JP2012223805A - Laser beam machining apparatus, laser beam machining method, and laser beam machined product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus which can machine a large quantity of workpieces in a short period of time, and a laser beam machining method using the same.SOLUTION: The laser beam machining apparatus 1 includes: a base 10 having a first slide part 15 along one direction; a plurality of first movement parts 30 independently moving along the first slide part respectively and having second slide parts 33 along the direction crossing the first slide part; second movement parts 40 having holding means 43 for workpieces and movably fitted to the second slide parts respectively; laser beam machining parts provided correspondingly to the respective holding means and emitting laser beams to the workpieces respectively; and a control part of controlling the movement of the first movement parts and the second movement parts. The plurality of first movement parts are controlled so as to move in the same direction and also at the same speed.

Description

  The present invention relates to a laser processing apparatus used when laser processing a workpiece such as ceramics, a laser processing method using the same, and a laser processed product manufactured by this method.

  Hard brittle materials such as ceramic materials, glass materials, and silicon materials are used for circuit boards on which electronic components are mounted. In order to cleave a substrate (workpiece) formed from such a hard and brittle material, a groove is formed on the surface of the substrate or a fine hole is formed inside the substrate. As such a forming means, laser processing for irradiating a substrate with a laser beam is used.

  As a laser processing apparatus for performing this type of laser processing, in order to increase the processing amount of the workpiece, it is placed on the base so as to be movable along the first direction and the second direction perpendicular thereto. It is known to have two loading stages (first loading stage and second loading stage) for holding an object, respectively, and one laser generator for irradiating a laser beam to process a workpiece ( JP, 2008-149716, A). In the apparatus described in this publication, while the workpiece loaded on one loading stage is irradiated with a laser beam, the workpiece is unloaded and loaded (or turned over) on the other loading stage. The purpose is to shorten the total processing time by the time until unloading and increase the processing amount.

  However, since the time required for loading and unloading the workpiece is shorter than the time for irradiating the laser beam for laser processing, the workpiece that has been loaded onto the loading stage waits for a while, As a result, the total processing time cannot be reduced so much, and therefore the amount that can be processed within the time can be expected to increase slightly.

JP 2008-149716 A

  The present invention has been made in view of these disadvantages, and is manufactured by a laser processing apparatus capable of processing a large amount of workpieces in a short time, a laser processing method using the same, and this method. The purpose is to provide a laser processed product.

The laser processing apparatus of the present invention made to solve the above problems is
A base having a first slide portion disposed along one direction;
A plurality of first moving parts each having a second slide part attached along the first slide part so as to be independently movable and arranged along a direction intersecting the first slide part;
A second moving part that has holding means capable of holding the workpiece and is movably attached to the second slide part;
A laser processing unit that is provided corresponding to each of the holding means, and that processes the workpiece by irradiating the held workpiece with a laser beam; and
A control unit that controls movement of the first moving unit and the second moving unit.

  The laser processing apparatus moves the holding unit by moving the first moving unit and the second moving unit, and irradiates the workpiece held by the holding unit with a laser beam from the laser processing unit. The workpiece can be processed. In the laser processing apparatus, the second moving part is attached to the second slide part of each of the plurality of first moving parts, and the second moving part is provided with holding means, whereby a plurality of first moving parts are provided. It has two moving parts and a plurality of holding means. Since a laser processing apparatus is provided corresponding to each of the plurality of holding means, a plurality of workpieces can be processed by a plurality of laser processing apparatuses. That is, since a plurality of workpieces can be processed simultaneously, a large amount of workpieces can be processed in a short time.

  Moreover, in the said laser processing apparatus, it is preferable to employ | adopt the structure which the control part controls so that the movement of one direction of several 1st moving parts becomes the same direction at the time of laser processing.

  Thereby, when processing a several to-be-processed object simultaneously, when a 1st moving part moves to the same direction, 1st moving parts do not interfere easily, such as contact. For this reason, the first moving parts can be arranged close to each other, and the entire apparatus can be made compact.

  Further, in the case where the above configuration is employed, it is preferable to employ a configuration in which the control unit controls the movement of the first moving unit in the same direction to have substantially the same speed.

  Thereby, since several 1st moving parts move to the same direction at substantially the same speed, interference of the 1st moving parts can be prevented more and the whole apparatus can be made more compact.

