JP2012222111A - Electric component module - Google Patents

Electric component module Download PDF

Info

Publication number
JP2012222111A
JP2012222111A JP2011085576A JP2011085576A JP2012222111A JP 2012222111 A JP2012222111 A JP 2012222111A JP 2011085576 A JP2011085576 A JP 2011085576A JP 2011085576 A JP2011085576 A JP 2011085576A JP 2012222111 A JP2012222111 A JP 2012222111A
Authority
JP
Japan
Prior art keywords
terminal block
current path
electrical component
path plate
component module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011085576A
Other languages
Japanese (ja)
Other versions
JP5674537B2 (en
Inventor
Kentaro Muramatsu
健太郎 村松
Yuji Morinaga
雄司 森永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP2011085576A priority Critical patent/JP5674537B2/en
Publication of JP2012222111A publication Critical patent/JP2012222111A/en
Application granted granted Critical
Publication of JP5674537B2 publication Critical patent/JP5674537B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent peeling of a sealing resin from a current path plate in an electric component module having a structure where electric components are mounted on a mounting surface of the current path plate and the mounting surface of the current path plate and the electric components are sealed by the sealing resin.SOLUTION: Conductive terminal boards 7, protruding from a mounting surface 2a of a current path plate 2, are provided at the current path plate 2. Each electric component 5 is electrically connected with the current path plate 2 through the terminal board 7 by mounting the electric component 5 on a tip surface 7a located in the protruding direction of the terminal board 7. Further, an engagement hole 71, recessed from an outer peripheral surface 7c, is formed at each terminal board 7.

Description

この発明は、電気部品モジュールに関する。   The present invention relates to an electrical component module.

従来の電気部品モジュール（樹脂封止型半導体装置）には、例えば特許文献１のように、導電性を有する板材や配線基板（セラミック基板）、リードフレーム等の電流経路板の搭載面に、半導体チップや基板等の電気部品を搭載し、これら電流経路板と電気部品とを電気接続した上で、電流経路板の搭載面及び電気部品を封止樹脂により封止したものがある。   In a conventional electric component module (resin-encapsulated semiconductor device), for example, as disclosed in Patent Document 1, a conductive plate member, a wiring substrate (ceramic substrate), a semiconductor substrate on a mounting surface of a current path plate such as a lead frame, etc. There are those in which electrical components such as a chip and a substrate are mounted, the current path plate and the electrical components are electrically connected, and the mounting surface of the current path plate and the electrical components are sealed with a sealing resin.

特開２００９−２３８８０４号公報JP 2009-238804 A

しかしながら、上記従来の電気部品モジュールでは、封止樹脂が電流経路板の搭載面から剥離する虞がある。
例えば、電流経路板及び封止樹脂の熱膨張係数が互いに異なる場合には、電気部品モジュールを加熱冷却した際に、電流経路板と封止樹脂との界面に電流経路板の搭載面に沿う方向へのせん断応力が作用して、封止樹脂が電流経路板の搭載面から剥離してしまう。 However, in the conventional electric component module, the sealing resin may be peeled off from the mounting surface of the current path plate.
For example, when the thermal expansion coefficients of the current path plate and the sealing resin are different from each other, the direction along the mounting surface of the current path plate on the interface between the current path plate and the sealing resin when the electrical component module is heated and cooled. As a result, the sealing resin peels off from the mounting surface of the current path plate.

また、電気部品モジュールを各種部材にネジ止めする等して電気部品モジュールに曲げ応力が生じた場合にも、電流経路板と封止樹脂との界面に前述と同様のせん断応力が作用し、封止樹脂が電流経路板の搭載面から剥離することもある。
さらに、電流経路板の搭載面にめっきが施される等して、この搭載面の表面粗さが小さくなっていると、電流経路板の搭載面に対する封止樹脂の密着性が低下するため、封止樹脂が電流経路板の搭載面から剥離しやすくなる。 Also, when bending stress is generated in the electrical component module by screwing the electrical component module to various members, the same shear stress as described above acts on the interface between the current path plate and the sealing resin, and the sealing is performed. The stop resin may peel off from the mounting surface of the current path plate.
Furthermore, if the surface roughness of this mounting surface is reduced, such as by plating the mounting surface of the current path plate, the adhesiveness of the sealing resin to the mounting surface of the current path plate is reduced. The sealing resin is easily peeled off from the mounting surface of the current path plate.

本発明は、上述した事情に鑑みたものであって、電流経路板と封止樹脂との剥離防止を図ることが可能な電気部品モジュールを提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide an electrical component module capable of preventing peeling between the current path plate and the sealing resin.

この課題を解決するために、本発明の電気部品モジュールは、電流経路板と、当該電流経路板の搭載面上に配されて前記電流経路板に電気接続される電気部品と、前記搭載面及び前記電気部品を封止する封止樹脂とを備え、前記電流経路板には、その搭載面から突出する導電性の端子台が設けられ、前記電気部品が前記端子台の突出方向の先端面に搭載されることで、前記電気部品と前記電流経路板とが前記端子台を介して電気接続されることを特徴とする。   In order to solve this problem, an electrical component module of the present invention includes a current path plate, an electrical component disposed on a mounting surface of the current path plate and electrically connected to the current path plate, the mounting surface, A sealing resin that seals the electrical component, and the current path plate is provided with a conductive terminal block that protrudes from a mounting surface thereof, and the electrical component is disposed on a distal end surface of the terminal block in a protruding direction. By being mounted, the electrical component and the current path plate are electrically connected via the terminal block.

本発明に係る電気部品モジュールによれば、電流経路板の搭載面から突出する端子台が封止樹脂に係合するため、電気部品モジュールが加熱冷却されたり、電気部品モジュールに曲げ応力が生じたとしても、封止樹脂が電流経路板に対してその搭載面に沿う方向（電流経路板の面方向）に移動することが規制される。したがって、電流経路板の搭載面と封止樹脂との界面には、従来のように、電流経路板の面方向へのせん断応力が作用しない、あるいは、このせん断応力が弱まり、結果として、電流経路板と封止樹脂との剥離防止を図ることができる。   According to the electrical component module of the present invention, the terminal block protruding from the mounting surface of the current path plate engages with the sealing resin, so that the electrical component module is heated and cooled or bending stress is generated in the electrical component module. However, the sealing resin is restricted from moving in the direction along the mounting surface (the surface direction of the current path plate) with respect to the current path plate. Therefore, the shearing stress in the surface direction of the current path plate does not act on the interface between the mounting surface of the current path plate and the sealing resin as in the conventional case, or the shear stress is weakened. It is possible to prevent peeling between the plate and the sealing resin.

