JP2012195397A - Manufacturing method of component built-in substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component built-in substrate with excellent productivity.SOLUTION: A film sticking step 41a sticks a peelable adhesive film 47 to an upper surface of a large-size wiring board 45 or a lower surface of a large-size wiring board 46 or to both the upper surface of the large-size wiring board 45 and the lower surface of the large-size wiring board 46. A resin part formation step 42 after this step forms a resin part 35 between the large-size wiring board 45 and the large-size wiring board 46. A removal step 43 after this step removes a removal part and then removes the adhesive film 47 in the position corresponding to the removal part while simultaneously disconnecting a wiring board 32 from the large-size wiring board 45 and a wiring board 36 from the large-size wiring board 46. A peeling step 44 after this step simultaneously removes the adhesive film 47 and the resin part, thereby achieving manufacturing of a component built-in substrate with excellent productivity.

Description

  The present invention relates to a component-embedded substrate in which electronic components are mounted on a substrate and these electronic components are sealed with resin.

  Hereinafter, a conventional component-embedded substrate 1 will be described with reference to the drawings. FIG. 12 is a cross-sectional view of a conventional component-embedded substrate 1. In the conventional component built-in substrate 1, an electronic component 3 a is mounted on the upper surface side of the wiring substrate 2. A wiring board 4 is provided above the wiring board 2 and is arranged so that the wiring board 4 and the wiring board 2 face each other. Between the wiring board 4 and the wiring board 2, a resin part 5 in which an electronic component 3a is embedded is formed. The resin portion 5 is made of a thermosetting resin. The base material part 6 is provided so as to surround the resin part 5 between the wiring board 2 and the wiring board 4.

  In such a conventional component-embedded substrate 1, the connection between the wiring substrate 2 and the wiring substrate 4 is made through the through hole 7. Therefore, the through hole 7 is formed at a position corresponding to the base material portion 6 and is formed through the wiring board 2, the wiring substrate 4, and the base material portion 6.

  Next, a method for manufacturing such a component-embedded substrate 1 will be described with reference to the drawings. FIG. 13 is a manufacturing flowchart of the conventional component-embedded substrate 1. In the mounting process 11, the electronic component 3 a is mounted on the upper surface of the wiring board 2. In addition, on the upper surface of the wiring board 2 in this process, a wiring pattern, pads for mounting the electronic component 3a, through holes (not shown) for connecting the upper and lower surfaces of the wiring board 2 and the like are formed in advance. . On the other hand, a copper foil is formed on the entire lower surface of the wiring board 2. That is, the wiring pattern is not formed.

  FIG. 14 is a cross-sectional view of a component-embedded substrate in a conventional lamination process. 13 and 14, the laminating step 12 is a step of laminating a plurality of prepregs 13 on the wiring substrate 2 after the mounting step 11 and further laminating the wiring substrate 4 on the laminated prepregs 13. is there. Here, in the prepreg 13, a hole 14 a is formed in advance in a position corresponding to the electronic component 3 a in the hole processing step 14. In the laminating step 12, the prepreg 13 is laminated so that the electronic component 3a is disposed in the hole 14a. Note that a wiring pattern, a through hole (not shown) for connecting the upper and lower surfaces of the wiring substrate 4 and the like are formed in advance on the lower surface of the wiring substrate 4 in this step. On the other hand, a copper foil is formed on the entire upper surface of the wiring board 4. That is, the wiring pattern is not formed.

  The resin part forming step 15 is a step of forming the resin part 5 and the base material part 6 by heating and compressing from above and below in the state of being laminated in the lamination process 12. The resin of the prepreg 13 that has been heated and softened to a flowable state flows into the hole 14a by a compressive force. Then, by further heating, the resin that is a thermosetting resin is cured. And by this resin part formation process 15, the inside of the hole 14a is filled with the hardened resin, and the resin part 5 in which the electronic component 3a is embedded is formed, and at the same time, the base materials of the prepreg 13 are bonded to each other by the resin. Thereby, the base material part 6 will be formed.

  Here, due to the compression in the resin portion forming step 15, the resin not only flows into the hole 14 a but also overflows to the outside of the wiring board 2. Therefore, in FIG. 13, a cutting process 16 is a process of cutting unnecessary resin that overflows to the outside of the wiring board 4 after the resin portion forming process 15.

  And the component built-in board | substrate 1 of a state which has copper foil on the upper and lower surfaces is completed by such a method. After that, through holes 7 and upper and lower wiring patterns are formed by a normal printed circuit board manufacturing process. That is, in the through-hole forming step 17, via holes penetrating the wiring board 2, the wiring board 4, and the base material portion 6 are formed by drilling or the like, and then copper plating is performed on the inner peripheral surface of the via hole. A through hole 7 for connecting the wiring board 2 and the wiring board 4 is formed. In the wiring pattern forming step 18, after the through-hole forming step 17, unnecessary portions of the copper foil are removed by etching or the like, and a wiring pattern having a required shape is formed on the upper and lower surfaces of the component-embedded substrate 1. Thus, the component built-in substrate 1 is completed.

  As prior art document information related to the invention of this application, for example, Patent Document 1 is known.

JP 2005-158770 A

  However, in the conventional method for manufacturing a component-embedded substrate, the prepreg 13 is very soft (in a state where it is in various states), and it takes time to stack a number of such soft prepregs 13 in the stacking step 12. In particular, in the conventional manufacturing method, since it is necessary to stack the prepreg 13 with high positional accuracy so that the electronic component 3a can be accommodated in the hole 14a, automation or the like becomes difficult. Further, the component-embedded substrate 1 is completed after the resin portion forming step 15, after the through hole forming step 17 for connecting the wiring substrate 2 and the wiring substrate 4, the wiring pattern forming step 18, and the like. A process is required. As a result, the conventional method for manufacturing the component-embedded substrate 1 has a problem that it takes time to manufacture the component-embedded substrate 1, the productivity is poor, and the manufacturing cost of the component-embedded substrate 1 increases.

  Accordingly, the present invention has been made to solve this problem, and an object thereof is to provide an inexpensive component-embedded substrate.

  In order to achieve this object, in the step of forming the resin portion, a peelable adhesive film is applied to at least one of the lower surface of the first large-sized wiring substrate and the upper surface of the second large-sized wiring substrate. It is provided after the process. Then, after the step of forming the resin portion, the removed portions of the first and second large-sized wiring boards are cut out, and the first and second wiring boards are removed from the first and second large-sized wiring boards. At the same time, the adhesive film at the position corresponding to the removal portion is also cut off. And after this process, the resin formed on the said adhesive film in the process of forming the said resin part is removed simultaneously by removing the said adhesive film. As a result, the intended purpose can be achieved.