  In addition, in the case where the above configuration is adopted, when the control unit finishes moving in one direction of one first moving unit among the plurality of first moving units, one direction of the other first moving unit When the movement to is not completed, the one first moving part and the one second moving part attached to the second slide part of the first moving part are set in a stopped state, and the other first moving part is stopped. After the movement of the moving unit in one direction is completed, the second slide of the first moving unit and / or the second moving unit and the other first moving unit and / or the other first moving unit. It is preferable to employ a configuration in which another second moving unit attached to the unit is controlled to start the next movement.

  That is, depending on the position and angle of the workpiece to be held, the amount of movement in one direction between the first moving parts may be different. In such a case, movement in one direction of one first moving part may be different. The movement of the other first moving unit in one direction may not be completed at the time of completion. In this way, when the movement ends in one direction of each first moving unit are different, the next movement (the movement of one first moving unit or the movement of one first moving unit) When the movement of one second moving part attached to the second slide part is started, there is a risk of causing interference between the first moving parts due to the time difference at the end of this movement. If accumulated, the above interference is more likely to occur. For this reason, by adopting the above configuration, the time difference between the movement of one first moving part and the movement of the other first moving part can be eliminated, thereby preventing interference between the first moving parts. become.

  The laser processing apparatus further includes a first drive unit that moves the first moving unit and a second drive unit that moves the second moving unit, and the control unit includes: The main body for calculating the machining path of the workpiece with the movement start point of the first moving unit and the second moving unit set before the machining start position of the workpiece, and driven based on the calculated machining path A laser processing control unit that receives the respective driving amounts of the first driving unit and the second driving unit, and controls the laser processing unit to start irradiation of the laser beam by the laser processing unit based on the driving amount. It is preferable to adopt a configuration.

  That is, the movement of the first moving unit and the second moving unit usually requires a certain period of time from the start time until the desired speed is reached (must move by a certain distance). By calculating the machining path, laser beam irradiation can be started after the desired speed is reached. Thus, the laser beam can be irradiated while moving the workpiece from the processing start position at an appropriate speed, and the workpiece can be processed reliably and accurately. In addition, the laser processing control in which the control unit receives the respective driving amounts of the first driving unit and the second driving unit and controls the laser processing unit to start the irradiation of the laser beam by the laser processing unit based on the driving amount. Since the laser processing control unit can control the laser processing unit based on the data received directly from the first drive unit and the second drive unit by this laser processing control unit, there is no time lag related to laser beam irradiation and more accurate processing Processing of objects can be performed. Note that “the movement start point of the first moving unit and the second moving unit” is “before the machining start position of the workpiece” is a direction in which the workpiece moves during machining from the machining start position of the workpiece and It means a direction opposite to the moving direction, and a position where the first moving unit and the second moving unit are separated by more than a necessary distance from the start of movement to a desired speed during laser processing.

  In addition, the laser processing apparatus preferably includes a camera that images the workpiece held by the holding unit. Thus, the machining path can be calculated based on the captured image data, and even if the workpiece is held in a state of being displaced from the holding means, the workpiece is moved by moving the holding means while correcting the deviation. The workpiece can be processed accurately. Here, this camera can be provided with a single camera for a plurality of holding means, but in this case, each holding means can be moved to an imageable area of the camera, or the camera can be imaged. It is necessary to provide a wide area. When each holding means is moved to an imageable area as in the former, the processing time is increased by the time required to move each holding means, and when the imageable area is widened as in the latter In such a case, the resolution of each workpiece may be reduced, and accurate machining of the workpiece may be difficult. For this reason, it is preferable that a plurality of cameras are provided corresponding to the plurality of holding units, respectively. As a result, the machining time can be shortened and there is an advantage that accurate machining is possible.

  Further, in the case where the camera is provided as described above, the control unit is provided so as to control the imaging of the camera, and the control unit instructs the camera to image the workpiece held by each holding unit. A step of receiving the imaged image data, a step of comparing the received image data with pre-stored reference data, a step of calculating a machining path of each workpiece based on the comparison result, and a calculation It is preferable to employ a configuration that performs a step of moving each of the first moving unit and the second moving unit based on the machining path.

  Thereby, the workpiece is imaged by the camera, the machining path of each workpiece is calculated by comparing the captured image data and the reference data, the holding means is moved along the machining path, The workpiece held by the holding means can be processed. For this reason, even if the workpiece is held in a state of being shifted from the holding means, a machining path in which the deviation is corrected can be calculated, and the workpiece can be processed accurately.

