JP2012227483A - Electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which allows a necessary operation to be performed while watching an operation target, by disposing a transparent operation panel part on a window part of the apparatus.SOLUTION: The electronic component mounting apparatus includes: a substrate transport device 30; movable carriages 43 and 45; and a transparent window part 13 to permit perspective views of mechanical components, such as a component mounting head 52, and electronic components, from the outside of the apparatus. A transparent operation panel part 60 is disposed on the window part. The transparent operation panel part 60 can visually display the mechanical components and electronic components that necessitate an operation during a trouble, or during a plan change. The apparatus also includes an operation control part 61 that outputs an operation command to activate the mechanical components by designating the mechanical components and electronic components displayed on the operation panel part.

Description

  The present invention relates to an electronic component mounting apparatus in which a transparent operation panel portion is provided in a window portion through which the inside of the machine can be seen.

  Generally, in an electronic component mounting apparatus, a window portion made of a transparent acrylic cover is provided on the front surface of the mounting apparatus so that the inside of the apparatus can be seen through the window portion. The mounting apparatus is provided with an operation panel for operating the electronic component mounting apparatus in the vicinity of the window. Conventionally, when the window portion is enlarged, there is a problem in that the installation position of the operation panel and the size of the display of the operation panel are restricted.

  Patent Document 1 describes an electronic component supply device including a transparent touch panel (operation panel). In the device described in Patent Document 1, a transparent touch panel is provided on the upper surface of the tray carried into the tray carry-in position, and the tray component is accommodated by operating the touch panel to designate the position of the pocket containing the tray component. The position of the pocket that has been made can be entered.

Japanese Patent No. 4392227

  If the touch panel described in Patent Document 1 is provided in the window part of the electronic component mounting apparatus, even if the window part is enlarged, the operation panel mounting position and the display size are not restricted, and the operation can be performed. The panel can be made large, and the conventional problems can be solved.

  An object of the present invention is to provide an electronic component mounting apparatus in which a necessary operation can be performed while looking at an operation target by providing a transparent operation panel section in a window section of the mounting apparatus.

  In order to solve the above-described problems, the invention according to claim 1 is characterized in that a substrate carrying device provided on a base for carrying in, carrying out and positioning of the substrate, a direction of carrying the substrate with respect to the base, and A movable table supported so as to be movable in an orthogonal direction; a component supply device that supplies an electronic component to be mounted on the substrate; and an electronic component that is attached to the movable table and supplied by the component supply device. A component mounting head mounted on the substrate positioned and held by the substrate transport device, a substrate imaging device provided on the movable table for imaging the substrate, and an electron provided on the base and held on the component mounting head A component imaging device for imaging a component, and at least a transparent window portion through which the board conveying device, the movable table, the mechanical components of the component mounting head, and the electronic components can be seen from the outside of the machine In the obtained electronic component mounting apparatus, the window portion is provided with a transparent operation panel portion that can visually display the mechanical components and the electronic components that need to be operated at the time of trouble or setup change, and displayed on the operation panel portion. The operation control unit outputs an operation command for operating the machine component by instructing the machine component or the electronic component.

  According to a second aspect of the present invention, in the first aspect, the position of the operation panel unit or the display position of the mechanical component or the electronic component displayed on the operation panel unit is set in accordance with the viewpoint of the operator. It has position adjusting means for adjusting in the vertical direction.

  A feature of the invention according to claim 3 is that in claim 1 or claim 2, when an operator performs a finger operation on the machine component or the electronic component displayed on the operation panel unit, the finger operation is performed. The operation control unit outputs a corresponding operation command.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, when an operator touches the mechanical component or the electronic component displayed on the operation panel unit, the mechanical component And a submenu for executing an operation necessary for the electronic component is displayed, and the operation control unit outputs an operation command corresponding to the selected submenu when the operator selects the displayed submenu. That is.

  According to a fifth aspect of the present invention, in the third aspect of the invention, in accordance with the operation mode of the finger operation, a captured image capturing range of an imaging device that images the mechanical component or the electronic component is moved, enlarged, or reduced. It is to be displayed.

  According to the invention according to claim 1 configured as described above, the mechanical components and electronic components that need to be operated at the time of trouble or changeover in the transparent window portion through which the mechanical components and electronic components can be seen from the outside of the machine. A transparent operation panel unit that can visually display parts is provided, and an operation control unit that outputs an operation command to operate the machine component by instructing the machine component or electronic component displayed on the operation panel unit is provided. doing.

