JP2012186095A - Light-emitting module, and lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting module capable of suppressing over-rise of a temperature of a semiconductor light-emitting element, with a simple structure, in which the wiring board mounting a light-emitting part hardly receives a stress.SOLUTION: The light-emitting module 11 is equipped with a wiring board 12 of a strip shape, a tube 15, a metallic chassis 17, and an end part cover 21. A plurality of light-emitting parts 13 are mounted on a single side of the wiring board 12. The tube 15 having light diffusion and transmission performance has a front portion 15a and a rear side portion 15b located on the upper part. The wiring board 12 is enclosed in the tube 15 by opposing the single side of the wiring board 12 mounted with the light-emitting part 13 from the upper part to the front portion 15a. The chassis 17 is installed on the outside of the tube 15 so that the rear side portion 15b may contact a heat receiving part 17a of the chassis 17 from the lower part. The end part cover 21 is connected respectively to both end parts in longitudinal direction of the chassis 17 and the tube 15 is supported by these end part cover so as to contact the chassis 17 from the lower side.

Description

  Embodiments of the present invention relate to a light emitting module including, for example, an LED (light emitting diode), and a lighting fixture including the module as a light source.

  A rectangular lighting fixture that is installed in an indoor ceiling has a fixture body that is assembled into a square shape using a metal plate, and a plurality of straight tube-type firefly light lamps have lamp sockets on the ceiling plate of the main body. Is attached via. The light from these fluorescent lamps illuminates the lower part of the lighting fixture.

  In recent years, development of lighting fixtures using LED light emitting devices as light sources instead of straight tube fluorescent lamps has been underway.

  Among the LED light emitting devices, the base light is formed by mounting a plurality of LEDs on a printed wiring board, and thus has a simple configuration. The shape of a base light used as an alternative to a straight tube fluorescent lamp is generally a strip plate, that is, the length in the direction orthogonal to the width direction of the wiring board is longer than the width dimension. By directly attaching a plurality of base lights having a configuration having such a length to the ceiling plate of the instrument body by screwing, illumination of a predetermined brightness can be achieved, and the heat generated by the LED can be transmitted to the instrument body via the wiring board. A luminaire capable of dissipating heat can be constructed.

  However, in the configuration in which a large number of base lights in the form of strips for obtaining a predetermined brightness are directly attached to the ceiling plate of the instrument main body with a plurality of screws, there are many screwing operations and it takes time to assemble. Furthermore, since the rectangular lighting fixture is relatively large, a ceiling plate made of a metal plate is often distorted when it is embedded and installed in the ceiling. Such a distortion of the ceiling plate spreads to the base light directly attached to the ceiling plate, and stresses the base light, so that there is a risk of causing a problem caused by the stress.

  Further, a round bar-shaped illumination device including an LED light emitter that can be used in place of a straight tube fluorescent lamp is known as a conventional technique.

  This illuminating device is formed in a straight tube shape by attaching cup-shaped end covers to both ends of the light emitting unit main body. The light-emitting unit body has a pair of aluminum extrusion molds, with a plurality of spacers that form gaps between them, and a wiring board on which a plurality of LED light emitters are mounted. Affixed to the surface of the substrate and a translucent cover for covering the LED light emitter is mounted on the surface of each mounting substrate. The end cover has a terminal corresponding to a lamp pin and a mounting seat, and this mounting seat is attached to the end of the light emitting unit main body. Power can be supplied to the LED light emitter through these terminals and the mounting seat.

  Since the LED light emitter generates heat with the light emission, it is required to prevent the temperature of the LED light emitter from excessively rising in order to maintain the light emission efficiency and the light emission color. However, since the round bar-shaped LED lighting device described above has a side edge of the mounting substrate exposed in a limited area between the pair of upper and lower covers and can only radiate heat from there, heat radiation is not sufficient. There is room for improvement. In addition, since the above-described lighting device is configured to illuminate mainly by projecting upward and downward, the upper LED luminous body is heated by the lower mounting substrate, and the temperature is likely to rise. In this respect as well, heat dissipation is not sufficient and there is room for improvement.

  Further, as described above, the LED lighting device having a round bar shape emits light by illuminating upward and downward, respectively, so that the number of parts is large and the configuration is complicated.

JP 2009-266432 A

  The embodiment includes a light emitting module that can suppress the temperature rise of the semiconductor light emitting element included in the light emitting unit, has a simple configuration, and the wiring board on which the light emitting unit is mounted is less susceptible to stress, and the module. It is to provide a luminaire.

  In order to solve the above problems, a light emitting module according to an embodiment includes a wiring board, a tube, a chassis, and an end cover. The wiring board has a belt-like shape, and a plurality of light emitting units having semiconductor light emitting elements that generate heat during light emission are mounted on one side thereof. The tube is light diffusive and has a front portion and a back portion located above the front portion. One side of the wiring board on which the semiconductor light emitting element is mounted is opposed to the front part from above, and the wiring board is enclosed in a tube. The chassis is made of metal and has a heat receiving portion. A chassis is disposed on the outer side of the tube so that the back surface portion is in contact with the heat receiving portion from below. The end cover has a fitting portion that fits outside the end portion of the tube. The end covers are respectively connected to both ends in the longitudinal direction of the chassis, and the tubes are supported by these end covers so as to contact the chassis from below.

  According to the light emitting module of the embodiment, the effect that the temperature rise of the semiconductor light emitting element included in the light emitting unit can be suppressed, the configuration is simple, and the wiring board on which the light emitting unit is mounted is not easily subjected to stress. Can be expected.

It is a perspective view which shows the lighting fixture which concerns on Example 1. FIG. It is sectional drawing which shows a part of lighting fixture of FIG. It is a perspective view which shows the light emitting module with which the lighting fixture of FIG. 1 is provided. It is a perspective view which shows a part of light emitting module of FIG. It is sectional drawing which shows a part of light emitting module of FIG. It is a perspective view which decomposes | disassembles and shows a part of light emitting module of FIG.

  The light-emitting module of Embodiment 1 includes a strip-like wiring board in which a plurality of light-emitting portions having semiconductor light-emitting elements that generate heat during light emission are mounted on one side; a front part and a rear part located above the front part And a light diffusing and permeable tube containing the wiring board with the one side facing the front part from above; a heat receiving part where the back part is in contact from below; A metal chassis disposed; and a fitting portion that fits into an end portion of the tube, and is connected to both longitudinal ends of the chassis, so that the tube contacts the chassis from below. A supporting end cover; and a supporting end cover.

  In the first embodiment, for example, an LED (light emitting diode) can be suitably used as the semiconductor light emitting element, and the LED includes a bullet type LED, an SMD type LED, a COB type LED, or the like. At the same time, in the first embodiment, the light emitting unit includes a translucent sealing member that protects the LED, and emits light of a desired color in combination with a phosphor mixed in the sealing member. However, the present invention is not limited to this.

  In the first embodiment, the wiring board is in the form of a band plate. The length of the wiring board in the direction orthogonal to the width direction of the wiring board is longer than the width dimension of the wiring board and has a length. The wiring board which is a structure is pointed out. When a plurality of wiring boards are used as a set, the wiring boards are arranged in the longitudinal direction, and the wiring boards adjacent in the longitudinal direction may be electrically connected using electric wires.

  In this Embodiment 1, in order to improve the diffusibility of the light in the design of a light emitting module and the front part of a tube, you may add an unevenness | corrugation etc. to a front part. In the first embodiment, it is preferable that the back portion of the tube and the heat receiving portion of the chassis with which the tube is in contact with each other are flat, but a concave portion or a convex portion may be provided in part. In the configuration in which the back surface portion and the heat receiving portion are provided with unevenness, there is an advantage that the strength of the tube and the chassis can be increased, and in the configuration in which the upward convex portion is provided in the heat receiving portion, there is an advantage that the heat radiation area of the chassis can be increased. .

  In the first embodiment, it is preferable that the chassis is formed by bending a single metal plate or a metal extrusion mold material in order to reduce the number of parts. However, the chassis is configured by assembling a plurality of metal members. It doesn't matter. In the first embodiment, the fitting portion of the end cover may be fitted to the outer end of the tube, the inner side of the end, or both of them.

  The light-emitting module of Embodiment 1 is configured to allow light emitted from the light-emitting unit to pass through mainly the front part of the tube protecting the wiring board and the light-emitting unit and emit downward to illuminate downward. There is no floodlight. This eliminates the need for a wiring board for upward illumination, a tube, a chassis, a pair of end covers, and the like, so that the configuration is simple.

  Furthermore, in the light emitting module of Embodiment 1, the wiring board on which the light emitting part having the semiconductor light emitting element is mounted is accommodated in a tube, and this tube is supported over the end covers connected to both ends in the longitudinal direction of the chassis. Has been. For this reason, even if the module installation member to which the light emitting module of Embodiment 1 is attached is distorted, it is difficult for the influence to be exerted on the wiring board, so that the wiring board can be prevented from being stressed.

  In addition, during the light emission of the light emitting module of Embodiment 1, the wiring substrate is heated by this heat as the semiconductor light emitting element of the light emitting section generates heat, and further, the back portion of the tube is mainly due to the heat radiation upward from the wiring substrate. Heated. Since this back surface part contacts the heat receiving part of the metal chassis from below, the heat of the tube is conducted to the chassis arranged outside the tube, and the heat of the chassis is released into the surrounding atmosphere. By such heat radiation, it is possible to suppress the temperature of the semiconductor light emitting element of the light emitting unit mounted on the wiring board from rising excessively.

  In the light emitting module of Embodiment 2, in Embodiment 1, the fitting portion is fitted to the outside of the end portion of the tube, and the tube has a substrate support portion facing the width direction of the tube. Thus, the circuit board support section supports the wiring board contained in the tube at a position closer to the back portion than the front portion.

  In the second embodiment, the substrate support part can be formed by a step in addition to the rib-like convex part protruding into the tube.

  In the second embodiment, the back portion of the tube is easily heated by the wiring board during the light emission in the first embodiment. In addition, since the temperature of the back surface portion is relatively higher than that of the front surface portion of the tube located below the back surface portion, the back surface portion has a larger elongation than the front surface portion. In this case, since the elongation of the tube is suppressed by the end covers at both ends, the tube is warped upward and the back surface portion thereof is brought into close contact with the heat receiving portion of the chassis. For this reason, heat conduction from the back surface portion to the heat receiving portion is performed more favorably. Such an improvement in heat dissipation can suppress the temperature of the semiconductor light emitting element of the light emitting unit mounted on the wiring board from rising excessively.

  The light emitting module according to Embodiment 3 is characterized in that, in Embodiment 1 or 2, the chassis has a pair of reflecting plate portions facing side edge portions extending in the longitudinal direction of the tube.

  In the third embodiment, the reflecting plate portion may or may not be formed by bending from the heat receiving portion, and the reflecting plate portion preferably faces the side edge portion of the tube from above, Even if the reflecting plate portion is bent obliquely downward, it may be opposed to the side edge portion obliquely from below. When the reflector is bent obliquely downward or when the reflector is substantially parallel to the side edge, the distance between the tips of the pair of reflectors, that is, the width of the chassis, It may be carried out with a width wider than.

  In the third embodiment, in the first or second embodiment, a part of the light emitted from the light emitting portion and diffused at the side edge portion of the tube is emitted upward from the side edge portion. Therefore, the upward light can be reflected downward by the reflection plate portion of the chassis to improve the instrument efficiency.

  A light emitting module according to a fourth embodiment is the light emitting module according to the third embodiment, wherein the chassis is formed by bending a single metal plate, and the reflecting plate portion is bent obliquely upward and passes through the reflecting plate portion. The cross-sectional shape is a groove shape that opens upward.

  In the fourth embodiment, since a chassis made of a single member is further provided in the third embodiment, the configuration of the light emitting module is simpler, and the chassis that bears the strength of the light emitting module is made of a single metal plate. Nevertheless, the required strength of the chassis can be ensured by using the reflector.

  The lighting fixture of Embodiment 5 has an embedded fixture main body assembled into a square shape having a ceiling plate made of a metal plate; and installed in the fixture main body and attached to the ceiling plate. And a light emitting module according to any one of 4 above.

  The lighting apparatus of Embodiment 5 can be applied to, for example, an embedded lighting apparatus that is embedded in a ceiling, a ceiling direct mounting lighting apparatus, and a hanging lighting apparatus. At the same time, in the fifth embodiment, the lower surface of the instrument body may be open or may be closed by a lighting cover or the like. Further, in the fifth embodiment, the light emitting module can be attached to the ceiling board by attaching the light emitting module to the ceiling board using the end cover, or a fixing part is provided on the chassis, and the fixing part is attached to the ceiling board. It is also possible to implement by attaching by screwing or the like.

  Since the lighting fixture of Embodiment 5 uses any one of the light-emitting modules according to claims 1 to 4 as a light source, it is possible to suppress an overtemperature of the semiconductor light-emitting element included in the light-emitting unit, and the configuration is simple. Even if a certain light emitting module is provided and the ceiling plate of the instrument body is distorted, an effect that the wiring board included in the light emitting module attached to the ceiling plate is not easily stressed can be expected.

  In the lighting fixture of Embodiment 6, in Embodiment 5, the lower end of the fixture body is opened as a light output opening, and a ventilation space is formed between the chassis of the light emitting module and the ceiling plate. It is characterized by that.

  In the sixth embodiment, in addition to the fifth embodiment, convection air can be circulated in the instrument body with the lower surface opened in a ventilation space formed between the chassis of the light emitting module and the ceiling plate of the instrument body. Therefore, as the heat dissipation from the chassis of the light emitting module is further improved, it is possible to further suppress the temperature rise of the semiconductor light emitting element included in the light emitting unit.

  Hereinafter, the light emitting module of Example 1 and the embedded lighting fixture with the lower surface using the light emitting module as a light source will be described in detail with reference to FIGS.

  Reference numeral 1 in FIGS. 1 and 2 denotes a lighting fixture. The lighting fixture 1 includes a square fixture body 2, a pair of power supply devices 7, a plurality of light emitting modules 11, and a baffle 31.

  The instrument body 2 is formed by combining a reflector 3 made of a metal plate and a body chassis 5.

  The reflector 3 has a flat ceiling plate 3a and a first side plate portion 3b to a fourth side plate portion 3e. The plan view shape of the ceiling board 3a is a square, for example, a regular square. A pair of work openings 3f (only one shown) and a plurality of electric wire through holes (not shown) are provided at predetermined locations on the ceiling board 3a. The working opening 3f is a rectangle that is long in the direction in which the straight line connecting the second side plate portion 3d and the fourth side plate portion 3e extends, and is used for passing a tool or the like when the instrument body 2 is installed in an indoor ceiling. It is done. An insulation covered electric wire (not shown) for connecting a power supply device 7 and a light emitting module 11 described later is passed through the electric wire passage hole.

  The first side plate portion 3b and the second side plate portion 3c are bent obliquely downward from the parallel edge of the ceiling plate 3a. The distance between the first side plate portion 3b and the second side plate portion 3c gradually increases toward the lower side. The 3rd side board part 3d and the 4th side board part 3e cover the edge part of the ceiling board 3a, the 1st side board part 3b, and the 2nd side board part 3c, and are connected with these edge parts. The third side plate portion 3d and the fourth side plate portion 3e are perpendicular to the ceiling plate 3a and continue downward. The lower ends of the first side plate portion 3 b to the fourth side plate portion 3 e define a light emission opening, and this opening is open to the lower surface of the instrument body 2.

  The main chassis 5 is formed by bending a metal plate that is thicker and stronger than the metal plate forming the reflector 3. As shown in FIG. 2, the main body chassis 5 includes a base portion 5a and a pair of chassis side plate portions 5b (only one of them is shown) bent downward therefrom. The base portion 5a covers the ceiling plate 3a from above and is connected to the ceiling plate 3a. The chassis side plate portion 5b covers most of the second side plate portion 3c or the second side plate portion 3d from the side, and is connected to the lower ends of these side plate portions.

  The base portion 5a is provided with a plurality of instrument mounting holes 5c (only one is shown in FIG. 2). These instrument mounting holes 5c face the work opening 3f. The instrument body 2 is inserted in the back of the ceiling until the lower edge of the first side plate portion 3b to the fourth side plate portion 3e comes into contact with the square instrument mounting hole opened in the indoor ceiling from below. The nut is screwed and tightened to the suspension bolt on the back of the ceiling that is passed through the mounting hole 5c, thereby being embedded in the ceiling.

  As shown in FIG. 2, one corner of the main body chassis 5 formed by the base 5a and the chassis side plate 5b faces the outer surface of the first side plate 3b, and a space S is formed between them. Yes. The other corner portion (not shown) of the main body chassis 5 formed by the base portion 5a and the chassis side plate portion 5b is also opposed to the outer surface of the second side plate portion 3c, and a space is also formed therebetween.

  A pair of power supply devices 7 (only one of which is shown in FIG. 2) for supplying power to a light emitting module 11 to be described later are respectively disposed in the space S and screwed to the base portion 5a. A power line (F cable) wired on the back of the ceiling is connected to these power supply devices 7, and an insulation coated electric wire (not shown) that is passed through the electric wire through hole is connected.

  For example, six light emitting modules 11 (only five are shown in FIG. 1) are used. Next, the light emitting module 11 will be described with reference to FIGS. The light emitting module 11 includes a wiring board 12, a tube 15, a chassis 17, and a pair of end covers 21.

  The wiring board 12 has a strip shape in which the length in the direction perpendicular to the width direction is longer than the width dimension of the wiring board 12. A wiring pattern (not shown) is provided on one side surface (one surface) of the wiring board 12 having a configuration having a length in this way. Further, a heat spreader (not shown) is provided on the other side surface of the wiring board 12 to further improve the heat dissipation from the wiring board 12 to the outside. This heat spreader is made of a metal layer such as copper laminated over substantially the entire other side surface.

  A plurality of light emitting portions (see FIGS. 2, 4, and 5) 13 are mounted on the one surface of the wiring board 12. Arrangement patterns of these light emitting portions 13 are arbitrary, and in the first embodiment, the light emitting portions 13 are arranged in a line at a predetermined interval in the longitudinal direction of the wiring substrate 12 on one end side in the width direction of the wiring substrate 12. The other ends in the width direction are also arranged in a row at a predetermined interval in the longitudinal direction of the wiring board 12.

  For example, SMD type LEDs are used for the light emitting units 13. In the SMD type LED, a reflector having a truncated cone-shaped hole is bonded on a light emitting unit base provided with an electrode, and an LED chip which is a semiconductor light emitting element is formed on the light emitting unit base forming the bottom surface of the reflector. This LED chip is formed by connecting the LED chip to the electrode by wire bonding or the like, and further filling the hole of the reflector with a translucent sealing member mixed with a phosphor and sealing the LED chip. Yes. This SMD type LED is disposed at a predetermined position by connecting an electrode routed on the back surface of the light emitting unit base to the wiring pattern of the wiring board 12.

  The LED chip is formed of a bare chip that emits blue light, for example, and the chip generates heat when the light is emitted. In order to allow white light to be emitted from the light emitting unit 13, the phosphor mixed in the sealing member is excited by blue light emitted from the LED chip and emits yellow light. The body is used. The LED chip included in the LED constituting the light emitting unit 13 is a semiconductor that directly converts electric energy into light, and the light emission is realized by passing a forward current through a pn junction of the semiconductor. A semiconductor light-emitting element that emits light based on such a light emission principle has an energy saving effect as compared with an incandescent bulb that inclines a filament to a high temperature by energization and emits visible light by its thermal radiation.

  The tube 15 is formed of an extruded product of a light diffusive and transparent material such as polycarbonate resin. The tube 15 is longer than the wiring board 12 on which the light emitting unit 13 is mounted, and both ends in the longitudinal direction are opened. As shown in FIGS. 2 to 4, the tube 15 has a front portion 15 a, a back portion 15 b, and a side edge portion 15 c and is formed in a deformed cylindrical shape.

  The front portion 15 a forms the lower surface of the tube 15. Since the front portion 15a has spacer protrusions 15d protruding downward, for example, on both sides in the width direction, the front portion 15a is uneven. A back surface portion 15b positioned above the front surface portion 15a is formed flat and forms the upper surface of the tube 15. The width of the back portion 15b is narrower than the width of the front portion 15a. The side edge portion 15 c integrally connects the front portion 15 a and the rear portion 15 b and forms the side portion of the tube 15. These side edge portions 15c are provided so as to protrude in the width direction of the tube 15 with respect to the back surface portion 15b.

  A substrate support portion 15e is provided on the inner surface of the upper portion of each side edge portion 15c that is bent and continuous with the back surface portion 15b. These substrate support portions 15e are formed of ribs facing each other in the width direction of the tube 15, and extend over the entire length in the longitudinal direction of the tube 15 in the same manner as the spacer convex portion 15d. Furthermore, the board | substrate support part 15e is provided in the height position more than the center position of the thickness direction of the tube 15, for example, the height position which approached the back surface part 15b rather than the front surface part 15a.

  A wiring board 12 is included in the tube 15. The wiring board 12 is supported in the tube 15 by placing both sides in the width direction on the board support part 15e. Therefore, the wiring board 12 included in the tube 15 is disposed at a position closer to the back surface portion 15b than to the front surface portion 15a. One side of the wiring board 12 included in the tube 15 on which the light emitting units 13 are mounted faces the front part 15a from above. Since this tube 15 covers the wiring pattern which is the charging part of the wiring board 12 and each light emitting part 13, it is possible to protect these wiring board 12 and each light emitting part 13 both electrically and mechanically. is there.

  The chassis 17 is formed by bending a single metal plate. The total length of the chassis 17 is longer than the total length of the tube 15. As shown in FIGS. 2, 4, and 6, the chassis 17 has a heat receiving portion 17a, a pair of side plate portions 17b, and a pair of reflecting plate portions 17c, and passes through the pair of reflecting plate portions 17c. The cross-sectional shape of the chassis 17 is a groove shape that opens upward. The chassis 17 is a member that bears the strength of the light emitting module 11. Although the chassis 17 is made of a single metal plate, it is formed in a groove shape as described above, so that the strength of the chassis 17 is ensured sufficiently.

  The heat receiving portion 17a is flat, for example, and its width is substantially equal to the width of the back portion 15b. At both ends in the longitudinal direction of the heat receiving portion 17a, a through groove 17d (see FIGS. 4 and 6) is cut out. The pair of side plate portions 17b are bent upward and substantially at right angles from both ends in the width direction of the heat receiving portion 17a. Screw holes 18 are provided at both ends in the longitudinal direction of the side plate portions 17b as shown in FIG.

  The pair of reflecting plate portions 17c are bent, for example, obliquely upward from the upper edge excluding both longitudinal ends of the side plate portion 17b. These reflecting plate portions 17c face side edge portions 15c extending in the longitudinal direction of the tube 15 from above. At the same time, the distance between the tips of the pair of reflecting plate portions 17 c is substantially equal to the width of the tube 15. Accordingly, when the adjacent light emitting modules 11 are arranged close to each other as shown in FIG. 2, it is possible to prevent the reflection plate portions 17 c from interfering with each other to interfere with the arrangement.

  The pair of end covers 21 are made of synthetic resin, and are provided with a fitting portion 23 and a chassis pressing portion 24 at the bottom of a cover base 22 extending in the vertical direction as shown in FIGS. A portion 25 and a stabilizing plate portion 26 are provided, and a connecting portion 27 is provided on each side of the cover base 22.

  The height dimension of the cover base 22 is larger than the total thickness dimension of the tube 15 and the chassis 17 in the vertical direction. The fitting portion 23 fitted to the outside of the end portion in the longitudinal direction of the tube 15 has a shape substantially corresponding to the cross-sectional shape of the tube 15, and the tip and upper surface thereof are open. The depth L (see FIG. 5) of the fitting portion 23 is defined as a depth at which the fitting with the tube 15 is maintained even when the entire length of the tube 15 is shortened. At the same time, the fitting portion 23 has a stopper portion 23a with which the lower end surface of the tube 15 comes into contact when the entire length of the tube 15 extends due to thermal expansion.

  The chassis pressing portion 24 is provided so as to face the open top surface of the fitting portion 23 from above. The attachment portion 25 is a portion connected to the main body chassis 5 and includes, for example, an upper sandwiching plate 25a and a lower sandwiching plate 25b. Note that the attachment portion 25 can be formed by a portion screwed to the main body chassis 5. Further, the stabilizing plate portion 26 protrudes in the direction opposite to the mounting portion 25 with the cover base 22 as a boundary. The one end cover 21 and the mounting portion 25 of the other end cover 21 are provided in the same direction, and the stabilizing plate portion 26 of these end covers 21 is also provided in the same direction.

  The pair of connecting portions 27 are provided so as to continue to the upper side of both end portions in the width direction of the fitting portion 23, and face the width direction of the cover base 22. Along with this, the connecting portion 27 has a threaded portion made of, for example, a recess.

  Next, the assembly procedure of the light emitting module 11 will be described.

  First, the wiring board 12 on which the plurality of light emitting units 13 are mounted is included in the tube 15. In this case, the wiring board 12 is inserted into the upper part of the tube 15 from one end to the other end in the longitudinal direction of the tube 15, and both sides in the width direction of the wiring board 12 are placed across the pair of board support portions 15 e.

  Next, the chassis 17 is disposed outside the tube 15. That is, the chassis 17 is placed with the heat receiving portion 17 a of the chassis 17 in contact with the back surface portion 15 b of the tube 15. At the same time, an insulation-coated electric wire (not shown) drawn from the open end face of the tube 15 is drawn through the through-groove 17d of the chassis 17 and placed on the upper surface of the heat receiving portion 17a.

  Thereafter, end covers 21 are assembled to the longitudinally opposite ends of the tube 15 and the chassis 17 that are stacked one above the other. As a result, the fitting portion 23 of the end cover 21 is fitted to the outer end of the tube 15 in the longitudinal direction. At the same time, the end portion in the longitudinal direction of the heat receiving portion 17 a is provided in contact with the lower surface of the chassis pressing portion 24, and the end surface in the longitudinal direction of the heat receiving portion 17 a is provided in contact with the side surface of the cover base 22. Further, both end portions in the longitudinal direction of the side plate portion 17b of the chassis 17 overlap the connecting portion 27 of the end cover 21, respectively, and the screw hole 18 of the side plate portion 17b and the threaded portion of the connecting portion 27 face each other.

  Finally, the chassis 17 and the end cover 21 are connected to each other by screwing them into the screw holes 18 through the connecting screws 29 (see FIGS. 3 to 5) through the threaded portions. With this assembly, the pair of end covers 21 are attached to both ends in the longitudinal direction of the chassis 17, whereby the end covers 21 support the tube 15 so as to contact the chassis 17 from below.

  When the light emitting module 11 is turned off and at normal temperature, the end surfaces of the tubes 15 supported at both ends by the pair of end covers 21 are formed on the stopper portions 23a of the fitting portions 23 as shown in FIG. They are in contact or close to the stopper portion 23a with a slight gap.

  At the same time, the end surface of the tube 15 is separated from the side surface of the cover base 22, and the insulation-coated electric wire (not shown) is passed through the gap between them and the wiring groove 17 d communicated with the gap from above. In addition, the electric wire connector is attached to the front-end | tip part of this insulation coating electric wire.

  Further, the height of the spacer projection 15d is not provided between the lower surface of the end of the tube 15 fitted inside the fitting portion 23 and the lower inner surface of the fitting portion 23 except for the spacer projection 15d. A gap corresponding to is provided. As described above, since both ends of the tube 15 are not closed by the end cover 21, convection of air over the inside and outside of the tube 15 is possible.

  Moreover, each light emitting module 11 is arrange | positioned in the instrument main body 2, and is attached to the ceiling board 3a. The longitudinal direction of each light emitting module 11 attached as shown in FIG. 1 coincides with the direction in which the straight line connecting the third side plate portion 3d and the fourth side plate portion 3e extends, and each light emitting module 11 is a first side plate. The straight lines connecting the part 3b and the second side plate part 3c are arranged in the extending direction.

  Each light emitting module 11 is attached to the ceiling plate 3a after inserting the upper sandwiching plate 25a of the attachment portion 25 of the end cover 21 into the module attachment hole 3g (see FIG. 5) provided in the ceiling plate 3a. As the entire light emitting module 11 is moved in the direction in which the mounting portion 25 is projected, the upper sandwiching plate 25a and the lower sandwiching plate 25b of the mounting portion 25 sandwich the periphery of the mounting hole 3g from above and below. . According to such an attachment procedure, it is not necessary to screw several places of each wiring board 12 to the ceiling plate 3a of the reflector 3, so that each light emitting module 11 can be easily disposed at a predetermined position. It is.

  With such attachment, the tube 15 and the chassis 17 on the tube 15 are separated from the ceiling plate 3a by using a portion from the fitting portion 23 to the stabilizing plate portion 26 of the end cover 21 as a spacer. In other words, a ventilation space G (see FIG. 5) is formed between the chassis 17 and the ceiling plate 3a.

  This ventilation space G is also used as a space for arranging the electric wire connector. That is, the wire connector connected to the tip of the insulation-coated wire drawn from the light emitting module 11 and the wire connector connected to the tip of the insulation-coated wire drawn from the power supply device 7 are coupled to each other. These electric wire connectors are arranged in the ventilation space G.

  Since the lighting fixture 1 has the ventilation space G, air convection in the reflector 3 with the lower surface of the fixture main body 2 opened is circulated in the ventilation space G while each light emitting module 11 emits light. Can do. Since the chassis 17 of the light emitting module 11 is exposed to this circulating air, the heat dissipation from the chassis 17 to the surrounding space is further improved.

  Further, as described above, the light emitting module 11 includes the wiring board 12 on which the plurality of light emitting portions 13 are mounted in the tube 15 supported over the end cover 21 connected to both ends in the longitudinal direction of the chassis 17. ing. For this reason, even if the ceiling plate 3a (module installation member) of the reflector 3 to which the light emitting module 11 is attached is distorted, the influence is not propagated to the wiring board 12. That is, it is possible to suppress the wiring board 12 from being stressed by the distortion of the ceiling board 3a.

  As shown in FIGS. 1 and 2, the baffle 31 is formed of a plurality of baffle bases 32 bent in a V-shaped cross section, and a plurality of baffle plates 33 attached to the baffle bases 32 so as to cross each other. Yes. The baffle 31 that defines the light shielding angle is housed in the reflector 3 by being hooked on the upper edge of the baffle base 32 and the engaging portion formed on the ceiling plate 3a. The baffle base 32 is provided in parallel with the light emitting module 11 and covers the work opening 3f of the ceiling plate 3a from below. The baffle plate 33 is disposed at a position below each light emitting module 11 so as to extend in a direction perpendicular to the longitudinal direction of the light emitting modules 11.

  The light-emitting module 11 included in the lighting fixture 1 having the above-described configuration is configured such that light emitted from each light-emitting portion 13 mounted on the wiring board 12 passes through the front portion 15a of the tube 15 and is emitted downward. It is the structure which illuminates, and does not have the structure which projects upwards. Thus, the light emitting module 11 does not require a wiring board for upward illumination, a tube, a chassis, a pair of end covers, and the like, and thus has a simple configuration.

  During the light emission of the light emitting module 11 of the lighting fixture 1 having the above-described configuration, the LED chip of each light emitting unit 13 generates heat, so that the wiring board 12 is heated by this heat, and further, by the heat radiation upward from the wiring board 12 The back portion 15b of the tube 15 is mainly heated.

  By the way, the light emitting part 13 is not emitting light, and the total length of the tube 15 in a state where the temperature is lowered as compared to during light emission is shorter than the total length of the tube 15 in a state where the temperature is increased with light emission. However, even in this state, the fitting between the end of the tube 15 and the fitting portion 23 of the end cover 21 is maintained. In the state where the temperature is lowered, as the tube 15 is curved so as to protrude downward in accordance with its length and weight, the back surface portion 15b may be distant from the heat receiving portion 17a.

  Nevertheless, according to the light emitting module 11 having the above configuration, the back surface portion 15b can be reliably brought into contact with the heat receiving portion 17a of the chassis 17 from below with the light emission.

  Specifically, during light emission, the back surface portion 15b of the tube 15 is easily heated by the wiring substrate 12, and in addition, the wiring substrate 12 is supported in the tube 15 at a position closer to the back surface portion 15b than the front surface portion 15a. The rear portion 15b is easily heated by the heat released upward from the wiring board 12 acting directly.

  Such heating causes the temperature of the back surface portion 15b to be relatively higher than that of the front surface portion 15a positioned below, so that the back surface portion 15b extends in the longitudinal direction in the longitudinal direction of the front surface portion 15a. Greater than. When the tube 15 is to be extended in this way, even if both ends thereof are close to the stopper portion 23a of the end cover 21, the tube 15 immediately comes into contact with the stopper portion 23a. The tube 15 is restrained by the part cover 21, and the tube 15 warps upward due to the force of the tube 15. Thereby, the back surface part 15b of the tube 15 is brought into close contact with the heat receiving part 17a of the chassis 17 from below.

  Therefore, the heat of the tube 15 is favorably conducted from the back surface portion 15 b of the tube 15 to the heat receiving portion 17 a of the chassis 17 disposed outside the tube 15. The heat of the chassis 17 is released into the surrounding atmosphere. Such heat dissipation suppresses the temperature of the LED chip included in the light emitting unit 13 mounted on the wiring board 12 from being excessively increased. Along with this, it is possible to suppress a decrease in light emission efficiency and a change in light emission color of the light emitting unit 13 having the LED chip.

  Further, the chassis 17 of the light emitting module 11 has a pair of reflecting plate portions 17c facing the side edge portions 15c extending in the longitudinal direction of the tube 15 from above. Therefore, among the light emitted from the light emitting portion 13 and diffused at the side edge portion 15c, the light emitted upward from the side surface portion 15c can be reflected downward by the reflector 17c of the chassis 17. Accordingly, it is possible to improve the instrument efficiency.

  DESCRIPTION OF SYMBOLS 1 ... Lighting fixture, 2 ... Appliance main body, 3a ... Ceiling board, 11 ... Light emission module, 12 ... Wiring board, 13 ... Light emission part, 15 ... Chu, 15a ... Front part of a tube, 15b ... Back part of a tube, 15c ... Side edge part of tube, 15e ... Substrate support part, 17 ... Chassis, 17a ... Heat receiving part, 17c ... Reflecting plate part, 21 ... End cover, 23 ... Fitting part, G ... Ventilation space

Claims (6)

A belt-like wiring board on which a plurality of light emitting portions having semiconductor light emitting elements that generate heat during light emission are mounted on one side;
A light diffusive and transparent tube having a front part and a rear part located above the front part, and including the wiring board with the one side facing the front part from above;
A metal chassis disposed on the outside of the tube with a heat receiving portion that is in contact with the back portion from below;
An end cover that has a fitting portion that fits to an end portion of the tube, is connected to both longitudinal ends of the chassis, and supports the tube so as to contact the chassis from below;
A light emitting module comprising:   The fitting portion is fitted to the outside of the end portion of the tube, and the tube has a substrate support portion facing in the width direction of the tube, and the tube support portion includes the substrate support portion. The light emitting module according to claim 1, wherein the printed wiring board is supported at a position closer to the back portion than the front portion.   3. The light emitting module according to claim 1, wherein the chassis has a pair of reflecting plate portions opposed to each of side edge portions extending in a longitudinal direction of the tube from above.   The chassis is formed by bending a single metal plate, the reflecting plate portion is bent obliquely upward, and the cross-sectional shape of the chassis passing through the reflecting plate portion is a groove shape that opens upward. The light emitting module according to claim 3. An embedded device body assembled into a square shape with a ceiling plate made of metal plate;
The light emitting module according to any one of claims 1 to 4, wherein the light emitting module is disposed in the instrument body and attached to the ceiling plate.
The lighting fixture characterized by comprising.   The lighting fixture according to claim 5, wherein a lower end of the fixture body is opened as a light output opening, and a ventilation space is formed between a chassis of the light emitting module and the ceiling plate. .

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