JP2012181073A - Infrared sensor device and inductive heating cooker with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an infrared sensor device capable of further suppressing a measurement error due to ambient influence (cooling air and radiation heat), and an inductive heating cooker with the infrared sensor device.SOLUTION: The infrared sensor device includes a sensor body 2 for detecting an infrared ray, an inner cylindrical wall part 3 having a central opening end part in which an infrared ray can be made incident on the sensor body 2 to cover the surroundings of the sensor body 2, and an outer cylindrical wall part 4 for covering the surroundings of the inner cylindrical wall part 3 and installed with spacing to the inner cylindrical wall part 3. The inner cylindrical wall part 3 includes a radiation fin 3b projected outwardly in a radial direction, and inserted through a lower opening part 7b formed on the outer cylindrical wall part 4 to extend to the outside.

Description

  The present invention includes an infrared sensor device that detects infrared rays from a measurement object and measures the temperature or the like of the measurement object, and an electromagnetic induction heating (IH) for an object to be heated such as a pan on a top plate. And an induction heating cooker capable of detecting the bottom temperature of the pan.

  Conventionally, as an induction heating cooker that can heat an object to be heated such as a pan on a top plate by electromagnetic induction heating and detect the bottom temperature of the pan, for example, Patent Document 1 discloses a non-magnetic material on which a cooking container is placed. Detects the temperature of the bottom surface of the cooking container through the top plate, the heating coil that is provided below the top plate, generates an induction magnetic field to heat the cooking container, the heating coil base that holds the heating coil, and the top plate An induction heating cooker has been proposed that includes a radiant temperature detecting means that controls the electric power supplied to the heating coil in accordance with the temperature detected by the radiant temperature detecting means.

  The radiation temperature detecting means of this induction heating cooker is constituted by an infrared element (infrared sensor) that detects infrared rays radiated from a measurement object, and the bottom surface of the cooking container through an infrared transmitting material fitted inside the top plate. The temperature is detected. Further, in this induction heating cooker, a heat insulating means for shielding heat from the heating coil is provided around the infrared element. The heat insulating means is formed of a cylindrical shape made of a heat resistant resin material having a low thermal conductivity. Further, this heat insulating means is provided with a mirror surface means made of a metal material such as aluminum whose inner surface is a mirror surface or has a low emissivity close to the mirror surface.

JP 2004-227777 A

The following problems remain in the conventional technology.
Conventionally, an infrared sensor installed in an induction heating cooker or the like causes measurement errors due to ambient influences, that is, radiant heat such as cooling air or a heating coil. Cylindrical insulation means are installed around. However, even if an attempt is made to block the influence of the surroundings by this cylindrical heat insulating means, the temperature of the cylindrical member itself is changed by cooling air or radiant heat, and the heat is transferred to the inside through the cylindrical member. There was a disadvantage that the infrared sensor was affected by the influence of the surroundings. In the technique described in Patent Document 1, although the heat effect from the inner surface of the heat insulating means is reduced by using the inner surface of the heat insulating means as a surface with low emissivity (mirror surface means), it is insufficient.

  The present invention has been made in view of the above-described problems, and provides an infrared sensor device that can further suppress measurement errors due to ambient influences (cooling air and radiant heat) and an induction heating cooker including the same. With the goal.

  The present invention employs the following configuration in order to solve the above problems. That is, an infrared sensor device according to a first aspect of the present invention includes a sensor main body that detects infrared rays, and an inner cylindrical wall that has a central opening end that allows infrared rays to enter the sensor main body and covers the periphery of the sensor main body. And an outer cylindrical wall portion that covers the periphery of the inner cylindrical wall portion and is spaced from the inner cylindrical wall portion, and the inner cylindrical wall portion is radially outer. And a heat dissipating fin that extends through the opening formed in the outer cylindrical wall and extends to the outside.

