JP2012199312A - Substrate unit and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate unit having excellent signal transmission characteristics and a method for manufacturing the same.SOLUTION: The substrate unit comprises: a substrate having a through-hole which penetrates between a first surface and a second surface and is provided with a conductive wall surface; a first electronic component having a first connection pin which is press-fitted into the through-hole from the first surface; and a conductive member which is disposed in the through-hole and connects the wall surface of the through-hole and the first connection pin.

Description

  The present invention relates to a substrate unit and a method for manufacturing the substrate unit.

  Conventionally, there has been a multilayer wiring board in which two through holes are provided and the stub portions of the through holes are removed by connecting the two through holes at both ends or one end of each through hole. .

  Here, the stub refers to a branch wiring that is not connected (terminated) to any terminal and is not grounded in the wiring of a printed board or a semiconductor substrate.

  In addition, as one of the methods for forming a through-hole connected to the inner layer wiring of the board, a metal film is formed on the inner wall of the through-hole, and then scraped off from the back side of the wiring board to remove unnecessary portions that become stubs. There was a way to do it.

JP 2005-183649 A US Pat. No. 6,663,442

  By the way, a connector or the like may be mounted on a printed circuit board by inserting a pin such as a connector into the through hole. Since the tip of the pin is thin, a portion that does not contact the conductive wall surface of the through hole occurs at the tip of the pin.

  For this reason, even if the through hole stub is reduced by the conventional method as described above, when a pin such as a connector is inserted into the through hole, a stub is generated at the tip of the pin.

  When a stub is generated at the tip of the pin in this way, the signal transmission characteristic on the substrate is lowered, and in particular, there is a problem that the high-speed signal transmission characteristic is greatly lowered.

  Accordingly, it is an object of the present invention to provide a substrate unit with good signal transmission characteristics and a method for manufacturing the substrate unit.

  A substrate unit according to an embodiment of the present invention includes a substrate having a through-hole having a conductive wall surface that penetrates between a first surface and a second surface, and the first surface in the through-hole. A first electronic component having a first connection pin that is press-fitted from and a conductive member that is disposed in the through-hole and connects the wall surface of the through-hole and the first connection pin.

  It is possible to provide a substrate unit with good signal transmission characteristics and a method for manufacturing the substrate unit.

It is a figure which shows the stub in a signal transmission path. It is a figure which shows the cross-section of 10 A of buildup board | substrates. (A) is a figure which shows the printed circuit board 10B manufactured by removing a stub with a back drill, (B) is a figure which shows the manufacturing process of the printed circuit board 10B. It is a figure showing substrate unit 10C of comparative example 1. It is a figure which shows board | substrate unit 10D of the comparative example 2. FIG. 2 is a diagram showing a block configuration of a server 500 including a board unit 100 according to the first embodiment. 1 is a diagram showing a cross-sectional structure of a substrate unit 100 according to Embodiment 1. FIG. It is sectional drawing which shows the manufacturing method of the board | substrate unit 100 (101) of Embodiment 1. FIG. It is sectional drawing which shows the manufacturing method of the board | substrate unit 100 (101) of Embodiment 1. FIG. It is a figure which shows the cross-section of the board | substrate unit 200 of Embodiment 2. FIG. It is sectional drawing which shows the manufacturing method of the board | substrate unit 200 (201) of Embodiment 2. FIG. It is a figure which shows the cross-section of the substrate unit 300 of Embodiment 3. FIG. It is sectional drawing which shows the manufacturing method of the board | substrate unit 300 (301) of Embodiment 3. It is a figure which shows the cross-section of the substrate unit 400 of Embodiment 4. FIG. It is sectional drawing which shows the manufacturing method of the board | substrate unit 400 (401) of Embodiment 4.

  Embodiments to which a substrate unit and a method for manufacturing a substrate unit of the present invention are applied will be described below.

  Here, before describing the substrate unit of the embodiment and the method of manufacturing the substrate unit, first, the printed circuit board and the substrate unit of the comparative example and their problems will be described with reference to FIGS.

  FIG. 1 is a diagram illustrating a stub in a signal transmission path. For example, when a signal is transmitted from the buffer 1 to the buffer 2 via the transmission line 3, it is assumed that there is a portion 3A that is branched from the transmission line 3 and is not terminated in the middle of the transmission line 3. This portion 3A becomes a stub 3A.

  The stub 3A causes reflection of the transmission signal to cause impedance mismatch of the transmission path 3, and also functions as an antenna to cause noise by generating the transmission signal.

  With the miniaturization of semiconductor processes, the operating frequency of LSI (Large Scale Integrated circuit) is increasing year by year. Accordingly, speeding up access to the outside of the LSI is also required.

  Although transmission speeds such as Ethernet (registered trademark) and InfiniBand have been increased, transmission using electrical signals continues to be said to be the limit.

  However, in reality, it is possible to transmit electric signals with 10 gigabit ethers by improving the material of the printed circuit board or reducing the loss of cables or connectors, and 40 gigabit ethers or 100 gigabits. The signal transmission with Ether is coming into view.

  Such high-speed signal transmission is greatly affected by signal reflection or noise generation by the stub.

  The influence of the stub is not a problem in low-speed signal transmission, but especially when the high-speed signal has a frequency exceeding 10 Gbps, the stub having a length of mm greatly affects the signal transmission characteristics. For example, when the signal frequency is 20 GHz, primary resonance may occur in a stub having a length of 0.6 mm, and radiation loss may occur.

  Such a stub may occur, for example, in a through hole connected to the inner layer of the printed circuit board. For this reason, as a multilayer substrate with reduced stubs, there is a build-up substrate manufactured while laminating copper foil, core layer, prepreg layer, etc. one by one to form a wiring.

  FIG. 2 is a diagram showing a cross-sectional structure of the buildup substrate 10A. The build-up substrate 10A is manufactured by alternately stacking the insulating layers 11, 12, 13, 14, and 15 and the conductive layers 21, 22, 23, 24, 25, and 26.

  The conductive layers 21 and 26 are conductive layers respectively disposed on the front surface and the back surface of the build-up substrate 10A, and the LSIs 4 and 5 are mounted thereon, respectively. The LSIs 4 and 5 are connected to the conductive layer 21 via connection portions 4A and 5A, respectively. On the other hand, the conductive layers 22 to 25 are inner conductive layers sandwiched between the insulating layers 11, 12, 13, 14, and 15.