  As described above, according to the present invention, the first wiring board on which the conductor layers are formed on at least both surfaces, the second wiring board disposed above the first wiring board, and the first wiring An electronic component mounted on at least one of the upper surface of the substrate and the lower surface of the second wiring substrate, and a connection body for electrically connecting the first and second wiring substrates; In a method of manufacturing a component-embedded board provided between the first and second wiring boards and including the connection body and the resin part in which the electronic component is embedded, at least the first and second large-sized wiring boards A step of mounting the electronic component on one of the two and mounting the connecting body on one of the first and second large-sized wiring boards, and the first and second large-sized wirings after this step. Mount the board in such a direction that the electronic components are facing inward. A step of connecting the first and second large-sized wiring boards through the connecting body, and then filling at least the resin between the first and second large-sized wiring boards, A step of forming the resin portion embedded in the resin, and a removal portion provided in the first and second large-sized wiring boards after the step is cut out, and the first and second large-sized wiring substrates are formed. Separating the first and second wiring boards from each other, and at least before the step of forming the resin portion, the lower surface of the first large wiring board and the upper surface of the second large wiring board are formed. A step of attaching a peelable adhesive film to at least one of them is provided, and a step of removing the adhesive film is provided after the step of excising the removal portion to form the resin portion. In the process, the adhesive with the resin The film is covered, and in the step of removing the removal portion, the adhesive film at the position corresponding to the removal portion is simultaneously removed, and in the step of removing the adhesive film, the adhesive film and the adhesive property are removed. The resin covering the film is removed at the same time, whereby the resin portion can be easily formed, and a step of separately connecting the first and second wiring boards is not required. Therefore, a method for manufacturing a component-embedded substrate with good productivity can be realized, and an inexpensive component-embedded substrate can be obtained.

(A) Sectional view of component built-in substrate in Embodiment 1, (b) Same as above, enlarged cross-sectional view of main part of component-embedded substrate Same as above, manufacturing flowchart of component built-in board Side view of the component built-in board in the assembly process Same as above, sectional view of component-embedded substrate in resin part forming process Cross-sectional view of the component built-in board in the cutting process Side view of the component built-in board in the peeling process Schematic sectional view of the resin part forming apparatus Manufacturing flowchart of resin part forming process Sectional view of resin part forming device in softening process Sectional view of the resin part forming device in the dipping process Sectional view of the resin part forming apparatus in the compression inflow process Sectional view of a conventional component-embedded substrate Same as above, manufacturing flowchart of component built-in board Cross-sectional view of component built-in board in the same lamination process

  A method for manufacturing the component-embedded substrate in the present embodiment will be described below.

(Embodiment 1)
Hereinafter, the component-embedded substrate 31 in the present embodiment will be described with reference to the drawings. FIG. 1A is a cross-sectional view of the component built-in substrate 31 in the present embodiment, and FIG. 1B is an enlarged cross-sectional view of the main part of the component built-in substrate 31. 1A and 1B, a wiring pattern 32a is wired on the upper surface of the wiring board 32, and an electronic component 3a is mounted on the wiring pattern 32a. On the other hand, a wiring pattern 32 b is formed on the lower surface of the wiring substrate 32. In the present embodiment, the wiring substrate 32 is a four-layer substrate having a thickness of 0.5 mm, and the electronic component 3a includes a semiconductor element and a chip component. The semiconductor is flip-chip mounted on the wiring board 32 face down.

  An electronic component 3 a is embedded in the resin portion 35. In the present embodiment, an epoxy resin of a thermosetting resin is used for the resin 35a (shown in FIG. 2) of the resin portion 35. Here, a wiring board 36 is provided on the upper surface of the resin portion 35 (above the wiring board 32), and the wiring board 36 and the wiring board 32 are arranged to face each other. With this configuration, the resin portion 35 is formed between the wiring board 32 and the wiring board 36. Here, a wiring pattern 36 a is formed on the upper surface of the wiring substrate 36. In the present embodiment, a double-sided board having a thickness of 0.1 mm is used as the wiring board 36. Therefore, the price is low, so that a low-cost component-embedded board 31 can be realized.

  In the present embodiment, the electronic component 3a is mounted on the wiring board 32, but it may be mounted on the wiring board 36 side. However, in that case, it is desirable to make the thickness of the wiring board 36 on which the electronic component 3 a is mounted thicker than the wiring board 32.

  In the present embodiment, one end of the spacer 37 (used as an example of a connection body) is fixed to the wiring board 36 and the other end is fixed to the wiring board 32. The spacer 37 in the present embodiment has a quadrangular prism shape, but this may be a shape having flat portions on the upper and lower surfaces such as a cylindrical shape. The spacer 37 is also embedded in the resin portion 35 in the same manner as the electronic component 3a. However, the height of the spacer 37 is set higher than the height of the electronic component 3 a mounted on the wiring board 32. That is, the resin portion 35 is also interposed between the electronic component 3 a and the wiring board 36. In the present embodiment, connection pads 32c and connection pads 36b are formed at positions where the spacers 37 are mounted on the wiring board 32 and the wiring board 36, respectively. The spacers 37, the connection pads 32c, and the spacers 37 are formed. And the connection pad 36 b are connected by solder 38. As a result, the wiring board 32 (an electronic circuit formed of the electronic component 3 a or the like) and the wiring board 36 are electrically connected via the spacer 37. The upper and lower surfaces of the wiring board 32 and the wiring board 36 are connected by through holes (not shown).

  In addition, the spacer 37 in this Embodiment is resin, and the connection pad 37a is formed in the upper and lower surfaces of the spacer 37, respectively. Thereby, the connection between the connection pad 32c and the connection pad 37a and the connection pad 36b and the connection pad 37a are connected by the solder 38. The upper and lower connection pads 37a of the spacer 37 are electrically connected by a conductor (for example, a through hole). Here, in the present embodiment, the resin spacer 37 is used, but a metal piece (for example, formed by cutting a metal plate such as brass) or a metal ball made of copper or the like may be used. It doesn't matter. Since conductive metal pieces and balls are thus very inexpensive, an inexpensive component-embedded substrate 31 can be obtained. Here, cut surfaces 39 are formed on the four side surfaces of the component-embedded substrate 31.

  Next, a manufacturing method of the component built-in substrate 31 in the present embodiment will be described with reference to the drawings. FIG. 2 is a manufacturing flowchart of the component built-in substrate in the present embodiment. 2, the same reference numerals are used for the same components as those in FIG. 1, and the description thereof is simplified. The manufacturing method of the component-embedded substrate 31 includes an assembly process 41, a resin part forming process 42, a cutting process 43, and a peeling process 44, which are performed in the order shown in FIG. Here, the case where the electronic component 3a is mounted on the wiring board 32 side will be described as a representative, and the case where the electronic component 3a is mounted on the wiring board 36 side will be omitted. However, when the electronic component 3a is mounted on the wiring board 36 side, the wiring board 32 and the wiring board 36 are interchanged in the following description.

