JP2012185384A - Imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that imaging elements receive a small amount of light due to pin holes shielding much of the light.SOLUTION: An imaging apparatus includes: a semiconductor substrate; multiple imaging elements formed on the semiconductor substrate; a light emitting unit which is formed on the semiconductor substrate so as to be adjacent to the imaging elements; multiple optical elements which are formed on optical paths of the imaging elements, and which direct the light emitted from the light emitting unit to be away from the light emitting unit in a direction parallel to the optical paths of the imaging elements; and multiple objective condenser components which are provided on the optical paths between the optical elements and a subject, and which condense the light from the optical elements to the subject.

Description

  The present invention relates to an imaging apparatus.

Patent Literature 1 discloses a microscope including a light source, an image sensor, and a pinhole disposed between the image sensor and a subject.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Translation of PCT Publication No. 2008-501999

  However, the above-described apparatus has a problem that a small amount of light reaches the image sensor because much light is blocked by the pinhole.

  In order to solve the above problems, a first aspect of the present invention is formed on a semiconductor substrate, a plurality of image sensors formed on the semiconductor substrate, and adjacent to the plurality of image sensors. A plurality of optical elements that are formed on the optical paths of the plurality of imaging elements and direct light from the light emitting parts in a direction parallel to and spaced from the optical paths of the plurality of imaging elements; An imaging apparatus including a plurality of objective condensing members provided on the optical path between the element and the subject and condensing light from the optical element onto the subject.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a whole perspective view of an imaging device. It is a whole perspective view of an image pick-up part. It is a disassembled perspective view of an imaging part. FIG. 3 is a partially enlarged view of FIG. 2. It is a longitudinal cross-sectional view of an imaging part. It is a schematic plan view of an imaging part. It is a block diagram explaining the control system of an imaging device. It is a figure explaining the motion of the beam spot in high image quality imaging mode. It is a flowchart in the case of generating an image without ranging in the XY directions. It is a whole perspective view of an image pick-up part by an embodiment which has arranged an image sensor two-dimensionally. It is a longitudinal cross-sectional view of an imaging part. It is a schematic plan view of an imaging part. It is a longitudinal cross-sectional view of the imaging part by embodiment which provided the divergence suppression member between the light emitting element and the optical element. It is a longitudinal cross-sectional view of the imaging part by embodiment which reduced the number of light emitting elements. It is a top view of the image pick-up part of an embodiment which changed the pitch of an image sensor. It is a fragmentary perspective view of the image pick-up part by an embodiment which provided the light-shielding wall between image pick-up elements. It is a fragmentary perspective view of the image pick-up part by an embodiment with which a light emitting element supplies light to a plurality of image pick-up elements.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is an overall perspective view of the imaging apparatus. XYZ indicated by an arrow in FIG. 1 is an XYZ direction of the imaging apparatus. Further, the + Z direction is the upward direction, and the −Z direction is the downward direction. As shown in FIG. 1, the imaging apparatus 10 according to the present embodiment includes a base 12, an imaging unit 14, a driving unit 16, a subject holding unit 18, an image output unit 20, and a control unit 22. .

  The base 12 is formed in a trapezoidal shape. A driving unit 16 and a subject holding unit 18 are placed on the upper surface of the base 12. As a result, the base 12 directly or indirectly supports the imaging unit 14, the driving unit 16, and the subject holding unit 18.

  The drive unit 16 moves the imaging unit 14 in the XYZ directions while holding both ends of the imaging unit 14. The drive unit 16 is controlled by a drive signal input from the control unit 22.

  The subject holding unit 18 includes a subject case 24 and four leg portions 26. The subject case 24 is made of a material that can transmit imaging light. The subject case 24 is formed in a rectangular parallelepiped shape parallel to the XY plane. The subject case 24 has a hollow subject region 30 on which the subject 28 is placed. The subject 28 may include a fluorescent material. The four leg portions 26 are disposed between the bottom surface of the four corners of the subject case 24 and the top surface of the base 12. Accordingly, the four legs 26 support the subject case 24 above the imaging unit 14.

  The image output unit 20 displays the image generated by the control unit 22. An example of the image output unit 20 is a liquid crystal display. The control unit 22 governs overall control of the imaging apparatus 10.

  FIG. 2 is an overall perspective view of the imaging unit. FIG. 3 is an exploded perspective view of the imaging unit. FIG. 4 is a partially enlarged view of FIG. FIG. 5 is a longitudinal sectional view of the imaging unit.

  As shown in FIGS. 2 to 5, the imaging unit 14 is arranged in the −Z direction of the subject region 30. The imaging unit 14 is supported by the drive unit 16 so as to be movable in the XYZ directions. The imaging unit 14 includes a semiconductor substrate 32, a light emitting element array 34 that is an example of a light emitting unit, an imaging element array 36, a pinhole array 38, an imaging condensing member 40, an adhesive 42, and an adhesive 44. , An optical element 46, a pedestal 48, and an objective condensing member 50.

  The semiconductor substrate 32 includes a semiconductor material such as silicon (Si), gallium nitride (GaN), and gallium arsenide (GaAs). A light emitting element array 34 and an imaging element array 36 are formed on the semiconductor substrate 32, and the semiconductor substrate 32 supports the light emitting element array 34 and the imaging element array 36.

