JP2012222167A - Substrate processing apparatus and manufacturing method of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the accurate temperature measurement conducted by a radiation thermometer from being inhibited due to smears of a view port.SOLUTION: A substrate processing apparatus includes: a boat holding multiple substrates; a cylindrical heating material provided so as to enclose the boat and forming a reaction chamber; a reaction pipe provided so as to enclose the cylindrical heating material; a cylindrical heat insulation part provided between the cylindrical heating material and the reaction pipe; a chip for temperature measurement provided between the cylindrical heating material and the cylindrical heat insulation part; a radiation thermometer measuring a temperature by radiation light being entered from the chip for temperature measurement; a view port provided between the chip for temperature measurement and the radiation thermometer and transmitting the radiation light from the chip for temperature measurement; and a blow nozzle provided at a clearance between the cylindrical heating material and the cylindrical heat insulation part and having a first gas supply port supplying an inactive gas to the view port.

Description

  The present invention relates to a substrate processing apparatus, and more particularly to a temperature measurement technique using a radiation thermometer for temperature control of the substrate processing apparatus.

  In a substrate processing apparatus that performs processing while applying heat to a substrate such as a wafer, the temperature in the processing chamber is detected using a thermocouple or a radiation thermometer as described in Patent Document 1, and based on the detected temperature. The temperature in the processing chamber is controlled.

  On the other hand, Patent Document 2 describes that a SiC epitaxial growth film is formed using a so-called vertical batch type substrate processing apparatus. Here, in Patent Document 2, because SiC epitaxial growth requires treatment at an ultrahigh temperature exceeding 1400 degrees, a reaction chamber is formed by a cylindrical derivative, and a heat insulating material is provided so as to surround the derivative. It is described that it is provided.

JP 2006-210768 A JP 2010-283336 A

  Here, the inventors studied to measure the temperature with a radiation thermometer in the configuration as in Patent Document 2. At that time, when a radiation thermometer is arranged on the side as in Patent Document 1, it is difficult to measure because a heat insulating material exists between the derivative to be measured and the radiation thermometer.

  Therefore, the temperature of the temperature measuring chip provided between the derivative and the heat insulating material was examined from the bottom of the processing furnace using a radiation thermometer. In this case, the radiation thermometer needs to be placed below the upper surface of the manifold where the temperature is relatively low. Therefore, a viewport is provided on the upper surface of the manifold with a transparent member, and the temperature measured through the viewport is measured. It is conceivable to measure the emitted light from the industrial chip. However, when particles adhere to the viewport, there is a possibility that the radiation cannot be transmitted through the viewport and the temperature cannot be measured accurately.

  According to one aspect of the present invention, there is provided a heat treatment apparatus for growing a single crystal film or a polycrystalline film on a plurality of substrates, a boat holding the plurality of substrates, and a reaction provided to surround the boat. A cylindrical heating material constituting the chamber, a reaction tube provided so as to surround the cylindrical heating material, a cylindrical heat insulating portion provided between the cylindrical heating material and the reaction tube, and the cylinder A temperature measuring chip provided between the heat generating member and the cylindrical heat insulating part, a radiation thermometer for measuring the temperature by radiating light from the temperature measuring chip, and the temperature measuring chip Provided between a tip and the radiation thermometer, provided in a gap between a viewport that transmits radiation light from the temperature measurement tip, and the cylindrical heating material and the cylindrical heat insulating part, Blow having a first gas supply port for supplying an inert gas toward the viewport To provide a substrate processing apparatus including a nozzle.

  The measurement accuracy of the radiation thermometer can be improved.

1 is a perspective view of a semiconductor manufacturing apparatus to which the present invention is applied. It is side surface sectional drawing of the processing furnace to which this invention is applied. It is a plane sectional view of a processing furnace to which the present invention is applied. It is the figure which extracted the part regarding temperature detection out of the processing furnace to which this invention is applied. It is a figure explaining arrangement | positioning of a temperature detection chip | tip and a radiation thermometer among the processing furnaces to which this invention is applied. It is the figure which showed the upper surface part of the manifold among the processing furnaces to which this invention is applied. It is a figure explaining the gas supply unit of the semiconductor manufacturing apparatus with which this invention is applied. It is a block diagram which shows the control structure of the semiconductor manufacturing apparatus with which this invention is applied. It is a schematic sectional drawing of the processing furnace of the semiconductor manufacturing apparatus with which this invention is applied, and its peripheral structure.

<Overall configuration>
First, referring to FIG. 1, a substrate processing apparatus for forming a SiC epitaxial film according to the first embodiment of the present invention, and a substrate for forming a SiC epitaxial film which is one of semiconductor device manufacturing steps. The manufacturing method will be described.

  A semiconductor manufacturing apparatus 10 as a substrate processing apparatus (film forming apparatus) is a batch type vertical heat treatment apparatus, and includes a housing 12 in which a main part is arranged. In the semiconductor manufacturing apparatus 10, a hoop (hereinafter referred to as a pod) 16 is used as a wafer carrier as a substrate container for storing a wafer 14 (see FIG. 2) as a substrate made of, for example, SiC. A pod stage 18 is disposed on the front side of the housing 12, and the pod 16 is conveyed to the pod stage 18. For example, 25 wafers 14 are stored in the pod 16 and set on the pod stage 18 with the lid closed.