  FIG. 3 is a side view of the component-embedded substrate in the assembly process. In FIG. 3, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is simplified. 2 and 3, the large-sized wiring board 45 has a wiring board 32 and a removing portion 45a (shown in FIG. 5). On the other hand, the large-sized wiring board 46 includes a wiring board 36 and a removal portion 46a (shown in FIG. 5). The removal portion 45 a is connected to the outer periphery of the wiring substrate 32, and the removal portion 46 a is connected to the outer periphery of the wiring substrate 36.

  First, the assembling step 41 is a step of electrically connecting the large-sized wiring board 45 and the large-sized wiring board 46 via the spacers 37. Here, the spacers 37 may be arranged discretely without being concentrated in one place. In the present embodiment, the large-sized wiring board 45, the large-sized wiring board 46, and the spacer 37 are connected by reflow soldering. At this time, the large-sized wiring board 45 (wiring board 32) and the large-sized wiring board 46 (wiring board 36) are arranged in a direction in which the electronic component 3a faces inward in the component-embedded substrate 31. Here, a wiring pattern 32b is preliminarily wired on the wiring board 32 in the present embodiment, and the wiring pattern 32b is connected to the connection pad 32c or the wiring pattern 32a through a through hole (not shown). On the other hand, a wiring pattern 36a is also formed in advance on the wiring board 36, and the wiring pattern 36a and the connection pad 36b are also connected by a through hole (not shown). Therefore, in this step, the large-sized wiring board 45 and the large-sized wiring board 46 are arranged so that both the wiring pattern 32b and the wiring pattern 36a are outside.

  FIG. 4 is a cross-sectional view of the component-embedded substrate in the resin portion forming step. In FIG. 4, the same components as those in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is simplified. As shown in FIG. 2, the resin part forming step 42 is performed after the assembly step 41. In this resin part forming step 42, after filling the soft thermosetting resin 35a between the large-sized wiring board 45 and the large-sized wiring board 46, the resin part 35a is heated and cured to thereby form the resin part 35. Is a step of forming. Here, since the spacers 37 are discretely mounted, the resin 35a passes between the spacers 37 in the resin portion forming step 42, and the large-sized wiring board 45 and the large-sized wiring board 46 (the wiring board 36 and the wiring board 32). ) Is easily filled. In the present embodiment, a method of forming the resin part 35 using a resin part forming apparatus 51 (shown in FIG. 7) described later is used (this will be described in detail later). A molding method such as vacuum printing may be used.

  FIG. 5 is a cross-sectional view of the component built-in substrate in the cutting process. In FIG. 5, the same components as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is simplified. The cutting step 43 is performed after the resin portion forming step 42 as shown in FIG. In this excision process 43, as shown in FIG. 5, the removal part 45a and the removal part 46a which become unnecessary are excised. At this time, an unnecessary resin portion 35b formed between the removal portion 45a and the removal portion 46a or on the outside of the large-sized wiring substrate 45 (or the large-sized wiring substrate 46) is also cut off at the same time, so The part 35b is cut off. As a result, the wiring substrate 32 and the wiring substrate 36 are separated from the large-sized wiring substrate 45 and the large-sized wiring substrate 46, respectively, and a cut surface 39 is formed on the side surface of the component-embedded substrate 31. As a result, it is processed into a desired size and shape, and the outer shape of the component-embedded substrate 31 is formed.

  In the cutting step 43, a dicing tooth, a press die, or the like is used as a cutting tool for cutting off unnecessary portions. And the position (area | region) cut | disconnected with these cutting tools in the wiring board 32 or the wiring board 36 is desirable to set it as the copper foil non-formation part. Thereby, since a cutting tool does not cut | disconnect copper foil, the lifetime of a cutting tool can be lengthened. Further, it is possible to make it difficult for copper foil burrs to occur on the side surface (cut surface 39) of the component-embedded substrate 31.

  Here, originally, in the resin part forming step 42, the resin part 35 may be formed between the wiring board 32 and the wiring board 36. However, in general, in such a resin portion forming step 42, the resin 35a adheres to the wiring pattern 32b side of the large-sized wiring board 45 (or the wiring pattern 36a side of the large-sized wiring board 46), and the wiring pattern 32b (or wiring) The pattern 36a) is covered with the resin 35a. Alternatively, the resin 35a may adhere to both the wiring pattern 32b side and the wiring pattern 36a side, and the wiring pattern 32b and the wiring pattern 36a may be covered with the resin 35a.

  Therefore, in the present invention, in order to prevent the wiring pattern 32b and the wiring pattern 36a from being covered with the resin 35a in the resin portion forming step 42, the wiring pattern 32b, the wiring pattern 36a, or the wiring pattern 36a and the wiring are formed before the resin portion forming step 42. A peelable adhesive film 47 (also referred to as a low adhesive film or a re-peeling film) is pasted on both of the patterns 32b. That is, in the resin part forming step 42, if only the wiring pattern 32b side is covered with the resin 35a, the adhesive film 47 may be attached only to the wiring pattern 32b side. Conversely, if only the wiring pattern 36a side is covered with the resin 35a, the adhesive film 47 may be attached only to the wiring pattern 36a side. If both the wiring pattern 32b and the wiring pattern 36a are covered with the resin 35a, the adhesive film 47 is attached to both the surface on which the wiring pattern 32b and the wiring pattern 36a are formed.

  At this time, the adhesive film 47 is made larger than the wiring substrate 32 (or the wiring substrate 36) to be attached. That is, the adhesive film 47 covers the entire surface of the wiring board 32 on the wiring pattern 32b side (or the wiring pattern 36a side of the wiring board 36), and further removes the removal portion 45a (or removal portion) from the wiring board 32 (or wiring board 36). 46a) (extending). In the present embodiment, the size of the adhesive film 47 is almost the same size as the large-sized wiring board 45 (or the large-sized wiring board 46) to be attached.

  Here, the adhesive film 47 is composed of a base material and a low adhesive strength adhesive applied on the base material, and the adhesive is heated in the assembly process 41 and the resin part forming process 42. It is possible to maintain adhesiveness to the extent that it can be peeled without being cured even after the addition of. In the present embodiment, it is desirable to use a flexible base material for the base material of the adhesive film 47. Furthermore, since heat is applied to the adhesive film 47 (base material) in the assembly process 41, the resin part forming process 42, etc., heat-resistant PET or the like is used.

  However, if the resin part forming step 42 is performed with the adhesive film 47 attached, the adhesive film 47 is covered with the resin 35a (the resin part 35c is formed), and the adhesive film 47 may be peeled off. become unable. At this time, it is desirable to make the thickness of the resin portion 35c as thin as possible. Therefore, in the present invention, the adhesive film 47 is made larger than the wiring substrate 32 (or the wiring substrate 36), and is sized so as to extend from the wiring substrate 32 to the removal portion 45a. Thereby, in the cutting | disconnection process 43, the adhesive film 47 and the resin part 35c of the position corresponding to the removal part 45a (or removal part 46a) are also cut off.

