JP2012224754A - Polyphenylene ether-containing resin composition and method of producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive resin composition low in dielectric constant and excellent in molding processability, heat resistance, impact resistance, and ductility.SOLUTION: The resin composition comprises (A) the polyphenylene ether, (B) polyphenylene sulfide, and (C) an epoxy group-containing ethylene copolymer or epoxy group-containing styrene block copolymer, in which polystyrene is grafted, wherein the component (A) is a sequential phase, and the components (B) and (C) are each a disperse phase.

Description

  The present invention relates to a resin composition containing polyphenylene ether and a method for producing the same.

  Polyphenylene ether (PPE) is inexpensive and has a low dielectric constant and excellent heat resistance, but has a problem that the molding processability is poor and it cannot be molded by itself. On the other hand, polyphenylene sulfide (PPS) is excellent in heat resistance, rigidity, flame retardancy, chemical resistance and the like, but has problems such as low ductility and impact resistance, high dielectric constant, and high cost.

  For this reason, conventionally, attempts have been made to improve the properties of the resin by combining PPE and PPS. For example, JP-A-50-156561 (Patent Document 1) describes a resin composition comprising polyphenylene sulfide and polyphenylene ether. JP-A-03-20356 (Patent Document 2), JP-A-10-95926 (Patent Document 3), and JP-A-2007-23078 (Patent Document 4) disclose polyphenylene sulfide, polyphenylene ether, and glycidyl. A resin composition comprising a copolymer of methacrylate and styrene is described. WO 2009/088092 (Patent Document 5) describes a composition comprising polyphenylene sulfide, polyphenylene ether, and a copolymer of ethylene and glycidyl methacrylate.

  These resin compositions described in Patent Documents 1 to 5 have a high dielectric constant because polyphenylene sulfide is a continuous phase, are insufficient in impact resistance and ductility, and are expensive. Moreover, although the resin composition which polyphenylene ether seems to be a continuous phase is disclosed by the comparative example of patent document 4, since the moldability was remarkably inferior, it was not practical.

  In addition, as a resin composition in which polyphenylene sulfide is a continuous phase and polyphenylene ether is a dispersed phase, a resin composition containing a block copolymer modified with maleic anhydride or the like as a third component (JP-A-58-40350). Publication: Patent Document 6), resin composition containing modified polyolefin and thermoplastic elastomer (JP-A-1-213361: Patent Document 7), resin composition containing ethylene-glycidyl methacrylate copolymer (JP-A-2-86652) Publication: Patent Document 8), resin composition containing ethylene-glycidyl methacrylate copolymer and styrene-butadiene-styrene block copolymer (JP-A-4-318067: Patent Document 9), styrene-butadiene-styrene Block copolymers or oxazoline-containing styrene copolymers Resin composition comprising a polymer (JP-A 09-161737 JP: Patent Document 10 Japanese Patent 10-53706 discloses: Patent Document 11) have been proposed.

  However, the resin compositions described in Patent Documents 5 to 11 were not at satisfactory levels in terms of dielectric constant, molding processability, heat resistance, impact resistance, ductility, and cost.

JP-A-50-156561 Japanese Patent Laid-Open No. 03-20356 Japanese Patent Laid-Open No. 10-95926 JP 2007-23078 A International Publication No. 2009/088092 JP 58-40350 A JP-A-1-213361 Japanese Patent Laid-Open No. 2-86652 Japanese Patent Laid-Open No. 4-318067 JP 09-161737 A JP-A-10-53706

  In view of the above circumstances, an object of the present invention is to provide a resin composition having a low dielectric constant, excellent molding processability, heat resistance, impact resistance, and ductility, and being inexpensive.

The present inventors have solved the above problems by using a grafted epoxy group-containing ethylene copolymer or epoxy group-containing styrene block copolymer as a third component. That is, the subject is the following present invention:
(A) polyphenylene ether containing 90 mol% or more of a repeating unit represented by chemical formula (1) described later, (B) polyphenylene sulfide containing 70 mol% or more of a repeating unit represented by chemical formula (2) described later, and (C ) An epoxy group-containing ethylene copolymer grafted with polystyrene or a styrene block copolymer containing an epoxy group, wherein the component (A) is a continuous phase, the component (B) and the component (C) are dispersed phases It is solved by a certain resin composition.

  According to the present invention, it is possible to provide a resin composition having a low dielectric constant, excellent molding processability, heat resistance, impact resistance, and ductility and being inexpensive.

Transmission electron micrograph of the resin composition obtained in Example 3

  The present invention is described in detail below. In the present specification, “to” includes values at both ends thereof.

1. Resin composition of the present invention (1) Polyphenylene ether (component A)
The polyphenylene ether of component (A) used in the present invention contains 90 mol% or more, preferably 95 mol% or more of the unit represented by the following chemical formula (1).

