JP2012230758A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a threshold voltage of a memory cell from being difficult to fall down due to repeating of data rewriting.SOLUTION: Each memory cell MC of a semiconductor device 1 includes a first transistor (for reading) TRA and a second transistor (for writing) each having a common floating gate FG. A control circuit 11 detects short circuit between sub-bit lines SBL_R and SBL_P connected to the first and second transistors, respectively by comparing current caused to flow to the memory cell when energizing one transistor with current caused to flow to the memory cell when energizing the both transistors.

Description

  The present invention relates to a semiconductor device, and more particularly to a semiconductor device that stores data in a nonvolatile manner.

  An EEPROM (Electrically Erasable Programmable Read Only Memory) has a data storage area with a small rewrite unit for storing initial parameters and holding set values. Then, it is required to incorporate the EEPROM in the microcomputer. By embedding the EEPROM in the microcomputer, the manufacturing cost can be reduced by using the same process, and the space for the apparatus using the microcomputer can be reduced. For an EEPROM built in such a microcomputer, for example, a data rewrite guarantee of 100,000 times, a small data erasing unit and a fast data erasing speed are required.

  For example, Patent Document 1 discloses the following EEPROM. That is, it has a substrate, a floating gate made of a conductive material isolated from the substrate by an insulating material, a first read channel, and a second programming channel. The charge injection point to the floating gate does not overlap with the first channel.

JP-A-6-188427

  However, Patent Document 1 does not disclose a specific method for preventing an increase in data erasing time.

  Therefore, an object of the present invention is to provide a semiconductor device capable of preventing an increase in data erasing time.

  In summary, the semiconductor device according to the present invention is a semiconductor device that stores data in a nonvolatile manner, and the first transistor includes a floating gate, a control gate, a first conduction electrode, and a second conduction electrode. Have The second transistor is coupled to a common floating gate with the first transistor, a control gate coupled to the control gate of the first transistor, a first conduction electrode, and a second conduction electrode of the first transistor. A second conductive electrode. When reading data, a positive first voltage is supplied to the control gates of the first transistor and the second transistor. A positive second voltage smaller than the first voltage is supplied to the first conduction electrode of the first transistor. A third voltage smaller than the second voltage is supplied to the second conducting electrodes of the first transistor and the second transistor. A fourth voltage lower than the second voltage is supplied to the first conduction electrode of the second transistor.

  In summary, a semiconductor device according to still another aspect of the present invention is a semiconductor device that stores data in a nonvolatile manner, and the first transistor includes a floating gate, a control gate, and a first conduction electrode. And a second conduction electrode. The second transistor is coupled to a common floating gate with the first transistor, a control gate coupled to the control gate of the first transistor, a first conduction electrode, and a second conduction electrode of the first transistor. A second conductive electrode. When writing data, a positive first voltage is supplied to the control gates of the first transistor and the second transistor. A second voltage lower than the first voltage is supplied to the first conduction electrode of the second transistor. A third voltage lower than the second voltage is supplied to the first conduction electrode of the first transistor. A fourth voltage smaller than the second voltage is supplied to the second conducting electrodes of the first transistor and the second transistor.

  In summary, a semiconductor device according to still another aspect of the present invention is a semiconductor device that stores data in a nonvolatile manner, and the first transistor includes a floating gate, a control gate, and a first conduction electrode. And a second conduction electrode. The second transistor is coupled to a common floating gate with the first transistor, a control gate coupled to the control gate of the first transistor, a first conduction electrode, and a second conduction electrode of the first transistor. A second conductive electrode. When erasing data, a negative first voltage is supplied to the control gates of the first transistor and the second transistor. The first conduction electrode of the first transistor and the first conduction electrode of the second transistor are opened. A positive second voltage is supplied to the second conducting electrodes of the first transistor and the second transistor.

  In summary, a semiconductor device according to still another aspect of the present invention stores data in a nonvolatile manner using a difference in threshold voltage. The control circuit determines whether the threshold voltage of the memory cell is equal to or lower than the first verify voltage when erasing data. The control circuit applies an erase voltage for reducing the threshold voltage to the memory cell when the threshold voltage of the memory cell is not lower than the first verify voltage. The control circuit outputs a signal representing the first deterioration state when the application time of the erase voltage exceeds the first determination value. The control circuit outputs a signal indicating the second deterioration state when the application time of the erase voltage exceeds a second determination value that is larger than the first determination value.

  In summary, a semiconductor device according to still another aspect of the present invention stores data in a nonvolatile manner using a difference in threshold voltage. The control circuit determines whether the threshold voltage of the memory cell is equal to or lower than the first verify voltage when erasing data. The control circuit applies an erase voltage for reducing the threshold voltage to the memory cell when the threshold voltage of the memory cell is not equal to or lower than the first verify voltage, and further, the threshold voltage of the memory cell is smaller than the first verify voltage. It is determined whether or not the voltage is equal to or higher than 2 verify voltage. The control circuit applies a first write voltage for increasing the threshold voltage to the memory cell when the threshold voltage of the memory cell is not equal to or higher than the second verify voltage. When the threshold voltage of the memory cell is equal to or lower than the first verify voltage, the control circuit determines whether the threshold voltage of the memory cell is equal to or higher than a third verify voltage that is smaller than the first verify voltage and larger than the second verify voltage. Determine whether. The control circuit applies a second write voltage for increasing the threshold voltage to the memory cell when the voltage is not equal to or higher than the third verify voltage.

  In summary, a semiconductor device according to still another aspect of the present invention is a semiconductor device that stores data in a nonvolatile manner, and the first transistor includes a floating gate, a control gate, and a first conduction electrode. And a second conduction electrode. The second transistor is coupled to a common floating gate with the first transistor, a control gate coupled to the control gate of the first transistor, a first conduction electrode, and a second conduction electrode of the first transistor. A second conductive electrode. The control circuit compares the first current and the second current, and detects the presence or absence of a short circuit between the first conduction electrode of the first transistor and the first conduction electrode of the second transistor based on the comparison result. . The first current supplies a first voltage to both the first conduction electrode of the first transistor and the first conduction electrode of the second transistor, and the second conduction of the first transistor and the second transistor. When a second voltage different from the first voltage is supplied to the electrode, the first transistor and the first conductive electrode of the second transistor and the second conductive electrode of the first transistor and the second transistor It is a flowing current. The second current supplies a first voltage to one of the first conduction electrode of the first transistor and the first conduction electrode of the second transistor, and the second current of the first transistor and the second transistor This is a current that flows between the first conduction electrode of the first transistor and the second transistor and the second conduction electrode of the first transistor and the second transistor when the second voltage is supplied to the two conduction electrodes. .

  In summary, a semiconductor device according to still another aspect of the present invention is a semiconductor device that stores data in a nonvolatile manner, and the first transistor includes a floating gate, a control gate, and a first conduction electrode. And a second conduction electrode. The second transistor is coupled to a common floating gate with the first transistor, a control gate coupled to the control gate of the first transistor, a first conduction electrode, and a second conduction electrode of the first transistor. A second conductive electrode. The third transistor has a floating gate, a control gate, a first conduction electrode, and a second conduction electrode. The fourth transistor is coupled to a floating gate common to the third transistor, a control gate coupled to the control gate of the third transistor, a first conduction electrode, and a second conduction electrode of the third transistor. A second conductive electrode. The fifth transistor switches between conduction and non-conduction between the first conduction electrode of the second transistor and the first conduction electrode of the third transistor.

  In accordance with the present invention, a semiconductor device includes a first transistor and a second transistor having a floating gate common to the first transistor and a control gate coupled to the control gate of the first transistor. As a result, data reading and data writing can be performed on different channels, so that it is possible to prevent the threshold voltage of the memory cell from becoming difficult to decrease due to repeated data rewriting.

  Alternatively, according to the present invention, at the time of erasing data, the control circuit outputs a signal indicating the first deterioration state when the application time of the erase voltage or the write-back voltage exceeds the first determination value. The control circuit outputs a signal representing the second deterioration state when the application time of the erase voltage or the write-back voltage exceeds a second determination value that is smaller than the first determination value. As a result, in addition to the state where the required specification of the data erasing time is not satisfied, it is possible to recognize the state where the required specification of the data erasing time can be satisfied but the deterioration of the memory cell has progressed to some extent .

  Alternatively, according to the present invention, when erasing data, the control circuit determines whether or not the threshold voltage of the memory cell is equal to or lower than the first verify voltage, and when the threshold voltage of the memory cell is not equal to or lower than the first verify voltage. Applies an erase voltage for reducing the threshold voltage to the memory cell. Then, each time the erase voltage is applied, it is determined whether or not the threshold voltage of the memory cell is equal to or higher than a second verify voltage that is smaller than the first verify voltage, and when the threshold voltage of the memory cell is not equal to or higher than the second verify voltage. Applies a write voltage for increasing the threshold voltage to the memory cell. As a result, the data can be erased so that the threshold voltage distribution of the memory cell becomes narrow, so that the threshold voltage distribution of the memory cell can be prevented from becoming wide.