  A pod transfer device 20 is disposed in a front face of the housing 12 and at a position facing the pod stage 18. A pod storage shelf 22, a pod opener 24, and a substrate number detector 26 are disposed in the vicinity of the pod transfer device 20. The pod storage shelf 22 is disposed above the pod opener 24 and is configured to hold a plurality of pods 16 mounted thereon. The substrate number detector 26 is disposed adjacent to the pod opener 24, and the pod transfer device 20 transfers the pod 16 among the pod stage 18, the pod storage shelf 22, and the pod opener 24. The pod opener 24 opens the lid of the pod 16, and the substrate number detector 26 detects the number of wafers 14 in the pod 16 with the lid opened.

  A substrate transfer machine 28 and a boat 30 as a substrate holder are disposed in the housing 12. The substrate transfer machine 28 has an arm (tweezer) 32, and has a structure that can be moved up and down and rotated by a driving means (not shown). The arm 32 can take out, for example, five wafers 14. By moving the arm 32, the wafer 14 is transferred between the pod 16 and the boat 30 placed at the position of the pod opener 24.

  The boat 30 is made of a heat-resistant material such as carbon graphite or SiC, for example, and a plurality of wafers 14 are arranged in a horizontal posture and aligned with their centers aligned, and are stacked and held in the vertical direction. It is configured. Note that a boat heat insulating portion 34 is disposed as a disk-shaped heat insulating member made of a heat resistant material such as quartz or SiC at the lower portion of the boat 30, and heat from the heated body 48 to be described later is processed. It is comprised so that it may become difficult to be transmitted to the downward side of the furnace 40 (refer FIG. 2).

  The processing furnace 40 is disposed in the upper part on the back side in the housing 12. The boat 30 loaded with a plurality of wafers 14 is loaded into the processing furnace 40 and subjected to heat treatment.

<Processing furnace configuration>
Next, the processing furnace 40 of the semiconductor manufacturing apparatus 10 for forming an SiC epitaxial film will be described with reference to FIGS. The processing furnace 40 is provided with a first gas supply nozzle 60 having a first gas supply port 68, a second gas supply nozzle 70 having a second gas supply port 72, and a first gas exhaust port 90. It is done. In addition, a third gas supply port 360 and a second gas exhaust port 390 for supplying an inert gas are shown.

  The processing furnace 40 is made of a heat resistant material such as quartz or SiC, and includes a reaction tube 42 formed in a cylindrical shape having a closed upper end and an opened lower end. A manifold 36 is disposed below the reaction tube 42 concentrically with the reaction tube 42. The manifold 36 is made of, for example, stainless steel and is formed in a cylindrical shape with an upper end and a lower end opened. The manifold 36 is provided so as to support the reaction tube 42. An O-ring (not shown) as a seal member is provided between the manifold 36 and the reaction tube 42. Since the manifold 36 is supported by a holding body (not shown), the reaction tube 42 is installed vertically. A reaction vessel is formed by the reaction tube 42 and the manifold 36.

  The processing furnace 40 includes a to-be-derivatized 48 formed in a cylindrical shape with an upper end closed and a lower end opened, and an induction coil 50 as a magnetic field generating unit. A reaction chamber 44 is formed in a cylindrical hollow portion of the to-be-derivatized 48 so that the boat 30 holding the wafer 14 as a substrate made of SiC or the like can be accommodated. As shown in the lower frame of FIG. 2, the wafer 14 is held by the annular lower wafer holder 15 and held by the boat 30 with the upper surface covered by the disk-like upper wafer holder 15 a. Good. Thereby, the wafer 14 can be protected from particles falling from the upper part of the wafer, and film formation on the back surface side with respect to the film formation surface (lower surface of the wafer 14) can be suppressed. Further, the film forming surface can be separated from the boat column of the wafer holder 15, and the influence of the boat column can be reduced. The boat 30 is configured to hold the wafers 14 held by the wafer holder 15 so as to be aligned in the vertical direction in a horizontal posture and with the centers aligned. The derivative 48 is heated by a magnetic field generated by an induction coil 50 provided outside the reaction tube 42, and the reaction chamber 44 is heated when the derivative 48 generates heat. It is like.

  Preferably, in the reaction chamber 44, between the first and second gas supply nozzles 60, 70 and the first gas exhaust port 90, and between the heated object 48 and the wafer 14. In the meantime, a structure 300 extending in the vertical direction and having an arc-shaped cross section is preferably provided in the reaction chamber 44 so as to fill the space between the heated object 48 and the wafer 14. For example, as shown in FIG. 3, by providing the structures 300 at the opposing positions, the gas supplied from the first and second gas supply nozzles 60 and 70 is transferred along the inner wall of the derivative 48 to the wafer. Bypassing 14 can be prevented. When the structure 400 is preferably formed of a heat insulating material or carbon felt, heat resistance and generation of particles can be suppressed.

  Between the reaction tube 42 and the to-be-derivatized 48, a heat insulating material 54 made of, for example, a carbon felt that is not easily dielectric is provided. By providing the heat insulating material 54, the heat of the to-be-derivatized 48 is changed to the reaction tube 42 or Can suppress the transmission to the outside of the reaction tube 42.

  Further, an outer heat insulating wall 55 having, for example, a water cooling structure is provided outside the induction coil 50 so as to suppress the heat in the reaction chamber 44 from being transmitted to the outside so as to surround the reaction chamber 44. Further, a magnetic seal 58 for preventing the magnetic field generated by the induction coil 50 from leaking outside is provided outside the outer heat insulating wall 55.