  In the formula, R1, R2, R3 and R4 each independently represent hydrogen, halogen, a primary or secondary alkyl group having 1 to 7 carbon atoms, a phenyl group, a haloalkyl group, an aminoalkyl group, a hydrocarbonoxy group. Selected from the group consisting of a group and a halohydrocarbonoxy group in which a halogen atom and an oxygen atom are bonded via at least two carbon atoms.

  The carbon number of the haloalkyl group, aminoalkyl group, and hydrocarbonoxy group is preferably 1-7. The carbon number of the halohydrocarbonoxy group is preferably 2-7.

  R1 and R2 are preferably each independently a primary alkyl group having 1 to 3 carbon atoms, and more preferably a methyl group. R3 and R4 are preferably hydrogen.

  Examples of units other than the unit represented by the chemical formula (1) include vinyl aromatic compounds. For example, polyphenylene ether obtained by graft polymerization of a vinyl aromatic compound can be used for the polymer composed of the unit represented by the chemical formula (1).

  Specific examples of polyphenylene ether include poly (2,6-dimethyl-1,4-phenylene ether), poly (2,6-diethyl-1,4-phenylene ether), poly (2,6-dipropyl-1, 4-phenylene ether), poly (2-methyl-6-ethyl-1,4-phenylene ether), poly (2-methyl-6-propyl-1,4-phenylene ether), poly (2-ethyl-6- Propyl-1,4-phenylene ether), 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer, 2,6-dimethylphenol / 2,3,6-triethylphenol copolymer, 2, 6-diethylphenol / 2,3,6-trimethylphenol copolymer and 2,6-dipropylphenol / 2,3,6-trimethylphenol copolymer Body is included.

  Further, as polyphenylene ether, a copolymer obtained by graft polymerization of styrene to poly (2,6-dimethyl-1,4-phenylene ether), a 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer, A copolymer obtained by graft polymerization of styrene may be used.

  Of these, poly (2,6-dimethyl-1,4-phenylene ether) is preferable as the polyphenylene ether.

  It is preferable that the terminal group of the polyphenylene ether can react with the epoxy group in the component (C) described later, since the compatibility between the polyphenylene ether and the component (C) is improved. Examples of such end groups include phenol groups and phenolate groups.

  The polyphenylene ether preferably has a molecular weight such that the intrinsic viscosity at 30 ° C. in chloroform is about 0.2 to 0.8 dl / g, more preferably about 0.3 to 0.6 dl / g.

  Polyphenylene ether is modified with maleic anhydride, glycidyl methacrylate, styrene, 2-hydroxyethyl methacrylate, N- [4-2,3-epoxypropoxy) -2,5-dimethylphenylmethyl] acrylamide, trimethoxyvinylsilane, etc. May be.

  Polyphenylene ether is usually produced by oxidative coupling of structural units (monomers). A number of catalysts are known for the oxidative coupling polymerization of polyphenylene ethers. There is no restriction | limiting in particular regarding selection of a catalyst, All the well-known catalysts can be used. That is, for example, polyphenylene ether polymerized using at least one kind of heavy metal compound such as copper, manganese, and cobalt may be used. When the catalyst residue reacts with an epoxy group in the component (C) described later, the compatibility between the polyphenylene ether and the component (C) is improved, which is preferable. Examples of such a catalyst include tertiary amines and cuprous salts. The polyphenylene ether may contain 50 ppm or more of amine as a catalyst residue.

(2) Polyphenylene sulfide (component B)
Component (B) used in the present invention is polyphenylene sulfide containing 70 mol% or more of a repeating unit represented by the following chemical formula (2).

  From the viewpoint of improving heat resistance, the content of the unit represented by the chemical formula (2) is preferably 80 mol% or more.

  Further, the polyphenylene sulfide may contain less than 30 mol% of units represented by the following chemical formula.

  Polyphenylene sulfide can be synthesized by a conventional method, for example, a method described in JP-B-52-12240 or JP-A-61-7332. Commercially available polyphenylene sulfide may also be used.

  The polyphenylene sulfide obtained as described above may be subjected to various treatments. Examples of this treatment include cleaning with heat treatment or hot water performed under an inert gas atmosphere such as nitrogen or under reduced pressure, and functional group-containing compounds such as acid anhydrides, amines, isocyanates, and functional group-containing disulfide compounds. An activation process is included.

  The polyphenylene sulfide preferably has a functional group capable of reacting with an epoxy group in the component (C) described later. The polyphenylene sulfide having such a functional group reacts with the component (C) to improve the compatibility between the polyphenylene sulfide and the component (C), thereby improving the impact resistance and workability of the resin composition. Examples of the functional group capable of reacting with an epoxy group include a sulfanyl group (mercapto group), an epoxy group, and a carboxyl group. Among them, a sulfanyl group having excellent reactivity is preferable.

