JP2012231418A - Wiring for high-speed signal transmission - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide wiring for high-speed signal transmission, which is suitable for transmitting a high-speed signal having a frequency of 10 GHz or higher.SOLUTION: The wiring for high-speed signal transmission includes: a substrate; a ground part formed on the substrate; and a signal line which is disposed close to the ground part, has at least one end connected to a pad on the substrate, and transmits a signal of 10 GHz or higher.

Description

  The present invention relates to high-speed signal transmission wiring.

  Conventionally, there are wirings that transmit signals of various frequencies. The signal transmission characteristics in the wiring largely depend on the impedance matching between the signal line and the ground line or the ground plane (for example, see Non-Patent Document 1).

Funori Ishizuka, “High-frequency packaging technology for future large-capacity transmission”, [online], Realize Science and Technology Center, Inc. [March 29, 2011], Internet (http://www.realize-se.co .jp / items / bt / 113/2 / index.html)

  By the way, in recent years, the frequency of signals has been increasing. Conventionally, the frequency of signals has been in the order of MHz, but recently, information processing apparatuses and electronic devices that transmit signals with a frequency of 10 GHz or higher have been developed. For this reason, it is desired that wiring used in information processing apparatuses and electronic devices can cope with high-speed signals of, for example, 10 GHz or more.

  Accordingly, an object of the present invention is to provide a high-speed signal transmission wiring suitable for transmitting a high-speed signal having a frequency of 10 GHz or more, for example.

  The high-speed signal transmission wiring according to one aspect of the present invention is disposed near the ground portion, the ground portion formed on the substrate, and at least one end connected to the pad on the substrate, And a signal line for transmitting a signal of 10 GHz or higher.

  In addition, the signal line is a pair of signal lines including a first signal line and a second signal line, and the first signal line and the second signal line are arranged close to each other in parallel. Or twisted portions that are twisted together.

  In addition to the ground portion, the signal line and the wiring include a wiring that is held at a ground potential, and the signal line and the wiring have adjacent parallel sections arranged in parallel and are twisted together. You may have a part.

  The ground portion is a ground plane, a pair of ground lines disposed on both sides of the signal line in plan view, and a pair of ground lines disposed on both sides of the signal line in plan view, A pair of ground lines having parallel sections close to and parallel to the signal line, or a pair whose both ends are disposed on both sides of the signal line in plan view and whose intermediate portion intersects the upper side or the lower side of the signal line Any one of the ground lines may be used.

  The other end of the signal line may be connected to a mounting portion different from the substrate.

  A specific effect is obtained that a high-speed signal transmission wiring suitable for transmitting a high-speed signal having a frequency of 10 GHz or more can be provided.

2A and 2B are diagrams illustrating a circuit configuration of a high-speed signal transmission wiring 100 according to the first embodiment, in which FIG. 3A is a side view and FIG. 6 is a plan view showing a high-speed signal transmission wiring 101 according to Modification 1 of Embodiment 1. FIG. FIG. 11 is a plan view showing a high-speed signal transmission wiring 102 according to Modification 2 of Embodiment 1. 6 is a plan view showing a high-speed signal transmission wiring 103 according to Modification 3 of Embodiment 1. FIG. 7 is a plan view showing a high-speed signal transmission wiring 104 according to Modification 4 of Embodiment 1. FIG. FIG. 11 is a plan view showing a high-speed signal transmission wiring 105 according to Modification 5 of Embodiment 1. It is a figure which shows the circuit structure of the wiring 200 for high-speed signal transmission of Embodiment 2, (A) is a side view, (B) is a top view. FIG. 10 is a plan view showing a high-speed signal transmission wiring 201 according to Modification 1 of Embodiment 2. FIG. 10 is a plan view showing a high-speed signal transmission wiring 202 of a second modification of the second embodiment. FIG. 10 is a plan view showing a high-speed signal transmission wiring 203 of Modification 3 of Embodiment 2. 10 is a plan view showing a high-speed signal transmission wiring 204 of Modification 4 of Embodiment 2. FIG. FIG. 25 is a plan view showing a high-speed signal transmission wiring 205 according to Modification 5 of Embodiment 2. It is a figure which shows the circuit structure of the wiring 300 for high speed signal transmission of Embodiment 3, (A) is a side view, (B) is a top view. FIG. 10 is a plan view showing a high-speed signal transmission wiring 301 according to Modification 1 of Embodiment 3. FIG. 10 is a plan view showing a high-speed signal transmission wiring 302 of a second modification of the third embodiment. FIG. 10 is a plan view showing a high-speed signal transmission wiring 303 of Modification 3 of Embodiment 3. FIG. 10 is a plan view showing a high-speed signal transmission wiring 304 of Modification 4 of Embodiment 3. It is a figure which shows the circuit structure of the wiring 400 for high-speed signal transmission of Embodiment 4, (A) is a side view, (B) is a top view. FIG. 10 is a plan view showing a high-speed signal transmission wiring 401 according to Modification 1 of Embodiment 4. FIG. 38 is a plan view showing a high-speed signal transmission wiring 402 according to Modification 2 of Embodiment 4; FIG. 38 is a plan view showing a high-speed signal transmission wiring 403 according to Modification 3 of Embodiment 4. FIG. 38 is a plan view showing a high-speed signal transmission wiring 404 in Modification 4 of Embodiment 4; It is a figure which shows the circuit structure of the wiring 500 for high-speed signal transmission of Embodiment 5, (A) is a side view, (B) is a top view. FIG. 10 is a plan view showing a high-speed signal transmission wiring 501 of Modification 1 of Embodiment 5. FIG. 38 is a plan view showing a high-speed signal transmission wiring 502 according to Modification 2 of Embodiment 5. FIG. 38 is a plan view showing a high-speed signal transmission wiring 503 according to Modification 3 of Embodiment 5. FIG. 38 is a plan view showing a high-speed signal transmission wiring 504 according to Modification 4 of Embodiment 5. FIG. 38 is a plan view showing a high-speed signal transmission wiring 505 according to Modification 5 of Embodiment 5.

  Embodiments to which the high-speed signal transmission wiring of the present invention is applied will be described below.

  The high-speed signal transmission wirings of the first to fifth embodiments are realized by arbitrarily combining the following seven items.

  (1) The signal line is disposed close to the ground portion, and at least one end is connected to a pad on the substrate, and transmits a signal of 10 GHz or more.

  (2) The signal line is a pair of signal lines including a first signal line and a second signal line, and the first signal line and the second signal line are twisted together.

  (3) The signal line is a pair of signal lines including a first signal line and a second signal line, and the first signal line and the second signal line have adjacent parallel sections that are arranged close to each other in parallel. .

  (4) Including the wiring held at the ground potential, the signal line and the wiring have adjacent parallel sections arranged close to each other in parallel.

  (5) Including the wiring held at the ground potential, the signal line and the wiring are twisted together.

(6) The ground part
(A) ground plane,
(B) having a pair of ground lines disposed on both sides of the signal line in plan view;
(C) a pair of ground lines disposed on both sides of the signal line in a plan view, the pair of ground lines having parallel sections close to the signal line and parallel to each other;
(D) Both ends of the signal line are disposed on both sides of the signal line in plan view, and the middle part has a pair of ground lines intersecting on the upper side or the lower side of the signal line.
One of them.

  (7) The other end of the signal line is connected to a mounting portion different from the substrate.

  Hereinafter, the high-speed signal transmission wiring according to the first to fifth embodiments will be described.