  As a result, even if the window is enlarged, the operation panel mounting position is not restricted, and the operation panel can be enlarged. The operability can be improved.

  According to the second aspect of the invention, the position adjustment means is provided for adjusting the position of the operation panel unit or the position of the machine component or electronic component displayed on the operation panel unit in the vertical direction in accordance with the viewpoint of the operator. Therefore, the operation target can be displayed on the operation panel unit on the line connecting the operator's viewpoint and the operation target regardless of the change of the operator's viewpoint position.

  According to the invention of claim 3, the operation control unit outputs an operation command corresponding to the finger operation when the operator performs a finger operation on the machine component or the electronic component displayed on the operation panel unit. As a result, the operation target can be operated intuitively, and complicated operations can be easily performed.

  According to the invention of claim 4, when an operator touches a machine component or electronic component displayed on the operation panel unit, a submenu for executing an operation required for the machine component or electronic component is displayed and displayed. When the operator selects an appropriate submenu, the operation control unit outputs an operation command according to the selected submenu, so it is easy to re-handle or discard the electronic component when a suction error occurs. Can be done.

  According to the fifth aspect of the present invention, the capture range of the captured image of the imaging device that images the mechanical component and the electronic component is moved, enlarged, or reduced according to the operation mode of the finger operation. In response to the operator's request, the captured image capturing range of the imaging device can be intuitively operated, and the operator can easily take measures such as troubles.

1 is a perspective view showing the entirety of an electronic component mounting apparatus showing a first embodiment of the present invention. It is a perspective view which shows the structure of the electronic component mounting apparatus which concerns on 1st Embodiment. It is a figure which shows the operation panel part provided in the window part. It is the figure which looked at the inside of a machine through the window part of the electronic component mounting apparatus. It is a figure which shows the control apparatus which controls an electronic component mounting apparatus. It is a figure which shows the position adjustment means of an operation panel part. It is a figure which shows an example of the operation which concerns on 1st Embodiment. It is a figure which shows another example of the operation which concerns on 1st Embodiment. It is a perspective view which shows the electronic component mounting apparatus which shows the 2nd Embodiment of this invention. It is a figure which shows the push-up pin which pushes up the electronic component which concerns on 2nd Embodiment. It is a figure which shows an example of the operation which concerns on 2nd Embodiment. It is a figure which shows the modification of the position adjustment means of an operation panel part.

  Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the electronic component mounting apparatus 10 includes a base module 11 and a component mounting module 12 installed on the base module 11, and the electronic component mounting apparatus 10 having the module configuration includes a required number of units. Only aligned next to each other. A window 13 made of a transparent acrylic plate is provided on the front surface of the electronic component mounting apparatus 10, and an operator can see through the window 13 the mechanical components and electronic components that constitute the component mounting module 12. Yes.

  As shown in FIG. 2, the component mounting module 12 of the electronic component mounting apparatus 10 includes a component supply device 20, a board transfer device 30, and a component transfer device 40.

  As an example, the component supply device 20 is configured by arranging a plurality of cassette-type feeders 21 in parallel on the base 11 a of the base module 11. The feeder 21 includes a main body frame 22 that is detachably attached to the base 11 a and a supply reel 23 that can be detachably attached to the rear portion of the main body frame 22, and an electronic component is provided at the tip of the main body frame 22. Can be supplied sequentially.

  The board conveying device 30 conveys the circuit board S in the alignment direction (X-axis direction) of the electronic component mounting apparatus 10, and as an example, is constituted by a double conveyor type in which two rows of conveying means 31 and 32 are arranged side by side. Has been. Each of the conveying means 31 and 32 has a pair of guide rails 33 and 34 arranged in parallel on the base 11a of the base module 11 so as to face each other in parallel. A pair of conveyor belts for supporting and transporting the circuit board S guided by the guide rails 33 and 34 are arranged in parallel on the transport means 31 and 32.

  The component transfer device 40 includes an XY robot, is mounted on the base module 11 and is disposed above the component supply device 20 and the substrate transfer device 30, and is along the guide rail 41 and is perpendicular to the X-axis direction. A Y-axis moving table 43 that is movable in the direction is provided. The movement of the Y-axis moving table 43 in the Y-axis direction is controlled by a servo motor 44 via a ball screw. An X-axis moving table 45 is guided and supported on the Y-axis moving table 43 so as to be movable in the X-axis direction, and movement of the X-axis moving table 45 in the X-axis direction is controlled by a servo motor 46 via a ball screw.

