JP2012192356A - Method of manufacturing electronic component, marking method, and marking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a marking which is applicable to an electronic component placed under a severe environment.SOLUTION: A method of manufacturing an electronic component is provided, which includes an applying step (steps S4, S9) of applying ink 45 having light-curing property and containing ≥5 mass% and ≤20 mass% N-vinyl caprolactam onto a semiconductor chip 12 being the electronic component to perform marking, an irradiation step (S3-S6, S8-S11) of irradiating the applied ink 45 with light at a cumulative light dose of ≥200 mJ/cm, and a heating step (step S15) of heating the ink 45 at ≥150°C and ≤200°C after the irradiation step.

Description

  The present invention relates to a method for manufacturing an electronic component for marking an electronic component, a method for marking a workpiece such as an electronic component, and a marking device used for the method for manufacturing the electronic component and the marking method.

  Conventionally, an electronic component formed by packaging an integrated circuit (IC) or the like has been used in various devices, and such electronic components are marked with characters, symbols, logo marks, or the like printed thereon. . For example, an ink jet method is known as a method for performing such marking, and this ink jet method is a mode in which ink is ejected only to a portion to be marked on an electronic component, and has a feature that ink can be used efficiently. is doing.

  As an example of marking by this inkjet method, Patent Document 1 states that the integrated light amount and illuminance of the ultraviolet light to be irradiated are set in a specific range so that the ink containing titanium dioxide is cured at a maximum ink film thickness of 10 to 30 μm. An ink jet recording method for manufacturing a printed wiring board is disclosed. Patent Document 2 discloses a step of providing a marking by jetting an ultraviolet curable ink containing a colorant, a photopolymerization initiator, and an epoxy reagent onto a printed circuit board from an inkjet printer, and the marking. And a step of exposing to ultraviolet light after at least 2 seconds.

JP 2006-21479 A Special table 2007-327459 gazette

  However, in the recording (printing) methods disclosed in Patent Documents 1 and 2, at least one of the abrasion resistance, adhesion, and alcohol resistance in the marking is inferior, or the quality is improved in terms of stability. It had the problem of being desired. That is, it may be difficult to apply to an electronic component placed in a severe environment such as temperature.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples or forms.

Application Example 1 An electronic component manufacturing method according to this application example includes a coating step in which a liquid material having photocurability and containing 5% by mass or more of N-vinylcaprolactam is applied to an electronic component for marking. And an irradiation step of irradiating the applied liquid material with light having an accumulated light quantity of 200 mJ / cm ² or more, and a heating step of heating the liquid material after the irradiation step.

According to this method for manufacturing an electronic component, a liquid containing 5% by weight or more of N-vinylcaprolactam is used for marking on the electronic component. This liquid material is used for marking on the electronic component in the coating step, and after marking, it is cured in a solid state by light irradiation in the irradiation step and heating in the heating step. In this case, the liquid containing 5% by weight or more of N-vinylcaprolactam becomes a preferable cured state when irradiated with light having an accumulated light amount of 200 mJ / cm ² or more in the irradiation step. Furthermore, in the heating step, by heating the liquid that has already been cured, the liquid becomes a more uniform and stable cured state. As described above, the marking on the electronic component uses a liquid material containing 5% by weight or more of N-vinylcaprolactam, and in addition to the application step and the irradiation step, further through the heating step, It is possible to have excellent properties in terms of abrasion resistance and alcohol resistance as marking.

  Application Example 2 In the electronic component manufacturing method according to the application example described above, in the heating step, the liquid material is preferably heated at a temperature of 150 ° C. or higher and 200 ° C. or lower.

  According to this method, the heating temperature in the heating step is set to 150 ° C. or higher and 200 ° C. or lower. By setting the temperature within this temperature range, the liquid that is in a cured state is made to be more uniform and stable, and the thermal effect on the electronic component is avoided, and the performance of the electronic component is reliably maintained. Is possible.

  Application Example 3 In the method for manufacturing an electronic component according to the application example described above, the liquid material preferably contains N-vinylcaprolactam in a range of 5% by mass to 20% by mass.

  According to this method, the N-vinylcaprolactam contained in the liquid is set to 5% by mass or more and 20% by mass or less to suppress variation in the cured state in the irradiation step and the heating step. That is, the liquid material is preferably cured when it contains 5% by weight or more of N-vinylcaprolactam. On the other hand, when it exceeds 20% by mass, the stability of the quality during storage tends to decrease and the viscosity tends to increase. Compared with the case where it is contained in 20% by mass or less, it tends to be slightly inferior in terms of workability in the coating step. Therefore, the liquid material is stable without variation by setting to contain N-vinylcaprolactam, that is, in the range of 5% by mass to 20% by mass, avoiding these slightly inferior characteristics. It is possible to exhibit a cured state.

  Application Example 4 In the electronic component manufacturing method according to the application example described above, it is preferable that the method further includes a surface treatment step for activating the surface of the electronic component before the coating step.

  According to this method, by further including the surface treatment step, the surface of the electronic component is activated and the adhesiveness with the liquid is improved. By sending the electronic component in this state to the coating step, it is possible to improve the adhesion of the liquid to the electronic component.

[Application Example 5] A marking method according to this application example includes an application step of applying a marking to a workpiece by applying a liquid material having photocurability and containing 5% by mass or more of N-vinylcaprolactam; An irradiation step of irradiating the liquid body with light having an accumulated light quantity of 200 mJ / cm ² or more, and a heating step of heating the liquid body after the irradiation step.