  As described above, the laser processing apparatus of the present invention can process a workpiece held by a plurality of holding means by each laser processing section, and can process a large amount of workpieces in a short time. Can do.

1 is a schematic plan view showing a laser processing apparatus according to an embodiment of the present invention. The schematic front view of the laser processing apparatus of FIG. The schematic block diagram of the laser processing apparatus of FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.

  The laser processing apparatus 1 of FIGS. 1 to 3 includes a base 10 and two (plural) holding means 43 provided so as to be movable in the front-rear and left-right directions with respect to the base 10. The moving mechanism 20 for moving in the horizontal direction, the laser processing unit 50 provided for each holding means 43, the cameras 60a and 60b provided for each holding means 43, and the movement control of the moving mechanism 20 are performed. And a control unit 100. In the laser processing apparatus 1, workpieces having the same structure are held by the holding means 43, and the workpieces are subjected to the same processing.

  The moving mechanism 20 includes two (a plurality of) first moving units 30 that are movably mounted on the base 10 along the left-right direction (one direction) on the same straight line, and the first moving unit 30. A second moving unit 40 mounted so as to be movable along a front-rear direction (a direction orthogonal to the left-right direction), a first drive unit (not shown) for moving the first moving unit 30; And a second drive unit (not shown) that respectively moves the second moving unit 40.

  A first rail portion 15 (first slide portion) is disposed on the base 10 along the left-right direction. Specifically, the base 10 includes a base main body 11 and a first rail member 13 mounted and fixed on the base main body 11. A rail portion 15 is formed.

  The plurality of first moving portions 30 are provided with second rail portions 35 (second slide portions) along the front-rear direction. The first moving unit 30 includes a first moving unit main body 31 that slides on the first rail unit 15, and a second rail member 33 that is placed and fixed on the first moving unit main body 31. The second rail portion 35 is formed on the upper surface of the second rail member 33.

  The second moving unit 40 includes a second moving unit main body 41 that slides along the second rail unit 35, and a holding table that is provided facing the second moving unit main body 41 with a certain gap. 43 (holding means). Here, the second moving part main body 41 has a flange 45 that protrudes from the lower surface side and engages with the second rail part 35, and one side edge (left side) of the second moving part main body 41 along the front-rear direction. The holding table 43 is parallel to the second moving part main body 41 from the upper end of the standing part 47 toward the other side edge side (right side) of the one side edge. Projected to That is, the second moving portion main body 41, the standing portion 47, and the holding table 43 are formed in a substantially inverted U shape in a side view as a whole. The holding table 43 functions as a holding means for holding the workpiece, and the holding table 43 is formed with suction holes (not shown) for sucking the workpiece. Further, the holding table 43 is formed with a perforation 43a on the center side of the suction hole.

  The first drive unit and the second drive unit can be constituted by, for example, a pulse motor. Further, the first slide portion, the second slide portion, the first drive portion, and the second drive portion can be configured by a so-called shaft motor. That is, a first shaft having a magnet in which N poles and S poles are alternately arranged at equal intervals along the axial direction is fixed to the base 10 as a first slide part, and is attached to the first shaft as a first drive part. It is also possible to provide the first moving unit 30 so as to be movable in the left-right direction by using a mover that is slidably attached and has a coil inside and fixed to the first moving unit 30. Similarly, a second shaft having a magnet in which N poles and S poles are alternately arranged at equal intervals along the axial direction is fixed to the first moving part 30 as a second slide part, and the second drive part is used as a second drive part. By using a mover that is slidably mounted on the two shafts and that has a coil inside, the second mover 40 can be provided to be movable in the front-rear direction by fixing the mover to the second mover 40. It is.

The laser processing unit 50 irradiates a workpiece with a laser beam to process the processing unit, and a plurality (two) of laser processing units 50 correspond to the plurality (two) holding means 43. Each laser processing unit 50 is fixed in relative position with respect to the base 10. Each laser processing unit 50 has a light source for emitting a laser beam and an optical system for irradiating the workpiece with the laser beam from the light source. The type of the light source is not particularly limited, and examples thereof include a gas laser such as a CO ₂ laser, a solid laser such as an Nd: YAG laser, and an ultrashort pulse laser such as a femtosecond laser. The wavelength of the laser beam of the light source is preferably 200 nm or more and 11 μm or less, and particularly preferably 240 nm or more and 1600 nm or less. By setting the wavelength of the laser beam within the above range, even a workpiece made of a hard and brittle material can realize an optimum laser output for cleaving, and improve the efficiency and certainty of laser processing. Can do. Further, it is preferable to employ continuous oscillation or pulse oscillation as the laser beam oscillation means of the light source. By making this laser beam oscillation means continuous oscillation, a constant laser output can be continuously oscillated. Further, by using pulse oscillation, a laser pulse having a high peak power can be obtained, and the heat-affected layer is small and more efficient processing is possible. As a result, it is possible to realize optimum processing according to the type and properties of the processing material.

