JP2012232433A - Heat press device and method for manufacturing circuit board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a superior circuit board without deformation of a through-hole by measuring a relative moving amount between hot plates of a heat press device and ensuring the invariable relative moving amount.SOLUTION: The heat press device is characterized in that measure means which measure the relative moving amount between the hot plates are attached to two adjacent hot plates. An omnidirectionaly deformable and highly flexible material is positioned between the hot plates, and the relative moving amount between the hot plates is measured while pressurized in a normal temperature state, thereby adjusting of the relative moving amount is facilitated and the invariable relative moving amount is ensured by using the heat press device. Accordingly, the superior circuit board without deformation of a through-hole is manufactured and provided.

Description

  The present invention relates to a heat press apparatus used for manufacturing a circuit board and a method for manufacturing a circuit board using the same.

  In recent years, with the miniaturization and high density of electronic devices, there has been a strong demand for multilayer substrates not only for industrial use but also for consumer use.

  In particular, as the density of a multilayer substrate increases, circuit patterns become finer, and it is desired to reduce the thickness of the substrate together with a plurality of circuit patterns.

  In such a circuit board, it is indispensable to newly develop a connection method for connecting inner via holes between circuit patterns of a plurality of layers and a highly reliable structure. Proposed high density circuit board manufacturing methods have been proposed.

  Hereinafter, the hot press apparatus used for circuit board manufacture will be described.

  5 and 6 are partial front views of a heat press apparatus having a multi-stage hot plate used for manufacturing a conventional circuit board. FIG. 5 shows a state where the hot plate is lowered and FIG. 6 shows a state where the hot plate is raised. ing.

  5 and 6, reference numeral 21 denotes a fixed platen disposed at the uppermost stage of the heat press apparatus, and 22 denotes a movable platen fixed to the upper part of the ram 24 that moves up and down. Reference numerals 23a to 23e denote heat plates whose temperature can be controlled by a heat medium or the like. In the figure, the number of heat plates is five. The hot platen 23a is fixed to the fixed platen 21 and does not move up and down. The hot plates 23b to 23d are stopped at a predetermined position of the guide 25 arranged at the four corners of the hot plate, and have a structure that does not move below the predetermined position.

  The hot platen 23e is fixed to the movable platen 22 and moves up and down together with the ram 24.

  FIG. 6 shows a state in which the heating plates 23a to 23e are raised and pressurized. However, the ram 24 is raised by supplying pressurized oil from a cylinder (not shown), and the movable plate 22 fixed to the ram 24 It rises and pressurizes with the hot platen 23e. As the ram 24 rises, the hot platen 23e comes into contact with the hot platen 23d, the hot platen 23c, and the hot platen 23b to raise each hot platen, and pressurizes after contacting the hot platen 23a fixed to the fixed platen 21. It has become. The circuit board is heated and pressurized after a plurality of products are placed on the hot platen 23b to 23e via a SUS plate and the hot platen 23e to hot platen 23b are raised and brought into contact with the hot platen 23a. Heat and pressurize using a temperature and pressure program according to the product.

  Since the parallelism between hot plates is directly reflected in the thickness of the product in a hot press device, adjustments such as inserting a shim between the movable platen and the ram to ensure the target value of parallelism, etc. Measures are taken.

  As prior art document information related to the invention of this application, for example, Patent Documents 1 and 2 are known.

JP 2003-340854 A JP 2008-36852 A

  The inventor of the present application has found the following problems in a hot press apparatus used for manufacturing the above-described conventional circuit board.

  That is, as shown in FIG. 7, a through hole 30 is formed using a laser processing machine or the like, and a conductive paste such as copper is filled in the through hole 30, for example, a glass cloth impregnated with an epoxy resin. Even when a two-layer circuit board having copper foils 28 arranged on both sides is heated and pressed using a hot press device, all through holes 30 formed in the prepreg 29 are deformed in the same direction as shown in FIG. May occur.

  The inventor of the present application has confirmed that the plate thickness after hot pressing of the prepreg in which the through hole is deformed is uniform, and the parallelism of the hot platen has no problem.