  FIG. 6 is a side view of the component built-in substrate in the peeling process. In FIG. 6, the same components as those in FIGS. 1 to 5 are denoted by the same reference numerals, and the description thereof is simplified. As shown in FIG. 2, the peeling process 44 is performed after the cutting process 43. In the peeling process 44, the adhesive film 47 is removed from the wiring board 32 (or the wiring board 36) as shown in FIG. However, the unnecessary resin part 35c on the adhesive film 47 is also removed at this time. Thereby, the wiring pattern 32b (or the wiring pattern 36a) is exposed, and the component built-in substrate 31 is completed. Here, in the cut state in the cutting step 43, the adhesive film 47 and the wiring board 32 (or the wiring board 36) are bonded to each other with a peelable adhesive. Therefore, in the peeling process 44, if the adhesive film 47 is peeled from the wiring substrate 32 (or the wiring substrate 36), the adhesive film 47 and the unnecessary resin portion 35c can be easily removed. In addition, since the adhesive film 47 in this Embodiment has flexibility, since the adhesive film 47 can be easily peeled off by pinching the edge of the adhesive film 47 with a finger or the like and peeling it off, The adhesive film 47 and the unnecessary resin part 35c can be easily removed.

  If the manufacturing method as described above is used, the resin portion 35 can be easily formed without laminating the prepreg 13. For example, transfer molding, vacuum marking, and the molding method shown in the present embodiment, etc. Since the component-embedded substrate 31 can be obtained using a molding method with good productivity, an inexpensive component-embedded substrate 31 can be obtained. Further, since the wiring board 32 and the wiring board 36 are electrically connected by the spacer 37, it is not necessary to separately form the through hole 7 for connecting the wiring board 32 and the wiring board 36 as in the prior art. Therefore, it is possible to realize an inexpensive component-embedded substrate 31 with higher productivity.

  Next, the assembly process 41 in the present embodiment will be described in detail. The assembly process 41 includes a film sticking process 41a, a mounting process 41b, and a connection process 41c. In the present embodiment, as shown in FIG. 2, a film attaching step 41a for attaching the adhesive film 47 to the wiring pattern 32b (or the wiring pattern 36a) is first performed. Thereby, since the adhesive film 47 is affixed before the mounting process 41b, the wiring pattern 32b can be protected by the adhesive film 47 in each process after the mounting process 41b. Dirt, scratches and disconnection can be made difficult to occur.

  In the mounting step 41b, after the film attaching step 41a, on the large-sized wiring board 45 (or the large-sized wiring board 46), the surface side on which the wiring pattern for mounting the electronic component 3a and the connection pads 32c are formed (the wiring in FIG. 1). A cream-like solder 38 is applied to the upper surface of the substrate 32 or the lower surface of the wiring substrate 36, and the electronic component 3a is mounted by a component mounting machine or the like. In the present embodiment, cream solder 38 is printed on the wiring pattern 32a and the connection pad 32c, the electronic component 3a is mounted on the wiring pattern 32a, and the spacer 37 is mounted on the connection pad 32c. The electronic component 3 a and the spacer 37 are connected to the wiring board 32 by performing reflow heating. In the present embodiment, since the spacer 37 is mounted simultaneously with the mounting of the electronic component 3a in the electronic component mounting step 41b, the productivity is very good.

  The connection process 41c is a process of connecting the wiring board 36 and the wiring board 32 after the mounting process 41b. Specifically, the solder paste 38 is applied to the connection pads 36b of the wiring board 36, and then the wiring board 32 on which the spacers 37 are mounted is mounted and heated, whereby the wiring board 32, the wiring board 36, and Are electrically connected to each other through the spacer 37 (the assembly step 41 thus completed is hereinafter referred to as an assembled component built-in substrate 31a).

  At this time, in order to reduce the warp of the component built-in board 31, the large-sized wiring board 45 is mounted on the large-sized wiring board 46 and soldered (heated) on the metal pallet 49 in the connection step 41c. Here, the bottom surface of the pallet 49 on which the large-sized wiring board 46 is placed is flat. Here, the large-sized wiring board 46 is mounted on the bottom surface of the pallet 49 with the connection pads 36b facing upward. On the large-sized wiring board 46, the large-sized wiring board 45 on which the spacers 37 are already mounted is mounted with the spacers 37 (connection pads 37a) and the connection pads 36b facing each other (the electronic component 3a faces inward). . In this state, the large-sized wiring board 46 and the large-sized wiring board 45 are pressed from above the large-sized wiring board 45 by the pressurizing body 48 while being mounted on the pallet 49. And it heats with this pressurization state, and the large format wiring board 46 and the large format wiring board 45 are connected through the spacer 37. FIG. By doing so, the large-sized wiring board 45 and the large-sized wiring board 46 are made to follow the plane of the pallet 49, and the warp of the large-sized wiring board 45 and the large-sized wiring board 46 (component built-in board 31) can be reduced.

  In the present embodiment, the pressurizing body 48 is a metal weight mounted on the upper side of the large-sized wiring board 45, and the lower surface of this weight is also flat. And with this weight mounted, it is put into a reflow furnace and heated. In this embodiment, since the spacer 37 is made of resin, the resin portion of the spacer 37 also serves as a stopper, and the space between the large-sized wiring board 45 and the large-sized wiring board 46 is restricted so as not to become small. is doing. Further, the same effect is obtained when a metal ball or a metal piece that does not melt by reflow heating is used as the spacer 37.

  In the present embodiment, since a double-sided (or multi-layer) board is used for the wiring board 36, electronic components (not shown) can be mounted on the lower surface side of the wiring board 36. As a result, a smaller component-embedded substrate 31 can be realized. This can be realized by mounting electronic components on the wiring board 36 before mounting the wiring board 32 on the wiring board 36 in the connection step 41c. In this case, if an electronic component is mounted on the large-sized wiring board 46 and the large-sized wiring board 45 is mounted, then the electronic component and the large-sized wiring board 45 (spacer 37) are simultaneously reflow-soldered. It is. Of course, a step of mounting electronic components on the large-sized wiring substrate 46 may be provided before the connecting step 41c, and the electronic components may be reflow soldered to the large-sized wiring substrate 45 in advance. In the connection step 41c in the present embodiment, the spacer 37 is mounted on the wiring board 32 in the mounting step 41b. However, the spacer 37 may be fixed to a predetermined position on the wiring board 36 in advance.