  The through hole 6 that connects the conductive layer 21 and the conductive layer 23, the through hole 7 that connects the conductive layer 23 and the conductive layer 25, and the through hole 8 that connects the conductive layer 25 and the conductive layer 26 are the insulating layers 11-15. And the conductive layers 21 to 26 are formed one by one in sequence.

  After the build-up substrate 10A is completed, if the LSIs 4 and 5 are mounted on the conductive layers 21 and 26 by the connecting portions 4A and 5A, respectively, between the LSIs 4 and 5, the conductive layer 21, the through hole 6, the conductive layer 23, and the through The hole 7, the conductive layer 25, the through hole 8, and the conductive layer 26 are electrically connected.

  Since almost no stub is formed in the through holes 6, 7, and 8 of the build-up board 10A, the signal transmission characteristics of the build-up board 10A are good.

  However, the build-up substrate 10A has a problem that it is expensive because it is manufactured by stacking one layer at a time as described above.

  Further, as a technique for reducing the stub of the through hole, there is a technique called back drill.

  FIG. 3A is a view showing a printed circuit board 10B manufactured by removing the stub with a back drill, and FIG. 3B is a view showing the printed circuit board 10B before the back drill is performed.

  As illustrated in FIG. 3A, the printed circuit board 10 </ b> B includes insulating layers 11, 12, 13, 14, 15, conductive layers 21, 22, 23, 24, 25, 26, and through holes 31, 32. The printed circuit board 10B is manufactured by thermally welding a plurality of insulating layers and a plurality of conductive layers at a time.

  In the printed circuit board 10 </ b> B shown in FIG. 3A, the conductive layer 21 and the conductive layer 25 are connected by a through hole 31, and the conductive layer 25 and the conductive layer 26 are connected by a through hole 32.

  Here, a method of forming the through holes 31 and 32 by the back drill will be described.

  First, as shown in FIG. 3B, through holes 31A and 32A are formed from the upper surface to the lower surface of the printed circuit board 10B.

  The through holes 31A and 32A are formed by drilling a through hole penetrating from the conductive layer 21 to the conductive layer 26 of the printed board 10B with a drill or the like and plating the wall surface of the through hole. The plating process is formed, for example, by first forming an electroless plating layer on the wall surface of the through hole and then forming the electroplating layer on the electroless plating layer. As the electroless plating layer and the electrolytic plating layer, for example, copper plating, gold plating, tin plating, or the like may be used.

  Next, the unnecessary portion of the through hole 31A is scraped off with the drill A from the lower side in FIG. 3B, and the unnecessary portion of the through hole 32A is scraped off with the drill B from the upper side. In this way, by removing unnecessary portions with the drills A and B, the through holes 31 and 32 shown in FIG. 3A are completed.

  As described above, if a method called a back drill is used, the through holes 31 and 32 as shown in FIG. 3A can be formed. However, the positions of the through holes 31 and 32 in the depth direction by the drills A and B are as follows. There is a problem of alignment accuracy.

  For this reason, it is difficult to completely remove unnecessary portions with the back drill, and a small stub may remain in the through hole 31 below the lower surface of the conductive layer 25, and the upper surface of the conductive layer 25 may be left in the through hole 32. Small stubs may remain on the upper side.

  Incidentally, a back-to-back type press-fit connector as shown in FIG. 4 may be used in a blade server or a large communication device.

  FIG. 4 is a diagram illustrating a substrate unit 10 </ b> C of Comparative Example 1.

  The board unit 10C shown in FIG. 4 includes insulating layers 11, 12, 13, 14, and 15, conductive layers 41, 42, 43, and 44, through holes 51 and 52, and press-fit connectors 61 and 62. In the board unit 10C, the insulating layers 11, 12, 13, 14, and 15, the conductive layers 41, 42, 43, and 44, and the through holes 51 and 52 are printed boards (boards). The laminated body of the insulating layers 11, 12, 13, 14, 15 and the conductive layers 41, 42, 43, 44 included in the substrate unit 10C includes a plurality of insulating layers (11-15) and a plurality of conductive layers (41-44). ) At a time.

  The conductive layers of the substrate unit 10 </ b> C are all inner conductive layers 41 to 44. The conductive layers 41 to 44 are not connected to the through holes 51 and 52 and are formed so as to avoid the through holes 51 and 52 in plan view.

  The through holes 51 and 52 are formed by drilling a through hole penetrating from the insulating layer 11 to the insulating layer 15 of the substrate unit 10C with a drill or the like and plating the wall surface of the through hole. The plating process is formed, for example, by first forming an electroless plating layer on the wall surface of the through hole and then forming the electroplating layer on the electroless plating layer. As the electroless plating layer and the electrolytic plating layer, for example, copper plating, gold plating, tin plating, or the like may be used.

  The press-fit connectors 61 and 62 are Back-to-Back type press-fit connectors, and are mounted on both surfaces of the substrate unit 10C.

  The tip portions 63A and 64A of the connection pins 63 and 64 of the press-fit connectors 61 and 62 are press-fitted into the through holes 51 and 52 of the board unit 10C, respectively. Thereby, the connection pins 63 and 64 are electrically connected via the through holes 51 and 52.

  As described above, when the back-to-back type press-fit connectors 61 and 62 are used, wiring such as a cable is not required between the connectors (61 and 62), and therefore wiring between the connection pin 63 and the connection pin 64 is performed. The length can be shortened.

  By the way, since the tip portions 63A and 64A of the connection pins 63 and 64 are thin, the tip portions 63A and 64A do not contact the inner wall surfaces of the through holes 51 and 52.

  For this reason, portions indicated by arrows at the tip portions 63A and 64A become stubs, and impedance mismatching due to signal reflection or noise due to the stub serving as an antenna and radiation may occur. This becomes more prominent as the signal transmission speed increases.

  Further, the same problem occurs in a press-fit connector mounted only on one side of the board unit, instead of the back-to-back type press-fit connectors 61 and 62.

  FIG. 5 is a diagram showing a substrate unit 10D of Comparative Example 2.

  The board unit 10 </ b> D includes insulating layers 11, 12, 13, 14, 15, conductive layers 41, 42, 43, 44, a through hole 53, and a press-fit connector 65. In the substrate unit 10D, the insulating layers 11, 12, 13, 14, and 15, the conductive layers 41, 42, 43, and 44, and the through holes 53 are printed circuit boards (substrates). The laminated body of the insulating layers 11, 12, 13, 14, and 15 and the conductive layers 41, 42, 43, and 44 included in the substrate unit 10D includes a plurality of insulating layers (11 to 15) and a plurality of conductive layers (41 to 44). ) At a time.