  In addition, the inventor of the present application further advances the cause of the failure, and heats and pressurizes in a state where shearing force is generated due to the relative accuracy of the ram ascending and the horizontal displacement between the heating plates within the clearance of each heating plate and the guide. The first problem that deformation of the through-hole occurs in the melting temperature region of the prepreg where the flow resistance is reduced, and even if the amount of movement of the hot platen is measured by bringing the hot plates into contact with each other, the entire hot platen moves. However, the second problem that the relative movement amount is not seen because it moves in synchronism with the frictional resistance between the heating plates was grasped.

  In order to solve the above-mentioned problems, the hot press device of the present invention is characterized in that a means for measuring the amount of relative movement between the hot plates is attached to two adjacent hot plates. It is possible to measure the relative movement amount. In other words, a highly flexible material that can be deformed in all directions is placed between the hot plates, and the relative moving amount can be easily adjusted by measuring the relative moving amount between the hot plates while pressurizing at normal temperature. An object of the present invention is to provide a hot press apparatus that can manufacture a high-quality circuit board without deformation of a through-hole by securing a moving amount.

  In order to achieve the above object, the heat press device of the present invention includes a fixed platen-side heat platen fixed to a fixed platen arranged at the top of the heat press device, and a movable platen fixed to the movable platen that moves up and down. A heating plate on the side, a plurality of heating plates between the heating plate on the fixed platen side and the heating plate on the movable platen side, and means for measuring the relative movement amount between the heating plates on two adjacent heating plates Is attached.

  Moreover, the manufacturing method of the circuit board using the hot press apparatus of this invention arrange | positions the hot-plate movement amount measuring material between two adjacent hot-plates of the hot press apparatus of Claim 1, and raises a pressure. Measuring a relative movement amount between two heating plates using a measuring means, a step of confirming that the relative movement amount is within a certain value, and a circuit board forming material between the heating plates. The circuit board forming material is formed by laminating copper foil on both sides of a prepreg in which a through-hole is filled with a conductive paste. By using the heat press apparatus of the invention, it is possible to produce and provide a high-quality circuit board that effectively acts as one block guarantee process in the circuit board production process and has no deformation of the through hole.

  The hot press device of the present invention can measure the relative displacement between the hot plates, arranges a highly flexible material that can be deformed in all directions between the hot plates, and pressurizes the hot plate while pressing at normal temperature. By measuring the amount of relative movement between them, it is easy to adjust the amount of relative movement, and a hot press device that can secure a certain amount of relative movement is provided. A simple circuit board can be manufactured and provided.

FIG. 2 is a partial front view of a heat plate relative displacement measurement explanation in the left-right direction of the hot press device according to the embodiment of the present invention. Configuration diagram of hot plate movement measurement material in the same embodiment Side view of partial explanation of measurement of relative displacement of hot platen in the front-rear direction of the hot press device in the same embodiment Measurement graph of relative movement amount of hot press device in same embodiment Partial front view of a conventional heat press device Partial front view of a conventional hot press device when the hot platen is raised The figure which shows an example of the circuit board structure manufactured with the conventional heat press apparatus Via deformation explanatory diagram of circuit board manufactured with conventional heat press equipment

(Embodiment)
Hereinafter, a hot press apparatus of the present invention and a method of manufacturing a circuit board using the same will be described.

  FIG. 1 is a partial front view for explaining the measurement of the relative movement of the hot platen in the left-right direction of the hot press device according to the embodiment of the present invention, FIG. It is a partial side view explaining the measurement of the relative movement of the hot platen.

  In FIG. 1, reference numeral 1 denotes a fixed platen disposed at the uppermost stage of the heat press apparatus, and 2 denotes a movable platen fixed to the upper part of the ram 4 that moves up and down. Reference numerals 3a to 3e denote heat plates whose temperature can be controlled by a heat medium or the like. In the figure, the number of heat plates is five.

  The hot platen 3 a is fixed to the fixed platen 1 and does not move up and down, and the hot platen 3 e is fixed to the movable platen 2 and moves up and down together with the ram 4. Further, a hot platen 3b to a hot platen 3d are provided between the hot platen 3a on the fixed platen 1 side and the hot platen 3e on the movable platen 2 side.

  The plurality of heating plates 3b to 3d are stopped at a predetermined position of the guide 5 arranged at the four corners of the heating plate, and have a structure that does not move downward from the predetermined position. The hot platen 3 e is fixed to the movable platen 2 and moves up and down together with the ram 4.

