JP2012198049A - Attachment structure for sensor element - Google Patents

Attachment structure for sensor element Download PDF

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Publication number
JP2012198049A
JP2012198049A JP2011060880A JP2011060880A JP2012198049A JP 2012198049 A JP2012198049 A JP 2012198049A JP 2011060880 A JP2011060880 A JP 2011060880A JP 2011060880 A JP2011060880 A JP 2011060880A JP 2012198049 A JP2012198049 A JP 2012198049A
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Japan
Prior art keywords
hall element
circuit board
sensor element
lead frame
shaft
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Pending
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JP2011060880A
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Japanese (ja)
Inventor
Yoshitaro Arai
由太郎 荒井
Nagaoki Kayama
長興 嘉山
Kenji Kozuki
健次 上月
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Tokyo Keiso Co Ltd
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Tokyo Keiso Co Ltd
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Priority to JP2011060880A priority Critical patent/JP2012198049A/en
Priority to KR1020110045036A priority patent/KR20120106507A/en
Priority to CN2011101775634A priority patent/CN102679863A/en
Publication of JP2012198049A publication Critical patent/JP2012198049A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0052—Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]

Abstract

PROBLEM TO BE SOLVED: To provide a sensor element that is minimally displaced due to an influence of an ambient temperature for accurately detecting minute displacement.SOLUTION: A flat surface portion of a Hall element 12 is adhered tightly onto a cut surface 16 formed on a shaft 11 with an adhesive, so as to support a circuit board 13 in the air by a lead frame 14. Owing to this structure, even when the lead frame 14 or a solder 15 is thermally expanded, or even when the circuit board 13 is deformed, the Hall element 12 is never displaced against the shaft 11 and measurement accuracy for a rotation angle of the shaft 11 is minimally affected.

Description

本発明は、例えばホール素子等のセンサ素子の取付構造に関するものである。   The present invention relates to a mounting structure for a sensor element such as a Hall element.

金属の薄片から成る一般的なホール素子においては、図３に示すように磁束密度検出面であるチップ面Ｔに直交する磁界の磁束密度をＢとし、ホール素子１に定電流Ｉを流すと、磁束密度Ｂによりローレンツ力を受けて起電力が発生する。ホール素子１の出力Ｖは、Ｋをホール係数、ｄをホール素子の厚みとすると、次の（１）式となる。
Ｖ＝（Ｋ／ｄ）Ｂ・Ｉ …（１） In a general Hall element made of a thin piece of metal, when the magnetic flux density of a magnetic field orthogonal to the chip surface T that is a magnetic flux density detection surface is B as shown in FIG. An electromotive force is generated by receiving the Lorentz force by the magnetic flux density B. The output V of the Hall element 1 is expressed by the following equation (1), where K is the Hall coefficient and d is the thickness of the Hall element.
V = (K / d) B · I (1)

ホール素子１から成る角度センサでは、磁界方向に対するチップ面Ｔの角度を検出している。   The angle sensor composed of the Hall element 1 detects the angle of the chip surface T with respect to the magnetic field direction.

しかし、この角度等を検出するためのホール素子１は、周囲温度等により取付位置が変位することがあり、検出精度への影響が生じ易い。   However, the mounting position of the Hall element 1 for detecting this angle or the like may be displaced due to the ambient temperature or the like, and the detection accuracy is likely to be affected.

一般に図４に示すように、ホール素子１からは複数本のリードフレーム２が引き出され、半田３を介して回路基板４に固定されている。そして、例えば被固定体であるシャフト５の切削面等に取り付ける場合には、回路基板４をシャフト５に接着し、ホール素子１はリードフレーム２を介して中空に支持される。   In general, as shown in FIG. 4, a plurality of lead frames 2 are drawn out from the Hall element 1 and fixed to the circuit board 4 via solder 3. For example, when attaching to the cutting surface of the shaft 5 that is a fixed body, the circuit board 4 is bonded to the shaft 5, and the Hall element 1 is supported hollowly via the lead frame 2.

しかし、このホール素子１を用いてシャフト５の回転角度を測定する場合に、シャフト５の回転角度が極めて小さく、例えば５秒程度の分解能が必要な場合には、ホール素子１を搭載する回路基板４、半田３、リードフレーム２の熱膨張等による変形が検出精度に影響してくる。   However, when the rotation angle of the shaft 5 is measured using the Hall element 1, if the rotation angle of the shaft 5 is extremely small and, for example, a resolution of about 5 seconds is required, the circuit board on which the Hall element 1 is mounted. 4. Deformation due to thermal expansion or the like of the solder 3 and the lead frame 2 affects the detection accuracy.

