JP2012204804A - Printed wiring board, electric circuit module using the printed wiring board, and manufacturing method of the electric circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board which enables connection between printed wiring boards at a low temperature, an electric circuit module using the printed wiring board, and a manufacturing method of the electric circuit module.SOLUTION: A printed wiring board 1 includes an insulation substrate 10 and multiple connection terminals 31 provided on a surface of the insulation substrate 10. Conductors 40, increasing its temperature by electrification, are provided at positions corresponding to the connection terminals 31. Further, two lands for electrification 52 are connected with the conductors 40.

Description

  The present invention relates to a printed wiring board provided with a connection terminal connected to a connected terminal of another printed wiring board, an electric circuit module using the printed wiring board, and a method of manufacturing the electric circuit module.

  As a method of connecting printed wiring boards with an anisotropic adhesive film, a technique described in Patent Document 1 is known. That is, the connection terminal of one printed wiring board and the connected terminal of the other printed wiring board face each other and an anisotropic adhesive film is disposed between the connecting terminal and the connected terminal, and then both printed wirings Stack the plates and press the heat tool through the silicon sheet. Thereby, the connection terminal portion is heated and pressurized to connect them.

JP 2000-312070 A

  By the way, the temperature of a heat tool may be set high in order to shorten the time of the connection process of printed wiring boards. However, in this case, although the connection between the printed wiring boards can be completed in a short time, the printed wiring board or the silicon sheet disposed on the heat tool side may be deformed due to overheating of the heat tool. .

  The present invention has been made in view of such a situation, and the object thereof is a printed wiring board capable of connecting the printed wiring boards at a low temperature, an electric circuit module using the printed wiring board, and An object of the present invention is to provide a method for manufacturing an electric circuit module.

In the following, means for achieving the above object and its effects are described.
(1) The invention described in claim 1 is a printed wiring board including an insulating substrate and a plurality of connection terminals provided on the insulating substrate, and a conductor whose temperature is increased by energization corresponds to the connection terminal. The gist is that at least two energization lands are connected to the conductor.

  According to this invention, the periphery of the connection terminal can be heated by raising the temperature of the conductor by energization. That is, when connecting the connection terminal of the printed wiring board and the connected terminal of another printed wiring board, in addition to heating and crimping by the heat tool, heating by energization can be performed, so the set temperature of the heat tool can be reduced. Can be lowered.

(2) The invention according to claim 2 is characterized in that, in the printed wiring board according to claim 1, the conductor is formed inside the insulating substrate.
According to the present invention, the conductor can be provided at a position close to the connection terminal as compared with the case where the conductor is provided at a position opposite to the place where the connection terminal is provided. be able to.

  (3) The invention described in claim 3 is the printed wiring board according to claim 2, wherein the energization land is provided on a surface on which the connection terminal is formed, and the energization land and the conductive land are provided. The gist is that it is connected to the body through a conducting part.

  According to this invention, since the energization land and the connection terminal are formed on the same surface, the probe pin for energization is pressed against the energization land from the same direction as the direction in which the connected terminal is pressed against the terminal portion. be able to.

  (4) The invention according to claim 4 is the printed wiring board according to claim 2, wherein the energization land is provided in the same layer as the conductor, and the insulating substrate reaches the energization land. The gist is that a through hole is provided.

  When the energization land and the conductor are formed in different layers, it is necessary to connect the energization land and the conductor by an interlayer connector such as a blind via or a through hole. However, when the cross-sectional area of the interlayer connector is not sufficiently large, disconnection may occur due to energization with a large current. In contrast, in the above configuration, the energization land and the conductor are formed in the same layer. Thereby, since a large current can be passed through the conductor without passing through the interlayer connection body, the occurrence of disconnection due to the energization of the large current can be suppressed.

  (5) The invention according to claim 5 is the printed wiring board according to claim 2, wherein the energization land is provided in the same layer as the conductor, and the energization land is from a side surface of the insulating substrate. The gist is that it is formed to protrude.

  According to the present invention, since the conductive lands are formed on the side surfaces of the insulating substrate, the electronic parts on the front and back surfaces of the printed wiring board are compared with the case where the conductive lands are formed on the front and back surfaces of the printed wiring board. The mounting area can be increased.

  (6) The invention according to claim 6 is the printed wiring board according to claim 2, wherein the energization land is provided on a surface opposite to the surface on which the connection terminal is formed, and the energization is performed. The gist of the present invention is that the land and the conductor are connected via a conducting portion.

  According to this invention, since the energization land is provided on the surface opposite to the surface on which the connection terminal is formed, the connection terminal is compared with the case where the energization land is provided on the surface on which the connection terminal is formed. The mounting area of the surface on which is formed can be increased.

  (7) The invention according to claim 7 is the printed wiring board according to claim 1, wherein the conductor and the energization land are provided on a surface opposite to the surface on which the connection terminal is provided. It is a summary. According to the present invention, since the conductor is provided not on the inside of the insulating substrate but on the surface, the manufacturing process of the printed wiring board can be simplified.

  (8) The invention according to claim 8 is the printed wiring board according to any one of claims 1 to 7, wherein the connection terminals are arranged in parallel to each other, and the conductor is connected to the connection terminals. The first straight line portion and the first connection portion that connect the first straight line portions to each other, and the first straight line portion and the first connection portion are connected in series. .

  According to the present invention, when connecting the connection terminal of the printed wiring board and the connection terminal of another printed wiring board via the anisotropic conductive film, the connection terminal and the first straight line portion opposed thereto are mutually connected. Since they are pressed together, the conductive particles in the anisotropic conductive film between the connection terminal and the connected terminal can be brought into strong contact. Thereby, resistance between a connecting terminal and a to-be-connected terminal can be made small.

  (9) The invention according to claim 9 is the printed wiring board according to any one of claims 1 to 8, wherein the connection terminals are arranged in parallel to each other, and the conductor is connected to the connection terminals. And a second connecting portion that connects the second straight portions to each other, and the second straight portion and the second connecting portion are connected in series. It is a summary.

  According to this invention, the connection terminal and the second straight portion of the conductor are orthogonal to each other. For this reason, when connecting the connection terminal of a printed wiring board and the connection terminal of another printed wiring board via an anisotropic conductive film, the lower side of each connection terminal is pressed by heating and pressurization. These pressures are dispersed by the second straight portion orthogonal to the terminals, and the pressure applied to each connection terminal is made uniform. Thereby, it can suppress that the dispersion | variation in the adhesive strength for every connection terminal becomes large.