  Further, as shown in FIG. 4, a radiation reflecting mirror 620 and a radiation thermometer 630 as temperature detecting means are provided in a space below the reaction chamber 44. The synchrotron radiation reflecting mirror 620 is provided at a position facing the temperature measuring chip 600 provided between the derivative 48 and the heat insulating material 54 via a viewport 610 formed of, for example, a transparent quartz member. The radiation thermometer 620 measures the temperature of the temperature measurement chip 600 by receiving radiation light such as infrared light emitted from the temperature measurement chip 600 and reflected by the radiation reflection mirror 620. The temperature control unit 52 shown in FIG. 8 is notified via an optical fiber and serial communication, and the measurement result can be fed back.

  Further, since the temperature measuring chip 600 and the derivative 48 are formed of the same material, and the temperature measuring chip 600 is close to the derivative 48, the temperature measuring chip 600 is heated in the same manner as the derivative 48. The temperature of the temperature measuring chip 600 becomes equal to the temperature of the to-be-derivatized 48, and the temperature of the to-be-derivatized 48 can be accurately measured by measuring the temperature of the temperature measuring chip 600.

  FIG. 5 shows the arrangement of the temperature measuring chip 600 and the radiation thermometer 630. The temperature measuring chip 600a is provided corresponding to the zone I having the highest position by dividing the derivative 48 into three zones in the height direction. Further, a high-temperature radiation thermometer 630a is provided corresponding to the temperature measurement chip 600a, and the radiated light from the temperature measurement chip 600a enters the high-temperature radiation thermometer 630a. Corresponding to the central zone II, temperature measuring chips 600b and 600d are provided. Further, a high-temperature radiation thermometer 630b is provided corresponding to the temperature measurement chip 600b, and the radiated light from the temperature measurement chip 600b enters the high-temperature radiation thermometer 630b. Further, a low temperature radiation thermometer 630d is provided corresponding to the temperature measurement chip 600d, and the emitted light from the temperature measurement chip 600d detects the temperature on the low temperature side with respect to the high temperature radiation thermometer 600b. The light enters the radiation thermometer 630d. In the lowest zone III, a temperature measuring chip 600c is provided, and a high-temperature radiation thermometer 600c is provided correspondingly. The emitted light from the temperature measuring chip 600c enters the high-temperature radiation thermometer 630c.

  Thus, in this embodiment, the to-be-derivatized 48 is divided into a plurality of zones in the height direction, and the temperature measuring chip 600 and the high-temperature radiation thermometer 630 are provided for each zone, and the temperature of each zone Can be detected. In the central zone II, a temperature measuring chip 600d and a low-temperature radiation thermometer 630d are further provided so that the temperature can be controlled at a low temperature during the temperature rise.

  FIG. 6 is a view showing an upper surface portion of the manifold 36 corresponding to FIG. 4. In the present embodiment, it further has a blow nozzle 650 having a gas supply port 651 for injecting an inert gas (for example, argon (Ar)) toward the view port 610. In this way, by supplying an inert gas toward the upper surface of the viewport 610, the process gas that flows in is suppressed, and particles can be blown away, so that the viewport 610 is prevented from becoming dirty. It becomes possible. Further, since the inert gas is directly supplied to the viewport 610, the temperature rise of the viewport 610 can be suppressed, and the viewport can be prevented from being broken by vacuum due to heat.

  The blow nozzle 650 further includes a gas supply port 652 for supplying an inert gas in the height direction (upward) toward the gap between the heat insulating material 54 and the derivative 48. As a result, the gap between the heat insulating material 54 and the derivative 48 can be made an inert gas atmosphere, and leakage of the process gas from the derivative 48 can be suppressed. At this time, the main purpose of the inert gas supplied from the gas supply port 651 is to be supplied onto the viewport 610, whereas the gas supply port 652 is provided between the heat insulating material 54 and the to-be-derivatized 48. The main purpose is to be supplied to the gap. Therefore, by making the hole diameter of the gas supply port 652 larger than the hole diameter of the gas supply port 651, the amount of the inert gas supplied from the gas supply port 652 is made larger than the amount of the inert gas supplied from the gas supply port 651. In this case, the inert gas can be efficiently supplied to the gap between the heat insulating material 54 having a large volume and the derivative 48.

  The blow nozzle 650 is connected to a fourth gas line 653 provided on the opposite side of the gas supply port 651, and the fourth gas line 653 is connected to a third gas line 240 described later. Thus, an inert gas is supplied. Furthermore, the blow nozzle 650 of the present embodiment has a configuration extending in the circumferential direction from the portion connected to the fourth gas line 653 along the gap between the derivative 48 and the heat insulating material 54. Thus, even when the fourth gas line 653 cannot be arranged in the area below the manifold 36 in the vicinity of the viewport 610, the gas supply port 651 can be brought close to the viewport 610, and the viewport can be effectively viewed. An inert gas can be supplied to the port 610. If it is possible to dispose the gas line 653 below the manifold 36 in the vicinity of the view port 610, a gas supply port 651 is provided on the side surface of the blow nozzle extending in the height direction, and the upper end of the blow nozzle is provided. A gas supply port 652 may be provided.