つまり、回路基板４が温度により変形し易い材料であったり、リードフレーム２の長さや半田３の量に差があると、周囲温度の影響により回路基板４が反ったり、或いは図５に示すように半田３やリードフレーム２が熱膨張し、ホール素子１が傾いて変位し、高精度の測定が困難となる。   That is, if the circuit board 4 is a material that easily deforms depending on the temperature, or if there is a difference in the length of the lead frame 2 or the amount of solder 3, the circuit board 4 warps due to the influence of the ambient temperature, or as shown in FIG. Further, the solder 3 and the lead frame 2 are thermally expanded, and the Hall element 1 is tilted and displaced, which makes it difficult to measure with high accuracy.

この課題の１つの解決法として、ホール素子１のパッケージ部を回路基板４に接着し、ホール素子１が動かないようにする方法が考えられるが、熱膨張を阻害されたリードフレーム２がホール素子１のパッケージを歪ませ、この歪みがパッケージ内部の回路基板４を歪ませ、更にはホール素子１を変位させるという新たな問題が生ずる。回路基板４が歪んでも、ホール素子１が単結晶の場合には歪みが少ないが、石英ガラス上にＧａＡｓをスパッタリングしたホール素子１のような場合は歪み易いため、その影響が顕著となる。   One solution to this problem is to attach the package portion of the Hall element 1 to the circuit board 4 so that the Hall element 1 does not move. 1 is distorted, and this distortion distorts the circuit board 4 inside the package, and further causes a new problem that the Hall element 1 is displaced. Even if the circuit board 4 is distorted, if the Hall element 1 is a single crystal, the distortion is small. However, in the case of the Hall element 1 in which GaAs is sputtered on quartz glass, the distortion is likely to occur, and the influence becomes significant.

本発明の目的は、上述の問題点を解消し、センサ素子のリードフレームや、リードフレームと回路基板とを接続する半田等の熱膨張の影響を受け難くし、微小変位の検出を精度良く実施できるセンサ素子の取付構造を提供することにある。   The object of the present invention is to eliminate the above-mentioned problems, make it less susceptible to thermal expansion of the lead frame of the sensor element and the solder connecting the lead frame and the circuit board, etc., and accurately detect minute displacements. An object of the present invention is to provide a mounting structure for a sensor element.

上記目的を達成するための本発明に係るセンサ素子の取付構造は、回路基板にリードフレームを介して取り付けたセンサ素子を被固定体に取り付けるセンサ素子の取付構造において、前記被固定体に前記センサ素子の面を接着剤により接着し、前記回路基板を前記リードフレームを介して中空に支持したことを特徴とする。   In order to achieve the above object, the sensor element mounting structure according to the present invention is a sensor element mounting structure in which a sensor element mounted on a circuit board via a lead frame is mounted on a fixed body, and the sensor is mounted on the fixed body. The element surface is bonded with an adhesive, and the circuit board is supported in a hollow state via the lead frame.

本発明に係るセンサ素子の取付構造によれば、センサ素子を直接に被固定体に接着するので周囲環境の温度が変化してもセンサ素子の変位が生じ難い。   According to the sensor element mounting structure of the present invention, since the sensor element is directly bonded to the fixed body, even if the temperature of the surrounding environment changes, the sensor element is hardly displaced.

実施例１の構成図である。1 is a configuration diagram of Example 1. FIG. 実施例２の構成図である。FIG. 6 is a configuration diagram of Example 2. ホール素子の原理的構成図である。It is a principle block diagram of a Hall element. 従来のホール素子の取付方法の説明図である。It is explanatory drawing of the attachment method of the conventional Hall element. ホール素子が傾いた状態の説明図である。It is explanatory drawing of the state in which the Hall element inclined.

本発明を図１、図２に図示の実施例に基づいて詳細に説明する。   The present invention will be described in detail based on the embodiment shown in FIGS.

図１は本実施例におけるセンサ素子としてのホール素子の取付構造の構成図を示している。例えば、フロート式液面計においては、フロートの上下位置を検出して液位を検出しているが、フロートの上下動をシャフト１１の回転に変換し、シャフト１１の回転角度から液位を求めることがある。   FIG. 1 shows a configuration diagram of a mounting structure of a Hall element as a sensor element in the present embodiment. For example, in the float type liquid level gauge, the liquid level is detected by detecting the vertical position of the float, but the vertical movement of the float is converted into the rotation of the shaft 11, and the liquid level is obtained from the rotation angle of the shaft 11. Sometimes.