  (10) The invention according to claim 10 is characterized in that, in the printed wiring board according to claim 1, the energization land is connected to the connection terminal, and the connection terminal itself is the conductor. .

  According to this invention, since the connection terminal itself can be heated, the connection terminal of the printed wiring board and the connected terminal of another printed wiring board can be quickly connected as compared with the case of heating indirectly. Can do.

  (11) The invention according to claim 11 is the printed wiring board according to claim 10, wherein the energization land is provided in a connection terminal having a larger heat capacity than the other terminals among the connection terminals. And

  Among the connection terminals, the connection terminal for grounding or the connection terminal for power supply is formed in a wide conductive pattern as compared with the other connection terminals. Since the wide connection terminal has a large heat capacity, when the connection terminal of the printed wiring board and the connection terminal of another printed wiring board are heated and pressurized via the anisotropic conductive film, the connection terminal sufficiently rises in temperature. Otherwise, the adhesive strength of the connection terminal may be lower than the adhesive strength of other connection terminals. In this respect, according to the above-described configuration, the connection terminal can be energized and heated, and therefore, the connection terminal can be heated in a short time compared to the case where it is heated only by indirect heating means.

(12) The invention according to claim 12 is an electric circuit module using the printed wiring board according to any one of claims 1 to 11.
When the printed wiring board is deformed, the connection portion is distorted and the internal stress is increased. When the internal stress is large, there is a possibility that the connection portion is disconnected as the connection portion deteriorates during long-term use. In this respect, since the deformation is suppressed, an electric circuit module having a low possibility of disconnection at the connection portion can be obtained.

  (13) The invention according to claim 13 is an electric circuit module using the printed wiring board according to any one of claims 1 to 11, wherein a heat sink is connected to the energization land. Is the gist.

  When an electronic component that generates heat is mounted on the printed wiring board, heat is transmitted through the conductive pattern, so that the temperature of the connection portion between the connection terminal and the connected terminal may increase. When the temperature rise is maintained for a long time, the strength of the connection portion between the connection terminal and the connected terminal may be reduced, and connection failure may occur. In this regard, according to the above-described invention, the heat transmitted to the connection portion is transmitted to the heat sink via the conductor and dissipated, so that the strength of the connection portion is suppressed from decreasing.

  (14) The invention according to claim 14 is an electric circuit module using the printed wiring board according to any one of claims 1 to 11, wherein the energization land is grounded. And

  When the electric circuit module is disposed near the electromagnetic wave generation source, noise is input to the electronic component through the conductive pattern. The electronic component may malfunction due to this noise. In this regard, in the above-described invention, since the conductive land is grounded and the conductor functions as an electromagnetic shield, noise generated in the electric circuit module can be reduced.

  (15) The invention according to claim 15 is the first electric circuit module using the printed wiring board according to any one of claims 1 to 11 and the connected printed wiring connected to the printed wiring board. A method of manufacturing an electric circuit module in which a second electric circuit module using a board is connected, the connection terminal of the printed wiring board, and the connection terminal of the connected printed wiring board corresponding to the connection terminal; And placing the anisotropic conductive film between the connection terminal and the connected terminal, heating the connection terminal and the connected terminal with a heating device and passing through the energization land Including a step of energizing a conductor, pressurizing the printed wiring board and the connected printed wiring board, and connecting the connecting terminal and the connected terminal. That.

  In this invention, when connecting the connection terminal of the printed wiring board and the connection terminal of the connected printed wiring board via the anisotropic conductive film, the connection terminal and the connection terminal are heated by the heating device and used for energization. The conductor is energized through the land. Thereby, a connection terminal and a to-be-connected terminal can be connected quickly.

  (16) The electric circuit module according to the sixteenth aspect is the electric circuit module according to the fifteenth aspect, wherein the conductor is energized before the connecting terminal and the connected terminal are heated and pressurized by the heating device. The gist is to start.

  A predetermined time is required from the start of energization until the conductor reaches a predetermined temperature. If the energization start and the heating and pressurization by the heating device are performed at the same timing, the heating of the connection terminal and the connected terminal may be insufficient at the start of pressurization by the heating device. In this respect, in the above-described invention, since the energization to the conductor is started before the connecting terminal and the connected terminal are heated and pressurized by the heating device, the heating device is sufficiently heated in the connected terminal and the connected terminal. Therefore, the contact time between the heating device and the printed wiring board can be shortened.

  (17) The invention according to claim 17 is characterized in that, in the method for manufacturing an electric circuit module according to claim 15 or 16, the temperature of the conductor by energization is made lower than the heat-resistant temperature of the insulating substrate. To do.

  When the temperature of the conductor is higher than the heat resistance temperature of the insulating substrate, there is a possibility that peeling occurs between the conductor and the insulating substrate. In this regard, according to the above-described invention, the temperature of the conductor is made lower than the heat-resistant temperature of the insulating substrate, so that peeling between the conductor and the insulating substrate can be suppressed.

  ADVANTAGE OF THE INVENTION According to this invention, the printed wiring board which can perform connection of printed wiring boards at low temperature, the electric circuit module using the printed wiring board, and the manufacturing method of the electric circuit module can be provided.

The top view which shows a planar structure about the printed wiring board of 1st Embodiment of this invention. Sectional drawing which shows the cross-sectional structure which follows the AA line of FIG. 1 about the printed wiring board of the embodiment. The top view which shows the pattern structure of a conductor about the printed wiring board of the embodiment. Sectional drawing which shows the crimping | compression-bonding method about the manufacturing method of the printed wiring board of the embodiment. Sectional drawing of the 1st modification of a conduction | electrical_connection part about the printed wiring board of the embodiment. Sectional drawing of the 2nd modification of a conduction | electrical_connection part about the printed wiring board of the embodiment. Sectional drawing of the 3rd modification of a conduction | electrical_connection part about the printed wiring board of the embodiment. Sectional drawing of the modification of a terminal part about the printed wiring board of the embodiment. The top view which shows the modification of the pattern structure of a conductor about the printed wiring board of the embodiment. The top view which shows the planar structure about the printed wiring board of 2nd Embodiment of this invention. The top view which shows the planar structure about the electric circuit module of 3rd Embodiment of this invention. The top view which shows the planar structure about the electric circuit module of 4th Embodiment of this invention.