  In the present embodiment, the film sticking step 41 a is performed at the beginning of the assembly step 41. In this case, at least three heat histories are added to the adhesive of the adhesive film 47 until the component-embedded substrate 31 is completed. Therefore, the adhesive force of the adhesive may be deteriorated by such repeated heating. This is likely to occur, for example, when a high melting point solder is used for the solder 38 or when a high melting point resin is used for the resin 35a. In such a case, in the worst resin portion forming step 42, the peripheral portion of the adhesive film 47 may be peeled off, and the resin 35a may adhere to this portion. Therefore, in order to reduce the occurrence of such peeling, the film attaching step 41a is preferably performed between the connecting step 41c and the resin portion forming step. According to this, since the heat history concerning the adhesive film 47 can be made once, it is difficult for the adhesive film 47 to be peeled off in the resin part forming step 42. In any case, the film adhering step 41a may be performed at least before the resin portion forming step 42. Therefore, the film adhering step 41a may be performed between the mounting step 41b and the connecting step 41c. Even in this case, the heat history applied to the adhesive can be reduced. In this way, when the film attaching step 41a is performed after the mounting step 41b, in order to prevent the adhesive film 47 from peeling off in the resin portion forming step 42, washing or the like is performed before attaching the adhesive film 47. It is desirable to do.

  Next, the resin part formation process 42 used in this Embodiment is demonstrated in detail using drawing. First, the resin part forming apparatus 51 used for forming the resin part 35 in the resin part forming step 42 of the present embodiment will be described. FIG. 7 is a schematic cross-sectional view of the resin part forming apparatus in the present embodiment, FIG. 8 is a manufacturing flowchart of the resin part forming process in the present embodiment, and FIG. 9 is a cross section of the resin part forming apparatus in the softening process. FIG. 7 to 9, the same reference numerals are used for the same components as in FIGS. 1 to 6, and the description thereof is simplified. 7 and 9, the surface on the upper side of the assembled component built-in substrate 31 a in a state where the assembled component built-in substrate 31 a is installed in the resin part forming apparatus 51, in the following embodiments, in the installed state. It is called the top surface. Conversely, in the state where the assembled component built-in substrate 31a is installed in the resin part forming apparatus 51, the surface that is the lower side of the assembled component built-in substrate 31a is referred to as the lower surface in the installed state in the following embodiments.

  The mounting part 52 is configured to mount the assembled component built-in substrate 31a, and is configured to adsorb the assembled component built-in substrate 31a to the mounting surface (lower surface) of the mounting unit 52. Specifically, since the upper surface in the installed state is directly adsorbed by the mounting portion 52, there is no gap between the upper surface in the installed state and the mounting portion 52, and the resin 35a does not enter. As a result, the resin 35a does not adhere to the upper surface in the installed state, and therefore it is not necessary to attach the adhesive film 47 to the upper surface in the installed state. Thereby, in the film sticking process 41a, it is not necessary to stick the adhesive film 47 on the upper surface side in the installation state, and the adhesive film 47 may be attached only to one side. Since the number of steps for attaching the adhesive film 47 in the film attaching step 41a can be shortened, productivity is improved. That is, in the resin part forming step 42 in the present embodiment, the adhesive film 47 may be attached only to at least one of the large size wiring substrate 45 and the large size wiring substrate 46 in the film attaching step 41a. Then, the assembled component built-in substrate 31a is mounted on the mounting portion 52 in such a direction that the side on which the adhesive film 47 is attached faces downward.

  In the present embodiment, the adhesive film 47 may be attached to the surface on either side of the wiring pattern 32b or the wiring pattern 36a. Here, the case where the wiring pattern 36a side of the large-sized wiring board 46 is mounted on the mounting portion 52 will be described as a representative. That is, in this case, the assembled component built-in substrate 31a is placed on the mounting portion 52 so that the surface on the wiring pattern 32b side is the upper surface in the mounted state and the surface on the wiring pattern 36a side is the lower surface in the mounted state. The That is, the assembled component built-in board 31a is placed in a direction in which the large-sized wiring board 45 faces downward. Therefore, in the film pasting step 41a in the present embodiment, the adhesive film 47 is not pasted on the wiring pattern 36a side of the large format wiring board 46, and only the wiring pattern 32b side of the large format wiring board 45 is tacky. A film 47 is pasted.

  Here, the wiring pattern 36a side is mounted on the mounting portion 52, but this is an assembled part so that the adhesive film 47 is attached to the wiring pattern 36a side and the wiring pattern 32b side is the upper side in the mounted state. The built-in substrate 31a may be mounted on the mounting portion 52. In this case, the adhesive film 47 may not be attached to the wiring pattern 32b side. In any of these cases, when it is desired to prevent the wiring pattern (32b or 36a) on the upper side in the mounted state from being stained or missing, the wiring pattern (32b or 36a) on the upper side in the mounted state is prevented. Also, an adhesive film 47 may be attached.

  Below the mounting portion 52, there is provided a resin tank 53 having an opening on the upper side and a space into which the resin 35a is poured. Here, the resin tank 53 is movable in the vertical direction. Further, the bottom 53a of the resin tank 53 has a structure that can move independently in the vertical direction (the arrow direction in FIG. 9) independently of the movement of the entire resin tank 53. The mounting portion 52 and the resin tank 53 are provided with heating means (not shown), and the resin 35a (and the wiring board 36 and the wiring board 32) are heated by these means. In addition, the resin portion forming apparatus 51 is provided with a compressor (not shown) and the like, and the air between the resin tank 53 and between the resin tank 53 and the mounting portion 52 is sucked to substantially form the resin portion 35. It can be performed under vacuum conditions. As a result, the molten resin 35a is defoamed, and voids in the resin portion 35 can be prevented.

  Next, the resin part forming step 42 in the case of using the resin part forming apparatus 51 as described above will be described in detail according to the order of the steps in FIG. 8 and 9, the softening step 61 mounts the assembled substrate 31 a on the mounting portion 52 in a predetermined direction after the assembly step 41, and in a non-flowing state (unmelted solid or This is a step in which resin 35a in a gel state is charged and heated to soften resin 35a until it becomes flowable. Here, as described above, the large component wiring board 45 is mounted in the direction in which the assembled component built-in substrate 31a is mounted on the mounting portion 52. In this process, in parallel with this process, the air in the space 54 between the resin 35a and the mounting portion 52 (the wiring board 36 and the wiring board 32, or the wiring board 32 and the resin 35a) is sucked. This suction is performed until the space 54 is almost in a vacuum state, and is stopped after the resin 35a is completely melted. In addition, since the resin tank 53 and the mounting part 52 in this Embodiment are heated to the temperature which the resin 35a fuse | melts previously, the resin 35a can be softened in a short time.

  In the present embodiment, the resin 35 a before being charged into the resin tank 53 is granular, and a predetermined amount of resin 35 a measured by a measuring container or the like is charged into the resin tank 53. Here, the resin 35a does not have fluidity within the first temperature range, but has fluidity within the second temperature range higher than the first temperature, and is cured at a temperature higher than the second temperature. A thermosetting resin is used. Thus, since the resin 35a is granular at the stage of charging the resin 35a into the resin tank 53, it can be accurately measured. It is also easy to automate weighing and charging.