  The light emitting element array 34 is provided at the end portion on the −Y side of the semiconductor substrate 32. The light emitting element array 34 has a plurality of light emitting elements 52 formed on the + Z surface of the semiconductor substrate 32 by a semiconductor manufacturing process. An example of the number of the light emitting elements 52 is several to thousands, but is not limited. The light emitting element 52 has a width of about 10 μm in the X direction. The width of the light emitting element 52 may be changed as appropriate. The light emitting element 52 is formed in a rectangular shape in plan view. The plurality of light emitting elements 52 are arranged on a straight line along the X direction. An example of the light emitting element 52 is a laser diode. As shown in FIG. 5, the light emitting element 52 includes a light emitting layer 54, a pair of cladding layers 56, and a cladding layer 56. The light emitting layer 54 emits light by the charge injected into each light emitting element 52. The pair of clad layers 56 and 56 are formed on the + Z side surface and the −Z side surface of the light emitting layer 54. The pair of clad layers 56 and 56 confine light by suppressing light emitted from the light emitting layer 54 from being guided in the Z direction. Both surfaces on the Y side of the light emitting layer 54 have a mirror structure. The surface on the + Y side of the light emitting layer 54 is configured to have a smaller reflectance than the surface on the -Y side. As a result, the light emitting element 52 confines the light emitted from the light emitting layer 54 by the clad layers 56 and 56 and emits light that is laser light in the + Y direction.

  As shown in FIGS. 2 to 5, the image sensor array 36 is provided at the + Y side end of the semiconductor substrate 32. The imaging element array 36 is arranged in the light emitting direction of the light emitting elements 52. The imaging element array 36 has a plurality of imaging elements 58 formed on the + Z surface of the semiconductor substrate 32 by a semiconductor manufacturing process. As a result, the light emitting element 52 and the imaging element 58 are formed on the same surface of the semiconductor substrate 32. Each imaging element 58 is disposed adjacent to the + Y side of each light emitting element 52 of the light emitting element array 34. That is, the image sensor 58 and the light emitting elements 52 have a one-to-one relationship and are arranged in the same number. Thereby, each light emitting element 52 irradiates one image sensor 58 with light. An example of the imaging element array 36 is a CCD (= Charge Coupled Device) or a CMOS (= Complementary Metal Oxide Semiconductor) image sensor. The image sensor 58 is those pixels. The imaging device 58 photoelectrically converts the received light and outputs an imaging signal that is an electrical signal. One side of the image sensor 58 is formed in a square shape of 10 μm, for example, in plan view. A light receiving surface 60 for receiving light is formed on the + Z surface of the image sensor 58. The image sensor 58 receives the light reflected by the subject 28 by the light receiving surface 60. Then, the image sensor 58 converts it into an image signal corresponding to the amount of light received on the light receiving surface 60 and outputs it.

  The pinhole array 38 is formed on the + Z side surface of the image sensor array 36, that is, on the subject region 30 side. The pinhole array 38 includes a light shielding portion 64 in which a plurality of pinholes 62 that are examples of openings are formed. The light shielding portion 64 is directly and integrally formed on the + Z side surface of the image sensor 58. As a result, the light shielding portion 64 is provided between the imaging element 58 and the optical element 46. The light shielding unit 64 includes a material capable of shielding light. The light shielding portion 64 is formed in a rectangular shape having substantially the same shape as the imaging element array 36 in plan view. The light shielding part 64 may be constituted by a plate-like material having a certain thickness, or may be constituted by a light shielding film formed on one surface of a transparent plate-like member. For example, the light shielding portion 64 may be configured by a metal thin film formed on the + Z plane of a silicon oxide film formed on the + Z plane of the image sensor 58 by a spin coating method or the like. In this case, the pinhole 62 can be formed by removing the metal thin film in a predetermined region by photolithography, etching, or the like.

  The plurality of pinholes 62 are arranged along the center line of the image sensor array 36 extending in the X direction. The pitch of the pinholes 62 is the same as the pitch of the image sensor 58. As a result, one pinhole 62 corresponds to any one image sensor 58. Each pinhole 62 is formed in a circular shape in plan view. The pinhole 62 is smaller than the light receiving surface 60 of the image sensor 58. For example, when the imaging element 58 has a square shape with a side of about 10 μm, the diameter of the pinhole 62 is about 1 μm. The pinhole 62 penetrates the light shielding portion 64 in the Z direction. The pinhole 62 is configured to transmit light. The pinhole 62 may be a space or may be embedded with a material that can transmit light. The pinhole 62 allows light from a focused focal plane to pass through. The light shielding unit 64 shields light from a defocused position that is a part of the light reflected by the subject 28.

  The imaging light collecting member 40 is disposed on the + Z side of the pinhole array 38 with an adhesive 42 interposed therebetween. The imaging light collecting member 40 is disposed on the −Z side of the optical element 46 with the adhesive 42 interposed therebetween. As a result, the imaging light collecting member 40 is provided on the optical path between the pinhole array 38 and the imaging element 58 and the optical element 46. The imaging light collecting member 40 includes an imaging base member 66, a plurality of pairs of lower imaging convex portions 68 and upper imaging convex portions 70.

  The imaging base member 66 is formed in a plate shape parallel to the XY plane. The imaging base member 66 is formed in a rectangular shape that is substantially the same shape as the + Z plane of the imaging element array 36. The imaging base member 66 is made of glass that can transmit light. The imaging base member 66 may be made of a resin that can transmit light.

  The lower imaging convex portion 68 is formed in a partial spherical shape protruding downward. The lower imaging convex portion 68 is provided on the lower surface of the imaging base member 66. The plurality of lower imaging convex portions 68 are arranged along the X direction. The pitch of the lower imaging convex portions 68 is the same as the pitch of the imaging element 58 and the pinhole 62. The lower imaging convex portion 68 is embedded in the adhesive 42. Thereby, the imaging light collecting member 40 including the lower imaging convex portion 68 is fixed to the upper surface of the pinhole array 38 via the adhesive 42.

