JP2012209522A - Retainer for semiconductor chip, and its usage - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a retainer for a semiconductor chip capable of improving productivity, preventing deterioration of a product rate, and also reducing manufacturing costs, and its usage.SOLUTION: In this retainer, an adhesive holding layer 10 is laminated on a supporting substrate 1, and plural semiconductor chips 2 jointed to a semiconductor wafer in line with each other are detachably and adhesively held. The supporting substrate 1 is formed into an approximately same size as that of the semiconductor wafer, and plural working holes 3 for the semiconductor chips 2 are bored on the supporting substrate 1. The adhesive holding layer 10 is provided with flexibility. One part of the adhesive holding layer 10 serves as an adhesion region 11 to the supporting substrate 1, and the remaining part of the adhesive holding layer 10 serves as a non-adhesion region 13 not adhered to the supporting substrate 1. Plural holding parts 15 for the semiconductor chips 2 are aligned and formed on the non-adhesion region 13, and each holding part 15 is blocked to be larger than the semiconductor chip 2. Each holding part 15 is opposed to the working holes 3 of the supporting substrate 1.

Description

  The present invention relates to a semiconductor chip holder used for stacking and transporting semiconductor chips in a semiconductor manufacturing process and a method for using the same.

  2. Description of the Related Art In recent years, in a semiconductor manufacturing process, a semiconductor three-dimensional stacking technique is emphasized in order to cope with mass production of a three-dimensional LSI (large scale integrated circuit). This semiconductor three-dimensional stacking technology includes (1) a wafer-on-wafer method in which semiconductor wafers are directly bonded to each other with solder, etc., and (2) soldering good semiconductor chips one by one on the semiconductor wafer or semiconductor chip. There are chip-on-wafer systems that are bonded together (see Patent Documents 1, 2, 3, and 4).

  In the case of the wafer-on-wafer method (1), there is a feature that excellent productivity can be expected. Further, the chip-on-wafer method (2) has an advantage that the product rate can be improved.

JP 2005-203657 A JP 2008-153499 A JP 2008-91696 A JP 2004-273899 A

  However, in the case of the wafer-on-wafer method of (1), although the productivity is excellent, when the number of defective products increases in the semiconductor wafer, the product ratio is drastically decreased due to the bonding and lamination of a plurality of semiconductor wafers. Therefore, there is a problem that it is not realistic and the cost cannot be reduced.

  On the other hand, in the case of the chip-on-wafer method (2), there is a problem that the productivity is inferior although it is possible to prevent a rapid decrease in the product rate. For example, when 500 semiconductor chips are bonded to one semiconductor wafer, the wafer-on-wafer method (1) completes with one bonding operation, whereas the chip-on-wafer method (2) Since it is necessary to repeat the joining operation 500 times, improvement in productivity cannot be expected.

  In order to cope with such a problem, a collective chip-on-wafer method using a wafer bonder to improve productivity has been proposed. However, this system requires a dedicated chip holder. However, since there is no such chip holder at present, there is a problem that it cannot be adopted and is not realistic.

  The present invention has been made in view of the above, and it is possible to provide a semiconductor chip holder and a method of using the same that can improve productivity and prevent a reduction in product rate and can reduce manufacturing costs. It is an object.

In the present invention, in order to solve the above-mentioned problem, an adhesive holding layer is laminated on a support substrate, and this adhesive holding layer is a holding tool for detachably holding a plurality of semiconductor chips bonded to a semiconductor wafer,
The support substrate is formed to be approximately the same size as the semiconductor wafer, and the adhesive holding layer is made flexible so that a part thereof becomes an adhesive region to the support substrate, and the remaining part of the adhesive holding layer is not bonded to the support substrate. As a region, a plurality of holding portions for semiconductor chips are formed on the surface of the non-adhesive region, and each holding portion is partitioned larger than the semiconductor chip, and one of the plurality of holding portions of the support substrate and the adhesive holding layer, It is characterized by drilling a plurality of working holes for semiconductor chips.

A plurality of work holes can be drilled in the support substrate so that the width of each work hole is smaller than that of the semiconductor chip, and the substantially center of the holding portion of the adhesive holding layer can be opposed to the work hole of the support substrate.
In addition, the support substrate and the adhesive holding layer may be bonded to each other with a double-sided adhesive tape, and a gap communicating with the work hole of the support substrate may be defined between the support substrate and the non-adhesive region of the adhesive holding layer. it can.