According to this marking method, a liquid containing 5% by weight or more of N-vinylcaprolactam is used for marking on the workpiece. This liquid material is used for marking on a workpiece, which has been improved in adhesion with the liquid material, preferably by surface treatment in the coating step, and is irradiated by light in the irradiation step and heated in the heating step. Cured to a solid state. In this case, the liquid containing 5% by weight or more of N-vinylcaprolactam becomes a preferable cured state when irradiated with light having an accumulated light amount of 200 mJ / cm ² or more in the irradiation step. Furthermore, in the heating step, by heating the liquid that has already been cured, the liquid becomes a more uniform and stable cured state. As described above, the marking on the workpiece uses a liquid containing 5% by weight or more of N-vinylcaprolactam, and in addition to the coating step and the irradiation step, the adhesiveness to the workpiece is obtained through a heating step. In addition, it is possible to have excellent characteristics in terms of abrasion resistance and alcohol resistance as marking.

[Application Example 6] A marking device according to this application example includes a discharge unit that discharges a liquid material having photocurability and containing 5% by mass or more of N-vinylcaprolactam to a workpiece, and the applied liquid material And an irradiating unit that irradiates the body with light having an accumulated light amount of 200 mJ / cm ² or more.

According to this marking apparatus, for marking on the workpiece, a liquid material containing 5% by weight or more of N-vinylcaprolactam is used, and this liquid material is discharged and marked on the workpiece by the discharge portion. . The marked liquid is cured into a solid state by irradiation of light from the irradiation unit. In this case, the liquid containing 5% by weight or more of N-vinylcaprolactam becomes a preferable cured state when irradiated with light having an integrated light amount of 200 mJ / cm ² or more by the irradiation unit. In this way, marking by a marking device can have adhesion to a workpiece, abrasion resistance as a marking, and alcohol resistance by using a liquid material containing 5% by weight or more of N-vinylcaprolactam. It is.

  Application Example 7 It is preferable that the marking device according to the application example further includes a heating unit that heats the liquid material that has been irradiated.

  According to this configuration, the marking device further includes a heating unit that applies heating after the irradiation of light by the irradiation unit. Thereby, in addition to hardening by light irradiation by an irradiation part, a liquid body will be in the more uniform and stable hardening state by being heated by a heating part. If this marking is used, the heating process can be performed continuously, and the working efficiency can be improved.

The top view which shows marking of an electronic component. The perspective view which shows the structure of the outline of a marking apparatus. (A) The front view which shows a carriage and a workpiece | work, (b) The top view which shows the nozzle arrangement | positioning of a nozzle unit. The flowchart which shows the procedure of marking.

Hereinafter, an electronic component manufacturing method, a marking method, and a marking device according to the present invention will be described with reference to the accompanying drawings. Here, a method for marking a semiconductor chip, which is an electronic component, using an inkjet marking device will be described as an example.
(Embodiment)

  FIG. 1 is a plan view showing marking of an electronic component. As shown in FIG. 1, a workpiece 10 as a workpiece includes a mounting table 11 and a semiconductor chip 12 that is an electronic component mounted on the mounting table 11. The surface of the semiconductor chip 12 is marked with a logo mark 12a, a product code 12b, a serial number 12c, and the like. In this case, the semiconductor chip 12 has an integrated circuit (IC) packaged with an epoxy resin, and markings are drawn on the surface portion of the epoxy resin with ink (liquid material).

  As a package material, a non-absorbent material is preferable in order to prevent ink from penetrating into the semiconductor chip 12, and in addition to epoxy resin, silicon, phenol resin, polyimide, polymethyl methacrylate, silicon nitride, etc. Nitrides, borides, and the like. Among these, epoxy resin and silicon are preferable because of excellent adhesion to ink.

  Next, a marking device for marking the semiconductor chip 12 with ink will be described. FIG. 2 is a perspective view showing a schematic configuration of the marking device. FIG. 3A is a front view showing the carriage and the workpiece, and FIG. 3B is a plan view showing the nozzle arrangement of the nozzle unit.

  First, as shown in FIG. 2, the marking device 1 is an ink jet type device, and includes a work transport device 2 for transporting a workpiece 10, a carriage 3, a carriage transport device 4, a maintenance device 5, have. The carriage 3 is provided with a head unit (ejection unit) 13 and two irradiation devices (irradiation units) 15. In the marking device 1, ink is ejected as droplets from the head unit 13 while changing the relative position of the head unit 13 and the workpiece 10 in plan view. Thereby, marking of a desired pattern can be drawn on the work 10 with ink. In the figure, the Y direction indicates the moving direction of the workpiece 10, and the X direction indicates a direction orthogonal to the Y direction in plan view. A direction orthogonal to the XY plane defined by the X direction and the Y direction is defined as the Z direction.

  In the marking device 1, the work transfer device 2 includes a surface plate 21, guide rails 23 a and 23 b, a work table 25, and a table position detection device 27. The surface plate 21 is made of a material having a small thermal expansion coefficient, such as stone, and is installed so as to extend along the Y direction together with the guide rails 23a and 23b. The work table 25 is provided so as to face the upper surface 21a of the surface plate 21 with the guide rails 23a and 23b interposed therebetween, and has a surface 25a on which the work 10 is placed. The table position detection device 27 is provided on the upper surface 21a of the surface plate 21, and detects the position of the work table 25 in the Y direction. The work table 25 is configured to reciprocate in the Y direction by a moving mechanism and a power source (not shown). As the moving mechanism, for example, there are a mechanism in which a ball screw and a ball nut are combined, a linear guide mechanism, and the like. In the marking device 1, a linear guide mechanism is used.