  The conductive layers of the substrate unit 10D are all inner conductive layers 41 to 44. The conductive layer 41 is connected to the through hole 53, and the conductive layers 42 to 44 are not connected to the through hole 53, and are formed so as to avoid the through hole 53 in plan view.

  The through hole 53 is formed by drilling a through hole penetrating from the insulating layer 11 to the insulating layer 15 of the substrate unit 10D with a drill or the like, and plating the wall surface of the through hole. At this time, the through hole 53 and the conductive layer 41 are connected. The plating process is formed, for example, by first forming an electroless plating layer on the wall surface of the through hole and then forming the electroplating layer on the electroless plating layer. As the electroless plating layer and the electrolytic plating layer, for example, copper plating, gold plating, tin plating, or the like may be used.

  Tip portions 66A of the connection pins 66 of the press-fit connector 65 are press-fitted into the through holes 53 of the board unit 10D. Thereby, the press-fit connector 65 is mounted on one surface of the substrate unit 10 </ b> D, and the connection pins 66 are electrically connected via the through holes 53.

  The female connector portion 66B of the press-fit connector 65 is provided in the recess 65A of the press-fit connector 65, and the cable connector 67 is connected to the connector portion 66B.

  The cable connector 67 includes a housing 67A and a male connector portion 68 held inside the housing 67A. The connector portion 68 of the cable connector 67 is inserted into the connector portion 66B of the press-fit connector 65. At this time, a part of the housing 67 </ b> A of the cable connector 67 is press-fitted into the recess 65 </ b> A of the press-fit connector 65. A cable 69 is connected to the connector portion 68 of the cable connector 67.

  Also in such a press-fit connector 65, the distal end portion 66 </ b> A of the connection pin 66 is thin, so the distal end portion 66 </ b> A does not contact the inner wall surface of the through hole 53.

  For this reason, the portion indicated by the arrow at the tip 66A becomes a stub, and impedance mismatch due to signal reflection or noise may be generated due to the signal being emitted by the stub serving as an antenna. This becomes more prominent as the signal transmission speed increases.

  As described above, in the press-fit connectors 61, 62, 65 mounted on the board units 10C, 10D of Comparative Examples 1 and 2, stubs are formed at the tip portions 63A, 64A, 66A of the connection pins 63, 64, 66. There is a problem that.

  Therefore, hereinafter, the substrate units of Embodiments 1 to 4 that solve the above-described problems will be described.

<Embodiment 1>
FIG. 6 is a diagram illustrating a block configuration of the server 500 including the board unit 100 according to the first embodiment.

  The server 500 is an example of an electronic device that includes the board unit 100 of the first embodiment. The server 500 includes chassis 510A and 510B and a switch module 520.

The chassis 510A includes a plurality of blades 600 ₁ to 600 _n and the substrate unit 100. Here, n is an arbitrary integer of 2 or more, and represents the number of blades 600 ₁ to 600 _n in the chassis 510A.

Blade 600 _1, CPU including: (large scale integrated circuit Large Scale Integrated circuit) 630 (Central Processing Unit The central processing unit) 610, a memory 621, 622, 623 and 624, and a communication LSI. The CPU 610, the memories 621, 622, 623, 624, and the communication LSI 630 are connected by a bus 650. Here, the memories 621, 622, 623, and 624 are, for example, SRAMs (Static Random Access Memory) as a main storage device.

The internal configuration of the blade ₆₀₀ 2 to 600 _n are the same as the blade 600 ₁ are not shown and described.

Each of the blades 600 ₁ to 600 _n is connected to a press-fit connector 60A (represented as CN (abbreviation of Connector)). The press-fit connector 60A and the communication LSI 630 are connected by a bus 660.

Here, when the blades 600 ₁ to 600 _n are not particularly distinguished, they are simply referred to as the blade 600.

  The board unit 100 is used as a so-called BP (Back Plane) and includes press-fit connectors 150 and 160. The press-fit connector 150 is an example of a first electronic component, and the press-fit connector 160 is an example of a second electronic component.

  The n press-fit connectors 150 are mounted on one surface of the board unit 100, and the n press-fit connectors 160 are mounted on the other surface.

  Thus, the press-fit connectors 150 and 160 are mounted on both sides of the substrate unit 100 as the BP. For this reason, BP (Back Plane) is written on each substrate unit 100.

  Each press-fit connector 150, 160 has a plurality of connection pins, and each connection pin is press-fitted into the through hole of the board unit 100, so that each connection pin and the conductive wall surface of the through hole are electrically connected. Has been. In addition, the structure of the connection part of the board | substrate unit 100 and the press fit connectors 150 and 160 is mentioned later.

The blades 600 ₁ to 600 _n are electrically connected to the wiring or the like of the board unit 100 by connecting the press-fit connector 60A and the press-fit connector 150, and also one side of the board unit 100 (left side in FIG. 6). The surface is fixed.

  The chassis 510B has a configuration similar to that of the chassis 510A, and thus description thereof is omitted.

  The switch module 520 is mounted with 2n press-fit connectors 60B. The press-fit connectors 160 of the board units 100 of the chassis 510A and 510B are connected to the press-fit connectors 60B of the switch module 520 via cables 88, respectively.

  When the CPU 610 of the blade 600 in the chassis 510 </ b> A communicates with the CPU 610 of the other blade 600 in the same chassis 510 </ b> A, the CPU 610 communicates with the communication LSI 630, the press-fit connectors 60 </ b> A and 150, and the board unit 100. Data is transmitted via internal wiring.

  Further, when the CPU 610 of the blade 600 in the chassis 510A communicates with the CPU 610 of the blade 600 in the chassis 510B, the CPUs 610 communicate with each other by the respective communication LSIs 630, press-fit connectors 60A, 150, 160, and 60B. Data is transmitted through the internal wiring of 100 and the switch module 520. At this time, the switch module 520 connects the communication LSI 630 in the chassis 510A and the communication LSI 630 in the chassis 510B.

  Next, the substrate unit 100 according to the first embodiment will be described with reference to FIG.

  FIG. 7 is a diagram showing a cross-sectional structure of the substrate unit 100 according to the first embodiment.