  The upper imaging convex portion 70 is formed in a partially spherical shape protruding upward. The upper imaging convex portion 70 is provided on the upper surface of the imaging base member 66. The upper imaging convex portion 70 is disposed above the lower imaging convex portion 68. Thereby, the pitch of the upper imaging convex portions 70 becomes equal to the pitch of the imaging element 58 and the pinhole 62. As a result, the pair of lower imaging convex portions 68 and upper imaging convex portions 70 correspond to the imaging elements 58 and the pinholes 62 on a one-to-one basis. The lower imaging convex portion 68 and the upper imaging convex portion 70 are arranged so that their optical axes coincide with each other. The lower imaging convex portion 68 and the upper imaging convex portion 70 constitute a convex lens capable of condensing light. As a result, the lower imaging convex portion 68 and the upper imaging convex portion 70 transmit the light reflected by the subject 28 and transmitted through the optical element 46 in the −Z direction to the pinhole 62 and the imaging element. Condensed to 58. The pinhole 62 is arranged at the focal point of the lower imaging convex portion 68 and the upper imaging convex portion 70. The upper imaging projection 70 is embedded in the adhesive 44. Thereby, the imaging light collecting member 40 including the upper imaging convex portion 70 is fixed to the lower surface of the optical element 46 via the adhesive 44.

  The optical element 46 is provided on the surface on the + Z side of the pinhole array 38 and the imaging light collecting member 40, that is, the surface on the subject region 30 side. The optical element 46 has a triangular prism-shaped element body 72 extending in the X direction. A cross section of the element body 72 parallel to the YZ plane is formed in a right triangle shape. Of the vertices of the cross section of the element main body 72, the right vertices are arranged at the + Y side end of the pinhole array 38. One surface of the element main body 72 is inclined from the XY plane. The inclined surface of the element main body 72 faces the light emitting element array 34. A half mirror 74 is formed on the inclined surface of the element main body 72. The half mirror 74 is inclined 45 ° from the XY plane. The half mirror 74 is made of a metal thin film formed to a thickness that reflects part of the light and transmits the remaining light. As an example, an example of the reflectance of the half mirror 74 with respect to the emission wavelength of the light emitting element 52 is 50%, and an example of the transmittance of the half mirror 74 is 50%. The half mirror 74 reflects a part of the light emitted from the light emitting element 52 in the + Z direction where the subject region 30 is arranged. As a result, the optical element 46 directs the light emitted from the light emitting element 52 in a direction that is parallel to the optical paths of the plurality of imaging elements 58 and is spaced apart. The half mirror 74 transmits part of the light reflected by the subject 28. As a result, the light reflected by the subject 28 reaches the pinhole array 38 via the imaging light collecting member 40. A part of the light reaching the pinhole array 38 passes through the pinhole 62 and is received by the image sensor 58. As a result, the optical element 46 is formed on the optical path of the plurality of imaging elements 58.

  The pedestal 48 is disposed on the + Z side of the optical element 46. The pedestal 48 fixes the objective condensing member 50 so as not to move relative to the optical element 46. The pedestal 48 is formed in a substantially triangular prism shape. A cross section of the pedestal 48 parallel to the YZ plane is formed in a right triangle shape. The inclined surface of the pedestal 48 is bonded to the half mirror 74 of the optical element 46. The pedestal 48 and the optical element 46 bonded together have a substantially rectangular parallelepiped shape. Further, the surface on the + Z side of the pedestal 48 is substantially horizontal. The pedestal 48 is made of a resin that can transmit light. Thereby, the pedestal 48 transmits the light reflected by the optical element 46 to the objective condensing member 50. The pedestal 48 transmits the light reflected by the subject 28 and transmitted through the objective condensing member 50 to the optical element 46. The pedestal 48 is made of a resin that can be cured by light irradiation or heat. Thereby, the base 48 is placed on the optical element 46 in a soft state. Thereafter, the pedestal 48 is cured by light, heat, or the like in a state where the objective condensing member 50 is placed on the upper surface of the pedestal 48. Thereby, the pedestal 48 fixes the objective condensing member 50 to the optical element 46.

  The objective condensing member 50 is disposed on the + Z side of the optical element 46 via the pedestal 48. The objective condensing member 50 is disposed on the −Z side of the subject region 30. As a result, the objective condensing member 50 is provided on the optical path between the optical element 46 and the subject region 30. The objective condensing member 50 includes an objective base member 76, and a plurality of pairs of lower objective convex portions 78 and upper objective convex portions 80.

  The objective base member 76 is formed in a plate shape parallel to the XY plane. The objective base member 76 is formed in a rectangular shape that is substantially the same shape as the + Z plane of the imaging element array 36. The objective base member 76 is made of glass that can transmit light. The objective base member 76 may be made of a resin that can transmit light.

  The lower objective convex portion 78 is formed in a partial spherical shape protruding downward. The lower objective convex part 78 is provided on the lower surface of the objective base member 76. The plurality of lower objective convex portions 78 are arranged along the X direction. The pitch of the lower objective convex part 78 is the same as the pitch of the image sensor 58 and the pinhole 62. The lower objective convex part 78 is embedded in the upper part of the base 48. Thereby, the objective condensing member 50 including the lower objective convex part 78 is fixed to the pedestal 48.

  The upper objective convex portion 80 is formed in a partially spherical shape protruding upward. The upper objective convex portion 80 is provided on the upper surface of the objective base member 76. The upper objective convex portion 80 is disposed above the lower objective convex portion 78. Thereby, the pitch of the upper objective convex part 80 becomes equal to the pitch of the image sensor 58 and the pinhole 62. As a result, the pair of lower objective convex portions 78 and the upper objective convex portions 80 correspond to the imaging elements 58 and the pinholes 62 on a one-to-one basis. The lower objective convex portion 78 and the upper objective convex portion 80 are arranged so that their optical axes coincide with each other. The lower objective convex part 78 and the upper objective convex part 80 constitute a convex lens that can collect light. As a result, the lower objective convex portion 78 and the upper objective convex portion 80 condense light from the optical element 46 reflected by the half mirror 74 and traveling in the + Z direction onto the subject 28 to the resolution resolution limit. Further, the lower objective convex portion 78 and the upper objective convex portion 80 convert the light reflected by the subject 28 and traveling in the −Z direction into parallel light. Here, since the lower objective convex part 78 and the upper objective convex part 80 of each group are disposed on the objective base member 76 parallel to the XY plane, the light is condensed by the lower objective convex part 78 and the upper objective convex part 80. The light beam spot is located on a plane parallel to the XY plane. The surface on which this beam spot is formed becomes the focal plane. The optical axes of the lower objective convex part 78 and the upper objective convex part 80 of each pair are provided so as to coincide with the optical axes of the corresponding lower imaging convex part 68 and upper imaging convex part 70 of the imaging condensing member 40. It has been. The subject 28 and the pinhole 62 are in an imaging relationship by the lower objective convex portion 78 and the upper objective convex portion 80, and the lower imaging convex portion 68 and the upper imaging convex portion 70.