  Alternatively, according to the present invention, the control circuit supplies a voltage to both the first conductive electrode of the first transistor and the first conductive electrode of the second transistor, and supplies a voltage to either one of the first transistor. The currents flowing between the first conduction electrodes of the first transistor and the second transistor and the second conduction electrodes of the first transistor and the second transistor are compared. Based on the comparison result, the presence / absence of a short circuit between the first conduction electrode of the first transistor and the first conduction electrode of the second transistor is detected. Thereby, it is possible to prevent the threshold voltage of the memory cell from being easily lowered due to repeated data rewriting.

  Alternatively, according to the present invention, the semiconductor device includes a first transistor, and a second transistor having a floating gate common to the first transistor and a control gate coupled to the control gate of the first transistor. . A third transistor, and a fourth transistor having a control gate coupled to a floating gate common to the third transistor and a control gate of the third transistor. Furthermore, a fifth transistor that switches between conduction and non-conduction between the first conduction electrode of the second transistor and the first conduction electrode of the third transistor is provided. As a result, it is possible to detect the presence or absence of a short circuit between the first conduction electrode of the first transistor and the first conduction electrode of the second transistor, so that the threshold voltage of the memory cell is unlikely to decrease due to repeated data rewriting. Can be prevented.

  Therefore, according to the present invention, it is possible to prevent an increase in the data erasing time of the semiconductor device.

1 is a functional block diagram showing a configuration of a microcomputer built-in flash memory (microcomputer flash memory module) according to a first embodiment of the present invention. 1 is a diagram schematically showing a configuration of a memory mat according to a first embodiment of the present invention. 1 is a circuit diagram showing a configuration of a memory cell according to a first embodiment of the present invention. 1 is a cross-sectional view showing a configuration of a flash memory module according to a first embodiment of the present invention. FIG. 3 is a diagram showing voltages supplied to each voltage control line when reading data, writing data, and erasing data in the flash memory module according to the first embodiment of the present invention. FIG. 6 is a diagram showing an example of a data read operation for the memory cell of the flash memory module according to the first embodiment of the present invention. FIG. 4 is a diagram showing an example of a data write operation to the memory cell of the flash memory module according to the first embodiment of the present invention. FIG. 4 is a diagram showing an example of a data erasing operation for the memory cell of the flash memory module according to the first embodiment of the present invention. 1 is a functional block diagram showing a configuration of a semiconductor device according to a first embodiment of the present invention. It is a functional block diagram which shows the structure of the modification of the semiconductor device which concerns on the 1st Embodiment of this invention. 10 is a flowchart defining an operation procedure when a sequencer in the semiconductor device 202 according to the second embodiment of the present invention erases data from a flash memory module. It is a figure which shows threshold voltage distribution of the memory cell of the flash memory module which concerns on the 2nd Embodiment of this invention. It is a figure which shows the status register in the flash memory module which concerns on the 2nd Embodiment of this invention. 10 is a flowchart defining an operation procedure when a sequencer in a semiconductor device 203 according to a third embodiment of the present invention erases data from a flash memory module. It is a figure which shows the threshold voltage distribution of the memory cell of the flash memory module which concerns on the 3rd Embodiment of this invention. It is a figure which shows roughly the structure of the memory cell etc. in the semiconductor device 204 which concerns on the 4th Embodiment of this invention. In the threshold voltage test A of the memory cell, it is a diagram showing a current path when the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are short-circuited. It is a figure which shows the current pathway in the threshold voltage test B of a memory cell. It is a figure which shows the threshold voltage distribution of the memory cell acquired in each of the threshold voltage test A and B of a memory cell when the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are not short-circuited. It is a figure which shows the threshold voltage distribution of the memory cell acquired in each of the threshold voltage tests A and B of a memory cell when the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are short-circuited. It is a figure which shows roughly the structure of the memory cell etc. in the semiconductor device 205 concerning the 5th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<First Embodiment>
[Configuration and basic operation]
FIG. 1 is a functional block diagram showing a configuration of a microcomputer built-in flash memory (microcomputer flash memory module) according to the first embodiment of the present invention.

  Referring to FIG. 1, flash memory module 1 includes a memory mat 2 having flash memory cells, a row / column predecoder / bank decoder 3 for predecoding an externally applied address signal AD, and the row / column prefetch. In accordance with a predecode signal from decoder / bank decoder 3, a row decoder / select gate (SG) decoder 4 for selecting a row and a memory block of memory mat 2 and a predecode signal from row / column predecoder / bank decoder 3 Y decoder 5 for generating a signal for selecting a column of memory mat 2, and a corresponding column (bit line) of memory mat 2 is selected according to a column selection signal from Y decoder 5 and provided corresponding to each column Y gate / bit line reset times to initialize the voltage level of the selected bit line 6, a sense amplifier 7 for detecting data read to a column selected by the Y gate / bit line reset circuit 6 at the time of data reading, and a write operation for writing data to the selected column of the memory mat 2 at the time of data writing. And a source line / P well / bottom N well driver 9 for setting the voltage levels of the source line, P well, and bottom N well of the memory mat 2 in accordance with the operation mode.

  In the memory mat 2, flash memory cells are arranged in a matrix, and each flash memory cell stores data in a non-volatile manner according to the accumulated charge of the floating gate. The memory mat 2 is divided into a plurality of memory blocks, and the memory blocks are divided into a plurality of banks. For this memory block selection, a selection gate (selection transistor) is provided. Therefore, in memory mat 2, data is read from the memory cells in the selected row / column of the selected memory block in the selected bank.

  In this memory mat 2, a source line to which a memory cell is connected is provided, a P well for forming a substrate region of the memory cell transistor is provided, and a bottom N well is provided so as to surround the P well. . The voltage levels of these source line, P well and bottom N well are set by driver 9 in accordance with the data write / read / erase mode.

  Flash memory module 1 is further coupled to sense amplifier 7 and write driver 8 to perform internal operation of flash memory module 1 in accordance with data handler 10 for transferring read / write data, control signal CTL and address signal AD. The sequencer 11 that generates the output data Dout from the data provided from the data handler 10 and sequentially supplies it to the CPU (not shown), and the oscillator 12 that is activated by the control of the sequencer 11 and generates the clock signals CLK_SC and CLK_CP A power supply circuit 13 for generating internal voltages intVPP and Vin according to clock signal CLK_CP from oscillator 12, and an internal reset signal according to reset signals IRP_VDD and IRP_VPP given from the outside An oscillator 12 and a power supply circuit 13 generates a ntIRPVPP and a reset circuit 14 for initializing.

  Sequencer 11 further receives write data via an address signal bus, and its operation cycle is defined by clock signal CLK_SC from oscillator 12, and controls internal operations in accordance with a control signal and an address signal.

  The power supply circuit 13 generates an internal voltage Vin having a voltage level corresponding to each operation mode in accordance with the operation mode designation signal from the sequencer 11, and the row decoder / ST decoder 4 and the source line / P well / bottom N well driver. 9 and Y gate / bit line reset circuit 6 and write driver 8. The internal voltage Vin includes a plurality of types of voltages to be described later. In FIG. 1, these internal voltage groups are indicated by “Vin” in order to simplify the drawing.

  Voltages VDD and VPP are applied from the outside. The sequencer 11 operates according to the external power supply voltage VDD, and the oscillator 12 performs an oscillation operation using the external power supply voltage VDD and the internal voltage intVPP as operation power supplies, and generates clock signals CLK_SC and CLK_CP. Clock signal CLK_CP is at the amplitude intVPP level, while clock signal CLK_SC is at the amplitude VDD level. The power supply circuit 13 generates the internal voltages Vin and intVPP from the external power supply voltage VPP by the charge pump operation of the capacitor in accordance with these clock signals.

  In the oscillator 12, when two external power supply voltages VDD and VPP are applied, the oscillator 12 stably oscillates and generates clock signals CLK_SC and CLK_CP. As external power supply voltage VPP, for example, a voltage in a voltage range of 2.7 V to 6.5 V can be used. The external power supply voltage VDD has the same voltage level as the power supply voltage of the microcomputer, and is used in the interface portion with the microcomputer in the flash memory module.

  The external power supply voltage VPP is a voltage having a higher level than the external power supply voltage VDD, and is used by the power supply circuit 13 to generate an internal voltage. Since the external power supply voltage VPP is compatible with various systems, the allowable range of the voltage level is extremely wide.

  FIG. 2 is a diagram schematically showing a configuration of the memory mat according to the first embodiment of the present invention. In the following description, the direction in which the bit lines extend is referred to as the column direction, and the direction in which the word lines extend is referred to as the row direction. FIG. 2 typically shows one memory block.

  Referring to FIG. 2, memory block MB in memory mat 2 includes a plurality of memory cells MC arranged in a matrix, and a plurality of word lines WL arranged corresponding to each row of the plurality of memory cells. A plurality of main bit lines MBL arranged corresponding to the respective columns of the plurality of memory cells, selection gate lines SG_R and SG_P arranged corresponding to the memory blocks, a plurality of selection transistors TRS_R, and a plurality And select transistors TRS_P. Memory cell MC includes memory cell transistors TRA and TRB.

  A control voltage from the row decoder / select gate (SG) decoder 4 is supplied to the word line WL, the select gate line SG_R, and the select gate line SG_P. A control voltage from the Y gate / bit line reset circuit 6 is supplied to the main bit line MBL.