そして、前記電気部品モジュールにおいては、前記端子台には、その外周面から窪む有底の係合穴が形成され、当該係合穴の内側面が、前記係合穴の底面に対向するように傾斜していることが好ましい。
この構成では、封止樹脂が係合穴に入り込むことで傾斜する係合穴の内側面に係合するため、封止樹脂が端子台の外周面から離間する方向（離間方向）に移動することを規制できる。ここで、封止樹脂の離間方向には搭載面に沿う方向の成分が含まれるため、端子台の外周面のうち係合穴に対向する封止樹脂が搭載面に沿う方向に移動することを特に規制できる。すなわち、搭載面に沿う方向への電流経路板と封止樹脂との相対移動をさらに規制して、電流経路板と封止樹脂との剥離を、より確実に防止することができる。 In the electrical component module, the terminal block is formed with a bottomed engagement hole that is recessed from the outer peripheral surface, and the inner surface of the engagement hole faces the bottom surface of the engagement hole. It is preferable to be inclined.
In this configuration, since the sealing resin enters the engagement hole and engages with the inner surface of the inclined engagement hole, the sealing resin moves in a direction away from the outer peripheral surface of the terminal block (separation direction). Can be regulated. Here, since the component in the direction along the mounting surface is included in the separation direction of the sealing resin, the sealing resin facing the engagement hole on the outer peripheral surface of the terminal block moves in the direction along the mounting surface. In particular, it can be regulated. That is, the relative movement between the current path plate and the sealing resin in the direction along the mounting surface can be further restricted, and the separation between the current path plate and the sealing resin can be more reliably prevented.

さらに、前記電気部品モジュールでは、前記係合穴が前記端子台の外周面の周方向に延びる溝状に形成されているとさらによい。
この構成では、端子台の外周面の周囲近傍に位置する封止樹脂全体の移動を規制することができるため、電流経路板と封止樹脂との剥離防止をさらに図ることができる。 Furthermore, in the electrical component module, it is further preferable that the engagement hole is formed in a groove shape extending in the circumferential direction of the outer peripheral surface of the terminal block.
In this configuration, since the movement of the entire sealing resin located near the periphery of the outer peripheral surface of the terminal block can be restricted, it is possible to further prevent the current path plate and the sealing resin from being separated.

また、前記電気部品モジュールにおいては、前記搭載面から上方に延びる前記端子台の外周面が、前記端子台の突出方向の先端面側において当該端子台の径方向外側に膨出するように形成されていることが好ましい。言い換えれば、前記端子台の突出方向の先端面側には、前記端子台の径方向外側に膨出する膨出部が形成されていることが好ましい。
この構成では、端子台の膨出部が、電流経路板の搭載面の上方に間隔をあけて対向するように位置することになる。これにより、電流経路板の搭載面と端子台の膨出部との間に封止樹脂が入り込んで端子台に係合するため、封止樹脂が電流経路板の搭載面から上方に剥離することを防止できる。 Further, in the electrical component module, an outer peripheral surface of the terminal block extending upward from the mounting surface is formed so as to bulge outward in a radial direction of the terminal block on a distal end surface side in the protruding direction of the terminal block. It is preferable. In other words, it is preferable that a bulging portion that bulges radially outward of the terminal block is formed on the distal end surface side in the protruding direction of the terminal block.
In this configuration, the bulging portion of the terminal block is positioned so as to face the mounting surface of the current path plate with a space therebetween. As a result, since the sealing resin enters between the mounting surface of the current path plate and the bulging portion of the terminal block and engages with the terminal block, the sealing resin peels upward from the mounting surface of the current path plate. Can be prevented.

さらに、前記電気部品モジュールでは、前記搭載面と当該搭載面から上方に延びる前記端子台の外周面との角部が、前記搭載面と前記外周面とを滑らかに接続する湾曲面となっているとよい。
この構成では、封止樹脂が電流経路板に対して移動しようとする力に基づいて、電流経路板の搭載面と端子台の外周面との角部に応力が集中することを防止できる。そして、角部への応力集中を防ぐことで、電流経路板と端子台との境界部分にクラックが生じることを防止することができる。 Furthermore, in the electrical component module, corners of the mounting surface and the outer peripheral surface of the terminal block extending upward from the mounting surface are curved surfaces that smoothly connect the mounting surface and the outer peripheral surface. Good.
In this configuration, it is possible to prevent stress from concentrating on the corners between the mounting surface of the current path plate and the outer peripheral surface of the terminal block based on the force with which the sealing resin moves with respect to the current path plate. By preventing stress concentration on the corners, it is possible to prevent cracks from occurring at the boundary between the current path plate and the terminal block.

また、前記電気部品モジュールにおいては、前記端子台が、平面視円形あるいは楕円形に形成されているとよい。
この構成では、端子台が平面視多角形である場合と比較して、端子台の周方向に尖った角部が形成されないため、封止樹脂と電流経路板とが相対移動しようとする力によって端子台の周方向の一部に応力が集中することを防止できる。 In the electrical component module, the terminal block may be formed in a circular shape or an elliptical shape in plan view.
In this configuration, compared to the case where the terminal block has a polygonal shape in plan view, since the corners sharpened in the circumferential direction of the terminal block are not formed, the force that the sealing resin and the current path plate try to move relatively It is possible to prevent stress from concentrating on a part of the terminal block in the circumferential direction.

さらに、前記電気部品モジュールにおいては、前記端子台の外周面と先端面との角部が、丸みを帯びているとよい。
この構成では、電気部品を端子台の先端面に載置する際に、電気部品が端子台の外周面と先端面との角部によって傷付けられることを防止できる。 Furthermore, in the electrical component module, it is preferable that the corners of the outer peripheral surface and the front end surface of the terminal block are rounded.
In this configuration, when the electrical component is placed on the distal end surface of the terminal block, the electrical component can be prevented from being damaged by the corner portion between the outer peripheral surface and the distal end surface of the terminal block.

また、前記電気部品モジュールにおいては、前記電流経路板と前記端子台とが一体に形成されていてもよい。   In the electrical component module, the current path plate and the terminal block may be integrally formed.

さらに、前記電気部品モジュールにおいては、前記電流経路板の搭載面及び当該搭載面に対向する前記端子台の対向面に、互いに係合する凹凸面が形成されていることがより好ましい。
この場合、前記電流経路板の搭載面及び前記端子台の対向面の一方の面に形成される前記凹凸面が、前記一方の面から窪む凹部によって画成され、前記電流経路板の搭載面及び前記端子台の対向面の他方の面に形成される前記凹凸面が、前記他方の面から突出して前記凹部に挿入可能な凸部によって画成されていればよい。 Furthermore, in the electrical component module, it is more preferable that an uneven surface engaging with each other is formed on the mounting surface of the current path plate and the facing surface of the terminal block facing the mounting surface.
In this case, the uneven surface formed on one surface of the mounting surface of the current path plate and the opposing surface of the terminal block is defined by a recess recessed from the one surface, and the mounting surface of the current path plate And the said uneven surface formed in the other surface of the opposing surface of the said terminal block should just be defined by the convex part which protrudes from the said other surface and can be inserted in the said recessed part.

このように電流経路板と端子台とが別個に形成されていれば、電流経路板に取り付ける端子台の形状や大きさを変更するだけで、様々な形状や大きさの電気部品を端子台に搭載することが可能となる。すなわち、電流経路板の汎用性が向上し、電気部品モジュールをより安価に製造することが可能となる。
また、電流経路板及び端子台の凹凸面同士を係合させることで、電流経路板及び端子台が、搭載面や対向面に沿う方向に互いに動いてずれることも確実に防止できる。 If the current path plate and the terminal block are formed separately in this way, simply changing the shape and size of the terminal block attached to the current path plate, various electrical parts of various shapes and sizes can be used for the terminal block. It can be installed. That is, the versatility of the current path plate is improved, and the electrical component module can be manufactured at a lower cost.
Further, by engaging the uneven surfaces of the current path plate and the terminal block, it is possible to reliably prevent the current path plate and the terminal block from moving and shifting with respect to each other in the direction along the mounting surface and the facing surface.