  The inventors performed the softening step 61 using the resin part forming apparatus 51 in the following procedure. The temperature of the mounting portion 52 and the resin tank 53 is higher than the temperature at which the resin 35a melts (generates fluidity) in advance by the heating means, and is lower than the temperature range at which the resin 35a is cured (second temperature range). Keep it heated. The resin 35a in the present embodiment has low fluidity at a temperature of less than about 140 ° C, softens most from about 140 ° C to about 175 ° C, generates fluidity, and cures at a temperature exceeding that (third temperature). Range) Epoxy thermosetting resin is used. Therefore, in this Embodiment, the temperature of the mounting part 52 and the resin tank 53 is set to 175 degreeC of the 2nd temperature range upper limit.

  In FIG. 8, after the softening step 61, the dipping step 62 dipped the electronic component 3a in the resin 35a melted in a flowable state, and the lower surface of the wiring board 36 was melted to the liquid level of the molten resin 35a. It is a process of making it contact. And this process is performed as follows, for example.

  FIG. 10 is a cross-sectional view of the resin part forming apparatus in the dipping process of the present embodiment. In FIG. 10, the resin tank 53 and the bottom 53a are moved upward (in the direction of the arrow in FIG. 9) at substantially the same speed, so that the outer periphery of the large-sized wiring board 46 (the outer periphery of the removal section 46a) is mounted on the resin tank 53. It is sandwiched between the parts 52. Therefore, in the present embodiment, the large-sized wiring board (the large-sized wiring board 46 in this description) that is the upper side in a state where the assembled component built-in substrate 31a is installed in the resin portion forming apparatus 51 is the lower side in the installed state. Is larger than the large-sized wiring board (large-sized wiring board 45 in this description).

  That is, in this representative description, the outer peripheral portion of the large-sized wiring substrate 46 is projected from the outer peripheral portion of the large-sized wiring substrate 45 in the four side directions of the large-sized wiring substrate 45. Therefore, the protruding portion (outer peripheral portion) of the large-sized wiring substrate 46 is sandwiched between the resin tank 53 and the mounting portion 52, and the opening of the resin tank 53 is blocked by the large-sized wiring substrate 46. At this time, the large-sized wiring board 45 is made smaller than the opening of the resin tank 53 and is large enough to be accommodated in the resin tank 53, so that the large-sized wiring board 45 is accommodated in the resin tank 53. In this representative example, the large-sized wiring board 46 is set on the upper side in the installed state. However, the large-sized wiring board 45 may be arranged on the upper side in the installed state. However, in this case, the opening is closed by the large-sized wiring board 45 so that the large-sized wiring board 46 is accommodated in the resin tank 53. In this case, the adhesive film 47 is attached to at least the wiring pattern 36a side.

  At this time, it is necessary to prevent a gap from being formed between the resin tank 53 and the lower surface of the large-sized wiring board 46. Therefore, in the resin tank 53, there is no place in contact with the lower surface of the large-sized wiring board 46. A rubber packing (not shown) or the like is provided. Then, the resin tank 53 stops after rising to a specified position (position where the resin tank 53 contacts the large-sized wiring board 46). In this state, as shown in FIG. 10, the liquid level of the resin 35 a is not yet in contact with the lower surface of the large-sized wiring board 46. Thereby, it is possible to reduce the overflow of the resin 35a from the resin tank 53.

  However, at this time, when the electronic component 3a is mounted on the lower large-sized wiring board (in this representative example, the large-sized wiring board 45) in a state of being mounted on the resin portion forming apparatus 51, the electronic component 3a is mounted. The gap between the lower large wiring board in the state is lower than the liquid level of the resin 35a (the gap between the electronic component 3a and the lower large wiring board in the mounted state is immersed in the resin 35a. It is desirable to do so. This reason will also be described using a representative example. This is because at least a gap between the electronic component 3a and the large-sized wiring substrate 45 is immersed in the resin 35a, so that the resin 35a is placed between the electronic component 3a and the large-sized wiring substrate 45 (wiring substrate 32). This is to allow entry into narrow gaps. As a result, the resin 35a can be reliably filled into a very narrow gap between the electronic component 3a and the large-sized wiring board 45 (wiring board 32) in the compression inflow process 63 described later. In the dipping process 62 in the present embodiment, the dipping process 62 is dipped until the upper surface of the electronic component 3a is covered with the resin 35a.

  However, when the electronic component 3a is mounted on the upper large-sized wiring substrate (in this representative example, the large-sized wiring substrate 46) mounted on the resin portion forming apparatus 51, the electronic component 3a is connected to the liquid surface of the resin 35a. It is desirable to keep it in contact. This is because the resin 35a crawls up along the side surface of the electronic component 3a due to the surface tension of the resin 35a, or a part thereof is between the electronic component 3a and the upper large-sized wiring board (large-sized wiring board 46). Because the resin 35a is likely to be filled into a very narrow gap between the electronic component 3a and the upper large-sized wiring board (large-sized wiring board 46) in the subsequent compression inflow process 63. is there.

  In the dipping process 62, the bottom 53a continues to move upward even after the movement of the resin tank 53 is stopped. As a result, the liquid level of the resin 35a and the lower surface of the large-sized wiring substrate 46 come into contact with each other. In the dipping process 62, it is necessary to fill the gap between the large-sized wiring board 45 (wiring board 32) and the large-sized wiring board 46 (wiring board 36) with the resin 35a. Therefore, in the present embodiment, a passage (gap) for the resin 35a to flow between the wiring board 32 and the resin tank 53 is provided. As a result, the resin 35 a flows between the large-sized wiring substrate 45 and the large-sized wiring substrate 46 through the passage between the side surface of the large-sized wiring substrate 45 and the inner surface of the resin tank 53.

  Further, by arranging the spacers 37 in a discrete manner, the resin passes through the gaps between the spacers 37, and the resin 35 a is smoothly filled between the large-sized wiring substrate 45 and the large-sized wiring substrate 46. Thus, in the dipping process 62, since the large-sized wiring board 45 is only immersed, the flow of the resin 35a is small, and the stress on the large-sized wiring board 45 and the electronic component 3a by the resin 35a can be reduced. Therefore, the destruction of the electronic component 3a itself and the connection between the electronic component 3a and the wiring board 32 (or the wiring board 36) can be hardly broken. Furthermore, a difference in the density of the filler contained in the resin 35a depending on the location (difference in the composition of the resin 35a) can hardly occur. Accordingly, the warpage of the large-sized wiring board 45 (wiring board 32) and the large-sized wiring board 46 (wiring board 36) can be reduced, so that the component-embedded board 31 with a small warp can be realized.

  FIG. 11 is a cross-sectional view of the resin part forming apparatus 51 in the compression inflow process 63. Since the lower surface of the large-sized wiring board 46 and the resin 35a come into contact with each other in the dipping process 62, as shown in FIG. 11, when the dipping process 62 is completed, it seems that the filling of the resin 35a is completed. However, since the gap between the electronic component 3a and the large-sized wiring board 45 (or the large-sized wiring board 46) is very narrow, there is a portion not filled with the resin 35a (unfilled gap 49). .