FIG. 3 is a circuit diagram showing a configuration of the memory cell according to the first embodiment of the present invention.
Referring to FIG. 3, memory cell MC0 includes a memory cell transistor TRA for reading data and a memory cell transistor TRB for writing data. The memory cell transistor TRA has a floating gate FG, a control gate CG, a drain, and a source. The memory cell transistor TRB includes a floating gate FG common to the memory cell transistor TRA, a control gate CG coupled to the control gate CG of the memory cell transistor TRA, a drain, and a source coupled to the source of the memory cell transistor TRA. Have A parasitic diode D is formed between a P well PW and a bottom N well NW described later.

  In the memory cell MC0, the sub bit line SBL_R is connected to the drain of the memory cell transistor TRA, the source line SL is connected to the source, and the word line WL0 is connected to the gate. Sub-bit line SBL_P is connected to the drain of memory cell transistor TRB, source line SL is connected to the source, and word line WL0 is connected to the gate.

  Similarly, the memory cell MC1 includes a memory cell transistor TRA for reading data and a memory cell transistor TRB for writing data. The memory cell transistor TRA has a floating gate FG, a control gate CG, a drain, and a source. The memory cell transistor TRB includes a floating gate FG common to the memory cell transistor TRA, a control gate CG coupled to the control gate CG of the memory cell transistor TRA, a drain, and a source coupled to the source of the memory cell transistor TRA. Have A parasitic diode D is formed between a P well PW and a bottom N well NW described later.

  In the memory cell MC1, the sub bit line SBL_R is connected to the drain of the memory cell transistor TRA, the source line SL is connected to the source, and the word line WL1 is connected to the gate. The sub bit line SBL_P is connected to the drain of the memory cell transistor TRB, the source line SL is connected to the source, and the word line WL1 is connected to the gate.

  Select transistor TRS_R has a gate connected to select gate line SG_R, a drain connected to main bit line MBL, and a source connected to sub bit line SBL_R.

  Select transistor TRS_P has a gate connected to select gate line SG_P, a drain connected to main bit line MBL, and a source connected to sub bit line SBL_P.

  FIG. 4 is a cross-sectional view showing the configuration of the flash memory module according to the first embodiment of the present invention.

  Referring to FIG. 4, flash memory module 1 has, for example, a triple well structure, and includes a p − type substrate SUB, a bottom N well NW, and a P well PW. The memory cell transistor includes a control gate CG, a floating gate FG, n + type diffusion regions DR1, DR2, DR5, DR6, and p + type diffusion regions DR3, DR4. The drain and source of each of memory cell transistors TRA and TRB are formed in P well PW.

  More specifically, p − type substrate SUB is connected to ground potential node N1 to which a ground voltage is supplied. Bottom N well NW is formed on the main surface of p − type substrate SUB. N + type diffusion regions DR1 and DR2 are formed on the surface of bottom N well NW. P well PW is formed on the surface of bottom N well NW at a distance from the main surface of p − type substrate SUB. The p + type diffusion regions DR3 and DR4 are formed on the surface of the P well PW. N + type diffusion regions DR5 and DR6 are formed on the surface of P well PW with a spacing from bottom N well NW.

  The floating gate FG is provided above the channel in the P well PW sandwiched between the n + type diffusion regions DR5 and DR6 and spaced from the P well PW. The control gate CG is provided opposite to the channel in the P well PW sandwiched between the n + type diffusion regions DR5 and DR6 via the floating gate FG.

  FIG. 5 is a diagram showing voltages supplied to the respective voltage control lines at the time of data reading, data writing and data erasing of the flash memory module according to the first embodiment of the present invention. That is, FIG. 5 shows voltages supplied to the word line WL, the sub bit line SBL_R, the sub bit line SBL_P, the source line SL, the P well PW, the selection gate line SG_R, the selection gate line SG_P, the main bit line MBL, and the bottom N well NW. Is shown. “Select” represents a memory cell that is a target of data read, data write, or data erase, and “non-select” represents a memory cell that is not a target of data read, data write, or data erase.

  FIG. 6 is a diagram showing an example of the data read operation for the memory cell of the flash memory module according to the first embodiment of the present invention.

  5 and 6, when data is read from memory cell MC, a positive first voltage is supplied to memory cell transistor TRA and control gate CG of memory cell transistor TRB, and a first voltage is applied to the drain of memory cell transistor TRA. A positive second voltage lower than the voltage is supplied, a third voltage lower than the second voltage is supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB, and a fourth lower voltage than the second voltage is supplied to the drain of the memory cell transistor TRB. A voltage is supplied, and a fifth voltage equal to or lower than the third voltage is supplied to the P well PW. Further, by supplying a sixth voltage not lower than the fifth voltage to the bottom N well NW, forward bias between the P well PW and the bottom N well NW can be prevented.

  For example, under the control of the sequencer 11, a voltage of 5V is supplied to the control gate CG of the memory cell transistor TRA and the memory cell transistor TRB, and 1V is supplied to the drain of the memory cell transistor TRA via the main bit line MBL and the sub bit line SBL_R. Is supplied, the ground voltage is supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB, the ground voltage is supplied to the drain of the memory cell transistor TRB, and the ground voltage is supplied to the P well PW. Further, external power supply voltage VDD, for example, a voltage of 1.5 V is supplied to bottom N well NW. Further, a voltage of 6V is supplied to the gate of the selection transistor TRS_R via the selection gate line SG_R, and a ground voltage is supplied to the gate of the selection transistor TRS_P via the selection gate line SG_P.

  In this way, by making the voltage supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB equal to the voltage supplied to the drain of the memory cell transistor TRB, the drain- Ensure that no current flows between the sources, i.e. the channels.

  Further, by equalizing the voltage supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB and the voltage supplied to the P well PW, the source of the memory cell transistor TRA and the memory cell transistor TRB and the P well PW A forward bias between the two can be prevented.

  Data reading from the memory cell MC is performed as follows. That is, the selection transistor TRS_R is turned on and the selection transistor TRS_P is turned off. Then, the read voltage is applied to the control gate CG of the memory cell transistor TRA and the memory cell transistor TRB via the word line WL. Then, the sense amplifier 7 determines whether or not a current flows through a channel formed between the source and drain of the memory cell transistor for reading, that is, the memory cell transistor TRA.

  The above is the operation for the selected memory cell MC, that is, the memory cell MC that is the target of data reading. However, for the non-selected memory cell MC that is not the target of data reading at the time of data reading, for example, the following operation is performed. Become. That is, based on the control of the sequencer 11, the ground voltage is supplied to the control gate CG, the drain, the source, and the P well PW of the memory cell transistor TRA and the memory cell transistor TRB. Further, external power supply voltage VDD, for example, a voltage of 1.5 V is supplied to bottom N well NW. The ground voltage is supplied to the gate of the selection transistor TRS_R via the selection gate line SG_R, and the ground voltage is supplied to the gate of the selection transistor TRS_P via the selection gate line SG_P.

  FIG. 7 is a diagram showing an example of a data write operation to the memory cell of the flash memory module according to the first embodiment of the present invention.

  Referring to FIGS. 5 and 7, when data is written to memory cell MC, a positive first voltage is supplied to memory cell transistor TRA and control gate CG of memory cell transistor TRB, and a first voltage is applied to the drain of memory cell transistor TRB. A second voltage lower than the second voltage is supplied, a third voltage lower than the second voltage is supplied to the drain of the memory cell transistor TRA, and a fourth voltage lower than the second voltage is supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB. The fifth voltage smaller than the fourth voltage is supplied to the P well PW. Further, by supplying a sixth voltage not lower than the fifth voltage to the bottom N well NW, forward bias between the P well PW and the bottom N well NW can be prevented.

  For example, under the control of the sequencer 11, a voltage of 10V is supplied to the control gate CG of the memory cell transistor TRA and the memory cell transistor TRB, and 4V is supplied to the drain of the memory cell transistor TRB via the main bit line MBL and the sub bit line SBL_P. Is supplied, a ground voltage is supplied to the drain of the memory cell transistor TRA, a ground voltage is supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB, and a voltage of −1 V is supplied to the P well PW. Further, external power supply voltage VDD, for example, a voltage of 1.5 V is supplied to bottom N well NW.

  In this way, by equalizing the voltage supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB and the voltage supplied to the drain of the memory cell transistor TRA, the drain- Since it is possible to prevent a current from flowing between the sources, that is, the channel, deterioration of the memory cell transistor TRA can be prevented.

  Further, by reducing the voltage supplied to the P well PW as compared with the voltage supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB, an electric field can be generated and the electron injection efficiency can be increased.

  Data writing to the memory cell MC is performed as follows. That is, the selection transistor TRS_R is turned off and the selection transistor TRS_P is turned on. Then, using the CHE (Channel Hot Electron) phenomenon, electrons are injected into the floating gate FG from the channel formed between the source and drain of the memory cell transistor for writing, that is, the memory cell transistor TRB, and the threshold voltage is gradually increased. To rise. That is, the sequencer 11 performs data writing by setting the threshold voltage of the memory cell MC to be written to the threshold voltage corresponding to the logic level of the data received from the microcomputer. For example, the sequencer 11 increases the threshold voltage corresponding to the logical level “0” from the threshold voltage corresponding to the logical level “1” in the erased state.