  The board unit 100 includes five insulating layers 111, 112, 113, 114, 115, four conductive layers 121, 122, 123, 124, a through hole 130, press-fit connectors 150, 160, and a coil spring 170. . In the substrate unit 100, the insulating layers 111, 112, 113, 114, 115, the conductive layers 121, 122, 123, 124, and the through holes 130 are printed circuit boards (substrates).

  A through-hole 130 is formed in the substrate unit 100 from the front surface 100A to the back surface 100B.

  The substrate unit 100 is a substrate unit formed of a glass cloth base material such as FR4 (Flame Retardant Type 4) or FR5 (Flame Retardant Type 5) and an epoxy resin, for example.

  For example, the insulating layers 111, 113, and 115 are prepreg layers in which fibers are impregnated with a thermosetting resin, for example, glass cloth base materials are impregnated with an epoxy resin. For example, the insulating layers 12 and 14 are core layers. However, the prepreg layer may be formed of an epoxy resin that does not include fibers.

  The conductive layers 121, 122, 123, and 124 are, for example, copper foil. The conductive layers 121, 122, 123, and 124 are used as, for example, a signal transmission wiring layer, a power supply layer, or a ground layer.

  Here, since the conductive layers 121, 122, 123, and 124 are not connected to the through hole 130, they are patterned so as to avoid the through hole 130 in a plan view.

  The insulating layers 111, 112, 113, 114, and 115 and the conductive layers 121, 122, 123, and 124 are formed on both surfaces of the insulating layer 112 and the insulating layer 114, which are core layers, respectively. In the state where 124 is formed, it is fixed by being subjected to a thermosetting treatment.

  Here, the substrate unit 100 is a four-layer substrate unit in which no conductive layer is formed on the front surface 100A and the back surface 100B. For example, when a high-speed signal such as a signal transmission speed of several tens of Gbps (or higher) is transmitted, in order to ensure good transmission characteristics, insulating layers ( This is because it may be preferable that 111-115) exist.

  However, the substrate unit 100 according to the first embodiment is not limited to the case where the conductive layer is not formed on the front surface 100A and the back surface 100B as described above, and the conductive layer is formed on one or both of the front surface 100A and the back surface 100B. Depending on the situation, a 5-layer type or a 6-layer type may be used.

  For convenience of explanation, FIG. 7 shows two through-holes 130 and a set of press-fit connectors 150, 160. However, the board unit 100 includes a plurality of sets of press-fit connectors 150, 160, a press-fit connector 150, The number of through holes 130 corresponding to 160 may be included.

  Further, the substrate unit 100 is not limited to FR4 or FR5, and may be other grades of the FR standard or other standards as long as it includes an inner conductive layer. May be.

  The through hole 130 is formed by first forming a through hole penetrating the insulating layers 111 to 115 from the front surface 100A to the back surface 100B of the substrate unit 100 and plating the wall surface of the through hole. For this reason, the wall portion of the through hole 130 becomes a conductive wall.

  The plating process for forming the through hole 130 is formed by first forming an electroless plating layer on the wall surface of the through hole and then forming the electrolytic plating layer on the electroless plating layer. As the electroless plating layer and the electrolytic plating layer, for example, copper plating, gold plating, tin plating, or the like may be used.

  In the case where the plating process is performed, a plating resist or the like may be applied to a portion where the plating layer is not formed. As the plating resist, for example, a fluororesin, a silicon resin, or an olefin resin that is difficult to be electrolessly plated can be used.

  The press-fit connectors 150 and 160 include housings 151 and 161 and connection pins 152 and 162, respectively.

  As a material of the casings 151 and 161, for example, a polyester resin can be used.

  As a material for the connection pins 152, 162, for example, phosphor bronze or nickel alloy plated with gold can be used. The connection pins 152 and 162 pass through the casings 151 and 161 as indicated by broken lines, and are held by the casings 151 and 161.

  For convenience of explanation, FIG. 7 shows two connection pins 152 and 162 for each of the press-fit connectors 150 and 160, but the press-fit connectors 150 and 160 include, for example, 16 connection pins 152 and 162, respectively. Or 32 each.

  The front end 152A of the connection pin 152 of the press-fit connector 150 is press-fitted into the through hole 130 from the surface 100A side of the board unit 100. The tip 162A of the connection pin 162 of the press-fit connector 160 is press-fitted into the through hole 130 from the back surface 100B side of the board unit 100.

  The terminal portion 152B of the connection pin 152 is connected to the press-fit connector 60A of the blade 600, and the terminal portion 162B of the connection pin 162 is connected to the cable 88 (see FIG. 6).

  The coil spring 170 is inserted into the space between the distal end portion 152 </ b> A of the connection pin 152 and the distal end portion 162 </ b> A of the connection pin 162 inside the through hole 130.

  Here, a space is provided between the distal end portion 152A of the connection pin 152 and the distal end portion 162A of the connection pin 162. This is because when the connection pins 152 and 162 are press-fitted, if the tip portions 152A and 162A come into contact with each other, a force to push back to the connection pins 152 or the connection pins 162 acts, resulting in poor connection with the through hole 130. This is because there is a possibility.

  Since the coil spring 170 is used to connect the distal end portion 152A of the connection pin 152 and the distal end portion 162A of the connection pin 162, as shown in FIG. 7, the axial direction (stretching direction) is the axis of the through hole 130. It is preferably inserted so as to substantially coincide with the direction.

  As for the coil spring 170, when the pins 152 and 162 are respectively press-fitted into the through holes 130, the coil spring 170 is contracted from the natural length between the distal end portion 152A and the distal end portion 162A and can exhibit a sufficient restoring force. What is necessary is just to set a full length and a spring constant.

  The coil spring 170 is an example of a conductive elastic member and an example of a conductive member. The coil spring 170 may be formed of a conductive material, but is preferably formed of the same material as the material of the plated layer of the through hole 130, for example. Accordingly, the coil spring 170 is made of, for example, copper, gold, tin, or the like.

  Next, the manufacturing method of the substrate unit 100 of Embodiment 1 is demonstrated using FIG.8 and FIG.9.

  8 and 9 are cross-sectional views showing a method for manufacturing substrate unit 100 (101) of the first embodiment. 8 and 9, the substrate unit 100 (101) is shown in a smaller scale than in FIG. Here, the substrate unit 101 represents a substrate unit in a manufacturing stage before the substrate unit 100 is completed.