  Therefore, the compression inflow step 63 is performed after the immersion step 62. In this compression inflow step 63, a load is applied to the resin 35a upward (in the direction of the arrow in FIG. 9) by the bottom 53a, the resin 35a is compressed, and the resin 35a is forced to flow into the unfilled gap 49 by this pressure. . At this time, the space surrounded by the resin tank 53 and the large-sized wiring board 46 is the resin 35a except for the unfilled gap 49 between the large-sized wiring board 45 (or the large-sized wiring board 46) and the electronic component 3a. Is buried by. Therefore, even if the resin 35a is compressed, the bottom 53a hardly rises, and only the pressure of the resin 35a rises. Then, pressurization is continued until the pressure reaches a specified value. When the pressure reaches the specified value, the movement of the bottom 53a is stopped, and the pressure is maintained for a specified time. In the compression inflow process 63, it is important that the temperature of the resin 35a is within the second temperature range. Thereby, the resin 35a can be reliably filled into the unfilled gap 49.

  Since the adhesive film 47 is to be peeled off later, originally, it is desirable that the resin 35a is not present between the adhesive film 47 and the bottom 53a in the compression inflow step 63. However, for that purpose, it is necessary to set the distance between the bottom 53a and the adhesive film 47 to zero. However, actually, there are variations in the supply amount of the solder 38, the thickness of the adhesive film 47, the height of the spacer 37, the thickness of the large-sized wiring board 45 and the large-sized wiring board 46, and the like. There is a variation in size. Therefore, at the worst, the bottom 53a hits the assembled component built-in board 31a, and the compressive force by the bottom 53a is applied to the large wiring board 45 and the large wiring board 46, and the spacer 37 and the large wiring board 45 (or the large wiring board 46) There is a possibility that cracks may occur in the solder that connects the two, the large-sized wiring board 45 or the large-sized wiring board 46 itself. Therefore, in the present embodiment, in the compression inflow process 63, the bottom 53a is prevented from hitting the assembled component built-in board 31a (large-size wiring board 45). That is, by leaving the resin 35a between the adhesive film 47 and the bottom portion 53a, it is possible to prevent the compressive force of the bottom portion 53a from being directly applied to the large-sized wiring substrate 45, and to obtain a highly reliable component-embedded substrate 31. be able to. And the resin part 35c will be formed when the resin 35a between this adhesive film 47 and the bottom part 53a hardens | cures in the hardening process 64 mentioned later.

  In the present embodiment, the connection between the electronic component 3a and the large-sized wiring board 45 (or the large-sized wiring board 46) is solder, and tin or silver-based lead-free solder is used. The melting point of the solder in this embodiment is about 200 ° C. Thus, the solder whose melting point is higher than the second temperature range is used. Therefore, since the solder does not melt in the compression inflow process 63 (or the dipping process 62), the electrical connection between the electronic component 3a and the large-sized wiring board 45 (or the large-sized wiring board 46) can hardly be disconnected.

  The curing step 64 further heats the resin 35a after the compression inflow step 63 until the temperature of the resin 35a exceeds the second temperature range (third temperature range). As a result, the resin 35a is cured, and a resin part 35 between the wiring board 32 and the wiring board 36 and a resin part 35b between the removal part 46a and the removal part 45a are formed. Further, a resin portion 35c is formed between the adhesive film 47 and the bottom portion 53a. Note that the pressure applied in the compression inflow step 63 is maintained also in the curing step 64 until at least the resin 35a has no fluidity. Thereby, it is possible to reliably prevent voids and the like from remaining in the gap between the electronic component 3a and the wiring board 32.

  If the resin part formation process 42 in this Embodiment as mentioned above is used, it is not necessary to pour the melted resin 35a into a narrow gap as in transfer molding. Thereby, in order to form the resin part 35 between the wiring board 32 and the wiring board 36, the stress added with respect to the wiring board 32 or the wiring board 36 (assembled component built-in board 31a) can be made small. Therefore, the inclination and deformation of the component built-in substrate 31 can be reduced.

  Further, by such a method, even if the distance between the electronic component 3a and the wiring board 36 is small, the resin 35a can be easily filled therebetween. Therefore, even if the thickness of the resin portion 35 between the electronic component 3a and the wiring board 36 is thin, the resin portion 35 can be formed reliably, and an inexpensive thin component-embedded substrate 31 can be obtained.

  Further, since pressure is applied in the compression inflow process 63, the resin 35a can be reliably filled into a very narrow gap between the electronic component 3a and the wiring board 32. Furthermore, since pressure is applied to the electronic component 3a only in the compression inflow process 63, the stress applied to the electronic component 3a can be reduced. Therefore, the deformation of the electronic component 3a and the wiring board 32 is reduced.

  Further, in the dipping process 62, only the wiring board 32 and the electronic component 3a are dipped in the resin 35a, and a flow occurs in the resin 35a in the compression inflow process 63. Therefore, the distance that the resin 35a flows is larger than that in transfer molding. Very short. Therefore, the internal stress due to the non-uniform flow of the resin 35a after curing can be reduced. This further reduces the distortion (deformation) of the electronic component 3a, the wiring board 32, and the resin portion 35 itself.

  In particular, in the present embodiment, the electronic component 3a includes an integrated circuit, and these are flip-chip mounted on the wiring substrate 32 face down, so that the electronic component 3a and the wiring substrate 32 are very close to each other. Therefore, there is a large stray capacitance between the circuit formed in the electronic component 3a and the wiring board 32. In particular, this variation in stray capacitance has a great influence on the characteristics of the circuit configured in the integrated circuit. There is. In particular, when the component-embedded substrate 31 is a high-frequency device and a high-frequency circuit is formed on the wiring substrate 32 or in an integrated circuit, the influence of this stray capacitance is particularly important.

  Such an integrated circuit may be connected to the wiring board 32 by pressure contact other than being connected to the wiring board 32 by solder bumps or the like. Especially in such a case, since the distortion of the integrated circuit and the wiring board 32 can be reduced, the pressure contact force can hardly be reduced. Therefore, the component-embedded substrate 31 with high connection reliability between the integrated circuit and the wiring substrate 32 can be realized.

  When forming a circuit on such a component-embedded substrate 31, it is very important to reduce the distortion of the integrated circuit. This is because, even if the integrated circuit, the wiring board 32, or the resin portion 35 itself has a large strain even in the inspection of the characteristics in the mounting step 41b, if the distortion of the integrated circuit, the wiring board 32, or the resin portion 35 itself is large, the resin portion 35 is formed. This is because there is a risk of failing. Then, after the resin portion 35 is formed, it is very difficult to repair the resin portion 35. Therefore, there is no measure other than disposal, and the yield is extremely deteriorated. Therefore, by using the manufacturing method as described above, by reducing the distance through which the resin 35a flows, the residual stress remaining in the resin 35a is reduced, and the stress applied to the integrated circuit, the wiring board 32, the resin portion 35 itself, and the like is reduced. To do. As a result, the variation in characteristics after the resin portion 35 is formed can be reduced, and the component-embedded substrate 31 with a good yield can be realized. This is particularly noticeable when a high-frequency circuit is formed in the component-embedded substrate 31.

