JP2012209491A5 - - Google Patents

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Publication number
JP2012209491A5
JP2012209491A5 JP2011075329A JP2011075329A JP2012209491A5 JP 2012209491 A5 JP2012209491 A5 JP 2012209491A5 JP 2011075329 A JP2011075329 A JP 2011075329A JP 2011075329 A JP2011075329 A JP 2011075329A JP 2012209491 A5 JP2012209491 A5 JP 2012209491A5
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JP
Japan
Prior art keywords
adhesive tape
clamping
chuck
adhesive
tape
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JP2011075329A
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Japanese (ja)
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JP2012209491A (en
JP5651059B2 (en
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Priority to JP2011075329A priority Critical patent/JP5651059B2/en
Priority claimed from JP2011075329A external-priority patent/JP5651059B2/en
Publication of JP2012209491A publication Critical patent/JP2012209491A/en
Publication of JP2012209491A5 publication Critical patent/JP2012209491A5/ja
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Description

この発明は、離型テープに貼着されて所定長さに切断された粘着テープを電子部品に貼着する粘着テープの貼着装置であって、
上記離型テープの供給部と、
開閉駆動される一対の挟持片を有する保持チャックと送りチャックを備え、これらチャックの一対の挟持片の開閉及び上記送りチャックの駆動によって上記離型テープを上記供給部から所定の長さずつ間欠的に引き出して走行させる送り機構と、
この送り機構によって引き出されて走行する上記離型テープに貼着された粘着テープを上記所定の長さに切断する切断機構と、
この切断機構によって切断されて貼着位置に位置決めされた上記所定の長さの粘着テープを上記貼着位置で待機する上記電子部品に加圧加熱して貼着する貼着手段を具備し、
上記各チャックの挟持片の挟持面のうち、少なくとも上記離型テープの上記粘着テープが貼着されていた面に対向する挟持面が、流動性を有する非粘着剤によって湿潤していることを特徴とする粘着テープの貼着装置にある。 This invention is an adhesive tape attaching apparatus for attaching an adhesive tape attached to a release tape and cut to a predetermined length to an electronic component,
The release tape supply section;
A holding chuck having a pair of holding pieces to be opened and closed and a feeding chuck are provided, and the release tape is intermittently provided from the supply unit by a predetermined length by opening and closing the pair of holding pieces of the chuck and driving the feeding chuck. A feed mechanism that is pulled out to travel,
A cutting mechanism for cutting the adhesive tape attached to the release tape that is drawn out and travels by the feed mechanism into the predetermined length;
It comprises an adhering means for adhering the pressure-sensitive adhesive tape of the predetermined length that has been cut by the cutting mechanism and positioned at the adhering position to the electronic component that waits at the adhering position by being heated under pressure,
Among clamping face of the clamping piece of the respective chuck, characterized in that the clamping face opposing at least the release tape of the adhesive tape has been adhered surface has been wetted by the non-adhesive with fluidity It is in the adhesive tape sticking device.

Claims (4)

