JP2012232392A - Slitter device, and slitter machining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a slitter device capable of preventing peeling or the like during cutting of a transfer ribbon or the like, and to provide a slitter machining method.SOLUTION: The slitter device for cutting a long base material with a prescribed width includes: unwinding means for unwinding a long base material having a transfer layer formed on one surface; a slitter for cutting the long base material with a prescribed width; a conveyance roll for maintaining tension at a contact between the long base material and the slitter; an inversion roll for contact with the slitter on the transfer layer forming surface of the long base material; and winding means for winding the cut long base material. The slitter machining method is characterized in that the slitter device conveys the long base material having the transfer layer formed on one surface while maintaining tension between two conveyance rolls, and bringing the slitter for cutting the roll base material with a prescribed width to cut from the surface of the roll base material, where the transfer layer is formed.

Description

  The present invention relates to a slitter apparatus and a slitter processing method for cutting a roll-shaped or long-sized substrate having a transfer layer formed on one side thereof into a predetermined width.

  As a method of forming a figure, a pattern or the like on a target article for the purpose of decoration or forgery prevention, a method of transferring a transfer foil to a transfer target is known. The transfer foil is used as a transfer ribbon in which a transfer layer such as a metal foil, an ink, and an adhesive layer is provided on a base material, and a release layer is provided on the surface of the base material in order to improve the peelability of the transfer layer. Is common.

  The transfer ribbon is produced in a state of being cut into an appropriate width in accordance with the width of the transfer object and wound up in a roll shape. As described in Patent Document 1, the cutting at this time is performed by cutting the conveyed substrate with a transfer layer in the conveying direction with a slitter while conveying it, and winding it into a ribbon having an appropriate width. .

Japanese Patent No. 3350286

  However, as shown in FIG. 5, when the transfer ribbon having the transfer layer 53 provided on one surface of the substrate 72 is cut by the slitter 71, a transfer layer peeling 74 occurs at the time of cutting, and this causes the transfer layer to be transferred to the transfer object. When transferring, there is a possibility of mixing as a foreign substance. This becomes a problem particularly when a brittle material such as a metal foil is used as the transfer foil material.

  In view of the above-described problems, the present invention provides a slitter device and a slitter processing method that do not cause peeling or the like when cutting a transfer ribbon or the like.

The invention according to claim 1 for solving the above problem is a slitter device for cutting a long base material with a predetermined width, and winding the long base material having a transfer layer formed on one surface thereof. Unwinding means for feeding out, slitter for cutting the long base material with a predetermined width, a transport roll for maintaining tension at the contact portion between the long base material and the slitter, and a transfer layer for the long base material A reversing roll for contacting the slitter on the surface, and a winding means for winding the cut long substrate;
Is a slitter device characterized by comprising at least.
The invention according to claim 2 is a slitter device characterized in that the slitter according to claim 1 is made of a carbide blade.
In the invention according to claim 3, tension is applied between two conveying rolls in which a long base having a transfer layer formed on one surface is disposed with a slitter for cutting the long base with a predetermined width. The slitter processing method is characterized in that the slitter processing method is characterized in that the slitter is brought into contact with and cut from the surface of the long base material on which the transfer layer is formed.
The invention according to claim 4 is the slitter processing method according to claim 3, wherein the tension between the two transport rolls is 0.1 to 15N.

  According to the present invention, while maintaining the tension at the contact portion between the long base material and the slitter, which is a transfer ribbon, by cutting the contact surface with the slitter on the surface of the long base material, A slitting method and a slitting apparatus with less peeling of the transfer layer can be realized.

It is a schematic diagram which shows one Embodiment of the transfer ribbon which concerns on this invention. It is a schematic diagram of the slitter apparatus which concerns on one Embodiment of this invention. It is the schematic diagram which expanded the slitter part of the slitter apparatus which concerns on one Embodiment of this invention. It is a schematic diagram of the slitter apparatus in embodiment of a comparative example. It is an enlarged photograph of the base-material surface after the slitter process in an Example. It is an enlarged photograph of the base-material surface after the slitter process in a comparative example. It is a schematic diagram for demonstrating the problem at the time of the conventional slitter process.

  FIG. 1 shows an embodiment of a transfer ribbon. In the example of FIG. 1, the transfer layer 12 including the release layer 121 and the adhesive layer 122 is formed on the substrate 11. Further, another layer may be added between the release layer and the adhesive layer.

  As the base material 11, what is necessary is just what was provided with sheet-like and film-like flexibility, and a polyester film (PET, PEN), a polyethylene film, a vinyl chloride film, polyvinyl alcohol, etc. can be mentioned. A polyethylene terephthalate (PET) film is particularly preferable from the viewpoints of surface smoothness, dimensional stability, heat resistance, workability, economy, toughness, and the like.

  The release layer 121 is provided at the interface with the substrate 11 and is a layer for facilitating the release from the substrate to the transfer target, and becomes a protective layer after transfer. The release layer is a resin having releasability with respect to the substrate, and is formed of a single material or a mixture of materials such as acrylic resin, cellulose resin, and wax.

  The adhesive layer 122 forms the adhesive layer 4 on the resurface on the transfer side. For example, the adhesive layer can be formed by applying and drying a coating solution mainly composed of vinyl chloride-vinyl acetate copolymer / polyester resin on the heat-resistant layer.

  As the other layer formed between the release layer and the adhesive layer, an embossed hologram layer composed of a resin layer formed by concavo-convex molding and a reflective layer deposited by metal deposition may be provided.

  Next, the transfer ribbon slitting method and slitter apparatus according to the present invention will be described.

  FIG. 2 is a schematic diagram of a slitter device according to an embodiment of the present invention. A material obtained by winding a base material (elongated base material) of the above-mentioned transfer ribbon on a reel or roll (hereinafter) is set in the unwinding means 21. In FIG. 2, the wound outer surface is the substrate side of the transfer ribbon and the inner surface is the transfer layer 12 side, but this is not a limitation.

  Several rolls are combined and conveyed while inverting the front and back of the long substrate. At this time, the slitter 22 is disposed so that the slitter hits from the transfer layer side in the cutting region where the slitter 22 is installed. FIG. 3 is a schematic view showing an embodiment of a slitter used in the present invention. Tension is applied to the long base material by the two rolls 31 and 32 sandwiching the slitter, and the base material is held so as not to loosen during cutting. The tension is preferably about 0.1 to 1.5N. Although there is no restriction | limiting in particular in the relationship between the two rolls 31 and 32 and the front and back of the elongate base material which contacts a roll, In the form of FIG. It arrange | positions so that it may contact on the peeling layer side. This can be adjusted by the number of reversing rolls until the two rolls are conveyed. This configuration is also advantageous in that the area where the slitter is arranged is widened.

  The slitter 22 includes a number of slit blades 33 corresponding to the width of the slits and a jig (slit blade fixing jig) 34 for fixing the slit blades. In the form of FIG. 3, the slit blade can be inserted into and separated from the elongated base material by the rotation of the slit blade fixing jig. Moreover, it is preferable to arrange | position a slitter so that the insertion to the elongate base material of a slit blade may become a direction so that the direction of a blade may follow the conveyance direction of a elongate base material.

  As the slit blade, those used in a general slitting device such as a stainless steel blade, a ceramic blade, and a carbide blade can be appropriately used. Among these, a cemented carbide blade made of a cemented carbide with high wear resistance such as tungsten carbide can be suitably used. As the shape of the slit blade, for example, a one-stage blade, a two-stage blade, and a blade angle of 20 to 24 ° can be suitably used.

  Each long base material cut to a predetermined width is wound around the winding means 23 as a transfer ribbon. As in the embodiment of FIG. 1, it may be wound at different positions so that adjacent transfer ribbons do not interfere with each other.

  The transfer ribbon cut to a predetermined width by the slitter device can be transferred to the transfer target by thermocompression bonding (for example, heat roll). In the case of a retransfer printer, the ink pattern is transferred from the ink ribbon to the adhesive layer surface of the transfer ribbon using a thermal head, and the transfer ribbon on which the ink pattern is transferred to a transfer medium such as a card substrate is thermocompression bonded. An ink pattern can be printed.

<Example 1>
Using the slitter apparatus shown in FIG. 1, slitting was performed using a long substrate having a width of 600 mm as a transfer ribbon having a width of 100 mm.

  The transfer ribbon, which is a long substrate, was formed by sequentially laminating a release layer made of an acrylic resin and an adhesive layer made of an epoxy resin on a 25 μm thick PET substrate.

  The long base material formed as described above is set in a slitter device, and the slitter is lowered to the transfer layer side of the long base material, and the distance between the winding means and the winding means is about 20 m / min. Transported at speed.

At this time, a cemented carbide blade was used as the slit blade, and in order to investigate the influence of the blade shape, cutting was performed using a single blade and a double blade of blade angles 20, 22, and 24 °, respectively.
<Example 2 (comparative example)>

  In Example 2, it carried out with the same structure as Example 1 except having used the apparatus shown in FIG. 4 as a slitter apparatus. In the slitter apparatus of FIG. 4, the slitter 22 is arrange | positioned not at the transfer layer side but at the base-material surface side.

<Evaluation results>
FIG. 5 is an enlarged photograph of the substrate surface in Example 1 using a slit blade having a blade angle of 20 ° in Example 1. As can be seen from the figure, the surface of the base material was not rough and no peeling occurred. Similarly, in the examples of other blade angles, the surface of the base material was not rough and no peeling occurred.

  FIG. 6 is an enlarged photograph of the substrate surface in Example 2 (Comparative Example) using a slit blade with a blade angle of 20 °. As can be seen from the figure, in this case, the surface of the base material was rough and peeling occurred. Also in comparative examples with other blade angles, the substrate surface was rough and peeling occurred.

DESCRIPTION OF SYMBOLS 11 ... Base material 12 ... Transfer layer 121 ... Release layer 122 ... Adhesive layer 21 Unwinding means 22 ... Slitter 23 ... Winding means 31 ... Tension roll (upstream side) )
32 ... Tension roll (downstream)
33 ... Slit blade 34 ... Slit blade fixing jig

Claims (4)

A slitter device for cutting a long substrate with a predetermined width,
Unwinding means for unwinding the elongated substrate having a transfer layer formed on one surface;
A slitter that cuts a long substrate with a predetermined width;
A transport roll that maintains tension at the contact portion between the elongated substrate and the slitter;
A reversing roll for contacting the slitter on the shape of the transfer layer of the elongated substrate;
A winding means for winding the cut long substrate;
A slitter device comprising:   A slitter device according to claim 1, wherein the slitter device comprises a carbide blade.   A long base material having a transfer layer formed on one surface is transported while maintaining tension between two transport rolls provided with slitters for cutting the long base material with a predetermined width. A slitting method comprising cutting a contact surface from a surface on which a transfer layer of a long substrate is formed.   The slitting method according to claim 3, wherein a tension between the two transport rolls is 0.1 to 15N.