(First embodiment)
The printed wiring board will be described with reference to FIGS.
As shown in FIG. 1, the printed wiring board 1 includes an insulating substrate 10, a conductive pattern 20 formed on the surface of the insulating substrate 10, a terminal portion 30, a conductor 40 (see FIG. 2), and a terminal portion 30. Are provided with a first reinforcing plate 11 and a second reinforcing plate 12 (see FIG. 2), and a conduction portion 50 for allowing a current to flow through the conductor 40.

With reference to FIG. 2, the cross-sectional structure of the printed wiring board 1 is demonstrated.
The printed wiring board 1 has a structure in which four conductive layers are laminated. Each conductive layer is separated by an insulating layer. In the following description, the side on which the terminal portion 30 is formed in the printed wiring board 1 is referred to as the upper side, and the opposite side is referred to as the lower side. In the insulating substrate 10, the upper surface is the front surface, and the opposite surface is the back surface. In addition, from the top, the conductive layers are a first conductive layer 2A, a second conductive layer 2B, a third conductive layer 2C, and a fourth conductive layer 2D. The insulating layers are a first insulating layer 3A, a second insulating layer 3B, and a third insulating layer 3C. A substrate constituted by the first insulating layer 3A, the second insulating layer 3B, and the third insulating layer 3C corresponds to the insulating substrate 10.

  A conductive pattern 20 as the first conductive layer 2A is provided on the first insulating layer 3A. The conductive pattern 20 is composed of a plurality of conductive lines arranged in parallel to each other at an equal pitch. Connection terminals 31 are provided at the ends of these conductive wires. These connection terminals 31 constitute a terminal portion 30.

  The conductive pattern 20 is covered with the solder resist 13 except for the terminal portion 30 and the land portion. A conductor 40 as the second conductive layer 2B is formed at a position between the first insulating layer 3A and the second insulating layer 3B and corresponding to the terminal portion 30. A first reinforcing plate 11 as a third conductive layer 2C is formed between the second insulating layer 3B and the third insulating layer 3C. A second reinforcing plate 12 as a fourth conductive layer 2D is formed on the third insulating layer 3C. The 1st reinforcement board 11 and the 2nd reinforcement board 12 are provided in the position corresponding to the terminal part 30, and the magnitude | size of the 1st reinforcement board 11 and the 2nd reinforcement board 12 is made into the magnitude | size substantially the same as the terminal part 30. . The second reinforcing plate 12 is covered with a solder resist 14.

  The conductive pattern 20, the conductor 40, the first reinforcing plate 11, the second reinforcing plate 12, and the conductive portion 50 are formed by any copper plating or electroless copper plating. For example, it is formed by a subtractive method, an additive method, a semi-additive method, or the like. The insulating layer is formed of an epoxy resin. The terminal portion 30 is formed with a nickel plating layer and a gold plating layer in order from the bottom.

  Two conductive portions 50 are provided on the printed wiring board 1. One conducting portion 50 is provided at a position outside the one end of the terminal portion 30, and the other conducting portion 50 is provided at a position outside the other end of the terminal portion 30. The conduction part 50 includes a main conduction part 51 that penetrates the printed wiring board 1, a conduction land 52 as the first conductive layer 2 </ b> A, a first inner land 53 that is connected to the conductor 40, and a fourth conductive layer. And an outer layer land 54 as 2D. The main conductive portion 51 is formed by a through hole that penetrates the printed wiring board 1. The main conduction part 51 penetrates each land.

The pattern structure of the conductor 40 will be described with reference to FIG.
The conductor 40 includes a first straight portion 41 that faces each connection terminal 31 and a first connection portion 42 that connects the first straight portions 41 to each other.

  The first linear portions 41 are arranged in parallel and in a horizontal row. The first connection portion 42 is disposed between the first straight portions 41 that are adjacent in the horizontal direction. The first connection portion 42 is disposed at the end of the first straight portion 41. Adjacent first connecting portions 42 are arranged to face each other with the first straight portion 41 therebetween. That is, the first straight part 41 and the first connection part 42 are connected in series to form a single conductive line. Both ends of the conductor 40 are connected to the first inner layer land 53.

  With reference to FIG. 4, the method of connecting the terminal part 30 of the said printed wiring board 1 and the terminal part 110 of another printed wiring board (connected printed wiring board) is demonstrated. Here, a flexible printed wiring board (hereinafter referred to as “FPC board 100”) will be described as an example of another printed wiring board.

  The terminal part 30 of the printed wiring board 1 and the terminal part 110 of the FPC board 100 are connected to each other using the connection device 200. The connection device 200 includes a heat tool 210 that heats the terminal portion 30 and the terminal portion 110 and an energization device 220 that energizes the conductor 40.

  The energization device 220 is connected to the constant current power source 221 for supplying a constant current, the control device 222 for controlling the energization time, the first probe pin 223 connected to the anode side of the constant current power source 221, and the cathode side. The second probe pin 224 is provided. The control device 222 causes a current to flow through the conductor 40 for a set time from when the first probe pin 223 and the second probe pin 224 contact the energization land 52. That is, energization of the conductor 40 is stopped when the set time has elapsed. Thereby, it is suppressed that the conductor 40 is energized for a preset time or more.

Next, a method for connecting the terminal portion 30 of the printed wiring board 1 and the terminal portion 110 of the FPC board 100 will be described.
The printed wiring board 1 is fixed to the stage so that the terminal portion 30 faces upward. Then, the anisotropic conductive film 130 is disposed on the terminal portion 30. Further, the terminal portion 110 of the FPC board 100 is disposed on the anisotropic conductive film 130. At this time, the FPC board 100 is positioned with respect to the printed wiring board 1 so that the connection terminal 31 and the connected terminal 120 face each other. For example, both the substrates are positioned by fitting the positioning holes of the printed wiring board 1 and the positioning holes of the FPC board 100 into the positioning pins previously set on the stage.

  Next, in a state where the printed wiring board 1 and the FPC board 100 are positioned, a silicon sheet 250 is laid on the FPC board 100, and the heat tool 210 is pressed against the FPC board 100 through the silicon sheet 250. Then, at the same time when the heat tool 210 is brought into contact with the silicon sheet 250, the first probe pin 223 is brought into contact with one energization land 52 and the second probe pin 224 is brought into contact with the other energization land 52. Thereafter, the heat tool 210 is further pushed down, and the terminal part 30 and the terminal part 110 are pressed. That is, the energization land 52 is heated at the same time as the terminal part 30 and the terminal part 110 are heated and pressed by the heat tool 210. Thereafter, the heat tool 210 is pushed up after a set time has elapsed since the start of pressing by the heat tool 210, that is, the start of energization of the conductor 40. With the above operation, the connection between the terminal part 30 and the terminal part 110 is completed.