  The above is the operation for the selected memory cell MC, that is, the memory cell MC that is the target of data writing. Become. That is, the ground voltage is supplied to the control gate CG, the drain, and the source of the memory cell transistor TRA and the memory cell transistor TRB based on the control of the sequencer 11. A voltage of −1 V is supplied to the P well PW of the memory cell transistor TRA and the memory cell transistor TRB. Further, external power supply voltage VDD, for example, a voltage of 1.5 V is supplied to bottom N well NW. The ground voltage is supplied to the gate of the selection transistor TRS_R via the selection gate line SG_R, and the ground voltage is supplied to the gate of the selection transistor TRS_P via the selection gate line SG_P.

  FIG. 8 is a diagram showing an example of the data erasing operation for the memory cell of the flash memory module according to the first embodiment of the present invention.

  Referring to FIGS. 5 and 8, when data is erased from memory cell MC, negative first voltage is supplied to control gate CG of memory cell transistor TRA and memory cell transistor TRB, and the drain of memory cell transistor TRA and the memory cell The drain of the transistor TRB is opened, the positive second voltage is supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB, and the positive third voltage is supplied to the P well PW. Further, by supplying a fourth voltage not lower than the third voltage to the bottom N well NW, a forward bias between the P well PW and the bottom N well NW can be prevented.

  For example, based on the control of the sequencer 11, a voltage of −9 V is supplied to the control gate CG of the memory cell transistor TRA and the memory cell transistor TRB, the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are opened, and the memory A voltage of 10V is supplied to the sources of the cell transistor TRA and the memory cell transistor TRB, and a voltage of 10V is supplied to the P well PW. A voltage of 11V is supplied to the bottom N well NW. Further, the main bit line MBL is opened.

  In this way, by equalizing the voltage supplied to the sources of the memory cell transistor TRA and the memory cell transistor TRB and the voltage supplied to the P well PW, the source and the P well of the memory cell transistor TRA and the memory cell transistor TRB. A forward bias between PW can be prevented.

  Data erasure with respect to the memory cell MC is performed as follows. That is, the selection transistor TRS_R is turned off and the selection transistor TRS_P is turned off. Then, by utilizing the FN (Fowler-Nordheim) tunnel phenomenon, electrons are extracted from the floating gate FG, which is a charge storage layer, to both channels formed between the source and drain of the memory cell transistors TRA and TRB, and a threshold voltage is set. The threshold voltage corresponding to the logical level “1” in the erased state is lowered.

  The above is the operation for the selected memory cell MC, that is, the memory cell MC that is the data erasure target. Become. That is, based on the control of the sequencer 11, the ground voltage is supplied to the control gate CG, the source and the P well PW of the memory cell transistor TRA and the memory cell transistor TRB. A voltage of 11V is supplied to the bottom N well NW. The ground voltage is supplied to the gate of the selection transistor TRS_R via the selection gate line SG_R, and the ground voltage is supplied to the gate of the selection transistor TRS_P via the selection gate line SG_P.

  FIG. 9 is a functional block diagram showing the configuration of the semiconductor device according to the first embodiment of the present invention.

  Referring to FIG. 9, semiconductor device 201A is a microcomputer, for example, SRAM (Static Random Access Memory) 101, CPU (Central Processing Unit) 102, flash memory modules 103 and 104, and high-speed buses BUSHL and BUSHU. And a low-speed bus BUSL.

  The flash memory modules 103 and 104 have the same configuration as the flash memory module 1 described above. The flash memory module 103 stores program code. The flash memory module 104 stores data.

  Further, the CPU 102 outputs an address signal, a control signal, and the like to the flash memory modules 103 and 104, thereby performing data reading and data erasing with respect to the flash memory modules 103 and 104. The CPU 102 writes data to the flash memory modules 103 and 104 by outputting address signals, data signals, control signals, and the like to the flash memory modules 103 and 104.

  More specifically, the CPU 102 writes data to the flash memory module 104 via the low-speed bus BUSL while reading the program code from the flash memory module 103 via the high-speed bus BUSHU. Further, the CPU 102 writes a program code to the flash memory module 103 via the high-speed bus BUSHU while reading data from the flash memory module 104 via the low-speed bus BUSL. As described above, the semiconductor device 201A according to the first embodiment of the present invention can cope with a BGO (Back Ground Operation) operation.

  Further, the CPU 102 reads out data and erases data from the SRAM 101 by outputting an address signal, a control signal, and the like to the SRAM 101. The CPU 102 writes data to the SRAM 101 by outputting an address signal, a data signal, a control signal, and the like to the SRAM 101.

  FIG. 10 is a functional block diagram showing a configuration of a variation of the semiconductor device according to the first embodiment of the present invention.

  Referring to FIG. 10, semiconductor device 201B is, for example, a microcomputer, and includes SRAM (Static Random Access Memory) 101, CPU (Central Processing Unit) 102, flash memory module 107, high-speed buses BUSHL and BUSHU, And a low-speed bus BUSL. The flash memory module 107 is a single chip including the flash memory modules 105 and 106.

  The flash memory modules 105 and 106 have substantially the same configuration as the flash memory module 1 described above, except that the sequencer 11 and the power supply circuit 13 are shared. The flash memory module 105 stores program code. The flash memory module 106 stores data.

  When the sequencer included in the flash memory module 107 individually controls the flash memory modules 105 and 106, a BGO operation similar to that of the semiconductor device 201A shown in FIG. 9 is possible.

  Generally, in a flash memory, electrons are trapped in a tunnel oxide film of a memory cell by repeatedly performing data rewriting, that is, data writing and data erasing. As a result, it is difficult to extract electrons into the channel, and the threshold voltage is difficult to decrease. Further, by repeatedly performing data rewriting, the channel deterioration due to CHE becomes large, and therefore, the transconductance of the transistor is deteriorated and the threshold voltage is hardly lowered. If the threshold voltage is difficult to decrease, it takes a long time to erase data, and the data erasure time does not satisfy the required specification. Further, under the condition that the data erasing time is constant, the threshold voltage remains larger, and the data read margin becomes smaller.

  However, in the semiconductor device according to the first embodiment of the present invention, the memory cell MC includes a memory cell transistor TRA for reading data and a memory cell transistor TRB for writing data. With such a configuration, data reading and data writing can be performed on separate channels, so that it is possible to prevent the trapping of electrons and the deterioration of mutual conductance due to data rewriting in the memory cell transistor TRA for data reading. Therefore, in the semiconductor device according to the first embodiment of the present invention, it is possible to prevent the threshold voltage of the memory cell from becoming difficult to decrease due to repeated data rewriting, and thus it is possible to prevent an increase in data erasing time.

  In addition, in the memory cell transistor for reading data, the number of electrons trapped in the tunnel oxide film is reduced. Therefore, the detrapping characteristic of electrons due to data rewriting, that is, the trapped electrons escape from the floating gate, thereby causing the threshold of the memory cell. The voltage can be prevented from lowering, and the data retention characteristics of the memory cell can be improved.

  The flash memory module according to the first embodiment of the present invention has been described on the assumption that it is a NOR type. However, the present invention is not limited to this, and the present invention is applicable to a NAND type flash memory. It is possible to apply.

  Next, another embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<Second Embodiment>
The present embodiment relates to a semiconductor device characterized by a data erasing sequence for a flash memory module as compared with the semiconductor device according to the first embodiment. The contents other than those described below are the same as those of the semiconductor device according to the first embodiment.

  FIG. 11 is a flowchart defining an operation procedure when the sequencer in the semiconductor device 202 according to the second embodiment of the present invention erases data from the flash memory module.

  FIG. 12 is a diagram showing a threshold voltage distribution of the memory cells of the flash memory module according to the second embodiment of the present invention. In FIG. 12, VR is a read voltage applied to the control gate CG of the memory cell MC in normal data read from the memory cell MC. For example, when the threshold voltage of the memory cell MC is smaller than the read voltage VR, the memory cell MC is determined to be in the erased state, that is, the logical level of the stored data is “1”. On the other hand, when the threshold voltage of the memory cell MC is higher than the read voltage VR, the memory cell MC is determined to be in the write state, that is, the logical level of the stored data is “0”.

  FIG. 13 is a diagram showing a status register in the flash memory module according to the second embodiment of the present invention.

  Referring to FIG. 13, status register REG has an 8-bit data area of bits B7 to B0. For example, bit B7 which is an MSB (Most Significant Bit) is a ready / busy bit, and is set to "0" when data is erased from the flash memory module during the sequence operation, for example, and the sequence operation ends. Set to “1”. Bit B6 is reserved. Bit B5 is an erase error bit, and is set to “1” when an erase error occurs in erase verify described later. Bit B4 is a write error bit, and is set to “1” when an error occurs in data writing to the flash memory module. Bit B3 is reserved. Bit B2 is an overwriting error bit, and is set to “1” when an error occurs in an overwriting error verify described later. Bit B1 is an overerase error bit, and is set to “1” when an error occurs in overerase verification described later. A bit B0 which is an LSB (Least Significant Bit) is an erase deterioration warning bit, and is set to “1” when deterioration of the memory cell MC is detected in erase verify or over-erase verify described later. The status register REG is provided in the above-described sequencer 11, for example. Bits B7 to B0 of the status register REG can be read, and for example, can be read by the CPU 102 described above.