  The feature of the hot press apparatus in the present embodiment is that a measuring means for measuring the relative movement amount between the hot plates is attached to two adjacent hot plates. In addition, the form of the detachable measuring means as a simple example will be described later.

  Reference numeral 6 denotes a hot platen moving amount measuring material. As shown in FIG. 2, a 1 mm-thick silicone rubber sheet 7 is used as an elastic sheet, and copper foils 8 are provided on both sides to protect the hot platen surface. It is arranged. The elastic sheet desirably has a relatively low hardness. In the present embodiment, a rubber sheet having a rubber hardness of 20 degrees is used.

  First, a method for measuring the amount of relative movement between the hot platen 3a and the hot platen 3b on the fixed platen 1 side will be described.

  Although the drawing is omitted, first, the above-described hot platen moving amount measuring material 6 is arranged on the hot platen 3b in a state where the ram 4 is in the lowest point state and the hot plates 3a to 3e are not in contact. In the embodiment, only the relative movement amount between the hot platen 3a and the hot platen 3b is measured, so that the hot platen moving amount measuring material 6 is arranged only on the hot platen 3b. However, the hot platen is also moved to the hot platen 3c to the hot platen 3e. A quantity measuring material 6 may be arranged.

  In the embodiment, only the hot platen moving amount measuring material 6 is used. However, in order to facilitate handling, the hot platen moving amount measuring material 6 is sandwiched between metal plates or the like used during hot pressing. You may arrange | position and may divide | segment the hot-plate movement amount measuring material 6 into several sheets, and may arrange | position.

  Next, as shown in FIG. 1, pressure oil is supplied from a cylinder (not shown) to raise the ram 4 and raise it together with the movable platen 2 and the hot platen 3 e fixed to the ram 4.

  As the ram 4 rises, the hot platen 3e comes into contact with the hot platen 3d, the hot platen 3c, and the hot platen 3b to raise each hot platen, and stops rising immediately before contacting the hot platen 3a fixed to the fixed platen 21. To do. After stopping, as shown in FIG. 1, detachable measurement blocks 11 are attached at two measurement positions of the hot platen 3a.

  The measuring block 11 constituting the measuring means of the hot press apparatus of the present embodiment is a 25 mm cubic magnet bonded with a square column having a side of 25 mm and a length of 100 mm. It is fixed with.

  Next, a magnet stand 10 is attached to the heating plate 3b side, and a probe of a dial gauge 9 which is a measuring device constituting a measuring means attached to the arm of the magnet stand 10 is placed on one side of the measuring block 11 from the lateral direction. Touch the dial gauge 9 to the zero point of the measurement origin.

  Thereafter, the ram 4 is raised to contact the hot platen moving amount measuring material 6 on the hot platen 3b, and the scale of the dial gauge 9 is read while increasing the pressure so that the horizontal direction relative between the hot platen 3a and the hot platen 3b is increased. Measure the amount of movement.

  Next, a method for measuring the relative amount of movement between the hot platen 3a and the hot platen 3b in the front-rear direction will be described.

  Since the movement amount measurement between the heating plates in the front-rear direction can be measured in front of the heating plate that can secure a measurement space, the measurement block used in the measurement of the movement amount between the heating plates in the left-right direction becomes unnecessary.

  As shown in FIG. 1, after placing the hot platen moving amount measuring material 6 on the hot platen 3b as shown in FIG. 1, the pressure oil is supplied from a cylinder (not shown) to make the ram 4 as shown in FIG. It is raised together with the movable platen 2 and the hot platen 3e fixed to the ram 4. As the ram 4 rises, the hot platen 3e comes into contact with the hot platen 3d, the hot platen 3c, and the hot platen 3b to raise each hot platen, and stops rising immediately before coming into contact with the hot platen 3a fixed to the fixed platen 1. To do.

  Then, as shown in FIG. 3, the magnet stand 10 is attached to two places on the heating plate 3b side in the same manner as the measurement in the left-right direction, and the dial gauge 9 probe attached to the arm of the magnet stand 10 is used to measure the heating plate 3a. The dial gauge 9 is adjusted to zero at the measurement origin by contacting the part.