  Here, the aberration of the convex lens constituted by the lower objective convex portion 78 and the upper objective convex portion 80 of the objective condensing member 50 is caused by the lower imaging convex portion 68 and the upper imaging convex portion 70 of the imaging condensing member 40. It is smaller than the aberration of the constructed convex lens. The aberration of the convex lens may be set by an aspherical surface or a spherical surface, surface roughness, or the like.

  FIG. 6 is a schematic plan view of the imaging unit and a diagram illustrating a drive system. As shown in FIG. 6, the driving unit 16 includes an X direction ranging unit 82, an X direction driving unit 84, a Y direction ranging unit 86, a Y direction driving unit 88, and a Z direction ranging unit 90. A Z-direction drive unit 92. The X-direction drive unit 84, the Y-direction drive unit 88, and the Z-direction drive unit 92 each have a small motor such as a voice coil motor or a piezoelectric element as a driving force generation source.

  The X-direction distance measuring unit 82 measures the distance between itself and the imaging unit 14 and the subject 28 in the X direction. The X-direction distance measuring unit 82 outputs the measured distance as distance information. The X direction driving unit 84 moves the imaging unit 14 along the X direction.

  The Y-direction distance measuring unit 86 measures the distance between itself and the imaging unit 14 and the subject 28 in the Y direction. The Y-direction distance measuring unit 86 outputs the measured distance as distance information. The Y direction driving unit 88 moves the imaging unit 14 along the Y direction. The X-direction drive unit 84 and the Y-direction drive unit 88 can cause the imaging unit 14 to scan in the XY plane and capture the entire image of the subject 28.

  The Z-direction distance measuring unit 90 measures the distance between itself and the imaging unit 14 and the subject 28 in the Z direction. The Z-direction distance measuring unit 90 outputs the measured distance as distance information. The Z direction drive unit 92 moves the imaging unit 14 along the Z direction. As a result, the Z-direction drive unit 92 focuses the beam spot 94 collected by the convex lens constituted by the lower objective convex part 78 and the upper objective convex part 80 on the objective condenser member 50 at the position of the subject 28. Can do. Further, the subject 28 at a different position in the Z direction can be imaged by moving the imaging unit 14 in the Z direction by the Z direction driving unit 92. As a result, a stereoscopic image of the subject 28 can be captured and generated.

  FIG. 7 is a block diagram illustrating a control system of the imaging apparatus. A control system of the imaging apparatus 10 will be described. The control unit 22 includes a computer and the like.

  As shown in FIG. 7, the control unit 22 includes each light emitting element 52, each imaging element 58, the image output unit 20, an X direction driving unit 84, a Y direction driving unit 88, and a Z direction driving unit of the driving unit 16. 92 is connected to be able to input and output signals.

  An imaging signal output from the imaging element 58 is input to the control unit 22. Thereby, the control unit 22 generates an image of the subject 28 based on the input imaging signal. The control unit 22 outputs the generated image signal to the image output unit 20 based on the imaging signal. The image output unit 20 displays an image based on the image signal. The controller 22 outputs an on / off signal to the light emitting element 52. Thereby, ON / OFF of the light emitting element 52 is switched.

  The X-direction distance measuring unit 82, the Y-direction distance measuring unit 86, and the Z-direction distance measuring unit 90 measure the distances of the subject 28 and the imaging unit 14 in the X direction, Y direction, and Z direction from their own positions, The distance is output to the control unit 22 as distance measurement information. The control unit 22 is based on the X direction, Y direction, and Z direction distance measurement information input from the X direction distance measurement unit 82, the Y direction distance measurement unit 86, and the Z direction distance measurement unit 90. And the relative position of the subject 28 are calculated. Based on the calculated relative position, the control unit 22 individually outputs drive signals to the X-direction drive unit 84, the Y-direction drive unit 88, and the Z-direction drive unit 92 of the drive unit 16, respectively. 14 is moved in the X, Y, and Z directions. Accordingly, the imaging unit 14 moves in the XY direction and scans the subject 28 in the XY plane. In addition, the imaging unit 14 moves in the Z direction to focus the objective condensing member 50 on a specific area of the subject 28.

  Next, a method for manufacturing the imaging unit 14 will be described. First, a light emitting element array 34 including a plurality of light emitting elements 52 is formed on one surface of a wafer-like semiconductor substrate 32 by a semiconductor manufacturing process such as a MOCVD (Metal Organic Chemical Vapor Deposition) method or an MBE (Molecular Beam Epitaxy) method. To do. Next, the imaging element array 36 including the plurality of imaging elements 58 is formed on one surface of the semiconductor substrate 32 so as to be separated from the light emitting element array 34 by a semiconductor manufacturing process such as MOCVD method or MBE method. Note that the light emitting element array 34 may be formed after the imaging element array 36 is formed first.

  Thereafter, a silicon oxide film is formed on the upper surface of the image sensor 58 of the image sensor array 36. Next, a resist film is formed on the upper surface of the silicon oxide film by photolithography. Thereafter, after depositing a metal thin film, the metal thin film on the resist film is removed together with the resist film. As a result, a pinhole array 38 having a light shielding portion 64 in which a plurality of pinholes 62 are formed is completed on the imaging element array 36.