  For example, sequencer 11 receives control signal CTL representing data erasure from CPU 102 and address signal AD, and first performs erase verify. That is, the sequencer 11 compares the threshold voltage of one memory cell MC to be erased with data or the upper skirt of the threshold voltage distribution of a plurality of memory cells MC to be erased, that is, the maximum value with the erase verify voltage VU. To do. Here, the erase verify voltage VU is a voltage smaller than the read voltage VR by a predetermined value. Here, description will be made on the assumption that there are a plurality of memory cells MC to be erased.

  More specifically, the sequencer 11 applies the erase verify voltage VU as a read voltage to the control gate CG of the memory cell MC to be erased. Other than the voltage applied to the control gate CG, for example, each voltage in the data read described with reference to FIGS. 5 and 6 is applied to the memory cell MC. Then, the sequencer 11 compares the erase verify voltage VU with the upper skirt of the threshold voltage distribution of the memory cell MC by determining whether the current flows through the memory cell MC with the sense amplifier 7.

  When the upper edge of the threshold voltage distribution of the memory cell MC to be erased is larger than the erase verify voltage VU (NO in step S1), the sequencer 11 determines the erase pulse as shown in the threshold voltage distribution A shown in FIG. The count value is increased by 1 (step S2).

  Then, when the erase pulse count value is n1 or less (NO in step S3) and the erase pulse count value is n2 or less (NO in step S5), the sequencer 11 deletes all data. An erase voltage is applied to the memory cell MC. For example, each voltage in the data erasure described with reference to FIGS. 5 and 8 is supplied to the memory cell MC in the flash memory module 1 in a pulse shape (step S7).

  Here, n1 is a value corresponding to the required specification of the semiconductor device 202, for example, a value corresponding to the required specification of the data erasing time for the flash memory module 1. N2 is a value smaller than n1. Further, n1 and n2 can be changed from the outside of the semiconductor device 202, for example. With such a configuration, setting according to the specifications of the device in which the semiconductor device 202 is used can be performed.

  If the count value of the erase pulse is greater than n1 (YES in step S3), the sequencer 11 determines that an erase error state has occurred, sets the erase error bit in the status register REG (step S4), and causes an abnormality. The process ends (step S17).

  On the other hand, when the erase pulse count value is n1 or less (NO in step S3) and the erase pulse count value is greater than n2 (YES in step S5), the sequencer 11 determines that the memory cell MC is It is determined that it has deteriorated, and the deterioration warning bit of the status register REG is set (step S6).

  After setting the deterioration warning bit, the sequencer 11 applies an erase voltage to all the memory cells MC to be erased (step S7).

  After applying the erase voltage to the memory cell MC, the sequencer 11 compares the upper threshold of the threshold voltage distribution of the memory cell MC with the erase verify voltage VU again. Then, the sequencer 11 performs overerase verification when the upper end of the threshold voltage distribution of the memory cell MC to be erased is equal to or lower than the erase verify voltage VU (YES in step S1). That is, the sequencer 11 compares the lower skirt, that is, the minimum value of the threshold voltage distribution of the plurality of memory cells MC to be erased with the overerase verify voltage VD. Here, the overerase verify voltage VD is a voltage smaller than the erase verify voltage VU by a predetermined value.

  More specifically, the sequencer 11 applies the overerase verify voltage VD as a read voltage to the control gate CG of the memory cell MC to be erased. The sequencer 11 compares the lower skirt of the threshold voltage distribution of the memory cell MC with the overerase verify voltage VD by determining whether or not a current flows through the memory cell MC by the sense amplifier 7.

  The sequencer 11 writes back when the lower end of the threshold voltage distribution of the memory cell MC to be erased is smaller than the overerase verify voltage VD (NO in step S8) as in the threshold voltage distribution B shown in FIG. The pulse count value is increased by 1 (step S9).

  When the write-back pulse count value is m1 or less (NO in step S10) and the write-back pulse count value is m2 or less (NO in step S12), the sequencer 11 performs data erasure. The write-back voltage is selectively applied to the memory cells MC whose threshold voltage is smaller than the over-erase verify voltage VD. For example, each voltage in the data writing described with reference to FIGS. 5 and 7 is supplied to the memory cell MC in the flash memory module 1 in a pulse shape. In this way, by selectively applying the write-back voltage to the memory cell MC, it is possible to prevent the threshold voltage of the normal memory cell MC from increasing (step S14).

  Here, m1 is a value corresponding to the required specification of the semiconductor device 202, for example, a value corresponding to the required specification of the data erasing time for the flash memory module 1. Moreover, m2 is a value smaller than n1. Further, m1 and m2 can be changed from the outside of the semiconductor device 202, for example. With such a configuration, setting according to the specifications of the device in which the semiconductor device 202 is used can be performed.

  If the count value of the write-back pulse is greater than m1 (YES in step S10), the sequencer 11 determines that an overerased error state has occurred, and sets the overerased error bit in the status register REG (step S11). ) Ends abnormally (step S17).

  On the other hand, when the count value of the write-back pulse is less than or equal to m1 (NO in step S10) and the count value of the write-back pulse is larger than m2 (YES in step S12), the sequencer 11 It is determined that the MC has deteriorated, and the deterioration warning bit of the status register REG is set (step S13).

  After setting the deterioration warning bit, the sequencer 11 selectively applies the write-back voltage to the memory cell MC whose threshold voltage is lower than the over-erase verify voltage VD among the memory cells MC to be erased (step S14). ).

  After applying the write-back voltage to the memory cell MC, the sequencer 11 again compares the lower skirt of the threshold voltage distribution of the memory cell MC with the overerase verify voltage VD. If the lower end of the threshold voltage distribution of the memory cell MC to be erased is equal to or higher than the overerase verify voltage VD (YES in step S8), the sequencer 11 performs overwrite-back verify. That is, the sequencer 11 compares the upper threshold of the threshold voltage distribution of the plurality of memory cells MC to be erased with the overwriting verify voltage. Here, the overwriting verify voltage is a voltage larger than the erase verify voltage VU and smaller than the read voltage VR. By making the erase verify voltage VU smaller than the overwrite-back verify voltage, it is possible to provide a write-back margin for the memory cell MC, that is, the threshold voltage exceeds the read voltage VR by the write-back to the memory cell MC. Can be surely prevented.

  If the upper end of the threshold voltage distribution of the memory cell MC to be erased is greater than the overwrite-back verify voltage (NO in step S15), the sequencer 11 determines that an overwrite-back error state has occurred, and status register REG. The overwriting return error bit is set (step S16), and the process ends abnormally (step S17).

  On the other hand, the sequencer 11 normally terminates the data erasing operation when the upper end of the threshold voltage distribution of the memory cell MC to be erased is equal to or lower than the overwriting verify voltage (YES in step S15) (step S18). . At this time, the threshold voltage distribution of the memory cell MC to be erased becomes, for example, a threshold voltage distribution C shown in FIG.

  As described above, the flash memory deteriorates every time data rewrite, that is, data write and data erase is repeated, and the threshold voltage is unlikely to decrease, and it takes a long time to erase data. The specification will not be met.

  Here, in the conventional semiconductor device, when the data erasure fails, that is, when the data erasure is not completed within a predetermined time, the control circuit such as a CPU for controlling the flash memory module is a flash memory module or other An alternative area is prepared in the memory circuit and data is stored. The control circuit cannot determine whether or not the data erasure is successful unless the data is actually erased from the flash memory module. In addition, the conventional semiconductor device can obtain only information on whether data erasure has succeeded or failed. For this reason, it is necessary to prepare an alternative area during the data erasing process and perform the data erasing again, which increases the data processing time.

  However, the semiconductor device according to the second embodiment of the present invention has two determination values for the number of application times of the erase voltage or the write-back voltage. That is, the sequencer 11 sets the erase error bit or the over-erase error bit when the application time of the erase voltage or the write-back voltage exceeds the first determination value (n1 or m1). Further, the sequencer 11 sets the deterioration warning bit when the application time of the erase voltage or the write-back voltage exceeds a second determination value (n2 or m2) that is smaller than the first determination value. With such a configuration, in addition to a state that does not satisfy the required specification of the data erasing time, it is possible to externally recognize a state in which the required specification of the data erasing time can be satisfied but the deterioration of the memory cell has progressed to some extent be able to. As a result, even when data erasure ends normally, it is possible to detect that there is a high possibility that the data erasure will end abnormally due to further deterioration of the memory cells. For this reason, it is possible to take measures to prevent an increase in data erasure time, such as preparing an alternative area in advance on the user or host side. Therefore, in the semiconductor device according to the second embodiment of the present invention, an increase in data erasing time can be prevented. Further, the degree of freedom of processing for the semiconductor device and the safety of stored data can be improved.

  In the flash memory module according to the second embodiment of the present invention, the sequencer 11 includes the status register REG. However, the present invention is not limited to this. The sequencer 11 may be configured to output signals representing an error state and a warning state to the outside instead of including the status register REG.

  In the flash memory module according to the second embodiment of the present invention, n1, n2, m1, and m2 are the numbers of times. However, the present invention is not limited to this, and is applied to the control gate CG of the memory cell MC. Any value may be used as long as it indicates the application time of the erase voltage or write-back voltage.