離型テープに貼着されて所定長さに切断された粘着テープを電子部品に貼着する粘着テープの貼着装置であって、
上記離型テープの供給部と、
開閉駆動される一対の挟持片を有する保持チャックと送りチャックを備え、これらチャックの一対の挟持片の開閉及び上記送りチャックの駆動によって上記離型テープを上記供給部から所定の長さずつ間欠的に引き出して走行させる送り機構と、
この送り機構によって引き出されて走行する上記離型テープに貼着された粘着テープを上記所定の長さに切断する切断機構と、
この切断機構によって切断されて貼着位置に位置決めされた上記所定の長さの粘着テープを上記貼着位置で待機する上記電子部品に加圧加熱して貼着する貼着手段を具備し、
上記各チャックの挟持片の挟持面のうち、少なくとも上記離型テープの上記粘着テープが貼着されていた面に対向する挟持面が、流動性を有する非粘着剤によって湿潤していることを特徴とする粘着テープの貼着装置。 An adhesive tape attaching device for attaching an adhesive tape attached to a release tape and cut to a predetermined length to an electronic component,
The release tape supply section;
A holding chuck having a pair of holding pieces to be opened and closed and a feeding chuck are provided, and the release tape is intermittently provided from the supply unit by a predetermined length by opening and closing the pair of holding pieces of the chuck and driving the feeding chuck. A feed mechanism that is pulled out to travel,
A cutting mechanism for cutting the adhesive tape attached to the release tape that is drawn out and travels by the feed mechanism into the predetermined length;
It comprises an adhering means for adhering the pressure-sensitive adhesive tape of the predetermined length that has been cut by the cutting mechanism and positioned at the adhering position to the electronic component that waits at the adhering position by being heated under pressure,
Among clamping face of the clamping piece of the respective chuck, characterized in that the clamping face opposing at least the release tape of the adhesive tape has been adhered surface has been wetted by the non-adhesive with fluidity Adhesive tape sticking device. 上記各チャックの挟持片の挟持面のうち、少なくとも上記離型テープの上記粘着テープが貼着されていた面に対向する挟持面に、流動溝が形成されていて、この流動溝には上記挟持片に形成された非粘着剤溜りから上記非粘着剤が供給されることを特徴とする請求項１記載の粘着テープの貼着装置。Of the clamping surfaces of the clamping pieces of each chuck, a flow groove is formed at least on the clamping surface of the release tape facing the adhesive tape, and the fluid groove has the clamping groove. The adhesive tape sticking apparatus according to claim 1, wherein the non-adhesive agent is supplied from a non-adhesive reservoir formed on the piece. 上記各チャックの挟持片の挟持面のうち、少なくとも上記離型テープの上記粘着テープが貼着されていた面に対向する挟持面は、上記非粘着剤を上記挟持面に拡散させる粗面に形成されていることを特徴とする請求項１又は請求項２記載の粘着テープの貼着装置。 Of the clamping surfaces of the clamping pieces of each chuck, at least the clamping surface of the release tape that faces the surface to which the adhesive tape is attached is formed on a rough surface that diffuses the non-adhesive agent to the clamping surface. The adhesive tape sticking device according to claim 1 or 2 , wherein the adhesive tape sticking device is provided. 上記各チャックの挟持片の挟持面のうち、少なくとも上記離型テープの上記粘着テープが貼着されていた面に対向する挟持面は、上記非粘着剤を上記挟持面に拡散させる多孔質材料によって形成されていることを特徴とする請求項１又は請求項２記載の粘着テープの貼着装置。 Of the clamping surfaces of the clamping pieces of each chuck, at least the clamping surface of the release tape facing the surface to which the adhesive tape is attached is made of a porous material that diffuses the non-adhesive agent to the clamping surface. The adhesive tape sticking device according to claim 1 or 2 , wherein the adhesive tape sticking device is formed.
JP2011075329A 2011-03-30 2011-03-30 Adhesive tape sticking device Active JP5651059B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011075329A JP5651059B2 (en) 2011-03-30 2011-03-30 Adhesive tape sticking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011075329A JP5651059B2 (en) 2011-03-30 2011-03-30 Adhesive tape sticking device

Publications (3)

Publication Number Publication Date
JP2012209491A JP2012209491A (en) 2012-10-25
JP2012209491A5 true JP2012209491A5 (en) 2014-05-15
JP5651059B2 JP5651059B2 (en) 2015-01-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011075329A Active JP5651059B2 (en) 2011-03-30 2011-03-30 Adhesive tape sticking device

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JP (1) JP5651059B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7484043B2 (en) 2020-05-07 2024-05-16 三井金属計測機工株式会社 Assembly device and assembly method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4825654B2 (en) * 2006-12-15 2011-11-30 芝浦メカトロニクス株式会社 Adhesive tape sticking device and sticking method
JP2010241565A (en) * 2009-04-07 2010-10-28 Shibaura Mechatronics Corp Applying device and applying method for adhesive tape

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