That is, in this infrared sensor device, an inner cylindrical wall portion that covers the periphery of the sensor body, and an outer cylindrical shape that covers the periphery of the inner cylindrical wall portion and is spaced from the inner cylindrical wall portion. Since the wall portion is provided, a high heat insulating effect can be obtained by the air layer formed in the space between the inner cylindrical wall portion and the outer cylindrical wall portion constituting the double structure. Therefore, even if the temperature of the outer cylindrical wall portion changes due to the influence of the surroundings, it is possible to suppress the thermal effect on the inner cylindrical wall portion and the inner sensor body by the air layer having high heat insulation. The outer cylindrical wall portion functions as a windshield that blocks outside air except for natural convection flowing from the opening. In addition, a plurality of air layers can be obtained and a higher heat insulating property can be obtained by forming the outer cylindrical wall portion into a multi-tubular structure with a plurality of cylindrical wall portions that are spaced apart from each other in the radial direction. It becomes possible.
Further, since the inner cylindrical wall portion has a heat radiation fin that protrudes radially outward and is inserted into an opening formed in the outer cylindrical wall portion and extends to the outside, the inner cylinder The temperature difference between the inner cylindrical wall part and the sensor body is reduced by releasing the heat of the cylindrical wall part to the outside of the outer cylindrical wall part through the radiation fin, and the inner cylindrical wall is affected by the influence of the measurement object. It can suppress that the temperature of a part rises and affects a sensor main body.

The infrared sensor device according to a second aspect of the present invention is the infrared sensor device according to the first aspect, wherein the air between the outer cylindrical wall portion and the inner cylindrical wall portion is located inside and outside the upper and lower portions of the outer cylindrical wall portion. An upper opening and a lower opening that can be circulated are provided.
That is, in this infrared sensor device, an upper opening and a lower opening that allow air between the outer cylindrical wall and the inner cylindrical wall to flow in and out are provided at the upper and lower portions of the outer cylindrical wall. Since it is provided, air in the air layer circulates inside and outside through the upper opening and the lower opening and convects. Therefore, it is possible to suppress the temperature of the air layer itself from changing due to stagnation of air in the air layer. Can do.

In the infrared sensor device of the third invention, in the first or second invention, the inner cylindrical wall portion is formed of a material having an infrared emissivity lower than that of the outer cylindrical wall portion. Features.
That is, in the infrared sensor device, since the inner cylindrical wall portion is formed of a material having a lower infrared emissivity than the outer cylindrical wall portion, the influence of disturbance is further suppressed, and only infrared rays from the central opening end portion are provided. Can be received by the sensor body, and can be detected with high accuracy.

The infrared sensor device according to a fourth aspect of the present invention is the infrared sensor device according to any one of the first to third aspects, wherein the outer cylindrical wall portion is formed of a material having a lower thermal conductivity than the inner cylindrical wall portion. It is characterized by being.
That is, in this infrared sensor device, since the outer cylindrical wall portion is formed of a material having a lower thermal conductivity than the inner cylindrical wall portion, the outer cylindrical wall portion further suppresses the influence of radiant heat from the surroundings. can do.

An infrared sensor device according to a fifth aspect of the present invention is the infrared sensor device according to any one of the first to fourth aspects, wherein the sensor body is provided on the insulating film and one surface of the insulating film so as to be separated from each other. A first heat-sensitive element, a second heat-sensitive element, and a conductive first wiring film formed on one surface of the insulating film and connected to the first heat-sensitive element; and the second heat-sensitive element. And a conductive second wiring film connected thereto, and an infrared reflecting film provided on the other surface of the insulating film so as to face the second heat sensitive element.
That is, since this infrared sensor device includes an infrared reflection film provided on the other surface of the insulating film so as to face the second thermal element, the first thermal element is irradiated with infrared rays and absorbs infrared rays. In contrast to measuring the partial temperature of the insulating film, the second thermosensitive element measures the partial temperature of the insulating film in which the infrared ray is reflected by the infrared reflecting film and the infrared absorption is greatly suppressed. . Therefore, the first thermal element under the infrared reflecting film that suppresses the influence of infrared rays on the first thermal element and obtains a high reference, and the thin insulating film having low thermal conductivity make the first A good temperature difference between the thermal element and the second thermal element can be obtained.

An induction heating cooker according to a sixth aspect of the present invention is a top plate on which an object to be heated is placed, an electromagnetic coil that is installed below the top plate and heats the object to be heated by electromagnetic induction heating, and below the top plate And a temperature sensor disposed apart from the top plate, wherein the temperature sensor is the infrared sensor device according to any one of the first to fifth inventions, and the infrared sensor device is the outer cylindrical wall. It is characterized in that it is installed at the center of the electromagnetic coil with the portion facing the electromagnetic coil side.
That is, in this induction heating cooker, since the infrared sensor device of the present invention is installed at the center of the electromagnetic coil with the outer cylindrical wall portion facing the electromagnetic coil side, The temperature of the bottom surface of the object to be heated can be measured with high accuracy by suppressing the influence of radiant heat and cooling air from the surroundings, and suppressing the temperature rise of the inner cylindrical wall due to the influence of the electromagnetic coil and top plate. be able to.