  First, as shown in FIG. 8A, the insulating layers 111, 112, 113, 114, and 115 and the conductive layers 121, 122, 123, and 124 are overlapped and subjected to thermosetting treatment, thereby manufacturing the substrate unit 101. To do. The conductive layers 121 to 124 of the substrate unit 101 shown in FIG. 8A are patterned so as to avoid portions where the through holes 130 will be formed later.

  Next, as shown in FIG. 8B, through holes 131 are formed from the surface 101A side of the substrate unit 101 by machining using a drill, laser processing, or the like. The through hole 131 is formed by removing the insulating layers 111 to 115 from the front surface 101A to the back surface 101B of the substrate unit 101. The through hole 131 may be formed from the back surface 101B side of the substrate unit 101.

  Next, the substrate unit 101 is impregnated with an electroless plating solution to form an electroless plating layer, and an electrolytic plating layer is formed thereon, thereby forming the through hole 130 as shown in FIG. Form.

  In the first embodiment, since no plating layer is formed other than the plating layer as the through hole 130, for example, when the substrate unit 101 shown in FIG. 8A is manufactured, the entire outer surface of the substrate unit 101 is formed. In addition, a plating resist may be applied.

  After forming a plating resist on the entire outer surface of the substrate unit 101 at the stage of FIG. 8A, if a through hole 131 is formed as shown in FIG. 8B, the plating resist is not formed on the wall surface of the through hole 131. Not formed. For this reason, by impregnating the substrate unit 101 with the electroless plating solution, the through hole 130 as a plating layer can be formed only on the wall surface of the through hole 131.

  Next, as shown in FIG. 8D, the front end portion 162 </ b> A of the connection pin 162 of the press-fit connector 160 is press-fitted into the through hole 130 from the back surface 101 </ b> B side of the substrate unit 101. As a result, the press-fit connector 160 is fixed to the back surface 101 </ b> B side of the substrate unit 101.

  Next, as illustrated in FIG. 9A, the coil spring 170 is inserted into the through hole 130 from the surface 101 </ b> A side of the substrate unit 101. At this time, it is preferable to insert the coil spring 170 into the through hole 130 so that the axial direction (stretching direction) of the coil spring 170 and the axial direction of the through hole 130 substantially coincide.

  Finally, the front end portion 152A of the connection pin 152 of the press-fit connector 150 is press-fitted into the through hole 130 from the surface 101A side of the substrate unit 101, whereby the substrate unit 100 shown in FIG. 9B is completed.

  Thus, the substrate unit 100 shown in FIG. 9B is formed. The board unit 100 shown in FIG. 9B is the same as the board unit 100 shown in FIG.

  Unlike the conventional board unit, the front end portions 152A and 162A of the connection pins 152 and 162 are connected to each other by the conductive coil spring 170 in the board unit 100, so that the conductive portions that are not terminated are shortened, and the connection pins 152 and 162 are shortened. Stubs at the tip portions 152A and 162A of the stub can be reduced.

  In particular, by optimizing the shape of the tip portions 152A and 162A of the connection pins 152 and 162 and the shape of the coil spring 170, it is possible to prevent stubs from being generated.

  Therefore, according to the first embodiment, it is possible to provide a substrate unit 100 that suppresses signal reflection or noise generation by effectively suppressing the generation of stubs and has good high-speed signal transmission characteristics. . Further, since signal reflection or noise generation is suppressed, long-distance signal transmission is possible.

  Further, according to the first embodiment, it is not necessary to use a build-up substrate, and it is not necessary to perform machining such as a back drill.

  For this reason, it is possible to provide a substrate unit 100 that can be easily manufactured at low cost.

<Embodiment 2>
The board unit 200 of the second embodiment is different from the board unit 100 of the first embodiment in that a conductive elastic pad 270 is used instead of the coil spring 170. Since other configurations are the same as those of the substrate unit 100 of the first embodiment, the same or equivalent components are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 10 is a diagram showing a cross-sectional structure of the substrate unit 200 according to the second embodiment.

  The substrate unit 200 includes five insulating layers 111, 112, 113, 114, 115, four conductive layers 121, 122, 123, 124, through holes 130, press-fit connectors 150, 160, and conductive elastic pads 270. including. In the substrate unit 200, the insulating layers 111, 112, 113, 114, and 115, the conductive layers 121, 122, 123, and 124, and the through hole 130 are printed circuit boards (substrates).

  As described above, the conductive elastic pad 270 is used instead of the coil spring 170 of the first embodiment, and is an example of a conductive elastic pad and an example of a conductive member. As the conductive elastic pad 270, a silicon rubber containing conductive particles, a conductive sponge, or an anisotropic conductive sheet in which fine metal wires are embedded in the thickness direction of the silicon rubber sheet can be used.

  The conductive material included in the conductive elastic pad 270 is preferably formed of the same material as the material of the plated layer of the through hole 130, for example. Therefore, it is desirable that the conductive elastic pad 270 includes, for example, copper, gold, tin, or the like as a conductive material.

  Next, a method for manufacturing the substrate unit 200 according to the second embodiment will be described with reference to FIG.

  FIG. 11 is a cross-sectional view illustrating a method for manufacturing the substrate unit 200 (201) of the second embodiment. In FIG. 11, the substrate unit 200 (201) is shown in a smaller scale than in FIG. Here, the substrate unit 201 represents a substrate unit in a manufacturing stage before the substrate unit 200 is completed.

  In the manufacturing process of the substrate unit 200, the insulating layers 111 to 115 and the conductive layers 121 to 124 are overlapped to manufacture the substrate unit 201, the through holes 131 are formed, the through holes 130 are formed, and the press-fit connector 160 is further formed. The process up to mounting is the same as the manufacturing process of the substrate unit 100 of the first embodiment.

  For this reason, FIG. 8 (A)-(D) showing to the process of mounting the press fit connector 160 is used, and the description is abbreviate | omitted.

  After the front end portion 162A of the connection pin 162 of the press-fit connector 160 is press-fitted into the through hole 130 from the back surface 201B side of the substrate unit 201 and the press-fit connector 160 is fixed to the back surface 201B side of the substrate unit 201, FIG. ) Is performed.

  In the step shown in FIG. 11A, the conductive elastic pad 270 is inserted into the through hole 130 from the surface 201A side of the substrate unit 201.