<Embodiment 1>
1A and 1B are diagrams illustrating a circuit configuration of a high-speed signal transmission wiring 100 according to the first embodiment, where FIG. 1A is a side view and FIG. 1B is a plan view.

  The high-speed signal transmission wiring 100 according to the first embodiment is realized by combining the item (1), the item (2), and the item (6) (a).

  The high-speed signal transmission wiring 100 includes a substrate 10, a ground plane 20, pads 31 to 34, and signal lines 41 and 42.

  The substrate 10 is, for example, a substrate made of FR4 (Flame Retardant Type 4).

  An H-shaped ground plane 20 and pads 31 to 34 are formed on the surface of the substrate 10 in plan view. The pads 31 to 34 are formed in a portion where the ground plane 20 is not formed, and are electrically insulated from the ground plane 20.

  The ground plane 20 is made of, for example, copper foil, and the thickness is set to, for example, about 0.03 mm.

  The signal lines 41 and 42 are twisted together. For example, FIG. 1B shows an example of twisting three times. The signal lines 41 and 42 may be twisted at least once.

  The signal wires 41 and 42 are resin-coated on the surface, and the core wire is, for example, a wire made of gold, copper, or aluminum. The signal lines 41 and 42 are connected between the pads 31 to 34, for example, by a method similar to wire bonding in the semiconductor manufacturing process. The signal line 41 is connected between the pad 31 and the pad 33, and the signal line 42 is connected between the pad 32 and the pad 34.

  As shown in FIG. 1A, the signal lines 41 and 42 are wired close to each other on the surface of the ground plane 20, and the distance d1 between the signal lines 41 and 42 is kept substantially constant. It is held at about 0.3 mm. Further, the thickness of the signal lines 41 and 42 is about 0.04 mm.

  Such signal lines 41 and 42 are suitable for transmitting differential signals (D +, D−), for example.

  Since the high-speed signal transmission wiring 100 according to the first embodiment as described above has a relationship in which the electric and magnetic fields cancel each other when the differential signals are transmitted because the signal lines 41 and 42 are twisted together. Good differential characteristic impedance, improved external noise resistance, and reduced radiation noise can be achieved.

  Further, the distance between the twisted portions 41A and 42A of the signal lines 41 and 42 and the ground plane 20 is kept constant (D), which means that it has a microstrip structure. For this reason, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  The controllability of differential characteristic impedance, external noise immunity, radiation noise, or common mode impedance is particularly good when the frequency of the signal transmitted by the signal lines 41 and 42 falls within a very high frequency band such as 10 GHz or more. Becomes an important factor.

  Since the high-speed signal transmission wiring 100 according to the first embodiment has good differential characteristic impedance, external noise resistance, radiation noise, and common mode impedance controllability as described above, it is extremely high, particularly at 10 GHz or higher. It is suitable for transmitting a signal having a high frequency.

<Modification 1 of Embodiment 1>
FIG. 2 is a plan view showing a high-speed signal transmission wiring 101 according to the first modification of the first embodiment.

  The high-speed signal transmission wiring 101 according to the first modification of the first embodiment includes a point including ground lines 21 and 22 instead of the ground plane 20 of the high-speed signal transmission wiring 100 shown in FIG. It differs from the high-speed signal transmission wiring 100 shown in FIG. 1 in that it is formed on a die 12 such as an IC (Integrated Circuit).

  The high-speed signal transmission wiring 101 of the first modification of the first embodiment is realized by combining the item (1), the item (2), the item (6), (b), and the item (7). The

  In addition, the same code | symbol is attached | subjected to the component which is the same as that of the high speed signal transmission wiring 100 of Embodiment 1, or equivalent, and the description is abbreviate | omitted.

  The substrate 11 is adjacent to the die 12 and is a mounting portion different from the substrate 11. Here, as an example, it is assumed that the surface heights of the substrate 11 and the die 12 are matched.

  In addition to the pads 33 and 34, pads 37 and 38 that are held at the ground potential for connecting the ground lines 21 and 22 are formed on the substrate 11. The pads 37 and 38 are formed on the surface of the substrate 11 so as to be located outside the pads 33 and 34 in a plan view.

  In addition to the pads 31 and 32, pads 35 and 36 that are held at the ground potential for connecting the ground line 21 are formed on the die 12. The pads 35 and 36 are formed on the surface of the pad 12 so as to be located outside the pads 31 and 32 in plan view.

  The ground lines 21 and 22 are, for example, gold, copper, and aluminum wires, and the surface may be resin-coated or may not be resin-coated. The ground lines 21 and 22 are connected between the pads 35 to 38 by, for example, a method similar to wire bonding in a semiconductor manufacturing process. The ground line 21 is connected between the pad 35 and the pad 37, and the ground line 22 is connected between the pad 36 and the pad 38.

  Note that the distance between the ground lines 21 and 22 and the surface of the substrate 11 is kept substantially constant, for example, about 0.3 mm. The thickness of the ground lines 21 and 22 is about 0.04 mm.

  In the high-speed signal transmission wiring 101 according to the first modification of the first embodiment as described above, the signal lines 41 and 42 are twisted so that the electric field and the magnetic field cancel each other when the differential signal is transmitted. Therefore, it is possible to improve the differential characteristic impedance, the external noise resistance, and the radiation noise.

  The controllability of differential characteristic impedance, external noise immunity, or radiated noise is particularly important when the frequency of the signal transmitted by the signal lines 41 and 42 falls within a very high frequency band such as 10 GHz or higher. Become an element.

  Since the high-speed signal transmission wiring 101 according to the first modification of the first embodiment has good differential characteristic impedance, resistance to external noise, and controllability of radiation noise as described above, the wiring 101 for the high-speed signal transmission is particularly extremely high at 10 GHz or more. It is suitable for transmitting a signal having a high frequency.

<Modification 2 of Embodiment 1>
FIG. 3 is a plan view showing a high-speed signal transmission wiring 102 according to the second modification of the first embodiment.

  The high-speed signal transmission wiring 102 according to the second modification of the first embodiment is shown in FIG. 2 in that the ground wires 21 and 22 are brought close to the twisted portions 41A and 42A of the signal wires 41 and 42 at the intermediate portions 21A and 22A. Different from the high-speed signal transmission wiring 101 of the first modification shown.

  The high-speed signal transmission wiring 102 of the second modification of the first embodiment is realized by combining the item (1), the item (2), the item (6) (c), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 101 shown in FIG. Is omitted.

  As shown in FIG. 3, the intermediate portions 21A and 22A in the longitudinal direction of the ground wirings 21 and 22 are close to the signal lines 41 and 42 in a plan view.

  The distance d2 between the intermediate portions 21A and 22A and the twisted portions 41A and 42A is maintained at about 0.06 mm, for example. Further, the thickness of the signal lines 41 and 42 is about 0.05 mm.

  Thereby, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  As described above, according to the high-speed signal transmission wiring 102 of the second modification of the first embodiment, the controllability of good differential characteristic impedance, external noise resistance, radiation noise, and common mode impedance as described above is achieved. Therefore, it is particularly suitable for transmitting a signal having a very high frequency such as 10 GHz or more.

<Modification 3 of Embodiment 1>
FIG. 4 is a plan view showing the high-speed signal transmission wiring 103 according to the third modification of the first embodiment.

  The high-speed signal transmission wiring 103 according to the third modification of the first embodiment is that the ground plane 23 is formed on the substrate 11 and the pads 35 and 36 and the ground plane 23 are connected by the ground lines 24 and 25 in FIG. Different from the high-speed signal transmission wiring 102 of the second modification shown.

