JP2012185607A - Conductive sheet and touch panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive sheet capable of securing high transparency and also improving a yield even when constituting an electrode with a pattern of a thin metallic wire in a touch panel.SOLUTION: A conductive sheet has a transparent base substance 12, and a second conductive part 13B formed on the other principal surface of the transparent base substance 12, in which at least the second conductive part 13B is adhered to a display device 108 through a transparent adhesive 120. The second conductive part 13B has a mesh-shaped structure part formed by thin metallic wires; an acute angle between the principal surface of the transparent base substance 12 and a side wall of the thin metallic wire; and peel adhesive strength of the second conductive part 13B with the transparent adhesive 120 is 0.1 N/10 mm or more and 5 N/10 mm or less.

Description

  The present invention relates to a conductive sheet and a touch panel, for example, a conductive sheet and a touch panel suitable for use in a projected capacitive touch panel.

As for the transparent conductive film using a thin metal wire, for example, as disclosed in Patent Documents 1 and 2, research continues.
Recently, the touch panel has attracted attention. The touch panel is mainly applied to a small size such as a PDA (personal digital assistant) or a mobile phone, but it is considered that the touch panel will be increased in size by being applied to a display for a personal computer.
In such future trends, since conventional electrodes use ITO (Indium Tin Oxide), as the resistance increases and the application size increases, the current transfer speed between the electrodes decreases, and the response speed There is a problem that the time from when the fingertip is touched until the position is detected is delayed.
Therefore, it is conceivable to reduce the surface resistance by forming an electrode by arranging a large number of grids made of metal fine wires (metal fine wires). For example, Patent Documents 3 to 9 are known as touch panels using metal fine wires as electrodes.

US Patent Application Publication No. 2004/0229028 International Publication No. 2006/001461 Pamphlet JP-A-5-224818 US Pat. No. 5,130,041 International Publication No. 1995/27334 Pamphlet US Patent Application Publication No. 2004/0239650 US Pat. No. 7,202,859 International Publication No. 1997/18508 Pamphlet JP 2003-099185 A

However, when a thin metal wire is used for an electrode, transparency and visibility become a problem because the thin metal wire is made of an opaque material.
The present invention has been made in consideration of such problems. Even when the electrode is configured with a thin metal wire pattern in the touch panel, high transparency can be ensured and the yield can be improved. An object is to provide a conductive sheet and a touch panel that can be used.

[1] A conductive sheet according to a first aspect of the present invention includes a base and a conductive portion formed on one main surface of the base, and at least the conductive portion is bonded to another object via an adhesive. In the conductive sheet, the conductive part has a network-like structure part of fine metal wires, an angle formed between the main surface of the base and the side wall of the fine metal line is an acute angle, and the adhesive part in the conductive part is The peel adhesive strength is 0.1 N / 10 mm or more and 5 N / 10 mm or less.
In the case where the conductive portion has a network structure of fine metal wires, it is conceivable to increase the thickness of the fine metal wires for the purpose of further reducing the surface resistance. However, when another object (such as a display device or an antireflection film) is pasted on the electrode via an adhesive (or adhesive sheet), bubbles enter between the conductive sheet and the adhesive (or adhesive sheet). It becomes easy and the beauty is damaged. If the thickness of the fine metal wire is large, the adhesive (or adhesive sheet) is likely to be firmly fixed to the fine metal wire, and partly when reapplying when there is a sticking error (sticking position misalignment, etc.) There is a problem that the fine metal wires are peeled off or the conductive sheet is deformed to cause a disconnection in a part of the fine metal wires.
Therefore, in the first aspect of the present invention, the angle formed by one main surface of the substrate and the side wall of the fine metal wire is an acute angle, and the peel adhesive strength with the adhesive in the conductive portion is 0.1 N / 10 mm or more and 5 N / 10 mm or less. It is trying to become.
Thereby, even if the thickness of the fine metal wire is increased for the purpose of reducing the surface resistance, the adhesive force of the adhesive (or adhesive sheet) to the fine metal wire is smaller than the adhesive force of the fine metal wire to the substrate. Even when the (or adhesive sheet) is reapplied, the fine metal wire does not peel from the substrate. Moreover, there is almost no air bubble mixing when the adhesive (adhesive sheet) is attached. As a result, the adhesive (or adhesive sheet) can be attached and reattached easily, the time required for assembly of the entire touch panel can be reduced, and the yield of the touch panel is improved. Can be made.
[2] In the first aspect of the present invention, the thin metal wire may have a substantially trapezoidal cross section.
[3] In the first aspect of the present invention, the angle formed is preferably 50 ° or more and less than 90 °.
[4] In the first aspect of the present invention, it is preferable that a peel adhesive force with the adhesive in the conductive portion is 0.3 N / 10 mm or more.
[5] When a conductive sheet is used as a conductive sheet for a touch panel, the thinner the display panel, the wider the viewing angle, which is preferable. From such a viewpoint, the thickness of the fine metal wire is preferably 9 μm or less.
[6] In the first aspect of the present invention, b1 * is a reflection chromaticity of the conductive portion measured from one main surface side of the substrate, and b2 is a reflection chromaticity of the conductive portion measured from the other main surface side of the substrate. *
| B1 * -b2 * | ≦ 2.0
It is characterized by being.
Thereby, the color of the electroconductive part which looked at the electroconductive sheet from the surface and the color of the electroconductive part which looked at the electroconductive sheet from the back surface hardly change.
[7] In this case, the thickness of the substrate is preferably 75 μm or more and 200 μm or less.
[8] In the first aspect of the present invention, the total light transmittance is 85% or more, and the surface resistance of the conductive portion is 100 ohm / sq. The following is preferable.
[9] In the first aspect of the present invention, when the surface resistance of the conductive part before the following bending test is R1, and the surface resistance of the conductive part after the following bending test is R2, R2 / R1 <3 is satisfied.
[In the bending test, the conductive sheet is hooked on a roller having a diameter of 4 mm, which is rotatably attached to the base, and one end of the conductive sheet is pulled with a tension of 28.6 kg per 1 m width. The step of bending the conductive sheet by rotating and the step of bending the conductive sheet by rotating the roller while pulling the other end of the conductive sheet with a tension of 28.6 kg per 1 m width are repeated. The conductive sheet is bent 100 times. ]
Thereby, even when the conductive sheet is deformed when the adhesive (or adhesive sheet) is reapplied, a part of the fine metal wire is not disconnected, and the manufacturing yield can be improved.
[10] More preferably, R2 / R1 <1.5.
[11] A conductive sheet according to a second aspect of the present invention includes a base, a first conductive portion formed on one main surface of the base, and a second conductive portion formed on the other main surface of the base. And at least one of the first conductive portion and the second conductive portion is a conductive sheet bonded to another object via an adhesive, the first conductive portion and the second conductive portion. Each of the two conductive portions has a network-like structure portion made of a fine metal wire, and an angle formed by one main surface of the base and a side wall of the fine metal wire in the first conductive portion, and the other main surface of the base and the second The angle formed by the side wall of the thin metal wire in the conductive part is an acute angle, and the peel adhesive strength with the adhesive in the conductive part is 0.1 N / 10 mm or more and 5 N / 10 mm or less.
Thereby, in the conductive sheet having the conductive portions on both surfaces of the substrate, when the adhesive (adhesive sheet) is pasted, there is almost no air bubbles mixed, and even if the adhesive is reapplied, the fine metal wires are peeled off. There is nothing. This is advantageous in improving the yield of the conductive sheet.
[12] In the second aspect of the present invention, the first conductive portion is bonded to the first object via the first adhesive, and the second conductive portion is bonded to the second object via the second adhesive, Even if the peel adhesive force with the first adhesive in the first conductive part and the peel adhesive force with the second adhesive in the second conductive part are 0.1 N / 10 mm or more and 5 N / 10 mm or less, respectively. Good.
[13] In the second aspect of the present invention, the fine metal wire may have a substantially trapezoidal cross section.
[14] In the second aspect of the present invention, the angle formed is preferably 50 ° or more and less than 90 °.
[15] In the second aspect of the present invention, it is preferable that a peel adhesive force with the adhesive in the conductive portion is 0.3 N / 10 mm or more.
[16] In the second aspect of the present invention, the thickness of the fine metal wire is preferably 9 μm or less.
[17] In the second aspect of the present invention, b1 * is the reflection chromaticity of the first conductive portion measured from one main surface side of the base, and the reflection of the second conductive portion is measured from the main surface side of the base. When chromaticity is b2 *,
| B1 * -b2 * | ≦ 2.0
It is characterized by being.
Thereby, the boundary between the network structure of the first conductive part and the network structure of the second conductive part becomes inconspicuous, and the visibility is improved.
[18] In the second aspect of the present invention, the substrate preferably has a thickness of 75 μm or more and 200 μm or less.
[19] In the second aspect of the present invention, the total light transmittance is 85% or more, and the surface resistance of the first conductive portion and the second conductive portion is 100 ohm / sq. The following is preferable.
[20] In the second aspect of the present invention, R1a and R1b represent the surface resistances of the first conductive portion and the second conductive portion before the following bending test, and the first conductivity after the following bending test. R2a / R1a <3 and R2b / R1b <3 are satisfied, where R2a and R2b are the surface resistances of the second portion and the second conductive portion.
[In the bending test, the conductive sheet is hooked on a roller having a diameter of 4 mm, which is rotatably attached to the base, and one end of the conductive sheet is pulled with a tension of 28.6 kg per 1 m width. The step of bending the conductive sheet by rotating and the step of bending the conductive sheet by rotating the roller while pulling the other end of the conductive sheet with a tension of 28.6 kg per 1 m width are repeated. The conductive sheet is bent 100 times. ]
Thereby, even when the conductive sheet is deformed when the adhesive (or adhesive sheet) is reapplied, a part of the fine metal wire is not disconnected, and the manufacturing yield can be improved.
[21] More preferably, R2a / R1a <3 and R2b / R1b <3.
[22] A touch panel according to a third aspect of the present invention is a touch panel having a conductive sheet bonded via a pressure-sensitive adhesive on a display panel of a display device, wherein the conductive sheet is provided on a substrate and one main surface of the substrate. The conductive portion has a network-like structure portion made of fine metal wires, the angle formed between the main surface of the base and the side walls of the fine metal wires is an acute angle, Peel adhesive strength with the adhesive is 0.1 N / 10 mm or more and 5 N / 10 mm or less.

As described above, according to the conductive sheet according to the present invention, it is possible to reduce the resistance of the conductive pattern formed on the substrate, and in the touch panel, even when the electrode is configured with a thin metal wire pattern, High transparency can be ensured, and the yield of the conductive sheet can be improved.
In addition, the touch panel according to the present invention can reduce the resistance of the conductive pattern formed on the substrate, and can ensure high transparency even when the electrode is configured with a fine metal wire pattern, For example, it is possible to cope with an increase in the size of a projected capacitive touch panel.

It is a disassembled perspective view which shows the structure of the touchscreen which concerns on this Embodiment. FIG. 2A is a perspective view showing one main surface of the transparent substrate, and FIG. 2B is a perspective view showing the other main surface of the transparent substrate. FIG. 3A is a cross-sectional view showing an example of a conductive sheet with a part thereof omitted, and FIG. FIG. 4A is a perspective view showing a pattern of a first conductive portion formed on one main surface of the transparent substrate, and FIG. 4B is a perspective view showing a pattern of a second conductive portion formed on the other main surface of the transparent substrate. is there. It is a top view which shows the example of a pattern of a 1st electroconductive part. It is a top view which shows the example of a pattern of a 2nd electroconductive part. It is a top view which shows the example of a pattern which looked at the electrically conductive sheet from the upper surface. 8A is a schematic diagram illustrating a first configuration example of the conductive sheet, FIG. 8B is a schematic diagram illustrating the second configuration example, and FIG. 8C is a schematic diagram illustrating the third configuration example. It is a perspective view which shows an example of the apparatus used for a bending test. It is a flowchart which shows an example of the manufacturing method of an electroconductive sheet. FIG. 11A is a cross-sectional view in which a part of the produced photosensitive material is omitted, and FIG. 11B is an explanatory view showing double-sided simultaneous exposure on the photosensitive material. The first exposure process and the second exposure process are performed so that the light irradiated to the first photosensitive layer does not reach the second photosensitive layer and the light irradiated to the second photosensitive layer does not reach the first photosensitive layer. FIG. 13A and 13B are process diagrams showing another example of a method for producing a conductive sheet.

  Hereinafter, embodiments of the conductive sheet and the touch panel according to the present invention will be described with reference to FIGS. In the present specification, “˜” indicating a numerical range is used as a meaning including numerical values described before and after the numerical value as a lower limit value and an upper limit value.

First, a touch panel in which the conductive sheet according to the present embodiment is used will be described.
The touch panel 100 includes a sensor body 102 and a control circuit (configured by an IC circuit or the like) not shown. The sensor main body 102 includes a conductive sheet 10 to be described later and a protective plate (a glass plate or the like) 106 laminated thereon. The conductive sheet 10 and the protective plate 106 are arranged on a display panel 110 in a display device 108 such as a liquid crystal display. When the conductive sheet 10 is viewed from the upper surface and the rear surface, as shown in FIGS. 2A and 2B, the sensor unit 112 disposed in an area corresponding to the display screen 110a (see FIG. 1) of the display panel 110, and a display And a terminal wiring portion 114 (so-called frame) disposed in a region corresponding to the outer peripheral portion of the panel 110.
As shown in FIG. 3A, the conductive sheet 10 according to the present embodiment includes a first conductive portion 13 </ b> A formed on one main surface 12 a of the transparent substrate 12 and a first main surface 12 b formed on the other main surface 12 b of the transparent substrate 12. 2 conductive parts 13B. There are other layers (such as an antihalation layer) between one main surface 12a of the transparent substrate 12 and the first conductive portion 13A and between the other main surface 12b of the transparent substrate 12 and the second conductive portion 13B. May be present.
As shown in FIGS. 4A and 5, the first conductive portion 13 </ b> A is a metal fine wire that electrically connects two or more conductive first large lattices 14 </ b> A by the fine metal wires 15 and the adjacent first large lattice 14 </ b> A. 15 is formed, and each first large lattice 14A is configured by combining two or more small lattices 18, and a circuit (conductive circuit pattern) is formed by combining the first large lattices 14A. Is configured. Here, the small lattice 18 is the smallest rhombus (including a square shape). As shown in FIG. 3B, the thin metal wire 15 has an acute angle θ formed by one main surface 12 a of the transparent substrate 12 and the side wall 15 a of the thin metal wire 15. The angle θ formed is preferably 50 ° or more and less than 90 °, and more preferably 60 ° or more and 80 ° or less. FIG. 3B shows an example in which the upper surface of the thin metal wire 15 is flat and has a substantially trapezoidal cross section. Of course, the shape of the upper surface is not limited to this cross-sectional shape, and may be a curved shape (for example, a convex surface). The thin metal wire 15 is made of, for example, gold (Au), silver (Ag), or copper (Cu).

  The length of one side of the first large lattice 14A is preferably 3 to 10 mm, and more preferably 4 to 6 mm. If the length of one side is less than the above lower limit value, when the conductive sheet 10 is used for a touch panel, for example, the capacitance of the first large lattice 14A at the time of detection is reduced, so there is a high possibility of detection failure. Become. On the other hand, if the upper limit is exceeded, the position detection accuracy may be reduced. From the same viewpoint, the length of one side of the small lattice 18 constituting the first large lattice 14A is preferably 50 to 500 μm, and more preferably 150 to 300 μm. When the small lattice 18 is in the above range, it is possible to keep the transparency better, and when it is attached to the front surface of the display device 108, the display can be visually recognized without a sense of incongruity.