  Next, the imaging light collecting member 40 is installed on the upper surface of the pinhole array 38 via the adhesive 42. In the manufacturing method of the imaging light collecting member 40, first, molding dies are arranged on the upper and lower surfaces of the imaging base member 66 made of glass. Thereafter, the resin is injected into the mold, and the resin is cured by light irradiation such as UV or heating. Thereby, the lower imaging convex portion 68 and the upper imaging convex portion 70 are formed on the upper and lower surfaces of the imaging base member 66, and the imaging condensing member 40 is completed.

  Next, the optical element 46 manufactured by another process is installed on the upper surface of the imaging light collecting member 40 via the adhesive 44. Thereafter, the objective condensing member 50 is placed on the upper surface of the optical element 46 so that the lower objective convex portion 78 is embedded in the pedestal 48 via the pedestal 48 made of a soft resin. The objective condensing member 50 is manufactured by the same process as the imaging condensing member 40 described above. Next, the pedestal 48 is cured by light irradiation or heating. Thereby, the imaging light collecting member 40 is fixed. As a result, the imaging unit 14 is completed.

  Next, an imaging operation and an image generation operation of the above-described imaging device 10 will be described. The imaging operation will be described separately for the normal imaging mode and the high image quality imaging mode.

  In the normal imaging mode, the control unit 22 outputs an ON signal to each light emitting element 52 of the light emitting element array 34. Thereby, the light emitting element 52 irradiates light that is laser light. The irradiated light travels in the + Y direction and reaches the half mirror 74 of the optical element 46. A part of the light is reflected in the + Z direction by the half mirror 74. The light traveling in the + Z direction is condensed onto the subject 28 placed in the subject region 30 by the objective condensing member 50. Thereafter, the light that reaches the region where the subject 28 does not exist travels in the + Z direction. On the other hand, the light reaching the subject 28 is reflected by the subject 28 in the −Z direction.

  A part of the light traveling in the −Z direction is collected by the objective condensing member 50, then passes through the half mirror 74 of the optical element 46, and travels in the element main body 72 in the −Z direction. . Thereafter, the light exits from the −Z surface of the element main body 72 and enters the imaging light collecting member 40. The light is condensed into the pinhole 62 by the imaging light collecting member 40 and passes through the pinhole 62. Thereafter, the light reaches the light receiving surface 60 of the image sensor 58. The imaging element 58 outputs an imaging signal, which is an electrical signal corresponding to the amount of light received at the light receiving surface 60, to the control unit 22. Next, the control unit 22 controls the X-direction driving unit 84 and the Y-direction driving unit 88 based on the distance measurement information input from the X-direction ranging unit 82 and the Y-direction ranging unit 86, and the imaging unit 14 is moved in the 10 μm Y direction, which is the pitch length of the image sensor 58. Thereafter, by repeating the above-described operation, the image sensor 58 captures an image of the subject 28 at a different position in the Y direction, and outputs an image signal of each region to the control unit 22.

  Next, the control unit 22 synthesizes an image based on the imaging signal input from the imaging element 58 that images the subject 28 in different regions in the Y direction. Next, the control unit 22 outputs the generated image as an image signal to the image output unit 20. The image output unit 20 displays an image of the subject 28 based on the received image signal. The image generation may be executed in parallel with the imaging operation.

  Further, when generating a stereoscopic image of the subject 28, the control unit 22 controls the Z direction driving unit 92 based on the distance measurement information from the Z direction distance measurement unit 90 to move the imaging unit 14 in the Z direction. Move and repeat the above operation. Then, an image of the subject 28 at a different position in the Z direction may be generated and combined to generate a stereoscopic image of the subject 28.

  FIG. 8 is a diagram for explaining the movement of the beam spot in the high image quality imaging mode. In the high image quality imaging mode, the control unit 22 controls the X direction driving unit 84 and the Y direction driving unit 88 based on the distance measurement information input from the X direction ranging unit 82 and the Y direction ranging unit 86. The imaging unit 14 is moved in the X direction and the Y direction by a distance equal to or less than the length of the pitch of the image sensor 58, preferably a distance equal to or less than the diameter of the beam spot 94. And the image pick-up element 58 images the to-be-photographed object 28 in each place, and outputs an image pick-up signal. Thereafter, the image pickup unit 14 is moved by the pitch of the image pickup device 58 and the image pickup is repeated. Thereby, the resolution is improved and a high-quality image is generated. As illustrated in FIG. 8, for example, the control unit 22 controls the X direction driving unit 84 or the Y direction driving unit 88 to move the imaging unit 14 in the X direction or the Y direction by about 3 μm. The pitch of the image sensor 58 is 10 μm, the diameter of the beam spot 94 of the light collected by the imaging light collecting member 40 is 4 μm or more, and the pitch of the image sensor 58 is 10 μm or less. This movement of the imaging unit 14 is repeated. As a result, the beam spot 94 moves by about 3 μm, and moves along the arrows from the position indicated by the solid line in FIG. 8 to each of the eight locations indicated by the dotted line. In addition, it is preferable to move the imaging unit 14 so that the nine beam spots 94 overlap each other. The image sensor 58 images the subject 28 at nine points indicated by solid lines and dotted lines, and outputs an image signal at each position to the control unit 22. The control unit 22 can generate an image having a resolution nine times that of the normal imaging mode by generating an image based on the input imaging signal. Further, the beam spot 94 may be moved 16 or 25 points in the plane of the upper surface of the image sensor 58 to increase the resolution by 16 or 25 times.