Next, the effect by the said connection method is demonstrated.
In order to connect the terminal part 30 of the printed wiring board 1 and the terminal part 110 of the FPC board 100 by the anisotropic conductive film 130, it is necessary to heat the anisotropic conductive film 130 to a specified temperature or higher. This specified temperature is 100 ° C. or higher, which is substantially the same as or higher than the heat resistance temperature of the printed wiring board 1 and the FPC board 100. The set temperature TA of the heat tool 210 is set to a temperature higher than the specified temperature in consideration of heat dissipation to the silicon sheet 250, the FPC board 100, the printed wiring board 1, and the like. When the set temperature TA of the heat tool 210 is higher than the heat resistant temperature of the FPC substrate 100 or the silicon sheet 250, the FPC substrate 100 or the silicon sheet 250 is deformed. In particular, this deformation is likely to occur when the FPC board 100 is thin.

  Therefore, in this embodiment, the anisotropic conductive film 130 is heated from both the upper and lower directions. Specifically, the anisotropic conductive film 130 is heated from above through the silicon sheet 250 and the FPC substrate 100 by the heat tool 210, and the anisotropic conductive film 130 is applied from below by energization of the conductor 40. Heat. That is, the heat path for heating the anisotropic conductive film 130 is dispersed upward and downward. Thereby, the temperature of both heat sources can be reduced. According to this connection method, it is possible to lower the set temperature TA of the heat tool 210 as compared with the conventional connection method, thereby suppressing the deformation of the FPC substrate 100 or the silicon sheet 250.

  When the set temperature TA of the heat tool 210 can be set to the same temperature as in the conventional connection method, the set temperature TA of the heat tool 210 is maintained at a high temperature and the conductor 40 is energized. The bonding time between the terminal part 30 and the terminal part 110 can be shortened.

Next, a product according to the above embodiment will be described.
The implemented product was configured as follows.
Using a FR-4 substrate having a thickness of 600 μm, a printed wiring board 1 having four conductive layers was formed. The thickness of the copper foil of each layer was 18 μm. The length of the connection terminal 31 was 5 mm, and the width of the connection terminal 31 was 0.1 mm. Then, 200 terminal portions 30 were formed by arranging 200 connection terminals 31 at an interval of 0.1 mm. The surface of the connection terminal 31 was gold plated. The conductor 40 was formed as the second conductive layer 2 </ b> B, and the first straight portion 41 was formed so as to correspond to each connection terminal 31. That is, the pattern width was 0.1 mm, the length of the first straight portions 41 was 5 mm, and the interval between the first straight portions 41 was 0.1 mm. The size of the energization land 52 was 5 mm × 5 mm. The pattern structure of the conductor 40 is the same as that shown in FIG.

  As the FPC board 100, a polyimide film having a thickness of 25 μm and a copper foil conductive pattern 20 having a thickness of 18 μm formed thereon, and the conductive pattern 20 covered with a polyimide film were used. The structure of the terminal part 110 was the same as that of the terminal part 30 of the printed wiring board 1. The surface of the connected terminal 120 was gold plated.

  The comparison product for comparison with the implementation product has the same structure as that of the printed wiring board 1 of the implementation product except that the conductor 40 is not formed. Note that a ground layer was formed in place of the conductor 40 in the portion where the conductor 40 of the product was formed. That is, the heat capacity around the terminal portion 30 of the example and the heat capacity around the terminal portion 30 of the comparative example were made substantially the same.

The bonding conditions of the implemented product and the comparative product were as follows.
The bonding condition is a condition in which the bonding between the terminal part 30 and the terminal part 110 is completed within 3 seconds after being pressed by the heat tool 210. Here, the completion of bonding is defined as follows. That is, when the temperature of the anisotropic conductive film 130 reaches 150 ° C., the adhesion is completed. The temperature of the anisotropic conductive film 130 was measured by sandwiching a thermocouple together with the anisotropic conductive film 130 between the terminal portion 30 and the terminal portion 110.
(result)
(A) Bonding conditions of the implemented product:
-Energizing current amount is 1500 mA and energizing time is 3 seconds.
-The set temperature TA of the heat tool 210 is 185 ° C.
(B) Bonding conditions for the comparison product:
-The set temperature TA of the heat tool 210 is 250 ° C.

  Furthermore, the reliability test of the electric circuit module which connected the printed wiring board 1 and the FPC board | substrate 100 about the implementation product and the comparison product was performed, and both were compared. Specifically, both were left for 1000 hours at high temperature and high humidity (85 ° C./85%). Then, the adhesive strength between the terminal part 30 and the to-be-terminal part 110 was measured about each electric circuit module of an implementation product and a comparison product. As a result, the adhesive strength values were substantially the same.

  As described above, according to the printed wiring board 1 of the present embodiment, the set temperature TA of the heat tool 210 when connecting the printed wiring board 1 and the FPC board 100 can be set lower than the conventional one. Moreover, the electric circuit module formed using this printed wiring board 1 has the performance equivalent to the electric circuit module formed using the conventional printed wiring board about heat resistance and moisture resistance.

With reference to FIGS. 5-7, the modification of the conduction | electrical_connection part 50 of the printed wiring board 1 is demonstrated.
FIG. 5 shows a first modification.
The conduction portion 60 includes a second inner layer land 61 (the energization land 52) connected to the conductor 40, and a through hole 62 that passes through the first insulating layer 3A and reaches the second inner layer land 61. . The second inner layer land 61 functions as the energization land 52. The second inner layer land 61 is sized such that the first probe pin 223 or the second probe pin 224 comes into contact therewith. A nickel plating layer and a gold plating layer are laminated on the surface of the second inner layer land 61. The through hole 62 is formed in a size that allows the first probe pin 223 or the second probe pin 224 to be inserted therethrough.

Adopting such a structure has the following effects.
If the energization land 52 and the conductor 40 are formed in different layers, it is necessary to connect the energization land 52 and the conductor 40 by an interlayer connector such as a blind via or a through hole. However, when the cross-sectional diameter of the interlayer connector is not sufficient, there is a possibility of disconnection due to energization with a large current. Therefore, the energization land 52 and the conductor 40 are connected by a plurality of interlayer connectors.