  The carriage conveyance device 4 includes a gantry 61, a guide rail 63, and a carriage position detection device 65, and is supported by a column 67a and a column 67b. The gantry 61 extends in the X direction and straddles the workpiece transfer device 2 and the maintenance device 5 in the X direction. The guide rail 63 is provided on the surface plate 21 side of the gantry 61 and supports the carriage 3 in a state where it can reciprocate in the X direction. The carriage 3 is configured to reciprocate in the X direction by a moving mechanism and a power source (not shown). As the moving mechanism, a linear guide mechanism is used as in the work table 25. The carriage position detector 65 is provided between the gantry 61 and the carriage 3 so as to extend in the X direction, and detects the position of the carriage 3 in the X direction. The carriage transport device 4 has a forward path start position 3a and a backward path start position 3b. The forward path start position 3a is a forward path start position when the carriage 3 is reciprocated, and the backward path start position 3b is the carriage 3 position. This is the start position of the return path. In the workpiece conveyance device 2, one side in the Y direction with respect to the carriage conveyance device 4 is a mounting position, which will be described later with reference to FIG. 4, and the other side is a heating position. FIG. 2 shows a state where the work table 25 is in the heating position.

  The maintenance device 5 includes a surface plate 71, guide rails 73a and 73b, a maintenance table 75, a capping unit 76, a flushing unit 77, and a wiping unit 79. The surface plate 71 is made of a material having a small coefficient of thermal expansion, such as stone, and is provided at a position facing the surface plate 21 across the support 67a in the X direction. The maintenance table 75 is provided so as to face the upper surface 71a of the surface plate 71 with the guide rails 73a and 73b interposed therebetween. The maintenance table 75 includes maintenance units such as a capping unit 76, a flushing unit 77, and a wiping unit 79. It is placed. The maintenance table 75 is guided along the Y direction by the guide rails 73a and 73b, and is configured to reciprocate on the surface plate 71 along the Y direction.

  The capping unit 76 is a device that covers the head unit 13. The ink ejected from the head unit 13 increases in viscosity because the liquid component evaporates, and the performance of ejecting as droplets may be reduced. In order to prevent this, the operation of covering the head unit 13 is called capping.

  The flushing unit 77 is a device that receives ink ejected from the head unit 13 during the flushing operation. Here, the flushing operation is an operation of ejecting ink from the head unit 13 irrespective of the marking drawing on the workpiece 10, and the ink staying in the head unit 13 is solidified and becomes difficult to eject. There is an effect such as preventing it.

  The wiping unit 79 is a device that wipes the head unit 13. Ink may adhere to the head unit 13 and the performance of discharging as droplets may deteriorate. The wiping unit 79 can wipe the ink that has deteriorated the performance by wiping the head unit 13 and maintain the ejection performance. The operation of wiping the head unit 13 with the wiping unit 79 is called wiping.

  The maintenance table 75 is configured to be reciprocable in the Y direction by a linear guide mechanism (not shown). Accordingly, the maintenance device 5 can reciprocate the capping unit 76, the flushing unit 77, and the wiping unit 79 along the Y direction, and the head unit 13 overlaps the maintenance device 5 in a plan view. The head unit 13 can be opposed to the capping unit 76, the flushing unit 77, and the wiping unit 79, respectively.

  As shown in FIGS. 3A and 3B, the carriage 3 includes a head plate 31 and two ejection heads 33 a and 33 b provided on the head plate 31. These two ejection heads 33 are arranged side by side in the X direction. The ejection head 33 has a nozzle surface 35 on which a plurality of nozzles 37 are formed. The nozzle surface 35 faces the work table 25 side, that is, the work 10 side in the Z direction. In each ejection head 33, the plurality of nozzles 37 constitute two nozzle rows 39 arranged along the Y direction. The two nozzle rows 39 are lined up with a gap in the X direction. In each nozzle row 39, the plurality of nozzles 37 are formed at a predetermined nozzle interval P along the Y direction, and the two nozzle rows 39 are shifted from each other by a distance of P / 2 in the Y direction. In the head unit 13, the nozzle row 39 in one of the two ejection heads 33 and the nozzle row 39 in the other ejection head 33 are shifted from each other by a distance of P / 4 in the Y direction. The density of the nozzle 37 is increased.

  The two irradiation devices 15a and 15b are provided at positions facing each other with the head unit 13 in the X direction. The irradiation device 15a is located on the opposite side of the ejection head 33a from the ejection head 33b side in the X direction. The irradiation device 15b is located on the opposite side of the ejection head 33b from the ejection head 33a side in the X direction. In the marking device 1, the irradiation devices 15 a and 15 b each have a light source 43 that emits ultraviolet light 41. The ultraviolet light 41 from the light source 43 can promote the curing of the ink 45 that is a liquid material ejected from the ejection head 33. That is, the ink 45 has photocurability, but the light in this case is ultraviolet light 41 as an example. If the ultraviolet light 41 is used, the ink 45 can be cured almost instantaneously, and further, the thermal influence on the semiconductor chip 12 can be suppressed. Although the ultraviolet light emitting diode (UV-LED) is used as the light source 43 of the irradiation device 15, an ultraviolet laser diode (UV-LD), a mercury lamp, a metal halide lamp, a xenon lamp, an excimer lamp, or the like may be used. The curing of the ink 45 will be described later in detail with reference to FIG.