  Further, as shown in FIG. 2, there is at least one Si (silicon) atom-containing gas and at least one Cl (chlorine) atom-containing gas between the subject derivative 48 and the wafer 14 in order to supply the wafer 14 with the gas. A first gas supply nozzle 60 provided with a first gas supply port 68 is installed. In addition, at least one C (carbon) atom-containing gas and a reducing gas are supplied to the wafer 14 at a location different from the first gas supply nozzle 60 between the derivative 48 and the wafer 14. A second gas supply nozzle 70 provided with the second gas supply port 72 is provided. Similarly, the first gas exhaust port 90 is also disposed between the heated object 48 and the wafer 14. In addition, a third gas supply port 360 and a second gas exhaust port 390 are disposed between the reaction tube 42 and the heat insulating material 54.

  The first gas supply nozzle 60 and the second gas supply nozzle 70 may be provided one by one. However, as shown in FIG. 3, three second gas supply nozzles 70 are provided, It is preferable that the first gas supply nozzle 60 is provided so as to be sandwiched between the two gas supply nozzles 70. By alternately arranging in this way, mixing of the Si atom-containing gas and the C atom-containing gas can be promoted. Further, by using an odd number of the first gas supply nozzles and the second gas supply nozzles, the deposition gas supply can be made symmetrical about the central second gas supply nozzle 70, and the inside of the wafer 14 can be made symmetrical. Can improve the uniformity.

  The first gas supply port 68 and the first gas supply nozzle 60 are made of, for example, carbon graphite and are provided in the reaction chamber 44. The first gas supply nozzle 60 is attached to the manifold 36 so as to penetrate the manifold 36. Here, when forming the SiC epitaxial film, the first gas supply port 68 uses at least Si (silicon) atom-containing gas, for example, monosilane (hereinafter referred to as SiH4) gas and Cl (chlorine) atom-containing gas. For example, hydrogen chloride (hereinafter referred to as HCl) gas and an inert gas (for example, Ar (argon)) as a carrier gas are supplied into the reaction chamber 44 through the first gas supply nozzle 60. Yes.

  The first gas supply nozzle 60 is connected to the gas supply unit 200 via the first gas line 222. Further, as shown in FIG. 7, the first gas line 222 is connected to a mass flow controller (hereinafter referred to as MFC) 211c as a flow rate controller (flow rate control means) for SiH 4 gas, HCl gas, and inert gas. , 211d, 211f and valves 212c, 212c, 212f, for example, are connected to a SiH4 gas supply source 210c, an HCl gas supply source 210d, and an inert gas supply source 210f.

  With the above configuration, the supply flow rate, concentration, partial pressure, and supply timing of SiH 4 gas, HCl gas, and inert gas can be controlled in the reaction chamber 44. The valves 212c, 212d, 212f, and the MFCs 211c, 211d, 211f are electrically connected to the gas flow rate control unit 78, and are controlled at a predetermined timing so that the flow rate of the supplied gas becomes a predetermined flow rate. (See FIG. 8). The gas supply sources 210c, 210d, 210f of SiH4 gas, HCl gas, and inert gas, the valves 212c, 212d, 212f, the MFCs 211c, 211d, 211f, the first gas line 222, the first The gas supply nozzle 60 and at least one first gas supply port 68 provided in the first gas supply nozzle 60 constitute a first gas supply system as a gas supply system.

  The second gas supply port 72 is made of, for example, carbon graphite and is provided in the reaction chamber 44. The second gas supply nozzle 70 is attached to the manifold 36 so as to penetrate the manifold 36. Here, when the SiC epitaxial film is formed, the second gas supply port 72 has at least a C (carbon) atom-containing gas, for example, propane (hereinafter referred to as C3H8) gas, and a reducing gas, for example, hydrogen (H A single atom or H2 molecule (hereinafter referred to as H2) is supplied into the reaction chamber 44 through the second gas supply nozzle 70.

  The second gas supply nozzle 70 is connected to the gas supply unit 200 via the second gas line 260. Further, as shown in FIG. 7, the second gas line 260 is connected to, for example, gas pipes 213a and 213b, and each of the gas pipes 213a and 213b is, for example, C3H8 gas as a C (carbon) atom-containing gas. On the other hand, it is connected to a C3H8 gas supply source 210a via an MFC 211a as a flow rate control means and a valve 212b, and as a reducing gas, for example, an H2 gas supply source 210b via an MFC 211b as a flow rate control means and a valve 212b for H2 gas. It is connected to the.

  With the above configuration, for example, the supply flow rate, concentration, and partial pressure of C3H8 gas and H2 gas can be controlled in the reaction chamber 44. The valves 212a and 212b and the MFCs 211a and 211b are electrically connected to the gas flow rate control unit 78, and are controlled at a predetermined timing so that the supplied gas flow rate becomes a predetermined flow rate. (See FIG. 7). In addition, gas supply is performed by gas supply sources 210a and 210b of C3H8 gas and H2 gas, valves 212a and 212b, MFCs 211a and 211b, a second gas line 260, a second gas supply nozzle 70, and a second gas supply port 72. A second gas supply system is configured as the system.

  Further, in the first gas supply nozzle 60 and the second gas supply nozzle 70, one first gas supply port 68 and one second gas supply port 72 may be provided in the arrangement region of the substrate. Alternatively, it may be provided for every predetermined number of wafers 14.