Moreover, the induction heating cooking appliance of 7th invention is equipped with the main body case in which the said top plate, the said electromagnetic coil, and the said infrared sensor apparatus were installed in 6th invention, and the said radiation fin is the said main body case. It is characterized by being connected to.
That is, in this induction heating cooker, since the radiating fin is connected to the main body case, the heat of the inner cylindrical wall portion can be released to the main body case via the radiating fin, and higher heat dissipation can be obtained. .

The present invention has the following effects.
That is, according to the infrared sensor device of the present invention, the inner cylindrical wall portion that covers the periphery of the sensor main body, and the inner cylindrical wall portion that covers the periphery of the inner cylindrical wall portion and is spaced from the inner cylindrical wall portion. Since the air layer formed in the space between the inner cylindrical wall portion and the outer cylindrical wall portion can provide a high heat insulation effect, the sensor can be used from the surroundings. The influence of heat on the main body can be suppressed. In addition, since the inner cylindrical wall portion includes a radiation fin that is inserted through the opening formed in the outer cylindrical wall portion and extends to the outside, the heat of the inner cylindrical wall portion is transmitted via the radiation fin. By letting it escape, it can suppress that the temperature of an inner cylindrical wall part rises and affects a sensor main body.
Therefore, according to the induction heating cooker of the present invention provided with this infrared sensor device, the influence of the radiant heat from the electromagnetic coil or the like that is the heating coil or the cooling air from the surroundings is suppressed, and the bottom surface of the heated object such as the pan Temperature measurement can be performed with high accuracy.

1 is a schematic perspective view showing an infrared sensor device in an embodiment of an infrared sensor device and an induction heating cooker according to the present invention. In this embodiment, it is a longitudinal cross-sectional view which shows an infrared sensor apparatus. In this embodiment, it is a perspective view which shows a sensor main body. In this embodiment, it is a perspective view which shows the sensor main body of the state which removed the housing | casing. It is sectional drawing which shows the sensor main body of this embodiment. In this embodiment, it is a schematic sectional drawing which shows an induction heating cooking appliance.

  Hereinafter, an infrared sensor device according to an embodiment of the present invention and an induction heating cooker including the infrared sensor device will be described with reference to FIGS. 1 to 6. In each drawing used for the following description, the scale is appropriately changed in order to make each member recognizable or easily recognizable.

  As shown in FIGS. 1 and 2, the infrared sensor device 1 of the present embodiment has a sensor main body 2 that detects infrared rays, and a central opening that allows the infrared rays to enter the sensor main body 2. An inner cylindrical wall 3 covering the periphery of the inner cylindrical wall 3, an outer cylindrical wall 4 covering the periphery of the inner cylindrical wall 3 and spaced from the inner cylindrical wall 3, and a sensor A main body 2 is mounted, and a mounting board 5 is provided as a circuit board on which an inner cylindrical wall 3 and an outer cylindrical wall 4 are installed.

  The outer cylindrical wall part 4 and the inner cylindrical wall part 3 have a cylindrical shape with the same central axis, and the upper part of the outer cylindrical wall part 4 is an object to be measured (this embodiment will be described later). The inner cylindrical wall portion 3 is disposed with a gap between the inner cylindrical wall portion 3 and the object to be measured with a slight gap therebetween. That is, the upper end portion of the inner cylindrical wall portion 3 is an open end.

  The outer cylindrical wall 4 is provided with an upper opening 7a and a lower opening 7b through which air between the outer cylindrical wall 4 and the inner cylindrical wall 3 can flow in and out. The upper opening 7 a is formed between a plurality of upper heat insulators 4 a that are attached to each other in the circumferential direction at the upper end of the outer cylindrical wall 4, and the lower opening 7 b is formed on the outer cylindrical wall 4. A pair of through-holes are formed at positions facing each other at the lower end. The upper heat insulator 4a is made of a heat resistant resin or the like.

  An air layer 7 is formed between the outer cylindrical wall portion 4 and the inner cylindrical wall portion 3 so that air in the air layer 7 can flow in and out through the upper opening 7a and the lower opening 7b. It is possible to circulate in the air layer 7 in the vertical direction.