  The heat distortion temperature (1.82 MPa load) based on ASTM D648 of polyphenylene sulfide is preferably 90 to 130 ° C. The specific gravity of polyphenylene sulfide is preferably 1.2 to 1.4. The melting point of the polyphenylene sulfide determined by differential scanning calorimetry is preferably 265 to 295 ° C, more preferably 270 to 290 ° C. Such polyphenylene sulfide provides a resin composition having particularly excellent heat resistance.

  The molecular weight of polyphenylene sulfide is not particularly limited, but is preferably 10,000 or more, more preferably 15,000 or more, and more preferably 18,000 or more in terms of weight average molecular weight. When polyphenylene sulfide having a molecular weight in such a range is used, the moldability and physical properties of the composition are improved, and the amount of the functional group present at the terminal is appropriate.

(3) Epoxy group-containing ethylene copolymer grafted with polystyrene, styrene-based block copolymer containing epoxy group (component C)
In the present invention, the copolymer containing the epoxy group is used as the component (C). These may be used alone or in combination. Hereinafter, each copolymer will be described.

(3-1) Epoxy group-containing ethylene copolymer grafted with polystyrene The copolymer is a copolymer in which a polystyrene chain is grafted to the trunk of an ethylene-based binary copolymer or ethylene-based terpolymer. It is. The ethylene-based binary copolymer as a trunk is a copolymer comprising (a) an ethylene unit and (b) an ethylenically unsaturated carboxylic acid glycidyl ester unit or an ethylenically unsaturated hydrocarbon group glycidyl ether unit. . The ethylene-based terpolymer as a trunk is composed of (a) an ethylene unit, (b) an ethylenically unsaturated carboxylic acid glycidyl ester unit or an ethylenically unsaturated hydrocarbon group glycidyl ether unit, and (c) a vinyl acetate unit. Alternatively, it is a copolymer comprising methyl acrylate units. The ethylene unit refers to a portion derived from ethylene in the copolymer, and specifically refers to a unit represented by — (CH ₂ —CH ₂ ) —. Ethylenically unsaturated carboxylic acid glycidyl ester units and the like are defined similarly.

  The composition of the ethylene-based binary copolymer is preferably such that the ratio of (a) units: (b) units is 95-40% by mass: 5-60% by mass, and 90-50% by mass: 10-50% by mass. % Is preferred. The composition of the ethylene-based terpolymer is preferably such that the ratio of (a) units: (b) units: (c) units is 40 to 94% by mass: 1 to 20% by mass: 5 to 40% by mass. 50 to 90% by mass: 2 to 15% by mass: 8 to 35% by mass is preferable. (B) The compound which provides an ethylenically unsaturated carboxylic acid glycidyl ester unit or an ethylenically unsaturated hydrocarbon group glycidyl ether unit is represented by the following chemical formulas (b1) and (b2), respectively.

  In the chemical formula (b1), R is a hydrocarbon group having 2 to 13 carbon atoms having one ethylene bond. The carbon number of R is preferably 2-10.

  Examples of the ethylenically unsaturated carboxylic acid glycidyl ester unit represented by the chemical formula (b1) include glycidyl α, β-unsaturated carboxylic acid such as glycidyl acrylate, glycidyl methacrylate, and diglycidyl itaconate.

In chemical formula (b2), R is a C2-C13 hydrocarbon group having one ethylene bond. X is —CH ₂ —O— or a group represented by the following chemical formula (b2-1). The carbon number of R is preferably 2-10.

  The epoxy groups in the trunk react with the end groups of the polyphenylene sulfide of component (B) and can also react with the end groups of the polyphenylene ether of component (A) or catalyst residues.

  On the other hand, the polystyrene chain which is a graft chain is a chain having styrene as a repeating unit and is compatible with the polyphenylene ether of component (A). Therefore, the epoxy group-containing ethylene copolymer grafted with the component (C) functions as a compatibilizing agent for the components (A) and (B).

  In order to optimize this compatibilizing effect, the mass ratio of the trunk to the styrene chain in the grafted epoxy group-containing ethylene copolymer is preferably 50 to 99 mass: 50 to 1 mass, and 60 to 80 mass. : More preferably, it is 40-20 mass.

  In the grafted epoxy group-containing ethylene copolymer, the glycidyl methacrylate content in the epoxy group-containing ethylene copolymer is preferably 2 to 40% by mass, more preferably 4 to 30% by mass, and further 6 to 25% by mass. preferable.