<Exhaust system>
As shown in FIG. 3, a first gas exhaust port 90 is provided below the boat 30, and a gas exhaust pipe 230 connected to the first gas exhaust port 90 is provided in the manifold 36 so as to pass therethrough. ing. A vacuum exhaust device 220 such as a vacuum pump is connected to the downstream side of the gas exhaust pipe 230 via a pressure sensor (not shown) as a pressure detector and an APC (Auto Pressure Controller) valve 214 as a pressure regulator. Yes. A pressure control unit 98 is electrically connected to the pressure sensor and the APC valve 214, and the pressure control unit 98 adjusts the opening degree of the APC valve 214 based on the pressure detected by the pressure sensor, thereby processing furnace. It is configured to control at a predetermined timing so that the pressure in 40 becomes a predetermined pressure (see FIG. 7).

  As described above, at least a Si (silicon) atom-containing gas and a Cl (chlorine) atom-containing gas are supplied from the first gas supply port 68, and at least a C (carbon) atom-containing gas is supplied from the second gas supply port 72. And the reducing gas are supplied, and the supplied gas flows in parallel to the wafer 14 made of Si or SiC and is exhausted from the first gas exhaust port 90, so that the entire wafer 14 is efficiently and uniformly supplied. Be exposed to gas.

  As shown in FIG. 3, the third gas supply port 360 is disposed between the reaction tube 42 and the heat insulating material 54 and attached so as to penetrate the manifold 36. Further, the second gas exhaust port 390 is disposed between the reaction tube 42 and the heat insulating material 54 so as to face the third gas supply port 360, and the second gas exhaust port 390 is a gas It is connected to the exhaust pipe 230. The third gas supply port 360 is formed in a third gas line 240 that penetrates the manifold 36, and is connected to a gas supply source 210e through a valve 212e and an MFC 211e. For example, a rare gas Ar gas is supplied as an inert gas from the gas supply source 210e and contributes to the growth of the SiC epitaxial film, for example, a gas containing Si (silicon) atoms, a gas containing C (carbon) atoms, or Cl ( (Chlorine) atom-containing gas or a mixed gas thereof is prevented from entering between the reaction tube 42 and the heat insulating material 54, and unwanted products adhere to the inner wall of the reaction tube 42 or the outer wall of the heat insulating material 54. Can be prevented. The third gas line 240 is connected to the fourth gas line 653 below the upper surface of the manifold 36.

  Further, the inert gas supplied between the reaction tube 42 and the heat insulating material 54 is exhausted from the vacuum exhaust device 220 via the APC valve 214 on the downstream side of the gas exhaust tube 230 from the second gas exhaust port 390. Is done.

<Details of gas supplied to each gas supply system>
Next, the reason for configuring the first gas supply system and the second gas supply system described above will be described. In a semiconductor manufacturing apparatus for forming a SiC epitaxial film, a source gas composed of at least a Si (silicon) atom-containing gas and a C (carbon) atom-containing gas is supplied to the reaction chamber 44 to form a SiC epitaxial film. There is a need to. Further, as in this embodiment, in the case where a plurality of wafers 14 are held in a multi-stage alignment in a horizontal posture, in order to improve the uniformity between the wafers, a film forming gas is used in the vicinity of each wafer. A gas supply nozzle is provided in the reaction chamber 44 so that it can be supplied from a gas supply port. Therefore, the gas supply nozzle also has the same conditions as the reaction chamber. At this time, if the Si atom-containing gas and the C atom-containing gas are supplied by the same gas supply nozzle, the raw material gases react with each other to consume the raw material gas, and the shortage of the raw material gas is just downstream of the reaction chamber 44. However, deposits such as a SiC film deposited by reaction in the gas supply nozzle block the gas supply nozzle, leading to problems such as unstable supply of the source gas and generation of particles.

  Therefore, in this embodiment, the Si atom-containing gas is supplied through the first gas supply nozzle 60 and the C atom-containing gas is supplied through the second gas supply nozzle 70. Thus, by supplying the Si atom-containing gas and the C atom-containing gas from different gas supply nozzles, it is possible to prevent the SiC film from being deposited in the gas supply nozzle. In addition, what is necessary is just to supply appropriate carrier gas, respectively, when adjusting the density | concentration and flow velocity of Si atom containing gas and C atom containing gas.

  Furthermore, a reducing gas such as hydrogen gas may be used in order to use the Si atom-containing gas more efficiently. In this case, it is desirable to supply the reducing gas through the second gas supply nozzle 70 that supplies the C atom-containing gas. In this way, the reducing gas is supplied together with the C atom-containing gas and mixed with the Si atom-containing gas in the reaction chamber 44, so that the reducing gas is reduced. Therefore, the decomposition of the Si atom-containing gas is compared with that during film formation. Therefore, the deposition of the Si film in the first gas supply nozzle can be suppressed. In this case, the reducing gas can be used as a carrier gas for the C atom-containing gas. Note that the use of an inert gas (particularly a rare gas) such as argon (Ar) as the carrier of the Si atom-containing gas can suppress the deposition of the Si film.

  Further, it is desirable to supply a chlorine atom-containing gas such as HCl to the first gas supply nozzle 60. In this way, even if the Si atom-containing gas is decomposed by heat and can be deposited in the first gas supply nozzle, it becomes possible to enter the etching mode with chlorine, and the first gas supply nozzle It is possible to further suppress the deposition of the Si film inside.