Further, two or more first large lattices 14A are arranged in the x direction (first direction) via the first connection portion 16A, and one conductive circuit pattern (hereinafter referred to as a first conductive pattern 22A) is formed by a thin metal wire. And two or more first conductive patterns 22A are arranged in the y direction (second direction) orthogonal to the x direction, and the adjacent first conductive patterns 22A are electrically insulated without the small lattice 18 The first insulating portion 24A is disposed.
The x direction indicates, for example, the horizontal direction (or vertical direction) of the touch panel 100 (see FIG. 1) or the horizontal direction (or vertical direction) of the display panel 110 on which the touch panel 100 is installed.

  Then, as shown in FIG. 5, among the four sides of the first large lattice 14A, the first side portion 28a and the second side adjacent to one apex portion 26a not connected to the adjacent first large lattice 14A. The side portion 28b has a configuration in which a large number of needle-like lines 32 (sides of the small lattice 18) project in a comb-tooth shape from the linear portion 30 continuous along the first side portion 28a and the second side portion 28b. (Hereinafter, the line 32 is also referred to as a comb 32). On the other hand, the third side portion 28c and the fourth side portion 28d adjacent to the other vertex portion 26b not connected to the adjacent first large lattice 14A are along the third side portion 28c and the fourth side portion 28d, respectively. In this configuration, a straight line portion 30 is formed, and one small lattice 18 (exactly two adjacent sides) corresponding to the other apex portion 26b is removed.

The first connecting portion 16A has a shape in which four medium lattices 20 having a size including four small lattices 18 (first medium lattice 20a to fourth medium lattice 20d) are arranged in a zigzag shape. That is, the first middle lattice 20a exists at the boundary portion between the straight portion 30 of the second side portion 28b and the straight portion 30 of the fourth side portion 28d, and one small lattice 18 and an L-shaped space are formed. Have a different shape. The second intermediate lattice 20b is adjacent to one side of the first intermediate lattice 20a (the straight portion 30 of the second side portion 28b) and has a shape in which a square space is formed, that is, four small lattices 18. Are arranged in a matrix and have a shape with the central cross removed. The third intermediate lattice 20c is adjacent to the first intermediate lattice 20a and adjacent to the second intermediate lattice 20b, and has the same shape as the second intermediate lattice 20b. The fourth middle lattice 20d includes a second straight portion 30 (second straight portion 30 from the outermost side toward the inside of the first large lattice 14A) of the third side portion 28c, and the first side portion 28a. And adjacent to the second intermediate lattice 20b and adjacent to the third intermediate lattice 20c, and similarly to the first intermediate lattice 20a, one small lattice 18 and an L-shaped space are provided. It has a formed shape. One side of the fourth middle lattice 20d exists on the extension of the straight portion 30 of the fourth side portion 28d in the first large lattice 14A. When the arrangement pitch of the small lattices 18 is Ps, the arrangement pitch Pm of the medium lattice 20 has a relationship of 2 × Ps.
As shown in FIG. 4A, the open end of the first large lattice 14A existing on one end side of each first conductive pattern 22A has a shape in which the first connection portion 16A does not exist. The end portion of the first large lattice 14A existing on the other end portion side of each first conductive pattern 22A is electrically connected to the first terminal wiring pattern 41a made of a thin metal wire via the first connection portion 40a. . That is, in the first conductive portion 13A, the first conductive patterns 22A described above are arranged at portions corresponding to the sensor portion 112, and the terminal wiring portion 114 is formed of a thin metal wire led out from each first connection portion 40a. A plurality of first terminal wiring patterns 41a are arranged.

On the other hand, as shown in FIGS. 4B and 6, the second conductive portion 13 </ b> B electrically connects two or more conductive second large lattices 14 </ b> B by the thin metal wires 15 and the adjacent second large lattices 14 </ b> B. A second connecting portion 16B is formed by the fine metal wires 15. Each second large lattice 14B is configured by combining two or more small lattices 18, and the second connecting portion 16B is n times as large as the small lattice 18 ( One or more medium lattices 20 having a pitch (n is a real number greater than 1) are arranged. The length of one side of the second large lattice 14B is also preferably 3 to 10 mm, and more preferably 4 to 6 mm, like the first large lattice 14A described above. As in the case of the first conductive portion 13, the fine metal wire 15 has an acute angle θ (see FIG. 3B) between the other main surface 12 b of the transparent substrate 12 and the side wall 15 a of the fine metal wire 15. The angle θ formed is preferably 50 ° or more and less than 90 °, and more preferably 60 ° or more and 80 ° or less.
Further, two or more second large lattices 14B are arranged in the y direction (second direction) via the second connection portion 16B, and one conductive circuit pattern (hereinafter referred to as a second conductive pattern 22B) is formed by a thin metal wire. ), Two or more second conductive patterns 22B are arranged in the x direction (first direction) orthogonal to the y direction, and the adjacent second conductive patterns 22B are electrically insulated without the small lattice 18 A second insulating portion 24B is arranged.

  As shown in FIG. 6, among the four sides of the second large lattice 14B in the second conductive pattern 22B, the fifth adjacent to one apex portion 26a not connected to the adjacent second large lattice 14B. Looking at the side part 28e and the sixth side part 28f, the fifth side part 28e is along the fifth side part 28e in the same manner as the first side part 28a of the first large lattice 14A in the first conductive sheet 10A. A large number of needle-like lines 32 (sides of the small lattice 18) protrude from the continuous straight part 30 in a comb-tooth shape. About the 6th side part 28f, it is set as the form by which the linear part 30 continuous along the 6th side part 28f was formed similarly to the 3rd side part 28c of 14 A of 1st large lattices in the 1st conductive sheet 10A. Yes. Looking at the seventh side portion 28g and the eighth side portion 28h adjacent to the other vertex portion 26b not connected to the adjacent second large lattice 14B, the seventh side portion 26g is the same as the fifth side portion 28e. In addition, a large number of needle-like lines 32 (sides of the small lattice 18) project in a comb-tooth shape from the straight portion 30 continuous along the seventh side portion 28g. Similar to the side portion 28f, a linear portion 30 that is continuous along the eighth side portion 28h is formed.

  The second connecting portion 16B has a shape in which four medium lattices 20 having a size including four small lattices 18 (fifth medium lattice 20e to eighth medium lattice 20h) are arranged in a zigzag shape. Have. That is, the fifth middle lattice 20e includes the second straight portion 30 (second straight portion from the outermost side toward the inside of the second large lattice 14B) and the eighth side portion 28h of the sixth side portion 28f. And has a shape in which one small lattice 18 and an L-shaped space are formed. The sixth intermediate lattice 20f is adjacent to one side of the fifth intermediate lattice 20e (the second straight portion 30 of the sixth side portion 28f), and has a shape in which a square space is formed, that is, four portions. The small lattices 18 are arranged in a matrix, and the cross is removed from the center. The seventh intermediate lattice 20g is adjacent to the fifth intermediate lattice 20e and is adjacent to the sixth intermediate lattice 20f, and has the same shape as the sixth intermediate lattice 20f. The eighth middle lattice 20h exists at the boundary between the straight portion 30 of the seventh side 28g and the fifth side 28e, is adjacent to the sixth middle lattice 20f, and is adjacent to the seventh middle lattice 20g. Similarly to the fifth middle lattice 20e, it has a shape in which one small lattice 18 and an L-shaped space are formed. One side of the eighth middle lattice 20h exists on the extension of the straight portion 30 of the eighth side 28h in the fifth middle lattice 20e. Also in the second conductive sheet 10B, when the arrangement pitch of the small lattices 18 is Ps, the arrangement pitch Pm of the medium lattice 20 has a relationship of 2 × Ps.

As shown in FIG. 4B, the open end of the second large lattice 14B existing on one end side of every other (for example, odd-numbered) second conductive pattern 22B, and the other of the even-numbered second conductive patterns 22B. The second connecting portion 16B does not exist at the open end of the second large lattice 14B existing on the end side. On the other hand, the second large lattice 14B existing on the other end side of each odd-numbered second conductive pattern 22B and the second end existing on one end side of each even-numbered second conductive pattern 22B. The end portions of the large lattice 14B are electrically connected to the second terminal wiring patterns 41b made of fine metal wires through the second connection portions 40b. That is, the second conductive portion 13B has a large number of second conductive patterns 22B arranged at portions corresponding to the sensor portion 112, and the terminal wiring portion 114 has a plurality of second terminals led out from the respective second connection portions 40b. The wiring pattern 41b is arranged.
When the conductive sheet 10 is viewed from the top, for example, as shown in FIG. 7, the first connection portion 16A of the first conductive pattern 22A and the second connection portion 16B of the second conductive pattern 22B are transparent substrate 12 (FIG. 3A), and the first insulating portion 24A of the first conductive pattern 22A and the second insulating portion 24B of the second conductive pattern 22B are similarly opposed to each other with the transparent substrate 12 interposed therebetween. . The line widths of the first conductive pattern 22A and the second conductive pattern 22B are the same, but in FIG. 7, the first conductive pattern 22A is shown so that the positions of the first conductive pattern 22A and the second conductive pattern 22B can be seen. The line width of the second conductive pattern 22B is exaggerated and narrowed.

When the conductive sheet 10 is viewed from above, the second large lattice formed on the other major surface 12b of the transparent substrate 12 so as to fill the gap between the first large lattice 14A formed on the one major surface 12a of the transparent substrate 12. 14B is arranged. In other words, a large lattice is spread. At this time, the tips of the comb teeth 32 in the first side portion 28a and the second side portion 28b of the first large lattice 14A are the straight portions 30 of the sixth side portion 28f and the eighth side portion 28h of the second large lattice 14B. As a result, the small lattices 18 are arranged, and similarly, the comb teeth 32 on the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B are formed. Each tip has a shape connected to each of the straight portions 30 of the third side portion 28c and the fourth side portion 28d of the first large lattice 14A. As a result, the small lattices 18 are arranged. .
By the way, when the conductive sheet 10 is viewed from the upper surface, as shown in FIG. 3A, for example, in the portion corresponding to the first large lattice 14A, the upper surface and side surfaces (inclined surfaces) of the fine metal wires 15 constituting the first conductive portion 13A. In the portion corresponding to the second large lattice 14B, the lower surface of the thin metal wire 15 constituting the second conductive portion 13B can be seen through the transparent substrate 12. In this case, if the reflection chromaticity from the first conductive portion 13A and the reflection chromaticity from the second conductive portion 13B are different, the boundary between the first large lattice 14A and the second large lattice 14B is easily visually recognized. Visibility may deteriorate.

Therefore, in the present embodiment, the reflection chromaticity of the first conductive portion 13A measured from the one main surface 12a side of the transparent substrate 12 is b1 *, and the second conductive portion 13B is measured from the one main surface 12a side of the transparent substrate 12. When the reflection chromaticity of b2 * is
| B1 * -b2 * | ≦ 2.0
It is trying to become.
Specifically, when the first conductive portion 13A and the second conductive portion 13B are formed by exposing and developing a photosensitive material having at least one silver halide emulsion layer on the transparent substrate 12, the transparent substrate The thickness of 12 is preferably 75 μm or more and 200 μm or less.
Alternatively, the transparent substrate 12 having a metal film formed on one main surface and the other main surface is used, and the metal film is selectively removed by etching. In the case of forming the second conductive portion 13B, it is preferable that the thickness of the transparent substrate is 75 μm or more and 200 μm or less, and the surface of the thin metal wire 15 is blackened.
Thereby, the boundary between the first large lattice 14A and the second large lattice 14B becomes difficult to be visually recognized with the naked eye, and the visibility is improved.

  As shown in FIGS. 1, 2A, and 2B, the outer shape of the conductive sheet 10 has a rectangular shape as viewed from above, and the outer shape of the sensor unit 112 also has a rectangular shape. In the terminal wiring portion 114, a peripheral portion on one long side of one main surface of the conductive sheet 10 (the main surface on which the first conductive portion 13A is formed) has a plurality of One terminal 116a is arranged in the length direction of the one long side. In addition, a plurality of first connection portions 40 a are linearly arranged along one long side of the sensor unit 112 (long side closest to one long side of the conductive sheet 10: y direction). The first terminal wiring patterns 41a derived from the first connection portions 40a are routed toward the substantially central portion of one long side of the first conductive sheet 10A, and are electrically connected to the corresponding first terminals 116a. It is connected. Accordingly, the first terminal wiring patterns 41a connected to the first connection portions 40a corresponding to both sides of one long side in the sensor unit 112 are routed with substantially the same length. Of course, the first terminal 116a may be formed at or near the corner of the first conductive sheet 10A, but the longest first terminal wiring pattern 41a and the shortest first among the plurality of first terminal wiring patterns 41a. A large difference in length occurs between the terminal wiring pattern 41a and signal transmission to the first conductive pattern 22A corresponding to the longest first terminal wiring pattern 41a and a plurality of first terminal wiring patterns 41a in the vicinity thereof. There is a problem of being slow. Therefore, as in the present embodiment, local signal transmission delay can be suppressed by forming the first terminal 116a in the central portion in the length direction of one long side of the conductive sheet 10. This leads to an increase in response speed.

  On the other hand, as shown in FIG. 2B, in the terminal wiring portion 114, the peripheral portion on one long side of the other main surface of the conductive sheet 10 (the main surface on which the second conductive portion 13B is formed) A plurality of second terminals 116b are arranged in the lengthwise direction of the one long side at the central portion in the vertical direction. Further, a plurality of second connection portions 40b (for example, odd-numbered second connection portions 40b) are provided along one short side of the sensor unit 112 (short side closest to one short side of the conductive sheet 10: x direction). A plurality of second connection portions 40b (for example, even-numbered second connections) along the other short side of the sensor unit 112 (the short side closest to the other short side of the conductive sheet 10: the x direction) arranged in a straight line. The parts 40b) are arranged in a straight line.

Among the plurality of second conductive patterns 22B, for example, odd-numbered second conductive patterns 22B are connected to the corresponding odd-numbered second connection portions 40b, respectively, and even-numbered second conductive patterns 22B are respectively corresponding even-numbered. It is connected to the second second connection part 40b. The second terminal wiring pattern 41b derived from the odd-numbered second connection part 40b and the second terminal wiring pattern 41b derived from the even-numbered second connection part 40b are substantially at the center on one long side of the conductive sheet 10. And are electrically connected to the corresponding second terminals 116b. Accordingly, for example, the first and second second terminal wiring patterns 41b are routed with substantially the same length. Similarly, the 2n-1th and 2nth second terminal wiring patterns 41b are , Respectively, are drawn with substantially the same length (n = 1, 2, 3,...).
Of course, the second terminal 116b may be formed at the corner of the conductive sheet 10 or in the vicinity thereof, but as described above, the longest second terminal wiring pattern 41b and the plurality of second terminal wiring patterns 41b in the vicinity thereof are provided. There is a problem that the signal transmission to the corresponding second conductive pattern 22B becomes slow. Therefore, as in the present embodiment, local signal transmission delay can be suppressed by forming the second terminal 116b in the central portion in the length direction of one long side of the conductive sheet 10. This leads to an increase in response speed.
The derivation form of the first terminal wiring pattern 41a may be the same as the second terminal wiring pattern 41b described above, and the derivation form of the second terminal wiring pattern 41b may be the same as the first terminal wiring pattern 41a described above.