  In contrast, in the above configuration, the energization land 52 and the conductor 40 are formed in the same layer. As a result, a large current can be passed through the conductor 40 without passing through the interlayer connection body, so that disconnection due to the large current is hardly generated. Thus, since it is less necessary to adopt a structure that takes into account disconnection due to conduction of electricity, the printed wiring board 1 can have a relatively simple structure.

FIG. 6 shows a second modification.
The conductive portion 70 connects the back surface land 71 formed on the third insulating layer 3C, the third inner layer land 73 connected to the conductor 40, and the back surface land 71 and the third inner layer land 73 to each other. Through-connecting portion 72.

  The back surface land 71 functions as the energization land 52. The back surface land 71 is sized so that the first probe pin 223 or the second probe pin 224 contacts. A nickel plating layer and a gold plating layer are laminated on the surface of the back surface land 71.

Adopting such a structure has the following effects.
In the case of the above structure, the energization land 52 is provided on the back side of the printed wiring board 1. For this reason, the mounting area on the surface side of the printed wiring board 1 can be increased as compared with the case where the energization lands 52 are provided on the surface side of the printed wiring board 1.

FIG. 7 shows a third modification.
The conducting portion 80 is provided in the same layer as the conductor 40, that is, the second conductive layer 2B. An end portion of the conductive portion 80 protrudes from the side surface of the insulating substrate 10. The protruding form of the end portion of the conducting portion 80 (hereinafter referred to as “projecting end portion 81”) is formed by performing processing such as etching or desmearing on the side surface of the printed wiring board 1. The protruding end portion 81 functions as the energization land 52.

Adopting such a structure has the following effects.
In the case of a double-sided mounted printed wiring board, it may be desired to secure a mounting area on both the front side and the back side. In this regard, according to the above configuration, the mounting area on the front surface side and the back surface side of the printed wiring board 1 can be increased as compared with the case where the energization lands 52 are provided on the front surface side or the back surface side of the printed wiring board 1. .

With reference to FIG. 8, the modification of the terminal part 30 is demonstrated.
In the printed wiring board 1 of this modification, the conductor 40A and the energization land 52R are formed on the back side of the printed wiring board 1. A reinforcing plate 15 is formed inside the insulating substrate 10.

  When the printed wiring board 1 is thin, it is difficult to form the conductor 40A inside. In this regard, in the above configuration, the conductor 40A and the energization land 52R are provided on the back side of the printed wiring board 1, and therefore the conductor 40A can be easily formed. In addition, since it is not necessary to form an interlayer connection such as a through hole or a blind via, the manufacturing process of the printed wiring board 1 can be simplified.

A modification of the pattern structure of the conductor 40B will be described with reference to FIG.
There is no restriction | limiting in the form of the pattern of the conductor 40, A various form can be considered. An example is given below.

  The conductor 40B includes a second straight line portion 43 that is orthogonal to each connection terminal 31 and extends over the plurality of connection terminals 31, and a second connection portion 44 that connects the second straight line portions 43 to each other. The second linear portions 43 are arranged in parallel and in a horizontal row. The second connecting portion 44 is disposed between the second straight portions 43 adjacent in the horizontal direction. The second connection portion 44 is disposed at the end of the second straight portion 43. Adjacent second connection portions 44 are arranged so as to face each other with the second straight portion 43 therebetween. That is, the second straight line portion 43 and the second connection portion 44 are connected in series to form one conductive line. Both ends of the conductor 40B are connected to the first inner layer land 53.

The operation of this configuration is as follows.
When connecting the connection terminal 31 and the connected terminal 120 via the anisotropic conductive film 130, the lower side of each connection terminal 31 is pressed by heating and pressurization. At this time, according to the above configuration, these pressures are dispersed by the second linear portion 43 orthogonal to the connection terminals 31, and the pressure applied to each connection terminal 31 is made uniform. For this reason, it can suppress that the dispersion | variation in the adhesive strength for every connection terminal 31 becomes large.

According to this embodiment, the following effects can be obtained.
(1) In the present embodiment, the conductor 40 is provided at a position corresponding to the terminal portion 30. According to this configuration, the periphery of the connection terminal 31 can be heated by raising the temperature of the conductor 40 by energization. That is, when the terminal portion 30 and the terminal portion 110 are connected via the anisotropic conductive film 130, in addition to heating and pressure bonding by the heat tool 210, heating by energization can be performed. The set temperature TA can be lowered. Thereby, the deformation | transformation of the FPC board | substrate 100 in the said heat tool 210 side and the deformation | transformation of the silicon sheet 250 which originate in overheating of the heat tool 210 can be suppressed.

  (2) In the present embodiment, the conductor 40 is formed inside the insulating substrate 10. For this reason, since the conductor 40 can be provided in the position close | similar to the terminal part 30 compared with the case where the conductor 40 is provided in the back surface side of the printed wiring board 1, the terminal part 30 can be heated rapidly.

  (3) In the present embodiment, the energization land 52 and the connection terminal 31 are formed on the same surface. For this reason, the probe pin for energization can be pressed against the energization land 52 from the same direction as the direction in which the terminal portion 110 is pressed against the terminal portion 30.

  (4) In this embodiment, the conductor 40 includes a first straight line portion 41 that faces each connection terminal 31 and a first connection portion 42 that connects the first straight line portions 41 to each other. 41 and the 1st connection part 42 are connected in series. According to this configuration, the resistance between the connection terminal 31 and the connected terminal 120 can be reduced.

  (5) In the first modification of the conduction portion 50 of the present embodiment, as shown in FIG. 5, the second inner layer land 61 as the energization land 52 is provided in the second layer and communicates with the second inner layer land 61. A through hole 62 is formed. In this configuration, since there is little need for a structure that takes into account disconnection due to conduction of electricity, the printed wiring board 1 can have a relatively simple structure.

  (6) In the second modification of the conduction portion 50 of the present embodiment, as shown in FIG. 6, the back surface land 71 as the energization land 52 is provided on the back surface side of the printed wiring board 1. According to this configuration, the mounting area on the front surface side can be increased as compared with the case where the energization land 52 is provided on the front surface side of the printed wiring board 1.

  (7) In the third modification of the conduction portion 50 of the present embodiment, as shown in FIG. 7, the protruding end portion 81 as the energization land 52 is formed so as to protrude from the side surface of the insulating substrate 10. According to this configuration, since the protruding end portion 81 (conductive land) is formed on the side surface of the insulating substrate 10, the printed wiring board 1 is compared with the case where the conductive lands are formed on the front and back surfaces of the printed wiring board 1. It is possible to increase the mounting area of the electronic components and the like on the front surface and the back surface.