  In the example shown in FIG. 2, the configuration has been described in which the SiH 4 gas and the HCl gas are supplied to the first gas supply nozzle 60, and the C 3 H 8 gas and the H 2 gas are supplied to the second gas supply nozzle 70. As shown, the examples shown in FIGS. 2, 4 and 7 are combinations that are considered to be the best, and are not limited thereto.

  In the example shown in FIGS. 2, 3, and 7, HCl gas is exemplified as the Cl (chlorine) atom-containing gas to be flowed when forming the SiC epitaxial film, but chlorine gas may be used.

  In the above description, when the SiC epitaxial film is formed, a Si (silicon) atom-containing gas and a Cl (chlorine) atom-containing gas are supplied. However, a gas containing Si atoms and Cl atoms, for example, tetrachlorosilane (hereinafter referred to as SiCl4 and Gas), trichlorosilane (hereinafter referred to as SiHCl3) gas, and dichlorosilane (hereinafter referred to as SiH2Cl2) gas may be supplied. Needless to say, the gas containing Si atoms and Cl atoms is also a Si atom-containing gas or a mixed gas of Si atom-containing gas and Cl atom-containing gas. In particular, SiCl4 is desirable from the viewpoint of suppressing the consumption of Si in the nozzle because the temperature at which pyrolysis is relatively high.

  In the above description, C3H8 gas is exemplified as the C (carbon) atom-containing gas. However, ethylene (hereinafter referred to as C2H4) gas or acetylene (hereinafter referred to as C2H2) gas may be used.

  Moreover, although H2 gas was illustrated as reducing gas, it is not restricted to this, You may use other H (hydrogen) atom containing gas. Furthermore, as the carrier gas, at least one of rare gases such as Ar (argon) gas, He (helium) gas, Ne (neon) gas, Kr (krypton) gas, and Xe (xenon) gas may be used. Alternatively, a mixed gas in which the above gases are combined may be used.

  In the above description, the SiC atom-containing gas is supplied via the first gas supply nozzle 60 and the C atom-containing gas is supplied via the second gas supply nozzle 70, thereby depositing the SiC film in the gas supply nozzle. (Hereinafter, the method of separating and supplying the Si atom-containing gas and the C atom-containing gas is referred to as a “separate method”). However, although this method can suppress the deposition of the SiC film in the gas supply nozzle, it is sufficient until the mixture of the Si atom-containing gas and the C atom-containing gas reaches the wafer 14 from the gas supply ports 68 and 72. Need to be done.

  Therefore, from the viewpoint of uniformity in the wafer, it is preferable to mix the Si atom-containing gas and the C atom-containing gas in advance and supply the gas to the gas supply nozzle 60 (hereinafter, the Si atom-containing gas and the C atom-containing gas are referred to as the gas supply nozzle 60) The method of supplying from the same gas supply nozzle is called “premix method”.) However, if the Si atom-containing gas and the C atom-containing gas are supplied from the same gas supply nozzle, the SiC film may be deposited in the gas supply nozzle. On the other hand, when the ratio of chlorine (etching gas) to hydrogen (reducing gas) (Cl / H) is increased in the Si atom-containing gas, the etching effect by chlorine increases, and the reaction of the Si atom-containing gas is suppressed. Is possible. Therefore, Si atom-containing gas, C atom-containing gas, and chlorine-containing gas are supplied to one gas supply nozzle, and a reducing gas (for example, hydrogen gas) used for the reduction reaction is supplied from the other gas supply nozzle. Thus, Cl / H in the gas supply nozzle becomes large, and it is possible to suppress the deposition of the SiC film.

<Processing furnace peripheral configuration>
Next, referring to FIG. 9, the configuration of the processing furnace 40 and its surroundings will be described. Below the processing furnace 40, a seal cap 102 is provided as a furnace port lid for hermetically closing the lower end opening of the processing furnace 40. The seal cap 102 is made of a metal such as stainless steel and is formed in a disk shape. An O-ring (not shown) is provided on the upper surface of the seal cap 102 as a sealing material that comes into contact with the lower end of the processing furnace 40. The seal cap 102 is provided with a rotation mechanism 104, and the rotation shaft 106 of the rotation mechanism 104 is connected to the boat 30 through the seal cap 102, and the wafer 14 is rotated by rotating the boat 30. It is configured.

  Further, the seal cap 102 is configured as a lifting mechanism provided outside the processing furnace 40 so as to be vertically lifted by a lifting motor 122 which will be described later. It is possible to carry in and out. A drive control unit 108 is electrically connected to the rotation mechanism 104 and the lifting motor 122, and is configured to control at a predetermined timing so as to perform a predetermined operation (see FIG. 8).

  A lower substrate 112 is provided on the outer surface of the load lock chamber 110 as a spare chamber. The lower substrate 112 is provided with a guide shaft 116 that is slidably fitted to the lifting platform 114 and a ball screw 118 that is screwed to the lifting platform 114. Further, an upper substrate 120 is provided at the upper ends of the guide shaft 116 and the ball screw 118 erected on the lower substrate 112. The ball screw 118 is rotated by an elevating motor 122 provided on the upper substrate 120, and the elevating platform 114 is moved up and down by rotating the ball screw 118.