  In the flash memory module according to the second embodiment of the present invention, the sequencer 11 applies a pulsed erase voltage and a pulsed writeback voltage to the control gate CG of the memory cell MC, that is, intermittently. Although the configuration is such that the erase voltage and the write-back voltage are applied, the present invention is not limited to this. The sequencer 11 may be configured to continuously apply the erase voltage and the write back voltage to the control gate CG of the memory cell MC and measure the application time of the erase voltage and the write back voltage.

  Further, the memory cell in the flash memory module according to the second embodiment of the present invention is not limited to the configuration shown in FIGS. 2 and 3, and data is stored in a non-volatile manner using the difference in threshold voltage. The present invention can be applied to any memory cell that stores data.

  Next, another embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<Third Embodiment>
The present embodiment relates to a semiconductor device in which a new verify operation is added in the data erasing sequence as compared with the semiconductor device according to the second embodiment. Except for the contents described below, the semiconductor device is the same as that of the second embodiment.

  FIG. 14 is a flowchart defining an operation procedure when the sequencer in the semiconductor device 203 according to the third embodiment of the present invention erases data from the flash memory module.

  FIG. 15 is a diagram showing the threshold voltage distribution of the memory cells of the flash memory module according to the third embodiment of the present invention. Except for an over-erase verify voltage VN described later, this is the same as FIG.

  For example, sequencer 11 receives control signal CTL representing data erasure from CPU 102 and address signal AD, and first performs erase verify. That is, the sequencer 11 compares the threshold voltage of one memory cell MC to be erased with data or the upper skirt of the threshold voltage distribution of a plurality of memory cells MC to be erased, that is, the maximum value with the erase verify voltage VU. To do. Here, the erase verify voltage VU is a voltage smaller than the read voltage VR by a predetermined value. Here, description will be made on the assumption that there are a plurality of memory cells MC to be erased.

  More specifically, the sequencer 11 applies the erase verify voltage VU as a read voltage to the control gate CG of the memory cell MC to be erased. Other than the voltage applied to the control gate CG, for example, each voltage in the data read described with reference to FIGS. 5 and 6 is applied to the memory cell MC. Then, the sequencer 11 compares the erase verify voltage VU with the upper skirt of the threshold voltage distribution of the memory cell MC by determining whether the current flows through the memory cell MC with the sense amplifier 7.

  When the upper end of the threshold voltage distribution of the memory cell MC to be erased is larger than the erase verify voltage VU (NO in step S21), the sequencer 11 determines the erase pulse as shown in the threshold voltage distribution A shown in FIG. The count value is increased by 1 (step S22).

  If the count value of the erase pulse is larger than n1 (YES in step S23), the sequencer 11 determines that the erase error state has occurred, sets the erase error bit in the status register REG (step S24), and causes an abnormality. The process ends (step S35). Here, the status register REG provided in the semiconductor device 203 is, for example, a spare bit B0 of the status register REG shown in FIG.

  Here, n1 is a value corresponding to the required specification of the semiconductor device 203, for example, a value corresponding to the required specification of the data erasing time for the flash memory module 1. Further, n1 can be changed from the outside of the semiconductor device 203, for example. With such a configuration, setting according to the specifications of the device in which the semiconductor device 203 is used can be performed.

  On the other hand, when the count value of the erase pulse is n1 or less (NO in step S23), the sequencer 11 applies the erase voltage to all the memory cells MC to be erased. For example, each voltage in the data erasure described with reference to FIGS. 5 and 8 is supplied to the memory cell MC in the flash memory module 1 in a pulse shape (step S25).

  Then, the sequencer 11 performs an excess erase verify. That is, the sequencer 11 compares the lower skirt of the threshold voltage distribution of the plurality of memory cells MC to be erased with the excess erase verify voltage VN. Here, the overerase verify voltage VN is a voltage lower than an overerase verify voltage VD described later, and is, for example, a negative voltage.

  More specifically, the sequencer 11 applies the excess erase verify voltage VN as a read voltage to the control gate CG of the memory cell MC to be erased. Then, the sequencer 11 compares the lower skirt of the threshold voltage distribution of the memory cell MC with the excess erase verify voltage VN by determining whether the current flows through the memory cell MC with the sense amplifier 7.

  The sequencer 11 erases the data when the lower skirt of the threshold voltage distribution of the memory cell MC to be erased is smaller than the excess erase verify voltage VN (NO in step S26) as in the threshold voltage distribution D shown in FIG. A small amount of pulsed write-back voltage is applied to the control gate CG of the target memory cell MC. In this case, the write-back voltage is a voltage smaller than an overerase verify voltage VD described later and larger than an excess erase verify voltage VN. Other than the voltage applied to the control gate CG, for example, each voltage in the data writing described with reference to FIGS. 5 and 7 is applied to the memory cell MC in a pulse shape. The sequencer 11 applies a write back voltage to the control gates CG of all the memory cells MC to be erased when there are a plurality of memory cells MC to be erased. Usually, the difference between the threshold voltage of the normal memory cell MC and the threshold voltage of the memory cell MC that fails the over-erase verification is large. For this reason, even if the write-back voltage is applied to all the memory cells MC to be erased, only the threshold voltage of the memory cell whose threshold voltage is extremely smaller than that of the normal memory cell MC can be selectively increased. Yes (step 27).

  After applying the write-back voltage to the memory cell MC, the sequencer 11 compares the upper threshold of the threshold voltage distribution of the memory cell MC with the erase verify voltage VU again. In addition, when the lower skirt of the threshold voltage distribution of the memory cell MC to be erased is greater than the excess erasure verify voltage VN (YES in step S26), the sequencer 11 again determines the upper skirt of the threshold voltage distribution of the memory cell MC. The erase verify voltage VU is compared. If the upper end of the threshold voltage distribution of the memory cell MC to be erased is equal to or lower than the erase verify voltage VU (YES in step S21), the sequencer 11 performs overerase verify. That is, the sequencer 11 compares the lower skirt, that is, the minimum value of the threshold voltage distribution of the plurality of memory cells MC to be erased with the overerase verify voltage VD. Here, the overerase verify voltage VD is a voltage smaller than the erase verify voltage VU by a predetermined value.

  More specifically, the sequencer 11 applies the overerase verify voltage VD as a read voltage to the control gate CG of the memory cell MC to be erased. The sequencer 11 compares the lower skirt of the threshold voltage distribution of the memory cell MC with the overerase verify voltage VD by determining whether or not a current flows through the memory cell MC by the sense amplifier 7.

  When the lower end of the threshold voltage distribution of the memory cell MC to be erased is smaller than the overerase verify voltage VD (NO in step S28), the sequencer 11 writes back the data, as in the threshold voltage distribution B shown in FIG. The pulse count value is increased by 1 (step S29).

  When the count value of the write-back pulse is less than or equal to m1 (NO in step S30), the sequencer 11 selects the memory cell MC whose threshold voltage is smaller than the overerase verify voltage VD among the memory cells MC to be erased. A write back voltage is selectively applied to the control gate CG. In this case, the write-back voltage is, for example, a voltage higher than the write-back voltage in the excess erase verify. Other than the voltage applied to the control gate CG, for example, each voltage in the data writing described with reference to FIGS. 5 and 7 is applied to the memory cell MC in a pulse shape. In this case, unlike the overerase verify, the difference between the threshold voltage of the normal memory cell MC and the threshold voltage of the memory cell MC that fails the overerase verify is small. For this reason, it is possible to prevent the threshold voltage of the normal memory cell MC from rising by selectively applying the write-back voltage to the memory cell MC (step S32).

  Here, m1 is a value corresponding to the required specification of the semiconductor device 203, for example, a value corresponding to the required specification of the data erasing time for the flash memory module 1. Further, m1 can be changed from the outside of the semiconductor device 203, for example. With such a configuration, setting according to the specifications of the device in which the semiconductor device 203 is used can be performed.

  If the count value of the write-back pulse is greater than m1 (YES in step S30), the sequencer 11 determines that an overerased error state has occurred, and sets the overerased error bit in the status register REG (step S31). ) Ends abnormally (step S35).

  After applying the write-back voltage to the memory cell MC, the sequencer 11 again compares the lower skirt of the threshold voltage distribution of the memory cell MC with the overerase verify voltage VD. If the lower end of the threshold voltage distribution of the memory cell MC to be erased is equal to or higher than the overerase verify voltage VD (YES in step S28), the sequencer 11 performs overwrite back verify. That is, the sequencer 11 compares the upper threshold of the threshold voltage distribution of the plurality of memory cells MC to be erased with the overwriting verify voltage. Here, the overwriting verify voltage is a voltage larger than the erase verify voltage VU and smaller than the read voltage VR. By making the erase verify voltage VU smaller than the overwrite-back verify voltage, it is possible to provide a write-back margin for the memory cell MC, that is, the threshold voltage exceeds the read voltage VR by the write-back to the memory cell MC. Can be surely prevented.

  If the upper end of the threshold voltage distribution of the memory cell MC to be erased is greater than the overwriting back verify voltage (NO in step S33), the sequencer 11 determines that an overwriting back error state has occurred, and status register REG. The overwriting error bit is set (step S34), and the process ends abnormally (step S35).