  The cameras 60a and 60b are for imaging the workpiece held by the holding means 43, and a plurality of (two pairs) cameras 60a corresponding to the plurality (two) holding means 43. , 60b. In the present embodiment, two cameras 60a and 60b are provided for one holding means 43, and specifically, a surface-side camera 60a that images the workpiece held by the holding means 43 from above. Two types of the rear side camera 60b that images the workpiece from the lower side through the perforation 43a are provided.

  In addition, the laser processing apparatus 1 has loading / unloading means (not shown) for loading the workpiece into the holding means 43 and unloading the workpiece from the holding means 43, and the loading / unloading means is the holding means. It is provided for every 43. Various means can be adopted as the carry-in / out means, for example, a SCARA robot or the like can be adopted. The control unit 100 controls the loading / unloading means.

  The control unit 100 controls the movement of the moving mechanism 20, controls the holding of the workpiece by the holding unit 43, controls the laser beam irradiation of the laser processing unit 50, and controls the imaging of the cameras 60a and 60b. To do.

  The control unit 100 includes a main body unit 110 that performs various controls, and the main body unit 110 includes, for example, a personal computer. The main body 110 includes an imaging data processing unit 111 that receives imaging data captured by the cameras 60a and 60b, and a drive control unit 113 that instructs the moving mechanism 20 to drive. The control unit 100 (the main body unit 110) has a storage unit (not shown) in which a control program and the like are stored, and the workpiece is accurately held by the holding unit 43 in this storage unit. The reference data of the workpiece, which is the imaged data in the state of being, is stored.

  The control unit 100 has a servo driver 130 connected to the drive control unit 113 via the terminal 120 and connected to the first drive unit and the second drive unit, respectively. Two servo drivers 130 are provided for one holding means 43. Specifically, each servo driver 130 includes one first driving unit, one second driving unit, another first driving unit, and the like. It is connected to each other second driving unit. These servo drivers 130 instruct the driving of the first driving unit or the second driving unit, respectively, and the driving amount of the first driving unit or the second driving unit (the movement of the first moving unit 30 or the second moving unit 40). Each).

  Furthermore, the control unit 100 includes a laser processing control unit 140 that instructs the laser processing unit 50 to irradiate / stop the laser beam. The laser processing control unit 140 is provided for each laser processing unit 50. Specifically, the control unit 100 includes two laser processing control units 140. This laser processing control unit 140 is connected to the first driving unit and the second driving unit, and one first driving unit and one second driving unit are connected to one laser processing control unit 140, and the other The first drive unit and the other second drive unit are connected to another laser processing control unit 140. The laser processing control unit 140 is configured to receive data relating to the driving amounts of the first driving unit and the second driving unit (the moving amounts of the first moving unit 30 and the second moving unit 40), respectively. The laser processing control unit 140 recognizes the position (front / rear / left / right position) of the holding means 43 based on the driving amounts of the first driving unit and the second driving unit, and performs laser processing when the workpiece reaches the processing start position. Laser beam irradiation by the processing unit 50 is started, and when the workpiece reaches the processing end position, the laser processing unit 50 is instructed to end laser beam irradiation by the laser processing unit 50. The laser processing control unit 140 is connected to the main body 110 of the control unit 100, and receives data on the irradiation start position (processing start position) and irradiation end position (processing end position) of the laser beam from the main body 110. ing.

In addition, the control unit 100
1. A loading step of loading the workpiece into each holding means 43;
2. A machining path calculating step of photographing the workpiece held by each holding means 43 with each camera 60a, 60b and calculating a machining path of each workpiece;
3. 3. a machining step of machining each workpiece based on the calculated machining path; and Each member is controlled so as to perform an unloading step of unloading the workpiece that has been processed.