  FIG. 9 is a flowchart for generating an image without performing distance measurement in the XY directions. The imaging unit 14 is driven as in the high image quality mode, and an image is generated based on the flowchart of FIG. First, the control unit 22 calculates the relative position of the plurality of images from the position of the subject 28 of each image (S10). Note that the relative positions of a plurality of images may be calculated from shape information such as the contour of the subject 28. Next, the pixel coordinates of each image are applied to the reference grid generated based on the calculated relative position (S12).

  Next, the control unit 22 applies the pixel data input from each image sensor 58 to the nearest reference pixel coordinate which is the closest image (S14). Thereafter, the control unit 22 creates interpolation data for the missing pixel (S16).

  Next, the control part 22 repeats step S10 and after again, when the average instruction | indication which averages the location where several images overlap is input by the user (S18: Yes). On the other hand, when the average instruction of the plurality of images is not input by the user (S18: No), the control unit 22 generates the image data (S20), and then creates and outputs the thinned data (S222). As a result, an image with improved image quality over the image in the high image quality mode is output, and image generation ends. Thereby, the imaging device 10 can generate an image without performing distance measurement in the XY directions. A deconvolution process for reducing image blur may be added between step S18 and step S20.

  As described above, the imaging apparatus 10 is provided with the objective condensing member 50 between the optical element 46 and the subject 28. Thereby, in the imaging device 10, the light reflected by the optical element 46 can be condensed by the objective condensing member 50 and irradiated onto the subject 28. Thereby, the amount of light reaching the image sensor 58 can be increased, so that the image quality of the captured image can be improved. Furthermore, the imaging apparatus 10 is provided with an imaging light collecting member 40 above each pinhole 62. Thereby, the imaging apparatus 10 can condense the light reflected by the subject 28 into the pinhole 62 by the imaging condensing member 40 and increase the light reaching the imaging element 58 more.

  In the imaging device 10, the light emitting elements 52 of the light emitting element array 34 and the imaging elements 58 of the imaging element array 36 are formed on the same surface of the semiconductor substrate 32. As a result, the image sensor 58 can capture an image by light emitted from the light emitting element 52 and reflected by the subject 28, not by light transmitted by the subject 28. As a result, the imaging apparatus 10 can image the subject 28 that does not transmit light.

  In the imaging device 10, a light emitting element 52 and an imaging element 58 are formed on a semiconductor substrate 32. Thereby, the imaging device 10 can reduce the size of the imaging unit 14. In addition, since an assembly process such as alignment between the light emitting element 52 and the imaging element 58 can be omitted, the imaging apparatus 10 can simplify the manufacturing process.

  The imaging device 10 is provided with a light shielding portion 64 in which a pinhole 62 is formed above the imaging element 58. Thereby, the imaging device 10 shields the light reflected by the subject 28 from the position deviated from the focus by the light shielding unit 64 and allows the light reflected by the subject 28 to pass from the focused position. In addition, the object condensing member 50 and the imaging condensing member 40 are in an imaging relationship between the subject 28 and the pinhole 62, and light that is out of focus is shielded by the light shielding portion 64, whereby an image of Fresnel diffraction is displayed. Deterioration can be suppressed.

  FIG. 10 is an overall perspective view of the imaging unit according to the embodiment in which the imaging elements are two-dimensionally arranged. FIG. 11 is a longitudinal sectional view of the imaging unit. FIG. 12 is a schematic plan view of the imaging unit.

  As shown in FIGS. 10 to 12, in the imaging unit 114, a plurality of light emitting element arrays 34, a plurality of imaging element arrays 36, a plurality of optical elements 46, a plurality of imaging condensing members 40, and a plurality of objective condensing members 50. Are arranged in the Y direction on the semiconductor substrate 32.

  Thereby, the light emitting element 52 and the imaging element 58 are two-dimensionally arranged in the X direction and the Y direction. As an example, several to thousands of light emitting elements 52 and imaging elements 58 are arranged in the X direction and the Y direction. In addition, you may change suitably the number arranged. Further, the lower imaging convex portion 68 and the upper imaging convex portion 70 of the imaging condensing member 40 and the lower objective convex portion 78 of the objective condensing member 50 are two-dimensionally arranged. A light shielding member may be provided on the −Y side of the light emitting element array 34 and on the + Y side of the imaging element array 36. Thereby, it can suppress that the light radiate | emitted from the light emitting element 52 and permeate | transmitted the half mirror 74 progresses to the row | line | column of the image pick-up element array 36 adjacent to a Y direction. An example of the light shielding member is a light shielding film formed on the + Y surface of the element main body 72.

  In the present embodiment, the light emitted from each light emitting element 52 travels in the + Y direction and is reflected in the + Z direction by the half mirror 74 of the optical element 46. The light is collected by the objective light collecting member 50 and then reflected by the subject 28. Thereafter, the light passes through the objective condensing member 50 and the optical element 46 and is then condensed by the imaging condensing member 40 into the pinhole 62. The condensed light passes through the pinhole 62 and is received by the image sensor 58. The imaging element 58 outputs an imaging signal corresponding to the received light to the control unit 22. Thereafter, when the plane area of the subject 28 is larger than the plane area of the imaging unit 114, the control unit 22 causes the X-direction ranging unit 82 and the Y-direction ranging unit 86 that are input simultaneously with the imaging signal of the imaging element 58. Based on the distance measurement information, the X direction driving unit 84 and the Y direction driving unit 88 are controlled to move the imaging unit 114 in the X direction or the Y direction, thereby imaging the subject 28 in different regions. Thereby, the control part 22 produces | generates an image.

  In the present embodiment, since the imaging elements 58 of the imaging unit 114 are two-dimensionally arranged, more imaging signals can be output at a time. For this reason, in this embodiment, since the movement of the imaging unit 114 in the XY direction during imaging can be reduced as compared with a monocular microscope, the time required for imaging can be reduced. In the present embodiment, the above-described high image quality mode may be applied to improve the image quality. Thereby, in this embodiment, it is possible to improve the image quality while reducing the imaging time.