When the conductive sheet 10 is used as the touch panel 100, a protective plate 106 is attached to the conductive sheet 10 via, for example, an antireflection film, and the conductive sheet 10 is derived from a large number of first conductive patterns 22A of the conductive sheet 10. The first terminal wiring pattern 41a and the second terminal wiring pattern 41b derived from the multiple second conductive patterns 22B of the second conductive sheet 10B are connected to a control circuit that controls scanning, for example.
As a touch position detection method, a self-capacitance method or a mutual capacitance method can be preferably employed. That is, in the case of the self-capacitance method, voltage signals for touch position detection are sequentially supplied to the first conductive pattern 22A, and voltage signals for touch position detection are sequentially supplied to the second conductive pattern 22B. Supply. Since the capacitance between the first conductive pattern 22A and the second conductive pattern 22B facing the touch position and the GND (ground) increases when the fingertip contacts or approaches the upper surface of the protective plate 106, the first conductive pattern The waveforms of the transmission signals from 22A and the second conductive pattern 22B are different from the waveforms of the transmission signals from the other conductive patterns. Therefore, the control circuit calculates the touch position based on the transmission signal supplied from the first conductive pattern 22A and the second conductive pattern 22B. On the other hand, in the case of the mutual capacitance method, for example, a voltage signal for touch position detection is sequentially supplied to the first conductive pattern 22A, and sensing (detection of a transmission signal) is sequentially performed on the second conductive pattern 22B. Do. Since the fingertip contacts or approaches the upper surface of the protective plate 106, the stray capacitance of the finger is added in parallel to the parasitic capacitance between the first conductive pattern 22A and the second conductive pattern 22B facing the touch position. The waveform of the transmission signal from the second conductive pattern 22B is different from the waveform of the transmission signal from the other second conductive pattern 22B. Therefore, in the control circuit, the touch position is calculated based on the order of the first conductive patterns 22A supplying the voltage signal and the transmission signal from the supplied second conductive pattern 22B. By adopting such a self-capacitance type or mutual capacitance type touch position detection method, it is possible to detect each touch position even if two fingertips are in contact with or close to the upper surface of the protective plate 106 simultaneously. Become. As prior art documents related to a projection type capacitance detection circuit, US Pat. No. 4,582,955, US Pat. No. 4,686,332, US Pat. No. 4,733,222 Specification, US Pat. No. 5,374,787, US Pat. No. 5,543,588, US Pat. No. 7,030,860, US Published Patent No. 2004/0155871, etc. is there.

  By the way, in the 1st conductive part 13A and the 2nd conductive part 13B, when all the sides of the 1st large lattice 14A and the 2nd large lattice 14B are formed as the straight part 30, for example, the 1st large lattice 14A 1st The open ends of a large number of lines 32 projecting from the side part 28a and the second side part 28b are connected to form a new straight part 30, and similarly, the fifth side part 28e and the seventh side part 28g of the second large lattice 14B. When the open ends of a large number of lines 32 extending from the end are connected to form a new straight line portion 30, the width of the overlapping portion between the straight line portions 30 increases due to a slight shift in the overlay position accuracy (thickening of the line). As a result, the boundary between the first large lattice 14A and the second large lattice 14B becomes conspicuous and the visibility deteriorates. However, in the present embodiment, as described above, the tips of the comb teeth 32 And the straight portion 30 The first no longer noticeable boundary between large lattices 14A and the second large lattices 14B, the visibility is improved. Note that an opening corresponding to one medium lattice is formed at a portion where the first insulating portion 24A and the second insulating portion 24B face each other. However, unlike the above-described line thickening, light is not blocked. Therefore, it is hardly noticeable outside. In particular, an opening corresponding to one medium lattice is almost the same in terms of size as compared with the surrounding small lattice 18, and therefore becomes less conspicuous.

  Further, for example, when the first side portion 28a to the eighth side portion 28h of the first large lattice 14A and the second large lattice 14B are all formed as the straight portion 30, the first side portion 28a to the fourth side of the first large lattice 14A. The straight line part 30 in the fifth side part 28e to the eighth side part 28h of the second large lattice 14B is located immediately below the straight line part 30 in the side part 28d. At this time, since each straight line portion 30 also functions as a conductive portion, a parasitic capacitance is formed between the side portion of the first large lattice 14A and the side portion of the second large lattice 14B. It acts as a noise component for information and causes a significant decrease in the S / N ratio. In addition, since a parasitic capacitance is formed between each first large lattice 14A and each second large lattice 14B, a large number of parasitic capacitances are connected in parallel to the first conductive pattern 22A and the second conductive pattern 22B. As a result, there is a problem that the CR time constant becomes large. When the CR time constant is increased, the rise time of the waveform of the voltage signal supplied to the first conductive pattern 22A (and the second conductive pattern 22B) is delayed, and an electric field for position detection is hardly generated in a predetermined scan time. There is a risk that it will not be performed. In addition, the rising time or falling time of the waveform of the transmission signal from the first conductive pattern 22A and the second conductive pattern 22B is also delayed, and there is a possibility that the change in the waveform of the transmission signal cannot be captured during a predetermined scan time. . This leads to a decrease in detection accuracy and a decrease in response speed. That is, in order to improve the detection accuracy and the response speed, the number of the first large grid 14A and the second large grid 14B must be reduced (reduction in resolution) or the size of the display screen to be adapted can be reduced. For example, there arises a problem that it cannot be applied to B5 version, A4 version, and larger screens.

On the other hand, in the present embodiment, as shown in FIG. 3A, the projection distance Lf between the straight portion 30 at the side portion of the first large lattice 14A and the straight portion 30 at the side portion of the second large lattice 14B is set. The length of one side of the small lattice 18 is approximately the same (50 to 500 μm). Furthermore, the needle-like lines 32 projecting from the first side portion 28a and the second side portion 28b of the first large lattice 14A are only the tips of the sixth side portion 28f and the eighth side portion of the second large lattice 14B, respectively. The needle-like lines 32 facing the straight line portion 30 in 28h and projecting from the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B are only the tips of the third side of the first large lattice 14A. Since only the straight portion 30 is opposed to the portion 28c and the fourth side portion 28d, the parasitic capacitance formed between the first large lattice 14A and the second large lattice 14B is reduced. As a result, the CR time constant is also reduced, and the detection accuracy and response speed can be improved.
The optimum distance of the projection distance Lf described above is not the size of the first large lattice 14A and the second large lattice 14B, but the size (line width and one side) of the small lattice 18 constituting the first large lattice 14A and the second large lattice 14B. It is preferable to appropriately set the length according to the length). In this case, if the size of the small lattice 18 is too large for the first large lattice 14A and the second large lattice 14B having a certain size, the translucency is improved, but the dynamic range of the transmission signal is reduced. Therefore, there is a risk of causing a decrease in detection sensitivity. On the other hand, if the size of the small lattice 18 is too small, the detection sensitivity is improved, but there is a limit to the reduction of the line width, so that the translucency may be deteriorated.

Therefore, the optimum value (optimum distance) of the projection distance Lf is preferably 100 to 400 μm, more preferably 200 to 300 μm, when the line width of the small lattice 18 is 1 to 9 μm. If the line width of the small lattice 18 is reduced, the above-mentioned optimum distance can be shortened. However, since the electrical resistance increases, the CR time constant increases even if the parasitic capacitance is small, resulting in detection sensitivity. May cause a decrease in response speed and response speed. Therefore, the line width of the small lattice 18 is preferably in the above range.
For example, based on the size of the display panel 110 or the size of the sensor unit 112 and the resolution of the touch position detection (pulse period of the driving pulse), the size of the first large lattice 14A and the second large lattice 14B and the small lattice 18 The size is determined, and the optimum distance between the first large lattice 14A and the second large lattice 14B is determined based on the line width of the small lattice 18.

Further, when the portion where the first connection portion 16A and the second connection portion 16B are opposed to each other is viewed from above, the intersection of the fifth middle lattice 20e and the seventh middle lattice 20g of the second connection portion 16B is the first large lattice. 14A is located substantially at the center of the second middle grating 20b, and the intersection of the sixth middle grating 20f and the eighth middle grating 20h of the second connecting portion 16B is at the middle of the third middle grating 20c of the first large grating 14A. A plurality of small lattices 18 are formed by a combination of the first medium lattice 20a to the eighth medium lattice 20h. That is, a plurality of small lattices 18 are arranged in a portion where the first connection portion 16A and the second connection portion 16B face each other by a combination of the first connection portion 16A and the second connection portion 16B. It becomes indistinguishable from the small lattice 18 constituting the first large lattice 14A and the small lattice 18 constituting the second large lattice 14B, and visibility is improved.
Furthermore, in the present embodiment, a plurality of first terminals 116a are formed in the longitudinal center portion of the terminal wiring portion 114 at the peripheral portion on the one long side of the first conductive sheet 10A, and the second conductive sheet is formed. A plurality of second terminals 116b are formed in the central portion in the length direction of the peripheral portion on one long side of 10B. In particular, in the example of FIGS. 2A and 2B, the first terminal 116a and the second terminal 116b are arranged so as not to overlap with each other, and further, the first terminal wiring pattern 41a and the second terminal wiring are arranged. The pattern 41b is not overlapped with the top and bottom. The first terminal 116a and, for example, the odd-numbered second terminal wiring pattern 41a may partially overlap each other.
Thereby, the plurality of first terminals 116a and the plurality of second terminals 116b are connected to two connectors (first terminal connector and second terminal connector) or one connector (first terminal 116a and second terminal 116b). And can be electrically connected to the control circuit via a cable.
In addition, since the first terminal wiring pattern 41a and the second terminal wiring pattern 41b do not overlap each other, generation of parasitic capacitance between the first terminal wiring pattern 41a and the second terminal wiring pattern 41b is suppressed. , A decrease in response speed can be suppressed.

Since the first connection part 40a is arranged along one long side of the sensor part 112 and the second connection part 40b is arranged along the short sides on both sides of the sensor part 112, the area of the terminal wiring part 114 Can be reduced. This can promote downsizing of the display panel 110 including the touch panel 100, and can make the display screen 110a look impressively large. In addition, the operability as the touch panel 100 can be improved.
In order to further reduce the area of the terminal wiring portion 114, it is conceivable to reduce the distance between the adjacent first terminal wiring patterns 41a and the distance between the adjacent second terminal wiring patterns 41b. In consideration of prevention of occurrence, it is preferably 10 μm or more and 50 μm or less.

In addition, when viewed from above, it is conceivable to reduce the area of the terminal wiring portion 114 by arranging the second terminal wiring pattern 41b between the adjacent first terminal wiring patterns 41a. If there is, there is a possibility that the first terminal wiring pattern 41a and the second terminal wiring pattern 41b overlap each other, and the parasitic capacitance between the wirings increases. This results in a decrease in response speed. Therefore, when adopting such an arrangement, it is preferable that the distance between the adjacent first terminal wiring patterns 41a be 50 μm or more and 100 μm or less.
Further, as shown in FIGS. 2A and 2B, the positioning used when the first conductive sheet 10A and the second conductive sheet 10B are bonded to each corner portion of the first conductive sheet 10A and the second conductive sheet 10B, for example. The first alignment mark 118a and the second alignment mark 118b are preferably formed. The first alignment mark 118a and the second alignment mark 118b become a new composite alignment mark when the first conductive sheet 10A and the second conductive sheet 10B are bonded to form the first laminated conductive sheet 50A. The mark also functions as an alignment mark for positioning used when the first laminated conductive sheet 50A is installed on the display panel 110.

As described above, when the conductive sheet 10 is applied to the projected capacitive touch panel 100, for example, the response speed can be increased and the touch panel 100 can be increased in size. In addition, the boundary between the first large lattice 14A formed on one main surface 12a of the transparent substrate 12 and the second large lattice 14B formed on the other main surface 12b of the transparent substrate 12 becomes inconspicuous, and the first connection portion Since the plurality of small lattices 18 are formed by the combination of 16A and the second connection portion 16B, there is no inconvenience such as local thickening of the line, and the visibility is improved as a whole.
In addition, the CR time constants of a large number of first conductive patterns 22A and second conductive patterns 22B can be significantly reduced, thereby increasing the response speed and detecting the position within the drive time (scan time). Will also be easier. This leads to an increase in the screen size of the touch panel 100 (vertical x horizontal size, not including thickness).

Here, a laminated structure of the conductive sheet 10 on the display device 108 will be described. As shown in FIGS. 8A to 8C, three modes can be preferably adopted for the laminated structure.
That is, in the first configuration example shown in FIG. 8A, the conductive sheet 10 shown in FIG. 3A is laminated on the display device 108 via the transparent adhesive 120 (or the transparent adhesive sheet) 120, and further on the conductive sheet 10. A hard coat layer 122 is laminated, and an antireflection layer 124 is laminated on the hard coat layer 122. Here, the touch panel 100 is configured by the transparent adhesive 120, the second conductive portion 13B, the first transparent base 12A, and the first conductive portion 13A on the display device 108, and the hard coat layer 122 and the antireflection on the touch panel 100 The layer 124 constitutes an antireflection film 126. A protective plate 106 shown in FIG. 1 is stuck on the antireflection film 126. The same applies to the second configuration example and the third configuration example described later.
In the second configuration example shown in FIG. 8B, the conductive sheet 10 and the protective resin layer 128 of FIG. 3A are laminated on the display device 108 via the transparent adhesive 120, and the hard coat layer 122 is further formed on the protective resin layer 128. The antireflection layer 124 is laminated on the hard coat layer 122. Here, the touch panel 100 is configured by the transparent adhesive 120, the second conductive portion 13B, the first transparent base 12A, the first conductive portion 13A, and the protective resin layer 128 on the display device 108, and a hard coat on the touch panel 100 The layer 122 and the antireflection layer 124 constitute an antireflection film 126.
In the third configuration example shown in FIG. 8C, the conductive sheet 10 and the second transparent adhesive 120B shown in FIG. 3A are laminated on the display device 108 via the first transparent adhesive 120A. A transparent film 130 is laminated on 120 B, a hard coat layer 122 is laminated on the transparent film 130, and an antireflection layer 124 is laminated on the hard coat layer 122. Here, the first transparent adhesive 120A, the second conductive portion 13B, the first transparent base 12A, the first conductive portion 13A, and the second transparent adhesive 120B on the display device 108 constitute a touch panel 100, and the touch panel 100 The upper transparent film 130, the hard coat layer 122, and the antireflection layer 124 constitute an antireflection film 126.

Usually, as shown in Patent Documents 3 to 9, when an electrode is formed by arranging a large number of grids composed of fine metal wires, it is considered to increase the thickness of the fine metal wires for the purpose of further reducing the surface resistance. It is done. However, the following problems occur when the display device 108 and the antireflection film 126 are attached to the electrodes via an adhesive (or adhesive sheet). That is, air bubbles easily enter between the conductive sheet and the pressure-sensitive adhesive (or pressure-sensitive adhesive sheet), and the aesthetic appearance is impaired. If the thickness of the fine metal wire is large, the adhesive (or adhesive sheet) is likely to be firmly fixed to the fine metal wire, and partly when reapplying when there is a sticking error (sticking position misalignment, etc.) There is a problem that the fine metal wires are peeled off or the conductive sheet is deformed to cause a disconnection in a part of the fine metal wires.
Therefore, in the present embodiment, an angle θ (see FIG. 3B) formed by one main surface 12a of the transparent substrate 12 and the side wall 15a of the thin metal wire 15 is an acute angle, and peel adhesive strength with the adhesive in the conductive portion, that is, Peel adhesive strength with the transparent adhesive 120 (or adhesive sheet) in the second conductive portion 13B, Peel adhesive strength with the second transparent adhesive 120B (or adhesive sheet) in the first conductive portion 13A, in the second conductive portion 13B The peel adhesive strength with the first transparent adhesive 120A (or the adhesive sheet) is set to be 0.1 N / 10 mm or more and 5 N / 10 mm or less.