  In the carry-in step and the carry-out step, the control unit 100 moves the holding unit 43 to the carry-in / out position. Then, the processed workpiece that is held by the holding means 43 at the loading / unloading position is delivered by the loading / unloading means, and the unloaded workpiece is loaded into the holding means 43 that has become empty by the loading / unloading means. The control unit 100 controls the workpiece to be held by the holding means 43. Note that when the workpiece is carried in and out, the control unit 100 controls the stopping and starting of the suction by the holding means 43.

In the machining path calculation step, the control unit 100
1. Moving the holding means 43 for holding an unprocessed workpiece to the imaging regions of the cameras 60a and 60b, respectively.
2. Imaging the workpiece located in the imaging region with the cameras 60a and 60b from the front side and the back side;
3. A step of receiving imaged image data from each of the cameras 60a and 60b by the imaged data processing means;
4). A step in which the imaging data processing means compares each received imaging data with the stored reference data;
5. Based on the comparison result, the imaging data processing means is controlled to perform a step of calculating a machining path of each workpiece.

  The machining path is calculated by the main body 110 of the control unit 100. This machining path includes a machining start position and a machining end position of the workpiece. In addition, movement to one side (right direction) in one direction of the workpiece, movement to one side (rear direction) in a direction orthogonal to one direction, movement to the other side (left direction) in one direction, and A pair of machining start positions and machining end positions are calculated for each of the movements to the other side (forward direction) of the orthogonal direction. That is, a machining path as a whole is constituted by a plurality of machining lines constituted by a plurality of pairs of machining start positions and machining end positions.

  Further, when calculating the machining path, the control unit 100 is also provided to calculate the movement path of the workpiece (movement and timing between the first moving unit 30 and the second moving unit 40). Here, the movement path of the workpiece includes the movement start position and the movement end position of the first movement unit 30 and the second movement unit 40. The movement start position is set in front of the processing start position. Further, the movement end position is set on the progress side with respect to the processing end position.

  Specifically, the movement start position is set at a position spaced apart from the machining start position on the extension line of the machining line to be machined next and on the opposite side of the machining direction of the machining line. Here, the fixed distance at which the movement start position and the machining start position are separated from each other is necessary for the first moving unit 30 or the second moving unit 40 to have a desired speed in the machining line direction. It is said that it is more than the distance. Further, the movement end position is set to a position on the extension line of the processing line where the processing has been performed and at a certain distance from the processing end position in the processing direction of the processing line. Here, the fixed distance at which the movement end position and the processing end position are separated is a distance required for the first moving unit 30 or the second moving unit 40 that moves during processing to stop.

  In the processing step, the control unit 100 moves the holding unit 43 to the processing start position, and when reaching the processing start position, each laser processing control unit 140 instructs each laser processing unit 50 to start laser irradiation. And moving the holding means 43 along each processing path while processing the workpiece by the laser beam emitted from each laser processing unit 50, and when each laser processing control unit 140 reaches the laser processing end position, Control is performed so that each laser processing unit 50 is instructed to end laser irradiation.

  Regarding the movement at the time of laser irradiation, the control unit 100 controls the plurality of holding means 43 to move substantially synchronously. That is, the control unit 100 controls the workpieces held by the plurality of holding means 43 to perform the machining on the same machining line in synchronization. Specifically, the control unit 100 controls the plurality of first moving units 30 to move synchronously in the same direction in the left-right direction, and the plurality of second moving units 40 synchronizes in the same direction in the front-rear direction. It is controlled to move. Here, the control unit 100 controls the movements of the plurality of first movement units 30 to have the same speed, and also controls the movements of the plurality of second movement units 40 to have the same speed. . More specifically, for example, at the start of laser processing, the plurality of first moving units 30 move in the right direction at the same speed, and then the plurality of second moving units 40 move in the backward direction at the same speed. Then, the control unit 100 controls the plurality of first moving units 30 to move leftward at the same speed and then the plurality of second moving units 40 to move forward at the same speed. (Note that this machining path can be changed in design as appropriate depending on the shape of the workpiece and the arrangement of the loading / unloading means). Here, when the first moving unit 30 moves in the left-right direction, the second moving unit 40 finely moves in the front-rear direction according to the calculated machining path, and the second moving unit 40 moves back and forth. When moving in the direction, the control unit 100 controls the first moving unit 30 to finely move in the front-rear direction for fine adjustment according to the calculated machining path.