  The high-speed signal transmission wiring 103 of the third modification of the first embodiment is realized by combining the item (1), the item (2), the item (6) (a), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 102 shown in FIG. Is omitted.

  The ground plane 23 is a modification of the ground plane 20 of the first embodiment, and the ground lines 24 and 25 are modifications of the ground lines 21 and 22 of the second modification of the first embodiment.

  The ground plane 23 and the twisted portions 41A and 42A of the signal lines 41 and 42 form a microstrip structure.

  For this reason, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  As described above, according to the high-speed signal transmission wiring 103 of the third modification of the first embodiment, the controllability of good differential characteristic impedance, external noise resistance, radiation noise, and common mode impedance as described above is achieved. Therefore, it is particularly suitable for transmitting a signal having a very high frequency such as 10 GHz or more.

<Modification 4 of Embodiment 1>
FIG. 5 is a plan view showing the high-speed signal transmission wiring 104 according to the fourth modification of the first embodiment.

  The high-speed signal transmission wiring 104 of the fourth modification of the first embodiment is different from the high-speed signal transmission wiring 102 of the second modification shown in FIG. 3 in that the ground lines 26 and 27 are crossed.

  The high-speed signal transmission wiring 104 according to the fourth modification of the first embodiment is realized by combining the item (1), the item (2), the item (6) (d), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 102 shown in FIG. Is omitted.

  The ground line 26 connects the pad 35 and the pad 38, and the ground line 27 connects the pad 36 and the pad 37. Thereby, the ground lines 26 and 27 intersect, and the intersecting portions 26A and 27A are below the twisted portions 41A and 42A of the signal lines 41 and 42 (between the substrate 11 and the twisted portions 41A and 42A). Through.

  As shown in FIG. 5, the intersecting portions 26A and 27A of the ground wirings 26 and 27 are close to the twisted portions 41A and 42A of the signal lines 41 and 42 in the vertical direction.

  The ground lines 26 and 27 are obtained by modifying the ground lines 21 and 22 of the second modification of the first embodiment.

  Thereby, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  As described above, according to the high-speed signal transmission wiring 104 of the fourth modification of the first embodiment, the controllability of the good differential characteristic impedance, the external noise resistance, the radiation noise, and the common mode impedance as described above. Therefore, it is particularly suitable for transmitting a signal having a very high frequency such as 10 GHz or more.

<Modification 5 of Embodiment 1>
FIG. 6 is a plan view showing the high-speed signal transmission wiring 105 according to the fifth modification of the first embodiment.

  The high-speed signal transmission wiring 105 according to the fifth modification of the first embodiment is such that the ground lines 28 and 29 are passed over the twisting parts 41A and 42A by the intersections 28A and 29A shown in FIG. 4 different from the high-speed signal transmission wiring 104.

  The high-speed signal transmission wiring 105 of the fifth modification of the first embodiment is realized by combining the item (1), the item (2), the item (6) (d), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 104 shown in FIG. Is omitted.

  As shown in FIG. 6, the intersecting portions 28A and 28A of the ground wirings 28 and 29 are close to the twisted portions 41A and 42A of the signal lines 41 and 42 in the vertical direction.

  The ground lines 28 and 29 are modified from the ground lines 21 and 22 of the second modification of the first embodiment.

  Thereby, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  As described above, according to the high-speed signal transmission wiring 105 of the fourth modification of the first embodiment, good differential characteristic impedance, external noise resistance, radiation noise, and common mode impedance controllability as described above. Therefore, it is particularly suitable for transmitting a signal having a very high frequency such as 10 GHz or more.

<Embodiment 2>
7A and 7B are diagrams showing a circuit configuration of the high-speed signal transmission wiring 200 according to the second embodiment, where FIG. 7A is a side view and FIG. 7B is a plan view.

  The high-speed signal transmission wiring 200 of the second embodiment uses signal lines 43 and 44 instead of the signal lines 41 and 42 of the signal transmission wiring 100 of the first embodiment.

  The high-speed signal transmission wiring 200 according to the second embodiment is realized by combining the item (1), the item (3), and the item (6) (a).

  In the following description, the same or equivalent components as those of the signal transmission wiring 100 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The high-speed signal transmission wiring 200 includes a substrate 10, a ground plane 20, pads 31 to 34, and signal lines 43 and 44.

  The signal lines 43 and 44 are a pair of signal lines and have adjacent parallel sections 43A and 44A that are arranged close to each other in parallel.

  The signal lines 43 and 44 are gold, copper, and aluminum wires, and the surface may be resin-coated or may not be resin-coated. The signal lines 43 and 44 are connected between the pads 31 to 34, for example, by a method similar to wire bonding in the semiconductor manufacturing process. The signal line 43 is connected between the pad 31 and the pad 33, and the signal line 44 is connected between the pad 32 and the pad 34.

  As shown in FIG. 7A, the signal lines 43 and 44 are wired close to each other on the surface of the ground plane 20, and the distance d1 between the signal lines 43 and 44 is kept substantially constant.

  Moreover, as shown in FIG. 7B, the distance d3 between the adjacent parallel sections 43A and 44A is, for example, about 0.06 mm.

  Such signal lines 43 and 44 are suitable for transmitting differential signals (D +, D−), for example.

  In the high-speed signal transmission wiring 200 according to the second embodiment as described above, since the signal lines 43 and 44 have the adjacent parallel sections 43A and 44A, the electric field and the magnetic field cancel each other when the differential signal is transmitted. Therefore, it is possible to improve the differential characteristic impedance, the external noise resistance, and the radiation noise.

  The distance between the adjacent parallel sections 43A and 44A of the signal lines 43 and 44 and the ground plane 20 is kept constant (D), which means that it has a microstrip structure. For this reason, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  The controllability of differential characteristic impedance, external noise immunity, radiation noise, or common mode impedance is particularly when the frequency of the signal transmitted by the signal lines 43 and 44 falls within a very high frequency band such as 10 GHz or more. Becomes an important factor.

  Since the high-speed signal transmission wiring 200 according to the second embodiment has good differential characteristic impedance, external noise resistance, radiation noise, and common mode impedance controllability as described above, it is particularly very high such as 10 GHz or more. It is suitable for transmitting a signal having a high frequency.

<Modification 1 of Embodiment 2>
FIG. 8 is a plan view showing a high-speed signal transmission wiring 201 according to the first modification of the second embodiment.

  The high-speed signal transmission wiring 201 according to the first modification of the second embodiment includes a point including ground lines 21 and 22 instead of the ground plane 20 of the high-speed signal transmission wiring 200 shown in FIG. It differs from the high-speed signal transmission wiring 200 shown in FIG. 7 in that it is formed on the IC die 12.

  The high-speed signal transmission wiring 201 of the first modification of the second embodiment is realized by combining the item (1), the item (3), the item (6), (b), and the item (7). The

  In addition, the same code | symbol is attached | subjected to the component same or equivalent to the high-speed signal transmission wiring 200 of Embodiment 2, and the description is abbreviate | omitted.

  The substrate 11 is adjacent to the die 12 and is a mounting portion different from the substrate 11.

  In addition to the pads 33 and 34, pads 37 and 38 that are held at the ground potential for connecting the ground lines 21 and 22 are formed on the substrate 11. The pads 37 and 38 are formed on the surface of the substrate 11 so as to be located outside the pads 33 and 34 in a plan view.