本発明によれば、電気部品モジュールを構成する電流経路板と封止樹脂との剥離防止を図ることができる。   According to the present invention, it is possible to prevent the current path plate constituting the electric component module from being peeled off from the sealing resin.

本発明の一実施形態に係る半導体装置を示す上面図である。It is a top view which shows the semiconductor device which concerns on one Embodiment of this invention. 図１のＡ−Ａ矢視断面図である。It is AA arrow sectional drawing of FIG. 図２に示す半導体装置の要部を示す拡大断面図である。FIG. 3 is an enlarged cross-sectional view showing a main part of the semiconductor device shown in FIG. 2. 本発明の他の実施形態に係る半導体装置を構成するヒートシンク及び端子台を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the heat sink and terminal block which comprise the semiconductor device which concerns on other embodiment of this invention.

以下、図１〜３を参照して本発明の一実施形態について説明する。
図１，２に示すように、この実施形態に係る半導体装置（電気部品モジュール）１は、厚板状のヒートシンク（電流経路板）２、複数の端子板３，４及び複数の半導体チップ（電気部品）５を封止樹脂６で封止して大略構成されている。
本実施形態の半導体チップ５は、大電流トランジスタ等のように通電により発熱するものであり、平面視矩形の板状に形成されて、上面及び下面の両方に電極パッドを有している。 Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, a semiconductor device (electric component module) 1 according to this embodiment includes a thick heat sink (current path plate) 2, a plurality of terminal plates 3 and 4, and a plurality of semiconductor chips (electrical modules). A component) 5 is sealed with a sealing resin 6 and is generally configured.
The semiconductor chip 5 of the present embodiment generates heat when energized like a large current transistor, is formed in a rectangular plate shape in plan view, and has electrode pads on both the upper and lower surfaces.

ヒートシンク２は、導電性を有し、かつ、放熱性の高い材料によって形成されている。ヒートシンク２をなす具体的な材料としては、例えば銅（Ｃｕ）、タングステン、モリブデン、あるいは、これにＮｉメッキを施したものが挙げられる。
このヒートシンク２には、その上面（搭載面）２ａから突出する導電性の端子台７が複数（図示例では四つ）設けられている。本実施形態の端子台７は、ヒートシンク２と一体に形成されているため、ヒートシンク２と同じ材料によって形成されている。 The heat sink 2 is made of a material having conductivity and high heat dissipation. Specific examples of the material for forming the heat sink 2 include copper (Cu), tungsten, molybdenum, or a material obtained by performing Ni plating on the copper.
The heat sink 2 is provided with a plurality (four in the illustrated example) of conductive terminal blocks 7 protruding from the upper surface (mounting surface) 2a. Since the terminal block 7 of this embodiment is formed integrally with the heat sink 2, it is formed of the same material as the heat sink 2.

端子台７は、図１〜３に示すように、平面視円形で、突出方向の先端面７ａがヒートシンク２の上面２ａに平行する略円柱形状に形成されている。また、端子台７は、その外径が高さ寸法よりも大きい扁平な円柱形状となっている。
この端子台７には、その外周面７ｃ（ヒートシンク２の上面２ａから上方に延びる端子台７の外周面７ｃ）から径方向内側に窪む有底の係合穴７１が形成されている。この係合穴７１は、端子台７の外周面７ｃの周方向に延びる溝状に形成されている。言い換えれば、係合穴７１はリング状に形成されている。また、係合穴７１の内側面７１ｂは、係合穴７１の底面７１ａに対向するように傾斜している。すなわち、係合穴７１の開口部分の面積が係合穴７１の底面７１ａの面積よりも小さくなっている。 As shown in FIGS. 1 to 3, the terminal block 7 has a circular shape in a plan view, and a tip end surface 7 a in a protruding direction is formed in a substantially cylindrical shape parallel to the upper surface 2 a of the heat sink 2. Further, the terminal block 7 has a flat cylindrical shape whose outer diameter is larger than the height dimension.
The terminal block 7 is formed with a bottomed engagement hole 71 that is recessed radially inward from the outer peripheral surface 7c (the outer peripheral surface 7c of the terminal block 7 extending upward from the upper surface 2a of the heat sink 2). The engagement hole 71 is formed in a groove shape extending in the circumferential direction of the outer peripheral surface 7 c of the terminal block 7. In other words, the engagement hole 71 is formed in a ring shape. Further, the inner side surface 71 b of the engagement hole 71 is inclined so as to face the bottom surface 71 a of the engagement hole 71. That is, the area of the opening portion of the engagement hole 71 is smaller than the area of the bottom surface 71 a of the engagement hole 71.

さらに、端子台７の外周面７ｃは、端子台７の突出方向の先端側において端子台７の径方向外側に膨出するように形成されている。言い換えれば、端子台７の外周面７ｃは、端子台７の突出方向の基端側から先端側に向かうにしたがって、端子台７の径方向外側に膨出している。さらに言い換えれば、端子台７の突出方向の先端面７ａ側には、端子台７の径方向外側に膨出する膨出部７２が形成されている。この膨出部７２は、ヒートシンク２の上面２ａの上方に間隔をあけて対向するように位置している。   Further, the outer peripheral surface 7 c of the terminal block 7 is formed so as to bulge outwardly in the radial direction of the terminal block 7 on the distal end side in the protruding direction of the terminal block 7. In other words, the outer peripheral surface 7c of the terminal block 7 bulges outward in the radial direction of the terminal block 7 from the proximal end side in the protruding direction of the terminal block 7 toward the distal end side. In other words, a bulging portion 72 that bulges outward in the radial direction of the terminal block 7 is formed on the distal end surface 7 a side in the protruding direction of the terminal block 7. The bulging portion 72 is positioned so as to face the upper surface 2a of the heat sink 2 with a space therebetween.

また、端子台７の外周面７ｃと先端面７ａとの角部７ｄは、丸みを帯びている。
そして、上記構成の端子台７の外周面７ｃとヒートシンク２の上面２ａとの角部７ｅは、これら上面及び外周面７ｃとを滑らかに接続する湾曲面７３となっている。したがって、本実施形態の端子台７は、断面視で端子台７の突出方向の中途部分において括れを有する形状を呈している。 Further, the corner 7d between the outer peripheral surface 7c and the tip end surface 7a of the terminal block 7 is rounded.
And the corner | angular part 7e of the outer peripheral surface 7c of the terminal block 7 of the said structure and the upper surface 2a of the heat sink 2 is the curved surface 73 which connects these upper surfaces and the outer peripheral surface 7c smoothly. Therefore, the terminal block 7 of this embodiment is exhibiting the shape which has a constriction in the middle part of the protrusion direction of the terminal block 7 by sectional view.