  And the marking apparatus 1 has the control part 6 for controlling operation | movement of said each structure. The control unit 6 includes a CPU (Central Processing Unit), a drive control unit, a memory unit, and the like (not shown). The CPU performs various arithmetic processes as a processor, and the drive control unit controls driving of each component. The memory unit includes a RAM (Random Access Memory), a ROM (Read Only Memory), and the like, and stores an area for storing program software in which the operation control procedure in the marking device 1 is described, and various data. A data expansion area and the like to be temporarily expanded are set. Data in the data development area includes, for example, marking data indicating a marking pattern to be drawn on the semiconductor chip 12, program data such as drawing processing, and the like.

  Here, the ink 45 used in the marking device 1 will be described. The ink 45 in the present embodiment is a liquid that has photocurability and contains 5% by mass or more of N-vinylcaprolactam. In the ink 45, N-vinylcaprolactam is added as an ink composition, so that the adhesion of the ink 45 to the semiconductor chip 12, the abrasion resistance, and the alcohol resistance are improved as an optimal polymerizable compound. Selected. If the N-vinylcaprolactam is contained in the ink 45 in an amount of 5% by weight or more, the N-vinylcaprolactam is polymerized by being irradiated by the irradiation device 15 to make the ink 45 in a preferable cured state. When it is contained, there is a tendency for the quality of the ink 45 to be lowered during storage and the viscosity to be increased. Compared to the case where it is contained in an amount of 20% by mass or less, it is slightly in terms of workability in marking and the like. It will be inferior. Therefore, the ink 45 is effective when N-vinylcaprolactam is contained in an amount of 5% by mass or more, and more preferably in the range of 5% by mass or more and 20% by mass or less.

  In addition, as a polymeric compound contained as a composition in a general ink, the compound which has both a vinyl group and (meth) acryl group in a molecule | numerator is mentioned, As a specific example, (meth) acrylic-acid 2-vinyloxy ethyl, (Meth) acrylic acid 3-vinyloxypropyl, (meth) acrylic acid 1-methyl-2-vinyloxyethyl, (meth) acrylic acid 2-vinyloxypropyl, (meth) acrylic acid 4-vinyloxybutyl, (meth) acrylic acid 4 -Vinyloxycyclohexyl, 5-vinyloxypentyl (meth) acrylate, 6-vinyloxyhexyl (meth) acrylate, 4-vinyloxymethylcyclohexylmethyl (meth) acrylate, p-vinyloxymethyl (meth) acrylate Phenylmethyl, 2- (vinyloxyethoxy) ethyl (meth) acrylate, (meth ) Acrylic acid 2- (vinyloxy ethoxy) ethyl, and (meth) acrylic acid 2- (vinyloxy ethoxy ethoxy ethoxy) ethyl and the like. Based on this, the ink 45 contains 20% by mass of 2- (vinyloxyethoxy) ethyl acrylate (VEEA), which has a low viscosity, a high flash point, and excellent reactivity and adhesion. In order to further improve the rubbing property, alcohol resistance, and the like, the composition contains 15% by mass of N-vinylcaprolactam as an essential polymerizable compound.

  The ink 45 includes a color material as a composition, and can be marked with white, black, yellow, magenta, and cyan colors. As the color material, at least one of a pigment and a dye can be used, and as the pigment, either an inorganic pigment or an organic pigment can be used. Examples of inorganic pigments include carbon blacks such as furnace black, lamp black, acetylene black, and channel black, iron oxide, and titanium oxide. Organic pigments include insoluble azo pigments, condensed azo pigments, azo lakes, chelate azo pigments and other azo pigments, phthalocyanine pigments, perylene and perinone pigments, anthraquinone pigments, quinacridone pigments, dioxane pigments, thioindigo pigments, isoindolinone pigments, and quinophthalone. Polycyclic pigments such as pigments, dye chelates (for example, basic dye type chelates, acidic dye type chelates), dyeing lakes (basic dye type lakes, acid dye type lakes), nitro pigments, nitroso pigments, aniline black, A daylight fluorescent pigment is mentioned. In the case of the ink 45, a white pigment is used as a coloring material in order to mark the dark surface of the semiconductor chip 12.

  Next, a marking processing method in the marking device 1 will be described. FIG. 4 is a flowchart showing a marking procedure. In the marking device 1, drawing is started based on the marking data in accordance with an instruction from the control unit 6, and thus the flowchart shows a procedure executed by the control unit 6.

Here, the surface treatment step is performed before the drawing according to the flowchart by the marking device 1. In the surface treatment step, the semiconductor chip 12 of the workpiece 10 is irradiated with a low-pressure mercury lamp. In this case, the processing conditions in the surface treatment step are: light of a low-pressure mercury lamp having a strong line spectrum at 185 nm and 254 nm in an atmosphere containing oxygen, that is, a processing atmosphere having an oxygen concentration of 20 to 100% by volume and a temperature of 160 to 190 ° C. Is irradiated to the workpiece 10 at an intensity of 0.01 to 60 mW / cm ² for a time of 5 seconds to 10 minutes. Under this condition, even if the semiconductor chip 12 is packaged with an epoxy resin, oxidation, breakage, etc. from the surface of the semiconductor chip 12 to the deep inside can be avoided. The semiconductor chip 12 subjected to such surface treatment is improved so that the surface thereof is activated and the adhesion to the ink 45 is improved. In this case, the surface treatment step is not performed in the marking device 1, but the marking device 1 includes an activating unit capable of heating in an atmosphere for performing the surface treatment, whereby the control unit 6. It may be configured to be performed by the above control. Then, the workpiece 10 subjected to the surface treatment on the semiconductor chip 12 is placed on the workpiece table 25 at the placement position.