  FIG. 13 is a longitudinal sectional view of an imaging unit according to an embodiment in which a divergence suppressing member is provided between the light emitting element and the optical element. As shown in FIG. 13, in the imaging unit 214 according to the present embodiment, the divergence suppressing member 96 is provided on the surface on the −Y side of the optical element 46. Thereby, the divergence suppressing member 96 is provided between the light emitting element 52 and the optical element 46 of the light emitting element array 34.

  The divergence suppression member 96 includes a suppression base material 97 and a collimator lens 98. The suppression base 97 is made of a glass plate. The collimator lens 98 is provided over the + Y side surface and the −Y side surface of the suppression base 97. The collimator lens 98 suppresses the divergence of the light emitted from the light emitting element 52, converts it into parallel light, and advances the light to the half mirror 74 of the optical element 46. Thereby, even when the light emitting element 52 is comprised by the light emitting diode etc., the divergence of light can be suppressed. As a result, in this embodiment, the light reflected by the subject 28 and received by the image sensor 58 can be increased. Note that the divergence suppressing member 96 may be provided with a member capable of suppressing the divergence of the light emitted from the light emitting element 52 instead of the collimator lens 98 that converts the diverging light into parallel light.

  FIG. 14 is a longitudinal sectional view of an imaging unit according to an embodiment in which the number of light emitting elements is reduced. As shown in FIG. 14, in the imaging unit 314 according to the present embodiment, the plurality of imaging elements 58 and the plurality of optical elements 46 are arranged on one light emitting element 52 along the Y direction that is the light emitting direction of the light emitting element 52. Correspondingly arranged. As a result, one light emitting element 52 supplies light to the plurality of optical elements 46. The half mirror 74 of the optical element 46 transmits part of the light traveling in the light emission direction and reflects the rest. Here, as the half mirror 74 of the optical element 46 moves away from the light emitting element 52, the reflectance increases and the transmittance decreases. That is, of the optical elements 46, the reflectance of the half mirror 74 of the optical element 46 closest to the light emitting element 52 is lower than the reflectance of the half mirror 74 of the optical element 46 next closest to the light emitting element 52. As described above, the reflectance of the half mirror 74 of the plurality of optical elements 46 decreases as the distance from the light emitting element 52 increases.

  Here, the light emitted from the light emitting element 52 becomes less likely to reach the optical element 46 as the distance from the light emitting element 52 increases. However, by gradually increasing the reflectance with increasing distance from the light emitting element 52 as described above, the light reflected by the half mirror 74 of the optical element 46 can be averaged regardless of the position in the Y direction. . In this embodiment, since the number of light emitting elements 52 can be reduced, the configuration of the imaging unit 314 can be simplified.

  In the embodiment shown in FIG. 14, the spectral transmittance characteristics of each half mirror 74 may be changed. For example, when the light emitting element 52 is a white light source, the half mirror 74 closest to the light emitting element 52 is set to have a high reflectance of red light, and the next half mirror 74 is set to have a high reflectance of green light. The half mirror 74 farthest from 52 may be set to have a high blue light reflectance.

  FIG. 15 is a plan view of the imaging unit according to the embodiment in which the adjacent interval between the imaging elements is changed. As shown in FIG. 15, in the imaging unit 414 of the present embodiment, the adjacent interval P in the X direction between the adjacent imaging elements 58 and the imaging element 58 is set so that the lower objective convex part 78 and the upper objective convex part of the objective condensing member 50. It is smaller than the diameter D of the beam spot 94 of the light condensed by the portion 80. In the present embodiment, the Y direction is the main scanning direction of the imaging unit 414. Therefore, the adjacent interval of the image sensor 58 in the direction intersecting the main scanning direction is the “adjacent interval P”. In the present embodiment, since the adjacent interval P of the image pickup device 58 is smaller than the diameter D of the beam spot 94, when the image pickup unit 414 is imaged while scanning in the Y direction, the adjacent beam spots 94 overlap. Thereby, a finer image can be generated. In addition, after scanning in the main scanning direction, the imaging unit 414 may be scanned in the X direction which is the sub scanning direction.

  FIG. 16 is a partial perspective view of the imaging unit according to the embodiment in which a light shielding wall is provided between the imaging elements. As shown in FIG. 16, in the imaging unit 514 of the present embodiment, a light shielding wall 99 is provided between the imaging element 58 and the imaging element 58. The light shielding wall 99 is erected on the + Z plane of the semiconductor substrate 32. The light shielding wall 99 is disposed so as to face the side surface on the X side of the objective condensing member 50 from the imaging element 58. The length of the light shielding wall 99 in the Y direction is longer than the length of the image sensor 58 in the Y direction. The height of the light shielding wall 99 is higher than the height from the + Z plane of the semiconductor substrate 32 to the apex of the upper objective convex portion 80 of the objective condensing member 50. Thereby, the light shielding wall 99 can cover the side surface of the objective light collecting member 50 from the imaging element 58. As a result, the light reflected by the subject 28 and received by the image sensor 58 can be reduced from being received by the adjacent image sensor 58.

  FIG. 17 is a partial perspective view of an imaging unit according to an embodiment in which a light emitting element supplies light to a plurality of imaging elements. As shown in FIG. 17, in the imaging unit 614 of the present embodiment, the light emitting unit 634 includes one light emitting element 52 and a diffusing member 653.

  The light emitting element 52 is provided at the + X side end of the semiconductor substrate 32. The diffusion member 653 is provided on the + Z surface of the semiconductor substrate 32. The diffusion member 653 is provided from the −X side side surface of the light emitting element 52 to the −X side end of the semiconductor substrate 32. The diffusing member 653 is disposed at a position separated from the image sensor 58. The + Z plane, the −X plane, and the −Y plane of the diffusing member 653 are configured to reflect light. The diffusion member 653 is made of a material that can diffuse light. Thereby, the diffusing member 653 guides the light incident from the light emitting element 52 in the X direction while diffusing the light. The diffusion member 653 emits light from the + Y plane toward the optical element 46. In this embodiment, since the number of the light emitting elements 52 can be reduced, the manufacturing process can be simplified.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  An embodiment in which the above-described embodiment is partially changed will be described.