  The compatibilizing effect is also affected by the viscosity of the ethylene copolymer grafted with polystyrene. Therefore, the MFR of the ethylene copolymer grafted with polystyrene is preferably 0.01 to 50 g / 10 min, more preferably 0.05 to 30 g / 10 min, and further 1.0 to 18.0 g / 10 min. preferable. MFR is measured in accordance with JIS K7210 under conditions of a resin temperature of 190 ° C. and a measurement load of 21 N (2.16 kg · f). If this MFR is less than 0.01 g / 10 min or exceeds 50 g / 10 min, the affinity between the graft ethylene copolymer and polyphenylene sulfide may be reduced, or the appearance of the resulting molded product may be deteriorated. Sometimes.

  A known method may be used to bond the ethylene copolymer segment and the vinyl polymer segment. For example, as described in JP-A-2007-63506, a vinyl monomer is added to a solution of an ethylene terpolymer segment in the presence of a peroxide to polymerize the vinyl monomer. Obtainable.

(3-2) Styrenic block copolymer containing an epoxy group The copolymer is a polymer obtained by subjecting a styrene block copolymer to epoxy modification. The styrene block copolymer is a block copolymer of styrene and a conjugated diene compound. Examples of the conjugated diene compound include butadiene, isoprene, 1,3-pentadiene, 3-butyl-1,3-octadiene, and butadiene or isoprene is preferable. The styrenic block copolymer may be hydrogenated. In the present invention, a styrene-butadiene-styrene triblock copolymer is preferable in view of availability. Such a styrenic block copolymer or a hydrogenated product thereof can be prepared, for example, by the method described in JP-B-40-23798 and JP-A-59-133203.

  To epoxy-modify a styrenic block copolymer is to introduce a compound having a glycidyl group into the styrenic block copolymer. Examples of the compound having a glycidyl group include unsaturated glycidyl esters, unsaturated glycidyl ethers, epoxy alkenes, and specific examples thereof include glycidyl methacrylate, glycidyl acrylate, butenecarboxylic acid glycidyl esters, allyl glycidyl ether. Etc. Glycidyl methacrylate and glycidyl acrylate are preferable from the viewpoint of availability.

  A method for introducing the compound having a glycidyl group into the styrene block copolymer is not particularly limited, but the compound can be introduced by graft copolymerizing the compound with the styrene block copolymer. At this time, the compound having a glycidyl group is preferably introduced into the butadiene block of the styrenic block copolymer. As described above, since the styrene block is almost completely compatible with the polyphenylene ether of the component (A), it can be avoided that the compatibility is lowered by the introduction of the epoxy group. When the introduced epoxy group can move freely, the reactivity with the component (A) or (B) increases, so that the epoxy group is not present in the butadiene block main chain but in the graft chain extending from the butadiene block. More preferably it is present.

  The epoxy group content in the styrenic block copolymer containing an epoxy group can be represented by an oxirane oxygen concentration. The oxirane oxygen concentration can be determined by titrating the mass% of oxirane oxygen derived from the epoxy group in the block copolymer with an acetic acid solution of hydrogen bromide according to ASTM-1652. The oxirane oxygen concentration is preferably 0.1 to 8% by mass, more preferably 0.2 to 5% by mass, and still more preferably 0.4 to 3% by mass. If the oxirane oxygen concentration is outside these ranges, the reactivity of the component (C) may be insufficient, or the molding processability of the composition may be insufficient.

  The content of styrene in the styrenic block copolymer containing an epoxy group is preferably 2% by mass or more, more preferably 5% by mass or more, and still more preferably 10% by mass or more. Moreover, 80 mass% or less is preferable and, as for content of styrene, 50 mass% or less is more preferable.

  The MFR of the styrenic block copolymer containing an epoxy group is preferably 0.01 to 50 g / 10 minutes, more preferably 0.03 to 35 g / 10 minutes, and further preferably 1.0 to 20.0 g / 10 minutes. preferable. MFR is measured in accordance with JIS K7210 under conditions of a resin temperature of 190 ° C. and a measurement load of 21 N (2.16 kg · f). If this MFR is less than 0.01 g / 10 min or exceeds 50 g / 10 min, the affinity between the graft ethylene copolymer and polyphenylene sulfide may be reduced, or the appearance of the resulting molded product may be deteriorated. Sometimes.

(4) Composition ratio The composition ratio of each component is determined so that component (A) is a continuous phase and component (B) and component (C) are dispersed phases. A continuous phase is a phase which forms the matrix of a resin composition, and is a phase which comprises the sea in what is called a sea-island structure. The dispersed phase is a domain-like phase existing in the system. Specifically, the mass ratio of the components (A) and (B) is preferably 55 to 95/45 to 5, and more preferably 57 to 90/43 to 10. If the mass ratio is outside these ranges, the component (B) may form a continuous phase, which is not preferable. 1-50 mass parts is preferable with respect to 100 mass parts of total amounts of a component (A) and a component (B), and, as for the quantity of a component (C), 2-45 mass parts is more preferable, and 4-40 mass parts is preferable. Further preferred. The phase structure will be described in detail later.