  A mounting head main body 47 and a board camera 48 as an imaging device for imaging the circuit board S are attached to the X-axis moving table 45. A component mounting head 52 is guided and supported on the mounting head main body 47 so as to be movable up and down in a Z-axis direction perpendicular to the X-axis and Y-axis directions, and is lifted and lowered by a servo motor 51 via a ball screw. A suction nozzle 53 that holds the electronic component P by suction is held at the lower end of the component mounting head 52. The suction nozzle 53 is supported by the component mounting head 52 so as to be rotatable about a center line parallel to the Z axis, and the rotation angle is controlled by a servo motor (not shown).

  In addition, a plurality of suction nozzles 53 can be indexed on the component mounting head 52 so that various electronic components P having different shapes and sizes can be sucked, or the component mounting head 52 can be attached to and detached from the X-axis moving table 45. By providing the electronic component P, the corresponding suction nozzle 53 can be easily changed as the electronic component P is changed.

  A component camera 55 is provided between the component supply device 20 and the substrate transport device 30 as an imaging device that captures an image of the electronic component P sucked by the suction nozzle 53 from below and images the suction state of the electronic component P. ing. A lighting device 56 is fixed above the component camera 55.

  As shown in FIG. 3, the window 13 of the electronic component mounting apparatus 10 is provided with an operation panel 60 that is transparent (including translucent) and capable of displaying a screen. The operator mounts the electronic component through the operation panel 60. The interior 10a of the apparatus 10 can be seen through. In addition, the operation panel unit 60 transmits an operation command corresponding to the operation to the drive control unit 61 (see FIG. 5) by performing an operation determined by touching by the operator. The operation panel unit 60 and the drive control unit 61 constitute an operation device 62 that operates the electronic component mounting apparatus 10.

  The operation panel unit 60 of the operation device 62 is configured to store machine components and electronic components as operation targets that need to be operated when a trouble occurs in the electronic component mounting apparatus 10 or when the circuit board S is changed. The screen is displayed on the screen 60 so that the operator can intuitively perform necessary operations while touching the operation panel unit 60. The display screen displayed on the operation panel unit 60 is, for example, a marker shown in red, an instruction, or an operation button.

  FIG. 4 shows a view of the interior 10 a of the electronic component mounting apparatus 10 viewed from the window 13 through the operation panel 60. From FIG. 4, the operator can see the component supply device 20 (in FIG. 4, the state where the feeder 21 is removed) in front, and the illumination device of the component camera 55 as it goes further from there. 56, the transfer means 31 and 32 of the substrate transfer device 30, the moving platforms 43 and 45 of the component transfer device 40, the component mounting head 52 holding the suction nozzle 53, the substrate camera 48, and the like can be seen. As a result, the operator touches the operation panel unit 60 while actually viewing each machine component constituting the component mounting module 12 and the electronic component P sucked by the suction nozzle 53, and the machine component that needs to be operated. The operation command for operating can be output.

  The electronic component mounting apparatus 10 has a control device 70 as shown in FIG. The control device 70 includes a CPU 71, ROM 72, RAM 73 and a bus 74 for connecting them, and an input / output interface 75 is connected to the bus 74. The input / output interface 75 is connected to an operation device 62 including an operation panel unit 60 and an operation control unit 61, and machine components (component supply device 20, substrate transfer device 30, components, etc.) constituting the component mounting module 12. A control circuit 77 for controlling driving devices (for example, servo motors 44, 46, 51, etc.) for driving the respective moving platforms 43, 45 and the component mounting head 52, the substrate camera 48, and the component camera 55) constituting the transfer device 40. An image processing device 78 that performs image processing on image data picked up by the board camera 48 and the component camera 55 is connected.

  The operation control unit 61 receives an operation command corresponding to a touch operation on the operation panel unit 60 from the operation panel unit 60 and sends the operation command to the CPU 71, and the contents of the operation command are analyzed by the CPU 71 to configure the component mounting module 12. Each drive device of the component is configured to execute an operation according to the operation command. As a result, the operator touches the operation panel unit 60 to perform an operation required for the operation target while actually viewing the machine component or electronic component as the operation target through the operation panel unit 60. It can be done intuitively.