以上のようにしてヒートシンク２上に設けられる複数の端子台７の各先端面７ａには、前述した半導体チップ５が半田１１によって接合されている。これにより、ヒートシンク２と半導体チップ５とが端子台７を介して電気接続されることになる。言い換えれば、ヒートシンク２及び端子台７は、半導体チップ５を外部に電気接続するための外部端子や接続配線としての役割を果たしている。
なお、本実施形態では、半導体チップ５の下面の面積が端子台７の先端面７ａの面積よりも大きいため、半導体チップ５を端子台７に接合した状態では、半導体チップ５が端子台７の先端面７ａの周縁から突出している。 As described above, the above-described semiconductor chip 5 is bonded to the tip surfaces 7 a of the plurality of terminal blocks 7 provided on the heat sink 2 by the solder 11. Thereby, the heat sink 2 and the semiconductor chip 5 are electrically connected via the terminal block 7. In other words, the heat sink 2 and the terminal block 7 serve as external terminals and connection wiring for electrically connecting the semiconductor chip 5 to the outside.
In this embodiment, since the area of the lower surface of the semiconductor chip 5 is larger than the area of the front end surface 7 a of the terminal block 7, the semiconductor chip 5 is connected to the terminal block 7 in a state where the semiconductor chip 5 is bonded to the terminal block 7. It protrudes from the peripheral edge of the tip surface 7a.

各端子板３，４は、銅材などの導電性板材を平面視短冊状に形成して大略構成されており、その長手方向の一端部３１，４１が封止樹脂６内に埋設されるインナーリード部をなし、他端部３２，４２が封止樹脂６から外側に突出して半導体チップ５を外部に接続するためのアウターリード部をなしている。なお、各端子板３，４の他端部３２，４２は、例えば、モールド樹脂６の外面から離間するように延在していてもよい（図２の実線部分）が、例えば、モールド樹脂６の外面に沿って配されるように折り曲げられていてもよい（図２の二点鎖線部分）。
そして、各端子板３，４の一端部３１，４１と他端部３２，４２との間には、折り曲げ加工を施すことで一端部３１，４１を他端部３２，４２よりも端子板３，４の板厚方向にずらして低く位置させる段差板部３３，４３が形成されている。なお、この段差板部３３，４３は、一端部３１，４１と共に封止樹脂６内に埋設されるインナーリード部をなしている。 Each terminal plate 3, 4 is generally configured by forming a conductive plate material such as a copper material in a strip shape in plan view, and an inner end in which one end portion 31, 41 in the longitudinal direction is embedded in the sealing resin 6. The other end portions 32 and 42 protrude outward from the sealing resin 6 to form outer lead portions for connecting the semiconductor chip 5 to the outside. The other end portions 32 and 42 of the terminal plates 3 and 4 may extend so as to be separated from the outer surface of the mold resin 6 (solid line portion in FIG. 2). It may be bent so as to be arranged along the outer surface of the (two-dot chain line portion in FIG. 2).
And between the one end parts 31 and 41 and the other end parts 32 and 42 of each terminal board 3 and 4, the end plate 31 and 41 are made terminal board 3 rather than the other end parts 32 and 42 by bending. , 4 are formed in step plate portions 33 and 43 which are shifted and lowered in the plate thickness direction. The step plate portions 33, 43 form inner lead portions embedded in the sealing resin 6 together with the one end portions 31, 41.

本実施形態では、一対の端子板３，４の一端部３１，４１同士が互いに間隔をあけて向かい合うように、一対の端子板３，４がその長手方向に配列されている。また、一対の端子板３，４がその幅方向に間隔をあけて二組配列されている。
そして、一対の端子板３，４のうちの一方（第一端子板３）を構成する一端部３１は、他方の端子板（第二端子板４）の一端部４１よりも端子板３，４の長手方向に長く形成されている。 In the present embodiment, the pair of terminal plates 3 and 4 are arranged in the longitudinal direction so that the one end portions 31 and 41 of the pair of terminal plates 3 and 4 face each other with a space therebetween. Further, two pairs of terminal plates 3 and 4 are arranged at intervals in the width direction.
And the one end part 31 which comprises one (1st terminal board 3) of a pair of terminal boards 3 and 4 is the terminal boards 3 and 4 rather than the one end part 41 of the other terminal board (2nd terminal board 4). It is long in the longitudinal direction.

第一端子板３の一端部３１は、端子台７と共に半導体チップ５を挟み込むように、半田１２によって半導体チップ５の上面に接合されている。本実施形態においては、二つの半導体チップ５が、同一の第一端子板３の長手方向に配列されるようにして同一の一端部３１の下面に接合されている。これにより、半導体チップ５が、第一端子板３に電気接続されている。   One end 31 of the first terminal plate 3 is joined to the upper surface of the semiconductor chip 5 by solder 12 so as to sandwich the semiconductor chip 5 together with the terminal block 7. In the present embodiment, two semiconductor chips 5 are joined to the lower surface of the same one end portion 31 so as to be arranged in the longitudinal direction of the same first terminal plate 3. Thereby, the semiconductor chip 5 is electrically connected to the first terminal plate 3.

封止樹脂６は、端子板３，４の他端部３２，４２が外部に突出するように、また、ヒートシンク２の下面２ｂが露出するように、ヒートシンク２の上面２ａ及び側面２ｃ、端子台７、半導体チップ５、並びに、端子板３，４の一端部３１，４１及び段差板部３３，４３を封止している。また、封止樹脂６は、端子台７の係合穴７１に入り込んでいる。そして、封止樹脂６は第一端子板３と第二端子板４との間に介在することで、第一端子板３と第二端子板４との電気的な絶縁を図っている。
以上のように構成される本実施形態の半導体装置１では、例えば、通電によって半導体チップ５において生じた熱を、端子台７からヒートシンク２に伝え、ヒートシンク２の下面２ｂから外部に効率よく放熱することが可能である。 The sealing resin 6 includes the upper surface 2a and side surface 2c of the heat sink 2 and the terminal block so that the other end portions 32 and 42 of the terminal plates 3 and 4 protrude to the outside and the lower surface 2b of the heat sink 2 is exposed. 7, the semiconductor chip 5, the end portions 31 and 41 of the terminal plates 3 and 4, and the step plate portions 33 and 43 are sealed. Further, the sealing resin 6 enters the engagement hole 71 of the terminal block 7. The sealing resin 6 is interposed between the first terminal plate 3 and the second terminal plate 4 to achieve electrical insulation between the first terminal plate 3 and the second terminal plate 4.
In the semiconductor device 1 of the present embodiment configured as described above, for example, heat generated in the semiconductor chip 5 due to energization is transmitted from the terminal block 7 to the heat sink 2 and efficiently radiated from the lower surface 2b of the heat sink 2 to the outside. It is possible.

そして、本実施形態の半導体装置１によれば、ヒートシンク２の上面２ａから突出する端子台７が封止樹脂６に係合するため、半導体装置１が加熱冷却されたり、半導体装置１に曲げ応力が生じたとしても、封止樹脂６がヒートシンク２に対してその上面２ａに沿う方向（ヒートシンク２の面方向）に移動することが規制される。したがって、ヒートシンク２の上面２ａと封止樹脂６との界面には、従来のように、ヒートシンク２の面方向へのせん断応力が作用しない、あるいは、このせん断応力が弱まり、結果として、ヒートシンク２と封止樹脂６との剥離防止を図ることができる。   According to the semiconductor device 1 of the present embodiment, since the terminal block 7 protruding from the upper surface 2a of the heat sink 2 engages with the sealing resin 6, the semiconductor device 1 is heated and cooled, or bending stress is applied to the semiconductor device 1. Even if this occurs, the sealing resin 6 is restricted from moving with respect to the heat sink 2 in the direction along the upper surface 2a (the surface direction of the heat sink 2). Therefore, the shear stress in the surface direction of the heat sink 2 does not act on the interface between the upper surface 2a of the heat sink 2 and the sealing resin 6 as in the prior art, or the shear stress is weakened. It is possible to prevent peeling from the sealing resin 6.