  In marking by the marking device 1, first, the carriage 3 is moved to the forward path start position 3a in step S1 in the flowchart. The forward path start position 3a is the start position of the forward path when the carriage 3 is reciprocated, and is positioned between the maintenance device 5 and the work table 25 in the X direction, and is located outside the work table 25 in plan view. is there. At this time, the workpiece 10 processed by the surface treatment step is set on the work table 25. After the carriage 3 moves, the process proceeds to step S2.

  In step S2, the work table 25 is moved to the marking area. Here, the marking area is a trajectory in which the ejection head 33 moves along the X direction between the forward path start position 3a and the return path start position 3b, and a trajectory in which the work table 25 moves along the Y direction. This is an overlapping area, where the semiconductor chip 12 is marked. After the work table 25 is moved, the process proceeds to step S3 and step S4.

In step S3, the irradiation device 15a is turned on, and in step S4, drawing in the forward path is performed. Drawing in the forward path is performed by controlling the driving of the ejection head 33 in a state where the irradiation device 15a is turned on, and ejecting the ink 45 from each nozzle 37 based on the marking data. Drawing on the surface of the semiconductor chip 12 is a marking (FIG. 1) such as a logo mark 12a, a product code 12b, and a serial number 12c. At this time, the irradiation device 15 a cures the ink 45 ejected on the surface of the semiconductor chip 12 with the ultraviolet light 41. The light source 43 of the irradiation device 15a is the ultraviolet light-emitting diode (UV-LED) described above. In this case, the light source 43 has a peak wavelength of 365 nm and is supplied to the ink 45 ejected to the semiconductor chip 12 with an integrated light quantity of 200 mJ. It is the structure which irradiates the ultraviolet light 41 of / cm < ² > or more. As a result, the ink 45 is cured on the surface of the semiconductor chip 12 with good adhesion. This step S4 corresponds to an application step. When the forward drawing is performed, the process proceeds to step S5.

  In step S5, it is determined whether or not the forward drawing has been completed. This determination is made by the CPU of the control unit 6. If the drawing has been completed, the process proceeds to step S6. On the other hand, if the drawing has not been completed, the process loops to the end of the drawing in step S5.

  If the drawing is completed, the irradiation device 15a is turned off in step S6. These steps S3 to S6 correspond to the irradiation step. After the irradiation device 15a is turned off, the process proceeds to step S7.

  In step S7, the work table 25 is moved. In step S <b> 7, the control unit 6 instructs to move the work table 25, thereby performing a so-called line feed for newly marking the semiconductor chip 12. After the line feed, the process proceeds to step S8 and step S9.

  In step S8, the irradiation device 15b is turned on, and in step S9, drawing on the return path is performed. Drawing on the return path is performed by discharging the ink 45 from each nozzle 37 based on the marking data by controlling the driving of the ejection head 33 with the irradiation device 15b turned on. At this time, the irradiation device 15b cures the ink 45 discharged to the surface of the semiconductor chip 12 with the ultraviolet light 41, as in the irradiation device 15a. This step S9 corresponds to an application step. When drawing on the return path is performed, the process proceeds to step S10.

  In step S10, it is determined whether or not the return path drawing has been completed. This determination is made by the CPU of the control unit 6. If the drawing has been completed, the process proceeds to step S11. If the drawing has not been completed, a loop is performed in step S10 until the drawing is completed.

  If the drawing is completed, the irradiation device 15b is turned off in step S11. These steps S8 to S11 correspond to the irradiation step. After the irradiation device 15b is turned off, the process proceeds to step S12.

  In step S12, it is determined whether or not all drawing has been completed. This determination is made by the CPU of the control unit 6. If a part of the drawing has not been completed yet, the process proceeds to step S13. If all the drawing has been completed, the process proceeds to step S14.

  If the drawing has not been completed yet, the work table 25 is moved in step S13. In step S <b> 13, the control unit 6 instructs to move the work table 25, thereby performing a so-called line feed for newly marking the semiconductor chip 12. After the line feed, the process proceeds to step S3 to continue drawing.

  On the other hand, if all drawing has been completed, the work table 25 is moved to the heating position in step S14. Here, the heating position is a position where the marked semiconductor chip 12 can be heated by a hot plate (heating unit) (not shown). In this step, in the marking device 1, the work table 25 is in a state of being moved along the Y direction from the marking area to the heating position. After the work table 25 is moved, the process proceeds to step S15.

  In step S15, the workpiece 10 is heated. That is, by heating the semiconductor chip 12, the marking drawn on the semiconductor chip 12 with the ink 45 and cured by the irradiation device 15 is further cured. In this heating, the semiconductor chips 12 on which the markings are drawn are arranged on a hot plate and heated at 180 ° C., which is 150 ° C. or higher and 200 ° C. or lower. When the heating temperature is 180 ° C., it is possible to avoid the thermal effect on the semiconductor chip 12 and maintain the performance without impairing the performance. Step S15 corresponds to a heating step. The flow ends when the heat treatment ends.