Further, the holding portion in the non-adhesion region can be brought into close contact with the support substrate by exhausting the air in the gap from the work hole of the support substrate to the outside.
It is also possible to arrange the plurality of holding portions of the adhesive holding layer so as to correspond to the arrangement of a plurality of semiconductor chips that are aligned and bonded to the semiconductor wafer.

Furthermore, in order to solve the above-mentioned problem in the present invention, the method of using the holder according to claim 1, 2, or 3,
A plurality of holding parts of the adhesive holding layer are brought into close contact with the support substrate, the semiconductor chips are held in the holding parts, and the semiconductor wafer and the semiconductor chip holder are pressed at least, whereby the plurality of semiconductor chips are put on the semiconductor wafer. It is characterized in that it is bonded together and then the holding part of the adhesive holding layer is peeled off from each semiconductor chip.

  Here, the supporting substrate in the claims is preferably the same size as the semiconductor wafer or approximately the same size as the semiconductor wafer. The semiconductor wafer includes a semiconductor wafer made of at least φ200, 300, 450 mm silicon wafer or the like. In addition, the adhesive holding layer may cover the entire surface of the opposing surface of the supporting substrate, but may cover the surface excluding the peripheral portion of the opposing surface of the supporting substrate. The adhesion holding layer may have a single layer structure or a multilayer structure.

  If the working hole has a width narrower than that of the semiconductor chip, the working hole is not particularly limited to a circular shape, a rectangular shape, a polygonal shape or the like, and can be used for work such as gas exhaustion and pin insertion / removal. Furthermore, since the semiconductor chip holder according to the present invention is expected to be pressurized or heated in some cases to a semiconductor wafer to which a plurality of semiconductor chips are bonded, it has pressure resistance and heat resistance. It is preferable. Furthermore, from the viewpoint of convenience of transport, it is desirable that the container can be stored in a substrate storage container of a top open box type or a front open box type (for example, FOSB).

  According to the present invention, when holding a plurality of semiconductor chips using a semiconductor chip holder, and bonding the plurality of semiconductor chips to a semiconductor wafer, first, a plurality of holding adhesive layers on the support substrate. The parts are brought into close contact with each other, and the semiconductor chip is adhered and held by the plurality of holding parts. At this time, if the gas between them is exhausted to the outside using the working holes of the support substrate or the adhesive holding layer, the plurality of holding portions of the adhesive holding layer can be easily brought into close contact with the support substrate. As described above, since the holding portion of the adhesive holding layer is in close contact with the support substrate, the adhesive holding layer is unlikely to bend or extend in the thickness direction due to the adhesion of the semiconductor chip.

  After the semiconductor chips are held by the plurality of holding portions of the adhesive holding layer, the semiconductor wafers are bonded to the semiconductor wafer at a time by at least pressurizing the semiconductor wafer and the semiconductor chip holder, and then each semiconductor chip. If the holding part of the adhesive holding layer is peeled off, a plurality of semiconductor chips can be bonded to the semiconductor wafer. At this time, since the support substrate of the semiconductor chip holder is approximately the same size as the semiconductor wafer, the semiconductor wafer and the semiconductor chip holder can be easily aligned.

  According to the present invention, it is possible to improve productivity and prevent a reduction in product rate, and to reduce manufacturing costs.

  According to the second aspect of the present invention, since the width of the working hole of the support substrate is smaller than that of the semiconductor chip, there is a risk that the edge of the semiconductor chip held in the holding portion will be protruded by a protruding pin or damaged. Few. In addition, since the working hole of the support substrate faces approximately the center of the holding portion, it is possible to protrude the approximate center instead of the biased end portion of the semiconductor chip by a protruding pin or the like, and the holding portion of the semiconductor chip and the adhesive holding layer Can be appropriately peeled off.

  Furthermore, according to the invention described in claim 3, since the arrangement of the plurality of holding portions corresponds to the arrangement of the plurality of semiconductor chips to be bonded to the semiconductor wafer, the plurality of semiconductor chips are bonded to the semiconductor wafer all at once. It becomes possible to do.