  In addition to the pads 31 and 32, pads 35 and 36 that are held at the ground potential for connecting the ground line 21 are formed on the die 12. The pads 35 and 36 are formed on the surface of the pad 12 so as to be located outside the pads 31 and 32 in plan view.

  The ground wires 21 and 22 are, for example, gold, copper, and aluminum wires, and the surface may be resin-coated or may not be resin-coated. The ground lines 21 and 22 are connected between the pads 35 to 38 by, for example, a method similar to wire bonding in a semiconductor manufacturing process. The ground line 21 is connected between the pad 35 and the pad 37, and the ground line 22 is connected between the pad 36 and the pad 38.

  The distance between the ground lines 21 and 22 and the surface of the substrate 11 is kept substantially constant.

  The high-speed signal transmission wiring 201 according to the first modification of the second embodiment as described above has the signal lines 43 and 44 having the adjacent parallel sections 43A and 44A, so that an electric field and a magnetic field are transmitted when a differential signal is transmitted. Therefore, good differential characteristic impedance, improved external noise resistance, and reduced radiation noise can be achieved.

  The controllability of differential characteristic impedance, external noise immunity, or radiated noise is particularly important when the frequency of the signal transmitted by the signal lines 43 and 44 falls within a very high frequency band such as 10 GHz or higher. Become an element.

  Since the high-speed signal transmission wiring 201 according to the first modification of the second embodiment has good differential characteristic impedance, resistance to external noise, and controllability of radiation noise as described above, it is extremely very high, such as 10 GHz or more. It is suitable for transmitting a signal having a high frequency.

<Modification 2 of Embodiment 2>
FIG. 9 is a plan view showing the high-speed signal transmission wiring 202 of the second modification of the second embodiment.

  In the high-speed signal transmission wiring 202 of the second modification of the second embodiment, the ground lines 21 and 22 are brought close to the adjacent parallel sections 43A and 44A of the signal lines 43 and 44 at the intermediate portions 21A and 22A in FIG. Different from the high-speed signal transmission wiring 201 of the first modification shown.

  The high-speed signal transmission wiring 202 of the second modification of the second embodiment is realized by combining the item (1), the item (3), the item (6) (c), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 201 shown in FIG. Is omitted.

  As shown in FIG. 9, the intermediate portions 21A and 22A in the longitudinal direction of the ground wirings 21 and 22 are close to the signal lines 43 and 44 in a plan view.

  Further, the distance d4 between the intermediate portion 21A and the adjacent parallel section 43A and the distance d4 between the intermediate portion 22A and the adjacent parallel section 44A are set to the same distance, for example, about 0.1 mm.

  Thereby, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  As described above, according to the high-speed signal transmission wiring 202 of the second modification of the second embodiment, excellent differential characteristic impedance, external noise resistance, radiation noise, and common mode impedance controllability as described above. Therefore, it is particularly suitable for transmitting a signal having a very high frequency such as 10 GHz or more.

<Modification 3 of Embodiment 2>
FIG. 10 is a plan view showing the high-speed signal transmission wiring 203 of the third modification of the second embodiment.

  The high-speed signal transmission wiring 203 of the third modification of the second embodiment is that the ground plane 23 is formed on the substrate 11 and the pads 35 and 36 and the ground plane 23 are connected by the ground lines 24 and 25 in FIG. Different from the high-speed signal transmission wiring 202 of the second modification shown.

  The high-speed signal transmission wiring 203 of the third modification of the second embodiment is realized by combining the item (1), the item (3), the item (6) (a), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 202 shown in FIG. Is omitted.

  The ground plane 23 and the adjacent parallel sections 43A and 44A of the signal lines 43 and 44 form a microstrip structure.

  For this reason, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  As described above, according to the high-speed signal transmission wiring 203 of the third modification of the second embodiment, the controllability of good differential characteristic impedance, external noise resistance, radiation noise, and common mode impedance as described above. Therefore, it is particularly suitable for transmitting a signal having a very high frequency such as 10 GHz or more.

<Modification 4 of Embodiment 2>
FIG. 11 is a plan view showing a high-speed signal transmission wiring 204 according to the fourth modification of the second embodiment.

  The high-speed signal transmission wiring 204 of the fourth modification of the second embodiment is different from the high-speed signal transmission wiring 202 of the second modification shown in FIG. 9 in that the ground lines 26 and 27 are crossed.

  The high-speed signal transmission wiring 204 of the fourth modification of the second embodiment is realized by combining the item (1), the item (3), the item (6) (d), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 202 shown in FIG. Is omitted.

  The ground line 26 connects the pad 35 and the pad 38, and the ground line 27 connects the pad 36 and the pad 37. Thereby, the ground lines 26 and 27 intersect, and the intersections 26A and 27A are below the adjacent parallel sections 43A and 44A of the signal lines 43 and 44 (between the substrate 11 and the adjacent parallel sections 43A and 44A). Through.

  As shown in FIG. 11, the intersections 26A and 27A of the ground lines 26 and 27 are close to the adjacent parallel sections 43A and 44A of the signal lines 43 and 44 in the vertical direction.

  Thereby, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  As described above, according to the high-speed signal transmission wiring 204 of the fourth modification of the second embodiment, excellent differential characteristic impedance, external noise resistance, radiation noise, and common mode impedance controllability as described above. Therefore, it is particularly suitable for transmitting a signal having a very high frequency such as 10 GHz or more.

<Modification 5 of Embodiment 2>
FIG. 12 is a plan view showing a high-speed signal transmission wiring 205 according to the fifth modification of the second embodiment.

  The high-speed signal transmission wiring 205 according to the fifth modification of the second embodiment is such that the ground lines 28 and 29 are arranged such that the intersections 28A and 29A pass over the adjacent parallel sections 43A and 44A as shown in FIG. 4 different from the high-speed signal transmission wiring 204.

  The high-speed signal transmission wiring 205 of the fifth modification of the second embodiment is realized by combining the item (1), the item (3), the item (6) (d), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 204 shown in FIG. Is omitted.

  As shown in FIG. 12, the intersections 28A and 28A of the ground wirings 28 and 29 are close to the adjacent parallel sections 43A and 44A of the signal lines 43 and 44 in the vertical direction.

  Thereby, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  As described above, according to the high-speed signal transmission wiring 205 of the fourth modification of the second embodiment, excellent differential characteristic impedance, external noise resistance, radiation noise, and common mode impedance controllability as described above. Therefore, it is particularly suitable for transmitting a signal having a very high frequency such as 10 GHz or more.

<Embodiment 3>
FIG. 13 is a diagram illustrating a circuit configuration of the high-speed signal transmission wiring 300 according to the third embodiment, where (A) is a side view and (B) is a plan view.

  The high-speed signal transmission wiring 300 according to the third embodiment is realized by combining the item (1) and the items (6) and (a).

  The high-speed signal transmission wiring 300 includes a substrate 10, a ground plane 20, pads 31 and 33, and a signal line 45.

  The substrate 10 is, for example, a substrate made of FR4 (Flame Retardant Type 4).

  An H-shaped ground plane 20 and pads 31 and 33 are formed on the surface of the substrate 10 in plan view. The pads 31 and 33 are formed in a portion where the ground plane 20 is not formed, and are electrically insulated from the ground plane 20.

  The surface of the signal line 45 is resin-coated, and the core wire is, for example, a wire made of gold, copper, or aluminum. For example, the signal line 45 is connected between the pads 31 and 33 by the same method as wire bonding in the semiconductor manufacturing process.