このシャフト１１の回転角度を検出する場合に、被固定体として非磁性体である金属製のシャフト１１にホール素子１２を取り付け、磁界中においてホール素子１２に定電流を流すことにより、ホール素子１２の出力値からホール素子１２の角度変位、つまりシャフト１１の回転角を知ることができる。   When the rotation angle of the shaft 11 is detected, the Hall element 12 is attached to a metal shaft 11 that is a non-magnetic material as a fixed body, and a constant current is passed through the Hall element 12 in a magnetic field. From the output value, the angular displacement of the Hall element 12, that is, the rotation angle of the shaft 11 can be known.

本実施例１における回路基板１３は、ホール素子１２のリードフレーム１４の膨張や収縮を阻害しないようにするために、例えば変形し易いフレキシブル基板を用い、この回路基板１３にホール素子１２は例えば４本のリードフレーム１４、半田１５を介して接続されている。   The circuit board 13 according to the first embodiment uses, for example, a flexible board that is easily deformed so as not to hinder the expansion and contraction of the lead frame 14 of the hall element 12. The lead frame 14 and the solder 15 are connected to each other.

リードフレーム１４の回路基板１３への接続に際しては、半田１５の量は均一となるようにし、回路基板１３にホール素子１２を搭載する際には、ホール素子１２に永久歪を生じさせるような外力を加えないように注意する必要がある。   When the lead frame 14 is connected to the circuit board 13, the amount of solder 15 is made uniform, and when the Hall element 12 is mounted on the circuit board 13, an external force that causes permanent distortion in the Hall element 12. Care must be taken not to add.

シャフト１１に形成した平坦な切削面１６に、ホール素子１２の表面の平担部が密着するように接着剤により接着し、回路基板１３をリードフレーム１４により中空に支持する。このとき、接着剤が熱膨張しても接着剤の厚み差によりホール素子１２の傾きが生じないように、接着剤はできる限り薄く均一に塗布することが好ましい。また、ホール素子１２は電気絶縁層によりコーティングされているが、ホール素子１２とシャフト１１の間に絶縁板等を介在してもよい。   The flat cutting surface 16 formed on the shaft 11 is bonded with an adhesive so that the flat portion of the surface of the Hall element 12 is in close contact, and the circuit board 13 is supported hollow by the lead frame 14. At this time, it is preferable to apply the adhesive as thinly and uniformly as possible so that the Hall element 12 is not inclined due to the thickness difference of the adhesive even if the adhesive is thermally expanded. The Hall element 12 is coated with an electrical insulating layer, but an insulating plate or the like may be interposed between the Hall element 12 and the shaft 11.

なお、回路基板１３上のＩＣ等の回路素子は回路基板１３の表面又は裏面或いは双方に配置してもよい。   Note that circuit elements such as ICs on the circuit board 13 may be disposed on the front surface, the back surface, or both of the circuit board 13.

更に、必要に応じて回路基板１３、ホール素子１２、リードフレーム１４の周囲には樹脂１７をモールドし、電気絶縁性等を確保すると共に、他物品の衝突から保護することが好ましい。   Furthermore, it is preferable to mold a resin 17 around the circuit board 13, the hall element 12, and the lead frame 14 as necessary to ensure electrical insulation and the like and to protect against collisions with other articles.

このような構造にすることにより、リードフレーム１４や半田１５に熱膨張が生じても、或いは回路基板１３が変形しても、シャフト１１の切削面１６に接着したホール素子１２はシャフト１１に対して変位することはなく、シャフト１１の回転角の測定精度に及ぼす影響は少ない。   With such a structure, the Hall element 12 adhered to the cutting surface 16 of the shaft 11 is attached to the shaft 11 even if thermal expansion occurs in the lead frame 14 or the solder 15 or the circuit board 13 is deformed. And the influence on the measurement accuracy of the rotation angle of the shaft 11 is small.

図２は実施例２におけるホール素子１２の取付構造の構成図を示し、実施例１と同一の部材には同一の符号を付している。   FIG. 2 is a configuration diagram of the mounting structure of the Hall element 12 in the second embodiment, and the same members as those in the first embodiment are denoted by the same reference numerals.

本実施例２においては、ホール素子１２をシャフト１１に接着し、リードフレーム１４を介して回路基板１３を中空に配置することは実施例１と同様である。   In the second embodiment, the Hall element 12 is bonded to the shaft 11 and the circuit board 13 is arranged in a hollow via the lead frame 14 as in the first embodiment.