また、端子台７の外周面７ｃに形成された係合穴７１に封止樹脂６が入り込むことによって、封止樹脂６が係合穴７１の内側面７１ｂに係合するため、封止樹脂６が端子台７の外周面７ｃから離間する方向（離間方向）に移動することを規制できる。ここで、封止樹脂６の離間方向にはヒートシンク２の上面２ａに沿う方向の成分が含まれるため、端子台７の外周面７ｃのうち係合穴７１に対向する封止樹脂６がヒートシンク２の面方向に移動することを規制できる。特に本実施形態では、係合穴７１が端子台７の外周面７ｃの周方向に延びるリング状に形成されているため、端子台７の外周面７ｃの周囲近傍に位置する封止樹脂６全体の移動を規制することができる。
したがって、ヒートシンク２の面方向へのヒートシンク２と封止樹脂６との相対移動をさらに規制して、ヒートシンク２と封止樹脂６との剥離を、より確実に防止することができる。 Further, since the sealing resin 6 enters the engagement hole 71 formed in the outer peripheral surface 7 c of the terminal block 7, the sealing resin 6 engages with the inner side surface 71 b of the engagement hole 71. Can be controlled to move away from the outer peripheral surface 7c of the terminal block 7 (separation direction). Here, since the component in the direction along the upper surface 2 a of the heat sink 2 is included in the separation direction of the sealing resin 6, the sealing resin 6 facing the engagement hole 71 in the outer peripheral surface 7 c of the terminal block 7 is the heat sink 2. The movement in the surface direction can be restricted. In particular, in this embodiment, since the engagement hole 71 is formed in a ring shape extending in the circumferential direction of the outer peripheral surface 7c of the terminal block 7, the entire sealing resin 6 located in the vicinity of the periphery of the outer peripheral surface 7c of the terminal block 7 Can be restricted.
Therefore, the relative movement between the heat sink 2 and the sealing resin 6 in the surface direction of the heat sink 2 can be further restricted, and the peeling between the heat sink 2 and the sealing resin 6 can be more reliably prevented.

さらに、端子台７に膨出部７２が形成されていることで、封止樹脂６がヒートシンク２の上面２ａと端子台７の膨出部７２との間に入り込んで係合するため、封止樹脂６がヒートシンク２の上面２ａから上方に剥離することを防止できる。
また、端子台７に膨出部７２が形成されていることで、本実施形態のように半導体チップ５が端子台７の先端面７ａの周縁から突出していても、封止樹脂６がヒートシンク２の上面２ａから上方に離間しようとする力が、この半導体チップ５の突出部分に集中することを防止できる。すなわち、半導体チップ５と端子台７とを接合する半田１１に応力が集中することを防いで、この半田１１にクラックが生じることも防止できる。 Further, since the bulging portion 72 is formed on the terminal block 7, the sealing resin 6 enters and engages between the upper surface 2 a of the heat sink 2 and the bulging portion 72 of the terminal block 7. The resin 6 can be prevented from peeling upward from the upper surface 2 a of the heat sink 2.
Further, since the bulging portion 72 is formed on the terminal block 7, even if the semiconductor chip 5 protrudes from the peripheral edge of the tip end surface 7 a of the terminal block 7 as in the present embodiment, the sealing resin 6 is used as the heat sink 2. It is possible to prevent the force to move upward from the upper surface 2 a of the semiconductor chip from being concentrated on the protruding portion of the semiconductor chip 5. That is, it is possible to prevent stress from concentrating on the solder 11 that joins the semiconductor chip 5 and the terminal block 7, and to prevent the solder 11 from cracking.

さらに、ヒートシンク２の上面２ａと端子台７の外周面７ｃとの角部７ｅを湾曲面７３とすることで、封止樹脂６がヒートシンク２に対して移動しようとする力に基づいて、ヒートシンク２の上面２ａと端子台７の外周面７ｃとの角部７ｅに応力が集中することを防止できる。そして、この角部７ｅへの応力集中を防ぐことで、ヒートシンク２と端子台７との境界部分にクラックが生じることを防止することができる。   Further, the corner 7 e between the upper surface 2 a of the heat sink 2 and the outer peripheral surface 7 c of the terminal block 7 is a curved surface 73, so that the heat sink 2 is based on the force with which the sealing resin 6 tries to move with respect to the heat sink 2. The stress can be prevented from concentrating on the corner portion 7e between the upper surface 2a and the outer peripheral surface 7c of the terminal block 7. Then, by preventing stress concentration on the corner 7e, it is possible to prevent cracks from occurring at the boundary between the heat sink 2 and the terminal block 7.

また、端子台７の平面視形状が円形に設定されていることで、端子台７の周方向に尖った角部が形成されないため、ヒートシンク２と封止樹脂６とが相対移動しようとする力によって端子台７の周方向の一部に応力が集中することを防止できる。
さらに、端子台７の外周面７ｃと先端面７ａとの角部７ｄが丸みを帯びていることで、半導体チップ５を端子台７の先端面７ａに載置する際に、半導体チップ５が端子台７の外周面７ｃと先端面７ａとの角部７ｄによって傷付けられることを防止できる。 In addition, since the shape of the terminal block 7 in plan view is set to be circular, a sharp corner is not formed in the circumferential direction of the terminal block 7, so that the heat sink 2 and the sealing resin 6 tend to move relative to each other. Therefore, it is possible to prevent stress from being concentrated on a part of the terminal block 7 in the circumferential direction.
Further, since the corner 7d between the outer peripheral surface 7c and the front end surface 7a of the terminal block 7 is rounded, when the semiconductor chip 5 is placed on the front end surface 7a of the terminal block 7, the semiconductor chip 5 is connected to the terminal block 7a. It can prevent being damaged by the corner | angular part 7d of the outer peripheral surface 7c of the base 7, and the front end surface 7a.

以上、上記実施形態により本発明の詳細を説明したが、本発明は上述した実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。
例えば、端子台７は、ヒートシンク２と一体に形成されることに限らず、図４に示すように、別個に形成されてもよい。この場合、ヒートシンク２及び端子台７は同一材料によって形成されてもよいが、例えば互いに異なる材料によって形成されてもよい。
また、ヒートシンク２と端子台７とが別体である場合、導電性を有すると共に放熱性の高い接着剤等によってヒートシンク２の平坦な上面２ａに端子台７を単純に接着するだけでもよいが、図４に示すように、ヒートシンク２の上面２ａ及び、この上面２ａに対向する端子台７の対向面７ｂに、互いに係合する凹凸面が形成されているとより好ましい。 As mentioned above, although the detail of this invention was demonstrated by the said embodiment, this invention is not limited to embodiment mentioned above, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, the terminal block 7 is not limited to being formed integrally with the heat sink 2, but may be formed separately as shown in FIG. In this case, the heat sink 2 and the terminal block 7 may be formed of the same material, but may be formed of different materials, for example.
Further, when the heat sink 2 and the terminal block 7 are separate bodies, the terminal block 7 may be simply bonded to the flat upper surface 2a of the heat sink 2 with an adhesive having conductivity and high heat dissipation. As shown in FIG. 4, it is more preferable that an uneven surface that engages with each other is formed on the upper surface 2a of the heat sink 2 and the opposing surface 7b of the terminal block 7 that opposes the upper surface 2a.