It is a plane explanatory view showing typically an embodiment of a holder for semiconductor chips concerning the present invention. It is a section explanatory view showing typically an embodiment of a holding fixture for semiconductor chips concerning the present invention, and a method for using the same.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. A semiconductor chip holder in this embodiment includes a deformable adhesive holding layer 10 laminated on a support substrate 1 as shown in FIGS. 1 and 2. The adhesive holding layer 10 is a holder for holding a plurality of semiconductor chips 2 to be bonded to the semiconductor wafer. The support substrate 1 is punched with work holes 3 for the semiconductor chips 2. A part of the adhesive holding layer 10 is used as a part, and the remaining part of the adhesive holding layer 10 is used as a non-adhesive area 13, and a plurality of holding parts 15 for the semiconductor chip 2 are formed in the non-adhesive area 13.

  The support substrate 1 is formed in a planar circle by a semiconductor wafer having the same size as a semiconductor wafer (not shown) on which a plurality of semiconductor chips 2 are arranged and mounted in a pattern, or a flat glass substrate having the same size as the semiconductor wafer. Preferably, it is accommodated in the container main body of the substrate storage container via a plurality of opposing support pieces. Each semiconductor chip 2 is formed in a substantially rectangular plane that is slightly smaller than the holding portion 15 of the adhesive holding layer 10 and is bonded to a pattern surface of a semiconductor wafer made of a silicon wafer or the like by solder or the like in a high temperature environment of about 250 ° C. The

  Since the support substrate 1 is pressed and soldered to the semiconductor wafer while the semiconductor chip 2 is held on the adhesive holding layer 10, or is optionally heat-bonded, it has a pressure resistance and a heat resistance of at least about 250 ° C. It is preferable to have.

  In the thickness direction of the support substrate 1, as shown in FIGS. 1 and 2, a plurality of work holes 3 are drilled through, and each work hole 3 is caused by decompression of the semiconductor chip 2 held by the adhesive holding layer 10. This is used for positioning and push-up peeling by the push pin 20. Each work hole 3 is drilled to a circular reduced diameter smaller than that of the semiconductor chip 2. This is because, when the work hole 3 has a larger diameter than the semiconductor chip 2, the edge of the semiconductor chip 2 is protruded when the semiconductor chip 2 is peeled off, and the pins 20 may be pushed up through the adhesive holding layer 10 to be damaged. Because there is.

  The adhesive holding layer 10 is formed in a flexible planar circle that covers the entire surface of the support substrate 1 using a predetermined material, and is partially bonded and fixed to the flat surface of the support substrate 1. The plurality of semiconductor chips 2 to be joined side by side function so as to be detachably adhered. Examples of the material for the adhesive holding layer 10 include self-adhesive polyolefin elastomers and urethane rubbers, and silicone and fluorine elastomers having excellent heat resistance. The adhesive holding layer 10 may have a thin film structure in which an acrylic adhesive or the like is applied and laminated on the surface of a film having no adhesiveness.

  The adhesive holding layer 10 is preferably provided with flexibility and large stretchability. This is because if the adhesive holding layer 10 does not have flexibility or stretchability, it may be difficult to peel off the semiconductor chip 2 that is adhesively held on the adhesive holding layer 10.

  The adhesive holding layer 10 has a narrow part as an adhesion region 11 to the surface of the support substrate 1 and a wide remaining part as a non-adhesion region 13 that does not adhere to the surface of the support substrate 1. A plurality of holding portions 15 for the chip 2 are arranged in a predetermined pattern. The adhesion region 11 is formed, for example, between the peripheral edge portion of the adhesive holding layer 10 that does not interfere with the work hole 3 of the support substrate 1 and the plurality of holding portions 15, and the back surface is bonded to the surface of the support substrate 1. As shown in FIG. 2, the adhesion of the adhesion region 11 is realized by, for example, adhesion of a ring-shaped or linear double-sided pressure-sensitive adhesive tape 12.

  However, the adhesion between the front surface of the support substrate 1 and the back surface of the adhesion region of the adhesion holding layer 10 is not limited to the adhesion with the double-sided adhesive tape 12. For example, the adhesive holding layer 10 can be laminated and bonded to the surface of the support substrate 1 using its self-adhesiveness. Further, an adhesive or a pressure-sensitive adhesive is applied to a portion corresponding to the adhesion region 11 on the surface of the support substrate 1 with a dispenser or the like, or screen-printed, and then the adhesion holding layer 10 is laminated on the surface of the support substrate 1 for adhesion. You can also

  The adhesive or pressure-sensitive adhesive used here is not particularly limited, and examples thereof include rubber-based types made of acrylic, urethane, epoxy, silicone rubber, styrene rubber, fluorine rubber, and the like. However, when the semiconductor chip 2 is bonded with solder bumps that melt at about 250 ° C., it is necessary to uniformly heat up to the melting temperature of the solder, so that it has heat resistance such as epoxy, silicone rubber, and fluorine. It is preferable to use an adhesive or a pressure-sensitive adhesive.