  Finally, the front end portion 152A of the connection pin 152 of the press-fit connector 150 is press-fitted into the through hole 130 from the front surface 201A side of the substrate unit 201, whereby the substrate unit 200 shown in FIG.

  Thus, the substrate unit 200 shown in FIG. 11B is formed. A substrate unit 200 shown in FIG. 11B is the same as the substrate unit 200 shown in FIG.

  Unlike the conventional board unit, the front end portions 152A and 162A of the connection pins 152 and 162 are connected to each other by the conductive elastic pad 270 in the board unit 200, so that the conductive portions that are not terminated are shortened, and the connection pins 152 and 162 Stubs at the tip portions 152A and 162A can be reduced.

  In particular, stubs can be hardly generated by accurately sandwiching the conductive elastic pad 270 between the tip portions 152A and 162A of the connection pins 152 and 162.

  Therefore, according to the second embodiment, it is possible to provide a board unit 200 that suppresses signal reflection or noise generation by effectively suppressing the occurrence of stubs and has good high-speed signal transmission characteristics. . Further, since signal reflection or noise generation is suppressed, long-distance signal transmission is possible.

  Further, according to the second embodiment, it is not necessary to use a build-up substrate, and it is not necessary to perform machining such as a back drill.

  For this reason, it is possible to provide a substrate unit 200 that is easy to manufacture at low cost.

<Embodiment 3>
The board unit 300 of the third embodiment is different from the board unit 100 of the first embodiment in that the press-fit connectors 350 and 360 are used instead of the press-fit connectors 150 and 160 and the coil spring 170 is not used.

  Since other configurations are the same as those of the substrate unit 100 of the first embodiment, the same or equivalent components are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 12 is a diagram illustrating a cross-sectional structure of the substrate unit 300 according to the third embodiment.

  The substrate unit 300 includes five insulating layers 111, 112, 113, 114, 115, four conductive layers 121, 122, 123, 124, a through hole 130, and press-fit connectors 350, 360. In the substrate unit 300, the insulating layers 111, 112, 113, 114, 115, the conductive layers 121, 122, 123, 124, and the through holes 130 are printed circuit boards (substrates).

  The press-fit connectors 350 and 360 include housings 351 and 361 and connection pins 352 and 362, respectively. The press-fit connector 350 is an example of a first electronic component, and the press-fit connector 360 is an example of a second electronic component.

  The connecting pin 352 has a convex tip 352A, and the connecting pin 362 has a concave tip 362A. The connecting pin 352 and the connecting pin 362 are dimensioned and convex and concave shapes of the leading end portions 352A and 362A so that the concave and convex portions of the leading end portion 352A and the leading end portion 362A come into contact or pressure contact when pressed into the through hole 130. The shape is set.

  Specifically, for example, the length of the connection pin 162 of the press-fit connector 160 according to the first embodiment is increased to such an extent that it contacts the connection pin 152, and a recess is formed at the tip of the connection pin 162. The fit connectors 350 and 360 can be realized.

  At this time, the concave portion of the tip portion 362A may be crushed so as to be in close contact with the convex portion of the tip portion 352A.

  As a material of the housings 351 and 361, for example, a polyester resin can be used.

  As a material of the connection pins 352 and 362, for example, a phosphor bronze or nickel alloy plated with gold can be used.

  The press-fit connector 350 and the press-fit connector 360 are desirably mounted on the board unit 300 at the same time. The connection pins 352 and 362 pass through the housings 351 and 361 and are held by the housings 351 and 361 as indicated by broken lines.

  In the press-fit connectors 350 and 360, the tip portions 352A and 362A of the connectors 352 and 362 are both press-fitted into the through hole 130, and both are pressed to form the convex and concave shapes of the tip portions 352A and 362A of the connection pins 352 and 362. Is mounted on the substrate unit 300 by pressure bonding.

  Next, a method for manufacturing the substrate unit 300 according to the third embodiment will be described with reference to FIG.

  FIG. 13 is a cross-sectional view illustrating a method of manufacturing the substrate unit 300 (301) of the third embodiment. In FIG. 13, the substrate unit 300 (301) is shown in a smaller scale than in FIG. Here, the substrate unit 301 represents a substrate unit in a manufacturing stage before the substrate unit 300 is completed.

  The manufacturing process of the substrate unit 300 is performed until the process of forming the through hole 131 and forming the through hole 130 after manufacturing the substrate unit 301 by superimposing the insulating layers 111 to 115 and the conductive layers 121 to 124. This is the same as the manufacturing process of the substrate unit 100 of the first embodiment.

  For this reason, FIG. 8 (A)-(C) showing to the process of forming the through hole 130 is used, and the description thereof is omitted.

  As shown in FIG. 13A, the tip 352A of the connection pin 352 of the press-fit connector 350 is press-fitted into the through-hole 130 from the surface 301A side of the substrate unit 301 in which the through-hole 130 is formed. At the same time, the front end portion 362A of the connection pin 362 of the press-fit connector 360 is press-fitted into the through hole 130 from the back surface 301B side of the substrate unit 300.

  Next, the connection pins 352 and 362 of the press-fit connectors 350 and 360 are press-fitted into the through holes 130 so that the convex and concave portions of the tip portions 352A and 362A of the connection pins 352 and 362 are pressed and pressed. . Thereby, the substrate unit 300 shown in FIG. 13B is completed.

  Thus, the substrate unit 300 shown in FIG. 13B is formed. A substrate unit 300 shown in FIG. 13B is the same as the substrate unit 300 shown in FIG.

  Unlike the conventional substrate unit, the board unit 300 has the tip portions 152A and 162A of the connection pins 352 and 362 being crimped to each other, so that a conductive portion that is not terminated is shortened, and the tip parts 352A and 352A of the connection pins 352 and 362 are connected. The stub in 362A can be reduced.

  In particular, when the concave portion of the tip portion 362A is crushed and in close contact with the convex portion of the tip portion 352A, almost no stub can be generated.

  For this reason, according to the third embodiment, it is possible to provide a substrate unit 300 that suppresses signal reflection or noise generation by effectively suppressing the occurrence of stubs and has good high-speed signal transmission characteristics. . Further, since signal reflection or noise generation is suppressed, long-distance signal transmission is possible.

  Further, according to the third embodiment, it is not necessary to use a build-up substrate and it is not necessary to perform machining such as a back drill.

  Therefore, it is possible to provide the board unit 300 that can be manufactured at low cost.