なお、図４に記載の構成では、ヒートシンク２の凹凸面がヒートシンク２の上面２ａから窪む凹部２１によって画成され、端子台７の凹凸面が端子台７の対向面７ｂから突出してヒートシンク２の凹部２１に挿入可能な凸部７４によって画成されているが、例えば、ヒートシンク２の凹凸面が上面２ａから突出する凸部によって画成されると共に、端子台７の凹凸面が対向面７ｂから窪む凹部によって画成されてもよい。
また、ヒートシンク２及び端子台７に形成される凹部２１や凸部７４の数は、１つだけに限らず複数形成されていてもよい。この場合、複数の凹部２１や凸部７４は互いに間隔をあけて形成されてもよいし、互いに隣接するように連ねて形成されてもよい。 In the configuration shown in FIG. 4, the uneven surface of the heat sink 2 is defined by a recess 21 that is recessed from the upper surface 2 a of the heat sink 2, and the uneven surface of the terminal block 7 protrudes from the opposing surface 7 b of the terminal block 7. For example, the concave / convex surface of the heat sink 2 is defined by the convex portion protruding from the upper surface 2a, and the concave / convex surface of the terminal block 7 is defined by the opposing surface 7b. It may be defined by a recess recessed from.
Further, the number of the concave portions 21 and the convex portions 74 formed in the heat sink 2 and the terminal block 7 is not limited to one, and a plurality of the concave portions 21 and the convex portions 74 may be formed. In this case, the plurality of concave portions 21 and convex portions 74 may be formed with a space therebetween or may be formed so as to be adjacent to each other.

このようにヒートシンク２と端子台７とが別個に形成されていれば、ヒートシンク２に取り付ける端子台７の形状や大きさを変更するだけで、様々な形状や大きさの半導体チップ５を端子台７に搭載することが可能となる。すなわち、ヒートシンク２の汎用性が向上し、半導体装置１をより安価に製造することが可能となる。
また、ヒートシンク２及び端子台７の凹凸面同士が係合することで、ヒートシンク２と端子台７とが、上面（搭載面）２ａや対向面７ｂに沿う方向に互いに動いてずれることも確実に防止できる。 In this way, if the heat sink 2 and the terminal block 7 are formed separately, the semiconductor chip 5 having various shapes and sizes can be changed by simply changing the shape and size of the terminal block 7 attached to the heat sink 2. 7 can be mounted. That is, the versatility of the heat sink 2 is improved, and the semiconductor device 1 can be manufactured at a lower cost.
In addition, the concave and convex surfaces of the heat sink 2 and the terminal block 7 are engaged with each other, so that the heat sink 2 and the terminal block 7 are also moved and displaced from each other in the direction along the upper surface (mounting surface) 2a and the facing surface 7b. Can be prevented.

そして、上記実施形態では、端子台７の係合穴７１が、端子台７の外周面７ｃの周方向に延びてリング状に形成されているが、例えば端子台７の外周面７ｃの周方向に互いに間隔をあけて複数配列されていてもよい。また、端子台７の係合穴７１は、例えば端子台７の外周面７ｃの周方向の一部にのみ形成されていてもよい。このような構成であっても、端子台７の外周面７ｃのうち係合穴７１に対向する封止樹脂６がヒートシンク２の面方向に移動することを規制して、ヒートシンク２と封止樹脂６との剥離を防ぐことができる。   And in the said embodiment, although the engagement hole 71 of the terminal block 7 is extended in the circumferential direction of the outer peripheral surface 7c of the terminal block 7, and is formed in the ring shape, the circumferential direction of the outer peripheral surface 7c of the terminal block 7, for example A plurality of them may be arranged at intervals. Moreover, the engagement hole 71 of the terminal block 7 may be formed only in a part of the circumferential direction of the outer peripheral surface 7c of the terminal block 7, for example. Even with such a configuration, the heat sink 2 and the sealing resin are regulated by restricting the sealing resin 6 facing the engagement hole 71 in the outer peripheral surface 7c of the terminal block 7 from moving in the surface direction of the heat sink 2. The peeling with 6 can be prevented.

また、端子台７には、係合穴７１及び膨出部７２が両方共に形成されるとしたが、例えば係合穴７１及び膨出部７２の一方のみが形成されてもよいし、例えば両方共に形成されなくてもよい。
さらに、端子台７の外周面７ｃと先端面７ａとの角部７ｄは、丸みを帯びた形状に形成されるとしたが、例えば尖った形状に形成されていてもよい。 Further, although both the engagement hole 71 and the bulging portion 72 are formed in the terminal block 7, for example, only one of the engagement hole 71 and the bulging portion 72 may be formed, for example, both It does not have to be formed together.
Furthermore, although the corner 7d between the outer peripheral surface 7c and the distal end surface 7a of the terminal block 7 is formed in a rounded shape, it may be formed in a sharp shape, for example.

また、端子台７の外周面７ｃとヒートシンク２の上面２ａとの角部７ｅは、湾曲面７３に限らず、例えば端子台７の外周面７ｃとヒートシンク２の上面２ａの両方に対して傾斜する傾斜面であってもよい。このような構成であっても、端子台７の外周面７ｃとヒートシンク２の上面２ａとの角部７ｅの角度が緩やかになるため、上記実施形態の場合と同様に、端子台７の外周面７ｃとヒートシンク２の上面２ａとの角部７ｅに応力が集中することを防止できる。   Further, the corner 7e between the outer peripheral surface 7c of the terminal block 7 and the upper surface 2a of the heat sink 2 is not limited to the curved surface 73, and is inclined with respect to both the outer peripheral surface 7c of the terminal block 7 and the upper surface 2a of the heat sink 2, for example. It may be an inclined surface. Even in such a configuration, since the angle of the corner 7e between the outer peripheral surface 7c of the terminal block 7 and the upper surface 2a of the heat sink 2 becomes gentle, the outer peripheral surface of the terminal block 7 is the same as in the above embodiment. It is possible to prevent stress from concentrating on the corner portion 7e between 7c and the upper surface 2a of the heat sink 2.