  A hollow elevating shaft 124 is vertically suspended from the elevating platform 114, and a connecting portion between the elevating platform 114 and the elevating shaft 124 is airtight. The elevating shaft 124 is moved up and down together with the elevating platform 114. The elevating shaft 124 passes through the top plate 126 of the load lock chamber 110, and a sufficient clearance is formed in the through hole of the top plate 126 through which the elevating shaft 124 passes so that the elevating shaft 124 does not contact the top plate 126. Has been.

  A bellows 128 is provided as a hollow elastic body having elasticity so as to cover the periphery of the lifting shaft 124 between the load lock chamber 110 and the lifting platform 114, and the load lock chamber 110 is hermetically sealed by the bellows 128. It is supposed to be kept. The bellows 128 has a sufficient amount of expansion and contraction that can accommodate the amount of elevation of the lifting platform 114, and the inner diameter of the bellows 128 is sufficiently larger than the outer diameter of the lifting shaft 124. It is comprised so that 124 may not contact.

  The elevating board 130 is horizontally fixed to the lower end of the elevating shaft 124, and the drive unit cover 132 is airtightly attached to the lower surface of the elevating board 130 via a seal member such as an O-ring. The elevating board 130 and the drive unit cover 132 constitute a drive unit storage case 134, and this configuration isolates the inside of the drive unit storage case 134 from the atmosphere in the load lock chamber 110.

  A rotation mechanism 104 for the boat 30 is provided inside the drive unit storage case 134, and the periphery of the rotation mechanism 104 is cooled by a cooling mechanism 135.

  The power cable 138 passes through the hollow portion from the upper end of the elevating shaft 124 and is guided to the rotation mechanism 104 and connected thereto. A cooling water flow path 140 is formed in the cooling mechanism 135 and the seal cap 102. Further, a cooling water pipe 142 is led from the upper end of the elevating shaft 124 through the hollow portion to the cooling water flow path 140 and connected thereto.

  As the elevating motor 122 is driven and the ball screw 118 rotates, the drive unit storage case 134 is raised and lowered via the elevating platform 114 and the elevating shaft 124.

  When the drive unit storage case 134 is raised, the seal cap 102 provided in an airtight manner on the elevating substrate 130 closes the furnace port 144 that is an opening of the processing furnace 40, so that wafer processing is possible. Further, when the drive unit storage case 134 is lowered, the boat 30 is lowered together with the seal cap 102, and the wafer 14 can be carried out to the outside.

<Control unit>
Next, referring to FIG. 8, the control configuration of each part constituting the semiconductor manufacturing apparatus 10 for forming a SiC epitaxial film will be described.

  The temperature control unit 52, the gas flow rate control unit 78, the pressure control unit 98, and the drive control unit 108 constitute an operation unit and an input / output unit, and are electrically connected to a main control unit 150 that controls the entire semiconductor manufacturing apparatus 10. ing. The temperature control unit 52, the gas flow rate control unit 78, the pressure control unit 98, and the drive control unit 108 are configured as a controller 152.

<Method of forming SiC film>
Next, as a step of the semiconductor device manufacturing process using the semiconductor manufacturing apparatus 10 described above, a substrate manufacturing method for forming, for example, a SiC film on a substrate such as a wafer 14 made of SiC or the like will be described. In the following description, the operation of each part constituting the semiconductor manufacturing apparatus 10 is controlled by the controller 152.

  First, when the pod 16 storing a plurality of wafers 14 is set on the pod stage 18, the pod 16 is transferred from the pod stage 18 to the pod storage shelf 22 by the pod transfer device 20 and stocked. Next, the pod 16 stocked on the pod storage shelf 22 is transported and set to the pod opener 24 by the pod transport device 20, the lid of the pod 16 is opened by the pod opener 24, and the pod 16 is detected by the substrate number detector 26. The number of wafers 14 housed in is detected.

  Next, the wafer 14 is taken out from the pod 16 at the position of the pod opener 24 by the substrate transfer device 28 and transferred to the boat 30.

  When a plurality of wafers 14 are loaded into the boat 30, the boat 30 holding the wafers 14 is loaded into the reaction chamber 44 (boat loading) by the lifting and lowering operation of the lifting platform 114 and the lifting shaft 124 by the lifting motor 122. . In this state, the seal cap 102 is in a state of sealing the lower end of the manifold 36 via an O-ring (not shown).

  After the boat 30 is loaded, the reaction chamber 44 is evacuated by the evacuation device 220 so that the inside of the reaction chamber 44 has a predetermined pressure (degree of vacuum). At this time, the pressure in the reaction chamber 44 is measured by a pressure sensor (not shown), and the APC valve 214 communicating with the first gas exhaust port 90 and the second gas exhaust port 390 based on the measured pressure is used. Feedback controlled. Further, the derivative 48 is heated so that the inside of the wafer 14 and the reaction chamber 44 has a predetermined temperature. At this time, based on the temperature information detected by the radiation thermometer 600d or the radiation thermometer 600d so that the inside of the reaction chamber 44 has a predetermined temperature distribution, the state of energization to the induction coil 50 is feedback-controlled as described above. . Subsequently, when the boat 30 is rotated by the rotation mechanism 104, the wafer 14 is rotated in the circumferential direction.

  Subsequently, Si (silicon) atom-containing gas and Cl (chlorine) atom-containing gas contributing to the SiC epitaxial growth reaction are supplied from gas supply sources 210c and 210d, respectively, and the reaction chamber 44 is supplied from the first gas supply port 68. Erupted inside. Further, after the opening degrees of the MFCs 211a and 211b corresponding to the C (carbon) atom-containing gas and the reducing gas H2 gas have a predetermined flow rate, the valves 212a and 212b are opened, The gas flows through the second gas line 260, flows through the second gas supply nozzle 70, and is introduced into the reaction chamber 44 through the second gas supply port 72.