  (8) In the modified example of the arrangement of the conductors 40 of this embodiment, the conductors 40A and the energization lands 52 are provided on the back side of the printed wiring board 1 as shown in FIG. According to this structure, the manufacturing process of the printed wiring board 1 can be simplified.

  (9) In the modification of the pattern structure of the conductor 40 of the present embodiment, as shown in FIG. 9, the conductor 40 </ b> B includes a second linear portion 43 that is orthogonal to each connection terminal 31 and extends over the plurality of connection terminals 31. The second straight line portion 43 is configured by a second connection portion 44 that connects the second straight line portions 43 to each other, and the second straight line portion 43 and the second connection portion 44 are connected in series. According to this structure, it can suppress that the dispersion | variation in the adhesive strength for every connection terminal 31 becomes large.

  (10) In the present embodiment, the connection terminal 31 and the connected terminal 120 are heated by the heat tool 210 (heating device) and the conductor 40 is energized through the energization land 52 to connect the connection terminal 31 and the connected terminal 120. Connect.

  In this configuration, when the terminal part 30 of the printed wiring board 1 and the terminal part 110 of the FPC board 100 are connected via the anisotropic conductive film 130, the terminal part 30 and the terminal part 110 are connected to two heating means. Therefore, the time for raising the anisotropic conductive film 130 to a predetermined temperature can be shortened. Thereby, the terminal part 30 and the to-be-terminald part 110 can be connected rapidly.

(Second Embodiment)
With reference to FIG. 10, 2nd Embodiment of the printed wiring board of this invention is described.
The printed wiring board 1 of the present embodiment is obtained by adding the following changes to the configuration of the first embodiment. That is, in the first embodiment, the terminal portion 30, the terminal portion 110, and the anisotropic conductive film 130 are heated by energizing the conductor 40, but in this embodiment, the terminal portion 30 is directly heated by energization. To do. Hereinafter, a detailed change from the configuration of the first embodiment that occurs with this change will be described. In addition, about the structure which is common in the said 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  The printed wiring board 1 includes an insulating substrate 10, a conductive pattern 20 formed on the surface of the insulating substrate 10, a terminal portion 30, a first reinforcing plate 11 and a second reinforcing plate 12 that reinforce the terminal portion 30, And a conduction portion 90 for allowing a current to flow through the predetermined connection terminal 31. In addition, the 1st reinforcement board 11 and the 2nd reinforcement board 12 are provided in the inside of the insulated substrate 10 similarly to 1st Embodiment.

  The conductive pattern 20 is classified into a first conductive pattern 21 that is a power line, a second conductive pattern 22 that is a signal line, and a third conductive pattern 23 that is a ground line. The various conductive patterns 20 are wired in parallel in the order of the first conductive pattern 21, the second conductive pattern 22, and the third conductive pattern 23. That is, the first conductive pattern 21 and the third conductive pattern 23 are formed outside the conductive pattern 20.

  The first conductive pattern 21 is formed wider than the second conductive pattern 22 in order to suppress heat generation due to power supply. The third conductive pattern 23 is formed wider than the second conductive pattern 22 in order to reduce noise.

  An end portion of the first conductive pattern 21 is branched into three fine line patterns 21B. That is, the first conductive pattern 21 includes a main line pattern 21A and a fine line pattern 21B. A connection terminal 31 is formed at the tip of the fine line pattern 21B. The width of the connection terminal 31 of the first conductive pattern 21 is the same as the width of the connection terminal 31 provided at the end of the second conductive pattern 22. The third conductive pattern 23 has the same structure as the first conductive pattern 21.

  The conduction part 90 is provided in each of the first conductive pattern 21 and the third conductive pattern 23. Since all the conducting parts 90 have the same structure, the conducting part 90 provided in the first conductive pattern 21 will be described below.

  The conduction portion 90 includes a first energization land 52A connected to the connection terminal 31 of the first conductive pattern 21 and a second energization land 52B connected to the main line pattern 21A of the first conductive pattern 21. . The connection terminal 31 is interposed between the first energization land 52A and the second energization land 52B. With this configuration, the connection terminal 31 of the first conductive pattern 21 can be energized. That is, the connection terminal 31 corresponds to the conductor 40.

Next, the connection method of the terminal part 30 and the to-be-terminald part 110 is demonstrated about this kind of printed wiring board 1. FIG.
When connecting the terminal part 30 of this kind of printed wiring board 1 and the terminal part 110 of the FPC board 100, the connection device 200 is used as follows. When the terminal part 30 and the terminal part 110 are pressure-bonded by the heat tool 210 with the anisotropic conductive film 130 sandwiched between the terminal part 30 and the terminal part 110, the first energizing land 52A is One probe pin 223 is brought into contact, and the second probe pin 224 is brought into contact with the second energization land 52B. Thereby, the terminal part 30 and the terminal part 110 are heated and pressure-bonded by the heat tool 210, and at the same time, the connection terminal 31 of the first conductive pattern 21 and the connection terminal 31 of the third conductive pattern 23 are heated by energization.

  By connecting the terminal part 30 of the printed wiring board 1 and the terminal part 110 of the FPC board 100 by the above connection method using the printed wiring board 1 having such a structure, the following effects can be obtained.

  According to the connection device 200, the terminal part 30 and the terminal part 110 are evenly heated by the heat tool 210. However, in the case of the printed wiring board 1 shown in FIG. 10, the first conductive pattern 21 and the third conductive pattern 23 are wider than the second conductive pattern 22 and have a larger heat capacity. The connection terminal 31 of the pattern 23 is less likely to be heated than the other connection terminals 31. For this reason, in the connection between the terminal part 30 and the terminal part 110, only the part corresponding to the second conductive pattern 22 is connected via the anisotropic conductive film 130, and the first conductive pattern 21 and the third conductive pattern 23 are connected. There was a case where the part corresponding to is not connected sufficiently.

  In this regard, according to the printed wiring board 1 of the present embodiment, the first conductive pattern 21 and the third conductive pattern 23 are heated by energization, so that the connection terminals 31 of the first conductive pattern 21 and the third conductive pattern 23 are It is possible to suppress the temperature rise from becoming lower than that of the other connection terminals 31. Thereby, in the connection between the terminal portion 30 of the printed wiring board 1 and the terminal portion 110 of the FPC board 100, the connection terminals 31 corresponding to the first conductive pattern 21 and the third conductive pattern 23 are prevented from being connected. Can do.