  As shown in FIG. 6, the operation panel 60 is provided so that the position of the operation panel 60 can be adjusted in the vertical direction with respect to the window 13. It can be fixed at any position. That is, when the operation target (machine component, etc.) of the in-flight 10a is displayed on the operation panel unit 60, for example, when the viewpoint position of the operator is switched from P1 to P2, the operation target of the in-flight 10a and the viewpoint position P2 are changed. The display screen 81 such as a marker for specifying the operation target cannot be displayed on the connecting line. Therefore, the position adjustment mechanism 80 is adjusted according to the operator's viewpoint positions P1 and P2, and the vertical position of the operation panel unit 60 is adjusted to change the display position of the display screen 81 for specifying the operation target. .

  Specifically, when adjusting the position of the operation panel unit 60, a light source 83 that emits light at a predetermined position in the cabin 10a is installed, and the light source 83 is set at a predetermined position on the operation panel unit 60 (a position corresponding to a standard viewpoint position). A display screen 81 corresponding to is displayed. In this state, the position adjustment mechanism 80 is operated to adjust the vertical position of the operation panel 60 so that the display screen 81 coincides with the line connecting the viewpoint positions P1, P2 and the light source 83, and the operator's viewpoint position is adjusted. The operation panel unit 60 is fixed at a position corresponding to P1 and P2. Such a position adjustment operation of the operation panel unit 60 is executed every time the operator who is in charge of the electronic component mounting apparatus 10 is changed.

  The position adjustment mechanism 85 that adjusts the position of the operation panel 60 in the vertical direction is configured by the position adjustment mechanism 80, the display screen 81, the light source 83, and the like.

  Next, an example of an operation for intuitively operating an operation target by touching an operation target (machine component or electronic component) displayed on the operation panel unit 60 at the time of trouble or setup change will be described.

  For example, when a trouble such as an adsorption error occurs, the error location is displayed on the operation panel 60 by a display screen 81 using a marker or the like, and is notified to the operator. At this time, since the display screen 81 is displayed on the operation panel unit 60 on a line connecting the operator's viewpoint position P1 (P2) and the operation target, the operator can easily identify the place where the trouble has occurred on the display screen 81. can do.

  7A to 7C show examples of operations when image processing of the electronic component P sucked by the suction nozzle 53 fails. FIG. 7A shows the electronic component during image processing. An example of teaching the angle of P is shown. That is, when the operator operates the finger to rotate in the arc direction while touching the suction nozzle 53 and the electronic component P as the operation target displayed on the operation panel unit 60 with the finger, the drive for rotating the suction nozzle 53 is performed. An operation command for rotating the suction nozzle 53 is output to the operation controller 61 to the apparatus. The operation command output to the operation control unit 61 is analyzed by the control device 70, and the drive device (rotation device) that rotates the suction nozzle 53 by controlling the control circuit 77 is rotated in accordance with the operation direction of the operator's finger. And the angle of the electronic component P is changed.

  As a result, when the electronic component P is picked up by the suction nozzle 53, the angle of the electronic component P is bad. Therefore, even if the image picked up by the component camera 55 cannot be recognized, an operation necessary for the operator is required. Can be easily performed.

  In addition, since the viewing angle of the component camera 55 is determined, in the case of a large electronic component P, if the electronic component P is slightly deviated, it will protrude from the field of view. In addition, the size of the electronic component P may change slightly due to the change of the lot. In particular, when the size of the electronic component P is small, it may be recognized as NG due to the dimensional relationship during image processing. An example of operation in such a case is shown in FIG. In other words, when the operator operates the suction nozzle 53 and the electronic component P displayed on the operation panel 60 as the operation target with two fingers while reducing the interval between the fingers, the component image processing is performed. An operation command that teaches to reduce the shape (body, lead) of the electronic component P at the time is output to the operation control unit 61. On the contrary, when the operator touches the suction nozzle 53 and the electronic component P displayed on the operation panel unit 60 with two fingers and operates to widen the interval between the fingers, the component image An operation command that teaches to increase the shape (body, lead) of the electronic component P during processing is output to the operation control unit 61.