  As shown in FIG. 13A, the signal line 45 is wired close to the surface of the ground plane 20, and the distance d1 between the intermediate portion 45A and the ground plane 20 is kept substantially constant. For example, it is held at about 0.3 mm. Further, the thickness of the signal line 45 is about 0.04 mm.

  Such a signal line 45 is suitable for transmitting a high-speed signal having a frequency of 10 GHz or more, for example.

  In the high-speed signal transmission wiring 300 of the third embodiment as described above, the distance between the intermediate portion 45A of the signal line 45 and the ground plane 20 is kept constant (D), which has a microstrip structure. It means having. For this reason, it is possible to improve the external noise resistance and the controllability of the characteristic impedance.

  The controllability of external noise resistance, radiation noise, or characteristic impedance becomes an important factor particularly when the frequency of a signal transmitted through the signal line 45 falls within a very high frequency band such as 10 GHz or higher.

  Since the high-speed signal transmission wiring 300 according to the third embodiment has good external noise resistance, radiation noise, and controllability of characteristic impedance as described above, a signal having a very high frequency such as 10 GHz or more is particularly preferable. Suitable for transmission.

<Modification 1 of Embodiment 3>
FIG. 14 is a plan view showing a high-speed signal transmission wiring 301 according to the first modification of the third embodiment.

  The high-speed signal transmission wiring 301 according to the first modification of the third embodiment includes ground lines 21 and 22 instead of the ground plane 20 of the high-speed signal transmission wiring 300 shown in FIG. The point formed on the die 12 is different from the high-speed signal transmission wiring 300 shown in FIG.

  The high-speed signal transmission wiring 301 of the first modification of the third embodiment is realized by combining the item (1), the items (6) and (c), and the item (7).

  The other components are the same as those of the high-speed signal transmission wiring 300 shown in FIG.

  In addition to the pads 33, pads 37 and 38 that are held at the ground potential are formed on the substrate 11 in order to connect the ground lines 21 and 22. The pads 37 and 38 are formed on the surface of the substrate 11 so as to be located outside the pad 33 in plan view.

  In addition to the pad 31, the die 12 is formed with pads 35 and 36 that are held at the ground potential to connect the ground line 21. The pads 35 and 36 are formed on the surface of the pad 12 so as to be located outside the pad 31 in plan view.

  The ground wires 21 and 22 are, for example, gold, copper, and aluminum wires, and the surface may be resin-coated or may not be resin-coated. The ground lines 21 and 22 are connected between the pads 35 to 38 by, for example, a method similar to wire bonding in a semiconductor manufacturing process. The ground line 21 is connected between the pad 35 and the pad 37, and the ground line 22 is connected between the pad 36 and the pad 38.

  The intermediate portions 21A and 22A in the longitudinal direction of the ground wirings 21 and 22 are close to the intermediate portion 45A of the signal line 45 in plan view, as shown in FIG.

  The distance d5 between the intermediate part 21A and the intermediate part 45A is, for example, about 0.06 mm.

  As a result, it is possible to improve external noise resistance, reduce radiation noise, and improve controllability of characteristic impedance.

  As described above, according to the high-speed signal transmission wiring 301 of the first modification of the third embodiment, the external noise resistance can be improved and the radiation noise can be reduced as described above. As described above, it is suitable for transmitting a signal having a very high frequency.

<Modification 2 of Embodiment 3>
FIG. 15 is a plan view showing a high-speed signal transmission wiring 302 according to the second modification of the third embodiment.

  The high-speed signal transmission wiring 302 of the second modification of the third embodiment is that the ground plane 23 is formed on the substrate 11 and the pads 35 and 36 and the ground plane 23 are connected by the ground lines 24 and 25 in FIG. This is different from the high-speed signal transmission wiring 301 of the first modification shown.

  The high-speed signal transmission wiring 302 of the second modification of the third embodiment is realized by combining the item (1), the items (6) and (a), and the item (7).

  The other components are the same as those of the high-speed signal transmission wiring 301 shown in FIG. Is omitted.

  The ground plane 23 and the intermediate portion 45A of the signal line 45 form a microstrip structure.

  For this reason, it is possible to improve the external noise resistance and the controllability of the characteristic impedance.

  As described above, the high-speed signal transmission wiring 302 according to the second modification of the third embodiment has excellent external noise resistance, radiation noise, and controllability of characteristic impedance as described above. As described above, it is suitable for transmitting a signal having a very high frequency.

<Modification 3 of Embodiment 3>
FIG. 16 is a plan view showing a high-speed signal transmission wiring 303 according to the third modification of the third embodiment.

  The high-speed signal transmission wiring 303 of the third modification of the third embodiment is different from the high-speed signal transmission wiring 301 of the first modification shown in FIG. 14 in that the ground lines 26 and 27 are crossed.

  The high-speed signal transmission wiring 303 of the third modification of the third embodiment is realized by combining the item (1), the items (6) and (d), and the item (7).

  The other components are the same as those of the high-speed signal transmission wiring 301 shown in FIG. Is omitted.

  The ground line 26 connects the pad 35 and the pad 38, and the ground line 27 connects the pad 36 and the pad 37. Thereby, the ground lines 26 and 27 intersect, and the intersecting portions 26A and 27A pass below the intermediate portion 45A of the signal line 45 (between the substrate 11 and the intermediate portion 45A).

  As shown in FIG. 16, the intersections 26 </ b> A and 27 </ b> A of the ground wirings 26 and 27 are close to the intermediate part 45 </ b> A of the signal line 45 in the vertical direction.

  As a result, it is possible to improve external noise resistance, radiation noise, and controllability of characteristic impedance.

  As described above, according to the high-speed signal transmission wiring 303 of the third modification of the third embodiment, since it has good external noise resistance, radiation noise, and controllability of characteristic impedance as described above, it is particularly 10 GHz. As described above, it is suitable for transmitting a signal having a very high frequency.

<Modification 4 of Embodiment 3>
FIG. 17 is a plan view showing a high-speed signal transmission wiring 304 according to the fourth modification of the third embodiment.

  The high-speed signal transmission wiring 304 according to the fourth modification of the third embodiment is such that the ground lines 28 and 29 are arranged such that the intersections 28A and 29A pass over the intermediate part 45A. Different from the signal transmission wiring 303.

  The high-speed signal transmission wiring 304 of the fourth modification of the third embodiment is realized by combining the item (1), the items (6), (d), and the item (7).

  The other components are the same as those of the high-speed signal transmission wiring 303 shown in FIG. 16, and the same or equivalent components as those of the high-speed signal transmission wiring 303 of the third modification of the third embodiment are denoted by the same reference numerals. Is omitted.

  As shown in FIG. 17, the intersecting portions 28A and 28A of the ground wirings 28 and 29 are close to the intermediate portion 45A of the signal line 45 in the vertical direction.

  As a result, it is possible to improve external noise resistance, radiation noise, and controllability of characteristic impedance.

  As described above, according to the high-speed signal transmission wiring 304 of the third modification of the third embodiment, since it has good external noise resistance, radiation noise, and controllability of characteristic impedance as described above, it is particularly 10 GHz. As described above, it is suitable for transmitting a signal having a very high frequency.

<Embodiment 4>
18A and 18B are diagrams showing a circuit configuration of the high-speed signal transmission wiring 400 according to the fourth embodiment. FIG. 18A is a side view and FIG. 18B is a plan view.

  The high-speed signal transmission wiring 400 according to the fourth embodiment is obtained by holding the signal line 43 of the signal transmission wiring 200 according to the second embodiment at the ground potential.