<Embodiment 4>
In the fourth embodiment, a conductive resin is provided between the point where the press-fit connector 450 is mounted on only one surface of the board unit 400 and the tip 452A of the connection pin 452 of the press-fit connector 450 and the wall surface of the through hole 130. Is different from the substrate unit 100 of the first embodiment.

  Since other configurations are the same as those of the substrate unit 100 of the first embodiment, the same or equivalent components are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 14 is a diagram showing a cross-sectional structure of the substrate unit 400 according to the fourth embodiment.

  The board unit 400 includes five insulating layers 111, 112, 113, 114, 115, four conductive layers 121, 122, 123, 124, a through hole 130, and a press-fit connector 450. In the substrate unit 400, the insulating layers 111, 112, 113, 114, 115, the conductive layers 121, 122, 123, 124, and the through holes 130 are printed circuit boards (substrates).

  Here, in the fourth embodiment, the through hole 130 is connected to the conductive layer 121 but is not connected to the conductive layers 122 to 124.

  The press-fit connector 450 includes a housing 451 and connection pins 452. The press-fit connector 450 is an example of a first electronic component.

  The dimensions of the connection pin 452 are set so that the tip portion 452A fits inside the through hole 130 when it is press-fitted into the through hole 130.

  As a material of the housing 451, for example, a polyester resin can be used.

  As a material of the connection pin 452, for example, a phosphor bronze or nickel alloy plated with gold can be used. The connection pin 452 penetrates the inside of the housing 451 in an L shape as indicated by a broken line and is held by the housing 451.

  The press-fit connector 450 is mounted on the board unit 400 by press-fitting the tip 452A of the connection pin 452 into the through hole 130 from the back surface 400B side of the board unit 400.

  In addition, after the tip 452A of the connection pin 452 is press-fitted into the through hole 130, a conductive resin 470 is injected into the through hole 130 from the surface 400A side of the substrate unit 400, whereby the tip 452A and the wall surface of the through hole 130 are filled. The space partitioned by is filled with conductive resin 470.

  As the conductive resin 470, for example, a conductive adhesive containing gold powder, copper powder, nickel powder, silver powder, aluminum powder, plating powder, carbon powder, graphite powder, or the like can be used as a conductive filler.

  For example, the conductive resin 470 is mounted on a device that forms a through hole for forming the through hole 130 in the substrate unit 400 by drilling, and a syringe (injector) 480 is mounted instead of the drill, and the conductive resin 470 is positioned in the through hole 130. In combination, the conductive resin 470 may be injected into the through hole 130.

  The female connector portion 452B of the connection pin 452 of the press-fit connector 450 is provided in the recess 451A of the housing 451 of the press-fit connector 450, and the cable connector 467 is connected to the connector portion 452B.

  The cable connector 467 includes a housing 467A and a male connector portion 468 held inside the housing 467A. The connector portion 468 of the cable connector 467 is inserted into the connector portion 452B of the press-fit connector 450. At this time, a part of the housing 467A of the cable connector 467 is press-fitted into the recess 451A of the housing 451 of the press-fit connector 450. A cable 469 is connected to the connector portion 468 of the cable connector 467.

  Here, the connecting portion 452 of the press-fit connector 450 is press-fitted into the through hole 130 from the back surface 400B side of the substrate unit 400, and the through hole 130 is the most on the front surface 400A side of the four conductive layers 121-124. Is connected to the conductive layer 121 located at the bottom.

  This is because the conductive layer located farthest from the side where the connection pin 452 is inserted (the back surface 400B side) (the front surface 400A side) rather than connecting the through hole 130 to any of the conductive layers 122, 123, 124. This is because the portion that is not terminated is reduced when the through hole 130 is connected to 121.

  Therefore, for example, when the connecting portion 452 of the press-fit connector 450 is press-fitted into the through hole 130 from the front surface 400A side of the substrate unit 400, the through hole 130 is connected to the conductive layer 124 (the conductive layer located closest to the back surface 400B). It is desirable to do.

  By doing in this way, the part which is not terminated can be reduced and the occurrence of stubs can be suppressed. As a result, the signal transmission characteristics are improved.

  Next, the manufacturing method of the substrate unit 400 of Embodiment 4 is demonstrated using FIG.

  FIG. 15 is a cross-sectional view illustrating a method for manufacturing the substrate unit 400 (401) of the fourth embodiment. In FIG. 15, the substrate unit 400 (401) is shown in a smaller scale than in FIG. Here, the substrate unit 401 represents a substrate unit in a manufacturing stage before the substrate unit 400 is completed.

  The manufacturing process of the substrate unit 400 is performed until the process of forming the through hole 131 and forming the through hole 130 after manufacturing the substrate unit 401 by superimposing the insulating layers 111 to 115 and the conductive layers 121 to 124. This is the same as the manufacturing process of the substrate unit 100 of the first embodiment.

  For this reason, FIG. 8 (A)-(C) showing to the process of forming the through hole 130 is used, and the description thereof is omitted.

  As shown in FIG. 15A, the tip end portion 452A of the connection pin 452 of the press-fit connector 450 is press-fitted into the through hole 130 from the back surface 401B side of the substrate unit 401 in which the through hole 130 is formed.

  Next, the conductive resin 470 is injected from the front surface 400 </ b> A side of the substrate unit 400. The conductive resin 470 is filled in a space defined by the tip 452 </ b> A and the wall surface of the through hole 130. Thereby, the substrate unit 400 shown in FIG. 15B is completed.

  Thus, the substrate unit 400 shown in FIG. 15B is formed. A substrate unit 400 shown in FIG. 15B is the same as the substrate unit 400 shown in FIG.

  Unlike the conventional board unit, the board unit 400 is filled with the conductive resin 470 in the space defined by the tip part 452A of the connection pin 452 and the wall surface of the through hole 130, so that the conductive part that is not terminated is short. Thus, the stub at the tip portion 452A of the connection pin 452 can be reduced.

  For this reason, according to the fourth embodiment, it is possible to provide a board unit 400 that suppresses signal reflection or noise generation by effectively suppressing the occurrence of stubs and has good high-speed signal transmission characteristics. . Further, since signal reflection or noise generation is suppressed, long-distance signal transmission is possible.

  Further, according to the fourth embodiment, it is not necessary to use a build-up substrate, and it is not necessary to perform machining such as a back drill.

  For this reason, it is possible to provide a substrate unit 400 that is inexpensive and easy to manufacture.