  As shown in FIG. 2, the non-adhesion region 13 of the adhesive holding layer 10 is non-adhesive treated so that the back surface does not adhere to the surface of the support substrate 1, and a slight gap 14 of double-sided adhesive tape 12 on the surface of the support substrate 1. The gap 14 communicates with the work hole 3 of the support substrate 1. In addition, the plurality of holding portions 15 are spaced by a double-sided adhesive tape 12 minutes in the XY direction on the surface of the non-adhesive region 13 so as to correspond to the arrangement of the plurality of semiconductor chips 2 that are aligned and bonded to the pattern surface of the semiconductor wafer. Arranged.

  Each holding portion 15 is partitioned into a planar rectangle larger than the peripheral portion of the semiconductor chip 2 so that the semiconductor chip 2 can be securely adhered and held in a stable posture, and the center is a gap in the work hole 3 of the support substrate 1. 14 opposite each other. Such a holding portion 15 is indented slightly in a substantially U-shaped cross section and is in close contact with the surface of the support substrate 1 when air is exhausted to the outside from the work hole 3 of the support substrate 1 (see the arrow in FIG. 2). It will be.

  The adhesive holding layer 10 can be partially bonded and fixed to the surface of the support substrate 1 in the elastic deformation region of the adhesive holding layer 10 in a state in which the adhesive holding layer 10 is stretched to be larger than the linear expansion in the operating temperature region. . In this way, even when the adhesive holding layer 10 is stretched at a high temperature in the operating temperature range, the holding portion 15 can prevent the adhesive holding layer 10 from being bent, and the semiconductor chip 2 in the holding portion 15 can be prevented from bending. Misalignment can be effectively prevented.

  In the above configuration, when a plurality of semiconductor chips 2 are adhered and held using a semiconductor chip holder, and the plurality of semiconductor chips 2 are bonded to a semiconductor wafer, first, a suction table provided with a vacuum device (not shown). A semiconductor chip holder is arranged on the top and the pressure is reduced using the plurality of work holes 3 of the support substrate 1, whereby the air in the gap 14 between the surface of the support substrate 1 and the non-adhesive region 13 of the adhesive holding layer 10. The holding portions 15 of the adhesive holding layer 10 are bent and brought into close contact with the support substrate 1, and the selected good semiconductor chips 2 are sequentially held in an adhesive state by the plurality of holding portions 15 of the adhesive holding layer 10. .

  At this time, since the holding portion 15 of the adhesive holding layer 10 is slightly recessed and brought into close contact with the surface of the support substrate 1, the adhesive holding layer 10 does not bend or extend in the thickness direction due to the adhesion of the semiconductor chip 2. Thereby, since the position shift of the semiconductor chip 2 can be prevented, the semiconductor chip 2 can be aligned and held in the plurality of holding portions 15 with high accuracy. When the semiconductor chip 2 is aligned and held in the plurality of holding portions 15, the vacuum device is stopped and the adhesive holding layer 10 can be returned to the original non-contact and non-contact state.

  After the semiconductor chip 2 is adhered and held on the plurality of holding portions 15 of the adhesive holding layer 10, solder is applied to the pattern surface of the semiconductor wafer, and at least the semiconductor chip holder is stacked on the semiconductor wafer in a high temperature environment. By pressing, the plurality of semiconductor chips 2 are collectively soldered to the pattern surface of the semiconductor wafer, and then the semiconductor chip holder is pulled away from the semiconductor wafer and the holding portion 15 of the adhesive holding layer 10 is removed from each semiconductor chip 2. If it peels, the several semiconductor chip 2 can be joined to a semiconductor wafer completely.

  At this time, since the support substrate 1 of the semiconductor chip holder is approximately the same size as the semiconductor wafer, the semiconductor wafer and the semiconductor chip holder can be easily aligned. In addition, since the arrangement of the plurality of holding portions 15 matches the arrangement of the plurality of semiconductor chips 2 that are aligned and bonded to the semiconductor wafer, the plurality of semiconductor chips 2 can be solder-bonded in one operation. Further, when the semiconductor chip holder is pulled away from the semiconductor wafer, the adhesive holding layer 10 extends to some extent, so that the holding part 15 of the adhesive holding layer 10 can be easily peeled from the peripheral edge of the semiconductor chip 2, and the semiconductor chip 2. Will not break the joint.