しかし、回路基板１３にはホール素子１２を非接触で収容するための孔部１８が形成されており、ホール素子１２はこの孔部１８内に配置されている。このように構成することにより、全体として高さが低くなり、構造的に安定する。また、これらの上に樹脂１７をモールドすることが好ましいことは、実施例１と同様である。   However, the circuit board 13 has a hole 18 for receiving the Hall element 12 in a non-contact manner, and the Hall element 12 is disposed in the hole 18. By comprising in this way, height becomes low as a whole and it becomes structurally stable. Further, it is preferable to mold the resin 17 on these, as in the first embodiment.

本実施例１、２においては、センサ素子として角度を検出するためのホール素子を用いて説明したが、ホール素子以外にも、磁気抵抗素子、装着位置関係の安定性を要求する他の位置検出センサ、更にはセンサに光を供給するための光ダイオード等にも適用可能である。   In the first and second embodiments, the Hall element for detecting the angle is used as the sensor element. However, in addition to the Hall element, other position detections that require stability of the magnetoresistive element and the mounting position relationship. The present invention can also be applied to a sensor, and further to a photodiode for supplying light to the sensor.

１１ シャフト
１２ ホール素子
１３ 回路基板
１４ リードフレーム
１５ 半田
１６ 切削面
１７ 樹脂
１８ 孔部 DESCRIPTION OF SYMBOLS 11 Shaft 12 Hall element 13 Circuit board 14 Lead frame 15 Solder 16 Cutting surface 17 Resin 18 Hole

Claims (4)

回路基板にリードフレームを介して取り付けたセンサ素子を被固定体に取り付けるセンサ素子の取付構造において、前記被固定体に前記センサ素子の面を接着剤により接着し、前記回路基板を前記リードフレームを介して中空に支持したことを特徴とするセンサ素子の取付構造。   In a sensor element mounting structure in which a sensor element attached to a circuit board via a lead frame is attached to a fixed body, a surface of the sensor element is bonded to the fixed body with an adhesive, and the circuit board is attached to the lead frame. A sensor element mounting structure characterized in that the sensor element is supported hollowly. 前記回路基板はフレキシブル基板としたことを特徴とする請求項１に記載のセンサ素子の取付構造。   The sensor circuit mounting structure according to claim 1, wherein the circuit board is a flexible board. 前記回路基板に孔部を形成し、前記センサ素子を前記孔部内に非接触で収容することを特徴とする請求項１又は２に記載のセンサ素子の取付構造。   The sensor element mounting structure according to claim 1, wherein a hole is formed in the circuit board, and the sensor element is accommodated in the hole without contact. 前記センサ素子、回路基板、リードフレームを樹脂によりモールドしたことを特徴とする請求項１又は２又は３に記載のセンサ素子の取付構造。   The sensor element mounting structure according to claim 1, wherein the sensor element, the circuit board, and the lead frame are molded with resin.
JP2011060880A 2011-03-18 2011-03-18 Attachment structure for sensor element Pending JP2012198049A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011060880A JP2012198049A (en) 2011-03-18 2011-03-18 Attachment structure for sensor element
KR1020110045036A KR20120106507A (en) 2011-03-18 2011-05-13 Mounting structure of sensing element
CN2011101775634A CN102679863A (en) 2011-03-18 2011-06-29 Installation structure of sensor elements

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JP2011060880A JP2012198049A (en) 2011-03-18 2011-03-18 Attachment structure for sensor element

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KR (1) KR20120106507A (en)
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514707U (en) * 1978-07-14 1980-01-30
JPH08236584A (en) * 1995-02-28 1996-09-13 Texas Instr Japan Ltd Semiconductor device
JP2000241696A (en) * 1999-02-17 2000-09-08 Canon Inc Holding/mounting method for optical sensor package

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112006001393B4 (en) * 2005-06-30 2010-01-28 Murata Mfg. Co., Ltd., Nagaokakyo-shi Detecting device and rotation angle sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514707U (en) * 1978-07-14 1980-01-30
JPH08236584A (en) * 1995-02-28 1996-09-13 Texas Instr Japan Ltd Semiconductor device
JP2000241696A (en) * 1999-02-17 2000-09-08 Canon Inc Holding/mounting method for optical sensor package

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CN102679863A (en) 2012-09-19
KR20120106507A (en) 2012-09-26

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