  Thereafter, the scale of the dial gauge 9 is read while raising the pressure by raising the ram 4 and bringing the hot platen moving amount measuring material 6 on the hot platen 3b into contact with the hot platen 3b. Can be measured.

  FIG. 4 shows the result of measurement of the relative amount of movement between the hot platen 3a and the hot platen 3b in the front-rear direction.

  From this result, it can be seen that the lower heat platen 3b moves to the back side and the amount of movement differs between the left and right sides, so that the heat platen 3b rotates to the right while moving in the back direction.

  The inventor has confirmed that the deformation of the through-hole is eliminated when the relative movement amount between the left and right sides is within 50 μm by using the above-described method for measuring the relative movement amount between the hot plates.

  The confirmation operation that the relative movement amount is within a certain value can be regarded as one block guarantee process in the circuit board manufacturing process, and can be used for manufacturing the circuit board. The case will be described below (not shown).

  First, a circuit board forming material in which copper foils are laminated on both sides of a prepreg in which through holes are filled with a conductive paste is prepared.

  Next, a hot platen moving amount measuring material is disposed between two adjacent hot plates of the heat press apparatus of the present embodiment, and the relative moving amount between the two hot plates is measured while increasing the pressure. To measure.

  Next, it is confirmed that the relative movement amount is within a certain value, that is, within 50 μm.

  Next, the circuit board forming material is placed between the hot plates and heated and pressed to form a copper clad laminate.

  Then, a circuit is formed on the surface layer of the copper-clad laminate using a photographic method and an etching method to obtain a circuit board.

  In the above circuit board manufacturing method, a hot platen moving amount measuring material was used to measure the relative moving amount, but a circuit in which copper foils are laminated on both sides of a prepreg filled with a conductive paste in a through hole. It is also possible to prepare a substrate forming material separately and use it as a hot platen moving amount measuring material, and more realistically confirm the deformation of the through hole as well as the measurement of the relative moving amount.

  In this case, the circuit board manufacturing method includes the following steps (not shown).

  First, a circuit board forming material in which copper foil is laminated on both sides of a prepreg filled with a conductive paste in a through hole, and a hot platen movement amount measuring material in which copper foil is laminated on both sides of a prepreg in which a through hole is filled with a conductive paste Prepare.

  Next, a hot platen moving amount measuring material is disposed between two adjacent hot plates of the hot press device of the present embodiment, and heated and pressed to form a laminated plate of the hot platen moving amount measuring material.

  Next, it is confirmed that the relative movement amount of the laminate of the hot plate movement amount measuring material is within a certain value, that is, within 50 μm. The confirmation work in this case is a method of confirming by X-ray projection of the upper side and the lower side of the through hole filled with the conductive paste, in addition to the method of confirming with the measuring means of the hot press device of the present embodiment, or It can also be confirmed by cross-sectional analysis.

  Next, the circuit board forming material is placed between the hot plates and heated and pressed to form a copper clad laminate.

  Then, a circuit is formed on the surface layer of the copper-clad laminate using a photographic method and an etching method to obtain a circuit board.

  In the above circuit board manufacturing method, it has been explained that the relative movement amount is within a certain value, that is, within 50 μm. However, when the relative movement amount exceeds 50 μm, the next process is temporarily stopped. However, it is desirable to adjust the hot press apparatus.

  As a result, the hot press device and the inspection method for the hot press device according to the present embodiment effectively operate as one block guarantee process in the circuit board manufacturing process, and there is no deformation of the through hole. Can be manufactured and provided.

  Since the lower hot platen is in contact with the upper hot plate while moving, the upper hot plate weight is added even if the rise of the hot plate is stopped immediately before contacting the hot platen 3a. In order to cancel the influence of the weight, it is only necessary to stop immediately before the upper heating plate to be contacted first, set the measuring instrument, raise the heating plate, and then measure. If the measured value fluctuates before coming into contact with the upper hot platen due to the inclination of the hot platen side or the like, the measurement may be performed by setting a measuring instrument with the minimum pressure of the hot press device applied.