  As a result, the adhesive force of the adhesive (or adhesive sheet) to the fine metal wire is smaller than the adhesive force of the thin metal wire to the transparent substrate. During the reattachment, the fine metal wire does not peel from the transparent substrate. Moreover, there is almost no air bubble mixing when the adhesive (adhesive sheet) is attached. As a result, the adhesive (or adhesive sheet) can be attached and reattached easily, the time required for assembly of the entire touch panel can be reduced, and the yield of the touch panel is improved. Can be made.

And the angle | corner mentioned above has preferable 50 degrees or more and less than 90 degrees, More preferably, they are 60 degrees or more and 80 degrees or less. On the other hand, the lower limit of the peel adhesive strength is preferably 0.3 N / 10 mm or more, and more preferably 0.5 N / 10 mm or more. The upper limit of the peel adhesive strength is preferably 5 N / 10 mm or less, and more preferably 3 N / 10 mm or more.
In the present embodiment, the surface resistances of the first conductive portion 13A and the second conductive portion 13B before the following bending test are R1a and R2a, and the first conductive portion 13B and the second conductive portion after the bending test are performed. When the surface resistance of the portion 13B is R1b and R2b,
R1a / R1a <3
R1b / R1b <3
To be satisfied. That is, flexibility is provided.

Thereby, even when the conductive sheet 10 is deformed when the adhesive (or the adhesive sheet) is reapplied, a part of the thin metal wire 15 is not disconnected, and the manufacturing yield can be improved. it can. More preferably,
R1a / R1a <1.5
R1b / R1b <1.5.
Here, in the bending test, for example, as shown in FIG. 9, a long conductive sheet 10 is hooked on a roller 202 having a diameter φ of 4 mm that is rotatably attached to the base 200, and one of the conductive sheets 10 is The step of bending the conductive sheet 10 by rotating the roller 202 while pulling the end portion 10a with a tension of 28.6 (kg / m), and the other end portion 10b of the conductive sheet 10 are similarly 28.6 (kg / m). The step of bending the conductive sheet 10 by rotating the roller 202 while pulling with the tension of) is repeated to bend the conductive sheet 10 100 times.

Note that the size of the small lattice 18 (the length of one side, the length of the diagonal line, etc.), the number of small lattices 18 constituting the first large lattice 14A, and the number of small lattices 18 constituting the second large lattice 14B are also as follows. It can be set as appropriate according to the size and resolution (number of wires) of the applied touch panel.
In the above example, the conductive sheet 10 is applied to the projected capacitive touch panel 100. However, the conductive sheet 10 may be applied to a surface capacitive touch panel and a resistive touch panel. Of course you can.

Next, a method for manufacturing the conductive sheet 10 will be described with reference to FIGS. 10 to 13B.
First, in the first production method, a photosensitive material having an emulsion layer containing a photosensitive silver halide salt is exposed on one main surface 12a and the other main surface 12b of the transparent substrate 12, respectively, and subjected to a development process. A metallic silver portion and a light transmissive portion are formed in the exposed portion and the unexposed portion, respectively, to form the first conductive portion 13A and the second conductive portion 13B. In addition, you may make it carry | support a conductive metal to a metal silver part by giving a physical development and / or a plating process to a metal silver part further.

In particular, as shown in FIG. 3A, when the first conductive portion 13A is formed on one main surface 12a of the transparent substrate 12 and the second conductive portion 13B is formed on the other main surface of the transparent substrate 12, the normal manufacturing method is followed. If the method of exposing one principal surface first and then exposing the other principal surface is employed, the desired first conductive portion 13A and second conductive portion 13B may not be obtained. In particular, it is difficult to uniformly form a pattern in which the comb teeth 32 protrude from the sides of the first large lattice 14A and the second large lattice 14B.
Therefore, the following manufacturing method can be preferably employed.
That is, the photosensitive silver halide emulsion layer formed on both surfaces of the transparent substrate 12 is collectively exposed to form the first conductive portion 13A on one main surface of the transparent substrate 12, and A second conductive portion 13B is formed on the surface.

A specific example of this manufacturing method will be described with reference to FIGS.
First, in step S1 of FIG. 10, a long photosensitive material 140 is manufactured. As shown in FIG. 11A, the photosensitive material 140 includes a transparent substrate 12 and a first photosensitive layer 142a composed of two or more photosensitive silver halide emulsion layers formed on one main surface of the transparent substrate 12, A second photosensitive layer 142b composed of two or more photosensitive silver halide emulsion layers formed on the other main surface of the transparent substrate 12, and the sensitivity of the lower photosensitive silver halide emulsion layer is adjusted to By setting it higher than the photosensitive silver halide emulsion layer, the cross-sectional shape after development can be controlled. It is not always necessary to have two or more emulsion layers. For example, even if the silver halide emulsion layer is a single layer, it is processed with a developer containing a development-suppressing material and developed above the silver halide emulsion layer. A trapezoidal cross section is formed by applying the suppression. In addition, the rectangular developed silver cross section is then subjected to a smoothing process such as a calendar process, whereby the corners of the upper surface are crushed and a more preferable dome shape can be formed.

In step S2 of FIG. 10, the photosensitive material 140 is exposed. In this exposure process, the first photosensitive layer 142a is irradiated with light toward the transparent substrate 12 to expose the first photosensitive layer 142a along the first exposure pattern, and the second photosensitive layer 142b. On the other hand, a second exposure process is performed in which light is irradiated toward the transparent substrate 12 to expose the second photosensitive layer 142b along the second exposure pattern (double-sided simultaneous exposure). In the example of FIG. 11B, while the long photosensitive material 140 is conveyed in one direction, the first photosensitive layer 142a is irradiated with the first light 144a (parallel light) through the first photomask 146a and the second photosensitive material 140a is irradiated. The layer 142b is irradiated with the second light 144b (parallel light) through the second photomask 146b. The first light 144a is obtained by converting the light emitted from the first light source 148a into parallel light by the first collimator lens 150a, and the second light 144b is emitted from the second light source 148b. It is obtained by converting the light into parallel light by the second collimator lens 150b in the middle. In the example of FIG. 11B, the case where two light sources (first light source 148a and second light source 148b) are used is shown, but the light emitted from one light source is divided through the optical system to generate the first light. The first photosensitive layer 142a and the second photosensitive layer 142b may be irradiated as the 144a and the second light 144b.
At this time, each of the first photosensitive layer 142a and the second photosensitive layer 142b is composed of two or more photosensitive silver halide emulsion layers, and the sensitivity of the silver halide emulsion layer in the lowermost layer is at least the uppermost layer. If the sensitivity is set higher than the sensitivity of the silver halide emulsion layer, the image width that can be developed by exposure is the largest in the lowermost silver halide emulsion layer and the smallest in the uppermost silver halide emulsion layer. Thus, a latent image having a substantially trapezoidal cross section is formed.

  In step S3 of FIG. 10, the exposed photosensitive material 140 is developed to produce the conductive sheet 10 as shown in FIG. 3A. The conductive sheet 10 includes a transparent substrate 12, a first conductive portion 13A (first conductive pattern 22A, etc.) along the first exposure pattern formed on one main surface 12a of the transparent substrate 12, and the transparent substrate 12. And a second conductive portion 13B (second conductive pattern 22B and the like) along the second exposure pattern formed on the main surface 12b. Note that the exposure time and development time of the first photosensitive layer 142a and the second photosensitive layer 142b vary depending on the type of the first light source 148a and the second light source 148b, the type of the developer, and the like. However, the exposure time and the development time are adjusted so that the development rate is 80 to 100%.

  In the first exposure process of the manufacturing method according to the present embodiment, as shown in FIG. 12, a first photomask 146a is closely disposed on the first photosensitive layer 142a, for example, and the first photomask 146a. The first photosensitive layer 142a is exposed by irradiating the first light 144a from the first light source 148a disposed opposite to the first photomask 146a. The first photomask 146a includes a glass substrate made of transparent soda glass and a mask pattern (first exposure pattern 152a) formed on the glass substrate. Therefore, the first exposure process exposes a portion of the first photosensitive layer 142a along the first exposure pattern 152a formed on the first photomask 146a. A gap of about 2 to 10 μm may be provided between the first photosensitive layer 142a and the first photomask 146a.

  Similarly, in the second exposure process, for example, the second photomask 146b is disposed in close contact with the second photosensitive layer 142b, and the second photomask 146b from the second light source 148b disposed to face the second photomask 146b. The second photosensitive layer 142b is exposed by irradiating the second light 144b toward. Similarly to the first photomask 146a, the second photomask 146b includes a glass substrate formed of transparent soda glass and a mask pattern (second exposure pattern 152b) formed on the glass substrate. Yes. Accordingly, the second exposure process exposes a portion of the second photosensitive layer 142b along the second exposure pattern 152b formed on the second photomask 146b. In this case, a gap of about 2 to 10 μm may be provided between the second photosensitive layer 142b and the second photomask 146b.

In the first exposure process and the second exposure process, the emission timing of the first light 144a from the first light source 148a and the emission timing of the second light 144b from the second light source 148b may be made simultaneously or different. Also good. At the same time, the first photosensitive layer 142a and the second photosensitive layer 142b can be exposed simultaneously by one exposure process, and the processing time can be shortened.
By the way, when both the first photosensitive layer 142a and the second photosensitive layer 142b are not spectrally sensitized, when the photosensitive material 140 is exposed from both sides, the exposure from one side affects the image formation on the other side (back side). Will be affected.
That is, the first light 144a from the first light source 148a reaching the first photosensitive layer 142a is scattered by the silver halide grains in the first photosensitive layer 142a, passes through the transparent substrate 12 as scattered light, and one of them. Part reaches the second photosensitive layer 142b. Then, the boundary portion between the second photosensitive layer 142b and the transparent substrate 12 is exposed over a wide range, and a latent image is formed. Therefore, in the second photosensitive layer 142b, the exposure with the second light 144b from the second light source 148b and the exposure with the first light 144a from the first light source 148a are performed, and the conductive sheet 10 and the conductive sheet 10 in the subsequent development process. In this case, in addition to the conductive pattern (second conductive portion 13B) formed by the second exposure pattern 152b, a thin conductive layer formed by the first light 144a from the first light source 148a is formed between the conductive patterns. A pattern (pattern along the second exposure pattern 152b) cannot be obtained. The same applies to the first photosensitive layer 142a.

In order to avoid this, as a result of intensive studies, the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b is set to a specific range, and the amount of silver applied to the first photosensitive layer 142a and the second photosensitive layer 142b is specified. By doing so, it was found that the silver halide itself absorbs light and can limit light transmission to the back surface. In the present embodiment, the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b can be set to 1 μm or more and 4 μm or less. The upper limit is preferably 2.5 μm. Further, the coating silver amount of the first photosensitive layer 142a and the second photosensitive layer 142b was regulated to 5 to 20 g / m ² .
In the above-described double-sided exposure method, image defects due to exposure inhibition due to dust adhering to the film surface becomes a problem. It is known to apply a conductive material to the film as a dust prevention, but metal oxides remain after processing, impairing the transparency of the final product, and conductive polymers are storable. There is a problem. Thus, as a result of intensive studies, it was found that the silver halide with a reduced amount of binder provided the necessary conductivity for antistatic, and the volume ratio of silver / binder in the first photosensitive layer 142a and the second photosensitive layer 142b was defined. . That is, the silver / binder volume ratio of the first photosensitive layer 142a and the second photosensitive layer 142b is 1/1 or more, and preferably 2/1 or more.

As described above, by setting and defining the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b, the amount of coated silver, and the volume ratio of silver / binder, the first photosensitive layer 142a can be formed as shown in FIG. The reached first light 144a from the first light source 148a does not reach the second photosensitive layer 142b. Similarly, the second light 144b from the second light source 148b that reaches the second photosensitive layer 142b is changed to the first photosensitive layer. As a result, when the conductive sheet 10 is formed in the subsequent development processing, as shown in FIG. 3A, a conductive pattern (first first pattern 12a) is formed on one main surface 12a of the transparent substrate 12 as shown in FIG. 3A. Only the pattern constituting the conductive portion 13A) is formed, and the conductive pattern formed by the second exposure pattern 152b (pattern constituting the second conductive portion 13B) is formed on the other main surface 12b of the transparent substrate 12. Becomes the only is formed, it is possible to obtain a desired pattern.
Thus, in the manufacturing method using the above-described double-sided batch exposure, it is possible to obtain the first photosensitive layer 142a and the second photosensitive layer 142b having both conductivity and suitability for double-sided exposure, and one transparent layer. By the exposure process on the base 12, the same pattern or different patterns can be arbitrarily formed on both surfaces of the transparent base 12, whereby the electrodes of the touch panel 100 can be easily formed and the touch panel 100 is thin. (Low profile) can be achieved.

The above example is a manufacturing method in which the first conductive portion 13A and the second conductive portion 13B are formed using a photosensitive silver halide emulsion layer. As another manufacturing method, a metal film is formed on both surfaces. There is a method in which a transparent substrate is used, a metal film is selectively removed by etching, and conductive portions made of fine metal wires are formed on both surfaces of the transparent substrate.
That is, as shown in FIG. 13A, the photoresist film on the metal film 160 (for example, copper foil) formed on both surfaces of the transparent substrate 12 is exposed and developed to form a resist pattern 162.
Thereafter, as shown in FIG. 13B, the metal film 160 exposed from the resist pattern 162 is removed by isotropic etching (for example, wet etching). Thereby, the upper part of the metal film 160 is also etched in the lateral direction, and as a result, the first conductive portion 13A and the second conductive portion 13B are formed by the thin metal wire 15 having a substantially trapezoidal cross section. Thereafter, the resist pattern 162 is removed to obtain the conductive sheet 10 shown in FIG. 3A.

Other manufacturing methods include the following manufacturing methods. That is, by printing a paste containing metal fine particles on both surfaces of the transparent substrate 12 and performing metal plating on the paste, the first conductive portion 13A by the metal wire 15 having a substantially trapezoidal cross section is formed on one main surface 12a of the transparent substrate 12. Alternatively, the second conductive portion 13B may be formed on the other main surface 12b of the transparent substrate 12 by the metal wire 15 having a substantially trapezoidal cross section.
Alternatively, the pattern of the first conductive portion 13A and the pattern of the second conductive portion 13B may be printed and formed on one main surface and the other main surface of the transparent substrate 12 by a screen printing plate or a gravure printing plate.
Alternatively, the pattern of the first conductive portion 13A and the pattern of the second conductive portion 13B may be formed on one main surface and the other main surface of the transparent substrate 12 by inkjet.

Next, in the conductive sheet 10 according to the present embodiment, a method using a silver halide photographic light-sensitive material that is a particularly preferable embodiment will be mainly described.
The method for producing a conductive sheet according to the present embodiment includes the following three forms depending on the photosensitive material and the form of development processing.

(1) A mode in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.
(2) An embodiment in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.
(3) A photosensitive silver halide black-and-white photosensitive material that does not contain physical development nuclei and an image-receiving sheet having a non-photosensitive layer that contains physical development nuclei are overlaid and diffusion transferred to develop a non-photosensitive image-receiving sheet. Form formed on top.

The aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
In the above aspect (2), the light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material by dissolving silver halide grains close to the physical development nucleus and depositing on the development nucleus in the exposed portion. A characteristic film is formed. This is also an integrated black-and-white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but developed silver is a sphere with a small specific surface.
In the above aspect (3), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby a light transmitting conductive film or the like is formed on the image receiving sheet. A conductive film is formed. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.

In either embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .
The chemical development, thermal development, dissolution physical development, and diffusion transfer development mentioned here have the same meanings as are commonly used in the industry, and are general textbooks of photographic chemistry such as Shinichi Kikuchi, “Photochemistry” (Kyoritsu Publishing) (Published in 1955), C.I. E. K. It is described in "The Theory of Photographic Processes, 4th ed." Edited by Mees (Mcmillan, 1977). Although this case is an invention related to liquid processing, a technique of applying a thermal development system as another development system can also be referred to. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, and 2005-010752, and Japanese Patent Application Nos. 2004-244080 and 2004-085655 can be applied. it can.

Here, the configuration of each layer of the conductive sheet according to the present embodiment will be described in detail below.
[Transparent substrate 12]
Examples of the transparent substrate 12 include a plastic film and a plastic plate.
Examples of the raw material for the plastic film and the plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, and EVA; Resin; In addition, polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC) and the like can be used.
As the transparent substrate 12, PET (melting point: 258 ° C), PEN (melting point: 269 ° C), PE (melting point: 135 ° C), PP (melting point: 163 ° C), polystyrene (melting point: 230 ° C), polyvinyl chloride ( A plastic film or a plastic plate having a melting point of about 290 ° C. or less, such as polyvinylidene chloride (melting point: 212 ° C.) or TAC (melting point: 290 ° C.), is preferred. From these viewpoints, PET is preferable. Since the conductive film such as the conductive sheet 10 is required to be transparent, the transparency of the transparent substrate 12 is preferably high.

[Silver salt emulsion layer]
The silver salt emulsion layer to be a conductive layer of the conductive sheet 10 (conductive portions such as the first large lattice 14A, the first connecting portion 16A, the second large lattice 14B, the second connecting portion 16B, and the small lattice 18) In addition to the binder, it contains additives such as solvents and dyes.
Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.

<Silver halide>
The silver halide preferably used in the form of a photographic emulsion of the silver halide photographic light-sensitive material will be described.
In the present embodiment, it is preferable to use silver halide in order to function as an optical sensor, and a technique used for silver halide photographic film, photographic paper, printing plate making film, emulsion mask for photomask, etc. relating to silver halide. Can also be used in this embodiment.
The halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof. For example, silver halide mainly composed of AgCl, AgBr, and AgI is preferably used, and silver halide mainly composed of AgBr or AgCl is preferably used. Silver chlorobromide, silver iodochlorobromide and silver iodobromide are also preferably used. More preferred are silver chlorobromide, silver bromide, silver iodochlorobromide and silver iodobromide, and most preferred are silver chlorobromide and silver iodochlorobromide containing 50 mol% or more of silver chloride. Used.
Here, “silver halide mainly composed of AgBr (silver bromide)” refers to silver halide in which the molar fraction of bromide ions in the silver halide composition is 50% or more. The silver halide grains mainly composed of AgBr may contain iodide ions and chloride ions in addition to bromide ions.

The silver halide emulsion used in this embodiment may contain a metal belonging to Group VIII or Group VIIB. In particular, it is preferable to contain a rhodium compound, an iridium compound, a ruthenium compound, an iron compound, an osmium compound or the like in order to obtain a gradation of 4 or more or to achieve low fog.
For high sensitivity, doping with a metal hexacyanide complex such as K ₄ [Fe (CN) ₆ ], K ₄ [Ru (CN) ₆ ] or K ₃ [Cr (CN) ₆ ] is advantageous. Done.
The amount of these compounds added is preferably 10 ⁻¹⁰ to 10 ⁻² mol / mol Ag per mol of silver halide, more preferably 10 ⁻⁹ to 10 ⁻³ mol / mol Ag.

In addition, in the present embodiment, silver halide containing Pd (II) ions and / or Pd metal can be preferably used. Pd may be uniformly distributed in the silver halide grains, but is preferably contained in the vicinity of the surface layer of the silver halide grains. Here, Pd “contains in the vicinity of the surface layer of the silver halide grains” means that the Pd content is higher than the other layers within 50 nm in the depth direction from the surface of the silver halide grains. means.
Such silver halide grains can be prepared by adding Pd in the course of forming silver halide grains. After adding silver ions and halogen ions to 50% or more of the total addition amount, Pd Is preferably added. It is also preferred that Pd (II) ions be present in the surface layer of the silver halide by a method such as addition at the time of post-ripening.
The Pd-containing silver halide grains increase the speed of physical development and electroless plating, increase the production efficiency of a desired heating element, and contribute to the reduction of production costs. Pd is well known and used as an electroless plating catalyst. However, in the present invention, Pd can be unevenly distributed on the surface layer of silver halide grains, so that extremely expensive Pd can be saved. is there.

In the present embodiment, the content of Pd ions and / or Pd metal contained in the silver halide is 10 ^{−4 to} 0.5 mol / mol Ag with respect to the number of moles of silver in the silver halide. It is more preferable that it is 0.01-0.3 mol / mol Ag.
Examples of the Pd compound to be used include PdCl ₄ and Na ₂ PdCl ₄ .
Silver coating amount of silver salt emulsion layer (coating amount of silver salt) is preferably from 1 to 30 g / m ² in terms of silver, more preferably 1 to 25 g / m ^2, more preferably 5 to 20 g / m ² . By setting the coated silver amount within the above range, a desired surface resistance can be obtained when the conductive sheet 10 is used.

<Binder>
Examples of the binder used in this embodiment include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and derivatives thereof, polyethylene oxide, polyvinyl amine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.
The content of the binder contained in the silver salt emulsion layer 16 of the present embodiment is not particularly limited, and can be appropriately determined as long as dispersibility and adhesion can be exhibited. The content of the binder in the silver salt emulsion layer 16 is preferably 1/4 or more, and more preferably 1/2 or more in terms of a silver / binder volume ratio. The silver / binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. The silver / binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver / binder volume ratio in the silver salt emulsion layer within this range, even when the coating silver amount is adjusted, variation in the resistance value can be suppressed, and the conductive sheet 10 having a uniform surface resistance can be obtained. The silver / binder volume ratio is converted from the amount of silver halide / binder amount (weight ratio) of the raw material to the amount of silver / binder amount (weight ratio), and the amount of silver / binder amount (weight ratio) is further converted to the amount of silver. / It can obtain | require by converting into binder amount (volume ratio).

<Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide, etc. Sulphoxides such as, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
The content of the solvent used in the silver salt emulsion layer of the present embodiment is in the range of 30 to 90% by mass with respect to the total mass of the silver salt and binder contained in the silver salt emulsion layer, and 50 to 80 It is preferably in the range of mass%.

<Other additives>
There are no particular restrictions on the various additives used in the present embodiment, and known ones can be preferably used.
[Other layer structure]
A protective layer (not shown) may be provided on the silver salt emulsion layer. In the present embodiment, the “protective layer” means a layer made of a binder such as gelatin or a high molecular polymer, and is formed on a silver salt emulsion layer having photosensitivity in order to exhibit an effect of preventing scratches and improving mechanical properties. It is formed. The thickness is preferably 0.5 μm or less. The coating method and forming method of the protective layer are not particularly limited, and a known coating method and forming method can be appropriately selected. An undercoat layer, for example, can be provided below the silver salt emulsion layer.

Next, each step of the manufacturing method of the conductive sheet 10 will be described.
[exposure]
The present embodiment includes a case where the pattern of the first conductive portion 13A and the pattern of the second conductive portion 13B are applied by a printing method. A pattern is formed by exposure and development. That is, exposure is performed on a photosensitive material having a silver salt-containing layer provided on both surfaces of the transparent substrate 12 or a photosensitive material coated with a photopolymer for photolithography. The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

[Development processing]
In this embodiment, after the emulsion layer is exposed, development processing is further performed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. The developer is not particularly limited, but a PQ developer, MQ developer, MAA developer and the like can also be used. Commercially available products include, for example, CN-16, CR-56, CP45X, and FD prescribed by FUJIFILM Corporation. -3, Papitol, a developer such as C-41, E-6, RA-4, D-19, D-72, etc. formulated by KODAK, or a developer included in the kit can be used. A lith developer can also be used.
The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.
The fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds. The replenishing amount of the fixing solution is preferably 600 ml / m ² or less with respect to the processing of the photosensitive material, more preferably 500 ml / m ² or less, 300 ml / m ² or less is particularly preferred.

The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment. In the washing treatment or stabilization treatment, the washing water amount is usually 20 liters or less per 1 m ^{2 of the} light-sensitive material, and can be replenished in 3 liters or less (including 0, ie, rinsing with water).
The mass of the metallic silver contained in the exposed portion after the development treatment is preferably a content of 50% by mass or more, and 80% by mass or more with respect to the mass of silver contained in the exposed portion before exposure. More preferably. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

The gradation after the development processing in the present embodiment is not particularly limited, but is preferably more than 4.0. When the gradation after the development processing exceeds 4.0, the conductivity of the conductive metal portion can be increased while keeping the light transmissive property of the light transmissive portion high. Examples of means for setting the gradation to 4.0 or higher include the aforementioned doping of rhodium ions and iridium ions.
Although the conductive sheet 10 is obtained through the above steps, the surface resistance of the obtained conductive sheet 10 is 0.1 to 100 ohm / sq. It is preferable that it exists in the range. The lower limit is 1 ohm / sq. 3 ohm / sq. 5 ohm / sq. 10 ohm / sq. It is preferable that The upper limit is 70 ohm / sq. Hereinafter, 50 ohm / sq. The following is preferable. Further, the conductive sheet 10 after the development process may be further subjected to a calendar process, and can be adjusted to a desired surface resistance by the calendar process.

[Physical development and plating]
In the present embodiment, for the purpose of improving the conductivity of the metallic silver portion formed by the exposure and development processing, physical development and / or plating treatment for supporting the conductive metal particles on the metallic silver portion is performed. May be. In the present invention, the conductive metal particles may be supported on the metallic silver portion by only one of physical development and plating treatment, or the conductive metal particles are supported on the metallic silver portion by combining physical development and plating treatment. May be. In addition, the thing which performed the physical development and / or the plating process to the metal silver part is called "conductive metal part".
“Physical development” in the present embodiment means that metal particles such as silver ions are reduced by a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W film, instant slide film, printing plate manufacturing, and the like, and the technology can be used in the present invention.
Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.
In the present embodiment, the plating treatment can use electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. For the electroless plating in the present embodiment, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Plating is preferred.

[Oxidation treatment]
In the present embodiment, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by physical development and / or plating treatment to oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.

[Conductive metal part]
The lower limit of the line width of the conductive metal part of the present embodiment (the line width of the first conductive part 13A and the second conductive part 13B) is preferably 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more, and the upper limit is 10 μm. Hereinafter, it is preferably 9 μm or less and 8 μm or less. When the line width is less than the above lower limit, the conductivity becomes insufficient, so that when used for the touch panel 100, the detection sensitivity becomes insufficient. On the other hand, if the above upper limit is exceeded, moire caused by the conductive metal portion becomes noticeable, or the visibility is deteriorated when the touch panel 100 is used. In addition, by being in the said range, the moire of an electroconductive metal part is improved and visibility becomes especially good. The line interval (here, the interval between the opposing sides of the small lattice 18) is preferably 30 μm or more and 500 μm or less, more preferably 50 μm or more and 400 μm or less, and most preferably 100 μm or more and 350 μm or less. The conductive metal portion may have a portion whose line width is wider than 200 μm for the purpose of ground connection or the like.
The conductive metal portion in the present embodiment preferably has an aperture ratio of 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio is the ratio of the light-transmitting portions excluding the conductive portions such as the first large lattice 14A, the first connecting portion 16A, the second large lattice 14B, the second connecting portion 16B, and the small lattice 18 to the whole. For example, the aperture ratio of a square lattice having a line width of 15 μm and a pitch of 300 μm is 90%.

[Light transmissive part]
The “light transmissive part” in the present embodiment means a part having translucency other than the conductive metal part in the conductive sheet 10. As described above, the transmittance in the light transmissive portion is 90% or more, preferably the transmittance indicated by the minimum value of the transmittance in the wavelength region of 380 to 780 nm excluding the contribution of light absorption and reflection of the transparent substrate 12, 95% or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.
Regarding the exposure method, a method through a glass mask or a pattern exposure method by laser drawing is preferable.

[Conductive sheet 10]
The thickness of the transparent substrate 12 in the conductive sheet 10 according to the present embodiment is preferably 75 to 350 μm, and more preferably 75 to 150 μm. If it is the range of 75-350 micrometers, the transmittance | permeability of a desired visible light is obtained and handling is also easy.
The thickness of the metallic silver portion provided on both surfaces of the transparent substrate 12 can be appropriately determined according to the coating thickness of the silver salt-containing layer coating applied on both surfaces of the transparent substrate 12. The thickness of the metallic silver portion can be selected from 0.001 mm to 0.2 mm, but is preferably 30 μm or less, more preferably 20 μm or less, and further preferably 0.01 to 9 μm. And most preferably 0.05 to 5 μm. Moreover, it is preferable that a metal silver part is pattern shape. The metallic silver part may be a single layer or a multilayer structure of two or more layers. When the metallic silver portion is patterned and has a multilayer structure of two or more layers, different color sensitivities can be imparted so as to be sensitive to different wavelengths. Thereby, when the exposure wavelength is changed and exposed, a different pattern can be formed in each layer.

The thickness of the thin metal wire is preferable for the use of the touch panel because the viewing angle of the display panel is wider as the thickness is thinner. From such a viewpoint, the thickness of the fine metal wire is preferably 9 μm or less, more preferably 0.1 μm or more and 5 μm or less, and further preferably 0.1 μm or more and 3 μm or less.
In the present embodiment, the thickness of the layer made of conductive metal particles is formed by controlling the coating thickness of the silver salt-containing layer described above to form a metallic silver portion having a desired thickness, and further by physical development and / or plating treatment. Therefore, even the conductive sheet 10 having a thickness of less than 5 μm, preferably less than 3 μm can be easily formed.
In the method for manufacturing the conductive sheet 10 according to the present embodiment, it is not always necessary to perform a process such as plating. This is because in the method for manufacturing the conductive sheet 10 according to the present embodiment, a desired surface resistance can be obtained by adjusting the coating silver amount of the silver salt emulsion layer and the silver / binder volume ratio. In addition, you may perform a calendar process etc. as needed.