(5) Other components The resin composition of the present invention can be made into an electrically conductive resin composition by further adding an electrical conductivity imparting substance. Examples of the electrical conductivity imparting substance include carbon black, carbon fiber, graphite, metal fiber, carbon nanotube, metal oxide, and antistatic plasticizer. Of these, carbon black is preferred. Examples of carbon black include furnace black, medium thermal carbon black, acetylene black, and ketjen black. Of these, acetylene black and ketjen black are preferred.

  The resin composition of the present invention may further include other compounding agents depending on applications and purposes, such as inorganic fillers such as talc, mica, calcium carbonate, and wollastonite, coupling agents, reinforcing agents, flame retardant aids, and stability. An impact resistance improving agent such as an agent, a pigment, a release agent, or an elastomer can be blended. The compounding quantity of these compounding agents is 45 mass parts or less with respect to a total of 100 mass parts of component (A), (B), and (C), Preferably it is 20 mass parts or less.

  In particular, it is preferable to mix glass fibers with the resin composition of the present invention. By blending glass fiber, the heat resistance, flexural modulus, etc. of the resin composition are further improved. A known glass fiber can be used. For example, glass fibers made of A glass, C glass, E glass, S glass, and the like can be used. The glass fiber may be subjected to a surface treatment. Among these, glass fiber surface-treated with silane is preferable. The number average glass fiber length of the glass fibers is preferably 10 to 1000 μm. Examples of such glass fibers include chopped strands, milled glass, and long fibers, but chopped strand glass fibers having a diameter of 3 to 30 μm and a fiber length of 1 to 3 mm are preferable.

(6) Phase structure and characteristics of the resin composition of the present invention In the resin composition of the present invention, the polyphenylene ether of the component (A) is a continuous phase, and the other components form a dispersed phase. When component (A) is a continuous phase, the resin composition has high heat resistance, low dielectric constant, and is inexpensive. Moreover, higher heat resistance is obtained because a component (B) becomes a dispersed phase. The number average particle size of the dispersed phase of the component (B) is preferably 0.1 to 7 μm, more preferably 0.1 to 5 μm, and further preferably 0.1 to 3 μm.

  As described above, component (C) can react with both component (A) and component (B). Morphologically, component (C) can be present in the continuous phase of component (A), in the dispersed phase of component (B), and at the interface between component (A) and component (B). A phase structure in which the component (C) is dispersed as fine particles in both the component (A) phase and the component (B) phase is preferable. The number average particle diameter of the component (C) in the entire composition including in the continuous phase and in the dispersed phase is preferably 0.05 to 3 μm, more preferably 0.05 to 2 μm. Due to the component (C), the compatibility between the component (A) and the component (B) is increased, and the impact resistance of the composition is improved.

  Since the resin composition of the present invention has such a characteristic phase structure, it is presumed that unlike conventional resin compositions, it has excellent impact resistance and ductility while realizing heat resistance and low dielectric constant. Is done.

  The phase structure can be observed with a transmission electron microscope image. That is, after dyeing the composition with ruthenium oxide or the like, an ultrathin section is prepared using a microtome or the like, and the phase structure can be observed with a transmission electron microscope. At that time, when the section is stained with ruthenium oxide, the component (C) is most easily dyed, black contrast, the component (B) is dark gray contrast, and the component (C) shows the weakest contrast. The form of each component inside can be observed.

  FIG. 1 shows the resin composition (component (A) (PPE) / component (B) (PPS) / component (C-1) = 60/30/10 (mass ratio)) obtained in Example 3 described later. It is a transmission electron microscope image. In the figure, component (A) forms a continuous phase, and component (B) forms a domain in the continuous phase. In the figure, the size of this domain is 0.2 to 3 μm. On the other hand, the component (C) is dispersed in the component (A) and the component (B) and on the boundary surface between the component (A) and the component (B). The size of component (C) in the composition system is 0.03 to 0.4 μm. By forming a morphology having such characteristics, the resin composition of the present invention exhibits excellent characteristics.

  The dielectric constant of the resin composition of the present invention is preferably 2.3 to 2.8, more preferably 2.5 to 2.7 when measured at a frequency of 1 kHz.

2. Manufacturing method of resin composition of this invention A resin composition can be manufactured by melt-kneading components (A), (B), and (C). For melt-kneading, a kneader such as a batch-type twin-screw kneader, a single-screw extruder, or a twin-screw extruder can be used. However, industrially, strong kneading is possible and continuous melt-kneading is possible. It is preferable to use a twin screw extruder. The melt kneading temperature is preferably 260 to 330 ° C, more preferably 280 to 320 ° C.

