JP2012188597A5 - - Google Patents

Claims (20)

An expandable substrate film comprising 4-methyl-1-pentene (co) polymer (A) and a thermoplastic elastomer (B),
The content of (B) is 3 to 50 parts by weight with respect to a total of 100 parts by weight of (A) and (B), and the film is measured by a differential scanning calorimeter (DSC). An expandable substrate film having a melting point TmB2 derived from a temperature of 100 ° C. or lower or substantially no observation of the melting point TmB2. An expandable substrate film comprising 4-methyl-1-pentene (co) polymer (A) and a thermoplastic elastomer (B),
The content of (B) is 3 to 50 parts by weight with respect to the total of 100 parts by weight of (A) and (B), and the melting point TmB1 measured by the differential scanning calorimeter (DSC) of (B) Is an expandable base film in which the melting point TmB1 is not substantially observed.   The expandable substrate according to claim 1 or 2, wherein the 4-methyl-1-pentene (co) polymer (A) has a tensile elastic modulus at 23 ° C measured in accordance with ASTM-0638 of 500 to 2000 MPa. the film.   The expandable base film according to any one of claims 1 to 3, wherein the thermoplastic elastomer (B) has a tensile elastic modulus at 23 ° C measured in accordance with JIS K7113-1 of 1 to 50 MPa.   The expandable base film according to any one of claims 1 to 4, wherein the thermoplastic elastomer (B) comprises an olefin-based elastomer and / or a styrene-based elastomer. The density of the thermoplastic elastomer (B) is 850~980kg / ^{m 3,} expandable base film according to any one of claims 1 to 5.   0.3 to 40 parts by weight of propylene (100 to 100 parts by weight in total of 4-methyl-1-pentene (co) polymer (A), thermoplastic elastomer (B) and propylene (co) polymer (C) The expandable substrate film according to any one of claims 1 to 6, comprising a (co) polymer (C).   Furthermore, it is a film of Claim 1 containing a propylene (co) polymer (C), Comprising: Melting | fusing point TmC2 derived from the said (C) measured with a differential scanning calorimeter (DSC) about the said film is 110-175. The expandable substrate film according to claim 7, which is in the range of ° C. A TEM image of the cut surface perpendicular to the main surface of the substrate (the distance in the film thickness direction of the imaging range is 15 μm and the imaging area is 45 μm ² ), and 4-methyl-1-pentene (co) polymer (A) The expandable substrate according to any one of claims 1 to 8, wherein a phase-dispersed structure consisting of a phase substantially composed of the above and a phase substantially composed of the thermoplastic elastomer (B) is observed. the film. The expandable base film according to any one of claims 1 to 9, wherein a linear expansion coefficient (1 / K) at 120 ° C is 1.0 x 10 ^{-4 to} 2.0 x 10 ^-3 .   The expandable adhesive film containing the base material layer which consists of an expandable base film as described in any one of Claims 1 thru | or 10, and an adhesion layer.   The expandable adhesive film according to claim 11, wherein the adhesive layer has a tensile elastic modulus at 25 ° C. of 50 MPa or less.   Temperature rising rate of the adhesive layer 2 ° C./min. The expandable pressure-sensitive adhesive film according to claim 11 or 12, wherein the thermal weight loss rate when the temperature is raised from room temperature to 200 ° C is less than 2%.   The expandable adhesive film according to any one of claims 11 to 13, which has an adhesive layer on the outermost surface.   The expandable adhesive film according to any one of claims 11 to 14, wherein a tensile elastic modulus at 25 ° C of a layer other than the base material layer is less than a tensile elastic modulus at 25 ° C of the base material layer.   A semiconductor dicing film comprising the film according to claim 1.   A 4-methyl-1-pentene (co) polymer (A), a thermoplastic elastomer (B) having a melting point TmB1 obtained by a differential scanning calorimeter (DSC) of 100 ° C. or lower, or the melting point TmB1 substantially not observed The method according to claim 1, further comprising a step of forming 3 to 50 parts by weight of a melt-kneaded product with respect to a total of 100 parts by weight of (A) and (B). The manufacturing method of the expandable base film as described in any one.   A step of attaching the dicing film according to claim 16 to a semiconductor wafer via an adhesive layer of the dicing film, a step of dicing the semiconductor wafer to obtain a semiconductor chip, and expanding the dicing film, Picking up the semiconductor chip; and a method of manufacturing a semiconductor device.   A step of attaching the dicing film according to claim 16 to a surface of the semiconductor wafer having a circuit surface facing the circuit surface through an adhesive layer of the film; and a step of sealing the circuit surface of the semiconductor wafer; A method for manufacturing a semiconductor device, comprising: a step of dicing the semiconductor wafer to obtain a semiconductor chip; and a step of expanding the dicing film and picking up the semiconductor chip. A 4-methyl-1-pentene (co) polymer (A), a thermoplastic elastomer (B) having a melting point TmB1 obtained by a differential scanning calorimeter (DSC) of 100 ° C. or lower, or the melting point TmB1 substantially not observed Comprising
The melt-kneaded material for expandable substrate films, wherein the content of (B) is 3 to 50 parts by weight with respect to a total of 100 parts by weight of (A) and (B).