The inner cylindrical wall 3 is formed of a material having a lower infrared emissivity than the outer cylindrical wall 4. Further, the outer cylindrical wall portion 4 is formed of a material having a lower thermal conductivity than the inner cylindrical wall portion 3.
That is, the inner cylindrical wall portion 3 of the present embodiment is formed of an aluminum metal plate having a mirror-finished surface, and the outer cylindrical wall portion 4 is formed of a resin material. As the resin material of the outer cylindrical wall portion 4, for example, a heat resistant resin such as polyphenylene sulfide resin (PPS) having an infrared shielding effect can be used.
An outer heat reflecting film 4 b such as an aluminum foil is formed on the outer peripheral surface of the outer cylindrical wall portion 4. The external heat reflecting film 4b has an effect of reflecting the radiant heat from the outside other than the measurement object and reducing the influence on the internal sensor body 2.

  The inner cylindrical wall portion 3 is installed on the mounting substrate 5 via an annular main body supporting member 3a formed of a heat insulating material such as resin. Further, the inner cylindrical wall portion 3 projects a pair of radiating fins 3b protruding outward in the radial direction and extending through the lower opening 7b formed in the outer cylindrical wall portion 4 to the outside. I have. These heat radiating fins 3b are installed on the mounting substrate 5 and supported by a fin support member 5a formed of a heat insulating material such as resin.

  As shown in FIGS. 3 to 5, the sensor body 2 includes an insulating film 11, a first thermal element 12 </ b> A and a first thermal element 12 </ b> A provided on one surface (lower surface) of the insulating film 11 so as to be separated from each other. The second thermal element 12B and the conductive first wiring film 13A and the second thermal element 12B, which are patterned on one surface of the insulating film 11 with copper foil or the like and connected to the first thermal element 12A. The connected conductive second wiring film 13B, the infrared absorption film 14 provided on the other surface (upper surface) of the insulating film 11 so as to face the first thermal element 12A, and the second thermal element 12B, an infrared reflecting film 15 provided on the other surface of the insulating film 11 and a casing 16 fixed to one surface of the insulating film 11 and supporting the insulating film 11, respectively. I have.

  That is, the infrared absorption film 14 is disposed immediately above the first thermal element 12A, and the infrared reflection film 15 is disposed immediately above the second thermal element 12B. The insulating film 11 is formed of an infrared transmissive film. In the present embodiment, the insulating film 11 is formed of a polyimide resin sheet.

  The first thermal element 12A and the second thermal element 12B are chip thermistors (thermistor elements) in which terminal electrodes 12a are formed at both ends. As this thermistor, there are thermistors of NTC type, PTC type, CTR type, etc. In this embodiment, for example, NTC type thermistors are adopted as the first thermal element 12A and the second thermal element 12B. This thermistor is formed of a thermistor material such as a Mn—Co—Cu-based material or a Mn—Co—Fe-based material. The first thermal element 12A and the second thermal element 12B are mounted on the insulating film 11 with the terminal electrodes 12a bonded to the wiring films 13A and 13B.

  The infrared absorption film 14 is formed of a material having an infrared absorption rate higher than that of the insulating film 11. For example, a film containing an infrared absorption material such as carbon black or an infrared absorption glass film (containing 71% silicon dioxide). Hockey glass film etc.). That is, the infrared absorption film 14 absorbs infrared rays due to radiation from the measurement object. The temperature of the first thermal element 12 </ b> A immediately below is changed by heat conduction through the insulating film 11 from the infrared absorption film 14 that absorbs infrared rays and generates heat. The infrared absorption film 14 is formed so as to cover it with a size larger than that of the first thermal element 12A.

  The infrared reflection film 15 is made of a material having an infrared emissivity higher than that of the insulating film 11, and is made of, for example, a mirror-deposited aluminum vapor deposition film, an aluminum foil, or an Au plating film. The infrared reflection film 15 is formed to cover the second thermal element 12B with a size larger than that of the second thermal element 12B.