According to the printed wiring board 1 of the present embodiment, in addition to the effect (1) of the first embodiment, the following effects can be obtained.
(11) In the present embodiment, the first energization land 52 </ b> A and the second energization land 52 </ b> B are connected to the connection terminal 31, and the connection terminal 31 itself is used as the conductor 40. According to this configuration, since the connection terminal 31 itself is heated, it is possible to raise the temperature of the connection terminal 31 in a shorter time than in the case of heating only by indirect heating means. That is, the terminal part 30 and the terminal part 110 can be connected in a short time compared to a printed wiring board having a conventional structure.

  (12) In the present embodiment, the energization land 52 is provided on the connection terminal 31 (the connection terminal 31 connected to the power line and the ground line) having a larger heat capacity than the other terminals among the connection terminals 31. According to this configuration, since the connection terminal 31 can be energized and heated, it is possible to suppress the bonding strength of the connection terminal 31 from being lower than the bonding strength of the other connection terminals 31. Thereby, the dispersion | variation in connection strength can be made small.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the electric circuit module 300 assembled using the printed wiring board 1 shown in the first embodiment or the second embodiment will be described using the energization land 52. In addition, about the structure which is common in the said 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  An electric circuit module 300 shown in FIG. 11 includes a printed wiring board 1 on which an electronic component 510 is mounted, an FPC board 100 connected to the printed wiring board 1, and a heat sink 310. The heat sink 310 has a plurality of fins. The energization land 52 is connected via silicon grease. The electronic component 510 is an IC that generates heat by operation. For example, an LED driver or the like corresponds to this electronic component 510. The electronic component 510 is provided near the terminal portion 30 of the printed wiring board 1.

The effect of the electric circuit module 300 having such a configuration will be described.
When the electronic component 510 operates, heat is transferred to the terminal unit 30 through the conductive pattern 20, and thus the temperature of the terminal unit 30 rises. If the temperature rise is maintained for a long time, the strength of the connection portion between the terminal portion 30 and the terminal portion 110 may be reduced, and connection failure may occur. In this regard, according to the above configuration, the conductor 40 is provided in the portion corresponding to the terminal portion 30, and thus heat is transmitted to the heat sink 310 through the conductor 40, and thus the terminal portion 30 and the terminal portion 110 are connected. The rise in temperature at the connection part is suppressed. Thereby, it is less likely that the strength of the connection portion is lowered.

The electric circuit module 300 of the present embodiment has the following effects.
(1) In this embodiment, the electric circuit module 300 is comprised by the printed wiring board 1 shown in 1st Embodiment or 2nd Embodiment. Thereby, since the deformation | transformation of the said FPC board 100 resulting from overheating of the heat tool 210 is suppressed, it can be set as the electric circuit module 300 with a low possibility of disconnection in a connection part.

  (2) In the present embodiment, the heat sink 310 is connected to the energization land 52. Thereby, since the heat transmitted to the connection part between the terminal part 30 and the terminal part 110 is transmitted to the heat sink 310 via the conductor 40 and radiated, it is suppressed that the strength of the connection part decreases. .

(Fourth embodiment)
A fourth embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the electric circuit module 400 assembled using the printed wiring board 1 shown in the first embodiment or the second embodiment will be described using the energization land 52. In addition, about the structure which is common in the said 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  An electric circuit module 400 shown in FIG. 12 includes a printed wiring board 1 on which an electronic component 520 is mounted, and an FPC board 100 connected to the printed wiring board 1. Electronic component 520 is a high-frequency circuit. The energization land 52 is connected to the ground line 420 via the lead wire 410. Note that the wiring of the lead wire 410 is performed after the connection between the printed wiring board 1 and the FPC board 100.

The effects of the electric circuit module 400 having such a configuration will be described.
When the electric circuit module 400 is disposed near an electromagnetic wave generation source, noise is input to the electronic component 520 through the conductive pattern 20. The electronic component 520 may malfunction due to this noise. In the case of this embodiment, since the conductor 40 is grounded, the conductor 40 functions as an electromagnetic shield. Thereby, generation | occurrence | production of malfunctioning of the electronic component 520 can be suppressed.

According to the electric circuit module 400 of the present embodiment, in addition to the effect (1) of the previous third embodiment, the following effects can be achieved.
(3) In the present embodiment, the energization land 52 is grounded. Since the energization land 52 is grounded and the conductor 40 functions as an electromagnetic shield, noise generated in the electric circuit module 400 can be reduced.

(Other embodiments)
In addition, the embodiment of the present invention is not limited to the embodiment shown in each of the above-described embodiments, and can be implemented by changing it as shown below, for example. Further, the following modifications are not applied only to the above-described embodiments, and different modifications can be combined with each other.

  In the first embodiment, the lands of each conductive layer are connected by through holes, but the lands of each layer may be connected by blind vias. In this case, the energization land 52 and the first inner layer land 53 are connected by a plurality of blind vias. This is to prevent the blind via from being disconnected due to energization of the conductor 40 with a large current.

  In the first embodiment, the two energization lands 52 are connected to the conductor 40, but the number of energization lands 52 may be three or more. In the case of this configuration, the arrangement of the probe pins can be changed.

  In the first embodiment, the terminal portion 30 and the terminal portion 110 are heated and pressurized by the heat tool 210 and energization of the conductor 40 is started at the same time. Before heating and pressurizing with the heat tool 210, energization of the conductor 40 may be started.

  A predetermined time is required until the conductor 40 reaches a predetermined temperature from the start of energization. If the start of energization and the heating and pressurization by the heat tool 210 are performed at the same timing, the heating of the connection terminal 31 and the connected terminal 120 may be insufficient at the start of pressurization by the heat tool 210. is there. In this regard, in the above-described configuration, since the energization of the conductor 40 is started before the connection terminal 31 and the connection terminal 120 are heated and pressurized by the heat tool 210, the connection terminal 31 and the connection terminal 120 are sufficiently heated. In this state, it can be pressurized and heated by the heat tool 210.

  In the first embodiment, the temperature of the conductor 40 by energization is not limited, but the temperature of the conductor 40 by energization of the conductor 40 may be lower than the heat resistance temperature of the insulating substrate 10. If the temperature of the conductor 40 is higher than the heat-resistant temperature of the insulating substrate 10, peeling may occur between the conductor 40 and the insulating substrate 10. In this respect, according to this configuration, the temperature of the conductor 40 is set lower than the heat-resistant temperature of the insulating substrate 10, so that peeling between the conductor 40 and the insulating substrate 10 can be suppressed.