Next, in the marking using various inks including the ink 45, the evaluation results when the composition and ultraviolet light irradiation conditions are different will be described. Table 1 shows that in the irradiation step shown in FIG. 4 (steps S3 to S6 and S8 to S11), the ultraviolet light 41 having an accumulated light amount of 200 mJ / cm ² or more is irradiated to the ink having the composition at five different ratios. This is a result of comparative evaluation between the case of UV irradiation (UV only) and the case of irradiation with ultraviolet light 41 with an integrated light quantity of 200 mJ / cm ² or more and heating at 180 ° C. (UV + heating). Comparative evaluations are shown for ink adhesion, scuff resistance and alcohol resistance.

  As shown in Table 1, five types of experimental inks, Experimental Examples 1 to 4 and Comparative Example 1, were prepared and evaluated. In this embodiment, N-vinylcaprolactam (NVC), which is an essential polymerizable compound, is contained in the ink of Experimental Example 1 in an amount of 5% by mass, the ink of Experimental Example 2 is 10% by mass, and the ink of Experimental Example 3 is 15% by mass. %, The ink of Experimental Example 4 contains 20% by mass, and the ink of Comparative Example 1 contains 3% by mass. Some other compositions such as 2- (vinyloxyethoxy) ethyl acrylate (VEEA) are also shown for reference. The curing method for these inks was divided into a UV-only method and a UV + heating method, and each was comparatively evaluated.

  First, the result of the comparative evaluation on adhesion will be described. Adhesion is carried out in accordance with JIS K-5600-5-6 (ISO 2409) (Coating General Test Method-Part 5: Mechanical Properties of Coating Film-Section 6: Adhesion (Cross Cut Method)). The adhesion between the surface of the chip 12 and the marking drawn on the surface was evaluated. In the cross-cut method, first, as a cutting tool, a single-blade cutting tool (generally available cutter) and a guide for cutting at equal intervals using a single-blade cutting tool are prepared. Apply the cutting tool blade so that it is perpendicular to the membrane and make 6 cuts. After these six cuts are made, the direction is changed by 90 °, and another six cuts are made so as to be perpendicular to the cuts already made. Next, take out the transparent adhesive tape (width 25 ± 1 mm) so that the length is about 75 mm, apply the tape to the part of the coating that has been cut into a grid, and tape it with your fingers enough to see through the coating. Rub. Next, within 5 minutes after applying the tape, the film is surely pulled apart at an angle close to 60 ° in 0.5 to 1.0 seconds.

The evaluation criteria for adhesion performed in this way are as follows. ◎ and ○ are practically acceptable evaluation criteria.
A: There is no peeling in the eyes of any lattice.
○: Peeling is observed on a part of the lattice.
Δ: Peeling is observed in 50% or more of the lattice.
X: Peeling is recognized on the entire surface.

  As can be seen from the evaluation results shown in Table 1, in the experimental example 1, the adhesion is evaluated as Δ in the UV-only ink curing method, but improved to ○ evaluation in the UV + heating ink curing method. Similarly, in Experimental Example 2, the evaluation was improved from △ evaluation to ○ evaluation, in Experimental Example 3 was improved from ○ evaluation to ◎ evaluation, in Experimental Example 4 was evaluated from ○ evaluation to ◯ evaluation, and in Comparative Example 1 was improved from × evaluation to △ evaluation. Yes. That is, in each experimental example and comparative example, an improvement in adhesion is recognized in the ink curing method using UV + heating than in the ink curing method using only UV. However, in Comparative Example 1, the ink curing method using UV + heating is unacceptable in practice.

  Next, the results of comparative evaluation on the abrasion resistance will be described. For the abrasion resistance, the degree of peeling of the coating film on the marking was confirmed using a load-fluctuating friction and abrasion test system (for example, Tribogear TYPE-HHS2000 [trade name], manufactured by Shinto Kagaku Co., Ltd.). The condition was that the coating film of the marking was scratched with a sapphire needle having a diameter of 0.2 mm while keeping the load constant, and the degree of peeling of the coating film was confirmed.

The evaluation criteria for the abrasion resistance thus obtained are as follows. ◎ and ○ are practically acceptable evaluation criteria.
(Double-circle): A coating film does not have a crack and peeling.
○: A part of the coating film is scratched, but no peeling is observed.
(Triangle | delta): A part of coating film is damaged and a coating film peels.
X: The entire surface of the coating film is scratched and the coating film is peeled off.

  As can be seen from the evaluation results shown in Table 1, in Experimental Example 1, the abrasion resistance is evaluated as Δ for the ink curing method using only UV, but improved to ○ evaluation for the ink curing method using UV + heating. Similarly, in Experimental Example 2, it was improved from ○ evaluation to ◎ evaluation, in Experimental Example 3 from △ evaluation to ◎ evaluation significantly, in Experimental Example 4 from ○ evaluation to ◎ evaluation, and in Comparative Example 1 from △ evaluation to △ evaluation. It has become. That is, in each of the experimental examples and the comparative examples, it is recognized that the ink curing method using UV + heating improves the abrasion resistance than the ink curing method using only UV. However, in Comparative Example 1, as in the case of adhesion, the result is that it is not acceptable in practice.

  Next, the result of the comparative evaluation about alcohol tolerance is demonstrated. For alcohol resistance, the marking on the semiconductor chip 12 is immersed in an isopropyl alcohol solution for 1 minute, then taken out from the solution, and the degree to which the coating film of the marking has been peeled off is confirmed under the same conditions as the above-described rubbing resistance evaluation. To do.

The evaluation criteria for alcohol resistance performed in this way are as follows. ◎ and ○ are practically acceptable evaluation criteria.
(Double-circle): A coating film does not have a crack and peeling.
○: A part of the coating film is scratched, but no peeling is observed.
(Triangle | delta): A part of coating film is damaged and a coating film peels.
X: The entire surface of the coating film is scratched and the coating film is peeled off.