In the resin composition of the present invention, the step of melt-kneading the components is kneaded using a kneader and so that the maximum shear rate of the kneader defined as follows is 600 sec ⁻¹ or more. It is preferable.

  The shear rate S of the kneader is defined by the following formula (i).

S = π · Dm · N / h (i)
S is the shear rate, N is the number of revolutions per second of the screw, and h is the clearance. When the kneader is a uniaxial or biaxial extruder, Dm is the average diameter of the screw grooves. The average diameter of a screw groove is an average value of the screw diameter in each groove part (concave part) of a screw.

  When the kneader is a batch kneader using a disk such as a lab plast mill, Dm is defined by the difference between the cylinder inner diameter and the disk major axis diameter.

  The clearance is the distance between the screw or disk and the wall surface of the kneader and is also called chip clearance. The screw may include a kneading part in part, and the clearance may be different in the longitudinal direction of the screw. In such a case, in the present invention, the clearance can be calculated as the average value of the entire screw or the average value of the clearance other than the kneading portion.

  The maximum value of the shear rate means the maximum shear rate generated in the melt-kneading process. In the normal melt-kneading process, Dm and h are not changed, so the shear rate S is adjusted by the number of rotations of N. The melt-kneading step means a case where the setting temperature of the kneader, which is a temperature at which polyphenylene sulfide is melted, is 280 to 320 ° C.

As the shear rate of the kneader increases, the degree of kneading can be increased. Therefore, in the present invention, the maximum value of the shear rate of the kneader is preferably at least 600 sec ^-1, more preferably 800 sec ^-1 or more, 900 sec ^-1 or more is more preferable. 1200 sec ⁻¹ or more is particularly preferable.

  In the present invention, the components (A) to (C) may be melted and kneaded together. Also, a method in which components (A) and (C) are previously melt-kneaded and then component (B) is added and melt-kneaded, and components (B) and (C) are previously melt-kneaded and then component (A) is added. Alternatively, a melt kneading method may be used. Furthermore, the components (A) and (C) are supplied to the extruder from the upstream side of the extruder, and the component (B) is supplied to the extruder from the downstream side of the extruder and melt kneaded, or the components A method may be used in which (B) and (C) are supplied from the upstream side of the extruder to the extruder, and the component (A) is supplied from the downstream side of the extruder to the extruder and melt-kneaded.

3. Processing method and application of the resin composition of the present invention The resin composition of the present invention is easily processed into a molded product by a processing method used for ordinary thermoplastic resin molded products. Examples of processing methods include injection molding, extrusion molding, film / sheet molding, fiber molding, vacuum molding, blow molding, press molding, calendar molding, foam molding, and the like. Since the resin composition in the present invention is excellent in heat resistance, impact resistance, ductility, moldability, etc., has a low dielectric constant, and is inexpensive, the above molding method is applied to the resin composition of the present invention. By applying, it can be widely applied to electrical / electronic parts, communication parts, film / sheets for packaging, textiles, automobile parts, etc. Especially, since the dielectric constant of the resin composition of this invention is low, application to the high-speed communication field | area is anticipated.

  The resin composition of the present invention is used as a laminate comprising a substrate comprising the resin composition and a metal layer on the substrate. A board | substrate is a plate-shaped or film-shaped member used as the base of a laminated body, and may be obtained by a well-known method. For example, the substrate can be obtained by film, sheet, extruded product, or injection molding.

  The metal layer can be formed by performing a plating process or a metal foil bonding process on the surface of the substrate. For the plating treatment, existing methods such as electrolytic plating, vapor phase plating, chemical plating, and hot dipping can be applied, but electrolytic plating and chemical plating are preferable. Electrolytic plating is a method in which a substrate is immersed in an electrolytic solution and then electricity is passed to deposit metal ions in the solution on the surface of the substrate. Examples of the plating metal in the electrolyte include copper, nickel, gold, silver, tin, aluminum, zinc, and chromium, but copper is preferable.

  The metal foil laminating treatment can be performed by applying a known method such as a thermocompression bonding method or a method of interposing an adhesive layer between the film and sheet of the resin composition. Although metal foil is not specifically limited, For example, gold foil, silver foil, stainless steel foil, electrolytic copper foil, rolled copper foil, copper alloy foil, titanium foil, aluminum foil, nickel foil, copper-nickel foil, nickel-copper A foil is included. Among these, electrolytic copper foil, rolled copper foil, and copper-nickel foil are preferable.

The thickness of the metal layer is preferably 1 to 500 μm, and more preferably 2 to 300 μm.
The laminate of the present invention can be used as a flexible printed board, a multilayer printed board and the like by forming a circuit.