  Also, as shown in FIG. 7C, when the finger is dragged from a to b, an operation command for moving the suction position by the suction nozzle 53 or the image processing center by the component camera 55 in a specified direction. Is output to the operation control unit 61.

  Furthermore, when an operator touches the displayed machine component or electronic component, instructions according to the situation are displayed on the operation panel unit 60, and further, by selectively touching the instructions, for example, It is also possible to display a submenu such as discarding the electronic component P sucked by the suction nozzle 53 or re-grabbing the electronic component P by the suction nozzle 53.

  That is, when the operator touches the displayed suction nozzle 53 (display screen 81), as shown in FIG. 8, submenus of operation buttons “1” and “2” are displayed on the operation panel unit 60. The operation button “1” instructs to suck the electronic component again by the suction nozzle 53, and the operation button “2” instructs to discard the electronic component sucked by the suction nozzle 53. Then, when the operator touches the operation button “1” and touches the decision button B1, an operation command for executing a cycle for re-sucking the electronic component by the suction nozzle 53 is sent to the operation control unit 61. Thereby, the drive device of the component mounting head 52 is controlled, and the suction operation by the suction nozzle 53 is executed. When the operator touches the operation button “2” and touches the decision button B1, an operation command for executing a cycle for discarding the electronic component sucked by the suction nozzle 53 to a predetermined position is sent to the motion control unit 61. Sent. As a result, the drive device of the component mounting head 52 is controlled, and the electronic component discarding operation by the suction nozzle 53 is executed.

  FIG. 9 shows a second embodiment of the present invention. The difference from the first embodiment is that an electronic component supplied from a component supply apparatus is an electronic component (semiconductor chip) formed on a wafer. The electronic component is pushed up from below by a push-up pin and sucked by a suction nozzle. Note that the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  A component supply device 120 is provided on one end side of the electronic component mounting apparatus 10. The component supply device 120 is provided with a table 121 that is movable in the horizontal Y-axis direction orthogonal to the conveyance direction (X-axis direction) of the circuit board S. Etching or etching is performed on a wafer diced on the table 121. An expanding base 122 is provided on which electronic parts P that are chipped by printing are placed. As shown in FIG. 10, the electronic component P is bonded to the adhesive sheet 123 and is held on the expanding table 122. Below the expand base 122, a push-up pin 125 that pushes up the electronic component P bonded to the adhesive sheet 123 is held by a holding member 126 that can move in the X, Y, and Z axis directions.

  The diced wafer and electronic component P and the push-up pin 125 are imaged using a substrate camera 48 attached to the X-axis moving table 45. When imaging the push-up pin 125, the table 121 is retracted in the Y-axis direction.

  The electronic component mounting apparatus 10 according to the second embodiment is also provided with a transparent window portion 13 on the front surface as described in the first embodiment, and a transparent operation panel portion 60 is provided in the window portion 13. Is provided so that the inside of the apparatus can be seen through the operation panel unit 60. Then, when the operator touches the display screen as the operation target displayed on the operation panel unit 60, an operation command for causing the operation target to perform a predetermined operation is output to the operation control unit 61 (see FIG. 5). The operation target can be operated intuitively.

  In the second embodiment, when the electronic component P is mounted on the circuit board S, the push-up pin 125 is moved in the X-axis and Y-axis directions so that the push-up pin 125 is mounted on the circuit board S. It is positioned below the part P. In this state, the push-up pin 125 is raised in the Z-axis direction, the electronic component P adhered to the adhesive sheet 123 is pushed up and peeled off from the adhesive sheet 123, and the suction nozzle 53 is lowered and pushed up by the push-up pin 125. The electronic component P is sucked by the suction nozzle 53. When the electronic component P is sucked by the suction nozzle 53, the component mounting head 52 is moved in the XY-axis direction together with the X-axis and Y-axis moving bases 45 and 43. Then, the component camera 55 detects the misalignment of the electronic component P sucked by the suction nozzle 53 with respect to the center of the suction nozzle 53 and the shift of the angle around the center. Next, the component mounting head 52 is conveyed onto the circuit board S, and the electronic component P is mounted at a predetermined position on the circuit board S.

  Next, an operation example in the second embodiment will be described with reference to FIG. In the second embodiment, mainly operations for a wafer captured image and operations for a push-up pin 125 are representative.

  For example, when the electronic component P pushed up by the push-up pin 125 cannot be removed well from the adhesive sheet 123 and an error occurs, the push-up pin 125 is designated as the operation target, and the operation target is displayed on the operation panel unit 60. (Push-up pin 125) is displayed as a marker. In this case, prior to displaying the push-up pin 125 on the operation panel unit 60, the table 121 is moved in the Y-axis direction, and the table 121 is retracted from above the push-up pin 125, thereby operating the push-up pin 125. It becomes visible through the panel unit 60.

  When the operator touches the marker displaying the push-up pin 125 as the operation target displayed on the operation panel unit 60 with two fingers and operates to narrow the interval between the fingers as shown in FIG. , A command to lower the push-up height by the push-up pin 125 is used. Based on this command, an operation command for lowering the push-up height is output to the operation controller 61 for the drive device that drives the push-up pin 125 in the vertical direction.

  On the other hand, if the operation is performed to widen the interval between the fingers, a command to increase the push-up height by the push-up pin 125 is issued. Based on this command, an operation command for increasing the push-up height is output to the operation control unit 61 for the drive device that drives the push-up pin 125 in the vertical direction.

  Also, as shown in FIG. 11B, when the finger is dragged in the left-right direction, for example, a command for moving the push-up position by the push-up pin 125 in the X-axis direction is given, while the finger is dragged in the vertical direction. In this case, it becomes a command to move the push-up position by the push-up pin 125 in the Y-axis direction, and based on these commands, the XY drive device moves the push-up position of the push-up pin 125 in the X-axis and Y-axis directions. The operation command for moving the push-up position in the Y-axis direction or the X-axis direction is output to the operation control unit 61.

  Furthermore, as shown in FIG. 11C, when the finger is flipped to the right like turning the page, a command to switch the push-up pin 125 to the next push-up pin is issued. Conversely, the finger is flipped to the left. In this case, a command for switching the push-up pin 125 to the previous push-up pin is provided, and an operation command for replacing the push-up pin 125 with another push-up pin is sent to the motion control unit 61 based on these commands. Output.

  On the other hand, when an error occurs in the image processing of the wafer, the wafer is displayed as an operation target on the operation panel unit 60, and in this state, the operator displays the operation panel unit 60 as described in FIG. For example, when the electronic component P is small and it is desired to enlarge the wafer while touching the wafer as the operation target with the two fingers, the electronic component is operated by widening the interval between the fingers. It becomes a command to enlarge P. Based on this command, an operation command for reducing the capture range and enlarging the imaging size is output to the operation controller 61 to the board camera 48, and the electronic camera P captured by the board camera 48 is enlarged. Image processing data is displayed on the operation panel unit 60.

  On the other hand, in the case of a large electronic component P, when it is desired to reduce and capture several electronic components P at the same time, it is a command to enlarge and display the wafer capture range by operating to narrow the finger interval. Based on this command, the operation command for changing to the imaging mode for expanding the capturing range is output to the operation controller 61 to the board camera 48.

  When the finger is dragged, a command for moving the capture position in the drag direction is output, and an operation command for moving the capture range is output to the motion control unit 61 based on the command.

  Further, when the finger is flipped, it is possible to make a command for taking a predetermined electronic component P into the center. For example, when the finger is flipped to the left, an operation command is output to the operation controller 61 so that the electronic component adjacent in the left direction is taken as the center, and similarly, the finger is moved to the right and up. When flipping is performed in the direction or the downward direction, an operation command is output to the operation control unit 61 so that the electronic component adjacent in the right direction, the upward direction, or the downward direction is taken in and centered.

  FIG. 12 shows a third embodiment of the present invention. The difference from the first embodiment is that the position adjusting means 85 of the first embodiment has the viewpoint positions P1 and P2 of the operator. Accordingly, the screen position 81 displayed on the operation panel unit 60 is made to coincide with the viewpoint position by adjusting the position of the operation panel unit 62 to the vertical position, but the position adjustment unit in the third embodiment Reference numeral 85 denotes a screen position 81 displayed on the operation panel unit 60 that can be adjusted in software.

  In FIG. 12, the operation panel unit 60 is fixedly held with respect to the window unit 13, and is displayed on the operation panel unit 60 when the position of the display screen 81 displayed on the operation panel unit 60 is adjusted. A position adjustment button (not shown) for scrolling the display screen 81 in the vertical direction is displayed. Then, the operator operates the position adjustment button to adjust so that the display screen 81 is displayed on the line connecting the viewpoint position P1 and the operation target, and the figure displayed on the operation panel unit 60 in that state. By operating an approximate determination button, a display position displayed on the operation panel unit 60 is determined according to the viewpoint positions P1 and P2 of the operator.