  On the other hand, the sequencer 11 normally terminates the data erasing operation when the upper end of the threshold voltage distribution of the memory cell MC to be erased is equal to or lower than the overwriting verify voltage (YES in step S33) (step S36). . At this time, the threshold voltage distribution of the memory cell MC to be erased becomes, for example, a threshold voltage distribution C shown in FIG.

  Generally, in a flash memory module, when erasing data, an erase voltage is repeatedly applied until the upper skirt of the threshold voltage distribution of the memory cell falls below the upper limit value of the threshold voltage range corresponding to the erased state. The erase voltage is excessively applied to the memory cells that are earlier than the upper limit value of the threshold voltage range earlier than the first memory cell. For this reason, there is a memory cell in which the threshold voltage becomes extremely small when the threshold voltage of all the memory cells to be erased falls below the upper limit value of the threshold voltage range corresponding to the erased state. The threshold voltage distribution of the memory cell becomes wide.

  A memory cell whose threshold voltage has become extremely small takes a considerably long time to write back. In addition, a memory cell having an extremely small threshold voltage is rapidly deteriorated because electrons are excessively injected and emitted, leading to a decrease in reliability. Therefore, it takes a long time to erase the data, and the data erasing time does not satisfy the required specification.

  Here, in the semiconductor device according to the third embodiment of the present invention, every time the erase voltage is applied to the memory cell MC in the erase verify, the excess erase verify voltage smaller than the overerase verify voltage VD used in the overerase verify. Overerase verification is performed to compare VN with the threshold voltage of the memory cell MC. If there is a memory cell whose threshold voltage is smaller than the overerase verify voltage VN, a write-back voltage smaller than the overerase verify voltage VD and greater than the overerase verify voltage VN is applied to the memory cell MC. Thus, by erasing the erasing voltage and the write back voltage alternately to the memory cell, it is possible to erase the data so that the threshold voltage distribution of the memory cell becomes narrow. Therefore, in the semiconductor device according to the third embodiment of the present invention, it is possible to prevent an increase in data erasing time by preventing the threshold voltage distribution of the memory cells from becoming wide. In addition, the reliability of the memory cell can be improved by preventing the deterioration of the memory cell.

  Note that the memory cell in the flash memory module according to the third embodiment of the present invention is not limited to the configuration shown in FIGS. 2 and 3, and the data is stored in a non-volatile manner using the difference in threshold voltage. The present invention can be applied to any memory cell that stores data.

  Next, another embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<Fourth embodiment>
The present embodiment relates to a semiconductor device to which a function of detecting a short circuit in a memory cell is added as compared with the semiconductor device according to the first embodiment. The contents other than those described below are the same as those of the semiconductor device according to the first embodiment.

  FIG. 16 is a diagram schematically showing a configuration of memory cells and the like in the semiconductor device 204 according to the fourth embodiment of the present invention. FIG. 16 shows a configuration in which the word line WL, the main bit line MBL, the sub bit line SBL_R, the sub bit line SBL_P, the source line SL, the selection gate line SG_R, and the selection gate line SG_P are selected in the configuration shown in FIG. A transistor TRS_R, a selection transistor TRS_P, and memory cell transistors TRA and TRB are representatively shown. Further, the sequencer 11 in the semiconductor device 204 includes a determination circuit 21. The determination circuit 21 detects the presence or absence of a short circuit between the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB based on the current flowing from the sense amplifier 7 to the source line SL.

  The sequencer 11 performs a threshold voltage test A of the memory cell. That is, the sequencer 11 turns on the selection transistor TRS_R and turns off the selection transistor TRS_P. Then, the sequencer 11 changes the read voltage supplied to the control gates CG of the memory cell transistors TRA and TRB through the word line WL within a predetermined range. Other than the voltage applied to the control gate CG, for example, each voltage in the data read described with reference to FIGS. 5 and 6 is applied to the memory cell MC. Then, the sequencer 11 determines whether or not a current flows through the memory cell MC by the sense amplifier 7, thereby acquiring a threshold voltage distribution of the memory cell at each voltage value in the read voltage change range. The acquired threshold voltage distribution is transferred from the sequencer 11 to a tester outside the semiconductor device 204 and stored in the tester. The tester displays the stored threshold voltage distribution, and outputs the stored threshold voltage distribution to another device as a log file.

  FIG. 16 shows a case where the sub bit line SBL_R and the sub bit line SBL_P, that is, the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are not short-circuited. That is, the current I1 supplied from the sense amplifier 7 flows to the source line SL via the main bit line MBL, the selection transistor TRS_R, the sub bit line SBL_R, and the memory cell transistor TRA.

  FIG. 17 is a diagram showing a current path when the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are short-circuited in the threshold voltage test A of the memory cell.

  Referring to FIG. 17, resistance SR is a resistance between the drain of memory cell transistor TRA that is short-circuited and the drain of memory cell transistor TRB.

  First, the current I2 supplied from the sense amplifier 7 flows to the source line SL via the main bit line MBL, the selection transistor TRS_R, the sub bit line SBL_R, and the memory cell transistor TRA.

  Here, since the control gate CG of the memory cell transistor TRB is coupled to the control gate CG of the memory cell transistor TRA, the control gate CG of the memory cell transistor TRB is applied to the control gate CG of the memory cell transistor TRA. The same voltage as the read voltage is applied. Therefore, in addition to the current path through the memory cell transistor TRA, the current I2 supplied from the sense amplifier 7 passes through the main bit line MBL, the selection transistor TRS_R, the sub bit line SBL_R, the sub bit line SBL_P, and the memory cell transistor TRB. It flows to the source line SL. Therefore, the current value of the current I2 is approximately twice that of the current I1.

  Incidentally, even when the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are short-circuited, it is possible to perform data writing, data reading and data erasing with respect to the memory cell. However, when such a short circuit occurs, data reading and data writing cannot be performed on separate channels. That is, in the memory cell transistor TRA for reading data, electron traps and mutual conductance are deteriorated due to data rewriting, and therefore, the threshold voltage of the memory cell is hardly lowered by repeated data rewriting. Therefore, the data erasing time increases. Further, even when the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are short-circuited, it is possible to perform data writing, data reading and data erasing with respect to the memory cell. In a normal test in which data writing, data reading and data erasing are performed, such a short state cannot be detected, and the data erasing time may increase after the semiconductor device is shipped.

  Therefore, in the semiconductor device 204 according to the fourth embodiment of the present invention, the following threshold voltage test B of the memory cell is performed.

FIG. 18 is a diagram showing a current path in the threshold voltage test B of the memory cell.
The sequencer 11 performs a threshold voltage test B of the memory cell. That is, the sequencer 11 turns on the selection transistor TRS_R and turns on the selection transistor TRS_P. Then, the sequencer 11 changes the read voltage supplied to the control gates CG of the memory cell transistors TRA and TRB through the word line WL within a predetermined range. Other than the voltage applied to the control gate CG, for example, each voltage in the data read described with reference to FIGS. 5 and 6 is applied to the memory cell MC. Then, the sequencer 11 determines whether or not a current flows through the memory cell MC by the sense amplifier 7, thereby acquiring a threshold voltage distribution of the memory cell at each voltage value in the read voltage change range.

  The current I3 supplied from the sense amplifier 7 flows to the source line SL via the main bit line MBL, the selection transistor TRS_R, the sub bit line SBL_R, and the memory cell transistor TRA. The current I3 supplied from the sense amplifier 7 flows to the source line SL via the main bit line MBL, the selection transistor TRS_P, the sub bit line SBL_P, and the memory cell transistor TRB. That is, the current value of the current I3 is approximately twice the current I1 regardless of whether or not there is a short circuit between the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB.

  FIG. 19 is a diagram showing the threshold voltage distribution of the memory cell obtained in each of the threshold voltage tests A and B of the memory cell when the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are not short-circuited. It is.

  Referring to FIG. 19, the threshold voltage distribution A of the memory cell acquired in the threshold voltage test A of the memory cell and the threshold voltage distribution B of the memory cell acquired in the threshold voltage test B of the memory cell are greatly different. As described above, in the threshold voltage test B of the memory cell, the current flowing from the sense amplifier 7 to the source line SL is approximately twice that of the threshold voltage test A of the memory cell. For this reason, the threshold voltage of the memory cell recognized by the sense amplifier 7 and the sequencer 11 is smaller in the threshold voltage test B of the memory cell than in the threshold voltage test A of the memory cell.

  FIG. 20 is a diagram showing the threshold voltage distribution of the memory cell acquired in each of the threshold voltage tests A and B of the memory cell when the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB are short-circuited. It is.

  Referring to FIG. 20, the threshold voltage distribution A of the memory cell acquired in the threshold voltage test A of the memory cell and the threshold voltage distribution B of the memory cell acquired in the threshold voltage test B of the memory cell are substantially the same. . This is because the current flowing from the sense amplifier 7 to the source line SL also in the threshold voltage test A of the memory cell as described above is not short-circuited between the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB. Almost double. For this reason, the threshold voltages of the memory cells recognized by the sense amplifier 7 and the sequencer 11 in the threshold voltage tests A and B of the memory cells are substantially the same.

  The determination circuit 21 compares the current flowing from the sense amplifier 7 to the source line SL in each of the threshold voltage test A of the memory cell and the threshold voltage test B of the memory cell, and if the difference between the two is less than a predetermined value, the memory It is determined that the drain of the cell transistor TRA and the drain of the memory cell transistor TRB are short-circuited.