さらに、上記実施形態において、端子台７は、平面視円形に形成されるとしたが、これに限ることは無く、平面視多角形等のように任意の平面視形状に形成されてよい。ただし、端子台７の周方向の一部への応力集中を防止あるいは抑制するためには、端子台７の平面視形状を、円形、楕円形、あるいは、角部に丸みを持たせた多角形とすることがより好ましい。
また、端子台７は平面視で半導体チップ５よりも小さく形成されているが、例えば半導体チップ５よりも大きく形成されてもよい。すなわち、端子台７の先端面７ａに接合された半導体チップ５は、先端面７ａの周縁から突出していなくてもよい。 Furthermore, in the said embodiment, although the terminal block 7 was formed in circular shape in planar view, it is not restricted to this, You may form in arbitrary planar view shapes like a planar view polygon. However, in order to prevent or suppress stress concentration on a part of the terminal block 7 in the circumferential direction, the terminal block 7 has a circular shape, an elliptical shape, or a polygon with rounded corners. More preferably.
Further, the terminal block 7 is formed smaller than the semiconductor chip 5 in plan view, but may be formed larger than the semiconductor chip 5, for example. That is, the semiconductor chip 5 bonded to the tip surface 7a of the terminal block 7 may not protrude from the peripheral edge of the tip surface 7a.

さらに、上記実施形態では、一対の端子板３，４の一方（第一端子板３）のみが半導体チップ５に電気接続されているが、例えば、一対の端子板３，４の大きさを調整する等して、一対の端子板３，４の両方（第一端子板３及び第二端子板４）に別個の半導体チップ５が接合されてもよい。
また、端子板３，４は、例えば段差板部３３，４３のない平坦な板状に形成されていてもよい。
さらに、端子板３，４、半導体チップ５及び端子台７の配列や数は、上記実施形態のものに限らず、半導体装置の仕様に応じて任意に設定されてよい。 Furthermore, in the above embodiment, only one of the pair of terminal plates 3 and 4 (first terminal plate 3) is electrically connected to the semiconductor chip 5, but for example, the size of the pair of terminal plates 3 and 4 is adjusted. By doing so, separate semiconductor chips 5 may be bonded to both of the pair of terminal plates 3 and 4 (first terminal plate 3 and second terminal plate 4).
The terminal plates 3 and 4 may be formed in a flat plate shape without the step plate portions 33 and 43, for example.
Furthermore, the arrangement and number of the terminal plates 3 and 4, the semiconductor chips 5, and the terminal blocks 7 are not limited to those of the above-described embodiment, and may be arbitrarily set according to the specifications of the semiconductor device.

そして、上記実施形態では、ヒートシンク２上に半導体チップ５を配してこれらを電気接続した半導体装置１について説明したが、本発明は、電流経路板上に電気部品を配してこれらを電気接続した構成の電気部品モジュールに適用することが可能である。したがって、電流経路板には、ヒートシンク２の他に、例えばリードフレームやセラミック基板等の配線基板を適用することが可能である。また、電気部品には、半導体チップ５の他に、例えば電流経路板よりも小さい小型のリードフレームや配線基板、あるいは、小型のリードフレームや配線基板に半導体チップ５等の電子部品を搭載した電子部品ユニットを適用することが可能である。   In the above-described embodiment, the semiconductor device 1 in which the semiconductor chip 5 is arranged on the heat sink 2 and electrically connected thereto has been described. However, in the present invention, electrical components are arranged on the current path plate to electrically connect them. It is possible to apply to the electrical component module having the above-described configuration. Therefore, in addition to the heat sink 2, for example, a wiring board such as a lead frame or a ceramic substrate can be applied to the current path plate. In addition to the semiconductor chip 5, for example, a small lead frame or wiring board smaller than the current path plate, or an electronic component in which an electronic component such as the semiconductor chip 5 is mounted on the small lead frame or wiring board is included in the electrical component. It is possible to apply a component unit.

なお、電流経路板がリードフレームや配線基板からなる場合には、ボンディングワイヤや導電性の板材等の導電性部材によって電気部品をリードフレームのリードや配線基板の配線パターンに電気接続することもできるため、電気部品モジュールは、例えば上記実施形態のような端子板３，４を備えていなくても構わない。   When the current path plate is composed of a lead frame or a wiring board, the electrical component can be electrically connected to the lead frame lead or the wiring pattern of the wiring board by a conductive member such as a bonding wire or a conductive plate material. Therefore, the electrical component module may not include the terminal plates 3 and 4 as in the above embodiment, for example.

１ 半導体装置（電気部品モジュール）
２ ヒートシンク（電流経路板）
２ａ 上面（搭載面）
５ 半導体チップ（電気部品）
６ 封止樹脂
７ 端子台
７ａ 先端面
７ｂ 対向面
７ｃ 外周面
７ｄ 角部
７ｅ 角部
７１ 係合穴
７１ａ 底面
７１ｂ 内側面
７２ 膨出部
７３ 湾曲面
７４ 凸部 1 Semiconductor device (electrical component module)
2 Heat sink (current path plate)
2a Top surface (mounting surface)
5 Semiconductor chips (electric parts)
6 Sealing resin 7 Terminal block 7a Tip surface 7b Opposing surface 7c Outer peripheral surface 7d Corner portion 7e Corner portion 71 Engaging hole 71a Bottom surface 71b Inner side surface 72 Swelling portion 73 Curved surface 74 Convex portion

Claims (10)

電流経路板と、当該電流経路板の搭載面上に配されて前記電流経路板に電気接続される電気部品と、前記搭載面及び前記電気部品を封止する封止樹脂とを備える電気部品モジュールであって、
前記電流経路板には、その搭載面から突出する導電性の端子台が設けられ、
前記電気部品が前記端子台の突出方向の先端面に搭載されることで、前記電気部品と前記電流経路板とが前記端子台を介して電気接続されることを特徴とする電気部品モジュール。 An electrical component module comprising a current path plate, an electrical component disposed on the mounting surface of the current path plate and electrically connected to the current path plate, and a sealing resin for sealing the mounting surface and the electrical component Because
The current path plate is provided with a conductive terminal block protruding from its mounting surface,
An electrical component module, wherein the electrical component and the current path plate are electrically connected via the terminal block by mounting the electrical component on a front end surface of the terminal block in a protruding direction. 前記端子台には、その外周面から窪む有底の係合穴が形成され、
当該係合穴の内側面が、前記係合穴の底面に対向するように傾斜していることを特徴とする請求項１に記載の電気部品モジュール。 The terminal block has a bottomed engagement hole that is recessed from the outer peripheral surface thereof.
The electrical component module according to claim 1, wherein an inner surface of the engagement hole is inclined so as to face a bottom surface of the engagement hole. 前記係合穴は、前記端子台の外周面の周方向に延びる溝状に形成されていることを特徴とする請求項２に記載の電気部品モジュール。   The electrical component module according to claim 2, wherein the engagement hole is formed in a groove shape extending in a circumferential direction of the outer peripheral surface of the terminal block. 前記搭載面から上方に延びる前記端子台の外周面が、前記端子台の突出方向の先端面側において当該端子台の径方向外側に膨出するように形成されていることを特徴とする請求項１から請求項３のいずれか１項に記載の電気部品モジュール。   The outer peripheral surface of the terminal block extending upward from the mounting surface is formed so as to bulge outward in the radial direction of the terminal block on the tip end surface side in the protruding direction of the terminal block. The electrical component module according to any one of claims 1 to 3. 前記搭載面と当該搭載面から上方に延びる前記端子台の外周面との角部が、前記搭載面と前記外周面とを滑らかに接続する湾曲面となっていることを特徴とする請求項１から請求項４のいずれか１項に記載の電気部品モジュール。   2. A corner portion between the mounting surface and an outer peripheral surface of the terminal block extending upward from the mounting surface is a curved surface that smoothly connects the mounting surface and the outer peripheral surface. The electrical component module according to claim 1. 前記端子台が、平面視円形あるいは楕円形に形成されていることを特徴とする請求項１から請求項５のいずれか１項に記載の電気部品モジュール。   6. The electrical component module according to claim 1, wherein the terminal block is formed in a circular shape or an elliptical shape in plan view. 前記端子台の外周面と先端面との角部が、丸みを帯びていることを特徴とする請求項１から請求項６のいずれか１項に記載の電子部品モジュール。   7. The electronic component module according to claim 1, wherein corners of the outer peripheral surface and the front end surface of the terminal block are rounded. 前記電流経路板と前記端子台とが一体に形成されていることを特徴とする請求項１から請求項７のいずれか１項に記載の電気部品モジュール。   The electrical component module according to any one of claims 1 to 7, wherein the current path plate and the terminal block are integrally formed. 前記電流経路板の搭載面及び当該搭載面に対向する前記端子台の対向面に、互いに係合する凹凸面が形成されていることを特徴とする請求項１から請求項７のいずれか１項に記載の電気部品モジュール。   The uneven surface which engages mutually is formed in the mounting surface of the said current path board, and the opposing surface of the said terminal block facing the said mounting surface, The any one of Claims 1-7 characterized by the above-mentioned. The electrical component module described in 1. 前記電流経路板の搭載面及び前記端子台の対向面の一方の面に形成される前記凹凸面が、前記一方の面から窪む凹部によって画成され、
前記電流経路板の搭載面及び前記端子台の対向面の他方の面に形成される前記凹凸面が、前記他方の面から突出して前記凹部に挿入可能な凸部によって画成されていることを特徴とする請求項９に記載の電気部品モジュール。 The uneven surface formed on one surface of the mounting surface of the current path plate and the opposing surface of the terminal block is defined by a recess recessed from the one surface,
The uneven surface formed on the other surface of the mounting surface of the current path plate and the opposing surface of the terminal block is defined by a protrusion that protrudes from the other surface and can be inserted into the recess. The electrical component module according to claim 9, wherein
JP2011085576A 2011-04-07 2011-04-07 Electrical component module Expired - Fee Related JP5674537B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011085576A JP5674537B2 (en) 2011-04-07 2011-04-07 Electrical component module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011085576A JP5674537B2 (en) 2011-04-07 2011-04-07 Electrical component module