  The resin composition of the present invention may be used as a laminate comprising a substrate comprising the resin composition and an inorganic layer on the substrate. Examples of the inorganic material forming the inorganic layer include carbon, silicon oxide, aluminum oxide, magnesium oxide, titanium nitride, indium oxide, and silicon. Examples of the method for forming the inorganic layer include vacuum deposition, ion plating, and sputtering. In the vacuum deposition method, an ion beam assist method in which an ion beam is simultaneously irradiated may be used.

  In manufacturing these laminates, the substrate may be subjected to a surface treatment. A well-known method can be applied to the surface treatment method. Examples include polishing treatment, acid treatment, alkali treatment, UV irradiation treatment, plasma treatment by high frequency discharge in an argon or oxygen atmosphere, and ion beam treatment. The laminate of the present invention may have a two-layer structure comprising a substrate and a metal layer or an inorganic layer, or a laminate of three or more layers comprising a metal layer and a substrate and a metal layer, or an inorganic layer and a substrate and an inorganic layer. May be. Such a laminate can be applied to printed wiring boards, electrical / electronic components, automobile structural materials, and the like.

  The present invention will be described below with reference to examples, but the present invention is not limited thereto.

(1) Physical property test / tensile test: A tensile test was carried out at a load cell of 1 kN, a distance between chucks of 40 mm, and a stretching speed of 10 mm / min.
・ Tensile impact test: DG digital impact tester manufactured by Toyo Seiki Seisakusho Co., Ltd., load by hammer mass 4J, distance from center of rotation axis of hammer to center of gravity 0.23 mm, hammer lifting angle 150 °, period 0. The measurement was performed in accordance with JIS 7160 at 962 sec and a temperature of 20 ° C.
Dielectric constant test: A 90 × 90 × 0.5 mm film was left in an atmosphere of 20 ° C. and 60% humidity for 7 days, and then measured at a frequency of 1 kHz using an LCR meter 4284A manufactured by Agilent Technologies. It was.
Molding processability: The raw material resin or kneaded product is preheated at 310 ° C. for 3 minutes and pressed at a pressure of 20 MPa for 5 minutes, and then rapidly cooled to 20 ° C. to form a sheet having a thickness of about 0.5 mm. Based on the evaluation.

○: Sheet molding was easily possible under the above conditions.
X: Sheet molding under the above conditions was impossible.

(2) Component of resin composition <Component (A)>
Polyphenylene ether (PPE): Poly (2,6-dimethyl-1,4-phenylene ether) Upilex PX-100F manufactured by Mitsubishi Engineering Plastics Co., Ltd. was used. The intrinsic viscosity of this resin in chloroform at 30 ° C. was 0.4 dl / g.

<Component (B)>
Polyphenylene sulfide (PPS): Torelina A900 manufactured by Toray Industries, Inc. was used. The physical properties of this resin were as follows.

・ Heat deformation temperature (ASTM D648, 1.82 MPa load) 105 ° C.
・ Specific gravity 1.34
Melting point (DSC) 278 ° C
・ Glass transition temperature 85 ℃

<Component (C)>
Styrene graft EGMA (C-1): NOF Corporation Modiper A4100 was used. The composition and physical properties of this resin were as follows.
A graft copolymer in which a styrene segment is grafted to a segment composed of ethylene units / ethylenically unsaturated carboxylic acid glycidyl ester (EGMA) units (segment ratio is 70/30 (mass ratio)), glycidyl methacrylate in EGMA The content is 15% by mass,
Melting point 95 ° C
・ Glass transition temperature -28 ℃

Epoxidized styrene-butadiene-styrene block copolymer (C-2): Epofriend HT302 manufactured by Daicel Chemical Industries, Ltd. was used. The composition and physical properties of this resin were as follows.
-Styrene / butadiene = 40/60 (mass ratio), epoxy group introduction position is butadiene block part-MFR (JIS K7210, 190 ° C, 21N (= 2.16 kg) load) 7 g / min-Specific gravity 0.918 (g / cm ³ )
・ Oxirane oxygen concentration 1.5% by mass

<Other ingredients>
Low-density polyethylene (E-1): Prime Polymer Co., Ltd. Ultrazex 20100J was used. The physical properties of this resin were as follows.
MFR (JIS K7210, 190 ° C., 21N (= 2.16 kg) load) = 8.5 g / 10 min Melting point 124 ° C.
・ Glass transition temperature -29 ℃
・ Specific gravity 0.92 (g / cm ³ )

[Examples 1 to 5 and Comparative Examples 1 to 4]
In the formulation shown in Table 1, after thoroughly mixing each component, a lab plast mill 4M150 manufactured by Toyo Seiki Seisakusho Co., Ltd. was used as a kneading machine, kneading temperature 300 ° C., screw rotation speed 100 rpm, kneading time 10 minutes. Each component was melt-kneaded.