  When the holding part 15 of the adhesive holding layer 10 cannot be easily peeled from the semiconductor chip 2, the protruding pin 20 is inserted into the work hole 3 of the support substrate 1 from below or the like on the back surface of the holding part 15. The semiconductor chip 2 may be pushed up through the holding portion 15 by pressure contact. In this way, since the work hole 3 of the support substrate 1 faces the center of the holding portion 15, it is possible to push up substantially the center of the back surface of the semiconductor chip 2, and the semiconductor chip 2 and the holding portion 15 of the adhesive holding layer 10 can be securely connected. It becomes possible to peel.

  According to the above configuration, a plurality of semiconductor chips 2 are collectively bonded to the pattern surface of the semiconductor wafer, rather than bonding good semiconductor chips 2 one by one on the semiconductor wafer, so that improvement in productivity is greatly expected. it can. In addition, since the non-defective semiconductor chips 2 selected by the plurality of holding portions 15 of the adhesive holding layer 10 are adhesively held, the product rate is not lowered at all, and a significant cost reduction can be achieved. Furthermore, if the semiconductor chip holder is peeled off from the semiconductor wafer, the solder-bonded semiconductor chip 2 and the holding portion 15 of the adhesive holding layer 10 can be easily separated to achieve both yield and productivity. be able to.

  In the above embodiment, a plurality of work holes 3 are drilled in the support substrate 1, but the present invention is not limited to this. For example, the working holes 3 are respectively drilled in the plurality of holding portions 15 of the adhesive holding layer 10, and the plurality of working holes 3 of the adhesive holding layer 10 are used, whereby the surface of the support substrate 1 and the non-adhesive holding layer 10 can be removed. The air in the gap 14 with the adhesive region 13 may be exhausted to the outside, and the holding portions 15 of the adhesive holding layer 10 may be in close contact with the support substrate 1.

  In addition, the adhesive holding layer 10 of the above embodiment can be subjected to various treatments in order to ensure appropriate adhesiveness on the surface and to obtain necessary physical properties, heat resistance, and the like. For example, an arbitrary portion of the adhesive holding layer 10 can be made sticky or non-sticky by a combination of a chemical etching method, a gas etching method, and a resist printing method.

  The semiconductor chip holder and the method of using the same according to the present invention can be used in the field of semiconductor manufacturing.

DESCRIPTION OF SYMBOLS 1 Support substrate 2 Semiconductor chip 3 Work hole 10 Adhesive holding layer 11 Adhesive area 12 Double-sided adhesive tape 13 Non-adhesive area 14 Gap 15 Holding part 20 Extrusion pin

Claims (4)

An adhesive holding layer is laminated on a support substrate, and this adhesive holding layer is a semiconductor chip holder for detachably holding a plurality of semiconductor chips bonded to a semiconductor wafer,
The support substrate is formed to be approximately the same size as the semiconductor wafer, and the adhesive holding layer is made flexible so that a part thereof becomes an adhesive region to the support substrate, and the remaining part of the adhesive holding layer is not bonded to the support substrate. As a region, a plurality of holding portions for semiconductor chips are formed on the surface of the non-adhesive region, and each holding portion is partitioned larger than the semiconductor chip, and one of the plurality of holding portions of the support substrate and the adhesive holding layer, A semiconductor chip holder comprising a plurality of working holes for a semiconductor chip.   2. The semiconductor chip according to claim 1, wherein a plurality of working holes are drilled in the support substrate so that the width of each work hole is smaller than that of the semiconductor chip, and the substantially center of the holding portion of the adhesive holding layer is opposed to the work hole of the support substrate. Retaining tool.   The semiconductor chip holder according to claim 1 or 2, wherein the plurality of holding portions of the adhesive holding layer are arranged so as to correspond to an arrangement of the plurality of semiconductor chips bonded and bonded to the semiconductor wafer.   4. The method of using a semiconductor chip holder according to claim 1, wherein a plurality of holding portions of the adhesive holding layer are brought into close contact with the support substrate to hold the semiconductor chips on the plurality of holding portions. A semiconductor chip characterized in that a plurality of semiconductor chips are collectively bonded to a semiconductor wafer by at least pressurizing the semiconductor chip holder and the holding part of the adhesive holding layer is peeled off from each semiconductor chip. How to use the holder.

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