  In addition, since the measurement in the left-right direction in the present embodiment has no measurement space in the lateral direction of the hot press device, the measurement was made using a prismatic measurement block on the front side, but the measurement space on both sides of the hot platen If there is, the magnet stand 10 is attached to either the hot platen 3b or the hot platen 3b and the dial gauge 9 attached to the arm of the magnet stand 10 is brought into contact with the other hot plate in the same manner as in the longitudinal measurement. That's fine.

  Although a contact-type measuring device is used here as a measuring device, non-contact measurement such as an optical method or a form using laser light may be used.

  Furthermore, it is also possible to attach fixed measuring means in the left-right direction and the front-rear direction between two adjacent hot plates.

  As described above, the hot press apparatus of the present invention is characterized in that the measuring means for the relative movement amount between the hot plates is attached to two adjacent hot plates.

  For this reason, it is easy to adjust the relative movement amount by measuring the relative movement amount between hot plates while applying pressure at room temperature. By using the hot press device, a high-quality circuit without deformation of the through-holes can be obtained. A substrate can be manufactured and provided, and the industrial applicability of the present invention is great.

1, 21 Fixed platen 2, 22 Movable platen 3a-3e, 23a-23e Hot platen 4, 24 Ram 5, 25 Guide 6 Hot platen moving amount measuring material 7 Silicone rubber sheet
8, 28 Copper foil 9 Dial gauge 10 Magnet stand 11 Measurement block 29 Prepreg 30 Through hole

Claims (12)

A fixed platen-side heat platen fixed to a fixed platen arranged at the top of the heat press device;
A heating platen on the movable platen side fixed to the movable platen that moves up and down;
A plurality of heat plates are provided between the fixed plate side heat plate and the movable plate side heat plate,
A heat press apparatus characterized in that a measuring means for measuring a relative movement amount between the two heating plates is attached to two adjacent heating plates. 2. The hot press apparatus according to claim 1, wherein the measuring means is attached in the left-right direction and the front-rear direction between two adjacent hot plates. The hot press apparatus according to claim 1, wherein the measuring means is detachable. The measuring means is composed of a measuring block attached to one of the two adjacent heat plates, and a measuring instrument having a probe attached to the other heat plate,
The hot press apparatus according to claim 1, wherein the measuring device can be adjusted to a measurement origin when the measuring element is brought into contact with a side of the measuring block. A hot platen moving amount measuring material is disposed between two adjacent hot plates of the hot press device according to claim 1, and the relative moving amount between the two hot plates is measured using a measuring means while increasing the pressure. And a process of
Confirming that the amount of relative movement is within a certain value;
A step of placing and forming a circuit board forming material between the heating plates and heating and pressurizing,
The material for forming the circuit board is:
A method of manufacturing a circuit board, wherein a copper foil is laminated on both sides of a prepreg in which through holes are filled with a conductive paste. 6. The method of manufacturing a circuit board according to claim 5, wherein the measurement of the relative movement amount is performed in a left-right direction and a front-rear direction between two adjacent heating plates. The method for manufacturing a circuit board according to claim 5, wherein the hot platen moving amount measuring material is obtained by laminating copper foils on both sides of an elastic sheet. The method for manufacturing a circuit board according to claim 7, wherein the elastic sheet is a silicone rubber sheet having a rubber hardness of 20 degrees. 6. The method of manufacturing a circuit board according to claim 5, wherein the hot platen moving amount measuring material is arranged in a state of being sandwiched between metal plates. 6. The method of manufacturing a circuit board according to claim 5, wherein the relative movement amount is measured between all adjacent hot plates of the hot press apparatus. Prepared circuit board forming material with copper foil laminated on both sides of prepreg filled with conductive paste in through hole and hot plate movement measuring material with copper foil laminated on both sides of prepreg filled with conductive paste in through hole And a process of
A step of placing a hot platen moving amount measuring material between two adjacent hot plates of the heat press device according to claim 1 to form a laminated plate of the hot platen moving amount measuring material by heating and pressing,
A step of confirming that the relative movement amount of the laminate of the hot platen movement amount measuring material is within a certain value;
Placing the circuit board forming material between the hot plates and heating and pressing to form a copper clad laminate; and
And a step of forming a circuit on a surface layer of the copper clad laminate. 12. The circuit board manufacturing method according to claim 5, wherein the constant value is within 50 [mu] m.

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