The kneading part of the kneader has an internal volume of about 70 mL, a cylinder inner diameter of 47.7 mm, a disk major axis outer diameter of 46.9 mm, a disk single axis outer diameter of 29.3 mm, and a clearance between the disk and the kneader wall surface of 0. 0. The distance between shafts was 38.5 mm, and the meshing ratio (disk major axis / disk minor axis) was 1.6. In the above formula (i), Dm is 0.8 mm, and h is 0.4 mm. Therefore, the shear rate S was calculated as 1.2 × 10 ³ (sec ⁻¹ ).

  The obtained kneaded material was preheated at 310 ° C. for 3 minutes and pressed at a pressure of 20 MPa for 5 minutes, and then rapidly cooled to 20 ° C. to obtain a sheet having a thickness of about 0.5 mm. However, in Comparative Example 1, the pellets were press-molded without being kneaded, and in Comparative Example 2, the powder was used as it was.

  For the tensile test, a press sheet punched into a mini dumbbell shape having a length of 16 mm in the straight part of the parallel part was used. For the tensile impact test, a press sheet having a dumbbell shape and punched into a total length of 80 mm, a thickness of 0.5 mm, a parallel part width of 10 mm, a parallel part length of 10 mm, and a grip part width of 15 mm was used.

  A 90 × 90 × 0.5 mm press sheet was used for dielectric constant measurement.

  From a comparison between the examples and comparative example 2, it is clear that the resin composition of the present invention is excellent in processability. From a comparison between Examples and Comparative Example 3, it is clear that the resin composition of the present invention has a low dielectric constant while having an impact strength equivalent to that of a resin composition having polyphenylene sulfide as a continuous phase.

A component A phase B component B phase C component C phase

Claims (12)

(A) The following chemical formula (1):

Wherein R1, R2, R3 and R4 are each independently hydrogen, halogen, a primary or secondary alkyl group having 1 to 7 carbon atoms, phenyl group, haloalkyl group, aminoalkyl group, hydrocarbon. An oxy group and a group selected from the group consisting of a halohydrocarbonoxy group in which a halogen atom and an oxygen atom are bonded via at least two carbon atoms)
Polyphenylene ether containing 90 mol% or more of the repeating unit represented by
(B) The following chemical formula (2):

And (C) an epoxy group-containing ethylene copolymer grafted with polystyrene or a styrene-based block copolymer containing an epoxy group. Yes,
A resin composition in which the component (A) is a continuous phase, and the component (B) and the component (C) are dispersed phases.   The mass ratio of the component (A) to the component (B) is 55 to 95/45 to 5, and the component (C) is added to 100 parts by mass of the total amount of the component (A) and the component (B). The resin composition according to claim 1, comprising 1 to 50 parts by mass.   The epoxy group-containing ethylene copolymer in the component (C) contains an ethylene unit and an ethylenically unsaturated carboxylic acid glycidyl ester unit or an ethylenically unsaturated hydrocarbon group glycidyl ether unit. The resin composition as described.   The resin composition of Claim 1 or 2 whose quantity of the styrene block segment in the styrene-type block copolymer containing the epoxy group of the said component (C) is 10-80 mass%.   The component (A) is poly (2,6-dimethyl-1,4-phenylene ether) having an intrinsic viscosity of 0.2 to 0.8 dl / g at 30 ° C in chloroform. The resin composition in any one of.   The resin composition according to any one of claims 1 to 5, wherein the component (B) has a melting point by differential scanning calorimetry of 265 ° C to 295 ° C and a specific gravity of 1.2 to 1.4.   The resin composition in any one of Claims 1-6 in which the said component (B) has a functional group which can react with the epoxy group in the said component (C). The components (A), (B) and (C) are mixed using a kneader in the following formula (i):
S = π · Dm · N / h (i)
(In formula (i), S is the shear rate, Dm is the average diameter of the screw groove, or the difference between the cylinder inner diameter and the disk major axis diameter, N is the number of revolutions per second of the screw, and h is the clearance) The manufacturing method of the resin composition in any one of Claims 1-7 including the process of knead | mixing so that the maximum value of the shear rate of may become 600 sec < ^-1 > or more.   An injection molded article, an extruded molded article, a tubular molded article, a sheet / film molded article, an extruded molded article, or a fiber comprising the resin composition according to any one of claims 1 to 7.   A laminate comprising a substrate comprising the resin composition according to claim 1 and a layer comprising a metal layer or an inorganic material provided on the substrate.   The laminated body containing the board | substrate which consists of a resin composition in any one of Claims 1-7, and the metal plating layer provided on the said board | substrate.   An electric / electronic part, a communication equipment part, or an automobile part using the molded body according to claim 9.