  In the fourth embodiment, the press-fit connector 450 is mounted only on the back surface 400B side of the substrate unit 400, but a press-fit connector may be mounted on the front surface 400A side. In this case, an appropriate amount of the conductive resin is taken into consideration that the connection pins of the press-fit connector on the surface 400A side are pressed into the through-hole 130 without filling the through-hole 130 with the conductive resin 470. After injecting 470 into the through-hole 130, a press-fit connector may be mounted on the surface 400A side.

  As described above, in the first to fourth embodiments, the configuration in which the board units 100, 200, 300, and 400 are included in the server 500 as an electronic device has been described. However, the electronic device including the substrate units 100, 200, 300, and 400 is not limited to the server 500, and may be a PC (Personal Computer), a mobile phone terminal, a smartphone, a digital camera, a video camera, or the like.

As described above, the substrate unit and the manufacturing method of the substrate unit according to the exemplary embodiment of the present invention have been described, but the present invention is not limited to the specifically disclosed embodiment, and is claimed. Various modifications and changes can be made without departing from the scope.
Regarding the above embodiment, the following additional notes are disclosed.
(Appendix 1)
A substrate having a through-hole with a conductive wall surface that penetrates between the first surface and the second surface;
A first electronic component having a first connection pin press-fitted into the through-hole from the first surface;
A board unit comprising: a conductive member disposed in the through hole and connecting a wall surface of the through hole and the first connection pin.
(Appendix 2)
The substrate unit further includes
A second electronic component having a second connection pin press-fitted into the through-hole from the second surface;
The board unit according to claim 1, wherein the conductive member is disposed in the through hole so as to connect the first connection pin and the second connection pin.
(Appendix 3)
The board unit according to appendix 1 or 2, wherein the conductive member is a conductive resin filled in the through hole.
(Appendix 4)
The board unit according to appendix 1 or 2, wherein the conductive member is a conductive elastic member disposed in the through hole.
(Appendix 5)
The board unit according to appendix 4, wherein the conductive member is a conductive coil spring.
(Appendix 6)
The board unit according to appendix 4, wherein the conductive member is a conductive elastic pad.
(Appendix 7)
A substrate in which a through-hole having a conductive wall surface that penetrates between the first surface and the second surface is formed;
A first electronic component having a convex connection pin disposed on the first surface and press-fitted into the through-hole from the first surface;
And a second electronic component having a concave connection pin that is press-fitted from the second surface into the through hole so as to contact the convex connection pin. A board unit characterized by that.
(Appendix 8)
The board unit according to appendix 7, wherein at least one of the convex connection pin or the concave connection pin press-fitted into the through hole is crushed.
(Appendix 9)
In the method for manufacturing a substrate unit in which a through-hole penetrating between the first surface and the second surface is formed and a component is mounted,
Press-fitting a first connection pin of a first electronic component into the through hole from the first surface;
A method for manufacturing a substrate unit, comprising: placing a conductive member in the through hole so that a wall surface of the through hole and the first connection pin are in contact with each other.
(Appendix 10)
In the method for manufacturing a substrate unit in which a through-hole penetrating between the first surface and the second surface is formed and a component is mounted,
Press-fitting a convex connection pin of the first electronic component into the through-hole from the first surface;
A step of press-fitting the concave connection pin of the second electronic component into the through hole from the second surface so as to contact the convex connection pin press-fitted into the through hole; Manufacturing method of substrate unit.

100, 101, 200, 201, 300, 301, 400, 401 Substrate unit 100A, 101A, 200A, 201A, 300A, 301A, 400A, 401A Front surface 100B, 101B, 200B, 201B, 300B, 301B, 400B, 401B Back surface 111 , 112, 113, 114, 115 Insulating layer 121, 122, 123, 124 Conductive layer 130 Through hole 131 Through hole 150, 160, 350, 360, 450, 60A, 60B Press-fit connector 151, 161, 351, 361, 451 Housing 152, 162, 352, 362, 452 Connection pins 152A, 162A, 352A, 362A, 452A Tip portion 152B, 162B Terminal portion 170 Coil spring 270 Conductive elastic pad 451A Recess 452B Connector section 467 cable connector 467A housing 468 connector part 470 conductive resin 480 syringe 500 servers 510A, 510B chassis 520 switch modules 600 ₁ to 600 _n blade 610 CPU
621, 622, 623, 624 Memory 630 Communication LSI
650, 660 bus

Claims (10)

A substrate having a through-hole with a conductive wall surface that penetrates between the first surface and the second surface;
A first electronic component having a first connection pin press-fitted into the through-hole from the first surface;
A board unit comprising: a conductive member disposed in the through hole and connecting a wall surface of the through hole and the first connection pin. The substrate unit further includes
A second electronic component having a second connection pin press-fitted into the through-hole from the second surface;
The board unit according to claim 1, wherein the conductive member is disposed in the through hole so as to connect the first connection pin and the second connection pin.   The substrate unit according to claim 1, wherein the conductive member is a conductive resin filled in the through hole.   The substrate unit according to claim 1, wherein the conductive member is a conductive elastic member disposed in the through hole.   The board unit according to claim 4, wherein the conductive member is a conductive coil spring.   The board unit according to claim 4, wherein the conductive member is a conductive elastic pad. A substrate in which a through-hole having a conductive wall surface that penetrates between the first surface and the second surface is formed;
A first electronic component having a convex connection pin disposed on the first surface and press-fitted into the through-hole from the first surface;
And a second electronic component having a concave connection pin that is press-fitted from the second surface into the through hole so as to contact the convex connection pin. A board unit characterized by that.   8. The substrate unit according to claim 7, wherein at least one of the convex connection pin or the concave connection pin press-fitted into the through hole is crushed. In the method for manufacturing a substrate unit in which a through-hole penetrating between the first surface and the second surface is formed and a component is mounted,
Press-fitting a first connection pin of a first electronic component into the through hole from the first surface;
A method for manufacturing a substrate unit, comprising: placing a conductive member in the through hole so that a wall surface of the through hole and the first connection pin are in contact with each other. In the method for manufacturing a substrate unit in which a through-hole penetrating between the first surface and the second surface is formed and a component is mounted,
Press-fitting a convex connection pin of the first electronic component into the through-hole from the first surface;
A step of press-fitting the concave connection pin of the second electronic component into the through hole from the second surface so as to contact the convex connection pin press-fitted into the through hole; Manufacturing method of substrate unit.

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