  According to the above-described embodiment, when trouble such as an adsorption error occurs, or when a setup change due to a change in a circuit board or the like, mechanical components and electronic components that need to be replaced or operated are displayed on the operation panel unit 60 with a marker or the like. Then, by touching the displayed machine component or electronic component, the operator can take countermeasures when trouble occurs.

  Accordingly, the operator can intuitively operate the machine components that need to be operated by touching the operation panel unit 60 while actually viewing each machine component and electronic component, and easily perform complicated operations. It can be carried out.

  Moreover, according to the above-described embodiment, since the operation panel unit 60 is provided in the transparent window unit 13 through which machine components and electronic components can be seen from outside the machine, the operation panel unit 60 can be obtained even if the window unit 13 is enlarged. The operation panel unit 60 can be made large in size and the visibility inside the machine can be improved, and the operability at the time of trouble or changeover can be improved.

  In the above-described embodiment, an example in which the operation panel unit 60 is touched and operated is shown in FIGS. 7, 8, and 11, but these are only representative examples, and the present invention is not limited to the operation. Similar to a conventional touch panel type operation panel in which the panel is provided separately from the window portion 13 of the electronic component mounting apparatus 10, various operations can be performed on a machine component as an operation target.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention described in the claims. Of course, it is possible.

  The electronic component mounting apparatus according to the present invention is suitable for use in a case where a transparent operation panel portion is provided in a window portion through which the inside of the apparatus can be seen.

  DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus, 13 ... Window part, 20, 120 ... Component supply apparatus, 30 ... Board | substrate conveyance apparatus, 40 ... Component transfer apparatus, 43, 45 ... Moving stand, 48 ... Board camera, 52 ... Component mounting head 53 ... Adsorption nozzle, 55 ... Component camera, 60 ... Operation panel unit, 61 ... Operation control unit, 70 ... Control device, 81 ... Display screen, 85 ... Position adjusting means, S ... Circuit board, P ... Electronic component.

Claims (5)

A substrate carrying device provided on a base for carrying in, carrying out and positioning and holding a substrate, a movable base supported so as to be movable relative to the base in the direction of carrying the board and a direction perpendicular thereto, and mounted on the board A component supply device that supplies electronic components to be mounted, and a component mounting head that is mounted on the substrate and that is mounted on the substrate and is positioned and held by the substrate transfer device while holding the electronic components attached to the moving table and supplied by the component supply device A substrate imaging device that images the substrate provided on the moving table, a component imaging device that images an electronic component provided on the base and held by the component mounting head, at least the substrate transfer device, and the movement In the electronic component mounting apparatus provided with a transparent window portion through which the machine component of the component mounting head and the electronic component can be seen through from outside the machine,
In the window portion, a transparent operation panel portion that can visually display the mechanical components and the electronic components that need to be operated at the time of trouble or setup change,
An operation control unit that outputs an operation command for operating the machine component by instructing the machine component or the electronic component displayed on the operation panel unit;
An electronic component mounting apparatus characterized by that.   In Claim 1, according to an operator's viewpoint, it has a position adjustment means which adjusts the position of the operation panel part, or the position of the machine component displayed on the operation panel part, or the position of the electronic parts in the up-and-down direction. An electronic component mounting apparatus.   3. The operation control unit according to claim 1, wherein an operator performs a finger operation on the machine component or the electronic component displayed on the operation panel unit, so that the operation control unit outputs an operation command corresponding to the finger operation. An electronic component mounting apparatus characterized by output.   4. The operation according to claim 1, wherein when an operator touches the machine component or the electronic component displayed on the operation panel unit, an operation necessary for the machine component or the electronic component is performed. An electronic component mounting apparatus, wherein a submenu to be displayed is displayed, and the operation control unit outputs an operation command corresponding to the selected submenu when an operator selects the displayed submenu. 4. The electronic component mounting according to claim 3, wherein a captured image capturing range of an imaging device that images the mechanical component or the electronic component is moved, enlarged, or reduced according to an operation mode of the finger operation. apparatus.

Images