Publications (2)

Publication Number Publication Date
JP2012222111A true JP2012222111A (en) 2012-11-12
JP5674537B2 JP5674537B2 (en) 2015-02-25

Family

ID=47273316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011085576A Expired - Fee Related JP5674537B2 (en) 2011-04-07 2011-04-07 Electrical component module

Country Status (1)

Country Link
JP (1) JP5674537B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211178A (en) * 2014-04-29 2015-11-24 三菱電機株式会社 Semiconductor device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629433A (en) * 1992-07-07 1994-02-04 Nec Corp Casing for mounting heating parts on
JPH0672247U (en) * 1991-11-26 1994-10-07 サンケン電気株式会社 Semiconductor device
JPH1197611A (en) * 1997-09-22 1999-04-09 Tokin Corp Lead frame for semiconductor device
JP2000236048A (en) * 1999-02-16 2000-08-29 Shindengen Electric Mfg Co Ltd Resin-sealed semiconductor device
JP2003124438A (en) * 2001-10-19 2003-04-25 Mitsubishi Electric Corp Semiconductor device and method of manufacturing the same
JP2003133497A (en) * 2001-10-29 2003-05-09 Toshiba Components Co Ltd Thin semiconductor device
JP2005223005A (en) * 2004-02-03 2005-08-18 Denso Corp Semiconductor apparatus
JP2005228849A (en) * 2004-02-12 2005-08-25 Mitsubishi Electric Corp Semiconductor device
JP2010097967A (en) * 2008-10-14 2010-04-30 Denso Corp Semiconductor device
JP2010103350A (en) * 2008-10-24 2010-05-06 Denso Corp Semiconductor device
JP2011054607A (en) * 2009-08-31 2011-03-17 Denso Corp Resin sealing type semiconductor device, and method of manufacturing the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0672247U (en) * 1991-11-26 1994-10-07 サンケン電気株式会社 Semiconductor device
JPH0629433A (en) * 1992-07-07 1994-02-04 Nec Corp Casing for mounting heating parts on
JPH1197611A (en) * 1997-09-22 1999-04-09 Tokin Corp Lead frame for semiconductor device
JP2000236048A (en) * 1999-02-16 2000-08-29 Shindengen Electric Mfg Co Ltd Resin-sealed semiconductor device
JP2003124438A (en) * 2001-10-19 2003-04-25 Mitsubishi Electric Corp Semiconductor device and method of manufacturing the same
JP2003133497A (en) * 2001-10-29 2003-05-09 Toshiba Components Co Ltd Thin semiconductor device
JP2005223005A (en) * 2004-02-03 2005-08-18 Denso Corp Semiconductor apparatus
JP2005228849A (en) * 2004-02-12 2005-08-25 Mitsubishi Electric Corp Semiconductor device
JP2010097967A (en) * 2008-10-14 2010-04-30 Denso Corp Semiconductor device
JP2010103350A (en) * 2008-10-24 2010-05-06 Denso Corp Semiconductor device
JP2011054607A (en) * 2009-08-31 2011-03-17 Denso Corp Resin sealing type semiconductor device, and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211178A (en) * 2014-04-29 2015-11-24 三菱電機株式会社 Semiconductor device

Also Published As

Publication number Publication date
JP5674537B2 (en) 2015-02-25

Similar Documents

Publication Publication Date Title
JP5729468B2 (en) Semiconductor device
JP6433590B2 (en) Power semiconductor device manufacturing method and power semiconductor device
US7701054B2 (en) Power semiconductor module and method for its manufacture
WO2012157583A1 (en) Semiconductor device and manufacturing method thereof
CN110199579B (en) Electronic module and method for manufacturing electronic module
JP5383717B2 (en) Semiconductor device
JPWO2013118478A1 (en) Semiconductor device
US10204871B2 (en) Semiconductor device and semiconductor device manufacturing method
JP6226068B2 (en) Semiconductor device
KR101354894B1 (en) Semiconductor package and method for manufacturing the same and semiconductor package module having the same
JP5930980B2 (en) Semiconductor device and manufacturing method thereof
JP3198019U (en) Semiconductor device
JP6048238B2 (en) Electronic equipment
US20140084438A1 (en) Semiconductor device and method of manufacturing same
JP6834815B2 (en) Semiconductor module
JP5674537B2 (en) Electrical component module
WO2022004332A1 (en) Circuit structure
JP5124329B2 (en) Semiconductor device
JP5256177B2 (en) Semiconductor package
JP2010087442A (en) Semiconductor device, and method of manufacturing the same
JP2012238749A (en) Semiconductor device
JP5145168B2 (en) Semiconductor device
JP2012129393A (en) Semiconductor device
JP6179003B2 (en) Semiconductor device
JP2011077215A (en) Semiconductor package

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20131111

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140411

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140422

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140623

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141125

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141222

R150 Certificate of patent or registration of utility model

Ref document number: 5674537

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees