apparatus according to claim 1, wherein an in-focus position is obtained based on an output of the detection unit when moved in a parallel direction. 前記検出部は、光電変換素子を含む、
ことを特徴とする請求項1ないし請求項3のいずれか1項に記載の露光装置。
The detection unit includes a photoelectric conversion element,
The exposure apparatus according to any one of claims 1 to 3, wherein the exposure apparatus is characterized in that:
請求項1ないし請求項4のいずれか1項に記載の露光装置を用いて基板を露光する工程と、
前記工程で露光された前記基板を現像する工程と、
を含むことを特徴とするデバイス製造方法。
A step of exposing the substrate using the exposure apparatus according to any one of claims 1 to 4,
Developing the substrate exposed in the step;
A device manufacturing method comprising:
JP2011104488A 2011-05-09 2011-05-09 Exposure apparatus and device manufacturing method Active JP5773735B2 (en)

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JP2012235065A5 true JP2012235065A5 (en) 2014-07-03
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6685821B2 (en) 2016-04-25 2020-04-22 キヤノン株式会社 Measuring apparatus, imprint apparatus, article manufacturing method, light quantity determination method, and light quantity adjustment method
JP7361599B2 (en) 2019-12-26 2023-10-16 キヤノン株式会社 Exposure equipment and article manufacturing method

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* Cited by examiner, † Cited by third party
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JP3450343B2 (en) * 1992-01-06 2003-09-22 キヤノン株式会社 Projection exposure apparatus and method for manufacturing semiconductor device using the same
JP3252526B2 (en) * 1993-04-09 2002-02-04 キヤノン株式会社 Position detecting device and method of manufacturing semiconductor device using the same
JP2000338683A (en) * 1999-05-28 2000-12-08 Nikon Corp Aligner and exposure method
JP2001044098A (en) * 1999-07-26 2001-02-16 Nikon Corp Aligner and position detection method therefor
JP2009065061A (en) * 2007-09-07 2009-03-26 Canon Inc Exposure system, method of exposure, and method of manufacturing device
JP5457767B2 (en) * 2009-09-08 2014-04-02 キヤノン株式会社 Exposure apparatus and device manufacturing method

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