(Hardening after development)
It is preferable to perform a film hardening process by immersing the film in a hardener after the silver salt emulsion layer is developed. Examples of the hardening agent include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. .
[Calendar processing]
The developed silver metal portion may be smoothed by calendaring. This significantly increases the conductivity of the metallic silver part. The calendar process can be performed by a calendar roll. The calendar roll usually consists of a pair of rolls.
As a roll used for the calendar process, a plastic roll or a metal roll such as epoxy, polyimide, polyamide, polyimide amide or the like is used. In particular, when emulsion layers are provided on both sides, it is preferable to treat with metal rolls. When an emulsion layer is provided on one side, a combination of a metal roll and a plastic roll can be used from the viewpoint of preventing wrinkles. The upper limit of the linear pressure is 1960 N / cm (200 kgf / cm, converted to a surface pressure of 699.4 kgf / cm ² ) or more, more preferably 2940 N / cm (300 kgf / cm, converted to a surface pressure of 935.8 kgf / cm ^2). ) That's it. The upper limit of the linear pressure is 6880 N / cm (700 kgf / cm) or less.
The application temperature of the smoothing treatment represented by the calender roll is preferably 10 ° C. (no temperature control) to 100 ° C., and the more preferable temperature varies depending on the line density and shape of the metal mesh pattern and metal wiring pattern, and the binder type. , Approximately 10 ° C. (no temperature control) to 50 ° C.

[Conductive sheet 10]
The conductive sheet 10 may be provided with an antireflection film 126. In this case, the first to third configuration examples shown in FIGS. 8A to 8C described above can be preferably employed.
The antireflection film 126 is formed, for example, by forming a hard coat layer 122 and an antireflection layer 124 on the conductive sheet 10 (see the first configuration example and the second configuration example), or a transparent film 130 and a hard coat on the conductive sheet 10. The layer 122 and the antireflection layer 124 are formed (see the third configuration example).
Hereinafter, a preferred aspect of the antireflection film 126 will be described mainly with reference to the third configuration example.

<Transparent film 130>
Since the transparent film 130 is used on the viewer side surface of the display device 108, the transparent film 130 is required to be a colorless film having high light transmittance and excellent transparency. As such a transparent film 130, it is preferable to use a plastic film. Examples of the polymer forming the plastic film include cellulose acylate (eg, cellulose triacetate such as TAC-TD80U and TD80UF manufactured by Fuji Film Co., Ltd., cellulose diacetate, cellulose acetate propionate, cellulose acetate butyrate), polyamide, and polycarbonate. , Polyester (eg, polyethylene terephthalate, polyethylene naphthalate), polystyrene, polyolefin, norbornene resin (Arton: trade name, manufactured by JSR Corporation), amorphous polyolefin (ZEONEX: trade name, manufactured by Nippon Zeon Co., Ltd.) , (Meth) acrylic resin (Acrypet VRL20A: trade name, manufactured by Mitsubishi Rayon Co., Ltd., including ring structures described in JP-A Nos. 2004-70296 and 2006-171464 Acrylic-based resin). Among these, cellulose triacetate, cellulose acetate propionate, cellulose acetate butyrate, polyethylene terephthalate, and polyethylene naphthalate are preferable, and cellulose triacetate is particularly preferable.

<Hard coat layer 122>
In order to give the antireflection film 126 the physical strength of the antireflection film 126, it is preferable to provide a hard coat layer 122. The hard coat layer 122 may be composed of two or more layers.

The refractive index of the hard coat layer 122 is preferably in the range of 1.48 to 1.90, more preferably 1.50 to 1.80, from the optical design for obtaining an antireflection film. More preferably, it is 1.52-1.65. In this embodiment, since there is at least one low refractive index layer on the hard coat layer 122, when the refractive index is too small, the antireflection property is lowered, and when it is too large, the color of reflected light is strong. Tend to be.
From the viewpoint of imparting sufficient durability and impact resistance to the antireflection film 126, the hard coat layer 122 has a thickness of usually about 0.5 to 50 μm, preferably 1 to 20 μm, More preferably, it is 2-15 micrometers, Most preferably, it is 3-10 micrometers. Further, the strength of the hard coat layer 122 is preferably 2H or more, more preferably 3H or more, and most preferably 4H or more in a pencil hardness test. Furthermore, in the Taber test according to JISK5400, the smaller the amount of wear of the test piece before and after the test, the better.

  The hard coat layer 122 is preferably formed by a crosslinking reaction or a polymerization reaction of an ionizing radiation curable compound. For example, it can be formed by applying a composition containing an ionizing radiation-curable polyfunctional monomer or polyfunctional oligomer on the transparent film 130 and causing the polyfunctional monomer or polyfunctional oligomer to undergo a crosslinking reaction or a polymerization reaction. . The functional group of the ionizing radiation-curable polyfunctional monomer or polyfunctional oligomer is preferably a light, electron beam, or radiation polymerizable group, and among them, a photopolymerizable functional group is preferable. Examples of the photopolymerizable functional group include unsaturated polymerizable functional groups such as a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group. Among them, a (meth) acryloyl group is preferable. As specific compounds, the monomers described in paragraphs [0087] and [0088] of JP-A-2006-30740 can be used, and the curing method described in paragraph [0089] of the same publication is used. Can do. In the case of photopolymerization, the photopolymerization initiators described in paragraphs [0090] to [0093] of the same publication can be used.

The hard coat layer 122 contains matte particles having an average particle diameter of 1.0 to 10.0 μm, preferably 1.5 to 7.0 μm, such as inorganic compound particles or resin particles, for the purpose of imparting internal scattering properties. May be. As these particles, the particles described in paragraph [0114] of JP-A-2006-30740 can be used.
For the binder of the hard coat layer 122, for the purpose of controlling the refractive index of the hard coat layer 122, a high refractive index monomer or inorganic fine particles having a size that does not cause light scattering (the primary particle diameter is 10 to 200 nm), or both Can be added. In addition to the effect of controlling the refractive index, the inorganic fine particles also have an effect of suppressing curing shrinkage due to a crosslinking reaction. As the inorganic fine particles, compounds described as inorganic fillers in paragraph [0120] of JP-A-2006-30740 can be used.

<Antireflection layer 124>
The antireflection film 126 is a film in which the antireflection layer 124 is formed on the hard coat layer 122 described above (which may include a transparent film 130 as a lower layer), and uses optical interference, so the antireflection layer 124 is used. Preferably has the refractive index and optical thickness described below. The antireflection layer 124 may be a single layer, but when a lower reflectance is required, a plurality of antireflection layers 124 are stacked. In the lamination of the plurality of antireflection layers 124, optical interference layers having different refractive indexes may be alternately laminated, or two or more optical interference layers having different refractive indexes may be laminated. Specifically, an embodiment in which only a low refractive index layer is provided on the hard coat layer 122, an embodiment in which a high refractive index layer and a low refractive index layer are provided in this order on the hard coat layer 122, and an intermediate refractive index on the hard coat layer 122 A mode in which a layer, a high refractive index layer, and a low refractive index layer are provided in this order is commonly used. Note that low, medium, and high in the refractive index layer are expressions of the relative magnitude relationship of the refractive index. The refractive index of the low refractive index layer is preferably set lower than the refractive index of the hard coat layer 122 described above. When the refractive index difference between the low refractive index layer and the hard coat layer 122 is too small, the antireflection property is lowered, and when it is too large, the color of the reflected light tends to be strong. The difference in refractive index between the low refractive index layer and the hard coat layer 122 is preferably 0.01 or more and 0.40 or less, and more preferably 0.05 or more and 0.30 or less.
The refractive index and thickness of each layer preferably satisfy the following.

That is, the refractive index of the low refractive index layer is preferably 1.20 to 1.46, more preferably 1.25 to 1.42, and particularly preferably 1.30 to 1.38. preferable. Further, the thickness of the low refractive index layer is preferably 50 to 150 nm, and more preferably 70 to 120 nm.
In order to produce the antireflection film 126 by laminating a low refractive index layer on a high refractive index layer, the refractive index of the high refractive index layer is preferably 1.55 to 2.40, more preferably. Is 1.60 to 2.20, more preferably 1.65 to 2.10, and most preferably 1.80 to 2.00.
When the antireflective film 126 is formed by laminating a medium refractive index layer, a high refractive index layer, and a low refractive index layer in order from the transparent film 130 (or the touch panel 100), the refractive index of the high refractive index layer is 1.65. It is preferably ˜2.40, more preferably 1.70 to 2.20. The refractive index of the middle refractive index layer is adjusted to be a value between the refractive index of the low refractive index layer and the refractive index of the high refractive index layer. The refractive index of the middle refractive index layer is preferably 1.55-1.80. In addition, the thickness of the high refractive index layer and the middle refractive index layer can be set to an optical thickness corresponding to the range of the refractive index.

[Low refractive index layer]
The above-mentioned low refractive index layer is preferably cured after forming the layer. The haze of the low refractive index layer is preferably 3% or less, more preferably 2% or less, and most preferably 1% or less.
A preferred composition for forming the low refractive index layer of the present invention is preferably a composition containing at least one of the following.
(1) A composition containing a fluorine-containing polymer having a crosslinkable or polymerizable functional group,
(2) a composition comprising as a main component a hydrolysis-condensation product of a fluorine-containing organosilane material;
(3) a composition containing a monomer having two or more ethylenically unsaturated groups and inorganic fine particles having a hollow structure;
Is mentioned.

(1) Fluorine-containing compound having a crosslinkable or polymerizable functional group As the fluorine-containing compound having a crosslinkable or polymerizable functional group, co-polymerization of a fluorine-containing monomer and a monomer having a crosslinkable or polymerizable functional group Coalescence can be mentioned.
Among the above-mentioned copolymers, a copolymer having a main chain composed only of carbon atoms and comprising a fluorine-containing vinyl monomer polymer unit and a polymer unit having a (meth) acryloyl group in the side chain is particularly characterized. P-1 to P-40 described in paragraphs [0043] to [0047] of Kaikai 2004-45462 can be used. Further, as a fluorine-containing polymer into which a silicone component is introduced for improving scratch resistance and slipperiness, a graft polymer having a polymer unit containing a polysiloxane moiety in the side chain and a fluorine atom in the main chain is disclosed in JP The compounds described in Tables 1 and 2 of paragraphs [0074] to [0076] of 2003-222702 can be used, and the ethylenically unsaturated group-containing fluorine containing a structural unit derived from a polysiloxane compound in the main chain As the polymer, compounds described in JP-A No. 2003-183322 can be used.

As described in JP 2000-17028 A, a curing agent having a polymerizable unsaturated group may be used in combination with the above polymer. Moreover, combined use with a compound having a fluorine-containing polyfunctional polymerizable unsaturated group as described in JP-A No. 2002-145952 is also preferred. Examples of the compound having a polyfunctional polymerizable unsaturated group include the above-described monomers having two or more ethylenically unsaturated groups. Moreover, the hydrolysis-condensation product of the organolane described in Unexamined-Japanese-Patent No. 2004-170901 is also preferable, and the hydrolysis-condensation product of the organosilane containing a (meth) acryloyl group is especially preferable. These compounds are particularly preferred because they have a large combined effect for improving scratch resistance, particularly when a compound having a polymerizable unsaturated group is used in the polymer body.
When the polymer itself does not have sufficient curability, necessary curability can be imparted by blending a crosslinkable compound. For example, when the polymer body contains a hydroxyl group, various amino compounds are preferably used as the curing agent. The amino compound used as the crosslinkable compound is, for example, a compound containing one or both of a hydroxyalkylamino group and an alkoxyalkylamino group in total, specifically, for example, a melamine compound, Examples include urea compounds, benzoguanamine compounds, glycoluril compounds, and the like. For curing these compounds, an organic acid or a salt thereof is preferably used.

(2) Hydrolyzed condensate of fluorine-containing organosilane material A composition containing a hydrolyzed condensate of a fluorine-containing organosilane compound as a main component is also preferable because of its low refractive index and high hardness on the coating film surface. A condensate of a tetraalkoxysilane with a hydrolyzable silanol-containing compound at one or both ends with respect to the fluorinated alkyl group is preferred. Specific compositions are described in JP-A Nos. 2002-265866 and 2002-317152.
(3) A composition containing a monomer having two or more ethylenically unsaturated groups and inorganic fine particles having a hollow structure

  Yet another preferred embodiment is a low refractive index layer composed of low refractive index particles and a binder. The low refractive index particles may be organic or inorganic, but particles having pores inside are preferable. Specific examples of the hollow particles include silica-based particles described in JP-A No. 2002-79616 (see, for example, paragraphs [0041] to [0049]). The particle refractive index is preferably 1.15 to 1.40, more preferably 1.20 to 1.30. Examples of the binder include monomers having two or more ethylenically unsaturated groups described in the section of the hard coat layer 122 described above.

It is preferable to add the polymerization initiator described in the above-mentioned item of the hard coat layer 122 (for example, see paragraphs [0090] to [0093] of JP-A-2006-30740) to the low refractive index layer. When a radical polymerizable compound is contained, 1 to 10 parts by mass, preferably 1 to 5 parts by mass of a polymerization initiator can be used with respect to 100 parts by mass of the compound.
In the low refractive index layer, inorganic particles can be used in combination. In order to impart scratch resistance, fine particles having a particle size of 15% to 150%, preferably 30% to 100%, more preferably 45% to 60% of the thickness of the low refractive index layer can be used. .
For the purpose of imparting antifouling properties, water resistance, chemical resistance, slipping properties, etc., a known polysiloxane-based or fluorine-based antifouling agent, slipping agent, etc. are appropriately added to the low refractive index layer. Can do.

[High refractive index layer / Medium refractive index layer]
As described above, the antireflection film 126 can be provided with a layer having a high refractive index between the low refractive index layer and the hard coat layer 122 to enhance the antireflection property.
The high refractive index layer and the medium refractive index layer are preferably formed from a curable composition containing high refractive inorganic fine particles and a binder. As the high refractive index inorganic fine particles that can be used here, high refractive index inorganic fine particles that can be contained to increase the refractive index of the hard coat layer 122 can be used. As the high refractive index inorganic fine particles, for example, particles of inorganic compounds such as silica particles and TiO ₂ particles; resin particles such as acrylic particles, crosslinked acrylic particles, polystyrene particles, crosslinked styrene particles, melamine resin particles, and benzoguanamine resin particles are preferable. Can be mentioned.

  The high refractive index layer and the medium refractive index layer are preferably formed in a dispersion liquid in which inorganic particles are dispersed in a dispersion medium, preferably a binder precursor necessary for matrix formation (for example, an ionizing radiation curable polyfunctional monomer or Polyfunctional oligomer, etc.), a photopolymerization initiator, etc. are added to form a coating composition for forming a high refractive index layer and a medium refractive index layer. For example, a coating composition for forming a high refractive index layer and a medium refractive index layer on a transparent film It is preferable to form the product by applying a product and curing it by a crosslinking reaction or a polymerization reaction of an ionizing radiation curable compound (for example, a polyfunctional monomer or polyfunctional oligomer).

Furthermore, it is preferable to cause the binder of the high refractive index layer and the medium refractive index layer to undergo a crosslinking reaction or a polymerization reaction with the dispersant simultaneously with or after the coating of the layer.
The binder of the high refractive index layer and the medium refractive index layer produced in this way is, for example, a preferable dispersant described above and an ionizing radiation curable polyfunctional monomer or polyfunctional oligomer, which are crosslinked or polymerized to form a binder. It becomes a form in which the anionic group of the dispersant is incorporated. Furthermore, the binder of the high refractive index layer and the medium refractive index layer has a function of maintaining the dispersion state of the inorganic particles by the anionic group, and the crosslinked or polymerized structure imparts a film forming ability to the binder and contains inorganic particles. To improve the physical strength, chemical resistance and weather resistance of the high refractive index layer and medium refractive index layer.

The binder of the high refractive index layer is added in an amount of 5 to 80% by mass based on the solid content of the coating composition of the high refractive index layer.
The content of the inorganic particles in the high refractive index layer is preferably 10 to 90% by mass, more preferably 15 to 80% by mass, and particularly preferably 15 to 75% by mass with respect to the mass of the high refractive index layer. . Two or more kinds of inorganic particles may be used in combination in the high refractive index layer.
When the low refractive index layer is provided on the high refractive index layer, the refractive index of the high refractive index layer is preferably higher than the refractive index of the transparent film 130.
The film thickness when the high refractive index layer is used as the optical interference layer is preferably 30 to 200 nm, more preferably 50 to 170 nm, and particularly preferably 60 to 150 nm.
The haze of the high refractive index layer and the medium refractive index layer is preferably as low as possible. It is preferably 5% or less, more preferably 3% or less, and particularly preferably 1% or less.

The preferred integrated reflectance of the antireflection film 126 provided with the low refractive index layer is preferably 3.0% or less, more preferably 2.0% or less, and most preferably 1.5% or less 0.3% or more. It is.
From the viewpoint of improving antifouling properties, it is preferable to reduce the surface free energy on the surface of the low refractive index layer. Specifically, it is preferable to use a fluorine-containing compound or a compound having a polysiloxane structure for the low refractive index layer. Further, an antifouling layer containing the following compound may be provided on the low refractive index layer separately from the low refractive index layer.
Examples of the additive having a polysiloxane structure include a reactive group-containing polysiloxane {for example, “KF-100T”, “X-22-169AS”, “KF-102”, “X-22-3701IE”, “X-22”. -164B "," X-22-5002 "," X-22-173B "," X-22-174D "," X-22-167B "," X-22-161AS "(product name), Shin-Etsu “AK-5”, “AK-30”, “AK-32” (trade name), manufactured by Toa Gosei Co., Ltd .; “Silaplane FM0725”, “Silaplane FM0721” (product) Name), manufactured by Chisso Corporation, etc.} is also preferable. Moreover, the silicone type compound of Table 2 and Table 3 of Unexamined-Japanese-Patent No. 2003-112383 can also be used preferably. These polysiloxanes are preferably added in the range of 0.1 to 10% by mass of the total solid content of the low refractive index layer, particularly preferably 1 to 5% by mass.

[Method for Producing Antireflection Film 126]
The antireflection film 126 can be formed by the following coating method, but is not limited thereto.
(Preparation work for application)
First, a coating solution containing components for forming each layer such as the hard coat layer 122 and the antireflection layer 124 is prepared. Usually, since the coating solution is mainly an organic solvent system, it is necessary to suppress the water content to 2% or less and to seal it to suppress the volatilization amount of the solvent. The organic solvent to be used is selected according to the material used for each layer. In order to obtain the uniformity of the coating solution, a stirrer or a disperser is appropriately used.
The adjusted coating solution is preferably filtered before coating so as not to cause a coating failure. It is preferable to use a filter having a pore size as small as possible within a range in which the components in the coating solution are not removed, and the filtration pressure is appropriately selected at 1.5 MPa or less. The filtered coating solution is preferably ultrasonically dispersed immediately before coating to defoam and retain the dispersion.

The transparent film 130 may be subjected to a heat treatment for correcting the base deformation or a surface treatment for improving the coating property and the adhesiveness with the coating layer before coating. Specific methods for the surface treatment include corona discharge treatment, glow discharge treatment, flame treatment, acid treatment, alkali treatment, and ultraviolet irradiation treatment. In addition, as described in JP-A-7-333433, it is preferable to provide an undercoat layer.
Further, it is preferable to provide a dust removing step as a pre-application step, and as a dust removing method used therefor, the method described in paragraph [0119] of JP 2010-32795 A can be used. In addition, it is particularly preferable to remove static electricity from the transparent film 130 before performing such a dust removal step in terms of increasing dust removal efficiency and suppressing dust adhesion. As such a static elimination method, the method described in paragraph [0120] of JP 2010-32795 A can be used. Furthermore, the flatness of the transparent film 130 may be secured and the adhesiveness may be improved by the method described in paragraphs [0121] and [0123] of the above publication.

(Coating process)
Each layer of the antireflection film 126 can be formed by the following coating method, but is not limited to this method. Dip coating method, air knife coating method, curtain coating method, roller coating method, wire bar coating method, gravure coating method and extrusion coating method (die coating method) (US Pat. No. 2,681,294, International Publication No. 05/123274) And a known method such as a micro gravure coating method is used, and among these, a micro gravure coating method and a die coating method are preferable. The micro gravure coating method is described in paragraphs [0125] and [0126] of JP 2010-32795 A, and the die coating method is described in paragraphs [0127] and [0128] of the above publication. These methods can also be used in the form. It is preferable in terms of productivity to apply at a speed of 20 m / min or more by using a die coating method.

(Drying process)
The antireflective film 126 is preferably applied on the transparent film 130 directly or via other layers and then conveyed in a web to a heated zone to dry the solvent.
Various knowledges can be used as a method for drying the solvent. Specific knowledge includes description techniques such as JP 2001-286817 A, 2001-314798, 2003-126768, 2003-315505, and 2004-34002.
The conditions described in paragraph [0130] of JP 2010-32795 A can be used for the temperature condition of the drying zone, and the conditions described in paragraph [0131] of the same publication can be used for the condition of the drying air.

(Curing process)
The antireflection film 126 can pass through a zone for curing each coating film by ionizing radiation and / or heat as a web after the solvent is dried or at a later stage of drying to cure the coating film. The ionizing radiation described above is not particularly limited, and is appropriately selected from ultraviolet rays, electron beams, near ultraviolet rays, visible light, near infrared rays, infrared rays, X-rays, and the like according to the type of the curable composition forming the film. However, ultraviolet rays and electron beams are preferred, and ultraviolet rays are particularly preferred because they are easy to handle and high energy can be easily obtained.
As the ultraviolet light source for photopolymerizing the ultraviolet curable compound, the light source described in paragraph [0133] of JP 2010-32795 A can be used, and the electron beam described in paragraph [0134] of the same publication can be used. Lines can be used. The conditions described in paragraphs [0135] and [0138] of the same publication can be used for the irradiation conditions, irradiation light quantity, and irradiation time. Furthermore, for the film surface temperature, oxygen concentration, and oxygen concentration control method before and after irradiation, use the conditions and methods described in paragraphs [0136], [0137], and [0139] to [0144] of the same publication. Can do.

(Handling for continuous production)
In order to continuously manufacture the antireflection film 126, a process of continuously feeding a roll-shaped transparent film 130, a process of applying and drying a coating liquid, a process of curing a coating film, and the transparent having a cured layer. A step of winding the film 130 is performed.
The above-described steps may be performed every time each layer is formed, or a plurality of coating units-drying chambers-curing units may be provided (so-called tandem method), and each layer may be formed continuously.
In order to produce the antireflection film 126, as described above, simultaneously with the microfiltration operation of the coating liquid, the coating process in the coating unit and the drying process performed in the drying chamber are performed in a high clean air atmosphere, and It is preferable that dust and dust on the transparent film 130 are sufficiently removed before the application. The air cleanliness of the coating process and the drying process is desirably class 10 (353 particles / m ³ or less of 0.5 μm or more) based on the standard of air cleanliness in US Federal Standard 209E, and more preferably. Is preferably class 1 (35.5 particles / m ³ or less of particles of 0.5 μm or more) or more. Moreover, it is more preferable that the degree of air cleanliness is high also in the feeding and winding parts other than the coating-drying process.

In order to maintain the sharpness of the image, the antireflection film 126 preferably adjusts the sharpness of the transmitted image in addition to adjusting the surface shape as smoothly as possible. The transmitted image definition of the antireflection film 126 is preferably 60% or more. The transmitted image definition is generally an index indicating the degree of blurring of an image reflected through the film, and the larger this value, the clearer and better the image viewed through the film. The transmitted image definition is preferably 70% or more, and more preferably 80% or more.
The antireflection film 126 can be used as a surface film on the viewing side of the display device 108. The display device 108 can be applied to various display devices such as various liquid crystal display devices, plasma displays, organic EL, and touch panels. Depending on the properties of the outermost surface of the display device 108 using the antireflection film 126, an adhesive layer is provided on the surface of the antireflection film 126 that does not have the coating layer of the transparent film 130 (hereinafter sometimes referred to as the back surface). Alternatively, the back surface of the transparent film 130 can be saponified and attached to the touch panel 100.
For the method of saponifying the back surface of the transparent film 130, the techniques described in paragraphs [0149] to [0160] of Japanese Patent Application Laid-Open No. 2010-32795 can be used.

  In addition, this invention can be used in combination with the technique of the publication gazette and international publication pamphlet which are described in following Table 1 and Table 2. FIG. Notations such as “JP,” “Gazette” and “No. Pamphlet” are omitted.

Hereinafter, the present invention will be described more specifically with reference to examples of the present invention. In addition, the material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Examples can be changed suitably unless it deviates from the meaning of this invention. Accordingly, the scope of the present invention should not be construed as being limited by the specific examples shown below.
[First embodiment]
1st Example evaluated the adhesiveness (bubble mixing state and rework property) and visibility of an adhesive (adhesive sheet) about the conductive sheets according to Examples 1 to 5 and Comparative Example 1. The breakdown of Examples 1 to 5 and Comparative Example 1 is shown in Table 3, and the evaluation results are shown in Table 4.

<Examples 1 and 2>
(Silver halide photosensitive material)
An emulsion containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium and containing silver iodobromochloride grains having an average equivalent sphere diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared. .
In this emulsion, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added so as to have a concentration of 10 ⁻⁷ (mol / mol silver), and silver bromide grains were doped with Rh ions and Ir ions. . Na ₂ PdCl ₄ was added to this emulsion, and gold sulfur was further sensitized with chloroauric acid and sodium thiosulfate. Emulsion B was prepared by reducing the amount of K ₃ Rh ₂ Br ₉ to Emulsion A and increasing the sensitivity twice.
(Photosensitive layer coating)
Then, it coated on one main surface (here, polyethylene terephthalate (PET)) of the transparent base | substrate 12 so that the coating amount of silver might be set to 10 g / m < ² > with a gelatin hardener. At this time, the volume ratio of Ag / gelatin was 2/1. The thickness of the transparent substrate 12 was 100 μm. 5 g / m ² Emulsion B in the lower layer, the emulsion A was multilayer coating so that 5 g / m ² on the upper layer.
Coating was performed for 20 m with a width of 25 cm on a PET support having a width of 30 cm, and both ends were cut off by 3 cm so as to leave a central portion of the coating, thereby obtaining a roll-shaped silver halide photosensitive material.

(exposure)
The exposure pattern was the pattern shown in FIGS. 4A and 5, and was performed on the transparent substrate 12 having an A4 size (210 mm × 297 mm). The exposure was performed using parallel light using a high-pressure mercury lamp as a light source through the photomask having the above pattern.

(Development processing)
・ Developer 1L formulation Hydroquinone 20 g
Sodium sulfite 50 g
Potassium carbonate 40 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjusted to pH 10.3 and formulated 1L fixer ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25 g
1,3-diaminopropane tetraacetic acid 8 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjustment to pH 6.2 Photosensitive material exposed using the above processing agent is processed using an automatic processor FG-710PTS manufactured by FUJIFILM Corporation. Development conditions: development 35 ° C. 30 seconds, fixing 34 ° C. 23 seconds, water / Min) for 20 seconds to obtain conductive sheets according to Examples 1 and 2.

<Example 3>
A conductive sheet according to Example 3 was produced in the same manner as in Example 1 except that the consolidation process (calendar process) was performed after the development process. The calendar treatment was performed by a combination of a metal roll and a plastic roll, and was performed at a line pressure of 2940 N / cm or more and 6880 N / cm or less.
<Example 4>
A copper foil substrate in which a copper foil is formed on one side of a transparent substrate 12 having a thickness of 100 μm is prepared, and the copper foil of the copper foil substrate is selectively isotropically etched to obtain the patterns shown in FIGS. 4A and 5. Thus, a conductive sheet according to Example 4 was obtained.
<Example 5>
A conductive sheet according to Example 5 was produced in the same manner as in Example 4 except that the surface of the fine metal wire made of copper foil was subjected to blackening treatment.

<Comparative Example 1>
(Silver halide photosensitive material)
An emulsion containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium and containing silver iodobromochloride grains having an average equivalent sphere diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared. .
In this emulsion, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added so as to have a concentration of 10 ⁻⁷ (mol / mol silver), and silver bromide grains were doped with Rh ions and Ir ions. . After adding Na ₂ PdCl ₄ to this emulsion and further performing gold-sulfur sensitization with chloroauric acid and sodium thiosulfate, together with the gelatin hardener, the coating amount of silver is 10 g / m ^2. It applied on one main surface (here, polyethylene terephthalate (PET)) of the transparent substrate 12. At this time, the volume ratio of Ag / gelatin was 2/1. The thickness of the transparent substrate 12 was 100 μm.
Coating was performed for 20 m with a width of 25 cm on a PET support having a width of 30 cm, and both ends were cut off by 3 cm so as to leave a central portion of the coating, thereby obtaining a roll-shaped silver halide photosensitive material.
Thereafter, exposure and development processes similar to those in Example 1 were performed, and further, a plating process was performed to obtain a conductive sheet according to Comparative Example 1.

[Measurement]
As shown below, the cross-sectional shape (the angle θ formed) of the fine metal wires in Examples 1 to 5 and Comparative Example 1, the resistance change rate by the bending test, and the difference in reflection chromaticity were measured. Table 3 shows the measurement results.
(Cross sectional shape of fine metal wire)
A cross-sectional photograph of the fine metal wire was taken, image processing was performed, and the angle formed by the side wall and the bottom surface (one main surface of the transparent substrate) of the fine metal wire was measured.
(Rate of resistance change by bending test)
The surface resistance R1 of the conductive part before the bending test (see FIG. 9) and the surface resistance R2 of the conductive part after the bending test were determined, and the resistance change rate R2 / R1 was determined.
(Difference in reflection chromaticity)
The reflection chromaticity of the conductive part measured from the surface of the conductive sheet (one principal surface side of the transparent substrate) is b1 *, and the reflection chromaticity of the conductive part measured from the back surface of the conductive sheet (other principal surface side of the transparent substrate) is b2. * Was determined, and the absolute value | b1 * -b2 * | of the difference in reflection chromaticity was determined.
[Evaluation]
As shown below, the adhesiveness of the adhesive sheets in Examples 1 to 5 and Comparative Example 1 (bubble mixing state and reworkability) and visibility were evaluated. The evaluation results are shown in Table 4.
(Bubble mixed state)
When the pressure-sensitive adhesive sheet is adhered to the entire surface including the conductive portion of the conductive sheet, “×” is obtained if there is even one bubble having a diameter of 0.5 mm or more, and “△” if there are 30 or more bubbles having a diameter of less than 0.5 mm. “○” when the number of bubbles having a diameter of less than 0.5 mm was 10 or more and less than 30, and “」 ”when the number of bubbles having a diameter of less than 0.5 mm was less than 10.
(Reworkability)
After sticking the adhesive sheet to the entire surface including the conductive part of the conductive sheet, when the adhesive sheet is peeled off, "x" if the fine metal wire is peeled off, and "○" if the fine metal wire is not peeled off evaluated.
(Visibility)
When the conductive sheet is pasted on the display screen of the liquid crystal display device and the liquid crystal display device is driven to display white, whether there is any line thickening or black spots, and the first large lattice 14A and the second large lattice It was confirmed with the naked eye whether the boundary of 14B was conspicuous.

In Table 3, the comparative example 1 has an angle θ of 100 °. This is considered to be because the width of the upper part of the fine metal wire is larger than the width of the lower part because the metal thin line is formed by forming a plating layer on the metal silver part having a rectangular cross section.
From Table 4, the visibility was good in both Comparative Example 1 and Examples 1-5. However, in Comparative Example 1, the adhesive property of the pressure-sensitive adhesive sheet was poor, air bubbles having a diameter of 0.5 mm or more were mixed, and when the pressure-sensitive adhesive sheet was peeled off, the fine metal wires were peeled off.
On the other hand, in Examples 1 to 5, the adhesiveness of the pressure-sensitive adhesive sheet was good, and in particular, Examples 3 and 5 had almost no air bubbles.

[Second Embodiment]
In the second example, the conductive sheets according to Examples 11 to 45 and Reference Examples 1 to 19 are different in the cross-sectional shape (the angle θ formed) of the fine metal wire, the peel adhesive strength depending on the thickness of the fine metal wire, and the surface resistance of the conductive sheet. As well as the difference in conductivity and reworkability.
(Example 11)
A conductive sheet according to Example 11 was obtained in the same manner as in Example 1 except that the line width of the fine metal wire was 10 μm, the cross-sectional shape (formed angle θ) of the fine metal wire was 85 °, and the thickness of the fine metal wire was 9 μm. Produced.
(Examples 12 to 17)
Conductive sheets according to Examples 12 to 17 were produced in the same manner as Example 11 except that the thickness of the thin metal wire was 7 μm, 5 μm, 3 μm, 1 μm, 0.5 μm, and 0.1 μm.
(Reference Examples 1 and 2)
Conductive sheets according to Reference Examples 1 and 2 were produced in the same manner as in Example 11 except that the thickness of the thin metal wire was 10 μm and 0.05 μm.

(Example 18)
The conductive sheet according to Example 18 was obtained in the same manner as in Example 1 except that the line width of the fine metal wire was 10 μm, the cross-sectional shape (the formed angle θ) of the fine metal wire was 80 °, and the thickness of the fine metal wire was 9 μm. Produced.
(Examples 19 to 24)
Conductive sheets according to Examples 19 to 24 were produced in the same manner as in Example 18 except that the thickness of the thin metal wire was 7 μm, 5 μm, 3 μm, 1 μm, 0.5 μm, and 0.1 μm.
(Reference Examples 3 and 4)
Conductive sheets according to Reference Examples 1 and 2 were produced in the same manner as in Example 18 except that the thickness of the thin metal wire was 10 μm and 0.05 μm.

(Example 25)
The conductive sheet according to Example 25 was obtained in the same manner as in Example 1 except that the line width of the fine metal wire was 10 μm, the cross-sectional shape (formed angle θ) of the fine metal wire was 70 °, and the thickness of the fine metal wire was 9 μm. Produced.
(Examples 26 to 31)
Conductive sheets according to Examples 26 to 31 were produced in the same manner as in Example 25 except that the thickness of the thin metal wire was 7 μm, 5 μm, 3 μm, 1 μm, 0.5 μm, and 0.1 μm.
(Reference Examples 5 and 6)
Conductive sheets according to Reference Examples 5 and 6 were produced in the same manner as in Example 25 except that the thickness of the thin metal wire was 10 μm and 0.05 μm.

(Example 32)
The conductive sheet according to Example 32 was obtained in the same manner as in Example 1 except that the line width of the fine metal wire was 10 μm, the cross-sectional shape (the formed angle θ) of the fine metal wire was 60 °, and the thickness of the fine metal wire was 9 μm. Produced.
(Examples 33 to 38)
Conductive sheets according to Examples 33 to 38 were produced in the same manner as in Example 32 except that the thickness of the thin metal wire was 7 μm, 5 μm, 3 μm, 1 μm, 0.5 μm, and 0.1 μm.
(Reference Examples 7 and 8)
Conductive sheets according to Reference Examples 7 and 8 were produced in the same manner as in Example 32 except that the thickness of the thin metal wire was 10 μm and 0.05 μm.

(Example 39)
The conductive sheet according to Example 39 was manufactured in the same manner as in Example 1 except that the line width of the fine metal wire was 10 μm, the cross-sectional shape (the angle θ formed) was 50 °, and the thickness of the fine metal wire was 9 μm. Produced.
(Examples 40 to 45)
Conductive sheets according to Examples 40 to 45 were produced in the same manner as in Example 32 except that the thickness of the thin metal wire was 7 μm, 5 μm, 3 μm, 1 μm, 0.5 μm, and 0.1 μm.
(Reference Examples 9 and 10)
Conductive sheets according to Reference Examples 9 and 10 were produced in the same manner as in Example 39 except that the thickness of the thin metal wire was 10 μm and 0.05 μm.

(Reference Example 11)
The conductive sheet according to Reference Example 11 was prepared in the same manner as in Example 1 except that the line width of the fine metal wire was 10 μm, the cross-sectional shape (formed angle θ) of the fine metal wire was 45 °, and the thickness of the fine metal wire was 10 μm. Produced.
(Reference Examples 12 to 19)
The conductive sheets according to Reference Examples 12 to 19 were manufactured in the same manner as Reference Example 11 except that the thickness of the fine metal wires was 9 μm, 7 μm, 5 μm, 3 μm, 1 μm, 0.5 μm, 0.1 μm, and 0.05 μm. Produced.

(Peel adhesion)
After being left for 1 hour at a temperature of 23 ° C. and 50% RH, the measurement was performed by pulling in the direction of 180 ° at a speed of 300 mm / min at a temperature of 23 ° C. and 50% RH.
(Surface resistance measurement)
In order to confirm the quality of the detection accuracy, the surface resistivity of the conductive sheet is the average value of values measured at any 10 points with a Lillestar GP (model number MCP-T610) series 4-probe probe (ASP) manufactured by Dia Instruments. is there.
(Conductivity)
The surface resistance of the conductive sheet before adhering the adhesive sheet to the entire surface including the conductive portion of the conductive sheet is 50 ohm / sq. In the following cases, “◎” was determined, and 50 ohm / sq. Exceeding 100 ohm / sq. In the following cases, it was determined as “◯” and 100 ohm / sq. When it exceeded, it was determined as “×”.
(Reworkability)
Compare the surface resistance of the conductive sheet before adhering the adhesive sheet to the entire surface including the conductive portion of the conductive sheet and the surface resistance after peeling the adhesive sheet after adhering the adhesive sheet. If the difference is less than 1%, the conductivity is judged as “◎”, and if it is 1% or more and less than 3%, the conductivity is judged as “good”, and if it is 3% or more, “x” is judged. did.
The results are shown in Tables 5-7.

From Tables 5 to 7, all of Reference Examples 1 to 19 were not good in reworkability. On the other hand, all of Examples 1 to 45 have good reworkability. In particular, Examples 15 to 17, 21 to 24, 27 to 39, and 41 to 44 have a difference in surface resistance of less than 1%, and are metal. It can be seen that the thin wires are hardly peeled off.
From this, the peel adhesive strength with the adhesive in the conductive part is preferably 0.1 N / 10 mm or more and 5 N / 10 mm or less, the lower limit is 0.3 N / 10 mm or more, preferably 0.5 N / 10 mm or more, and the upper limit. It is understood that is preferably 3 N / 10 mm or less. Moreover, it is found that the thickness of the fine metal wire is preferably 9 μm or less, more preferably 0.1 μm or more and 5 μm or less, and further preferably 0.1 μm or more and 3 μm or less.
Note that the conductive sheet and the touch panel according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Conductive sheet 12 ... Transparent base 12a ... One main surface 12b ... Other main surface 13A ... 1st electroconductive part 13B ... 2nd electroconductive part 14A ... 1st large lattice 14B ... 2nd large lattice 15 ... Metal fine wire 15a ... Side wall 16A ... 1st connection part 16B ... 2nd connection part 18 ... Small lattice 22A ... 1st conductive pattern 22B ... 2nd conductive pattern 100 ... Touch panel 108 ... Display apparatus 110 ... Display panel 120 ... Transparent adhesive 120A ... 1st transparent adhesive 120B ... 2nd transparent adhesive

Claims (22)

In a conductive sheet having a base and a conductive portion formed on one main surface of the base, and at least the conductive portion is bonded to another object via an adhesive,
The conductive portion has a network-like structure portion made of fine metal wires,
The angle formed between the main surface of the substrate and the side wall of the fine metal wire is an acute angle,
A conductive sheet having a peel adhesive strength with the adhesive in the conductive portion of 0.1 N / 10 mm or more and 5 N / 10 mm or less. The conductive sheet according to claim 1,
The conductive sheet is characterized in that the metal thin wire has a substantially trapezoidal cross section. The conductive sheet according to claim 1,
The conductive sheet is characterized in that the angle formed is not less than 50 ° and less than 90 °. The conductive sheet according to claim 1,
The conductive sheet having a peel adhesive strength with the adhesive in the conductive part is 0.3 N / 10 mm or more. The conductive sheet according to claim 1,
The conductive sheet is characterized in that a thickness of the fine metal wire is 9 μm or less. The conductive sheet according to claim 1,
When the reflection chromaticity of the conductive part measured from one main surface side of the base is b1 *, and the reflection chromaticity of the conductive part measured from the other main surface side of the base is b2 *,
| B1 * -b2 * | ≦ 2.0
A conductive sheet characterized by the above. The conductive sheet according to claim 6,
A conductive sheet having a thickness of the substrate of 75 μm or more and 200 μm or less. The conductive sheet according to claim 1, wherein the total light transmittance is 85% or more, and the surface resistance of the conductive portion is 100 ohm / sq. A conductive sheet comprising: The conductive sheet according to claim 1,
R2 / R1 <3 is satisfied, where R1 is a surface resistance of the conductive part before the following bending test and R2 is a surface resistance of the conductive part after the bending test is performed. Conductive sheet.
[In the bending test, the conductive sheet is hooked on a roller having a diameter of 4 mm, which is rotatably attached to the base, and one end of the conductive sheet is pulled with a tension of 28.6 kg per 1 m width. The step of bending the conductive sheet by rotating and the step of bending the conductive sheet by rotating the roller while pulling the other end of the conductive sheet with a tension of 28.6 kg per 1 m width are repeated. The conductive sheet is bent 100 times. ] The conductive sheet according to claim 1,
R2 / R1 <1.5 is satisfied, where R1 is the surface resistance of the conductive portion before the following bending test and R2 is the surface resistance of the conductive portion after the bending test is performed. A conductive sheet.
[In the bending test, the conductive sheet is hooked on a roller having a diameter of 4 mm, which is rotatably attached to the base, and one end of the conductive sheet is pulled with a tension of 28.6 kg per 1 m width. The step of bending the conductive sheet by rotating and the step of bending the conductive sheet by rotating the roller while pulling the other end of the conductive sheet with a tension of 28.6 kg per 1 m width are repeated. The conductive sheet is bent 100 times. ] A base, a first conductive portion formed on one main surface of the base, and a second conductive portion formed on the other main surface of the base, wherein the first conductive portion and the second conductive portion Among them, at least one of the conductive parts is a conductive sheet that is bonded to another object via an adhesive,
Each of the first conductive portion and the second conductive portion has a network-like structure portion made of fine metal wires,
The angle formed by one main surface of the base and the side wall of the thin metal wire in the first conductive portion and the angle formed by the other main surface of the base and the side wall of the thin metal wire in the second conductive portion are both acute angles. ,
A conductive sheet having a peel adhesive strength with the adhesive in the conductive portion of 0.1 N / 10 mm or more and 5 N / 10 mm or less. The conductive sheet according to claim 11,
The first conductive part is bonded to the first object via the first adhesive, the second conductive part is bonded to the second object via the second adhesive,
The peel adhesive force with the first adhesive in the first conductive part and the peel adhesive force with the second adhesive in the second conductive part are 0.1 N / 10 mm or more and 5 N / 10 mm or less, respectively. A characteristic conductive sheet. The conductive sheet according to claim 11 or 12,
The conductive sheet is characterized in that the metal thin wire has a substantially trapezoidal cross section. The conductive sheet according to claim 11 or 12,
The conductive sheet is characterized in that the angle formed is not less than 50 ° and less than 90 °. The conductive sheet according to claim 11,
The conductive sheet having a peel adhesive strength with the adhesive in the conductive part is 0.3 N / 10 mm or more. The conductive sheet according to claim 11,
The conductive sheet is characterized in that a thickness of the fine metal wire is 9 μm or less. The conductive sheet according to claim 11,
When the reflection chromaticity of the first conductive part measured from one main surface side of the base is b1 *, and the reflection chromaticity of the second conductive part measured from one main surface side of the base is b2 *,
| B1 * -b2 * | ≦ 2.0
A conductive sheet characterized by the above. The conductive sheet according to claim 17,
A conductive sheet having a thickness of the substrate of 75 μm or more and 200 μm or less. The conductive sheet according to claim 11, wherein the total light transmittance is 85% or more, and the surface resistance of the first conductive portion and the second conductive portion is 100 ohm / sq. A conductive sheet comprising: The conductive sheet according to claim 11,
R1a and R1b are the surface resistances of the first conductive part and the second conductive part before performing the following bending test, and the respective surfaces of the first conductive part and the second conductive part after performing the following bending test. A conductive sheet characterized by satisfying R2a / R1a <3 and R2b / R1b <3 when the resistance is R2a and R2b.
[In the bending test, the conductive sheet is hooked on a roller having a diameter of 4 mm, which is rotatably attached to the base, and one end of the conductive sheet is pulled with a tension of 28.6 kg per 1 m width. The step of bending the conductive sheet by rotating and the step of bending the conductive sheet by rotating the roller while pulling the other end of the conductive sheet with a tension of 28.6 kg per 1 m width are repeated. The conductive sheet is bent 100 times. ] The conductive sheet according to claim 11,
R1a and R1b are the surface resistances of the first conductive part and the second conductive part before performing the following bending test, and the respective surfaces of the first conductive part and the second conductive part after performing the following bending test. A conductive sheet characterized by satisfying R2a / R1a <1.5 and R2b / R1b <1.5 when the resistance is R2a and R2b.
[In the bending test, the conductive sheet is hooked on a roller having a diameter of 4 mm, which is rotatably attached to the base, and one end of the conductive sheet is pulled with a tension of 28.6 kg per 1 m width. The step of bending the conductive sheet by rotating and the step of bending the conductive sheet by rotating the roller while pulling the other end of the conductive sheet with a tension of 28.6 kg per 1 m width are repeated. The conductive sheet is bent 100 times. ] In a touch panel having a conductive sheet bonded via an adhesive on the display panel of the display device,
The conductive sheet is
A substrate;
A conductive portion formed on one main surface of the base body,
The conductive portion has a network-like structure portion made of fine metal wires,
The angle formed between the main surface of the substrate and the side wall of the fine metal wire is an acute angle,
A peel adhesive strength with the adhesive in the conductive part is 0.1 N / 10 mm or more and 5 N / 10 mm or less.

Images