  The gas supplied from the first gas supply port 68 and the second gas supply port 72 passes through the inside of the derivative 48 in the reaction chamber 44 and passes through the gas exhaust pipe 230 from the first gas exhaust port 90. Exhausted. When the gas supplied from the first gas supply port 68 and the second gas supply port 72 passes through the reaction chamber 44, the gas contacts the wafer 14 made of SiC or the like, and the SiC is formed on the surface of the wafer 14. Epitaxial film growth is performed.

  Further, after the opening degree of the corresponding MFC 211e is adjusted by the gas supply source 210e so that the Ar gas, which is a rare gas as an inert gas, has a predetermined flow rate, the valve 212e is opened and the third gas line is opened. 240 is supplied to the reaction chamber 44 from the third gas supply port 360. Ar gas which is a rare gas as an inert gas supplied from the third gas supply port 360 passes between the heat insulating material 54 in the reaction chamber 44 and the reaction tube 42, and the second gas exhaust port 390. Exhausted from. In parallel with this, the gas flows to the fourth gas line 653 and is supplied from the gas supply port 651 to the view port 610 via the blow nozzle 650. Further, the gas is supplied from the gas supply port 652 to the gap between the derivative 48 and the heat insulating material 54.

  Next, when a preset time elapses, the gas supply described above is stopped, an inert gas is supplied from an inert gas supply source (not shown), and the space inside the object to be heated 48 in the reaction chamber 44 becomes empty. While being replaced with the inert gas, the pressure in the reaction chamber 44 is returned to normal pressure.

  Thereafter, the seal cap 102 is lowered by the elevating motor 122, the lower end of the manifold 36 is opened, and the processed wafer 14 is carried out from the lower end of the manifold 36 to the outside of the reaction tube 42 while being held in the boat 30 ( The boat 30 waits at a predetermined position until the wafer 14 held in the boat 30 cools. When the wafers 14 in the boat 30 that have been waiting are cooled to a predetermined temperature, the wafers 14 are taken out from the boat 30 by the substrate transfer device 28, and transferred to the empty pod 16 set in the pod opener 24 for storage. To do. Thereafter, the pod 16 in which the wafers 14 are stored is transferred to the pod storage shelf 22 or the pod stage 18 by the pod transfer device 20. In this way, a series of operations of the semiconductor manufacturing apparatus 10 is completed.

  As mentioned above, although this invention has been demonstrated based on embodiment, it cannot be overemphasized that various changes are possible without being restricted to this. For example, in the embodiment, the SiC epitaxial growth apparatus has been described. However, the present invention is not limited to this, and the present invention can be used for all substrate processing apparatuses that perform processing by heating a substrate. Further, the heating method is not limited to the induction heating method, and a resistance heater or lamp heating can also be applied. Further, the zone division is not limited to three divisions, and may be at least at most.

Below, the preferable aspect which concerns on this embodiment is appended.
(1) A heat treatment apparatus for growing a single crystal film or a polycrystalline film on a plurality of substrates, a boat holding the plurality of substrates, and a cylindrical shape provided to surround the boat and constituting a reaction chamber A heating material, a reaction tube provided so as to surround the cylindrical heating material, a cylindrical heat insulating portion provided between the cylindrical heating material and the reaction tube, the cylindrical heating material, and the cylinder A temperature measuring chip provided between the heat insulating portion, a radiation thermometer that measures temperature by receiving radiation emitted from the temperature measuring chip, the temperature measuring chip, and the radiation thermometer Between the viewport that transmits the light emitted from the temperature measuring chip and the tubular heating material and the tubular heat insulating portion, and is not directed toward the viewport. A blow nozzle having a first gas supply port for supplying an active gas. Plate processing equipment.
(2) In the above (1), the blow nozzle has a second gas supply port for supplying the inert gas upward toward a gap between the cylindrical heat generating material and the cylindrical heat insulating portion. Processing equipment.
(3) The substrate processing apparatus according to (2), wherein a hole diameter of the second gas supply port is larger than a hole diameter of the first gas supply port.

Claims (3)

A boat holding a plurality of substrates,
A cylindrical heating material provided to surround the boat and constituting a reaction chamber;
A reaction tube provided so as to surround the cylindrical heating material;
A cylindrical heat insulating portion provided between the cylindrical heating material and the reaction tube;
A temperature measuring chip provided between the tubular heating material and the tubular heat insulating part;
A radiation thermometer that measures the temperature by the radiation light from the temperature measuring chip being incident;
A viewport provided between the temperature measuring chip and the radiation thermometer, and transmitting a radiation light from the temperature measuring chip;
A substrate processing apparatus comprising: a blow nozzle having a first gas supply port that is provided in a gap between the cylindrical heat generating material and the cylindrical heat insulating portion and supplies an inert gas toward the viewport. In claim 1,
The blow nozzle is a substrate processing apparatus having a second gas supply port for supplying the inert gas upward toward a gap between the cylindrical heat generating material and the cylindrical heat insulating portion. In claim 2,
The substrate processing apparatus, wherein a hole diameter of the second gas supply port is larger than a hole diameter of the first gas supply port.