  In the semiconductor device according to the fourth embodiment of the present invention, the presence / absence of a short circuit between the drain of the memory cell transistor TRA and the drain of the memory cell transistor TRB can be detected by the configuration as described above. Therefore, in the semiconductor device according to the fourth embodiment of the present invention, it is possible to prevent the threshold voltage of the memory cell from becoming difficult to decrease due to repeated data rewriting, and thus it is possible to prevent an increase in data erasing time.

  In the semiconductor device according to the fourth embodiment of the present invention, the memory cell includes the memory cell transistor TRA and the memory cell transistor TRB. However, the present invention is not limited to this. The memory cell may be a three-channel type, that is, a configuration further including a memory cell transistor for erasing data.

  Next, another embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<Fifth embodiment>
The present embodiment relates to a semiconductor device to which a function of detecting a short circuit in a memory cell is added as compared with the semiconductor device according to the first embodiment. The contents other than those described below are the same as those of the semiconductor device according to the first embodiment.

  FIG. 21 is a diagram schematically showing a configuration of memory cells and the like in the semiconductor device 205 according to the fifth embodiment of the present invention.

  Referring to FIG. 21, semiconductor device 205 further includes one bypass transistor TRBY for every two memory cells, as compared with the semiconductor device according to the first embodiment. That is, the semiconductor device 205 includes memory cells MC11 and MC12, select transistors TRS_R1 and TRS_R2, select transistors TRS_P1 and TRS_P2, bypass transistor TRBY, word line WL, main bit lines MBL0 and MBL1, and sub bit lines SBL_R1 and SBL_R2, sub-bit lines SBL_P1 and SBL_P2, source line SL, and select gate lines SG_R and SG_P are included. Memory cell MC11 includes memory cell transistors TRA1 and TRB1. Memory cell MC12 includes memory cell transistors TRA2 and TRB2.

  Bypass transistor TRBY is, for example, an N-channel MOS transistor, and has a drain connected to the drain of memory cell transistor TRB1, a source connected to the drain of memory cell transistor TRA2, and a gate.

  The bypass transistor TRBY switches between conduction and non-conduction between the drain of the memory cell transistor TRB1 and the drain of the memory cell transistor TRA2.

  The sequencer 11 in the semiconductor device 205 performs a memory cell short test. That is, the sequencer 11 turns on the selection transistors TRS_R1 and TRS_R2 and the bypass transistor TRBY, and turns off the selection transistors TRS_P1 and TRS_P2. The sequencer 11 turns off the memory cell transistors TRA1, TRA2, TRB1, and TRB2. Then, the sequencer 11 supplies the power supply voltage VDD to the drain of the memory cell transistor TRA1, and supplies the ground voltage VSS to the drain of the memory cell transistor TRA2. That is, the sequencer 11 supplies the power supply voltage VDD to the main bit line MBL0 and supplies the ground voltage VSS to the main bit line MBL1.

  Then, the sequencer 11 detects a current flowing between the drain of the memory cell transistor TRA1 and the drain of the memory cell transistor TRA2. More specifically, the sequencer 11 detects the current flowing from the sense amplifier 7 to the main bit line MBL1 via the main bit line MBL0 by the sense amplifier 7.

  When the drain of the memory cell transistor TRA1 and the drain of the memory cell transistor TRB1 are short-circuited, current flows from the sense amplifier 7 to the main bit line MBL1 via the main bit line MBL0 as shown in FIG.

  When the current flowing from the sense amplifier 7 to the main bit line MBL1 through the main bit line MBL0 is equal to or greater than a predetermined value, the sequencer 11 shorts between the drain of the memory cell transistor TRA1 and the drain of the memory cell transistor TRB1. Judge that

  As described in the fourth embodiment of the present invention, when the drain of the memory cell transistor TRA1 and the drain of the memory cell transistor TRB1 are short-circuited, data reading and data writing are performed on separate channels. Will not be able to. That is, in the memory cell transistor TRA for reading data, electron traps and mutual conductance are deteriorated due to data rewriting, and therefore, the threshold voltage of the memory cell is hardly lowered by repeated data rewriting. Therefore, the data erasing time increases. Further, even when the drain of the memory cell transistor TRA1 and the drain of the memory cell transistor TRB1 are short-circuited, it is possible to perform data writing, data reading and data erasing with respect to the memory cell. In a normal test in which data writing, data reading and data erasing are performed, such a short state cannot be detected, and the data erasing time may increase after the semiconductor device is shipped.

  However, in the semiconductor device according to the fifth embodiment of the present invention, the presence / absence of a short circuit between the drain of the memory cell transistor TRA1 and the drain of the memory cell transistor TRB1 can be detected by the configuration as described above. Therefore, in the semiconductor device according to the fifth embodiment of the present invention, it is possible to prevent the threshold voltage of the memory cell from becoming difficult to decrease due to repeated data rewriting, and thus it is possible to prevent an increase in data erasing time.

  In the semiconductor device according to the fifth embodiment of the present invention, for example, the memory cell MC11 includes the memory cell transistor TRA1 and the memory cell transistor TRB1, but the present invention is not limited to this. The memory cell may be a three-channel type, that is, a configuration further including a memory cell transistor for erasing data.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1, 103 to 107 Flash memory module, 2 memory mat, 3 row / column predecoder / bank decoder, 4 row decoder / select gate (SG) decoder, 5 Y decoder, 6 Y gate / bit line reset circuit, 7 sense amplifier , 8 Write driver, 9 Source line / P well / Bottom N well driver, 21 Judgment circuit, 101 SRAM, 102 CPU, 201A, 201B, 202 to 205 Semiconductor device, BUSHL, BUSHU high-speed bus, BUSL low-speed bus, MB memory Block, MC, MC0, MC11, MC12 Memory cell, MBL, MBL0, MBL1 Main bit line, SG_R1, SG_R2, SG_P1, SG_P2 Select gate line, SBL_R1, SBL_R2, SBL_P1, SBL_P2 Sub Bit line, SL source line, WL word line, TRS_R1, TRS_R2, TRS_P1, TRS_P2 selection transistor, TRA, TRB, TRA1, TRB1, TRA2, TRB2 memory cell transistor, TRBY bypass transistor, FG floating gate, CG control gate, PWP Well, NW bottom N well, D diode, SUB p-type substrate, DR1, DR2, DR5, DR6 n + type diffusion region, DR3, DR4 p + type diffusion region.

Claims (4)

A semiconductor device for storing data in a nonvolatile manner,
A first transistor having a floating gate, a control gate, a first conduction electrode, and a second conduction electrode;
A floating gate shared with the first transistor, a control gate coupled to the control gate of the first transistor, a first conduction electrode, and a second coupled to the second conduction electrode of the first transistor. A second transistor having a conductive electrode;
Supplying a first voltage to both the first conduction electrode of the first transistor and the first conduction electrode of the second transistor, and to the second conduction electrode of the first transistor and the second transistor; When a second voltage different from the first voltage is supplied, a first conduction electrode of the first transistor and the second transistor, a second conduction electrode of the first transistor and the second transistor, A first current flowing between the first transistor and the first conduction electrode of the first transistor and the first conduction electrode of the second transistor, and the first voltage In the case where the second voltage is supplied to the transistor and the second conduction electrode of the second transistor, the first transistor and the second transistor A second current flowing between the conduction electrode and the second conduction electrode of the first transistor and the second transistor; and based on the comparison result, the first conduction electrode of the first transistor and A semiconductor device comprising: a control circuit that detects the presence or absence of a short circuit between the first conductive electrodes of the second transistor.   When the difference between the first current and the second current is equal to or less than a predetermined value, the control circuit includes a first conduction electrode of the first transistor and a first conduction electrode of the second transistor. The semiconductor device according to claim 1, wherein the semiconductor device is determined to be short-circuited. A semiconductor device for storing data in a nonvolatile manner,
A first transistor having a floating gate, a control gate, a first conduction electrode, and a second conduction electrode;
A floating gate shared with the first transistor, a control gate coupled to the control gate of the first transistor, a first conduction electrode, and a second coupled to the second conduction electrode of the first transistor. A second transistor having a conductive electrode;
A third transistor having a floating gate, a control gate, a first conduction electrode, and a second conduction electrode;
A floating gate common to the third transistor, a control gate coupled to the control gate of the third transistor, a first conduction electrode, and a second conduction electrode coupled to the second conduction electrode of the third transistor. A fourth transistor having a conductive electrode;
A semiconductor device comprising: a fifth transistor that switches between conduction and non-conduction between a first conduction electrode of the second transistor and a first conduction electrode of the third transistor. The semiconductor device further includes:
The first transistor, the second transistor, the third transistor, and the fourth transistor are turned off, the fifth transistor is turned on, and a first conductive electrode of the first transistor is connected to the first conduction electrode. 1, a second voltage different from the first voltage is supplied to the first conduction electrode of the third transistor, and the first conduction electrode of the first transistor and the third transistor 4. The semiconductor according to claim 3, further comprising a control circuit that detects the presence or absence of a short circuit between the first conduction electrode of the first transistor and the first conduction electrode of the second transistor based on a current flowing between the first conduction electrodes. apparatus.

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