  As can be seen from the evaluation results shown in Table 1, in Experimental Example 1, alcohol resistance is evaluated as Δ in the ink curing method using only UV, but improved to ○ evaluation in the ink curing method using UV + heating. In Experimental Example 2, the evaluation is evaluated from ○ evaluation to ○ evaluation, in Experimental Example 3 is improved from ○ evaluation to ◎ evaluation, in Experimental Example 4 is improved from Δ evaluation to ○ evaluation, and in Comparative Example 1 is evaluated from × evaluation to × evaluation. That is, in each experimental example and comparative example, an improvement in adhesion is recognized in the ink curing method using UV + heating than in the ink curing method using only UV. However, in Comparative Example 1, the result is that it is unacceptable for practical use as well as the adhesion and the scratch resistance.

  The result of Comparative Example 1 is a result that practically unacceptable adhesion, scuff resistance and alcohol resistance are due to the fact that the N-vinylcaprolactam (NVC) content of the ink is 3% by mass. Can be judged. That is, the content of N-vinylcaprolactam (NVC) in the ink is preferably 5% by mass or more. It can be said. The ink 45 used in the marking device 1 is the ink evaluated in Experimental Example 3. As a result, when the ink 45 used for marking the semiconductor chip 12 is treated by an ink curing method using UV + heating, the adhesion, rubbing resistance and alcohol resistance are evaluated as ◎ and have excellent characteristics. is there.

Next, in the marking using the ink 45, the evaluation results when the curing methods having different ultraviolet light irradiation conditions are applied to five types of inks having the same compositions as shown in Table 1 will be described. The different curing method is that the ultraviolet light 41 with an integrated light quantity of less than 200 mJ / cm ² is irradiated in the irradiation steps (steps S3 to S6 and S8 to S11) shown in FIG. Thereby, the difference from the case of irradiating the ultraviolet light 41 with an integrated light quantity of 200 mJ / cm ² or more is clarified. Table 2 shows the irradiation of ultraviolet light 41 with an integrated light quantity of less than 200 mJ / cm ² on each of the five types of ink (UV only), irradiation with ultraviolet light 41 with an integrated light quantity of less than 200 mJ / cm ² , and heating at 180 ° C. It is the result of comparative evaluation with the case of (UV + heating). Comparative evaluations are shown for ink adhesion, scuff resistance and alcohol resistance. The inks of Experimental Examples 5, 6, 7, 8 and Comparative Example 2 in Table 2 are the same as the inks of Experimental Examples 1, 2, 3, 4 and Comparative Example 1 in Table 1, respectively.

  First, the result of the comparative evaluation on adhesion will be described. Since the evaluation method and the evaluation criteria are the same as those described with reference to Table 1, the description is omitted and only the results are described. As can be seen from the evaluation results shown in Table 2, in Example 5, the adhesion is evaluated as x in the ink curing method using only UV, but is improved to Δ evaluation in the ink curing method using UV + heating. Similarly, in Experimental Example 6, the evaluation was improved from x evaluation to △ evaluation, in Experimental example 7, the evaluation was improved from △ evaluation to ◯ evaluation, in Experimental example 8, Δ evaluation was evaluated from △ evaluation, and in Comparative example 2, the evaluation was changed from x evaluation to x evaluation. . That is, in each experimental example and comparative example, an improvement in adhesion is slightly observed in the ink curing method using UV + heating than in the ink curing method using only UV. However, none of the results is practically acceptable except in the case of the ink curing method by UV + heating in Experimental Example 7.

  Next, the results of comparative evaluation on the abrasion resistance will be described. Since the evaluation method and the evaluation criteria are the same as those described with reference to Table 1, the description is omitted and only the results are described. As can be seen from the evaluation results shown in Table 2, in Experimental Example 5, the abrasion resistance is evaluated as x in the ink curing method using only UV, but is improved to Δ evaluation in the ink curing method using UV + heating. In Experimental Example 6, Δ evaluation to Δ evaluation, in Experimental example 7 improved from Δ evaluation to ○ evaluation, in Experimental example 8 improved from Δ evaluation to ○ evaluation, and in Comparative example 2 from × evaluation to × evaluation. That is, in each experimental example and comparative example, an improvement in adhesion is slightly observed in the ink curing method using UV + heating than in the ink curing method using only UV. However, all results are unacceptable in practice except for the ink curing method by UV + heating in Experimental Example 7 and Experimental Example 8.

  Next, the result of the comparative evaluation about alcohol tolerance is demonstrated. Since the evaluation method and the evaluation criteria are the same as those described with reference to Table 1, the description is omitted and only the results are described. As can be seen from the evaluation results shown in Table 2, the alcohol resistance is evaluated as x in the ink curing method using only UV in Experimental Example 5, and also evaluated as x in the ink curing method using UV + heating. In Experimental Example 6, the evaluation was improved from x evaluation to Δ evaluation, in Experimental example 7, it was improved from Δ evaluation to ○ evaluation, in Experimental example 8, Δ evaluation was evaluated from Δ evaluation, and in Comparative example 2, it was changed from x evaluation to x evaluation. That is, in each experimental example and comparative example, an improvement in adhesion is slightly observed in the ink curing method using UV + heating than in the ink curing method using only UV. However, none of the results is practically acceptable except in the case of the ink curing method by UV + heating in Experimental Example 7.