  The control unit 100 controls the first moving unit 30 and the second moving unit 40 to move to the processing start position of the next processing line after the processing of each processing line is completed. Specifically, the control unit 100 first moves the workpiece to the movement start position of one machining line, then moves the workpiece along the machining line, and the workpiece is moved to the machining start position. When reaching, the laser processing unit 50 is instructed to start laser beam irradiation so as to irradiate the laser beam. Thereafter, when the workpiece reaches the processing end position, the control unit 100 instructs to stop the irradiation of the laser beam and gives an instruction to end the driving to the first driving unit and the second driving unit. After that, the first drive unit and the second drive unit are moved to the movement end position on the extension line of one processing line until they completely stop. Then, the control unit 100 moves the workpiece from the movement end position to the movement start position of the next processing line.

  Moreover, the control part 100 performs the next operation | movement of the 1st moving part 30 and the 2nd moving part 40 until the process of all the workpieces among several workpieces is complete | finished about the process of each process line. It is controlled so that there is no.

  That is, when the movement of one of the plurality of first moving units 30 in the left direction or the right direction is completed, the movement of the other first moving unit 30 in the left direction or the right direction is completed. If not, the one first moving unit 30 and one second moving unit 40 placed on the first moving unit 30 are set in a stopped state, and the other first moving unit 30 is moved leftward or After the movement in the right direction is completed, the first moving unit 30 and / or the second moving unit 40 and the other first moving unit 30 and / or the other first moving unit 30 are placed. The control unit 100 controls the other second moving unit 40 that has been started to start the next movement. Further, when the backward movement or the forward movement of one second movement section 40 among the plurality of second movement sections 40 is completed, the backward movement or the forward movement of the other second movement section 40 is finished. If not, the one second moving unit 40 and the one first moving unit 30 on which the second moving unit 40 is placed are set in a stopped state, and the other second moving unit 40 moves backward or After the movement in the forward direction is completed, the one second moving part 40 and / or the one first moving part 30 and the other second moving part 40 and / or the other second moving part 40 are placed. The control unit 100 controls the other first moving unit 30 thus started to start the next movement.

  The movement and standby of the first moving unit 30 and the second moving unit 40 are controlled by the drive control unit 113 of the control unit 100. Here, the case where the first moving unit 30 is moved leftward will be described as an example. When the leftward movement from one first moving unit 30 is completed, the drive control unit 113 performs another second movement. It is determined whether the movement of one moving unit 30 is completed, and if it is determined that the movement of all the first moving units 30 is not completed, the first moving unit 30 that has completed the movement is put on standby. On the other hand, when it is determined that the movement of all the first moving units 30 has been completed, the next movement is instructed to the moving mechanism 20. Thereby, the time difference at the end of the movement of each first moving unit 30 in the left direction is eliminated. The movement of the first moving unit 30 in the right direction and the movement of the second moving unit 40 in the front-rear direction are similarly controlled.

  The control of the control unit 100 will be described more specifically. The control unit 100 controls the laser processing apparatus of the present embodiment to perform the following operation. First, when processing a processing line by moving in the right direction, when the plurality of first moving units 30 move in the right direction and one first moving unit 30 finishes moving in the right direction, If one moving unit 30 has not finished moving in the right direction, the first moving unit 30 and the second moving unit 40 placed on the first moving unit 30 are not moved. Wait until the movement of the other first moving unit 30 in the right direction is completed, and after the movement of the other first moving unit 30 in the right direction is completed, the next processing line (processing by moving in the backward direction). The workpiece is moved to the movement start position of line). Then, when processing the next processing line, first, the movement of the plurality of second moving units 40 in the backward direction is started. In addition, when the plurality of second moving units 40 move backward and one second moving unit 40 finishes moving backward, the other second moving unit 40 finishes moving backward. If not, the second movement unit 40 and the first movement unit 30 on which the second movement unit 40 is placed are not moved to the rear side of the other second movement unit 40. After the movement of the second moving unit 40 is finished, the workpiece is placed at the movement start position of the next machining line (the machining line by the movement in the left direction). Move. Note that the movement of the first moving unit 30 in the left direction and the movement of the second moving unit 40 in the forward direction are substantially the same as described above. The time difference at the end of the movement of each of the first moving unit 30 and the second moving unit 40 in each direction occurs due to a slight deviation when the workpiece is loaded. This is caused by a difference in the amount of movement in the left-right direction or the front-rear direction of the machining path of each workpiece due to the deviation.

  Next, a laser processing method using the laser processing apparatus 1 will be described.