  The high-speed signal transmission wiring 400 of the fourth embodiment is realized by combining the item (1), the item (4), and the item (6) (a).

  In the following description, the same or equivalent components as those of the signal transmission wiring 200 of the second embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The high-speed signal transmission wiring 400 includes the substrate 10, the ground plane 20, pads 32, 34, 35 to 38, 39 A and 39 B, and signal lines 44 and 46.

  The signal lines 44 and 46 are a pair of signal lines and have adjacent parallel sections 46A and 44A that are arranged close to each other in parallel.

  The signal lines 44 and 46 are gold, copper, and aluminum wires, and the surface may be resin-coated or may not be resin-coated. The signal lines 44 and 46 are connected between the pads 32 and 34 and between the pads 39A and 39B, for example, by the same method as wire bonding in the semiconductor manufacturing process.

  As shown in FIG. 18A, the signal lines 44 and 46 are wired close to each other on the surface of the ground plane 20, and the distance d1 between the signal lines 44 and 46 is kept substantially constant.

  The signal line 46 is held at the ground potential, and the signal line 44 is suitable for transmitting a high frequency signal having a frequency of about 10 GHz, for example.

  The high-speed signal transmission wiring 400 of the fourth embodiment as described above is good because the signal line 46 held at the ground potential and the signal line 44 transmitting the high-frequency signal have the adjacent parallel sections 46A and 44A. It is possible to improve the characteristic impedance, the external noise resistance, and the radiation noise.

  Further, the distance between the adjacent parallel sections 46A and 44A of the signal lines 44 and 46 and the ground plane 20 is kept constant (D), which means that it has a microstrip structure. For this reason, it is possible to improve the external noise resistance and the controllability of the characteristic impedance.

  The controllability of characteristic impedance, external noise immunity, and radiation noise is an important factor especially when the frequency of the signal transmitted by the signal lines 44 and 46 falls within a very high frequency band such as 10 GHz or higher. .

  Since the high-speed signal transmission wiring 400 according to the fourth embodiment has good characteristic impedance, external noise resistance, and radiation noise controllability as described above, a signal having a very high frequency such as 10 GHz or more is particularly preferable. Suitable for transmission.

<Modification 1 of Embodiment 4>
FIG. 19 is a plan view showing a high-speed signal transmission wiring 401 according to the first modification of the fourth embodiment.

  The high-speed signal transmission wiring 401 according to the first modification of the fourth embodiment includes a point including ground lines 21 and 22 instead of the ground plane 20 of the high-speed signal transmission wiring 400 shown in FIG. It differs from the high-speed signal transmission wiring 400 shown in FIG. 18 in that it is formed on the IC die 12.

  The high-speed signal transmission wiring 401 of the first modification of the fourth embodiment is realized by combining the item (1), the item (4), the item (6) (b), and the item (7). The

  In addition, the same code | symbol is attached | subjected to the component which is the same as that of the high speed signal transmission wiring 400 of Embodiment 4, or equivalent, and the description is abbreviate | omitted.

  The substrate 11 is adjacent to the die 12 and is a mounting portion different from the substrate 11.

  In addition to the pads 39 </ b> B and 34, pads 37 and 38 that are held at the ground potential for connecting the ground lines 21 and 22 are formed on the substrate 11. The pads 37 and 38 are formed on the surface of the substrate 11 so as to be located outside the pads 39B and 34 in a plan view.

  In addition to the pads 39A and 32, pads 35 and 36 held at the ground potential for connecting the ground line 21 are formed on the die 12. The pads 35 and 36 are formed on the surface of the pad 12 so as to be located outside the pads 39A and 32 in a plan view.

  The ground wires 21 and 22 are, for example, gold, copper, and aluminum wires, and the surface may be resin-coated or may not be resin-coated. The ground lines 21 and 22 are connected between the pads 35 to 38 by, for example, a method similar to wire bonding in a semiconductor manufacturing process. The ground line 21 is connected between the pad 35 and the pad 37, and the ground line 22 is connected between the pad 36 and the pad 38.

  The distance between the ground lines 21 and 22 and the surface of the substrate 11 is kept substantially constant.

  As described above, the high-speed signal transmission wiring 401 according to the first modification of the fourth embodiment includes the signal lines 46 and 44 having the adjacent parallel sections 46A and 44A. Radiation noise can be reduced.

  Characteristic impedance, external noise immunity, or radiated noise controllability is an important factor, especially when the frequency of the signal transmitted by the signal lines 44 and 46 falls within a very high frequency band such as 10 GHz or higher. Become.

  Since the high-speed signal transmission wiring 401 of the first modification of the fourth embodiment has good characteristic impedance, resistance to external noise, and controllability of radiation noise as described above, the frequency is particularly very high, such as 10 GHz or more. It is suitable for transmitting a high signal.

<Modification 2 of Embodiment 4>
FIG. 20 is a plan view showing a high-speed signal transmission wiring 402 according to the second modification of the fourth embodiment.

  The high-speed signal transmission wiring 402 according to the second modification of the fourth embodiment is that the ground plane 23 is formed on the substrate 11 and the pads 35 and 36 and the ground plane 23 are connected by the ground lines 24 and 25 in FIG. Different from the high-speed signal transmission wiring 201 of the first modification shown.

  The high-speed signal transmission wiring 402 of the second modification of the fourth embodiment is realized by combining the item (1), the item (4), the item (6) (a), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 401 shown in FIG. 19, and the same or equivalent components as those of the high-speed signal transmission wiring 401 of the second modification of the fourth embodiment are denoted by the same reference numerals. Is omitted.

  The ground plane 23 and the adjacent parallel sections 44A and 46A of the signal lines 44 and 46 form a microstrip structure.

  For this reason, it is possible to improve the external noise resistance and the controllability of the characteristic impedance.

  As described above, according to the high-speed signal transmission wiring 402 of the second modification of the fourth embodiment, since it has good external noise resistance, radiation noise, and controllability of characteristic impedance as described above, it is particularly 10 GHz. As described above, it is suitable for transmitting a signal having a very high frequency.

<Modification 3 of Embodiment 4>
FIG. 21 is a plan view showing a high-speed signal transmission wiring 403 according to the third modification of the fourth embodiment.

  The high-speed signal transmission wiring 403 of the third modification of the fourth embodiment is different from the high-speed signal transmission wiring 401 of the first modification shown in FIG. 19 in that the ground lines 26 and 27 are crossed.

  The high-speed signal transmission wiring 403 according to the third modification of the fourth embodiment is realized by combining the item (1), the item (4), the item (6) (d), and the item (7). The

  Others are the same as those of the high-speed signal transmission wiring 401 shown in FIG. 19, and the same or equivalent components as those of the high-speed signal transmission wiring 401 of the first modification of the fourth embodiment are denoted by the same reference numerals. Is omitted.

  The ground line 26 connects the pad 35 and the pad 38, and the ground line 27 connects the pad 36 and the pad 37. Thereby, the ground lines 26 and 27 intersect, and the intersecting portions 26A and 27A are below the adjacent parallel sections 46A and 44A of the signal lines 44 and 46 (between the substrate 11 and the adjacent parallel sections 46A and 44A). Through.

  As shown in FIG. 21, the intersections 26A and 27A of the ground wirings 26 and 27 are close to the adjacent parallel sections 46A and 44A of the signal lines 44 and 46 in the vertical direction.

  Thereby, the external noise tolerance can be improved and the controllability of the characteristic impedance can be improved.