That is, in each ink, both the effect of containing 5% by mass or more of N-vinylcaprolactam (NVC) and the effect of the curing method in which heating is performed in addition to UV are recognized, but the ultraviolet light with an integrated light quantity of 200 mJ / cm ² or less. It was found that a sufficient effect could not be obtained only by irradiating the light 41 as compared with the case of irradiating the ultraviolet light 41 with an integrated light quantity of 200 mJ / cm ² or more. Among them, the ink shown in Experimental Example 7 is the ink 45 used for the marking of the semiconductor chip 12, and under the conditions shown in Table 2, only adhesion, scuff resistance and alcohol resistance were evaluated. This is the result.

As described above, in Tables 1 and 2, the markings processed by the ink curing method using UV + heating in Experimental Example 1, Experimental Example 2, Experimental Example 3, Experimental Example 4 and Experimental Example 7 have practically sufficient quality ( In the case of Experimental Example 3, in particular, all evaluations are ◎ evaluations. This indicates that the ink 45 contains N-vinylcaprolactam (NVC), and the treatment of curing by irradiation with ultraviolet light 41 and heating is effective. Again, the ink 45 contains 15% by mass of N-vinylcaprolactam (NVC) of 5% by mass or more, irradiation of ultraviolet light 41 with an integrated light amount of 200 mJ / cm ² or more by the irradiation device 15, and hot plate. It is set to be cured by heating at 180 ° C. which is 150 ° C. or more and 200 ° C. or less. Therefore, when the ink 45 is cured, a thermal effect on the semiconductor chip 12 including a package such as an epoxy resin can be avoided, and the performance of the semiconductor chip 12 can be maintained without deteriorating. Further, the ink 45 has excellent characteristics from the viewpoints of adhesion, abrasion resistance and alcohol resistance, and is optimal for marking on the semiconductor chip 12.

  Further, the electronic component manufacturing method, marking method, and marking device are not limited to the above-described embodiments, and the same effects as those of the embodiments can be obtained even in the following modifications. It is done.

  (Modification 1) The heating step (step S15) is a form in which the semiconductor chips 12 on which the markings are drawn are arranged on the hot plate and heated at the heating position of the marking device 1, but is limited to this form. is not. For example, as shown in FIG. 2, using a heating lamp (heating unit) 80 such as a mercury lamp or a metal halide lamp, the heating temperature may be set to 150 ° C. or higher and 200 ° C. or lower, preferably 180 ° C. . Further, the heating step can be performed by an apparatus other than the marking apparatus 1 as in the surface treatment step.

  (Modification 2) The surface treatment step is a setting in which the semiconductor chip 12 is performed by an apparatus other than the marking apparatus 1, and the marking apparatus 1 is activated for heating in an atmosphere for performing the surface treatment. It is also possible to adopt a configuration that includes a unit and is performed under the control of the control unit 6.

  (Modification 3) A workpiece 10 as a workpiece includes a mounting table 11 and a semiconductor chip 12 which is an electronic component mounted on the mounting table 11. Only parts may be set on the work table 25 as workpieces.

  (Modification 4) The electronic parts to be marked with the ink 45 are not only the semiconductor chip 12 but also flash memory cards such as USB memory, memory card, SD memory card, memory stick, smart media, xD picture card, etc. It can also be applied to packaged vibrators and the like.

  DESCRIPTION OF SYMBOLS 1 ... Marking apparatus, 2 ... Work conveying apparatus, 3 ... Carriage, 4 ... Carriage conveying apparatus, 5 ... Maintenance apparatus, 6 ... Control part, 10 ... Workpiece | work as to-be-processed object, 11 ... Mounting stand, 12 ... As electronic components Semiconductor chip, 12a ... logo mark, 12b ... product code, 12c ... serial number, 13 ... head unit as discharge unit, 15 ... irradiation device as irradiation unit, 25 ... work table, 33 ... discharge head, 37 ... nozzle 41 ... ultraviolet light, 43 ... light source, 45 ... ink as liquid, 80 ... heating lamp as heating unit.

Claims (7)

A coating step of marking by applying a liquid material having photocurability and containing 5% by mass or more of N-vinylcaprolactam to an electronic component;
An irradiation step of irradiating the applied liquid material with light having an accumulated light amount of 200 mJ / cm ² or more;
And a heating step of heating the liquid after the irradiating step. In the manufacturing method of the electronic component of Claim 1,
In the heating step, the liquid material is heated at a temperature of 150 ° C. or higher and 200 ° C. or lower. In the manufacturing method of the electronic component of Claim 1 or 2,
The liquid material contains N-vinylcaprolactam in a range of 5% by mass or more and 20% by mass or less. In the manufacturing method of the electronic component of any one of Claim 1 to 3,
An electronic component manufacturing method, further comprising a surface treatment step of activating the surface of the electronic component before the applying step. A coating step of marking by applying a liquid material having photocurability and containing 5% by mass or more of N-vinylcaprolactam to a workpiece;
An irradiation step of irradiating the applied liquid material with light having an accumulated light amount of 200 mJ / cm ² or more;
And a heating step of heating the liquid after the irradiating step. A discharge section for discharging a liquid material having photocurability and containing 5% by mass or more of N-vinylcaprolactam to a workpiece;
A marking device, comprising: an irradiation unit that irradiates the applied liquid material with light having an accumulated light amount of 200 mJ / cm ² or more. The marking device according to claim 5, wherein
A marking device, further comprising a heating unit that heats the irradiated liquid.

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