JP2012208360A5 - - Google Patents
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- JP2012208360A5 JP2012208360A5 JP2011074648A JP2011074648A JP2012208360A5 JP 2012208360 A5 JP2012208360 A5 JP 2012208360A5 JP 2011074648 A JP2011074648 A JP 2011074648A JP 2011074648 A JP2011074648 A JP 2011074648A JP 2012208360 A5 JP2012208360 A5 JP 2012208360A5
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Description
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011074648A JP5742376B2 (en) | 2011-03-30 | 2011-03-30 | Positive photosensitive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011074648A JP5742376B2 (en) | 2011-03-30 | 2011-03-30 | Positive photosensitive resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012208360A JP2012208360A (en) | 2012-10-25 |
| JP2012208360A5 true JP2012208360A5 (en) | 2014-04-03 |
| JP5742376B2 JP5742376B2 (en) | 2015-07-01 |
Family
ID=47188143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011074648A Active JP5742376B2 (en) | 2011-03-30 | 2011-03-30 | Positive photosensitive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5742376B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6102736B2 (en) * | 2012-09-24 | 2017-03-29 | 東レ株式会社 | Positive photosensitive resin composition |
| WO2014050558A1 (en) * | 2012-09-25 | 2014-04-03 | 東レ株式会社 | Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition |
| JP6358095B2 (en) * | 2013-01-09 | 2018-07-18 | Jsr株式会社 | Photosensitive composition, polymer, resin film, method for producing the same, and electronic component |
| KR101720717B1 (en) * | 2014-04-10 | 2017-03-28 | 제일모직 주식회사 | Positive photosensitive resin composition, photosensitive resin film, and display device using the same |
| US10705425B2 (en) | 2015-03-27 | 2020-07-07 | Toray Industries, Inc. | Photosensitive resin composition, photosensitive, sheet, semiconductor device and method for manufacturing semiconductor device |
| WO2017043375A1 (en) * | 2015-09-08 | 2017-03-16 | 東レ株式会社 | Photosensitive resin composition, photosensitive sheet, semiconductor device, and method for manufacturing semiconductor device |
| MY184067A (en) * | 2015-09-28 | 2021-03-17 | Toray Industries | Cured film and method for manufacturing same |
| JPWO2017073481A1 (en) * | 2015-10-28 | 2018-08-16 | 東レ株式会社 | Positive photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film, semiconductor protective film, method for manufacturing semiconductor device, semiconductor electronic component, and semiconductor device |
| SG11201807876SA (en) * | 2016-03-28 | 2018-10-30 | Toray Industries | Photosensitive film |
| JP7003659B2 (en) * | 2016-04-25 | 2022-01-20 | 東レ株式会社 | Resin composition |
| CN114207520A (en) | 2019-08-01 | 2022-03-18 | 东丽株式会社 | Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, interlayer insulating film, and electronic component |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4957884B2 (en) * | 2005-03-24 | 2012-06-20 | 信越化学工業株式会社 | Epoxy resin composition and semiconductor device |
| JP4655757B2 (en) * | 2005-05-19 | 2011-03-23 | 住友電気工業株式会社 | Positive photosensitive adhesive |
| CN102186904A (en) * | 2008-10-20 | 2011-09-14 | 日本化药株式会社 | Polyamide resin and composition thereof |
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2011
- 2011-03-30 JP JP2011074648A patent/JP5742376B2/en active Active