  As described above, according to the high-speed signal transmission wiring 403 of the third modification of the fourth embodiment, since it has good external noise resistance, radiation noise, and controllability of characteristic impedance as described above, it is particularly 10 GHz. As described above, it is suitable for transmitting a signal having a very high frequency.

<Modification 4 of Embodiment 4>
FIG. 22 is a plan view showing high-speed signal transmission wiring 404 according to the fourth modification of the fourth embodiment.

  The high-speed signal transmission wiring 404 according to the fourth modification of the fourth embodiment is such that the ground lines 28 and 29 are arranged such that the intersections 28A and 29A pass over the adjacent parallel sections 46A and 44A, as shown in FIG. 3 different from the high-speed signal transmission wiring 403.

  The high-speed signal transmission wiring 404 of the fourth modification of the fourth embodiment is realized by combining the item (1), the item (4), the item (6) (d), and the item (7). The

  The other components are the same as those of the high-speed signal transmission wiring 403 shown in FIG. 21, and the same or equivalent components as those of the high-speed signal transmission wiring 403 of the third modification of the fourth embodiment are denoted by the same reference numerals. Is omitted.

  As shown in FIG. 22, the intersections 28A and 28A of the ground wirings 28 and 29 are close to the adjacent parallel sections 46A and 44A of the signal lines 44 and 46 in the vertical direction.

  Thereby, it is possible to improve the external noise resistance, the external noise resistance, and the controllability of the characteristic impedance.

  As described above, according to the high-speed signal transmission wiring 404 of the third modification of the fourth embodiment, since it has good external noise resistance, radiation noise, and controllability of characteristic impedance as described above, it is particularly 10 GHz. As described above, it is suitable for transmitting a signal having a very high frequency.

<Embodiment 5>
FIG. 23 is a diagram illustrating a circuit configuration of the high-speed signal transmission wiring 500 according to the fifth embodiment, in which (A) is a side view and (B) is a plan view.

  The high-speed signal transmission wiring 500 of the fifth embodiment uses signal lines 47 and 48 twisted together instead of the signal lines 44 and 46 of the signal transmission wiring 400 of the fourth embodiment.

  The high-speed signal transmission wiring 500 of the fifth embodiment is realized by combining the item (1), the item (5), and the item (6) (a).

  In the following description, the same or equivalent components as those of the signal transmission wiring 400 of the fourth embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The high-speed signal transmission wiring 500 includes the substrate 10, the ground plane 20, pads 32, 34, 35 to 38, 39 A and 39 B, and signal lines 47 and 48.

  The signal lines 47 and 48 are twisted together. For example, FIG. 23B shows an example of twisting three times. The signal lines 47 and 48 may be twisted at least once. The signal lines 47 and 48 are a pair of signal lines and have twisted portions 47A and 48A.

  The signal lines 47 and 48 are gold, copper, and aluminum wires, and the surfaces are coated with a resin. For example, the signal lines 47 and 48 are connected between the pads 32 and 34 and between the pads 39A and 39B by a method similar to wire bonding in a semiconductor manufacturing process.

  As shown in FIG. 23A, the signal lines 47 and 48 are wired close to each other on the surface of the ground plane 20, and the distance d1 between the signal lines 47 and 48 is kept substantially constant.

  The signal line 47 is held at the ground potential, and the signal line 48 is suitable for transmitting a high-frequency signal having a frequency of about 10 GHz, for example.

  The high-speed signal transmission wiring 500 of the fifth embodiment as described above is good because the signal line 47 held at the ground potential and the signal line 48 transmitting the high-frequency signal have the twisted portions 47A and 48A. It is possible to improve the characteristic impedance, the external noise resistance, and the radiation noise.

  Further, the distance between the twisted portions 47A and 48A of the signal lines 47 and 48 and the ground plane 20 is kept constant (D), which means that it has a microstrip structure. For this reason, it is possible to improve the external noise resistance and the controllability of the characteristic impedance.

  The controllability of characteristic impedance, external noise immunity, and radiated noise is an important factor especially when the frequency of the signal transmitted by the signal lines 47 and 48 falls within a very high frequency band such as 10 GHz or higher. .

  Since the high-speed signal transmission wiring 500 of the fifth embodiment has good characteristic impedance, resistance to external noise, and controllability of radiation noise as described above, a signal having a very high frequency such as 10 GHz or more is particularly preferable. Suitable for transmission.

<Modification 1 of Embodiment 5>
FIG. 24 is a plan view showing the high-speed signal transmission wiring 501 of the first modification of the fifth embodiment.

  A high-speed signal transmission wiring 501 according to the first modification of the fifth embodiment includes ground lines 21 and 22 instead of the ground plane 20 of the high-speed signal transmission wiring 500 shown in FIG. 23, and pads 39A and 32. It differs from the high-speed signal transmission wiring 500 shown in FIG. 23 in that it is formed on the IC die 12.

  The high-speed signal transmission wiring 501 of the first modification of the fifth embodiment is realized by combining the item (1), the item (5), the item (6) (b), and the item (7). The

  In addition, the same code | symbol is attached | subjected to the same or equivalent component as the high-speed signal transmission wiring 500 of Embodiment 5, and the description is abbreviate | omitted.

  The substrate 11 is adjacent to the die 12 and is a mounting portion different from the substrate 11.

  In addition to the pads 39 </ b> B and 34, pads 37 and 38 that are held at the ground potential for connecting the ground lines 21 and 22 are formed on the substrate 11. The pads 37 and 38 are formed on the surface of the substrate 11 so as to be located outside the pads 39B and 34 in a plan view.

  In addition to the pads 39A and 32, pads 35 and 36 held at the ground potential for connecting the ground line 21 are formed on the die 12. The pads 35 and 36 are formed on the surface of the pad 12 so as to be located outside the pads 39A and 32 in a plan view.

  The ground wires 21 and 22 are, for example, gold, copper, and aluminum wires, and the surface may be resin-coated or may not be resin-coated. The ground lines 21 and 22 are connected between the pads 35 to 38 by, for example, a method similar to wire bonding in a semiconductor manufacturing process. The ground line 21 is connected between the pad 35 and the pad 37, and the ground line 22 is connected between the pad 36 and the pad 38.

  The distance between the ground lines 21 and 22 and the surface of the substrate 11 is kept substantially constant.

  As described above, the high-speed signal transmission wiring 501 of the first modification of the fifth embodiment includes the signal lines 47 and 48 having the twisted portions 47A and 48A. Radiation noise can be reduced.

  Characteristic impedance, external noise immunity, or radiated noise controllability are important factors, particularly when the frequency of the signal transmitted by the signal lines 47 and 48 falls within a very high frequency band such as 10 GHz or higher. Become.

  Since the high-speed signal transmission wiring 501 of the first modification of the fifth embodiment has excellent characteristic impedance, resistance to external noise, and controllability of radiation noise as described above, the frequency is particularly very high, such as 10 GHz or more. It is suitable for transmitting a high signal.

<Modification 2 of Embodiment 5>
FIG. 25 is a plan view showing a high-speed signal transmission wiring 502 according to the second modification of the fifth embodiment.

  In the high-speed signal transmission wiring 502 of the second modification of the fifth embodiment, the ground wires 21 and 22 are brought close to the twisted portions 47A and 48A of the signal wires 47 and 48 at the intermediate portions 21A and 22A in FIG. Different from the high-speed signal transmission wiring 501 of the first modification shown.