The housing 16 is made of, for example, resin, and is preferably made of a material having lower thermal conductivity than the insulating film 11 so as not to dissipate heat of the insulating film 11 more than necessary.
The housing 16 is provided with a first storage portion 16a and a second storage portion 16b that individually store the first thermal element 12A and the second thermal element 12B. The first storage portion 16a and the second storage portion 16b are holes having a rectangular cross section formed corresponding to the positions of the first thermal element 12A and the second thermal element 12B, respectively. The opening is closed with the insulating film 11 in a state where the air is sealed. Note that a foamed resin having a lower thermal conductivity than the insulating film 11 may be enclosed in the first storage portion 16a and the second storage portion 16b.

  Further, on the side surface of the housing 16, an upper end is connected to the first wiring film 13 </ b> A and the first side surface electrode portion 13 a extending to the bottom of the housing 16 and the second wiring film 13 </ b> B are connected. A second side electrode portion 13b having an upper end connected and extending to the bottom of the housing 16, and a lower portion of the side surface of the housing 16 connected to the lower end of the first side electrode portion 13a and on the mounting substrate 5 A first mounting external terminal 13c to be connected to the mounting substrate 5, a second mounting external terminal 13d to be connected to the lower end of the second side surface electrode portion 13b at the lower side surface of the housing 16 and connected to the mounting substrate 5, Is provided.

  Next, the induction heating cooker 21 of this embodiment provided with the infrared sensor device 1 will be described with reference to FIG.

  As shown in FIG. 6, the induction heating cooker 21 of the present embodiment has a top plate 22 on which the object to be heated N is placed, and the object to be heated N installed under the top plate 22 to heat the object to be heated N by electromagnetic induction heating. And the infrared sensor device 1, which is a temperature sensor disposed below the top plate 22 and spaced from the top plate 22, and the control electrically connected to the electromagnetic coil 23 and the infrared sensor device 1. Part C and a main body case 24 in which these are installed are provided.

The bottom surface of the top plate 22 is provided with an infrared shielding layer (not shown) that covers the bottom surface and is partially opened as an infrared transmission window (not shown).
The infrared shielding layer is an infrared shielding sheet such as a sprayed material of crystallized glass containing carbon black attached to the lower surface of the top plate 22. The infrared shielding layer may be formed by coating the lower surface of the top plate 22 with a paint having an infrared shielding effect other than the infrared shielding sheet. In addition, the infrared transmission window is formed by providing an opening in the infrared shielding layer and exposing the top plate 22 only in a portion located directly above the center opening end of the infrared sensor device 1.

The heated object N is a pan or the like formed of a magnetic material (iron or the like) or a non-magnetic material (aluminum or the like).
The top plate 22 is formed of crystallized glass or the like and has high heat resistance, and is attached to the upper part of the main body case 24.

  The electromagnetic coil 23 is arranged in an annular shape or a spiral shape below the top plate 22 and in the main body case 24, and generates a high-frequency magnetic field when supplied with electric power by an alternating current to generate an object to be heated on the top plate 22. N is induction-heated.

The infrared sensor device 1 is installed so that the center opening end is arranged directly opposite to the infrared transmission window so that the infrared light from the infrared transmission window enters the center opening end and is detected by the sensor body 2. . The infrared sensor device 1 is installed at the center of the electromagnetic coil 23 with the outer cylindrical wall portion 4 facing the electromagnetic coil 23 side.
Moreover, the radiation fin 3b is extended to the inner wall of the main body case 24, and the front-end | tip is connected to this inner wall.

The control unit C includes an inverter power supply (not shown) that supplies power to the electromagnetic coil 23, and controls the power supplied to the electromagnetic coil 23 based on the temperature of the heated object N detected by the infrared sensor device 1. It has a function.
The control unit C calculates the infrared difference (output difference) detected between the first thermal element 12A and the second thermal element 12B, and uses the second thermal element 12B as a reference for the first thermal element. It has a function of calculating the temperature detected by the element 12A.

  As described above, the infrared sensor device 1 of the present embodiment includes the inner cylindrical wall portion 3 that covers the periphery of the sensor main body 2, and the inner cylindrical wall portion 3 that covers the periphery of the inner cylindrical wall portion 3 and is spaced from the inner cylindrical wall portion 3. Since the outer cylindrical wall portion 4 is provided with a space between the inner cylindrical wall portion 3 and the outer cylindrical wall portion 4 constituting a double structure, as shown in FIG. A high heat insulating effect can be obtained by the air layer 7 formed in the above. Therefore, even if the temperature of the outer cylindrical wall portion 4 changes due to the influence of the surroundings, the heat effect on the inner cylindrical wall portion 3 and the sensor body 2 inside thereof can be suppressed by the air layer 7 having high heat insulation. .

