JP2012199531A5 - - Google Patents
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- Publication number
- JP2012199531A5 JP2012199531A5 JP2012046432A JP2012046432A JP2012199531A5 JP 2012199531 A5 JP2012199531 A5 JP 2012199531A5 JP 2012046432 A JP2012046432 A JP 2012046432A JP 2012046432 A JP2012046432 A JP 2012046432A JP 2012199531 A5 JP2012199531 A5 JP 2012199531A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- mechanical polishing
- weight
- polishing composition
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/039,705 US8440097B2 (en) | 2011-03-03 | 2011-03-03 | Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition |
| US13/039,705 | 2011-03-03 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012199531A JP2012199531A (ja) | 2012-10-18 |
| JP2012199531A5 true JP2012199531A5 (OSRAM) | 2015-04-09 |
| JP6118501B2 JP6118501B2 (ja) | 2017-04-19 |
Family
ID=46671507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012046432A Active JP6118501B2 (ja) | 2011-03-03 | 2012-03-02 | 安定した濃縮可能な水溶性セルロースフリーのケミカルメカニカル研磨組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8440097B2 (OSRAM) |
| JP (1) | JP6118501B2 (OSRAM) |
| KR (1) | KR101829639B1 (OSRAM) |
| CN (1) | CN102690609B (OSRAM) |
| DE (1) | DE102012004219A1 (OSRAM) |
| FR (1) | FR2972195B1 (OSRAM) |
| TW (1) | TWI602909B (OSRAM) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8435896B2 (en) * | 2011-03-03 | 2013-05-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable chemical mechanical polishing composition and methods relating thereto |
| US8545715B1 (en) * | 2012-10-09 | 2013-10-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method |
| US20140308814A1 (en) * | 2013-04-15 | 2014-10-16 | Applied Materials, Inc | Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositions |
| US9984895B1 (en) * | 2017-01-31 | 2018-05-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| JP7209620B2 (ja) * | 2017-03-14 | 2023-01-20 | 株式会社フジミインコーポレーテッド | 研磨用組成物、その製造方法ならびにこれを用いた研磨方法および基板の製造方法 |
| US10676646B2 (en) * | 2017-05-25 | 2020-06-09 | Fujifilm Electronic Materials U.S.A., Inc. | Chemical mechanical polishing slurry for cobalt applications |
| KR102570805B1 (ko) * | 2019-11-01 | 2023-08-24 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼 연마 방법 |
| TWI896724B (zh) * | 2020-09-29 | 2025-09-11 | 日商福吉米股份有限公司 | 研磨用組成物及其製造方法、研磨方法以及基板的製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG99289A1 (en) | 1998-10-23 | 2003-10-27 | Ibm | Chemical-mechanical planarization of metallurgy |
| US6375693B1 (en) | 1999-05-07 | 2002-04-23 | International Business Machines Corporation | Chemical-mechanical planarization of barriers or liners for copper metallurgy |
| JP3551238B2 (ja) * | 1999-09-07 | 2004-08-04 | 三菱住友シリコン株式会社 | シリコンウェーハの研磨液及びこれを用いた研磨方法 |
| JP2004533115A (ja) | 2001-04-12 | 2004-10-28 | ロデール ホールディングス インコーポレイテッド | 界面活性剤を有する研磨用組成物 |
| US6632259B2 (en) | 2001-05-18 | 2003-10-14 | Rodel Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| JP4641155B2 (ja) * | 2004-06-03 | 2011-03-02 | 株式会社日本触媒 | 化学機械研磨用の研磨剤 |
| US7303993B2 (en) | 2004-07-01 | 2007-12-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US20060000808A1 (en) * | 2004-07-01 | 2006-01-05 | Fuji Photo Film Co., Ltd. | Polishing solution of metal and chemical mechanical polishing method |
| US7384871B2 (en) | 2004-07-01 | 2008-06-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US7086935B2 (en) | 2004-11-24 | 2006-08-08 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cellulose-containing polishing compositions and methods relating thereto |
| US7824568B2 (en) | 2006-08-17 | 2010-11-02 | International Business Machines Corporation | Solution for forming polishing slurry, polishing slurry and related methods |
| JP2008091411A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
| US20090032765A1 (en) * | 2007-08-03 | 2009-02-05 | Jinru Bian | Selective barrier polishing slurry |
| TW200920828A (en) * | 2007-09-20 | 2009-05-16 | Fujifilm Corp | Polishing slurry for metal and chemical mechanical polishing method |
| US9633865B2 (en) * | 2008-02-22 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-stain polishing composition |
| US20090215266A1 (en) | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
| JP4521058B2 (ja) * | 2008-03-24 | 2010-08-11 | 株式会社Adeka | 表面改質コロイダルシリカおよびこれを含有するｃｍｐ用研磨組成物 |
| US8540893B2 (en) | 2008-08-04 | 2013-09-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
-
2011
- 2011-03-03 US US13/039,705 patent/US8440097B2/en not_active Expired - Fee Related
-
2012
- 2012-03-01 DE DE102012004219A patent/DE102012004219A1/de not_active Withdrawn
- 2012-03-02 TW TW101106930A patent/TWI602909B/zh not_active IP Right Cessation
- 2012-03-02 KR KR1020120021967A patent/KR101829639B1/ko not_active Expired - Fee Related
- 2012-03-02 CN CN201210126827.8A patent/CN102690609B/zh not_active Expired - Fee Related
- 2012-03-02 JP JP2012046432A patent/JP6118501B2/ja active Active
- 2012-03-05 FR FR1251977A patent/FR2972195B1/fr not_active Expired - Fee Related
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