  The high-speed signal transmission wiring 502 of the second modification of the fifth embodiment is realized by combining the item (1), the item (5), the item (6), (c), and the item (7). The

  Others are the same as those of the high-speed signal transmission wiring 501 shown in FIG. 24, and the same or equivalent components as those of the high-speed signal transmission wiring 501 of the first modification of the fifth embodiment are denoted by the same reference numerals. Is omitted.

  The intermediate portions 21A and 22A in the longitudinal direction of the ground wirings 21 and 22 are close to the signal lines 47 and 48 in plan view, as shown in FIG.

  Thereby, it is possible to improve the external noise resistance and the controllability of the common mode impedance.

  As described above, according to the high-speed signal transmission wiring 502 of the second modification of the fifth embodiment, it has excellent characteristic impedance, external noise resistance, radiation noise, and common mode impedance controllability as described above. In particular, it is suitable for transmitting a signal having a very high frequency such as 10 GHz or more.

<Modification 3 of Embodiment 5>
FIG. 26 is a plan view showing a high-speed signal transmission wiring 503 according to the third modification of the fifth embodiment.

  The high-speed signal transmission wiring 503 of the third modification of the fifth embodiment is that the ground plane 23 is formed on the substrate 11, and the pads 35 and 36 and the ground plane 23 are connected by the ground lines 24 and 25 in FIG. Different from the high-speed signal transmission wiring 502 of the second modification shown.

  The high-speed signal transmission wiring 503 of the third modification of the fifth embodiment is realized by combining the item (1), the item (5), the item (6) (a), and the item (7). The

  Others are the same as those of the high-speed signal transmission wiring 502 shown in FIG. 25, and the same or equivalent components as those of the high-speed signal transmission wiring 502 of the second modification of the fifth embodiment are denoted by the same reference numerals. Is omitted.

  The ground plane 23 and the twisted portions 47A and 48A of the signal lines 47 and 48 form a microstrip structure.

  For this reason, it is possible to improve the external noise resistance and the controllability of the characteristic impedance.

  As described above, according to the high-speed signal transmission wiring 503 of the third modification of the fifth embodiment, since it has good external noise resistance, radiation noise, and controllability of characteristic impedance as described above, it is particularly 10 GHz. As described above, it is suitable for transmitting a signal having a very high frequency.

<Modification 4 of Embodiment 5>
FIG. 27 is a plan view showing a high-speed signal transmission wiring 504 according to the fourth modification of the fifth embodiment.

  The high-speed signal transmission wiring 504 of the fourth modification of the fifth embodiment is different from the high-speed signal transmission wiring 501 of the first modification shown in FIG. 24 in that the ground lines 26 and 27 are crossed.

  The high-speed signal transmission wiring 504 according to the fourth modification of the fifth embodiment is realized by combining the item (1), the item (5), the item (6) (d), and the item (7). The

  Others are the same as those of the high-speed signal transmission wiring 501 shown in FIG. 24, and the same or equivalent components as those of the high-speed signal transmission wiring 501 of the first modification of the fifth embodiment are denoted by the same reference numerals. Is omitted.

  The ground line 26 connects the pad 35 and the pad 38, and the ground line 27 connects the pad 36 and the pad 37. Thereby, the ground lines 26 and 27 intersect, and the intersecting parts 26A and 27A are below the twisted parts 47A and 48A of the signal lines 47 and 48 (between the substrate 11 and the twisted parts 47A and 48A). Through.

  As shown in FIG. 27, the intersecting portions 26A and 27A of the ground wirings 26 and 27 are close to the twisted portions 47A and 48A of the signal lines 47 and 48 in the vertical direction.

  As a result, it is possible to improve external noise resistance, radiation noise, and controllability of characteristic impedance.

  As described above, according to the high-speed signal transmission wiring 504 of the fourth modification of the fifth embodiment, since it has good external noise resistance, radiation noise, and controllability of characteristic impedance as described above, in particular, 10 GHz. As described above, it is suitable for transmitting a signal having a very high frequency.

<Modification 5 of Embodiment 5>
FIG. 28 is a plan view showing high-speed signal transmission wiring 505 according to the fifth modification of the fifth embodiment.

  The high-speed signal transmission wiring 505 according to the fifth modification of the fifth embodiment is such that the ground lines 28 and 29 are crossed over the twisted sections 47A and 48A by the intersections 28A and 29A as shown in FIG. 4 different from the high-speed signal transmission wiring 504.

  The high-speed signal transmission wiring 505 of the fifth modification of the fifth embodiment is realized by combining the item (1), the item (5), the item (6) (d), and the item (7). The

  Others are the same as those of the high-speed signal transmission wiring 504 shown in FIG. 27, and the same or equivalent components as those of the high-speed signal transmission wiring 504 of the fourth modification of the fifth embodiment are denoted by the same reference numerals. Is omitted.

  As shown in FIG. 28, the intersecting portions 28A and 28A of the ground wirings 28 and 29 are close to the twisted portions 47A and 48A of the signal lines 47 and 48 in the vertical direction.

  Thereby, it is possible to improve the external noise resistance, the external noise resistance, and the controllability of the characteristic impedance.

  As described above, according to the high-speed signal transmission wiring 505 of the fourth modification of the fifth embodiment, since it has good external noise resistance, radiation noise, and controllability of characteristic impedance as described above, it is particularly 10 GHz. As described above, it is suitable for transmitting a signal having a very high frequency.

  Although the high-speed signal transmission wiring of the exemplary embodiment of the present invention has been described above, the present invention is not limited to the specifically disclosed embodiment and deviates from the scope of the claims. Without limitation, various modifications and changes are possible.

High-speed signal transmission wiring 100, 101, 102, 103, 104, 105, 200, 201, 202, 203, 204, 205, 300, 301, 302, 303, 304, 400, 401, 402, 403, 404, 500 , 501, 502, 503, 504, 505
10, 11 Substrate 12 Die 20 Ground plane 21, 22 Ground line 21A, 22A Intermediate portion 23 Ground plane 24, 25, 26, 27, 28, 29 Ground line 28A, 29A Intersection 31, 32, 33, 34, 35, 36, 37, 38, 39A, 39B Pad 41, 42, 43, 44, 45, 46, 47, 48 Signal line 41A, 42A, 47A, 48A Twisted section 43A, 44A, 46A Proximity parallel section 45A Middle section

Claims (5)

A substrate,
A ground portion formed on the substrate;
A high-speed signal transmission wiring, comprising: a signal line that is disposed close to the ground portion and at least one end is connected to a pad on the substrate and transmits a signal of 10 GHz or more. The signal line is a pair of signal lines including a first signal line and a second signal line,
2. The high-speed signal transmission wiring according to claim 1, wherein the first signal line and the second signal line have adjacent parallel sections arranged in parallel adjacent to each other, or have a twisted portion twisted together. .   In addition to the ground portion, it includes a wiring that is held at a ground potential, and the signal line and the wiring have adjacent parallel sections arranged in parallel in close proximity, or a twisted portion that is twisted together. The high-speed signal transmission wiring according to claim 1. The ground part is
Ground plane,
A pair of ground lines disposed on both sides of the signal line in plan view;
A pair of ground lines disposed on both sides of the signal line in plan view, and having a parallel section close to the signal line and parallel to each other, or both ends of the signal line in plan view A pair of ground lines that are disposed on both sides of the signal line and intersect at the upper or lower side of the signal line,
The high-speed signal transmission wiring according to any one of claims 1 to 3, wherein the high-speed signal transmission wiring is any one of the above.   5. The high-speed signal transmission wiring according to claim 1, wherein the other end of the signal line is connected to a mounting portion different from the substrate.

Images