  In addition, reducing the residual stress greatly affects the long-term reliability of the characteristics of the component-embedded substrate 31. That is, it is considered that the resin portion 35 and the wiring substrate 32 are expanded and contracted due to a temperature change and the internal stress distribution in the resin portion 35 is changed. As a result, the strain amount of the integrated circuit, the wiring board 32, the resin portion 35, and the like changes, and as a result, the value of the stray capacitance between the integrated circuit and the wiring board 32 may change from the value at the manufacturing stage. In addition, when the integrated circuit is connected to the wiring substrate 32 by pressure contact, it is conceivable that the pressure contact force changes due to a temperature change. Therefore, since the internal stress can be reduced by the above manufacturing method, it is possible to realize the component-embedded substrate 31 that can maintain stable characteristics over a long period of time against temperature changes and the like.

  And of course, the resin 35a is forcibly filled in the gap in the compression inflow process 63, so that the resin 35a can be reliably filled between the electronic component 3a and the wiring board 32 as compared with the printing method or potting method. Needless to say. Therefore, the component built-in substrate 31 with very good reliability can be realized.

  And as mentioned above, even if the compression pressure by pressurization is added, it can reduce that the electronic component 3a is destroyed. Further, when the electronic component 3a is an integrated circuit element, deformation of the integrated circuit element can be reduced, so that the thickness of the integrated circuit can be reduced. Therefore, a thinner component-embedded substrate 31 can be realized as compared with the conventional transfer molding.

  The component-embedded substrate 31 in the present embodiment has two layers of the wiring substrate 32 and the wiring substrate 36, but at least one intermediate layer wiring substrate is provided between the wiring substrate 32 and the wiring substrate 36. It does not matter as above. Even in this case, the assembled component-embedded substrate 31a can be easily completed by mounting the electronic component 3a and the spacer 37 on the intermediate wiring board in the mounting step 41b and then connecting them in the assembly step 41. For example, in the case of this representative example, in the connecting step 41c, cream solder 38 is applied to the intermediate wiring board, and reflow soldering is performed in the state where the large wiring board 46, the intermediate wiring board, and the large wiring board 45 are mounted in this order. To do.

  However, it is important that the intermediate wiring board in this case is also smaller than the large-sized wiring board (large-sized wiring board 46) on the upper side when mounted on the resin portion forming apparatus 51, and is sized to be accommodated in the resin tank 53. It is. In this case, it is preferable that the outer periphery of the intermediate wiring board does not protrude from the outer periphery of the wiring board 32 (or the wiring board 36). That is, the cutting tool in the cutting process 43 is prevented from cutting the intermediate wiring board. Thereby, since a cutting tool does not cut | disconnect a glass base material, the lifetime of a cutting tool can be lengthened. Further, since the intermediate wiring board is not exposed on the side surface (cutting surface 39) of the component built-in substrate 31, it is difficult to generate burrs of the glass base material on the side surface (cutting surface 39) of the component built-in substrate 31.

  The method for manufacturing a component-embedded substrate according to the present invention has an effect that an inexpensive component-embedded substrate can be manufactured, and is particularly useful when used for a device that is required to be small and thin.

3a electronic component 31 component built-in board 31a assembled component built-in board 32 wiring board 35 resin part 35b resin part 35c resin part 36 wiring board 37 spacer 41 assembly process 41a film attaching process 41b mounting process 41c connecting process 42 resin part forming process 43 Cutting process 44 Peeling process 45 Large-sized wiring board 45a removal part 46 Large-sized wiring board 46a removal part 47 Adhesive film

Claims (7)

A first wiring board having a conductor layer formed on at least both surfaces; a second wiring board disposed above the first wiring board; an upper surface of the first wiring board; and the second wiring board. An electronic component mounted on at least one of the lower surfaces of the substrate, a connection body for electrically connecting the first and second wiring boards, and between the first and second wiring boards And mounting the electronic component on at least one of the first and second large-sized wiring boards in a method of manufacturing a component-embedded substrate provided with the connection body and a resin portion in which the electronic component is embedded And a step of mounting the connection body on one of the first and second large-sized wiring boards, and the electronic components facing the first and second large-sized wiring boards after the step. These first and second large format wiring boards A step of connecting between the first and second large-sized wiring boards, and forming the resin part in which the electronic component is embedded with the resin. And removing the portions provided on the first and second large-sized wiring boards after this process, and removing the first and second wiring boards from the first and second large-sized wiring boards. An adhesive that can be peeled off at least one of the lower surface of the first large-sized wiring substrate and the upper surface of the second large-sized wiring substrate at least before the step of forming the resin portion. And a step of removing the adhesive film, and a step of removing the adhesive film, and in the step of forming the resin portion, the adhesive film is formed of the resin. As it is covered In the step of excising the removal portion, the adhesive film at the position corresponding to the removal portion is also excised at the same time, and in the step of removing the adhesive film, the adhesive film and the resin covering the adhesive film are removed. A method of manufacturing a component-embedded substrate that is removed at the same time. The method for manufacturing a component built-in board according to claim 1, wherein in the step of mounting the connection body, the connection body is discretely arranged on the first or second wiring board. The said adhesive film has flexibility, The manufacturing method of the component built-in board | substrate of Claim 2 which peels off the said adhesive film in the process of removing the said adhesive film. In the step of forming the resin portion, the wiring board on the side of the first and second wiring boards on which the adhesive film is attached is arranged in a downward direction, and the adhesive film is attached. Soften until the resin in a non-flowing state put into a resin tank provided below the attached wiring board becomes flowable, and then the wiring board on the side to which the adhesive film is attached The electronic component and the adhesive film are immersed in the softened resin, the lower surface of the wiring board disposed on the upper side is brought into contact with the liquid surface of the resin, and then the resin is compressed and heated to The method for manufacturing a component-embedded board according to claim 3, wherein the resin portion is formed by curing a resin. In the step of forming the resin portion, the outer peripheral portion of the wiring substrate disposed on the upper side of the first and second wiring substrates protrudes from the outer peripheral portion on the four sides of the wiring substrate disposed on the lower side, The wiring board disposed on the upper side closes the opening of the resin tank, and the wiring board on the side to which the adhesive film is attached, the electronic component, and the adhesive film are accommodated in the resin tank. The method for manufacturing a component-embedded substrate according to claim 4. The method for manufacturing a component built-in substrate according to claim 4, wherein both the electronic component and the connection body are mounted on one of the first and second wiring substrates. 5. The method of manufacturing a component built-in board according to claim 4, wherein in the step of mounting the electronic component on the wiring board, the electronic component is mounted on the first and second wiring boards.

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