  In addition, the inner cylindrical wall portion 3 includes a radiating fin 3b that protrudes radially outward and is inserted through a lower opening 7b formed in the outer cylindrical wall portion 4 and extends to the outside. Therefore, the temperature difference between the inner cylindrical wall portion 3 and the sensor body 2 is reduced by allowing the heat of the inner cylindrical wall portion 3 to escape to the outside of the outer cylindrical wall portion 4 through the radiation fins 3b. It can suppress that the temperature of the inner side cylindrical wall part 3 rises by the influence from a target object, and affects the sensor main body 2. FIG.

  Further, an upper opening 7a and a lower opening 7b through which air between the outer cylindrical wall 4 and the inner cylindrical wall 3 can flow in and out are provided at the upper and lower portions of the outer cylindrical wall 4. Therefore, the air in the air layer 7 circulates in and out of the air through the upper opening 7a and the lower opening 7b, and the temperature of the air layer 7 itself changes due to the stagnation of the air in the air layer 7. Can be suppressed. That is, as shown in FIG. 2, when the air in the air layer 7 is warmed, upward convection (arrow A in the figure) is generated, so that outside air flows in through the lower opening 7b and the upper opening 7a Natural convection occurs in which warm air inside flows out to the outside. Thereby, the temperature rise of the air in the air layer 7 can be suppressed, and the temperature of the inner cylindrical wall portion 3 can be made to follow the ambient temperature with an appropriate time constant. The outer cylindrical wall 4 functions as a windshield that blocks outside air except for natural convection that flows from the upper opening 7a or the lower opening 7b.

Furthermore, since the inner cylindrical wall 3 is formed of a material having an infrared emissivity lower than that of the outer cylindrical wall 4, the influence of disturbance is further suppressed, and only the infrared rays from the central opening end are detected by the sensor body 2. Can be received and can be detected with high accuracy.
Moreover, since the outer cylindrical wall part 4 is formed of a material having a lower thermal conductivity than the inner cylindrical wall part 3, the outer cylindrical wall part 4 can further suppress the influence of radiant heat from the surroundings. it can.

  In addition, since the sensor body 2 includes the infrared reflecting film 15 provided on the other surface of the insulating film 11 so as to face the second thermal element 12, the first thermal element 12 is irradiated with infrared rays. In contrast, the second thermal element 12 measures the partial temperature of the insulating film 11 that has absorbed infrared rays, while the second heat sensitive element 12 reflects the infrared rays reflected by the infrared reflecting film 15 so that the infrared absorption is greatly suppressed. Measure partial temperature. Therefore, the second heat-sensitive element 12 under the infrared reflective film 15 that can suppress the influence of infrared rays on the first heat-sensitive element 12 and obtain a high reference, and the insulating film 11 that is thin and has low thermal conductivity, A good temperature difference between the first thermal element 12 and the second thermal element 12 can be obtained.

  And in the induction heating cooking appliance 21 of this embodiment provided with the said infrared sensor apparatus 1, the infrared sensor apparatus 1 is installed in the center of the electromagnetic coil 23 with the outer cylindrical wall part 4 facing the electromagnetic coil 23 side. Therefore, it is possible to suppress the influence of the radiant heat from the electromagnetic coil 23 or the like that is a heating coil and the cooling air from the surroundings, and to suppress the temperature rise of the inner cylindrical wall 3 due to the influence from the electromagnetic coil 23 or the top plate 22 And the temperature measurement of the bottom face of the to-be-heated material N can be performed with high precision.

Furthermore, since the heat radiating fins 3b are connected to the main body case 24, the heat of the inner cylindrical wall portion 3 can be released to the main body case 24 via the heat radiating fins 3b, and higher heat dissipation can be obtained.
In the induction heating cooker 21 of the present embodiment, the electromagnetic coil 23 generates eddy current in the aluminum inner cylindrical wall portion 3 to generate heat. However, the air convection effect of the air layer 7 and the radiating fin 3b are described above. Due to the heat dissipation effect, the temperature rise of the inner cylindrical wall portion 3 is suppressed, and the accuracy of the measured temperature by the sensor body 2 is obtained. Moreover, the heat dissipation time after heating stop by the electromagnetic coil 23 is shortened, and the temperature rise of the sensor body 2 due to continuous reheating can be suppressed.