The laser processing method is
1. The first moving unit 30 and the second moving unit 40 are moved to move the plurality of holding units 43 to the respective loading / unloading positions, and the processed workpieces are unloaded by the loading / unloading units, and the unprocessed workpieces Carry in
2. The first moving unit 30 and the second moving unit 40 are moved to move the holding means 43 to the imaging areas of the respective cameras 60a and 60b. The workpieces are imaged by the cameras 60a and 60b, and the imaging data is controlled. The control unit 100 calculates the processing path of each workpiece by comparing the transmitted imaging data with the reference data transmitted to the unit 100,
3. The workpiece is processed by the laser processing unit 50 while moving each holding means 43 based on the calculated processing path.
At the time of carrying in / out, the carry-out work is not performed at the initial stage where the machining has not yet been performed, and only the carry-in work is performed. At the completion stage after all the processes are completed, the carry-in work is not performed and only the carry-out work is performed. The movement of the first moving unit 30 and the second moving unit 40 and the irradiation of the laser processing unit 50 during laser processing (during laser beam irradiation) are performed by the method described in the control method of the control unit 100.

  Since the laser processing apparatus 1 and the laser processing method are configured as described above, they have the following advantages.

  That is, since the laser processing unit 50 is provided corresponding to each of the plurality of holding means 43, a plurality of workpieces can be processed by the plurality of laser processing units 50. That is, since a plurality of workpieces can be processed simultaneously, a large amount of workpieces can be processed in a short time.

  In addition, during the laser processing, since the movements of the plurality of first moving units 30 in the left-right direction and the front-rear direction are in the same direction and at the same speed, the first moving units 30 are unlikely to contact each other and hardly interfere with each other. For this reason, the first moving parts 30 can be arranged close to each other, and the entire apparatus can be made compact.

  In addition, the next movement is not performed until the movement of the first movement unit 30 in the left direction and the right direction is completed for all the first movement units 30, and similarly, the movement of the second movement unit 40 in the backward / forward direction is performed. Since the next movement is not performed until all the second moving parts 40 are completed, even if a time difference occurs in the movement of each holding means 43, it does not cause interference between the first moving parts 30. The entire apparatus can be made more compact.

  Furthermore, since the movement of the first moving unit 30 and the second moving unit 40 is started from a position before the processing start position, the laser beam from the laser processing unit 50 from the processing start position in a state where the workpiece has reached a desired speed. Since irradiation can be started, non-uniform machining can be prevented due to differences in workpiece movement speed, and a laser beam with a moderate intensity is applied to the workpiece moving at a moderate speed. The workpiece can be processed reliably and accurately.

  In particular, since this control is performed by the laser processing control unit 140 based on the driving amounts of the first driving unit and the second driving unit, data received directly from the first driving unit and the second driving unit by the laser processing control unit 140. Since the irradiation of the laser beam can be started based on the above, a time lag relating to the laser beam irradiation hardly occurs, and the workpiece can be processed more accurately.

  Further, since the workpiece held by the holding means 43 is imaged by the cameras 60a and 60b and the machining path is calculated based on the imaging data, even if the workpiece is held in a state shifted from the holding means 43, The workpiece can be processed accurately by moving the holding means 43 while correcting the deviation.

  In particular, since the cameras 60a and 60b are provided corresponding to the respective holding means 43, it is not necessary for another workpiece to wait during imaging of one workpiece, thereby shortening the machining time. In addition, the imaging regions of the respective cameras 60a and 60b can be made suitable for the size of the workpiece, and an accurate machining path can be calculated and accurate machining can be performed. In addition, since each workpiece has a pair of cameras 60a and 60b that capture images from the front side and the back side, a more accurate machining path can be calculated from imaging data on both the front and back sides of the workpiece.

  Furthermore, the machining path can be easily calculated by comparing the captured image data and the reference data stored in advance, and the machining path can be calculated in a short time by comparing with the reference data. The processing speed can be improved.

  Further, the laser processing apparatus 1 can perform the same processing on a large number of workpieces in a short time. For example, after processing one surface of a large amount of workpieces, the processing is performed on the one surface. It is also possible to turn the applied work piece upside down and process the opposite surface of the work piece.

  In the above-described embodiment, the above-described configuration has the above-described advantages. However, the present invention is not limited to this, and the design can be changed as appropriate within the intended scope of the present invention.