  In the embodiment described above, the imaging condensing member 40 is provided, but the imaging condensing member 40 may be omitted. In the embodiment described above, the pinhole array 38 in which the pinhole 62 is formed is provided, but the pinhole array 38 may be omitted.

  In the embodiment described above, the base substrate made of glass is provided on the light collecting member such as the objective light collecting member 50 and the imaging light collecting member 40. However, the base substrate is omitted from each light collecting member, and only the resin is used. You may comprise by. In the embodiment described above, the optical element 46 having the half mirror 74 has been described as an example, but a polarizing beam splitter may be provided in the optical element instead of the half mirror. When the light emitting element 52 is configured by a laser, a beam expander may be provided between the light emitting element 52 and the optical element 46.

  The light emitting element 52 may be configured to be capable of emitting light of different wavelengths, that is, different colors. For example, the light emitting elements 52 that can emit red, green, and blue light may be periodically arranged. In this case, it is preferable to form the objective condensing member 50 and the imaging condensing member 40 so that the chromatic aberration is reduced in accordance with the color of the condensed light.

  The light emitting element 52 may be configured to emit a plurality of different colors, for example, three different colors. The light emitting element 52 that emits red light, the light emitting element 52 that emits green light, and the light emitting element 52 that emits blue light may be periodically arranged on the semiconductor substrate 32. In this case, the imaging element array 36 includes a plurality of types of imaging elements 58 having a high light receiving rate of light of any color. The plurality of imaging elements 58 include an imaging element 58 that receives red light emitted from the light emitting element 52 and converts it into an electrical signal, and an imaging element that receives green light emitted from the light emitting element and converts it into an electrical signal. 58 and an imaging element 58 that receives blue light emitted from the light emitting element and converts it into an electrical signal. These image sensors 58 are arranged periodically.

  Each imaging element may be provided with a plurality of layers, for example, three light receiving layers, and each light receiving layer may receive light of different colors. For example, the uppermost light-receiving layer receives blue light that is most easily absorbed, the next light-receiving layer receives green light, and the lowermost light-receiving layer receives red light that is hardly absorbed. You may comprise.

  In the above embodiment, the subject 28 is imaged by the light emitted from the light emitting element 52, but the subject 28 may be imaged by the light transmitted through the subject 28. Thereby, the subject 28 can be imaged by natural light or the like while reducing the power consumption of the light emitting element 52.

10 Imaging device
12 base
14 Imaging unit
16 Drive unit
18 Subject holding part
20 Image output unit
22 Control unit
24 Subject case
26 legs
28 subjects
30 Subject area
32 Semiconductor substrate
34 Light Emitting Element Array
36 Image sensor array
38 pinhole array
40 Condensing member for imaging
42 Adhesive
44 Adhesive
46 Optical elements
48 pedestal
50 Objective condensing member
52 Light Emitting Element
54 Light emitting layer
56 Clad layer
58 Image sensor
60 Photosensitive surface
62 pinhole
64 Shading part
66 Base member for imaging
68 Projection for lower imaging
70 Upper imaging convex part
72 Element body
74 half mirror
76 Objective base member
78 Lower objective projection
80 Upper convexity
82 X-direction ranging unit
84 X direction drive
86 Y-direction distance measuring unit
88 Y direction drive
90 Z-direction ranging unit
92 Z direction drive
94 Beam Spot
96 Divergence suppression member
97 Inhibiting substrate
98 Collimator lens
99 Shading wall
114 Imaging unit
214 Imaging unit
314 Imaging unit
414 Imaging unit
514 Imaging unit
614 Imaging unit
634 Light emitting unit
653 Diffusing member

Claims (10)

A semiconductor substrate;
A plurality of imaging elements formed on the semiconductor substrate;
A light emitting unit formed on the semiconductor substrate adjacent to the plurality of imaging elements;
An optical element that is formed on an optical path of the plurality of imaging elements and directs light from the light emitting unit in a direction parallel to and spaced apart from the optical paths of the plurality of imaging elements;
An imaging apparatus comprising: an objective condensing member that is provided on the optical path between the optical element and a subject and collects light from the optical element onto the subject. The imaging apparatus according to claim 1, further comprising an imaging condensing member that is provided on an optical path between the optical element and the imaging element and condenses the light reflected by the subject onto the imaging element. The imaging apparatus according to claim 2, wherein the aberration of the objective condensing member is smaller than the aberration of the imaging condensing member. The imaging device according to claim 1, further comprising a divergence suppressing member that is provided between the light emitting unit and the optical element and suppresses divergence of light from the light emitting unit. 5. The light-shielding portion according to claim 1, further comprising a light-shielding portion that is provided between the optical element and the imaging element and has an opening that allows a part of the light reflected by the subject to pass therethrough. Imaging device. The light emitting unit includes a plurality of light emitting elements that emit light of different colors,
The imaging apparatus according to claim 1, wherein the objective condensing member is formed corresponding to different colors.   The adjacent interval between the image pickup element and the image pickup element in a direction intersecting the scanning direction of the plurality of image pickup elements is smaller than the diameter of the beam spot collected by the objective light collecting member. The imaging device according to item. A plurality of the imaging elements and a plurality of optical elements are arranged along the light emitting direction of the light emitting unit,
The imaging device according to claim 1, wherein the optical element transmits a part of light traveling in the light emitting direction. The imaging apparatus according to claim 8, wherein the plurality of optical elements have a light transmittance that decreases with distance from the light emitting unit. The imaging device according to claim 1, further comprising a light shielding wall provided between the plurality of imaging elements.

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