  In the second embodiment, as shown in FIG. 10, the first energization land 52 </ b> A and the second energization land 52 </ b> B are provided for the connection terminal 31 outside the terminal portion 30. A land 52 may be provided. In this case, the energization lands 52 are individually provided so that the connection terminals 31 are not short-circuited.

  In the third embodiment, the heat sink 310 having fins is mounted on the energization land 52. However, instead of the heat sink 310, a substrate having high thermal conductivity may be connected. Even in this case, the effect according to the third embodiment can be obtained.

  In the fourth embodiment, the energization land 52 and the ground line 420 are connected and grounded, but instead, the energization land 52 may be connected to a grounded casing. Even in this case, the effect according to the fourth embodiment can be obtained.

  DESCRIPTION OF SYMBOLS 1 ... Printed wiring board, 10 ... Insulation board | substrate, 11 ... 1st reinforcement board, 12 ... 2nd reinforcement board, 13, 14 ... Solder resist, 15 ... Reinforcement board, 20 ... Conductive pattern, 21 ... 1st conductive pattern, 21A ... main line pattern, 21B ... fine line pattern, 22 ... second conductive pattern, 23 ... third conductive pattern, 30 ... terminal portion, 31 ... connection terminal, 40 ... conductor, 40A ... conductor, 40B ... conductor, 41 ... 1st straight line part, 42 ... 1st connection part, 43 ... 2nd straight line part, 44 ... 2nd connection part, 50 ... conduction part, 51 ... main conduction part, 52 ... energization land, 52A ... 1st energization land 52B ... second energization land, 52R ... second energization land, 53 ... first inner layer land, 54 ... outer layer land, 60 ... conduction portion, 61 ... second inner layer land, 62 ... through hole, 70 ... conduction portion 71 ... Back side land, 72 ... Through-connection part, DESCRIPTION OF SYMBOLS 3 ... 3rd inner-layer land, 80 ... Conductive part, 81 ... Protruding end part, 90 ... Conductive part, 2A ... 1st conductive layer, 2B ... 2nd conductive layer, 2C ... 3rd conductive layer, 2D ... 4th conductive layer 3A ... 1st insulating layer, 3B ... 2nd insulating layer, 3C ... 3rd insulating layer, 3D ... 4th insulating layer, 100 ... FPC board, 110 ... Terminal part, 120 ... Terminal to be connected, 130 ... Anisotropic Conductive conductive film, 200 ... connecting device, 210 ... heat tool, 220 ... energizing device, 221 ... constant current power supply, 222 ... control device, 223 ... first probe pin, 224 ... second probe pin, 250 ... silicon sheet, 300 DESCRIPTION OF SYMBOLS ... Electric circuit module 310 ... Heat sink 400 ... Electric circuit module 410 ... Lead wire 420 ... Ground wire 510 ... Electronic component 520 ... Electronic component

Claims (17)

In a printed wiring board comprising an insulating substrate and a plurality of connection terminals provided on the insulating substrate,
A conductor that is heated by energization is provided at a position corresponding to the connection terminal,
A printed wiring board, wherein at least two energization lands are connected to the conductor. In the printed wiring board of Claim 1,
The printed wiring board, wherein the conductor is formed inside the insulating substrate. In the printed wiring board according to claim 2,
The energization land is provided on a surface on which the connection terminal is formed, and the energization land and the conductor are connected via a conductive portion. In the printed wiring board according to claim 2,
The energization land is provided in the same layer as the conductor,
The printed wiring board, wherein the insulating substrate is provided with a through hole reaching the energization land. In the printed wiring board according to claim 2,
The printed wiring board, wherein the energization land is provided in the same layer as the conductor, and the energization land is formed so as to protrude from a side surface of the insulating substrate. In the printed wiring board according to claim 2,
The energization land is provided on a surface opposite to the surface on which the connection terminal is formed, and the energization land and the conductor are connected via a conductive portion. Wiring board. In the printed wiring board of Claim 1,
The printed wiring board, wherein the conductor and the energization land are provided on a surface opposite to a surface on which the connection terminal is provided. In the printed wiring board as described in any one of Claims 1-7,
The connection terminals are arranged in parallel to each other,
The conductor is composed of a first straight line portion facing each connection terminal and a first connection portion that connects the first straight line portions to each other, and the first straight line portion and the first connection portion are in series. A printed wiring board characterized by being connected. In the printed wiring board as described in any one of Claims 1-8,
The connection terminals are arranged in parallel to each other,
The conductor is configured by a second straight portion that is orthogonal to each of the connection terminals and extends over the plurality of connection terminals, and a second connection portion that connects the second straight portions to each other, and the second straight portion and the first straight portion. A printed wiring board characterized by being connected in series with the two connecting portions. In the printed wiring board of Claim 1,
The printed wiring board, wherein the energization land is connected to the connection terminal, and the connection terminal itself is the conductor. In the printed wiring board according to claim 10,
The printed wiring board, wherein the energization land is provided in a connection terminal having a larger heat capacity than the other terminals among the connection terminals.   The electric circuit module using the printed wiring board as described in any one of Claims 1-11. An electric circuit module using the printed wiring board according to any one of claims 1 to 11,
An electric circuit module, wherein a heat sink is connected to the energization land. An electric circuit module using the printed wiring board according to any one of claims 1 to 11,
The electrical circuit module, wherein the energization land is grounded. The 1st electric circuit module using the printed wiring board as described in any one of Claims 1-11 and the 2nd electric circuit module using the to-be-connected printed wiring board connected to the said printed wiring board are connected. An electrical circuit module manufacturing method comprising:
The connection terminal of the printed wiring board and the connection terminal of the connected printed wiring board corresponding to the connection terminal are opposed to each other, and an anisotropic conductive film is disposed between the connection terminal and the connection terminal. And a process of
The connecting terminal and the connected terminal are heated by a heating device, and the conductor is energized through the energization land, and the printed wiring board and the connected printed wiring board are pressurized, and the connecting terminal and the connected terminal A method of manufacturing an electric circuit module, comprising: a step of connecting to a terminal to be connected. The electric circuit module according to claim 15,
The method of manufacturing an electric circuit module, wherein energization of the conductor is started before the connecting terminal and the connected terminal are heated and pressurized by the heating device. In the manufacturing method of the electric circuit module according to claim 15 or 16,
The method of manufacturing an electric circuit module, wherein the temperature of the conductor by energization is lower than the heat-resistant temperature of the insulating substrate.

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