  That is, although the above embodiment has been described with a camera, the camera is not an essential requirement in the present invention. However, it is preferable to provide a camera for improving processing accuracy. In this case, it is preferable to provide a camera corresponding to each holding means. However, even when a camera is provided corresponding to each holding means, it is not always necessary to install two cameras that capture images from the front and back surfaces as in the above-described embodiment. It is also possible to provide one unit at a time corresponding to the holding means.

  Moreover, in the said embodiment, a process path | route (the process line) is a path | route along either the left-right direction or the front-back direction, for example, when the 2nd moving part only moves finely at the time of a movement of a 1st moving part is demonstrated. However, the present invention can also be applied to a case where the machining path is an oblique path such as the upper left direction. In this case, the first moving unit and the second moving unit may be caused to cooperate. In addition, the said laser processing apparatus can also be used so that it may process in a different process path | route with respect to the to-be-processed object each hold | maintained at several holding means.

  The second slide part is within the range intended by the present invention as long as it is arranged in a direction intersecting the first slide part. For example, the plurality of second slide parts are parallel to each other. Is not an essential requirement. Further, it is not essential that the plurality of holding means are provided in the same plane as each other. For example, even if there is a difference in the vertical height of the plurality of holding means, it is within the range intended by the present invention. Furthermore, the present invention is not limited to the laser processing apparatus and the laser processing method, but also covers laser processed products manufactured by this laser processing method.

  As described above, the laser processing apparatus of the present invention can perform a large amount of laser processing in a short time and can be widely used in the field of laser processing.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 10 Base 11 Base main body 13 1st rail member 15 1st rail part (1st slide part)
20 moving mechanism 30 first moving part 31 first moving part main body 33 second rail member 35 second rail part 40 second moving part 41 second moving part main body 43 holding means (holding table)
43a perforation 45 collar 47 standing unit 50 laser processing unit 60a front side camera 60b back side camera 100 control unit 110 main body unit 111 imaging data processing unit 113 drive control unit 120 terminal 130 servo driver 140 laser processing control unit

Claims (9)

A base having a first slide portion disposed along one direction;
A plurality of first moving parts each having a second slide part attached along the first slide part so as to be independently movable and arranged along a direction intersecting the first slide part;
A second moving part that has holding means capable of holding the workpiece and is movably attached to the second slide part;
A laser processing unit that is provided corresponding to each of the holding means, and that processes the workpiece by irradiating the held workpiece with a laser beam; and
A laser processing apparatus comprising: a control unit that controls movement of the first moving unit and the second moving unit.   The laser processing apparatus according to claim 1, wherein the control unit controls the movement of the plurality of first moving units to be substantially synchronized in the same direction during laser processing.   The laser processing apparatus according to claim 2, wherein the control unit controls the movement of the first moving unit in the same direction to have substantially the same speed.   When the control unit has not finished moving in one direction of the other first moving unit at the time when moving in one direction of the first moving unit of one of the plurality of first moving units is completed, The one first moving part and one second moving part attached to the second slide part of the first moving part are set in a stopped state, and the movement of the other first moving part in one direction is finished. Later, the first moving part and / or the second moving part and the other first moving part and / or another second moving part attached to the second slide part of the other first moving part. The laser processing apparatus according to claim 3, which controls to start the next movement. A first drive unit for moving each of the first moving units;
A second driving unit that respectively moves the second moving unit;
The control unit is
A main body for calculating the machining path of the workpiece, wherein the movement starting point of the first moving unit and the second moving unit is set before the machining start position of the workpiece;
The laser processing unit receives the driving amounts of the first driving unit and the second driving unit that are driven under the calculated processing path, and starts laser beam irradiation by the laser processing unit based on the driving amounts. The laser processing apparatus in any one of Claims 1-4 provided with the laser processing control part which controls.   The laser processing apparatus according to any one of claims 1 to 5, further comprising a camera that is provided corresponding to each holding means and images each of the held workpieces. The control unit is provided to control imaging of the camera;
This control unit
Instructing the camera to image the workpiece held by each holding means;
Receiving captured image data;
Comparing the received imaging data with pre-stored reference data;
The laser according to claim 6, wherein a step of calculating a machining path of each workpiece based on the comparison result and a step of moving each first moving unit and the second moving unit based on the calculated machining path are performed. Processing equipment.   The laser processing method using the laser processing apparatus of any one of Claims 1-7. A laser processed product processed by the laser processing method according to claim 8.

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