  In addition, a demagnetizing field with respect to the magnetic field generated by the electromagnetic coil 23 is generated inside the inner cylindrical wall portion 3 by an eddy current generated in the inner cylindrical wall portion 3 and the external heat reflection film 4b. The intersecting magnetic field can be reduced. Thereby, the eddy current loss which generate | occur | produces in the metal part of the sensor main body 2 reduces, and it can suppress heat_generation | fever.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, in the above embodiment, the first and second thermosensitive elements of the chip thermistor are employed, but the first and second thermosensitive elements formed by the thin film thermistor are also employed. I do not care.
As the thermal element, a thin film thermistor or a chip thermistor is used as described above, but a pyroelectric element or the like can be used in addition to the thermistor.
Moreover, although the front-end | tip of the said heat radiating fin is directly connected to the main body case, you may connect to a main body case via other members with high heat conductivity, such as a metal.

In addition, it is preferable to form an infrared absorption film in the light receiving region above the first thermal element as in the above embodiment, but if an infrared reflection film is formed above the second thermal element, the first The infrared absorption film may not be formed in the light receiving region above the thermal element. That is, the light receiving region above the first heat sensitive element may be a surface where the insulating film is directly exposed.
Furthermore, in the said embodiment, although the cylindrical inner cylindrical wall part and the outer cylindrical wall part are employ | adopted, other cylindrical shapes, for example, a rectangular cylindrical inner cylinder wall part and an outer cylindrical wall part, are adopted. You may adopt.

  DESCRIPTION OF SYMBOLS 1 ... Infrared sensor apparatus (temperature sensor), 2 ... Sensor main body, 3 ... Inner cylindrical wall part, 3b ... Radiation fin, 4 ... Outer cylindrical wall part, 7a ... Upper opening part, 7b ... Lower opening part, 11 ... Insulating film, 12A ... first thermal element, 12B ... second thermal element, 13A ... first wiring film, 13B ... second wiring film, 15 ... infrared reflective film, 22 ... top plate, 23 ... electromagnetic Coil, 24 ... body case, C ... control unit, N ... heated object

Claims (7)

A sensor body for detecting infrared rays;
An inner cylindrical wall portion that has a central opening end that allows infrared rays to enter the sensor body and covers the periphery of the sensor body;
An outer cylindrical wall portion covering the periphery of the inner cylindrical wall portion and spaced from the inner cylindrical wall portion;
The inner cylindrical wall portion includes a radiating fin that protrudes radially outward and is inserted through an opening formed in the outer cylindrical wall portion and extends to the outside. Infrared sensor device. The infrared sensor device according to claim 1,
The upper and lower openings of the outer cylindrical wall are provided with upper and lower openings through which air between the outer cylindrical wall and the inner cylindrical wall can flow in and out. Infrared sensor device characterized. The infrared sensor device according to claim 1 or 2,
The infrared sensor device, wherein the inner cylindrical wall portion is formed of a material having an infrared emissivity lower than that of the outer cylindrical wall portion. In the infrared sensor device according to any one of claims 1 to 3,
The infrared sensor device, wherein the outer cylindrical wall portion is formed of a material having a lower thermal conductivity than the inner cylindrical wall portion. In the infrared sensor device according to any one of claims 1 to 4,
The sensor body is an insulating film;
A first thermal element and a second thermal element provided on one surface of the insulating film so as to be spaced apart from each other;
A conductive first wiring film formed on one surface of the insulating film and connected to the first thermal element; and a conductive second wiring film connected to the second thermal element;
And an infrared reflecting film provided on the other surface of the insulating film so as to face the second thermosensitive element. A top plate for placing an object to be heated;
An electromagnetic coil installed under the top plate and heating the object to be heated by electromagnetic induction heating;
A temperature sensor disposed below the top plate and spaced from the top plate;
The temperature sensor is the infrared sensor device according to any one of claims 1 to 5,
The induction heating cooker, wherein the infrared sensor device is installed at the center of the electromagnetic coil with the outer cylindrical wall portion facing the electromagnetic coil side. The induction heating cooker according to claim 6,
A main body case in which the top plate, the electromagnetic coil and the infrared sensor device are installed;
The induction heating cooker, wherein the heat radiating fins are connected to the main body case.

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